Microsystems Technology in Germany 2016

MICROSYSTEMS TECHNOLOGY IN GERMANY 2016

MIKROSYSTEMTECHNIK IN DEUTSCHLAND 2016

Impressum

Publisher/Herausgeber Picture Credits/Bildnachweis trias Consult Johannes Lüders Title/Titel Crellestraße 31 Carbon nanotube based field-effect transistors D – 10827 Berlin Auf Kohlenstoffnanoröhren basierende Feld-Effekt-Transistoren Phone +49 (0)30 - 781 11 52 Source/Quelle: © Zentrum für Mikrotechnologie (ZfM) Honorarprofessur Mail [email protected] für Technologien der Nanoelektronik. Foto: Jürgen Lösel Web www.microsystems-technology-in-germany.de Page/Seite Layout Uta Eickworth, Dammerstorf 6 Mail [email protected] IGBTs with customer specific metallization Web www.designcircle-berlin.de IGBTs mit anwenderspezifischer Metallisierung Source/Quelle: © Fraunhofer ISIT, Itzehoe Printing/Druck Grafisches Centrum Cuno, Calbe 12 2016, Printed in Germany Cell-on-chip biosensor for detection of cell-to-cell interactions based on standard PCB technologies (EU project COCHISE) Biosensor zur Detektion interzellulärer Wechselwirkungen Printausgabe ISSN 2191-7183 basierend auf Leiterplattentechnologien (EU-Projekt COCHISE) Source/Quelle: Fraunhofer IZM

38 Source/Quelle: VDE/VDI-GMM

58 Device Development in the Clean Room for Microsystems Bauelement-Entwicklung im Mikrosystemreinraum Source/Quelle: ©Fraunhofer IPMS

74 Size comparison of a LTCC-MEMS package Größenvergleich eines LTCC-MEMS-Packages Source/Quelle: © Fraunhofer IKTS

86 Electrostatic Actuators Based on UV-Curable Polymers. Elektrostatische Aktuatoren auf Basis UV-härtender Polymere. Source/Quelle: Fraunhofer IOF

99 Mucus swimmer graphic Mikropropeller mit Schleimlöser Source/Quelle: Max-Planck-Institut für Intelligente Systeme

01 Table of Contents

1 Impressum 26 Arnd Menschig, Carl Zeiss 3D Automation GmbH: 4 Welcoming Address smartWT – The Intelligent Workpiece Carrier for Grußwort Micro Production and more Volker Saile, Chairman MST- Congress 2015, 30 Volker Nestle, Festo AG & Co. KG: Karlsruhe Institute of Technology: Intelligent Service Robotics for Production Microsystems: A Success Story with a Bright Future 32 Thomas Stieglitz, IMTEK: Mikrosystemtechnik – eine Erfolgsgeschichte mit Intelligent Implants in Neural Engineering: glänzender Zukunft from tools in neuroscience to new treatment options in an ageing society 6 Positioning in International 34 H.J.Crawack, Christoph Miethke GmbH & Co. KG: Competition The Aesculap-Miethke SENSOR RESERVOIR®: Positionierung im on the way to becoming a telemetric intracranial internationalen Wettbewerb pressure (ICP) measurement device 36 M. Juergen Wolf, Oswin Ehrmann, Fraunhofer IZM: Waver Level Packaging and System Integration

38 The German Congress on Microsystem Technologies 2015 8 Germany Trade and Invest: Der Deutsche Mikrosystem Germany: The European MEMS Driver technik-Kongress 2015 10 VDE/VDI-GMM: Microsystems Technology Meets Applicatlons

12 Contributions to Topical Fields 40 Kilian Bilger, of Innovation Robert Bosch GmbH: Beiträge zu aktuellen MEMS: Trends and Challenges Innovationsfeldern of Connected Sensor Systems 42 Stefan Saller, Festo AG & Co. KG, et al.: SmartSkin – An Intelligent Skin for Adaptive 14 Thomas Gessner, Bionic Grippers Fraunhofer ENAS: 44 Thomas Knieling, Fraunhofer ISIT, et al.: Smart Integrated Systems – hardware basis Different Force Sensor Approaches for for the IoT Flexible Shoe Inlays in Acoustic Gait Analysis 16 Frank Schäfer, 46 Ulrike Wallrabe, Matthias Wapler, IMTEK: Robert Bosch GmbH: Ultra-compact Adaptive High-speed Lenses MEMS Micromirrors for Intelligent Headlamps with Large Aperture and Aspherical Correction 18 Holger Neubert, Sylvia Gebhardt, 48 René Berlich, et al., Fraunhofer IOF: Fraunhofer IKTS Dresden: Thin Multi Aperture Microscope Smart Materials and Microsystems with High Resolution 20 Reinhard Manns, JUMO GmbH & Co. KG: 50 L.K. Weber et al., Karlsruhe Institute of Technology: Smart Sensors for Industry 4.0 Automated Microfluidic System with Optical Setup 20 Rolf Slatter, Sensitec GmbH: for the Investigation of Peptide-Antibody Interactions Energy Efficient Magnetoresistive Sensors for in an Array Format Low-power and Wireless Applications 52 E. Schuster, Institut für Mikroelektronik Stuttgart 24 Dieter Hentschel, Lars Schubert, (IMS CHIPS), et al.: Fraunhofer IKTS: Ultra-thin Silicon Chips and Printed Circuit Boards Wireless Sensors for Structural Health Monitoring for Applications in Flexible Electronic Systems

2 Inhaltsverzeichnis

54 A. Stett, NMI Reutlingen, et al.: 79 Finetech GmbH & Co. KG: Sensor Capsule for Medical in Vivo Biosensors Finetech – Customized Sub-Micron 56 M. Mehner et al., Technische Universität Ilmenau: Die Bonding Equipment Micromechanical Binary Counter 80 mechOnics ag: for Threshold Event Detection Competence in Micropositioning for More than 10 Years 58 Results and Portfolios 81 microworks GmbH: of Research Institutions Two New Modalities in X-ray Imaging Ergebnisse und Leistungen aus with microworks’ TALINT System Forschungseinrichtungen 82 MUEGGE GMBH: Muegge Plasma Systems 84 Physik Instrumente (PI) GmbH & Co. KG: Optical 3D Surface Measuring Technology for 60 Fraunhofer IAF: Industry and Research: Accurate Profile Reproduction Mobile Telecommunications of of the Finest Structures Thanks to Piezo Technology Tomorrow: Aluminum Scandium Nitride (AlScN) and Confocal Technology 62 Fraunhofer IOF: 85 Polytec GmbH: Solutions with Light – Optical Measurement Tools for State-of-the-Art Micro- and Nanooptical Systems and Technology Microstructure Development and Testing 64 Fraunhofer ICT-IMM: Fraunhofer ICT-IMM’s Streamlined Portfolio 86 Networks between Research 66 Technische Universität Ilmenau, IMN MacroNano®: and Industry Bridging the Gap between Macro and Nano Netzwerke zwischen 68 Karlsruhe Institute of Technology (KIT), Forschung und Industrie Programme STN/KNMF: Bridging the Gap from Nanoscience to Applications 70 Fraunhofer ENAS: From Microsystems to Nanosystems 72 Fraunhofer IPMS: 88 ZVEI - Zentralverband Elektrotechnik MEMS Technologies at the Fraunhofer Institute und Elektronikindustrie e.V.: for Photonic Microsystems ZVEI - German Electrical and Electronic 73 Hahn-Schickard-Gesellschaft Manufacturers´ Association 90 VDMA Electronics, Micro and Nanotechnologies (EMINT): 74 Innovations and Competencies VDMA The German Engineering Federation of Companies 92 AMA Verband für Sensorik und Messtechnik e.V.: Innovationen und Kompetenzen Sensors and Measurement: aus Unternehmen Tiny Smart Devices Keep Up Big Advances 94 IVAM Fachverband für Mikrotechnik: IVAM Microtechnology – International High-tech Network 76 ADZ NAGANO GmbH: 96 microTEC Südwest: ADZ NAGANO GmbH Gesellschaft für Sensortechnik microTEC Südwest The Cluster for Smart Solutions 77 AEMtec GmbH: 98 Berlin Partner for Business and Technology: Electronics Development and Manufacture The Stage is set for Micro Photonics 2016 with Highest Precision in Berlin 78 AMO GmbH: 100 City of Dortmund: Diversification in CMOS-technology: DORTMUND – Top Location Nano-Sensors using Photonics and Plasmonics for Micro- and Nanotechnology!

3 Preface

Microsystems: A Success Story with a Bright Future

Prof. Dr. Volker Saile Chairman MST- Congress 2015 Karlsruhe Institute of Technology.

Microsystems or MEMS (Micro Electro with another dramatic jump in volume of years deserve our recognition and Mechanical Systems) have changed through IoTS. These new concepts im- thanks. our world in the past two decades. pact the manufacturing sector and will Cars wouldn’t drive safely without them lead to a next phase in industrialization. Every other year the Mikrosystemtech- and smartphones wouldn’t be smart at In Germany these developments are nik-Kongress serves as showcase for all. In a broader picture, microsystems promoted under the headline Industrie Germany’s strength in microsystems technology has developed into a key 4.0 and major, often government sup- R&D and products. It started originally technology for addressing challenges ported, efforts aim at informing industry in Freiburg in 1995 and its sixth edi- facing our society and providing solu- representatives and preparing them for tion was held in Karlsruhe in October tions. Such challenges include secure the paradigm changes. 2015 as a joint event of the Federal energy production and supply, pres- Ministry of Education and Research, ervation of our environment and our Germany is in an enviable situation of the State of Baden-Württemberg and health, development of our communi- holding a worldwide top position in the VDE Association for Electrical, cation infrastructure, locally and around microsystems research and develop- Electronic & Information Technologies. the globe, and support of our mobility. ment and, most important, also in Approximately 1000 participants and Novel concepts are currently being de- production. Big companies like Bosch 50 exhibitors demonstrated the vitality veloped under the headlines of Cyber and Roche are world-leaders, and of the field and everywhere an upbeat Physical Systems (CPS), TSensors, In- numerous small and medium size mood could be sensed in view of the ternet of Things (IoT), Internet of Things companies support the microsystems bright future. and Services (IoTS) and Internet of manufacturing network, while universi- Everything (IoE). The common feature ties and research organizations de- I hope you will enjoy reading “Micro- of all of them is network connectivity of velop the field further and educate the systems Technology in Germany” and physical objects with electronics, pro- work force. Germany’s leading position find inspiring contributions with new cessors and software and all of them is not an accident but rather the result ideas, results and concepts. rely on microsystems, in particular, on of a deliberate long term strategy of all sensors. Such sensors first conquered partners involved and, last but defi- the automotive sector in the 90’s, then nitely not least, of a prudent support the consumer market since approxi- and guidance of the federal and state mately ten years reaching an incredible governments. The individuals in the annual volume production of several ministries, who whole-heartedly sup- billion units mostly for smartphones. ported the microsystems efforts from The next phase is already in sight early on and over a significant number

With best regards,

Prof. Dr. Volker Saile Chairman MST Congress 2015 Karlsruhe Institute of Technology

4 Grußwort

Mikrosystemtechnik – eine Erfolgsgeschichte mit glänzender Zukunft

Mikrosysteme oder MEMS (Micro Electro dabei beeindruckende Volumina in der Strategie aller beteiligten Partner, und Mechanical Systems) haben in den ver- Massenproduktion von mehreren Milliar- dabei insbesondere auch einer umsichti- gangenen zwei Jahrzehnten unsere Welt den Einheiten pro Jahr, hauptsächlich für gen Unterstützung und Begleitung durch verändert. Autos würden ohne sie nicht Smartphones. Die nächste Phase dieser die Bundes- und Landesregierungen. Die sicher fahren und Smartphones wären Entwicklung ist bereits in Sicht mit einem Mitarbeiter und Mitarbeiterinnen in den Mi- keineswegs „smart“. Aus globaler Sicht weiteren dramatischen Sprung im Volu- nisterien, die engagiert die Anstrengungen hat sich die Mikrosystemtechnik zu einer men durch IoTS. Diese neuen Konzepte in der Mikrosystemtechnik frühzeitig und Schlüsseltechnologie entwickelt, die ein haben Auswirkungen auf die verarbeiten- über eine beträchtliche Anzahl von Jahren wichtiger Baustein bei der Bewältigung de Industrie und leiten die nächste Phase unterstützt haben, verdienen unsere Aner- der großen Herausforderungen, vor denen der Industrialisierung ein. In Deutschland kennung und Dank. unsere Gesellschaft steht, geworden ist wird diese Entwicklung unter der Über- und dabei Lösungsvorschläge liefert. Zu schrift Industrie 4.0 vorangetrieben und Alle zwei Jahre dient der Mikrosystem- solchen Herausforderungen zählen eine erhebliche Anstrengungen, die oft mit öf- technik-Kongress als Schaufenster für sichere Energieerzeugung und -Versor- fentlichen Mittel unterstützt werden, zielen Deutschlands Stärke in FuE und Mikro- gung, der Erhalt unserer Umwelt und un- auf eine Information von Repräsentanten systemprodukten. Er fand erstmals im serer Gesundheit, die Weiterentwicklung aus der Industrie ab, um sie auf den Para- Jahre 1995 in Freiburg statt und wurde im unserer Kommunikations-Infrastruktur lokal digmenwechsel vorzubereiten. Oktober 2015 zum sechsten Mal in Karls- und rund um den Globus sowie die Unter- ruhe als gemeinsame Veranstaltung des stützung unsere Mobilität. Zurzeit werden Deutschland ist in einer beneidenswerten Bundesministeriums für Bildung und For- neue Konzepte unter den Schlagworten Lage, eine weltweite Spitzenposition in schung, des Landes Baden-Württemberg Cyber-Physical Systems (CPS), TSensors, Forschung und Entwicklung für die Mik- und des Verbands der Elektrotechnik, Internet der Dinge (IoT), Internet der Dinge rosystemtechnik und, das ist von größter Elektronik und Informationstechnik (VDE) und Dienste (IoTS) und Internet of Eve- Bedeutung, auch in ihrer Produktion durchgeführt. Etwa 1000 Teilnehmer und rything (IoE) entwickelt. Ihr gemeinsames innezuhaben. Große Unternehmen wie 50 Aussteller zeugten von der Vitalität des Merkmal ist die Vernetzung von physi- Bosch und Roche sind weltweit führend Feldes und überall herrschte Aufbruch- schen Objekten mit Elektronik, Prozesso- und zahlreiche Mittelständler unterstützen stimmung angesichts der glänzenden ren und Software und alle stützen sich auf das Mikrosystem-Fertigungsnetzwerk Zukunftsperspektiven. Mikrosysteme und dabei insbesondere während Universitäten und Forschungs- auf Sensoren. Solche Sensoren eroberten institute das Feld weiterentwickeln und Ich hoffe, Ihnen gefällt die „Mikrosystem- zuerst den Automobilsektor in den 90er Mitarbeiter dafür ausbilden. Deutschlands technik in Deutschland“ und Sie finden Jahren, dann in den letzten zehn Jahren führende Stellung ist kein Zufall, sondern inspirierende Beiträge mit neuen Ideen, den Consumer-Markt und erreichten das Ergebnis einer gezielten langfristigen Ergebnissen und Konzepten.

Mit besten Grüßen

Prof. Dr. Volker Saile Tagungsleiter MST Kongress 2015 Karlsruher Institut für Technologie

5 Positionierung im internationalen Wettbewerb Positioning in International Competition Positioning in International Competition

Germany: The European MEMS Driver

Market developments Recent years have seen much soul- searching in the European semiconductor and electronics communities. As Europe’s share of the semiconductor market continues to ebb, there remains one European stronghold: More- than-Moore technology. Particularly important in this field is MEMS (known in Europe as microsystems technology). Europe as a whole is a world leader in this field and Germany is – like in so many other manufacturing-related fields – arguably Europe’s engine.

2015 has seen reports of German giant Bosch taking the number 1 Fig. 1: Resonant translational mirror for industrial applications, © Fraunhofer IPMS spot in the MEMS sensor market for the second year in a row. Together Investment German Association for Sensors and with STMicroelectronics, there are 2 Not only is Germany very successful in Measurement (AMA), German sensor European companies in the top 3 in the MEMS industry today but compa- industry companies are ramping up terms of MEMS sales. In 2014, the gap nies are investing heavily to stay ahead their investment into R&D and produc- between the two widened to more than of the competition and conquer the tion capacity by an astonishing 24% $500 m. markets of tomorrow. According to the in 2015. This increase comes after an already healthy increase of 5% The German MEMS industry enjoys a in investment in 2014. This healthy competitive position. It supplies large-scale investment growth consumer markets, especially smart- is driven by developments phones, with its sensors. This market in the fields of the Internet offers large and growing volume, with of Things and Industry 4.0 / total revenue increasing at an annual- Smart Factories as well as ized 3% despite declining prices due to autonomous driving. It is an intense competition. encouraging sign that German companies are committed to However, the German MEMS industry staying ahead in this market. has a second pillar of growth within the strong domestic premium car indus- So all is well in Germany? try. Here, demand for sensors and While Bosch enjoys a healthy actuators is particularly strong and position, it should not be will continue to grow as cars that can forgotten that its top rank is sense their own environment become largely dependent on Apple more important. design contracts. Infineon is

8 Positioning in International Competition

Max Milbredt, Manager Electronics & Microtechnology

also doing well in the MEMS market and has grown significantly over the past few years but is still a long way behind in terms of total sales in the market. Also, it should be noted that 7 out of the top 10 companies are US-based - although with NXP’s recent acquisition of Fre- escale, we might count that as a third European MEMS company soon. Even so, the German industry needs to work on bringing more companies up to scale in this important market.

