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AMD Server “K8” ~ 89 W

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AMD Server “K8” ~ 89 W AMD Desktop T-Bred/Barton ~76 W “K7” Athlon XP Palomino Athlon ~72 W Thunderbird 50mm / OPGA ~72 W Socket 462 / 2.54 Pitch 50mm / OPGA Socket 462 / 2.54 Pitch 50mm / CPGA Socket 462 / 2.54 Pitch 2000 2001 2002 AMD Desktop New Castle “K8” ~89 W ClawHammer ~89 W SledgeHammer 40mm / uOPGA ~89 W Socket 939 / 1.27 Pitch 40mm / uOPGA Socket 754 / 1.27 Pitch 40mm / uCPGA Socket 940 / 1.27 Pitch 2003 2004 2005 AMD Desktop Dual core Toledo ~ 110W Dual core Toledo 89W~110W San Diego 104W 40mm / uOPGA Socket 939 / 1.27 Pitch 40mm / uOPGA Socket 939 / 1.27 Pitch 40mm / uOPGA Socket 939 / 1.27 Pitch 2005 2006 AMD Mobile Hammer “K8” ~35W T-Bred/Barton “K7” ~ 25 W T-Bred/Barton 40mm / uOPGA ~35W Socket 754 / 1.27 Pitch 33mm / uOPGA Socket 563 / 1.27 Pitch 50mm / OPGA Socket 462 / 2.54 Pitch 2002 2003 2004 AMD Mobile Lower Power ~ 35 W ~ 25 W ~ 35 W 35mm / uOPGA Socket 638 S1 / 1.27 Pitch 40mm / uOPGA Socket 754 / 1.27 Pitch 2005 2006 AMD Server “K8” ~ 89 W “K7” ~ 66 W ~ 66 W 40mm / uCPGA Socket 940 / 1.27 Pitch 50mm / OPGA Socket 462 / 2.54 Pitch 50mm / CPGA Socket 462 / 2.54 Pitch 2000 2001 2003 AMD Server 800 Series 200 Series 100 Series ~ 95W ~ 95W ~ 95W 40mm / uOPGA 40mm / uOPGA 40mm / uOPGA Socket 939 / 1.27 Pitch Socket 939 / 1.27 Pitch Socket 939 / 1.27 Pitch 2005 AMD Embedded Solution ~ 1.6 W ~ 3.9 W ~ 14 W LX NX 483-pin BGA 481-pin TE-BGA 50mm / OPGA 21mm x 21mm 40mm x 40mm Socket 462 / 2.54 Pitch Intel Desktop Northwood P4 /Prescott ~ 103W Willamette P3 ~ 71W Tualatin ~ 33W 35mm / uPGA Socket 478 / 1.27 Pitch 50mm / BGA with interposer. Socket 423 / 2.54 Pitch 50mm / PGA Socket 370 / 2.54 Pitch 2001 2002 2003 Intel Desktop Presler ~ 130W Smithfield ~ 130W 37.5mm / LGA Prescott Socket 775 ~ 115W 1.09 X 1.17 Pitch 37.5mm / LGA Socket 775 1.09 X 1.17 Pitch 37.5mm / LGA Socket 775 1.09 X 1.17 Pitch 2004 2005 2006 Intel Mobile P3 - M P4 - M PM Banias ~ 7 W ~ 35W ~ 25W 31mmx27mm 35mm 35mm BGA 495 uOPGA 478 uOPGA / BGA 478 Micro PGA 495 1.27 Pitch 1.27 Pitch 1.27 Pitch 2001 2002 2003 Intel Mobile PM - Dothan PM – Yonah ( Dual ) ~ 27 W ~ 31 W 35mm 35mm uOPGA / BGA 478 uOPGA /Socket 478 1.27 Pitch 1.27 Pitch 2005 2006 Intel Xeon Gallatin ~ 80 W Nocona ~ 103 W 53.34mm Interposer 42.5mmX42.5mm 35mm x 35mm OBGA uOPGA Socket 603 / 1.27 Pitch Socket 604 / 1.27 Pitch 2002 2004 Intel Xeon Paxville (Dual ) ~ 135 W 53 mm X 53 mm uOPGA Socket 604 / 1.27 Pitch 2006 2007 Intel Itanium Itanium 1 Itanium 2 PCB with OBGA PCB with OBGA Socket : PAC 418 Socket PAC 611 ~ 130 W ~ 130 W 2001 2002 Ultra SPARC : SUN II IIe IIi 35mm X 35mm 50mm X 50mm 37.5mm X 37.5mm Ceramic 787 LGA Ceramic 370 PGA Ceramic 587 LGA 1.0mm Pitch 2.54mm Pitch 1.27mm Pitch Ultra SPARC : SUN IIIi III IV 45mmX 45mm 45mm X 45mm 45mm X 45mm Ceramic 959 uPGA Ceramic 1368 LGA Ceramic 1368 LGA 1.27 Pitch 1.12mm Pitch 1.12mm Pitch ~ 52W ~ 50W ~ 108W Transmeta Crusoe TM 5600 TM 5800 TM 5700 5.7 ~ 7.3 W 5.1 ~ 9 W 5 ~ 9.5 W 474-pin 474-pin 399-contact Ceramic BGA Ceramic BGA FC-OBGA 32.5mm x 25mm 32.5mm x 25mm 21mm x 21mm Transmeta Efficeon TM 8800 TM 8820 ~25 W ~25 W 783-pin 592-pin FC-OBGA FC-OBGA 29mm x 29mm 21mm X 21mm 1.0mm Pitch 0.8mm Pitch ~ 20 W ~ 20 W ~ 7 W EBGA FCBGA nanoBGA2 35mm x 35mm 21mm x 21mm 15 mm x 15mm GPU : nVidia GeFORCE 6800 FC OBGA with Stiffener GPU : ATI w/Stiffener 42.5mm X 42.5mm 1265 Pin FC OBGA 300 3000 3000 ) 130 nm 90 nm 65 nm 45 nm 32 nm 2 250 2500 POWER (W) 2500 Power (W) 2 200 Power density (W/cm ) 2000 2000 150 1500 1500 POWER (W) POWER POWER (W) POWER 100 1000 1000 POWER DENSITY (W/cm DENSITY POWER 50 500 500 130 nm 90 nm 65 nm 45 nm 32 nm 0 0 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 20160 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 YEARYEAR But that’s not the whole story… Multi-Core Processing 300 ) 2 250 500 POWER (W) Phase-Change Cooling Alternate Direct Die Handle 200 Cooling 400 Die Thinning Substrate 150 Solder 300 Liquid Metal TIM1 POWER (W) 100 200 Solid Filler TIM1 50 130 nm 90 nm 65 nm 45 nm 32 nm POWER DENSITY (W/cm 0 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 YEAR … the power density becomes independent of feature size and is restricted by available packaging technology .
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