3Dhgiscience.Pdf
Total Page:16
File Type:pdf, Size:1020Kb
Heterogeneous Three-Dimensional Electronics by Use of Printed Semiconductor Nanomaterials Jong-Hyun Ahn, et al. Science 314, 1754 (2006); DOI: 10.1126/science.1132394 The following resources related to this article are available online at www.sciencemag.org (this information is current as of December 14, 2006 ): Updated information and services, including high-resolution figures, can be found in the online version of this article at: http://www.sciencemag.org/cgi/content/full/314/5806/1754 Supporting Online Material can be found at: http://www.sciencemag.org/cgi/content/full/314/5806/1754/DC1 This article cites 5 articles, 3 of which can be accessed for free: http://www.sciencemag.org/cgi/content/full/314/5806/1754#otherarticles This article appears in the following subject collections: Physics, Applied http://www.sciencemag.org/cgi/collection/app_physics on December 14, 2006 Information about obtaining reprints of this article or about obtaining permission to reproduce this article in whole or in part can be found at: http://www.sciencemag.org/help/about/permissions.dtl www.sciencemag.org Downloaded from Science (print ISSN 0036-8075; online ISSN 1095-9203) is published weekly, except the last week in December, by the American Association for the Advancement of Science, 1200 New York Avenue NW, Washington, DC 20005. Copyright c 2005 by the American Association for the Advancement of Science; all rights reserved. The title SCIENCE is a registered trademark of AAAS. REPORTS 9. M. Schwarzschild, R. Härm, Astrophys. J. 150, 961 (1967). 21. F. M. Jiménez-Esteban, P. García-Lario, D. Engels, in 9499 (A.M. and P.G.L.) and a MEC JdC grant (J.M.T.R.). 10. R. H. Sanders, Astrophys. J. 150, 971 (1967). Planetary Nebulae as Astronomical Tools, R. Szczerba, This work is based on observations obtained at the 11. M. Busso, R. Gallino, G. J. Wasserburg, Annu. Rev. Astron. G. Stasinska, S. K. Gorny, Eds. (AIP Conference Proceedings, 4.2-m William Herschel Telescope, operated on the Astrophys. 37, 239 (1999). vol. 804, American Institute of Physics, Melville, NY, 2005), island of La Palma by the Isaac Newton Group in the 12. O. Straniero et al., Astrophys. J. 440, L85 (1995). pp. 141–144. Observatorio del Roque de Los Muchachos of the 13.J.W.Truran,I.IbenJr.,Astrophys. J. 216, 797 22. P. Ventura et al., Astrophys. J. 550, L65 (2001). Instituto de Astrofisica de Canarias, and on observations (1977). 23. C. M. O’D. Alexander, Philos. Trans. R. Soc. London Ser. A obtained with the 3.6-m telescope at ESO–La Silla 14. H. Beer, R. L. Macklin, Astrophys. J. 339, 962 (1989). 359, 1973 (2001). Observatory (Chile). 15. C. Abia et al., Astrophys. J. 559, 1117 (2001). 24. E. Zinner et al., Geochim. Cosmochim. Acta 69, 4149 16. D. L. Lambert et al., Astrophys. J. 450, 302 (1995). (2005). 17. J. Tomkin, D. L. Lambert, Astrophys. J. 523, 234 (1999). 25. K. D. McKeegan, A. M. Davis, in Meteorites, Planets, and Supporting Online Material www.sciencemag.org/cgi/content/full/1133706/DC1 18. A. Banerjee, D. Das, V. Natarajan, Europhys. Lett. 65, Comets, A. Davis, Ed., vol. 1 of Treatise on Geochemistry Fig. S1 172 (2004). (Elsevier-Pergamon, Oxford, 2003), pp. 431–460. 19.N.Grevesse,A.J.Sauval,Space Sci. Rev. 85, 161 26. F. A. Podosek et al., Geochim. Cosmochim. Acta 55, 10 August 2006; accepted 19 October 2006 (1998). 1083 (1991). Published online 9 November 2006; 20. P. S. Chen, R. Szczerba, S. Kwok, K. Volk, Astron. 27. Supported by the Spanish Ministerio de Educación y 10.1126/science.1133706 Astrophys. 368, 1006 (2001). Ciencia (MEC) grants AYA 2004-3136 and AYA 2003- Include this information when citing this paper. this method avoids some of the aforementioned problems, the requirements for epitaxy place Heterogeneous Three-Dimensional severe restrictions on the quality and type of materials that can be grown, even when buffer Electronics by Use of Printed layers and other advanced techniques are used (1, 13). Semiconductor Nanomaterials By contrast, nanoscale wires, ribbons, mem- branes, or particles of inorganic materials, or Jong-Hyun Ahn,1,2,3 Hoon-Sik Kim,5 Keon Jae Lee,1,3 Seokwoo Jeon,1,2,3 Seong Jun Kang,1,2,3 carbon-based systems such as single-walled Yugang Sun,1,2,3 Ralph G. Nuzzo,1,2,3,4 John A. Rogers1,2,3,4,5* carbon nanotubes (SWNTs) or graphene sheets (14–17), can be grown and then suspended in We developed a simple approach to combine broad classes of dissimilar materials into solvents or transferred onto substrates in a on December 14, 2006 heterogeneously integrated electronic systems with two- or three-dimensional layouts. The process manner that bypasses the need for epitaxial begins with the synthesis of different semiconductor nanomaterials, such as single-walled carbon growth or wafer bonding. Recent work has nanotubes and single-crystal micro- and nanoscale wires and ribbons of gallium nitride, silicon, shown the integration of isolated crossed nano- and gallium arsenide on separate substrates. Repeated application of an additive, transfer printing wire diodes in 2D layouts formed by