What about China? China has not yet been able to penetrate MEMS markets significantly. How- ever, there is significant interest from Fig. 2: Lab on a chip, © Henrik Ottoson Chinese government, VCs and entrepre- neurs. We are already seeing the rise of internet services companies and their we assist companies in setting up Chinese foundries. Thus far, the MEMS need for easier access to capital mar- business operations in Germany. At the market has been characterized by long kets. The German electronics industry same time, we also provide information development cycles. According to Yole, should join that struggle to encourage on foreign markets for companies based the average R&D period is 10 years. To- getting innovation in MEMS up to scale. in Germany, making Germany an ideal gether with product and cost evolution, Otherwise the US and China, with their location for European headquarters. All the total time from R&D to commercial- more efficient venture capital markets investment services are treated with the ization currently takes 27 years, so the could again rise to dominate a new mar- utmost confidentiality and provided free efforts by Chinese start-ups could take ket. Looking at the lessons to be learned of charge. more than a decade to show meaningful from traditional More-Moore technology results. Nonetheless, these long product and Europe’s decline in that market, cycles are not law and it would not be we now know we should aim to keep the first time that a quicker rate of catch- Europe and Germany strong in MEMS. up would surprise Western observers were China to get up to speed faster. Germany Trade & Invest If China puts its full weight of entrepre- Germany Trade & Invest is the foreign neurial spirit and easy access to capital trade and inward investment agency of Germany Trade and Invest GmbH behind its MEMS companies, it might the Federal Republic of Germany. Our Friedrichstraße 60 surprise us all again. mission is to promote Germany as a D – 10117 Berlin location for investments and to advise Phone +49 (0)30 - 200 099 - 0 The road ahead foreign companies on how to invest Fax +49 (0)30 - 200 099 - 111 That points to a threat to Germany’s in German markets. With our team of Mail [email protected] current competitive position. There is industry experts, incentive specialists, LinkedIn www.linked.com/in/maxmilbredt an ongoing discussion with regards to and other investment-related services Web www.gtai.com/electronics

9 Positioning in International Competition

Prof. Dr. Christoph Kutter, Microsystems Technology Chairman VDE/VDI Society of Microelectronics, Meets Applications Microsystems and Precision Engineering (GMM), Fraunhofer EMFT,München

Germany and Europe enjoy outstanding strength in micro and nanotechnology research and applications. And we dare not give up this pole position. It is time to gather our forces and ensure a leading role in this new game. With double-digit growth rates, major leverage effects and steadily growing application potential, it numbers among the most important drivers of innovation and growth. Only those who master MST technologies and systems can prevail in global innovation competition, successfully develop new products for key markets of the future, and thus contribute to growth and employment in key industries.

With its integration of sensor technology, evaluation electronics and actuation systems as well as miniaturization and soft- Fig.1: 300mm-wafer. Source: © ST-Leti ware, microsystems technology (MST) makes possible innovative systems solu- ing role in wireless installation systems, is automotive electronics, followed by tions for virtually all social, business and building monitoring and the increasing industrial electronics, data process- industrial applications. In particular, these use of sensor technology in machines ing and telecommunications as well as include the key areas of energy/climate, and plants. The vision “Industry 4.0” consumer electronics. The VDE believes mobility and communication, healthcare, cannot be realized without MST. In the fields of energy efficiency and the safety, production and logistics. safety systems and logistics, count- internet of things, in particular, will be im- less MST-based solutions are being portant MST growth drivers in the future. In automotive electronics, MST contrib- developed or are already in use, such Important technology trends in coming utes to the reduction of CO2, increases as in smart cards, secure authentication years will be self-sufficient microsystems safety and comfort with the help of systems. New MST applications are also with their own energy supply and wire- innovative driver assistant systems, and opening up in micro-optics, the aero- less communication. supports the optimization of traffic flows space industry and in measuring and through car-to-car communication. In control systems. We have to strengthen our microelec- medical engineering, MST solutions tronics industry as part of an overall are becoming increasingly important for Germany’s research and industry holds strategic EU innovation policy. Especially implants as well as for diagnostic and a very solid position in MST in inter- when it comes to system security – a monitoring systems. In telecommunica- national comparison. The fact that the vital issue – the message should be tions, MST modules provide the basis importance of MST for German indus- clear. We must eliminate so-called for new functions and the development try is growing is reflected by steadily “chip backdoors” and find solutions for of 5 G future mobile communication. In increasing MST market volumes. By embedded end-to-end security. That’s industrial electronics, MST plays a grow- far the biggest customer industry here why it is critically important to have the

10 Positioning in International Competition

Dr. Ronald Schnabel VDE/VDI Society of Microelectronics, Microsystems and Precision Engineering (GMM)

entire microelectronics innovation chain Microsystems Technology localized and under our own control. All Congress as well as in net- the way from chip design to produc- work projects – to utilize the tion, from microchips through embed- great innovation potential of ded systems to entire cyber-physical MST in Germany for industry. systems. And what is the role of politics Here, the VDE/VDI Society of here? Our politicians must also provide Microelectronics, Microsys- attractive incentives for making the tems and Precision Engi- adequate investments needed for secur- neering (GMM) is playing an ing microelectronics and microsystems important role as a broadly- technologies and applications. Our based expert platform for political communities must create and knowledge transfers, and is maintain legal and regulatory frame- making major contributions work conditions that ensure long-term to the strengthening of MST planning security. Without this, develop- in Germany through position ments will be hindered. The tasks lying papers, workshops, confer- ahead range from research in basic ences and initiatives. Fig.3: The world of microsystems © VDE/VDI-GMM technologies to pilot projects and demonstrators in various technical fields. The GMM believes one of the chal- the results of their basic research into lenges in the future will be to support marketable products. Other challenges The VDE and the German Federal Min- innovative small and mid-sized enter- will be to reduce bureaucratic hurdles to istry of Education and Research (BMBF) prises – that are shaping Germany’s innovation, expand knowledge networks are very successfully cooperating in the industrial structure in the field of MST and increase support for young talents field of microsystems technology – both and that contribute to Germany’s lead- and research. The VDE believes the in the framework of the VDE/BMBF ing position for innovation – in turning goal of a far-sighted and future-oriented MST engagement is to rigorously utilize the great potential of MST and strategi- cally strengthen Germany’s competitive position in other key technologies and leading markets.

VDE/VDI Society of Microelectronics, Microsystems and Precision Engineering (GMM) Dr. Ronald Schnabel Stresemannallee 15 D – 60596 Frankfurt Phone +49 (0)69 - 6308 - 227/330 Fax +49 (0)69 - 6308 - 9828 Mail [email protected] Fig.2: Chip-to-Wafer Stock for 3D Integration. Source: © Fraunhofer IZM Web www.vde.com/gmm

11 Positioning in International Competition

12 Contributions to Topical Fields of Innovation

Beiträge zu aktuellen Innovationsfeldern Contributions to Topical Fields of Innovation

Smart Integrated Systems – Prof. Dr. Thomas Gessner hardware basis for the IoT

Just several years ago Frost and Sullivan with each other. They are highly reliable, 174 businesses, universities and other pointed out that smart is the new green. often miniaturized, networked, predictive partners, is involved in 46 research The concept of “Smart Earth” is, in fact, and energy autonomous. projects to develop intelligent technical the in-depth application of a new genera- Smart components and systems are systems and make Industry 4.0 a reality. tion of network and information technolo- a pervasive key enabling technol- Looking at Industry 4.0 often cyberphys- gies. Smart cities arise worldwide. Global ogy, impacting all industrial branches ical systems are addressed. These are concepts for smart production are under and almost all aspects of life. One of networked systems, their functionality is development. The Internet of Things - IoT the most important applications is the autonomously controlled by software. - including smart grid, smart health, smart smart factory or smart production. The The hardware of cyberphysical systems city, smart buildings, smart home, smart international markets request new, are the smart systems. In order to make production and smart mobility provides high-quality products and individualized it easier if smart systems are exchanged not only big opportunities but is request- products in even shorter times. This can as well as to reduce time and effort ing more highly integrated smart systems only be realized based on an increase if new components are integrated in from the hardware side. The total number of productivity minimizing resources and production units, the cluster aims to of connected devices is expected to grow energy consumption. develop plug-and-play functionalities for rapidly. intelligent devices, machinery and pro- Therefore, the development of smart duction units by devising hardware and According to the strategic Research components and system for tomorrow’s software components and making them Agenda of the European Platform on production is one of the keys of the available on a platform. Thereby also Smart Systems Integration EPoSS smart current industrial revolution, in Germany interfaces for the integration of different systems are defined as self-sufficient called Industry 4.0. Germany’s high-tech sensors and actuators are established. intelligent technical systems or sub- strategy provides good frame conditions systems with advanced functionality, to transfer excellent ideas into real prod- The vision of the Cluster of Excellence enabled by underlying micronano- and ucts and services. Some of the clusters MERGE - Merge Technologies for Mul- bio-systems and other components, and aspects will be described below. tifunctional Lightweight Structures - of Figure 1. They are able to sense, Technische Universität Chemnitz is to diagnose, describe, qualify and manage So the technology network “it’s OWL” tap into the joint resource potential of a given situation, their operation being – Intelligent Technical Systems Ost- merged technologies and lightweight further enhanced by their ability to mutu- WestfalenLippe –, founded as one of structures by adopting an integrated ally address, identify and work in consort Germany’s leading edge clusters with approach. The hybrid construction of multifunctional lightweight structures unites passive or active components, which must be combined to meet specific requirements. The fundamental production methods that form the basis for this research are textile, plastics and metal processing methods. Here active components such as sensors, actuators and generators in electronic modules can be integrated into the production process using in-line or in-situ proce- Figure 1: Smart Systems according to SRA of EPoSS, 2013 [1]

14 Contributions to Topical Fields of Innovation

dures, thus adding a further stage of cooperation of Freudenberg Dichtungs- functional lightweight construction. und Schwingungstechnik GmbH & Co. KG, Weinheim, Fraunhofer ENAS Chem- Current industrial trends in mechanical nitz and Fraunhofer IZM Berlin, Figure 3. engineering and plant manufacturing The system contains sensors, elec- address condition monitoring mainly to tronics for signal conditioning, wireless minimizing system failures as well as signal transmission (necessary due to protection against plagiarism, Figure 2. rotating parts) and self-sustaining power The implementation of sensors, elec- supply, which ensures the autonomous tronics for signal conditioning, wireless and efficient operation. signal transmission (necessary due to rotating parts) and self-sustaining power Looking at different markets it is clear to supply allows an autonomous and see that the smart systems have steadily Figure 3: Rotary shaft seal (Simmering®) with opti- efficient operation of such systems for evolved themselves in recent de- cal sealing function detection on air side – Source: Fraunhofer ENAS various applications. For condition moni- cades - and have to develop itself even toring a smart system of second genera- further - in their variety of technologies, many different application fields as well tion – a rotary shaft seal (Simmering®) materials, used physical effects, applica- – especially for the moment and even with optical sealing function detection on tion fields. With their offered variety of more in the future pending requirements air side - had been developed in a jointly solution options they are adaptable for from the grand challenges, mainly the climate change, a secure energy supply, Figure 2: the sustainable transport, the sustain- Protection against able production, demographic change plagiarism in the case and securing of health and wellbeing. of a transmission belt These capabilities of smart systems thus result in extremely high expectations; they are ultimately a key technology. These same claims generate a tremendous development pressure, by which the development will be further promoted and accelerated.

[1] Strategic research agenda of EPoSS 2013

Prof. Dr. Thomas Gessner Fraunhofer Institut für Elektronische Nanosysteme Technologie-Campus 3 D – 09126 Chemnitz Phone +49 (0)371 - 45001 - 100 Fax +49 (0)371 - 45001 - 101 Mail [email protected] Web www.enas.fraunhofer.de

15 Contributions to Topical Fields of Innovation

MEMS Micromirrors for Intelligent Headlamps

In the last decade automotive head game. Based on lamps changed from simple dual lights this information with low beam and high beam to adap- the light distribu- tive headlamps which are able to gener- tion is modified ate complex light distributions on the so that oncom- road. Today adaptive headlamps can ing or drivers be divided into two groups following the ahead are not subtractive and the additive approach. In blinded (see the subtractive principle, part of the gen- Figure 1). erated flux is blanked out and dumped, e.g. by movable shutters. In contrast, In order to the additive principle generates the light realize new distribution by selectively switching on or and innovative Figure 2: Principle setup of a headlight with a scanning MEMS micromirror off additional light sources. functions, a new Modern headlamps have several adap- technology will be developed in the gy uses a laser beam scanning unit and tive driving beam functions. One of them course of the project iLaS (“intelligent can neither be classified as a subtractive is the glare free high beam function laser based adaptive headlight system”), nor as an additive adaptive headlight. which is based on an automotive cam- funded by the German Federal Ministry In this new headlight a laser beam is era system which is mounted in the rear of Education and Research (BMBF), continuously scanned over a phosphor view mirror. The camera detects and grant ID FKZ 13N13087. The project converter by a MEMS micro mirror. The classifies besides their traffic participants partners are Audi AG, Osram AG, so generated scan pattern is projected on recognition of their tail lights and Robert Bosch GmbH and Karlsruher In- onto the road through secondary optics. headlamps also unlighted pedestrians or stitut für Technologe (KIT). This technolo- For updating the pattern in time the system electronic must synchronize the deflection of the mirror and the power supply of the laser.

Figure 2 shows the principle setup. The beam of a laser diode with a wavelength of around 450 nm is directed onto a small MEMS micromirror, which deflects the light towards a phosphor converter. The converter contains conversion and scattering particles embedded in a matrix. The resulting mix of scattered blue light and converted light can be tuned to yield white light. With the synchronized combination of tilting the MEMS micromirror and controlling the laser power a desired light pattern can be produced on the converter and projected onto the Figure 1: A glare free headlight road like a slide in a slide projector.

16 Contributions to Topical Fields of Innovation

Dr. Frank Schäfer, BOSCH

The light pattern will be modified accord- of the width of the masked area caused lid to allow optical access and offer ing to information obtained by high perfor- by activating or deactivating adjacent protection against particles. The reflec- mance driver assistance sensors (cam- pixels. tion properties of the MEMS element era, LIDAR, RADAR, etc.) and merged by Another advantage of headlights based are very demanding for a headlight an ECU in order to calculate an adaptive on scanning micromirrors is their ability application. Based on typical system and intelligent light distribution. of a true redistribution of the available parameter values it can be derived that Today’s most advanced adaptive headlight. Subtractive lighting systems, e.g. optical laser power of about 10W might lamps are matrix LED headlights. Nearly systems based on DLP, LCD or LCOS be required. A typical metal coating for 100 LEDs can be activated and deac- imagers can only discard light after it is CE applications like, e.g. Ag is achiev- tivated or dimmed individually. This is a generated. This requires having more ing about 95% reflection at 450nm. For major drawback compared to headlights luminous power installed than needed minimizing the power deposited into based on scanning micromirrors. Each on average and also supplying it with the micro mirror, and hence to reduce LED is generating or modulating light electrical power. An ideal scanning the thermal load, a high reflection is and can be individually projected into a laser system is able to redistribute the necessary. We utilize an optimized defined solid angle. This pixel structure light flux as required allowing for a high dielectric multilayer stack. Depending could cause visible patterns and “jump- average utilization of the installed light on the polarization of the used laser ing” boundaries of the illuminated area sources and low energy consumption. beam a reflectivity close to 100% can especially when single segments are be achieved. switched on or off. In contrast, scanning Figure 3 shows a micromirror suited This new application would enable micromirror based systems gener- for headlight applications. The mirror a complete new market for MEMS ate a continuous light distribution. The is made of silicon, manufactured with products. Today the automotive MEMS light masking can follow smoothly an standard MEMS technologies. In our market is dominated by acceleration oncoming vehicle without sudden jumps case the mirror is covered with a glass sensors, gyroscopes and pressure sensors for airbag, ESP® and power train. Being one of the MEMS pioneers and by far the world’s largest automotive MEMS supplier with the experience of more than 6 billion MEMS sensors (automotive and CE), Bosch fulfills all conditions to step successfully into this new application field: scanning micromirrors for adaptive headlights.

Dr. Frank Schäfer Robert Bosch GmbH AE/PRM-S AE/ESE2 Postfach 13 42 D – 72703 Reutlingen Phone +49 (0)7121 - 35 - 1558 Mobile +49 (0)160 - 9041 8737 Mail [email protected] Figure 3: MEMS micromirror Web www.bosch.com

17 Contributions to Topical Fields of Innovation

Smart Materials and Microsystems

Continuous development of functional Piezoceramic Thick Films a LTCC substrate. Finally, assembled materials, adequate structuring technolo- Piezoceramic thick films with typical in the system, each structure forms the gies and component manufacturing is the thickness of 30 – 150 µm offer the op- rear side of a bimorph mirror enabling key to advances in micro-technology and portunity of integrated solutions for smart beam focusing in an optical system. systems integration and enables superior electrical, optical and fluidic microsys- Each single PZT thick film element is products and innovative applications. The tems. Depending on layout and electri- individually controllable and works as an “Smart Materials and Systems” department cal activation they can be applied as actuator that can locally deform the mir- at Fraunhofer IKTS is specialized in devel- sensors, actuators, ultrasonic transduc- ror. By this, optical aberrations of e.g. oping dielectric functional ceramics and ers, transformers or energy harvest- high-energy lasers can be controlled. integrating them into devices, microsystems ers. Using screen printing technology and active structures. Research covers all net-shaped structures can easily be fab- Figure 2 contains an example similar to aspects of the value chain, ranging from ricated on substrates like Low Tempera- Figure 1 but in difference used for ul- materials synthesis to functional verifica- ture Cofired Ceramics (LTCC), Al2O3, trasound generation. It shows a screen tion in prototype systems. Special materi- ZrO2, silicon and appropriate steel printed ultrasonic transducer array for als expertise exists in the field of complex grades. Insulation and electrode layers particle manipulation. The principle of perovskites, which, as high-performance compatible to the piezoceramic material these so-called ultrasonic tweezers is piezoceramic or dielectric ceramics, provide enable a large variety of different designs based on the generation of standing sensing, actuating, and electronic functions with electrical connection to each single ultrasound waves within a fluid channel in monolithic components and compos- piezoceramic element. Thereby miniatur- between a transducer and a reflector ites with polymers, metals, glasses, and ized devices which allow for a combina- layer. Particles with dimensions of less other ceramics. Thick film, multilayer, and tion of piezoelectric function, multilayer than 1 μm up to hundreds of microns piezocomposite technologies are available technology and electronics packaging can be trapped at the pressure node as complete technology chains. Functional can be manufactured. Because the plane. Ultrasonic transducer arrays optimization is accordingly performed on screen printing process is technological- made of individually addressable ele- several scales, through utilization of prop- ly established, monolithic and integrated ments enable for stepwise driving and erty combinations of composites, functional piezoceramic solutions are feasible in thus for moving trapped particles along consolidation in materials, and adaptation batch production on wafer-level. a microfluidic chamber which is of of components to the system environ- special interest in fields of biotechnol- ment. This is emphasized by the following Figure 1 shows four PZT (lead zirconate ogy and life science like cell separation examples. titanate) thick film structures printed on and sorting.

Figure 1: Different layouts of PZT thick film actuators on LTCC substrate used as adaptive mirrors for laser beam shaping (FhG IKTS/IOF)

Figure 2: 2D ultrasonic transducer array on Al2O3 for particle manipulation, 6 x 6 PZT thick film elements with 2 mm feature width and 2.3 mm pitch 18 Contributions to Topical Fields of Innovation

Dr. Sylvia Gebhardt Dr. Holger Neubert

Cross electrode designs, as shown in array structures with cylindrical rods „Electronic Sonotweezers“ programme Figure 3, allow for 2D ultrasonic trans- in a non-regular arrangement after funded by the UK Engineering and ducer arrays with even smaller pitches sintering. Rod diameters are 65 and 48 Physical Sciences Research Council, and larger numbers of elements. In μm, rod height is 325 μm in this case. and the Fraunhofer Institute for Ap- those designs, a continuous PZT layer These structures are further processed plied Optics and Precision Engineering is printed between perpendicularly ar- to 1-3 piezocomposites for ultrasonic within the “Kompetenzdreieck Optische ranged bottom and top electrode lines. transducer arrays. Currently, reduction Mikrosysteme – KD Optimi” funded by The example in Figure 3 comprises of rod size down to 30 µm and lower the Federal Ministry of Education and 900 elements with an electrode line is under investigation designed for Research (BMBF) FKZ: 16SV5473. width of 200 µm and a pitch of 500 µm. frequency ranges up to 30 MHz.

Soft Mold Process The research activities of the “Smart Screen printed structures are limited Materials and Systems” department in height by technology. Fine scaled at IKTS are not restricted to the above structures with larger aspect ratio described materials and processes. between element height and width Current projects cover, for example, can be manufactured by the soft mold dielectric materials and component process. It uses master molds, which technology for capacitors in power have been structured by microsys- electronics and high voltage applica- tems technology like micromachining, tions, electro-caloric materials for in- Dr. Holger Neubert chemical or plasma etching. The micro- novative cooling systems, lead free and Dr. Sylvia Gebhardt structured, e.g. silicon, master mold is high temperature piezoceramic materi- Fraunhofer-Institut für transferred into the ceramic mold via a als for sensor, actuator and ultrasound Keramische Technologien soft plastic template, which is reus- applications as well as piezoelectric und Systeme IKTS Dresden able. The template, being the nega- fibers, pearls and composites thereof Winterbergstraße 28 tive of the desired structure, is filled for adaptive functions. D-01277 Dresden with a ceramic slurry. After drying, the We gratefully acknowledge co- Phone +49 (0)351 - 2553 - 7615 ceramic green body is demolded and operational research with the Institute Mail holger.neubert@ikts. subsequently sintered. Figure 4 gives for Medical Science and Technology fraunhofer.de an example of such manufactured PZT of Dundee University, UK within the Web www.ikts.fraunhofer.de

Figure 3: Crossed electrode ultrasonic transducer array

Figure 4: SEM micrograph of a sintered PZT array structure with cylindrical rods in a non-regular arrangement 19 Contributions to Topical Fields of Innovation

Smart Sensors for Industry 4.0

With digiLine, JUMO presents the first bus-capable connection system for digital liquid analysis sensors with Plug and Play functionality and an with integrated sensor management. The system enables the simple setup of sensor networks.

The world is analog – our senses, as well as all natural, physical, and chemical processes, function according to this principle. Why then do we try to make everything digital? For the technical world, the digitization of measurement signals represented an important step forward. Finally, it was possible to process measured values from the sensors in display units, controllers, or recorders without any loss, digiLine Pressefoto and to mathematically connect these with other signals. The major trend in recent years has or malfunctions on the way from the sensors became so-called “smart sen- been not to first digitize the sensor sig- sensor to the downstream measur- sors”, which carry their specifications nals in a measuring or control device, ing device to be further minimized or with them at all times. From a techni- but instead to bring these as close as prevented altogether. cal point of view, this now simplifies possible to the analog sensor ele- Through the integration of microproces- startups, calibration processes, and ment. This enables any signal changes sors in the sensors, analog measuring parameter settings. The sensor has

digiLine Systemaufbau digiLine Sensorerkennung

20 Contributions to Topical Fields of Innovation

Reinhard Manns

digiLine sensors can be integrated with the JUMO mTRON T automation system. This means that there is no need for an additional transmitter between the control and the digital sensor. Alongside the Modbus-based digiLine protocol, most digiLine sensors are also available with an analog output of 4 to 20 mA. This allows the smart sensors to be integrated even in older systems. JUMO digiLine pH and redox sensors come as a single unit consisting of the sensor with the electronic system screwed onto it. Once the pH redox component has become completely worn, the screw connection is separated and electronic components can continue to be used with a new sensor. DSM-Software (Digital Sensor Management) The system software is also completely new. The necessary parameterization everything on board to automatically A variety of liquid analysis parameters and calibration of the pH or redox sen- provide the peripheral equipment with can now be measured using just one sor can be carried out conveniently in the option to retrieve measurement system. For the market launch, a digi- the laboratory using a PC or laptop, a signals and further data. The often Line component was developed for pH, USB interface converter, and the JUMO mentioned “Plug and Play” from the redox, and temperature measurement. digiLine software. Calibration data and consumer sector has now finally found Furthermore, it is possible to connect the sensor status evaluation are stored its practical use in the industrial and with tried-and-tested JUMO products for directly in the sensor and enable seam- technical world. turbidity and oxygen measurement. Digi- less documentation over the entire sen- In addition to the digital transfer of tal versions of the conductivity and am- sor life cycle. sensor signals, the smart sensors also perometric sensors for disinfection (free With this new technology, JUMO is enable the setup of sensor networks. chlorine, total chlorine, ozone, hydrogen bridging the gap between the world of An example of this type of intelligent peroxide, etc.) are also in preparation. sensor technology and Industry 4.0. network is the JUMO digiLine. A The major benefit: the simple connection diverse range of sensors can be con- of various sensors to a bus opens up a nected to each other in a star network range of new possibilities for industrial JUMO GmbH & Co. KG or in series. Only a single digital signal applications in the processing, food, Reinhard Manns cable then connects to the next evalu- pharmaceutical, and water industry. The JUMO Product Manager ating unit or to the control. This enables JUMO digiLine sensor network also Moritz-Juchheim-Straße 1 more efficient and faster cable installa- increases the number of sensors that D – 36039 Fulda tion in plants in which several param- can be connected to the JUMO AQUIS Phone +49 (0)661 - 6003 - 493 eters need to be monitored simultane- touch multichannel measuring and Mail reinhard.manns.jumo.net ously at a diverse range of locations. control devices. Furthermore, JUMO Web www.jumo.net

21 Contributions to Topical Fields of Innovation

Energy Efficient Magnetoresistive Sensors for Low-power and Wireless Applications

Dr. Rolf Slatter Sensitec GmbH

Magnetoresistive netic field. However, this effect sensor technology could first be used industrially Magnetic microsystems in the more than 120 years later, dur- form of magnetoresistive (MR) ing the late 1970s, in combina- sensors are firmly estab- tion with thin-film technologies lished in automobiles, mobile derived from the semiconductor telephones, medical devices, industry. The intelligent arrange- wind turbines, machine tools ment of thin-film structures or industrial robots: be it for within a sensor enabled the the measurement of path, development of many differ- angle or electrical current, or ent sensor types for measuring as an electronic compass. Fig. 1: Comparison of MR technologies. Source: Sensitec GmbH the angle, strength or gradient Originally developed for data of a magnetic field. The effect storage applications, the discovered by Thomson was different MR effects open up named the “anisotropic magne- new measurement possi- toresistive effect” (AMR) and re- bilities for sensors, not only sulted in a resistance change of in terrestrial applications, but just a few percent. Nevertheless also in space applications. this effect was used million-fold MR sensors are robust, reli- in the production of read-heads able, precise and miniaturized. for hard discs. At the end of This combination of features is the 1980s the “giant magne- leading to continuous growth toresistive effect” (GMR) was in the application field of MR discovered. Here the resistance sensors. The extremely low change was more than 50 %, power consumption of MR which opened up even more Fig. 2: Comparison of sensor area for different resistances. sensors makes them ideal for Source: Sensitec GmbH applications for MR sensors. In wireless, autonomous sen- the meantime the read-heads of sor applications. They present the The magnetoresistive effect has been hard discs are almost exclusively based developers of many different types of known for more than 150 years. The on the “tunnel magnetoresistive effect” mechanism or instrument with com- British physicist William Thomson, later (TMR), which can exhibit a resistance pletely new possibilities to measure known as Lord Kelvin, discovered that change of several hundred percent angle, path, electrical currents or the electrical resistance of a conductor under laboratory conditions. This magnetic fields. changed under the influence of a mag- technology has additional features that

AMR GMR (Spin-Valve) TMR Signal strength (ΔR/R) < 4 % < 15 % < 200 % Direction of current flow Parallel to layer plane Parallel to layer plane Perpendicular to layer plane Topology Meander Meander Point Table 1: Differences between MR technologies

22 Contributions to Topical Fields of Innovation

Signal Sensitivity Detectivity Detectivity Bandwidth Power Tempera- Hysteresis Radiation Miniaturisa- strength (low (high consump- ture hardness tion (ΔR/R) frequency) frequency) tion stability capability AMR o + ++ ++ ++ o + ++ ++ o GMR + + o ++ + + ++ o + + TMR ++ + o ++ + ++ ++ o + ++ Hall ------++ - -

Table 2: Comparison of magnetic sensor technologies

are not only interesting for 1/f noise. For this reason sen- storage technology, but also sor nodes featuring magnetic for sensors. For example, field measurement, e.g. for ve- TMR-based sensors have hicle detection, almost always an extremely high sensitiv- feature AMR sensors to date. ity and a very low power Table 2 summarizes the main consumption. Fig. 1 shows a properties of MR sensors, in schematic comparison of the Fig. 3: Battery consumption after 6 months for typical TMR sensor (left) and AMR comparison to other magnetic sensor (right) in continuous operation. Souce: Sensitec GmbH different MR layer structures sensors, such as hall-effect and Table 1 compares their sensors. basic characteristics for commercially available prod- Application Example: Condition ucts. For sensor applications monitoring of bearings the AMR, GMR and TMR Fig. 4 shows an intelligent effects are complementary, plummer block developed each offering specific advan- by NTN-SNR in France. Also tages that can be of benefit known as a pillow block, this in different applications. is a pedestal for support- As indicated above the TMR ing rotating shafts in large effect not only offers a large machines. This application signal strength, but also allows the remote monitoring makes the realization of ultra- of a bearing in terms of tem- low power sensors possible. perature, vibration, speed and The AMR effect depends Fig. 4: Intelligent plummer block (left) and solar-powered demonstrator (right). number of turns. For saving on the material volume of Source: NTN-SNR Roulements S.A. battery life, the node is most the MR material, with the of the time idle and wakes up consequence that a 4-fold increase tor between ca. 10 and 100, compared from time to time for making the different in resistance to achieve a reduction in to a Hall-effect sensor by a factor of up measurements and sending them over power consumption, leads to a 4-fold to 1000. a RF network using the IEEE 802.15.4 increase in the area of the active surface protocol. A TMR sensor is used here of the sensor chip, as shown in Fig. 2. There is, however, a limit to how high with a pole ring inside the housing for For the TMR effect, on the other hand, the resistance of a TMR sensor can measuring the shaft speed. the resistance of the sensor chip be increased. Thermal and shot noise increases exponentially with the thick- increases with increasing resistance Dr. Rolf Slatter ness of the barrier layer (see Fig. 1). In and 1/f noise increases as the sensor Sensitec GmbH this case the power consumption of the area gets smaller, with the result that the Georg-Ohm-Str. 11 sensor chip can be reduced signifi- signal-to-noise ratio worsens. At low fre- D – 35633 Lahnau cantly without any increase in chip area. quency (< 100 Hz) the detectivity of GMR Phone +49 (0)6441- 9788 - 0 Compared to an AMR sensor the power and TMR sensors is in any case lower Mail [email protected] consumption can be reduced by a fac- than for AMR sensors due to intrinsic Web www.sensitec.com

23 Contributions to Topical Fields of Innovation

Wireless Sensors for Structural Health Monitoring

Methods und measurement systems of tion. Mostly, SHM requires a network of of the structure (fig. 1). For this reason, condition monitoring help to assure the many sensor nodes to test large struc- there is a need for completely wireless, availability of machines and plants as tures like bridges, pipelines, wind power self-sufficient sensor nodes. well as reliability and optimal functioning plant rotors etc. Generally speaking, a of critical components. SHM sensor network is some kind of a Along the project “CoolSensornet” par- Integrated in the production, condition “sensing skin” of a technical device like tially initiated and led by my Fraunhofer monitoring supports control and optimi- the skin of an animal or human being. group and based within the leading zation of production processes within SHM applications have gained signifi- edge technology cluster named “Cool companies and along the value added cant attention in many industrial fields. Silicon” Fraunhofer IZFP and IKTS have chain. One of the most important physical jointly developed energy autonomous methods to implement SHM is the and wireless sensor systems together Fraunhofer IKTS provides optical, detection of (material- inherent or with IMA GmbH Dresden, Technische acoustical and electromagnetic sen- stimulated) acoustical lamb waves in Universität Dresden, ZMDi AG and RHe sors, sensor systems and monitoring the frequency range of a few 100 kHz. Microsystems GmbH. These sensor systems, which act as support for the To detect lamb waves in (mostly larger) systems are ready-to-use for monitoring erection and commissioning of plants technical structures, it is necessary to large sized aircraft structures and wind as well as the ongoing operation by implement a sensor network on the skin power rotor blades over long terms. permanent condition diagnostics. They of the structure or inside the structure. First project results revealed that by us- are designed for harsh operation condi- These sensor networks are often “in ing wireless sensors that are based on tions and provide advantages, like non- the field”, that means far away from any acoustical lamb waves it is possible to destructive defect detection, real-time power supply. Furthermore, the usage detect damages after impacts in CFRP monitoring and associated condition- of cabling is not desirable in many appli- materials. To achieve this, a defect indi- based maintenance or plant optimiza- cations. Examples are the aircraft indus- cator is determined by the sensor node tion and lifetime prognosis. try (each cable produces more weight) firmware with the help of data compres- and rotor blades of wind energy plants sion, environment influence compensa- Structural Health Monitoring (SHM) – as (to avoid lightning flash damages). Sen- tion and feature extraction. a part of condition monitoring – consists sor nodes completely embedded in in the testing of (mostly) mechanical carbon fiber reinforced plastics (CFRP) The hardware of the sensor node properties of technical structures with should also be wireless, because any includes a 900 MHz IEEE 802.15.4 regard to their safety and proper func- additional cable could weak the stiffness transceiver, which is a ZigBee derivate,

Fig. 1: Sensor Node Embedded in CFRP Fig. 2: Sensor Node Electronics Fig. 3: Energy Harvesting System

24 Contributions to Topical Fields of Innovation

Dr.-Ing. Dieter Hentschel Dr. Lars Schubert

and an ARM 32-bit Cortex © -M3 as the central processor unit. The sensor input signals are filtered and amplified, and after this, converted by a 14bit 2MS/s analog/digital converter. The energy consumption of the sensor node hardware for a complete RX/TX cycle amounts to 1 mWs only. Figure 2 shows the complete sensor node electronics.