solution process that uses soft stamps with these substrates as donors, followed by device and interconnect casting (18). Our results show how dissimilar formation, yields high-performance heterogeneously integrated electronics that incorporate any single-crystal inorganic semiconductors (such combination of semiconductor nanomaterials on rigid or flexible device substrates. This versatile as micro- and nanoscale wires and ribbons of methodology can produce a wide range of unusual electronic systems that would be impossible to GaN, Si, and GaAs) can be combined with one achieve with other techniques. another and also with other classes of nano- www.sciencemag.org materials (such as SWNTs) with the use of a any existing and emerging electronic chip-scale bonding (1, 2, 6, 8–10) and epitaxial scalable and deterministic printing method to devices benefit from the heteroge- growth (3, 11, 12) represent the two most widely yield complex, heterogeneously integrated Mneous integration of dissimilar classes used methods for achieving these types of electronic systems in 2D or 3D layouts. The of semiconductors into single systems, in either integrated systems. capabilities of this process are demonstrated by two-dimensional (2D) or 3D layouts (1, 2). Ex- The bonding processes use fusion processes ultrathin multilayer stacks of high-performance amples include multifunctional radio-frequency (8, 9) or layers of adhesives (6, 10) to combine metal oxide semiconductor field-effect transis- communication devices, infrared imaging cam- integrated circuits, photodiodes, or sensors tors (MOSFETs), high electron mobility tran- Downloaded from eras, addressable sensor arrays, and hybrid sili- formed separately on different semiconductor sistors (HEMTs), thin-film transistors (TFTs), con complementary metal oxide semiconductor wafers. This approach works well in many photodiodes, and other components that are (CMOS) circuits and nanowire devices (3–7). cases, but it has important drawbacks (1, 9), integrated into device arrays, logic gates, and In some representative systems, compound semi- including (i) limited ability to scale to large actively addressable photodetectors on rigid conductors or other materials provide high-speed areas (i.e., larger than the wafers) or to more inorganic and flexible plastic substrates. operation, efficient photodetection, or sensing than a few layers in the third (i.e., stacking) Figure 1 illustrates representative steps for capabilities; the silicon CMOS provides digital dimension; (ii) incompatibility with unusual producing these types of systems. The process readout and signal processing in circuits that of- materials (such as nanostructured materials) begins with the synthesis of the semiconductor ten involve stacked 3D configurations. Wafer- or and/or low-temperature materials and substrates; nanomaterials, each on their own source sub- (iii) challenging fabrication and alignment for strate. The devices shown in Fig. 1 allow micro- 1Department of Materials Science and Engineering, Uni- the through-wafer electrical interconnects; (iv) and nanoscale wires and ribbons of single- versity of Illinois, Urbana-Champaign, IL 61801, USA. demanding requirements for planar bonding crystalline GaN, GaAs, and Si that were formed 2Beckman Institute for Advanced Science and Technology, University of Illinois, Urbana-Champaign, IL 61801, USA. surfaces; and (v) bowing and cracking that can with the use of wafer-based source materials 3Frederick Seitz Materials Research Laboratory, University occur from mechanical strains generated by and lithographic etching procedures (19–23)to of Illinois, Urbana-Champaign, IL 61801, USA. 4Department differential thermal expansion and contraction be integrated with each other or with networks of Chemistry, University of Illinois, Urbana-Champaign, IL of disparate materials. Epitaxial growth provides of SWNTs that were grown by chemical vapor 61801, USA. 5Department of Electrical and Computer En- gineering, University of Illinois, Urbana-Champaign, IL 61801, a different approach, which uses molecular deposition (16, 23). Scanning electron micro- USA. beam epitaxy or other means to form thin layers graphs at the top of Fig. 1 show these *To whom correspondence should be addressed. E-mail: of semiconductor materials directly on the semiconductor nanomaterials after their removal [email protected] surfaces of wafers of other materials. Although from the source substrates. For circuit fabrica- 1754 15 DECEMBER 2006 VOL 314 SCIENCE www.sciencemag.org REPORTS tion, these elements remain in the configurations Second, the method is applicable to broad optical micrograph of an edge of the system; the defined on the wafers during the fabrication or classes of semiconductor nanomaterials, includ- layout of the system was designed to reveal growth stage: aligned arrays in the case of the GaN, ing emerging materials such as SWNTs. Third, separately the parts of the substrate that sup- GaAs, and Si materials, and submonolayer random the soft stamps enable nondestructive contacts port one, two, and three layers of MOSFETs.