To provide the sensor node with the required energy, our group developed an energy harvesting system with four parallel piezoelectric transducers connected with a tip mass (fig. 3). The energy harvesting system gains its input energy from vibrations of an aircraft structure, which is resonant at about 500 Hz. These structure vibrations are on the one hand of high dynamics, Fig. 4: Sensor Sleeve for Underwater Applications but on the other hand they have small elongations of a few µm. Therefore, the 1. 5000 hours at 85 % of relative hu- Another example is the SHM of pipes electrical output of the energy harvest- midity at a temperature of 85 °C by a sensor sleeve. In this case, the ing system is only a little more than 2. 4000 temperature cycles at monitoring of local corrosion, cracks and 100 µW. Nevertheless, an intermittent -55/+85 °C integral wall abrasion is possible with the monitoring cycle is possible in case of 3. 24 hours at a temperature of 180 °C help of sensors in a special arrangement continuous vibration. During a time span 4. 24 hours at a temperature of -70 °C around the pipe. Monitoring of pipelines of 90 seconds, an amount of 1 mW 5. More than 3 million mechanical strain and base structures of off-shore wind electrical energy is collected in a storing cycles. energy plants is realized, even underwa- capacitor of 47 µF. This is sufficient to ter, as shown in figure 4. achieve a complete RX/TX cycle of the Meanwhile, the SHM sensor nodes are sensor node. used in many other technical fields too. One example is the detection of cracks Fraunhofer-Institut für Keramische Tech- The reliability of the SHM sensor is in railway vehicle wheels by monitor- nologien und Systeme IKTS another very important question: The ing the three-dimensional acceleration Dr.-Ing. Dieter Hentschel test system has to be more reliable than signals with the help of a sensor system Business Development the structure to be tested. Therefore, the mounted inside the bearing cap besides Maria-Reiche-Straße 2 lifetime of the embedded sensor node the railway wheel set. In this special D – 01109 Dresden according Figure 1 of up to 15 years case, another type of energy harvesting Phone +49 (0)351 - 88815 - 540 was proved by accelerated aging. The system is necessary, dealing with heavy Mail [email protected] whole system was damage free till stochastical elongations. Web www.ikts.fraunhofer.de

25 Contributions to Topical Fields of Innovation smartWT – The intelligent Workpiece Carrier for Micro Production and more

Arnd Menschig, Carl ZEISS 3D Automation GmbH

A short throughput time, a secure part The smartWT is not only a smart, but a industrial bus systems Modbus and I2C handling and traceable processes - real intelligent object. May be you will was realized [1]. Built within the available these facts do essentially determine not name him intelligent only because of ISM radio band (Industrial, Scientific and the quality and effectivity of production. his brain – the micro controller with his Medical) at 868 MHz it allows sending Cyber physical systems are on the way data storage – and his senses – smart data to a receiver over at least 25 m to bring this benefit even to small and sensors for e.g. temperature, shock and in an in-door star topology at 0 dBm medium enterprises. According to fulfil vibration. Or because he also is possible transmitting power. A software defined the Industrie 4.0 requirement on real- to activate movements, to accumulate radio controller with a special wake-up time data processing a self-sufficient energy and to communicate with the technology developed by IMTEK [2] workpiece carrier with radio communica- production environment. But then he was used to save energy. The wake-up tion is needed. tells you that something will go wrong distance was measured to reach 15 m. in your next fabrication step. Now you Introduction accept that he is an intelligent accessory As energy storage an AAA-sized Li-ion The independent smartWT helps to record for your production. accumulator with a capacity of 500 mAh and deliver continuously the relevant data at 3.6 V was chosen. Loading is done of the fabrication process or the logistics The electronic heart of the sensor via inductive energy transfer with an supply chain. The communication partner and actor platform air gap of up to 5 mm with a maximum can be a controller of a metal working ma- A miniaturized electronic control unit transmission capacity of 7.5 Watt. On chine, a micro production equipment or – the smartWT miniECU – is the brain the secondary side a miniaturized single an enterprise resource planning system. of the configurable sensor and actor circuit board (54 mm x 8 mm) for the With the help of the smartWT infrastruc- platform. It supports the connection of bridge rectifier together with the energy ture the production scheduler can su- I2C-bus, Modbus and analog sensors management and monitoring circuit with pervise and optimize selected processes and communicates with the environ- an I2C-communication to the smartWT permanently. Even so, if the smartWT is ment by wire or wireless. For the radio controller was developed. A charging not coupled to a machinery. communication a gateway for the current of 500 mA at a maximum voltage of 4.2 V can be realized. Towards the primary side a withstand voltage of maximum 76 V was implemented. The inductive energy transfer unit on the primary side was integrated in loading stations for the three different applications metrology, assembly and manufacturing. The resonance frequency, the output voltage and power can be adapted by software. Also available are error messaging and configuration of control parameters for voltage, current and phase of the oscillator, and also for the temperature of the electronics. The software runs on the computer of the Figure 1: Smart sensors with miniaturized head for temperature measurements at workpieces adapted to a workstations to set-up the workpiece workpiece carrier system [Zeiss 3D Automation, 2015]. carriers.

26 Contributions to Topical Fields of Innovation

Figure 2: Web-based operator interface for monitoring and analyzing of sensor networks across locations [Zeiss 3D Automation, 2015].

Miniaturized sensors within the miniaturized electronics in database synchronization to a cloud and sensor networks Modbus register. application in the local network or the Low power miniaturized sensors for tem- internet. With this technology important perature measurement, 3D shock detec- Besides the miniaturized sensors also information, e.g. temperature gradients or tion and 2D angle metering together with a special 3D seismic detector with seismic events, are analyzed and visual- a M5 industrial connection environment 200 µg accuracy was developed. The ized in real-time. As required for Industrie were realized. Also a Modbus to I2C con- embedded module solution performs an 4.0 applications the results can be viewed verter electronic is available to connect on-board data processing of the output and compared to historical data on mobile low-cost sensors of different type. The data from a sensitive acceleration sen- devices locally or all over the world. overall size of the injection molded elec- sor to supervise thresh- tronics is 50 x 11 x 8 mm (Figure 1). The old values of vibration shielded cable has an outer diameter of amplitudes in several 3 mm. As the communication protocol ranges of frequency. the industrial Modbus with a supply Via Modbus communi- voltage of 5 V was chosen. The sensors cation the violations of can be used in classic wired networks up to six limits for each or together with the smartWT miniECU in range of frequency can the new wireless Modbus/I2C network. be transferred. The digital workpiece temperature sensors have spring-loaded single Pt100 Both sensor network heads of size 6.5 x 32 mm with a spring types were integrated into deflection of about 2 mm. The electron- a local data collecting and ics use high precision analog to digital analyzing controller with converter, a temperature accuracy of a web-based operator 50 mK can be specified. The sensor interface. The software Figure 3: : Sensoric workpiece carrier on a coordinate measurement model and the calibration data is stored infrastructure supports machine [Kugler, 2015].

27 Contributions to Topical Fields of Innovation

Metrology applications A temperature variation of the workpiec- Applications assembly and manufacturing In production the carriers today are es or of the carrier during measurement In addition to the static solutions for mainly pure mechanical fixtures to hold causes different elongations. Therefore metrology in these applications system the workpiece sometimes combined shape and position tolerances can integrated actors allow cooperation with static identifiers or with memory not be met. The smartWT informs the between the carrier and the production accessed by RFID technology. Now a user when the set-point temperature is process. One carrier type was real- miniaturized self-sufficient solution is reached or a shock event occurred so ized with integrated rotational elements available with sensors detecting the that the following process step can be (Figure 5). It is no longer necessary to condition of the workpiece or the envi- blocked or performed. One workpiece rotate a dispenser tool or a camera by ronment. carrier (530 x 120 x 70 mm) was real- robot around the workpiece or reduce The brain of the carrier can learn ized to perform batch measurement to one-piece flow technology. In an positions, set-point temperatures and of 20 high precision mechanical parts assembly application the carrier was successive process steps, as laser used in wafer alignment within litho- used to deposit glue radially on metal micromachining, cleaning, solder depo- graphic machines (Figure 2). Another shafts in a two-dimensional arrange- sition, soldering and quality inspection, one addresses further miniaturization. ment of 27 pieces without moving the of different workpieces. The carrier can With a two-dimensional clamping tool tip. control measured values, determine system it is possible to fix 36 cylindri- and compare the process quality and cal shafts on minimal surface area For the manufacturing application the communicate the information also to (Figure 4). Although each single position use case high precision diamond turning external equipment. A mile-stone is can be addressed to load or unload was chosen. A cylindrical workpiece reached making Industrie 4.0 compat- the workpiece. On an open frame (diameter 8 mm, height 90 mm) needs to ible real-time data available for produc- workpiece carrier with a dimension of be centered within a tolerance of ± 1 μm. tion control. 190 x 150 mm also a gripper interface In the past the part was centered on a In metrology the technology was used for automation and the complete self- palette of a zero point clamping sys- to realize a permanent shock and ther- sufficient smartWT electronics together tem and fixed to the tool holder in the mal control during transport and long with two temperature, one tri-axial turning machine. A manual beating and term measurement. A shock event can shock and one two-axial levelling sen- inductive sensing operation needs 10 be a signal, that parts are damaged. sors were arranged. minutes per part to achieve a toler-

Figure 4: Miniaturized modular workpiece carrier for automatic handling [Zeiss 3D Automation/Schunk, 2015].

Figure 5: Highly modular carrier system [3] equipped with four units for workpiece rotation in a dispensing application [Fraunhofer IPA, 2015].

28 Contributions to Topical Fields of Innovation

Figure 6: Centering unit in a high precision turning machine: measuring centricity (left), adjustment with actuator modules and turning (right) [Kugler, 2015]. ance better than 10 μm. To increase sität Freiburg IMTEK Lehrstuhl EMP, References productivity this procedure should be Kugler GmbH, Schunk GmbH & Co. KG [1] In cooperation with SmartEnergy WMS GmbH, Freiburg automated. and WITTENSTEIN AG. [2] G.U. Gamm, M. Kostic, M. Sippel, L.M. Here the smartWT was set up as a It is possible to build workpiece carriers Reindl, „Low power sensor node with ad- centering unit with three cylindrical suitable for production using the minia- dressable wake-up on demand capability”; containers on top of each other with a turized electronic units of the sensor and Int. J. Sensor Networks, 11, 1 (2012), pp 48 – 56 total height of only 90 mm (Figure 6). In actor platform. The development of the [3] T. Iseringhausen et al. 2014. „Modu- the base electronic unit the smartWT electronics was completed successfully lar Workpiece Carrier System for Micro miniECU was combined with two motor and the demonstrators operate prop- Production”. In: Ratchev, Svetan (Hrsg.): Precision Assembly Technologies and Sys- controllers and two energy storages. On erly. The industrialization of the project tems. Bd. 435: IFIP Advances in Information top two actor units each with 100 μm results is on the way. Smart sensors, and Communication Technology; Berlin, travel range were mounted. The axes the electronic sensor and actor platform, Heidelberg: Springer, pp 133 – 138, DOI: 10.1007/978-3-662-45586-9_17 move perpendicular to each other and intelligent workpiece carriers and the therefore can center the workpiece. software infrastructure will become com- Now the centricity is measured on the mercially available within the next twelve machine. The correction values were months. transmitted wireless to the smartWT centering unit and corrected auto- Acknowledgements matically in half of the time the operator The research project “smartWT – Intel- needs using the manual procedure. ligent and supporting workpiece carrier Carl ZEISS 3D Automation GmbH system to increase the quality and trace- Dr. Arnd Menschig Conclusion ability in micro production processes Leiter Neue Technologien Eight partner worked together to (16 SV 5971)” was funded by the Feder- Manager Evolving Technologies achieve a common objective – CADwalk al Ministry for Education and Research, Carl-Zeiss-Str. 32 GmbH & Co. KG, Carl Zeiss 3D Germany (BMBF). It was supported D – 73431 Aalen Automation GmbH, digiraster GmbH, by the framework of the leading-edge Phone +49 (0)7361 - 6336 - 227 Fraunhofer Institut für Produktionstech- technology cluster microTEC Südwest, Mail [email protected] nik und Automatisierung (IPA), Univer- as well as the VDI/VDE IT GmbH. Web www.probes.zeiss.com

29 Contributions to Topical Fields of Innovation

Intelligent Service Robotics for Production

The future of the production landscape It is these four trends that mainly influ- increased adaptivity, the use of intelligent is often put on a level with the term ence the technological lines of action service robotics on the shopfloor may Industry 4.0. The ongoing discussion towards a future production landscape. also considerably improve the flexibility about possible upcoming transforma- The digitalization and interconnect- of production infrastructure by reducing tions on the shopfloor is not only driven edness of production facilities are a complexity. by technological innovation but also precondition for customer specific pro- by fundamental changes in customer duction in terms of mass customization, In this context, intelligent service robotics behaviour and future products. Firstly, small lot sizes or one piece flow. has to be regarded from an architectural individual products and personalization On the other side, sustainability has perspective: increasingly penetrate the consumer to be addressed by high efficiency, On the component level, intelligent industry and B2C business, now carried near-to-zero emission, re-use and a microsystems integrate sensors and forward to B2B business. Secondly, continous lean production approach. microcontrollers to provide a real-time shorter product life cycles require a high- Furthermore, social aspects come to image of the lateral working space and

Pictures: Gesture Control (left) and Brain-Machine- Interface in CogniGame (right) at Festo

er implementation rate and the speeding the fore when future working conditions, to handle process data in a decentral- up of innovation processes. Thirdly, the competence development and preser- ized way. In excess to sensor signals like ecological footprint of products is gain- vation, as well as learning and motivation position, acceleration, pressure or force, ing importance. In this context, not only strategies are discussed. more complex and “smart” sensors like the environmental impacts of production It is clear that the depicted changes 3D vision systems or advanced proxim- have to be considered but also the use in the production landscape will fun- ity sensors (e.g. smart skin, systems in of new materials and technologies for damentally change the role of human foil) will make their way to applications. sustainable production. workforce on the shopfloor. The interac- On-board systems may be supported And fourthly, the increasing availability tion of workers and intelligent service by external sensors which can provide and use of social media triggers a fun- robotics will increase considerably to an observer perspective to the scene damental change in customer ‘s behav- deal with low and varying production and get integrated via intelligent commu- iour and expectations on purchase and volumes and to allow quick up-scaling nication interfaces. In doing so, intel- utilization of products. to large numbers at need. In excess of ligent service robotics may handle and

30 Contributions to Topical Fields of Innovation

Dr. Volker Nestle Head of Future Technology, Festo AG & Co. KG

communicate with several decentralized as well as legal guidelines have to be that software will play a crucial role in on–board microsystems as well as with fulfilled. future production, but Microsystems peripheral devices. Matching all neces- The reliability of structural elements, Technology will still provide a major sary information on platform level and components, materials and error free share of physical platforms to run future deriving a specific kinesic behaviour out communication are typical measures to factories and enable new technologies of these information, intelligent service ensure the functional safety of technical like intelligent service robotics on the robotics may also be constituted as systems. The aim is to avoid damage shopfloor. cyber physical systems (CPS). Due to caused by the operation of technical the trailblazing development of process- systems and to prevent physical injury. ing power in microcontrollers, innovative Security can be seen as an important approaches of artificial intelligence are attribute of a safe system and primarily supposed to facilitate a new generation addresses the protection of technical of context-sensitive, intelligent service facilities against manipulation or loss

Pictures: Festo ExoHand (left) and Human-Machine- Interaction on the shopfloor at Festo production plant (right)

robotics. This example shows that of sensible data. Security networks, intelligence is also needed in terms of a authentification, cyber diodes, access distinct and effective human-machine- restrictions, data encryption or security interaction (MMI). While smart and on a chip can be typical measures to Dr. Volker Nestle responsive displays emerge at present, achieve security. It is obvious that safety Head of Future Technology, research and future technologies already and security likewise are one of the ma- Festo AG & Co. KG focus on advanced MMIs like gesture jor sticking points for a commercial use Chairman of the Board, control or brain-machine-interfaces. of intelligent service robotics. Hahn-Schickard Irrespective of the way of interaction Ruiter Str. 82 between human beings and machines, The scenario of the digital (r)evolution in D – 73734 Esslingen safety and security represent a crucial the future production landscape often Phone +49 (0)711 - 347 - 3774 pitfall for a commercial use. Technical conciliates a picture of a totally software Mail [email protected] specifications for engineering standards driven environment. It is beyond dispute Web www.festo.com

31 Contributions to Topical Fields of Innovation

Intelligent Implants in Neural Engineering: from tools in neuroscience to new treatment options in an ageing society

Thomas Stieglitz, IMTEK

Miniaturization, information and commu- trains in neuromodulation to overwrite available for a large variety of questions nication technologies have significantly electrical neural patterns and thereby in preclinical studies. If neural implants contributed to many diagnosis and treat- treat symptoms of diseases and change are transferred into clinical applications ment options in the life sciences. Techni- functions in the body. Neural prostheses in humans, not only functionality has to cal devices have been used in medicine are intelligent implants that shall replace be guaranteed but also strong safety in the context of diagnosis, therapy and sensory functions or motor deficits with aspects have to be considered. Even rehabilitation for centuries but the micro- the help of electrical stimulation of exist- though many application scenarios electronic revolution brought developing nerves. The electrical modulation of have been proposed for neural implants ments to a new level. Since the human internal organs as intervention instead from a research point of view only few body works truly electric for many func- of pharmaceutical treatment is the latest success stories have been written with tions, neural engineering arose as a dis- application field and has been intro- respect to economic success and cipline to investigate the electrical activity duced as “bioelectronics medicine”. market penetration (Stieglitz 2009). From and interactions in nerve cells and neural Over the last decades, implantable an economical aspect, neural implant networks and invented new tools and neural interfaces served as fundamental numbers are often compared with the methods to intervene with the brain and tools in the neurosciences to investigate cardiac pacemaker, which is sold for the peripheral nervous system. Differ- the electrical activity of single cells up than 350,000 times per year. Cochlea ent application areas and developments to networks, correlate behavior to it and implants restore hearing, spinal cord have been summarized in neural engi- identify pathophysiological changes in stimulators treat chronic pain and incon- neering: implants deliver electrical pulse disease models. A toolbox of devices is tinence, deep brain stimulators modulate movement disorders in Parkinson’s disease and vagal nerve stimulators decrease the seizure frequencies in epilepsy. Worldwide, less than a million patients benefit from neural implants in these most prominent applications, even though the costs of brain related diseases in Europe extends the cumula- tive costs of cancer and cardiovascular diseases (DiLuca & Olesen 2014). Academic and corporate research from start-up as well as large companies focused on the development of neural implants to intervene with the brain in the last decades. Different approaches are competing with each other. Laser technology allows the development of electrode arrays with large number of contact sites (Fig. 1) and overcomes Fig. 1: Some neural implants are placed on the surface of the brain, the cortex, to record electrical signals of the limits of integration density of preci- the underlying areas and electrically stimulate the brain. Electrode sites are made out of thin metal foils and sion mechanics approaches. These sandwiched between silicon rubber layers. Cables are used to connect the electrode sites with a control unit that transmits the signals wirelessly to an extracorporal receiver unit. developments have to come with the © Daimler-und-Benz-Stiftung / Oostergard development of hermetic packages with

32 Contributions to Topical Fields of Innovation

personalized closed-loop approach to lower blood pressure with a neural implant (Plachta 2014). Other applications in which the nerve signals from natural sensors of internal organs are recorded and overwritten include diabetes and other typical diseases of an ageing society. Precision mechanics has been well established for decades in implant manufacturing but came to its scaling limitations. Microsystems engineering has been eventually identified by medical companies as enabling technology to bring neural implants to a new level and offer treatment options for larger patient groups. Future will tell the next success stories in the emerging field of neural implants hopefully soon. Fig. 2: Electronic components and circuits are assembled on a ceramic-based substrate that serves as part of a hermetic package to protect them from water and salt ions. Many electrical feedthroughs have to be integrated to interconnect each and every site of the electrode array with the electronic circuitry inside the package. References: © Daimler-und-Benz-Stiftung / Oostergard DiLuca M, Olesen J. The Cost of Brain Diseases: A Burden or a Challenge? Neuron 82: 1205-08 (2014) a large number of electrical feedthroughs Stieglitz T. Neuroprothetik und Neuromodulation (Fig. 2). Implants exchange data with an – Forschungsansätze und klinische Praxis extracorporal control unit and will be also bei Therapie und Rehabilitation. Bundesge- sundheitsblatt – Gesundheitsforschung – powered or recharged via a wireless link. Gesundheitsschutz 53 (3): 783-90 (2010) Microtechnical approaches with inte- Raspopovic, S., M. Capogrosso, F. M. Petrini, grated thin-film electrodes are not yet M. Bonizzato, J. Rigosa, G. D. Pino, J. Carpaneto, M. Controzzi, T. Boretius, E. established for reliability reasons. First Fernandez, G. Granata, C. M. Oddo, L. Citi, interfaces have been recently success- A. L. Ciancio, C. Cipriani, M. C. Carrozza, fully evaluated in a first-in-man study. W. Jensen, E. Guglielmelli, T. Stieglitz, P. M. Rossini, S. Micera. Restoring Natural Sen- Four implants with a total of 56 contact sory Feedback in Real-Time Bidirectional sites have been implanted in the arm Hand Prostheses. Sci. Transl. Med. 6 (22): nerves of one subject nine years after 222ra19 (2014). amputation trauma to reduce phantom Plachta,D.T.T., Gierthmuehlen, M., Cota, O., Espinosa, N., Boeser, F., Herrera, T.C., limb pain and restore natural sensory Stieglitz,T., Zentner, J.: Blood pressure feedback in bidirectional hand prosthe- control with selective vagal nerve stimula- sis control (Raspopovic 2014). tion and minimal side effects. J Neural Eng 11(3): 036011 (2014). While approaches in neural prostheses often suffer from relatively small patient Fig. 3: Thomas Stieglitz is director of the Laboratory for Biomedical Micotechnology in the Department of numbers that prevent investors to invest Prof. Dr.-Ing. Thomas Stieglitz Microsystems Engineering (IMTEK) at the Univer- in these endeavors, neuromodulation Laboratory for Biomedical sity of Freiburg and PI in the cluster of excellence and especially bioelectronics medicine Microtechnology “BrainLinks-BrainTools”. His teaching and research interests include neural interface and implant target large patient groups that are Department of Microsystems Engineering development, biocompatible packaging and assembly currently treated with pharmaceuticals. – IMTEK technologies and bioelectonic medicine. He combines Neural implants are often proposed University of Freiburg expertise in fundamental and translational research. In as last resort treatment but opinions Georges-Koehler-Allee 102 this photograph he demonstrates where package and electrode arrays will be placed in neural implants for change. In the case of hypertension, D – 79110 Freiburg intervention with the brain. Dr. Stieglitz is co-founder a portion of about 30 % of all patients Phone +49 (0)761 - 203 - 7471 of the start-up company CorTec (www.cortec-neuro. is medically refractory and desperately Fax +49 (0)761 - 203 - 7472 com) that commercializes neural interfaces and implants to investigate and treat brain disorders. waiting for new treatment options. First Mail [email protected] © Daimler-und-Benz-Stiftung / Oostergard studies proved the opportunity of a Web www.imtek.de/bmt

33 Contributions to Topical Fields of Innovation

The Aesculap-Miethke SENSOR RESERVOIR®: on the way to becoming a telemetric intracranial pressure (ICP) measurement device

Approval of the first long-term-implantable pressure sensor for a non-invasive and radiation-free hydrocephalus-shunt function diagnosis.

The fundamental importance of ICP That is why there is great interest in a The brain is the only human organ which thorough knowledge of the real “in-situ” is located in a hard and closed shell: the course of the ICP. skull. Thereby it is optimally protected The first ex-situ pressure measure- against shocks and injuries. „Cerebro- ment, a short-term “lumbar (i.e. spine) spinal fluid“ (CSF) is produced in four puncture”, has been performed already compartments inside the brain - the in 1891 with a riser (see fig. 1). How- so-called „ventricles“ - and circulates ever, even with the first availability of along thin channels („foraminae“) to the sterile electro-mechanical sensors in spine and the surrounding „subarach- the 1980th ICP measurement remained noid space“, where it is absorbed again. complicated, error-prone and danger- The CSF circulation system serves as ous. Today it is known, that many differ- a shock absorber, nutrient supply and ent normal and pathologic ICP waves defence against infections. Due to the with different amplitudes and frequen- inflexibility of the skull, the pressure bal- cies superimpose with each other and ance is very susceptible to disturbance. form a complex pattern. Nevertheless, Space-demanding processes like the many questions remain unanswered growth of cysts or tumours, internal because of the lack of truly long-term bleedings, overproduction or reduced pressure measurements inside the absorption of CSF, blockages of the flow closed skull. channels, a reduced brain elasticity or also an abnormal high CO2 concentra- Hydrocephalus Fig.2 tion in the blood can create a danger- The clinical picture of CSF accu- ous overpressure. This abnormal high mulation with too high ICP is called not easily be diagnosed (e.g. with x-ray intracranial pressure (ICP) can cause an “Hydrocephalus”. Since the 1950th it image), but only be derived with high irreversible destruction of brain tissue, is successfully treated mainly by the uncertainty from clinical anomalies and and lead to death if remains untreated. implantation of a permanent drainage patient’s behaviour. A reliable shunt- system, a so-called “hydrocephalus function-control is of utmost importance shunt”. The overpressure is reduced to avoid unnecessary burdensome by drainage of the excess CSF through shunt-revisions. a catheter implanted under the skin An appropriate way of a shunt-function- mainly into the abdominal cavity. An diagnosis is a pressure measurement integrated differential pressure valve within the shunt system. By manoeu- regulates the amount of CSF drained vres with the patient (lying, getting up, with the aim to control the ICP within pressing, coughing, sneezing, com- the physiological range (see fig 2). pression of the vena-jugularis etc.) the Particles inside the CSF like clumped state of the shunt can be identified from proteins, tissue cells or blood clots can the pressure readings. If for example lead to an occlusion of the shunt, so the pulse-induced pressure waves are that the shunt must be explanted and not detectable the ventricle catheter Fig.1 exchanged. Such a shunt-failure can- (see fig. 2) is probably occluded.

34 Contributions to Topical Fields of Innovation

Dr. H.J.Crawack all electromagnetic-compatibility- Clinical Science requirements (EMC) and is MRI- Christoph Miethke GmbH & Co. KG compatible up to the common field strength of 3T. 4. The sensor is half-active, i.e. no battery is required. The necessary energy for the ASIC is transferred by the antenna of the reader unit (see fig. 5) through the titanium membrane by a 130 kHz-field and received by an induction-coil. The field is used at the same time for the encapsulated sensor data transmission (by amplitude cell (see fig. 3) and the modulation). The reader unit is hold pressure within the shunt by the physician in a distance of is effectively transmitted 1– 3 cm over the implanted SENSOR by a thin titanium mem- RESERVOIR® to activate the sensor brane (see fig. 4). Beside and to measure the pressure. With its small diameter with the two separate single measurements size of a thumbnail, the the pressure difference in recumbent SENSOR RESERVOIR® and upright position or (if the valve offers eminent further is adjustable) for different differential Fig.3 advantages: pressure set points can be calcu- Telemetric shunt function control 1. Integration in a shunt system. No ad- lated. Alternatively a time-resolved Since decades there have been efforts ditional operative step like a second measurement within several seconds to develop an implantable autonomous burrhole in the skull for another sepa- should show the already mentioned ICP or shunt-pressure sensor, which can rate implant is required. pulse- synchronous pressure waves. be controlled in a non-invasive telemetric 2. The pressure is measured with a By a more detailed evaluation of the way. End of 2014 Aesculap-Miethke high precision of a few mbar relative measurement results, conclusions brought such a device onto the market: to the outer atmospheric pressure. about the approximate location of a the SENSOR RESERVOIR®. 3. The encapsulated titanium sensor possibly present occlusion can be It consists of a capacitive pressure is suitable for ETO sterilization, fulfils drawn. sensor with an integrated control unit 5. In case of an outage of the SENSOR for the measurement and the telemetric RESERVOIR® there is no need to energy/data transmission (ASIC). The explants the device. The sensor SENSOR RESERVOIR® is housed in a electronic is encapsulated in a ro- burrhole reservoir (see fig. 2 & 3). In the bust biocompatible titanium shell and reservoir the drained CSF flows around is approved for a long-term implantation with unlimited duration. The therapeutic function of the shunt is not affected by any sensor drop-out.

Dr. H.J.Crawack Clinical Science Christoph Miethke GmbH & Co. KG Ulanenweg 2 D – 14469 Potsdam Phone +49 (0)331 - 620 83 - 20 Mail Hans-Joachim.Crawack @miethke.com Fig.4 Fig.5 Web www.miethke.com

35 Contributions to Topical Fields of Innovation

Waver Level Packaging and System Integration

M. Juergen Wolf, Oswin Ehrmann, Fraunhofer IZM

WAVER LEVEL PACKAGING context, individual and different wafer extend the integration capabilities to the AND SYSTEM INTEGRATION level packaging and 3D system integra- third dimension (3D). Microelectronic packaging and system tion approaches are adapted to specific The expansion to 3D architectures integration is of main relevance for new application scenarios. poses unique challenges that are not application areas e. g. Cyber Physical encountered in conventional 2D packag- Systems (CPS), Internet of Things (IoT), 3D WAFER LEVEL ing. These include technical challenges Ambient Assisted Living (AAL) as well as ARCHITECTURES e.g. via formation (TxV), wafer thinning information & communication, logistics, 3D-SiPs involve a set of technologies and handling, 3D device stacking (die, security, automotive, health care and including stacked packages, stacked wafer), thermal management, power industrial electronics (Industry 4.0). devices with Through Silicon Vias (3D delivery/management and testing of 3D Heterogeneous integration approaches IC), silicon interposer (2,5D) and embed- structures. 3D integration also requires, following “More than Moore” are of high ding technologies to integrate different beside the development of new techno- importance to address the needs of devices e.g. ASICs, memories, pas- logical approaches and the application time to market and cost targets for future sive devices, transceivers, sensors and of new materials, the consideration of products. MEMS into one package. reliability and design aspects. Vertical interconnects through devices or System in Packages (SiPs) are driving through packages e.g. Through Silicon THROUGH SILICON today‘s packaging and heterogeneous Vias (TSVs), Through Glass Vias (TGVs), VIA (TSV) TECHNOLOGY system integration technologies. New Through Package Vias (TPVs), Through The Through Silicon Via (TSV) technol- technologies are emerging which spe- Mold Vias (TMVs) are key elements for ogy is a key element of 3D integra- cifically meet the requirements of the the three dimensional device or package tion where electrical interconnects are new product generations in a wireless architecture. During the last years, also formed from front side to the back side connected world regarding e.g. min- the embedded wafer level ball grid array of active or passive silicon devices on iaturization, high speed wireless data (eWLB) package has been introduced. wafer level. The TSV approach provides transmission, power delivery & manage- The integration of vertical interconnects shortest vertical interconnects between ment or multi-device integration. In this in the package and double-sided RDL devices or functional layers. There are

Figure 1: Fine pitch Interconnects: Indium Micro bumps (6 µm diameter, 10 µm pitch)

Figure 2: Silicon Interposer with Cu TSVs (10 µm/ASR >10)

36 Contributions to Topical Fields of Innovation

Figure 3: 3D multiple TSV device stack (10x)

Figure 4: Wafer level SiP

different TSV integration schemes such Depending on the second level, intercon- (housing) for sensor applications e.g. as via first, via last, via middle, or back- nects for 3D systems or interposer are MEMS. Beside silicon interposer, also side TSV. Cu-TSVs provide excellent performed by larger bumps e.g. solder glass interposers with Through Glass electrical properties and are realized by balls with typical feature sizes like micro- Vias (TGV) are emerging substrates for using electro-deposition of copper with BGAs. For high density I/Os, also Cu- specific applications e.g. RF modules an appropriate seed layer deposition Pillar micro-bumps with or without solder and sensor. process. This allows the realization of cap with diameters of approx. 20 µm and different TSVs in silicon substrates and pitches of approx. 50 µm are used. OUTLOOK active devices with different integration Future Internet of Things (IoT) applica- schemes and different sizes. SILICON INTERPOSER tions are driving the development of cost Today, the TSV via middle approach is FOR 3D ARCHITECTURES efficient, multifunctional, miniaturized most commonly used for Cu-TSV inte- Silicon interposers (2,5D) with TSVs system in packages (SiP). The use of gration in active circuits. Depending on are an important element for combining the 3rd dimension in package architec- the business model and supply chain, different circuit devices into one minia- tures is an indispensable prerequisite also other approaches e.g. via last TSV turized SiP with high functionality and to to achieve better form factors and to from backside are becoming important. overcome current technical and financial increase performance at the same time. Recent R&D especially focused on issues regarding TSV integration into Different 3D integration approaches are achieving a high TSV yield at reasonable active circuit devices. In this way, 3D used whereat 3D wafer level SiPs are processing cost. Beside optimization SiPs can be realized at reasonable costs very attractive since they can use exist- of process materials, also the TSV size with a short time to market. 3D WL-SiPs ing manufacturing lines. has a great impact on process time using TSVs and interposers are very Fraunhofer IZMs research activities es- and cost. For interposers, the full filled product specific and require an overall pecially focus on technologies for wafer TSV has an aspect ratio of > 10 (10 µm understanding of design, technology level system integration and packaging diameter, 110-120 µm depth). With via- and reliability. (6”-12”) and offer a broad spectrum of middle integration, the TSV size tends Concerning technical features, inter- R&D services including customer-spe- to be less than 5 µm diameter and less posers can handle multiple functions cific SiP development, prototyping and than 50 µm depth. e.g. fan-out routing and providing pilot manufacturing at their two locations high-dense, high-speed interconnects in Berlin and at ASSID in Dresden. INTERCONNECT STRUCTURES – between circuits for digital applications. MICROBUMPS Future high-speed applications will also M. Juergen Wolf, Oswin Ehrmann Today, mostly flip chip with solder address, besides electrical intercon- Fraunhofer IZM bumps are performed for 3D stack nects, integrated optical waveguides. Gustav-Meyer-Allee 25 formation. New interconnection tech- New interposer architectures are also D – 13355 Berlin nologies, e. g. micro-solder bumps dealing with integrated micro-fluidic Ringstr. 12 (SnAg) and Cu-Pillars, are used for the channels to address cooling for per- D – 01468 Moritzburg assembly and 3D stack formation of formance applications and integrated Phone +49 (0)30 - 46403 - 124 the devices to deal especially with the active and passive device functions. +49 (0)351 - 795572 - 0 surface topography of the devices and And, last but not least, interposers are Mail [email protected] the warpage of the board/substrate. also acting as a complete package Web www.izm.fraunhofer.de

37 A Joint Event of:

Organization: The German Congress on Microsystems Technology 2015 The German Congress on Microsystems Technology 2015

MEMS: Trends and Challenges of Connected Sensor Systems

Kilian Bilger, Corporate Research and Advance Engineering, Microsystems and Nanotechnologies, Robert Bosch GmbH, Renningen.

With nearly seven billion MEMS sensors sors, reflecting the high potential in this Another trend is the integration of MEMS shipped since 1995, Bosch is one of market. The market is far more dynamic sensors into sensor clusters, so called the pioneers in microsystems technolo- and faster, in comparison to automo- “system-in-package” solutions. This gies and the leading supplier of MEMS tive – with speed and time-to-market allows for the creation of new complex sensors. Mass production and indus- being crucial success factors. Bosch functionalities, such as 9 degree of trialization of this technology was first successfully entered this market with the freedom (DOF) modules to measure driven by automotive applications such founding of Bosch Sensortec in 2005. “absolute orientation”, or an environ- as airbag-systems, and ESP (Electronic Meanwhile 3 out of 4 smartphones are mental sensor cluster measuring gases, Stability Program), as well as engine equipped with sensors from Bosch temperature, pressure, and humidity. In management and exhaust gas control. Sensortec. order to enable easy integration into the A modern car contains more than 50 corresponding ecosystem and to create MEMS sensors in different applica- In the initial phase of MEMS consumer new functions and solutions, software tions. Today’s automotive MEMS sensor applications, the existing sensor tech- and intelligence is directly integrated landscape is still dominated by pressure, nologies from automotive (pressure, onto the sensor module. Moreover, soft- mass flow, angular rate and acceleration acceleration and angular rate) had been ware based solutions with intelligent al- sensors. One upcoming new application adapted to consumer requirements. gorithms and data fusion enable shorter for MEMS in automotive is micro-mirror In order to be “smartphone capable”, time-to-market for new functionalities. An based intelligent head-lamps [1]. MEMS sensors needed to become overview of Bosch Sensortec’s product much cheaper and smaller. Energy portfolio is shown in figure 1. Since the beginning of this century, efficiency became an important fac- MEMS sensors have been penetrating tor. Continuously, additional sensing At a higher level of integration, the port- the consumer market with applications technologies have been developed at folio contains “sensor hubs” and “ap- such as gaming and smartphones. In Bosch for serving the CE market, such plication specific sensor nodes” (ASSN) 2015, roughly 1.4 bn smart phones have as magnetometers, humidity sensors with software and intelligence on board. been shipped worldwide [2], each of and gas sensors for indoor air quality One recent example is the BHI160 them equipped with ~4-5 MEMS sen- measurement trough the smartphone. containing a 3-axis gyro, 3-axis accelerometer, a magnetometer interface and an integrated sensor fusion core, which allows for 100Hz data fusion at less than 1.6 mA power consumption (figure 2). The MEMS core of the BHI160 is the BMI160 Inertial Measurement Unit which represents the world’s first IMU for true always-on applications. The BMI160 integrates a 3-axis accelerometer and a 3-axis gyroscope into a single package with only 2.5 x 3 mm² footprint and features less than 1 mA current consumption in full operation mode.

Sensor hubs and ASSNs are build- Figure1: Sensor portfolio Bosch Sensortec ing the bridge from consumer to IoT.

40 The German Congress on Microsystems Technology 2015

energy earning is limited. However, with a further significant reduction of power consumption, harvesting might be appropriate for certain applications, i.e. thermal generators for industry 4.0.

With Bosch Connected Devices and Solutions (BCDS) founded in 2013, Bosch has combined the IoT sensor and service platform activities into a dedicated business unit. The BCDS sensor platform integrates different sensors, GPS, radio, power management, µ-controller and software. Primary application fields for Bosch (BCDS) Figure 2: BHI160 – IMU + FUSER Core are industry 4.0 & logistics, connected mobility and smart home & building They are key-building blocks for various size and cost of the sensors, as well as (figure 3). IoT-applications in a sense that they the integration of different MEMS-chips can be easily integrated as well into the into sensor clusters, is a strong trend. Furthermore, the success of an IoT- IoT-ecosystem over their built-in soft- One decisive factor for smart connected based solution requires the optimization ware interface. MEMS sensors are an sensor systems is energy efficiency. of a complex and distributed ecosystem important enabler and key-technology With ever increasing numbers of sensors, consisting of devices (sensors and for the IoT, giving “our things a sense”. users will not accept limited energy avail- actuators), communication and network With the increasing number of things ability causing system downtimes and layer, cloud infrastructure, an applica- being connected to the internet, this is maintenance efforts and cost. Use-cases tion-layer and a corresponding business opening up opportunities for various new will require more and more always-on model. solutions and applications in the fields applications. Energy lifetime can be of – for instance – smart home, indus- increased by [1] a further reduction of As market leader in MEMS sensors and try 4.0, logistics, mobility, and health. power consumption and [2] by energy a multi-market system supplier, Bosch is Connected sensor systems will help harvesting. Levers to reduce the power well positioned to shape the future with to enhance our safety and health, to consumption are continuously improving new connected solutions. make our lives more convenient, to save MEMS technology, low-power ASICs and resources, and to make industrial and radio technologies, and intelligent operat- Sources: logistic processes more efficient. ing strategies. Harvesting approaches [1] Frank Schaefer, Bosch, “MEMS Micromir- rors for intelligent Headlamps”. From the sensor technology point of are use-case specific, and for miniatur- [2] IDC worldwide quarterly mobile phone view, the consequent further reduction in ized systems, in general, the amount of tracker, Dec 2, 2015.

Dr. Kilian Bilger Robert Bosch GmbH Corporate Sector Research and Advance Engineering Microsystems and Nanotechnologies (CR/ARY) Robert-Bosch-Campus 1 D – 71272 Renningen Mail [email protected] Web bosch.com Figure 3: IoT sensor and service platform

41 The German Congress on Microsystems Technology 2015

SmartSkin – An Intelligent Skin for Adaptive Bionic Grippers

Stefan Saller, Festo AG & Co. KG Yigˇ it Mahsereci, INES Institut für Nano- und Christine Harendt, Institut für Mikroelektronik Stuttgart Mikroelektronische Systeme, Universität Stuttgart Jan Kostelnik, Würth Elektronik GmbH & Co. KG Joachim N. Burghartz, Institut für Mikroelektronik Stuttgart Alina Schreivogel, Würth Elektronik GmbH & Co. KG

Introduction in a flexible multilayer composite of thin Embedding of ultrathin chips Competitive automation solutions face the polyimide, forming the system-in-foil. The by the ECT-µVia-Process challenge of an advancing individualization. ultra-thin chips are mechanically flex- With novel processes the ultrathin silicon As a part of the automation chain han- ible with a thickness of 20 µm and are chips have been embedded in flex- dling systems play a key role in logistics manufactured using CMOS-technology. ible polyimide circuit boards. Therefore and material flow. Thus a high degree of The integrated circuit packaging technol- ASICs have been positioned face down individualization in terms of positioning ogy of the sensor system is realized by on a foil substrate with dispensed glue and gripping applications in the produc- the ECT-µ-Via – CHIP+ process that will and a drying process. Subsequently the tive environment is needed. The adaptive be enhanced further in this application system is embedded in an acrylic matrix Finray®-finger of the bionic handling as- for developing thin and steady flexible and pressed against a copper foil (Figure sistant combined with an intelligent sensor setups [5]. 3 A – C). The electrical contacts have been system called SmartSkin meets these realized by laser-drilled and electroplated requirements and enables the possibility Due to the piezo-resistive effect, bending microvias (Figure 3 D – E). With the help of an actively controlled gripping process stress changes the transistor proper- of the ECT-Process (CHIP+, Embedded [1,4]. ties. As a result of bending measurable Component Technology) the embed- changes in the output current of the ding concept is demonstrated and first SmartSkin – flexible sensor technology sensing transistors can be detected. The SmartSkin-systems have been realized for adaptive grippers logical functionalities are designed to be successfully. SmartSkin is a customized system for stress independent, furthermore sensing the evaluation of stress and strain on the elements are temperature-compensated Simulations and measurements of SmartSkin surface of the gripper finger (Figure 1). due to the current mirror topology [3]. Depending on the object size and gripping The sensor system consists of four equi- With an attached SmartSkin system the position, the complex structure of the ® distant distributed chips which employ in-plane stress components σx, σy and Finray -finger shows distinctive stress- stress sensitive PMOS- and NMOS- σxy can be measured on the gripper sur- and strain patterns [2]. Purpose of the transistors. The Chips are embedded face during the gripping process. SmartSkin sensor system is to extract

Figure 1: Adaptive gripper with SmartSkin Figure 2: SmartSkin with four ultrathin chips

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the system. SmartSkin enables the possibility of object recognition on adaptive grippers and enhancing the gripping process by ultrathin chips embedded in flexible multilayer circuit boards.

Acknowledgment We gratefully acknowledge the support of our project partners working on the BMBF funded Project KoSiF (Project ID 161ES00015). Particularly we would like to thank the German Federal Ministry of Education and Research (BMBF) for funding and supporting the technologies presented. Figure 3: ECT-Process Figure 4: Application test rig these characteristics from the sensor data the tips or is fully enclosed by the gripper References to draw conclusions about the gripping fingers. [1] M. Giousouf, R. Kaminski, S. Saller, “Halte- vorrichtung zum Festhalten von Gegen- state. For predicting and evaluating the Regarding the simulated PMOS-transistor ständen”, European Pat. EP 2 502 714 A1, stress levels of the transistors, a non-linear signals of chip 2, good qualitative agree- 09/2012. FEM-model of the system has been built. ment between the measured output signal The stress levels in the chips have been and the simulation results can be found [2] C. Harendt, et al., “Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips”, simulated and verified by measurements, (Figure 5). Moreover the object size and Proc. of ESSDERC, Venice, Italy, 2014, pp. considering the 3D-printed gripper finger, the gripping position can be distinguished. 210-213. an adhesive foam tape and SmartSkin. [3] Y. Mahsereci, S. Saller, H. Richter, J. N. The adhesive foam tape serves as a Conclusions Burghartz, “An ultra-thin flexible CMOS compliant interface between the flexible With SmartSkin, the successful com- stress sensor demonstrated on an adap- gripper finger and the flexible multilayer bination of flexible CMOS-technology tive robotic gripper”, Proc. of ISSCC, San Francisco, USA, 2015, pp. 1-3. circuit board preventing stress overload of and novel technologies of integration the chips. (ECT-µVIA) has been demonstrated. The [4] A. Grzesiak, R. Becker, A. Verl, “The Bionic Figure 4 shows an application test rig with distinct stress characteristics during the Handling Assistant: A Success story of Ad- ditive Manufacturing”, Journal of Assembly two Finray®-fingers mounted on a parallel gripping process indicating object size Automation, vol. 31, no. 4, 2011, pp. 329- gripper. Within this setup the output-sig- and gripping position have been verified 333. nals of three functional chips have been both in simulation and measurement of measured whereas [5] J. Kostelnik: Die funktionelle Integration von aktiven und passiven Komponenten object sizes (ØD) in die Leiterplatte im industriellen Umfeld.; and gripping posi- Nürnberg 2010; Tagungsband / SMT Hy- tions H have been brid Packaging. Hrsg.: Herbert Reichl, VDE Verlag GmbH, Berlin/Offenbach varied. Depending on the application stress maxima σmax (ØD) are linked to the Stefan Saller object size whereas Festo AG & Co. KG different stress gra- Abt. CR-FM ∂σ dients ___ indicate Ruiter Straße 82 ∂H the gripping posi- D – 73734 Esslingen tion whether the Phone +49 (0)711 - 347 - 50705 object has been Mail [email protected] clamped between Figure 5: Comparison measurement and simulation (Chip 2) Web www.festo.com

43 The German Congress on Microsystems Technology 2015

Different Force Sensor Approaches for Flexible Shoe Inlays in Acoustic Gait Analysis

Thomas Knieling, Agnieszka Kurylo, Florian Beeck, Vithyasaahar Sethumadhavan, Fraunhofer ISIT

Abstract Acoustic bio-feedback for improving body motion is actually discussed intensively since this kind of feedback is more intuitive than the widely used visual feedback alone, especially for learning new, more healthy motions e.g. after neurologic diseases or sports injuries [1]. Some of the gait parameters like the plantar pressure distribution and its time dependence can be measured by force or pressure sensors below the foot, thus different sen- Fig. 2: Color encoded planter pressure distributions measurements. Left: Flat Standing. Center: Heel standing. Right: Ball standing. Maximum forces are ~ 20 N/cm². sor approaches for their integration into a sensing shoe inlay are discussed. sure plates or by those integrated e.g. in ment ranges (force: 1 – 100 N/ cm², treadmills, or, as described here, by pres- sample rate at least 100 Hz), low energy 1 Introduction sure sensing shoe inlays. consumption and low cost, thus in this Gait analysis is used in sports and project three sensing principles have medical rehabilitation for getting the actual 2 General remarks been tested and evaluated: Commercially status, its development over time and by Gait analysis by the measurement of available resistive foil sensors, commer- installing visual or acoustic feedback an multiple gait parameters with different cially available MEMS capacitive sen- improvement of the gait behavior of a hu- sensing methods has been discussed sors, and ISIT printed piezoelectric and man. Different methods have been used extensively in several studies during the capacitive sensors, shown and described in history for gait inspection, of which the past years [2,3,4]. in more detail in [6]. most important ones are Kinematic meth- From these studies the sensing positions ods, electromyographic (EMG) methods for foot pressure distribution measure- 3 Experimental setup and results and kinetic methods. In this last method ment are fixed on locations which may be As carrier substrates PET foil sheets the plantar pressure distribution is directly denoted as “centers of gravity”. However, (125 µm) have been used. On these measured, mostly by stand-alone pres- since feet from different people are also substrates at first conductive lines and different, the measurement sensor attachment pads have been areas around these centers created by functional inkjet printing and should be somewhat in- sintering of silver nanoparticle ink. The creased. A punctual sensing printing layout depends on the used principle as for capacitive sensors or on the sensing principle, MEMS sensors [5] may re- respectively. quire the usage of more sensors than areas. Integration of 3.1 Resistive foil sensors force sensors into a flexible For a first inlay prototype commercially and wireless shoe inlay require available membrane force foil sensors the fulfilling of some important have been used (Interlink, FSR-400™). specifications like robustness The sensor output emits hysteresis ef- Fig. 1: R-F-Characteristics of the FSR 400TM resistive foil sensor and reliability, low drift and low fects and shows different linear char- with two linear parts. The inlet shows a photo of the foil sensor. hysteresis, suited measure- acteristics for different force ranges,

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connected by a curved transition region, lines and GND pads was then attached, 5 Literature which makes calibration difficult (Fig. 1). yielding a two foil stack with embedded [1] N. Schaffert, K. Mattes, “Acoustic feedback in adaptive rowing”, Proc. 18th Int. Conf. on Moreover different sensors show consid- sensor modules. Auditory Display, Atlanta, GA, USA, 2012 erable variations in their output charac- The space between the two foils as well [2] C. Giacomozzi, Potentialities and Criticalities teristics and also emit lowered repeat- as the whole substrate pair was filled and of Plantar Pressure Measurements in the ability. Since due to keep electronics and encapsulated with PDMS. Measurements Study of Foot Biomechanics: Devices, Methodologies and Applications, ch. 11 in software simpler only one calibration curve with embedded sensors are shown in “Biomechanics in Applications”, book edited for one inlay is used, the accuracy of the Fig. 3. The signal is roughly linear but by Vaclav Klika, ISBN 978-953-307-969-1, force output is lowered by at least 5-10 %. shows some drift and hysteresis. 2011 [3] A. Hadi, A. Razak, A. Zayegh, R. K. Begg and The sensors where mounted onto a flex- Y. Wahab, Foot Plantar Pressure Measure- ible PET substrate where already Ag con- 3.3 Printed sensors ment System: A Review, Sensors 2012, 12, ductive lines had been printed on. Sensor Free form factor, simple fabrication and 9884-9912; doi:10.3390/s120709884 [4] D. Rosenbaum and H.-P. Becker, “Plantar signals where thus led out to a plug integration as well as low price are the pressure distribution measurements. Techni- which was connected to the electronics. most important advantages of PPS. How- cal background and clinical applications”, Afterwards the whole sensor matrix was ever, compared with the other mentioned Foot and Ankle Surgery 1997, 3:1-14 covered with a thin plastic / rubber foil. principles, piezoelectric sensors will only [5] T. Schary; “Capacitive surface-micromachined Pressure Sensors on Fused Silica”, Moreover the whole stack was covered yield direct results after dynamic, and not Dissertation, Universität Bremen, Germany, with textile for providing the user the static, input. 319 pages, 2009 impression of a conventional shoe inlay. [6] T. Knieling et al.:” Verschiedene Kraftsensor- prinzipien für flexible Schuheinlagen in der Some measurements of plantar pressure Thus sensor printing technology was akustischen Ganganalyse“, Proc. Mikros- distributions for different foot settings are further developed and capacitive sen- ystemtechnik Kongress 2015, Karlsruhe, shown in Fig. 2. sors with simple three layer setups and Germany This setup appeared to be robust and arbitrary shapes yielding a parallel plate accurate enough for first field test, e.g. on capacitor structure were manufactured. a treadmill. In Fig. 4 the printing layout for one inlay is shown. Dr.-Ing. Thomas Knieling 3.2 MEMS capacitive sensors Fraunhofer-Institut Micro machined capacitive sensors 4 Conclusion and future work für Siliziumtechnologie (ISIT) designed for absolute pressure mea- It has been shown that various different Head of Business Field surement (Protron™, series 09112012) sensing methods can be integrated into Wearable Electronics have also been integrated into an inlay. flexible substrates for gait analysis applica- Department Module Integration The sensor itself was mounted and wire tions. Each sensing element has its own Fraunhoferstrasse 1 bonded on an interposer PCB. advantages and drawbacks. The next D – 25524 Itzehoe This interposer was then fixed on a per- step will further development of capaci- Phone +49 (0)4821 - 17 - 4605 /1441 forated PET foil, again containing printed tive printed sensor with sufficient shield- Fax +49 (0)4821 - 17 - 4250 lines and signal pads for contacting sen- ing against external electrical fields and Mail [email protected] sors. Another (upper) PET foil with printed humidity. Web www.isit.fraunhofer.de

Fig. 3: Characteristics of capacitive MEMS sensors, embedded into a Fig. 4: Left: Printing layout for capacitive sensing inlays. Upper right: Sensor PET/PDMS inlay. characteristics (area = 2 cm²). Lower right: Sensor construction.

45 The German Congress on Microsystems Technology 2015

Ultra-compact Adaptive High-speed Lenses with Large Aperture and Aspherical Correction

Abstract Fig. 1: Adaptive (varifocal) lenses give the A) Active glass-piezo composite membrane. possibility of changing the focal length B) Elastomer lens. or other properties of an optical system C) Fluid lens. without actually moving any optical elements. This removes the complex and bulky lens translation mechanisms that may be costly and are often subject to wear. It may further reduce the number Fig. 2: Buckling and bending of necessary lenses, making the system actuation modes. lighter and smaller. We present a lens technology that advances the perfor- Working principle mance of adaptive lenses in three ways: The key component of our lenses is an Our lenses are more compact with up active glass-piezo composite mem- to 70% free aperture compared to the brane (fig. 1a) consisting of a sheet of outer diameter, they are several times ultrathin glass (30-70µm thick) that is faster than existing adaptive lenses and sandwiched between two piezo rings also have a variable aspherical lens (~100µm thick). If we apply a `positive’ profile for aberration correction. voltage in the direction of the polarization a soft cylindrical elastomer lens body to both piezo rings, they will contract – as shown in fig. 1b. This system is Background causing the membrane to buckle up or straightforward to fabricate, in particular There are three major types of adaptive down. If we apply opposite or at least in small dimensions, but may suffer lenses: Fluid-membrane lenses, elec- non-equal voltages, one ring may con- from birefringence in the deformed trowetting lenses and acoustic gradi- tract and one expand, giving a bending polymer. It has also a strong mechani- ent index lenses – the latter ones being effect to the edge of the membrane. cal effect from the back pressure of the specialized lenses for high-frequency With these two degrees of freedom elastomer that needs an aspect ratio of pulsed light. Electrowetting lenses use an (fig. 2), we can control both the ampli- at least around 0.5. electric field to control the size of a water- tude and the shape of the membrane The other option (fig. 1c) is to use a based drop in oil and hence the profile of profile, i.e. the aspherical behavior. As fluid. We developed a thin lens cham- the oil-water interface. They are inherently the PZT rings have a similar stiffness to ber with an elastomer ring that acts as only suitable for small apertures (<4mm). the glass, they can be relatively narrow, a hinge and support for the membrane Fluid-membrane lenses consist of a fluid- depending on the glass thickness. and also allows for a vertical motion of filled lens chamber that is covered with a To turn this membrane into a lens, we the membrane to counteract the fluid lens membrane. A pump displaces the need a refractive medium. One pos- displacement. This concept avoids lens fluid into the lens chamber and hence sibility is to glue the membrane onto birefringence as it comprises only a causes the lens membrane to deflect. Fig. 3: While they can have large apertures in the Images of elastomer region of 10mm and a numerical aperture and fluid lens. around 0.05, their speed is limited (around 10ms at 10mm aperture) and the pump makes them bulky, with at best 1/3 clear aperture, similar to electrowetting lenses.

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Prof. Dr.-Ing Dr. Matthias Wapler indicated in fig. 4, where we show the Ulrike Wallrabe quartic (i. e. fourth order fit) parameter α 4 of the lens profile as a function of the refractive power for voltage trajectories that roughly outline the operating region. α 4 = 0 corresponds to a parabolic profile, α 4 > 0 is hyperbolic and α 4 < 0 elliptic. We see clearly that it is possible to achieve different aspherical profiles for a single focal power, with a focal range of ±5.8 dpt for the larger fluid lens (right) homogeneous and isotropic fluid and developed to be used in an MR-com- and ±11 dpt for the small polyurethane the glass surfaces in the lightpath. It is, patible microscope, where we wanted lens (left). The resonance frequencies however, less trivial to fabricate and to to focus without moving parts and had (fig. 5) of the smaller lenses are in the realize in small dimensions. to deal with an electromagnetically harsh kHz range, while the fluid lens has its first environment. We designed the mem- resonance around 500 Hz which can be Realization brane with a 12.5 mm clear aperture suppressed with pre-deflections. We investigated the elastomer concept to support the 8.5 mm aperture of the Comparing the different refractive media with an ultra-compact lens with 6.25 mm microscope and a dark field illumination. and the pure membrane assuming a aperture, using a 30 µm thin glass We chose a polyurethane with shore fictive n = 1.49, we see that the poly- membrane and a narrow piezo ring with hardness A50 for the supporting ring, urethane has a strong creeping behavior 7.9 mm outer diameter (fig. 3). For the which is compatible with the paraffin oil that makes it unsuitable for dynamic op- 3.5 mm thick lens body, we tried a clear that we used as an optical fluid. In this eration, but follows in the static behavior polyurethane with shore hardness A30 case, we did not package the lens, but closely the membrane behavior. The and a PDMS with shore hardness A25. mounted it directly on a PCB for integra- PDMS highly affects the lens profile due These materials have a very different tion into the microscope. to its cross-linked elasticity but has very dynamic and mechanical behavior. The low damping. The fluid lens seems to be polyurethane further has a closer match Results a good compromise, as it combines low in the refractive index to the glass while We characterized the lenses primarily damping and a wide focal and aspheri- the PDMS has lower birefringence. The by measuring the membrane deforma- cal tuning range. outer diameter of the package is 9 mm. tion, ignoring possible birefringence. We can conclude that this type of lens A prototype of the fluid-based lens was The aspherical focusing behavior is actuated by the piezo-glass-piezo sand- wich offers a whole set of new opportunities for adaptive lenses with millisec- ond-scale response times, compact dimensions and aspherical correction.

Acknowledgments This research was financed in part by DFG grant EXC 1086 and by the Baden-Württemberg Stiftung gGmbH Fig. 4: Quartic parameter as a function of the focal power for voltage trajectories outlining the working range of project 'Adopt-Tomo'. the lenses on the 'positive branch’. The discontinuity corresponds to a jump between two (meta-)stable points. Universität Freiburg Institut für Mikrosystemtechnik – IMTEK Arbeitsgruppe Mikroaktorik Georges-Köhler-Allee 102 D – 79110 Freiburg Phone +49 (0)761 - 203 - 7580 Mail [email protected] [email protected] Web www.imtek.de/professuren/ Fig. 5: Resonance spectrum of the elastomer (left) and fluid (right) lenses. mikroaktorik

47 The German Congress on Microsystems Technology 2015

Thin Multi Aperture Microscope with High Resolution

René Berlich, Tobias Hermeyer, Frank Wippermann, Andreas Reimann, Andreas Brückner, Andreas Bräuer Fraunhofer Institut für Angewandte Optik und Feinmechanik

Abstract 1 Introduction field with a high resolution based on a Many applications in the field of point- Microscopes represent a versatile parallelized imaging approach. At the of-care diagnostics call for the basic tool to inspect small structures within same time, the multi-aperture configura- functionality of a microscope but in a modern applications including biomedi- tion facilitates a compact and portable much more compact format (e.g. size cal imaging or machine-vision. However, device with a reduced overall length of of a smartphone), with the possibility for analysing extended probes usually less than 8 mm. The respective optical rapid detection of several square millime- requires long image acquisitions due to system comprises a stack of refrac- ters object field, with high sensitivity but the necessity to scan the entire object tive microlens arrays (MLAs), which are relatively little cost. One potential solution field, which limits the throughput and manufactured by cost-efficient, parallel- is provided by the approach of a parallel increases system size and costs. Here, ized lithography and UV-imprint meth- imaging through multiple lenslet channels we present the optical design as well as ods (Fig. 1). in which each individual channel is minia- the technological implementation of a turized and thus transferring only a small digital microscope, based on a multi-ap- 2 Working principle and optical design part of the object field. erture, microoptical imaging approach. With the development of microelectronic An array of (m x n) of these optical Initially, the utilization of two-dimensional image sensors, the necessity to see channels transmits an object field size that lens arrays was proposed by Ander- through a microscope with the human is (m x n)-times that of the single channel son [1] in order to image documents eye is eliminated – the inspection can be without increasing the system z-height. and displays onto a photographic film. performed digitally on a PC. Without the For the production of the lenslet elements Subsequently, the concept was suc- requirement of a separate imaging track microoptical manufacturing processes are cessfully applied to project lithography for the direct inspection with the eye, a used which enable the achievement of masks [2]. Furthermore, microoptical significantly reduced system size can the necessary tolerances for microscale solutions featuring 1:1 image projection be achieved. In fact, the optical array imaging optics also in larger volume. based on this idea have been demon- module, presented here, can be tailored The feasibility of such an arrangement strated [3, 4]. In contrast to these sys- to specific requirements on the object is demonstrated by an example system tems, the array microscope, presented field size as well as the image sensor by with a numerical aperture of 0.3 and an here, enables to combine this principle adapting the amount of imaging chan- experimentally proven resolution of 1.1 μm with an optical magnification. It allows nels and without the need to increase at a z-height of less than 8 mm. for the acquisition of an extended object the systems z-height.

Fig. 1: Photograph of one microlens array of the system, manufactured by UV-imprinting.

Fig. 2: Schematic design illustrating three optical channels that comprise three microlens surfaces.

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Fig. 3: Measured MTF (squares) at the center (green) and at the edge (blue, ca. 100 µm field position) of the single channel field of view (FOV). For comparison, the simulated MTF curves are plotted using straight lines.

Fig. 4: Acquired images of red blood cells (left) with a diameter of 6-8 µm and two paramecium samples (right).

The resolution of previous systems was respective tolerances for cost-efficient In summary, the concept of the pre- limited to about 6 µm [3,4]. In order to fabrication of these complex optical sented array microscope provides a achieve a targeted object resolution elements. powerful, cost-efficient and compact of 1 µm, a numerical aperture of 0.3 is In order to quantify the optical perfor- optical solution for many bio-medical required for the imaging objective. In mance of the system, the modulation applications, e. g. the diagnosis of viral addition, the pixel pitch of current image transfer function (MTF) is measured infections. sensors is in the order of a few microm- according to ISO 12233. The obtained eter and thus larger than the targeted results are plotted in Fig. 3 and show a 5 Literature resolution. Accordingly, resolving these nearly diffraction limited performance. [1] Anderson, R.H.: Close-up imaging of documents and displays with lens array. Applied features with the image sensor requires A resolution limit of 910 lp/mm was mea- Optics, Vol. 18 (1979), pp. 477-484 utilizing an optical magnification. sured in the center of the lenslet’s field of [2] Völkel, R.; Herzig, H.P.; Nussbaum, P.; Dän- As shown in Fig. 2, the final design view (FOV), considering a minimum MTF dliker, R.: Microlens array imaging system comprises three microlenses within requirement of 10 %. The corresponding for photolithography. Optical Engineering, Vol. 35 (1996), pp. 3323-3330 each optical channel. It provides a close minimum feature size of 1.1 µm agrees [3] Brückner, A.; Duparré, J.; Wippermann, F.; to diffraction limited performance for a with the simulated results as well as the Leitel, R.; Dannberg, P.; Bräuer, A.: Ultra- small spectral bandwidth around 580 nm theoretical limit provided by the system’s compact close-up microoptical imaging system. Proc. SPIE, Vol. 7786 (2010), pp. and features an optical magnification of numerical aperture. The field of view of 77860A 10 and a numerical aperture of 0.3. Due each lenslet channel is 200 x 200 µm² [4] Berlich, R.; Brückner, A.; Leitel, R.; to the optical magnification, the image and the depth of focus is approximately Oberdörster, A.; Wippermann, F.; Bräuer, A.: “Multi-aperture microoptical system that is generated by an individual lenslet 5 µm. The acquired exemplary images, for close-up imaging”, Proc. SPIE 9192, channel is larger than the corresponding presented in Fig. 4, demonstrate that Current Developments in Lens Design and subarea of the object. Accordingly, it is the system performance is sufficient in Optical Engineering XV, 91920E (Septem- not possible to acquire the entire object order to resolve micro-biological struc- ber 25, 2014) field of interest by a single shot, even tures such as the paramecium and its in case of 100 % fill factor at the image inner parts, as well as blood cells. sensor. The system thus requires the acquisition of multiple, laterally shifted 4 Future work images, which can be combined subse- The limited spectral bandwidth of the quently using post processing software. current system is already sufficient for many applications, e. g. fluorescence M Sc. René Berlich 3 Experimental results microscopy. However, the optical design Fraunhofer Institut für Angewandte Optik The microoptical components (see can be optimized further by incorpo- und Feinmechanik Fig. 1) are manufactured by imprinting rating multiple polymers (achromatic Abt. Mikrooptische Systeme a single lens master into a UV-polymer design) in order to be able to image the Albert-Einstein-Str. 7 on top of a glass substrate (step & entire visual spectrum. In addition, an D – 07745 Jena repeat process). This master is created increased numerical aperture of 0.5 can Phone +49 (0)3641 - 807 - 381 using ultra-precision diamond turning. be achieved by utilizing six microlens Fax +49 (0)3641 - 807 - 603 The analysis of the obtained microlens elements within each lenslet channel, Mail [email protected] surface profile confirmed the suitability of which enables an enhanced optical Web www.microoptics.org the applied technology chain and their resolution of 700 nm. www.facetvision.de

49 The German Congress on Microsystems Technology 2015

Automated Microfluidic System with Optical Setup for the Investigation of Peptide-Antibody Interactions in an Array Format

L.K. Weber 1* , A. Fischer 1* , T. Schorb 1, M. Soehindrijo 1, T.C. Förtsch 1, C. von Bojničić-Kninski 1, D. Althuon 1, F.F. Loeffler1, F. Breitling1, J. Hubbuch ², A. Nesterov-Müller1 1 Institute of Microstructure Technology, Karlsruhe Institute of Technology, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen ² Biomolecular Separation Engineering, Karlsruhe Institute of Technology, Engler-Bunte-Ring 1, 76131 Karlsruhe * these authors contributed equally

Abstract information whether an antibody binds Peptide arrays enable high throughput specifically to a peptide, it is of interest screening of antibody-protein interac- to characterize the peptide-antibody tions. Thousands of peptides can be interaction. Therefore, we developed a screened simultaneously with a mini- microfluidic system for the automated in- mum of sample volume. Besides the cubation of peptide arrays with biological samples and for the optical characterisation of antibody-peptide interactions in Figure 2: MicCell system by GeSiM. the array format. Therefore, our experimental setup allows Introduction incubating 120 different peptides with The study of protein binding is the basis different biological samples (e.g. sera or of fundamental research regarding can- cell culture supernatant), while binding cer related signaling cascades as well events are detected by time resolved as for diagnostics regarding detection of fluorescence imaging. disease-related antibodies [1]. For the interrogation of protein binding events, Microfluidic system peptide arrays are a well-established All incubation steps are automatically method [2]. They enable multiplexed performed in a microfluidic system. high-throughput assays and require A continuous, laminar flow allows the minimal sample volume. At the Institute contact and interaction of the sample of Microstructure Technology at KIT antibodies with the peptides, which are high-density peptide arrays and their ap- immobilized in array format. plications are developed and optimized The core part of the experimental setup [3, 4]. Peptide arrays can be used to is a microfluidic channel of the MicCell search for linear epitopes in the immune system by GeSiM (see fig. 2). The walls response to diseases or vaccines: dis- and the top of the channel are molded playing the whole amino acid sequence into Polydimethylsiloxane (PDMS). The of a toxoid as overlapping peptides, the actual channel is formed when the toxoid specific antibodies in a patient peptide array is attached to the PDMS. Figure 1: serum can be analyzed and character- A cover plate contains threads to con- a) The amino acid sequence of a protein is cut in ized [5] (see fig. 1 a-c). nect the tubing. By screwing the cover silico into peptides with overlapping sequences. b) These sequences are synthesized onto a peptide We were especially interested to set plate onto the frame, a defined pressure array. c) The peptide array is incubated with fluores- up a system that – in addition to mere is applied to the PDMS and the peptide cently labelled antibodies. d) The fluorescence signal antibody binding – would also deliver array to seal the microfluidic channel. is detected with a camera over time for different antibody concentrations. Example protein structure kinetic data in an array format, and for There are two parallel channel molded from [6], modeled with PyMOL many different antibody-peptide pairs. into the PDMS, each 150 µm in height

50 The German Congress on Microsystems Technology 2015

and 3.5 mm in width. A continuous flow The peptides are functionalized with a is realized by an automated peristaltic C-terminal cysteine which contains a pump (Reglo ICC, Ismatec). All process thiol in the side chain that binds to the relevant buffers are connected to the maleimide. After the completion of the system via a motorized valve. spotting procedure, unreacted ma- leimides on the surface are blocked by Optical Setup washing the surface with mercaptoetha- For the detection of binding events, we nol. Unbound peptides from the spotting chose fluorescence, due to the high process are removed by a washing step sensitivity. with 0.1% trifluoroacetic acid in aceto- Fluorescence on the peptide array is nitrile. excited by a high-power LED at 530 nm. A filter set (F41-007 HQ-Set, AHF Experiments Analysetechnik) separates excitation and All buffers used for washing, blocking emission. The signal is detected with a and incubation are degassed and filtered CCD-Camera (ProgRes C5, Jenoptik) sterile. In the first step the microfluidic (see fig. 3). Exposure times of up to 10 channel is filled with phosphate buffered Figure 4: Fluorescence intensity detected over time for anti-FLAG antibodies labelled with Cy3 incubated seconds are possible. saline with 0.05 % Tween20 (PBS-T, in different concentrations on peptides: ■ 30 nM, The fluorescence signal increases over Sigma Aldrich) and the array is preswol- ♦ 50 nM, • 70 nM, ▲90 nM. Fitting according -k obs t time as more antibodies bind to the len for 10 minutes under flow with a to [7]. I = I max (1 – e ) with I max representing the peptides. volume flow rate of 600 µl/min. Next, the fluorescence intensity at equilibrium and k obs = k ac + k d. k a and k d are the respective system is blocked with Rockland buffer association and dissociation rate constants. Peptide arrays and antibodies (Biotrend) for 30 minutes to prevent any To establish the system, a monoclonal unspecific binding of antibodies in the In the future, we plan to investigate dif- Anti-FLAG M1 antibody (Sigma-Aldrich) system. The incubation of the array with ferent peptide-antibody combinations binding to the FLAG peptide (amino antibodies is realized at a flow velocity of with our system and establish reference acid sequence DYKDDDDK) is used. 16.4 mm/s, resulting in a Reynolds num- measurements for validation. Potentially, The antibody is fluorescently labelled ber of 2.1 for the microfluidic channel. our system will allow for obtaining dis- with a Lightning-Link™ Rapid conjuga- Every minute, the CCD camera takes sociation rate constants for 120 different tion kit (Innova Biosciences) with the an image with an exposure time of 8 peptide spots simultaneously. fluorophore Dylight550 according to the seconds and a digital gain of 8. Bias instructions. Peptides were ordered from and flat field correction is performed with Literature Peps4LS and spotted with a Spotting ImageJ. The intensity of the signal is cal- [1] Molecular bioSystems, 5(3): 224–234, 2009 Roboter (MicroGrid II, Genomic Solu- culated as the average grey scale value [2] Chemical Society reviews, 40(5): ‘ tions) onto 3D-maleimide functionalized of all pixels of one peptide spot. 2131–2145, 2011 surfaces (PolyAn). Finally, the intensity of designated [3] Advanced Materials, 26(22): background control areas is subtracted 3730-3734, 2014 [4] Science, 318(5858): 1888-1888, 2007 from the intensity of the peptide [5] Biointerphases, 7(1-4): 47, 2012 spots. For the calculation of [6] Biochemistry, 44(20), 7450-7457, 2005 the equilibrium dissociation [7] Analytical biochemistry, 236(2): 275-283, 1996 rate constant K D, a pseudo- first-order model according to O’Shannassay and Winzor [7] is used.

Results and Outlook Karlsruhe Institute of Technology With the above described sys- PD Dr. Alexander Nesterov-Müller tem, we detected kinetic pro- Institute of Microstructure Technology files of a monoclonal antibody Hermann-von-Helmholtz-Platz 1 (see fig. 4). D – 76344 Eggenstein-Leopoldshafen We calculated an equilibrium Phone +49 (0)721 - 608-29253 dissociation rate constant Mail [email protected] -8 Figure 3: Schematic of experimental setup. K D of 6.1 · 10 M. Web www. kit.edu

51 The German Congress on Microsystems Technology 2015

Ultra-thin Silicon Chips and Printed Circuit Boards for Applications in Flexible Electronic Systems

E. Schuster1, E. Lorenz2, K. Berschauer2, T. Gneiting3, C. Harendt1, J. Kostelnik4, A. Kugler2, J. Wolf4, J.N. Burghartz1

1 Institut für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart 2 Robert Bosch GmbH, Renningen 3 AdMOS GmbH, Frickenhausen 4 Würth Elektronik GmbH & Co. KG, Rot am See

There is a growing demand for mechani- tem even with the existing concepts. Both cess the CMOS wafers are first notched cally flexible electronic systems intended the patented ChipFilm™ technology and and then grinded down do the final thick- for various advanced applications. There- wafer back grinding enable the fabrication ness while being attached to a framed fore, hybrid systems with ultra-thin flex- of chips with thickness below 20 µm and carrier foil. During the grinding process ible silicon chips embedded in polymer 50 µm, respectively. Novel handling and the chips are separated but still held in substrates (System-in-Foil) are getting assembly processes are used to mount place by the carrier foil. more and more attention. These systems these IC chips onto semi-manufactured require thin chips which maintain their substrates and to produce Systems-in- 3. Assembly interconnection proper functionality even in bent state. It Foils. and embedding with the should also be possible to reliably handle ThinECT-µVia technology and assemble them on or inside foil car- 2. Ultra-thin chips During the so called ThinECT (Embed- riers with available process technologies. As a part of the System-in-Foil, ultra-thin ded Component Technology)-µVia A consortium of three companies and one silicon dies are fabricated either through process the pads of the ultra-thin chip research institute has been closely coop- ChipFilm™ technology [1] or by a wafer are interconnected by copper vias [3]. erating to tackle these problems within back-grinding process, the so called This process starts with a single-sided the framework of a leading-edge cluster Dicing-Before-Grinding (DBG) [2]. During copper-clad liquid crystal polymer on called “MicroTEC Südwest” in Germany. the ChipFilm™ process buried cavities which the ultra-thin die is assembled face and anchor structures are defined on the down by a thermal compressive process. 1. Introduction silicon wafer before the CMOS integra- To realize a double-layer flexible substrate, The development of technologies for the tion process. After the CMOS process a second single-sided copper-clad liquid fabrication of thin and flexible substrates the chips are separated by trenching and crystal polymer substrate which melts at offers the opportunity for new applications then detached from the wafer by means lower temperature is thermally pressed and innovative solutions for the entire sys- of a pick & place tool. In the DBG pro- onto the chip assembled substrate. The

Fig. 1: Ultra-thin chips embedded in liquid crystal polymer Fig. 2: Measured resistance of a daisy chain test device versus bending cycles

52 The German Congress on Microsystems Technology 2015

Prof. Dr.-Ing. Joachim Burghartz IMS CHIPS

pads are opened in a laser via drilling step microvia connections were very stable (Fig. 3) were presented. Accompanied and are connected through a copper and reliable. For the previously described by simulation, the electrical and me- plating process. As the last step, copper bending setup, 50000 bending cycles chanical characteristics of the flexible layers on both sides are structured by us- could be achieved without any failure. The System-in-Foil were evaluated. It could be ing a photolithography step (Fig. 1). plot of the measured resistance values of demonstrated that such Systems-in-Foil a complete daisy chain is shown in Fig. 2. can sustain bending stress up to 50000 4. Electrical characterization of the During the entire sequence, the change in cycles. ThinECT-µVia build-up resistance was below ±1.5% of the initial Characterization of the flexible circuit value, which is negligibly small. Acknowledgements takes place in a special bending ma- This work was financially supported by chine. This fully automated tool allows for 5. Mechanical Simulation the BMBF Germany within the research in-situ electrical measurement of the foil of the ThinECT-µVia build-up project “ULTIMUM (Fkz 16SV5136)”. Also, during bending both in bent and unbent Based on the ThinECT-µVia process, the management team of the leading- conditions. Different pre-set bending radii different aspects have been examined edge research cluster “MicroTEC Süd- [4] can be used to qualify the bending through simulations. The data indicate west” as well as VDI/VDE IT GmbH are behavior of the device under test. The high stress areas in the foil system close acknowledged for administrative support. measurement results presented in this to the connection of thick copper vias. paper are achieved from embedded daisy These results are confirmed by measure- References chain chips which have been bent to a ments. [1] M. Zimmermann et al.: A Seamless Ultra-Thin Chip Fabrication and Assembly radius of 10 mm. Process, IEDM, 2006, pp. 1010-1012 Conclusions [2] M. Nakamura: Method of manufactur- To further analyse the daisy chain test Two different technologies to integrate ing device. Patent: US20080220591 A1, device, resistance measurements have ultra-thin chips into flexible substrates 27.02.2008 [3] J. Wolf et. al.: „Flexible Schaltungsträger mit been carried out. eingebetteten, flexiblen ICs, EBL, 2012 Additionally lock- [4] E. Lorenz et. al.: “Reliability Characteriza- in-thermography tion of Blind-hole Vias for a System-in-Foil,” ESTC, 2014, Helsinki, ed. IEEE, 1–6. before and after Piscataway, NJ: IEEE the bending cycles has been made to locate the failures or the vias with increased resistance in case that Prof. Dr.-Ing. Joachim Burghartz no electrical open IMS CHIPS occurs. Allmandring 30 a For samples that D – 70569 Stuttgart did not exhibit any Phone +49 (0)711 - 21855 - 200 initial damages, it Mail [email protected] was found that the Fig. 3: ULTIMUM demonstrator, Chip embedded in liquid crystal polymer Web www.ims-chips.de

53 The German Congress on Microsystems Technology 2015

Sensor Capsule for Medical in Vivo Biosensors

A. Stett, R. P. von Metzen, G. Link, NMI Naturwissenschaftliches und Medizinisches Institut, Reutlingen; K. Schneider, A. Pojtinger, 2E mechatronic GmbH & Co. KG, Kirchheim; D. Mintenbeck, D. Rossbach, Hahn-Schickard, Villingen-Schwenningen; H. Richter, M. Nawito, Institut für Mikroelektronik Stuttgart; C. Jeschke, Multi Channel Systems MCS GmbH, Reutlingen; O. Bludau, N. Haas, T. Göttsche, OSYPKA AG, Rheinfelden; T. Lebold, M. Kokelmann, Retina Implant AG, Reutlingen.

Microimplants for diagnosis and therapy with external devices for energy and data System architecture Electrically active medical implants are transmission. The SMART IMPLANT con- The implant system consists of a sensor used for the diagnosis, monitoring and sortium in the Spitzencluster microTEC capsule and an external control and treatment of numerous diseases. The Südwest developed a highly-integrated reading unit. ASICs (application specific best known are pacemakers, cochlear system for in vivo biosensor applications. integrated circuit) and a microcontroller implants and deep brain stimulators for It contains amperometric, potentiometric enable the readout of sensors and inductive energy and bi-directional data transfer Fig. 1: between the implant and an external unit Block diagram of via an inductive interface. The link enables the SMART implant system with a wire- data rates of 50 kbit/s for parametriza- less link between tion of the implant, uplink transmission of an external reader the sensor measurement data and the unit and the im- realization of a closed loop power control. planted electronic circuit with ASICs The electronic components (2 ASICs, and sensorchip. microcontroller, SMD components) and a separately produced sensor chip are assembled on a 3-dimensionally shaped MID (molded interconnect device) board. The board and a battery are housed for mechanical protection in a two-part, rigid the treatment of Parkinson’s disease. and impedance sensors for measurement capsule made of PEEK (polyetheretherk- Currently there are numerous dysfunc- of the oxygen concentration, the pH value etone). PEEK is suitable as a chemically tions of internal organs in the focus of and the impedance in the immediate resistant construction material. However, new therapy approaches. environment of the implant. The electronic PEEK alone is not a sufficient barrier to State-of-the-art active implants for long- circuits are designed for maximum energy water vapor and thus against moisture. To term use basically consist of a solid metal efficiency to allow, together with the high protect the MID board with the electronic housing protecting the electronics and integration density, as small as possible parts against ingress of moisture, it is the energy storage. For applications, and wireless active implants. coated before being integrated into the where only a small volume is available for Implantable biosensors allow the continu- capsule with Parylene C. The recharge- embedding of the implant into the body, ous detection of biomarkers that can able battery allows autonomous operation and where large batteries and cabling are be used for diagnosis and monitoring of of the implant. not applicable, miniaturized and compact neurological, cardiovascular and metabol- system architectures are required. The ic diseases, to monitor drug effects and Sensor Readout devices must contain means for on-board vitality of tissue and organs in intensive Depending on the parametrization the data management and a wireless link care after transplantation. microcontroller periodically wakes up

54 The German Congress on Microsystems Technology 2015

Fig. 3: MID board assembly of the SMART implant system.

the custom-made sensor readout ASIC Sensors Conclusion which amplifies and digitizes the signals The microelectrodes for electrochemical Miniaturization of active implants com- from the sensors and sends them back to monitoring are fabricated on a glass sub- prising high functionality and wireless the microcontroller, where they are stored strate by Ti/Pt sputtering and subsequent links to external devices can be obtained in its internal memory. The connection structuring of the connecting lanes and by designing energy efficient electronic to the microcontroller is established by overlaying insulating layers (SiO2, SU-8) circuits and ASICs and their integration in a Serial Peripheral Interface (SPI) Bus. by means of photolithography and dry compact substrates and housings. Those Biasing of the sensors is done by a digital etching processes. Each micro sensor ar- miniaturized implants will open up a whole to analogue converter (DAC) set by the ray comprises the setup for two O2-, two new spectrum of health care applications, microcontroller. The measurement circuits pH-value- and one impedance measure- facilitating more specific diagnosis, more contain a charge integrator for current ment. An amperometric sensor realized in effective therapies and aids used on a measurements and a high impedance a three electrode configuration with work- daily basis by patients suffering e.g. from amplifier for voltage measurement. All ing, counter and reference electrode, is neurological or metabolic disorders. components are designed for low power employed to measure oxygen concentra- operation, but still achieving an overall tion. A pH sensitive potentiometric sensor Acknowledgement measurement rate of 1 kHz. The sensor in a two electrode configuration compris- SMART IMPLANT was a project of the readout ASIC is produced at IMS using ing a working and reference electrode is SSI platform in the Cluster microTEC the in-house Gate Forest architecture with fabricated by electroplating iridium dioxide Südwest, funded by the German Fed- 0.5μm CMOS processes. In the frame- and subsequent coating with a cation- eral Ministry of Education and Research work of this project 250 µm thick chips selective polymer membrane (Nafion®). (BMBF), grants no. 16SV5979K, have been accommodated in a QFN48 Amperometric and potentiometric sensors 16SV5980, 16SV5982-86. (7x7mm) package. share a common on-chip reference electrode. This is realized as a quasi-reference electrode and fabri- NMI Naturwisssenschaftliches cated by electroplating und Medizinisches Institut of Ag/AgCl. Imped- an der Universität Tübingen ance measurements Dr. Alfred Stett as a parameter for Deputy Managing Director tissue characterization Markwiesenstraße 55 are realized in a four D – 72770 Reutlingen electrode configura- Phone +49 (0)7121 - 51530 - 70 tion with separated Fax +49 (0)7121 - 51530 - 16 potential-pick up and Mobile +49 (0)151 - 12 28 82 12 Fig. 2: Implantable capsule for electrochemical biosensor applications. The current-carrying elec- Mail [email protected] sensors are located in the opening on the upper side of the PEEK housing. trodes. Web www.nmi.de

55 The German Congress on Microsystems Technology 2015

Micromechanical Binary Counter for Threshold Event Detection

M. Mehner, S. Leopold, S. Schwebke, M. Hoffmann, Technische Universität Ilmenau

Introduction Design (H) and the low or (L) state. The position For complex technical systems, the Adapting the idea of an electronic shift of all bits represents the current counter time periods between maintenance is register, a micromechanical counter value as a binary code. often based on empirical data and not mechanism is designed. In figure 2 on measured information. Condition the system architecture and essential The switching energy acts always monitoring can be helpful to support system components are presented. The similarly on the entrance that forces the maintenance and thus help to reduce switching energy at the entrance causes first bit to switch. In the low state the costs and to use resources efficiently. a movement of the mechanical coupled bit position is fixed by the ratchets that For many applications, a summarized system components so that serial ar- secure the bit against the spring force information of critical off-limit condi- ranged bits are switched between two of its guiding springs. In the high state tions after a preceding time of opera- stable positions – referred to as the high the bit guiding springs are relaxed or tion is sufficient to indicate the need of unstrained. maintenance or the remaining life span. To achieve a binary counting, several If sparse events that occur incidentally switching rules have to be ensured: during long time spans of operation If a bit n changes its state from low (L) to (years) have to be detected and need high (H), the next bit (n+1) state has to to be stored over arbitrary long time be unaffected by that movement which periods, non-electrical storage con- is implemented by a force rectifier. It is cepts are advantageous. Examples are only capable of force forwarding to other known from acceleration sensors [1, 2] system components in one x-direction. or from specialized applications such The change of a bit n from high to low as measuring an integrated temper- has in contrast to this to cause the same ature-time load [3]. These systems switching for all serially following bits Figure 1: are designed to detect a single or a Autonomous microsystem containing a microme- (n + m) with the same state high. This is few threshold events. Here, a micro- chanical binary counter mechanism realized utilizing two center arms that en- mechanical binary counter design is presented that enables detection and storing a large number of off-limit conditions as a binary code in a mechanical way. An event to be detected is a physical parameter such as temperature, pressure, acceleration, etc., which is larger than a critical threshold and thus shall be counted. The counter mechanism shall be part of an autonomous sensor system that is shown in figure 1. Binary counting implements the analogue- digital conversion by the mechanical system itself so that a direct broadcast (e.g. by RFID) of the counter value is Figure 2: SEM picture (stack out of 10 single frames) of a fabricated 2-bit system – essential system compo- allowed. nents are shown – both bits are positioned in the high state

56 The German Congress on Microsystems Technology 2015

Conclusion The micromechanical binary counter mechanism enables detection and quantified storage of off-limit conditions as a mechanical binary code without the need for electrical energy. The number of detectable threshold events is limited by the number of serially arranged bits, only. Expanding the design to up to ten bits would lead to a counter mechanism able to detect and store 1023 off-limit Figure 3: a Test chip containing four different 2-bit systems and (focus stacked photograph) b detailed view of conditions. As the switching energy a 2-bit system (focus stacked photograph) scales almost linearly with the number of bits, this system would need a peak energy of around 3.6 µJ at the system entrance. The system design can be expanded towards an electrical read-out of the bit positions by measuring whether the bit guiding springs are strained or un-strained. Consequently, the system represents a long time storage without self-discharge that enables e.g. non- electrical lifetime condition monitoring of Figure 4: Photographs of the two different states for a 1-bit system demonstrator a shows the low (0) state of critical physical quantities. bit 0 and b shows the high (1) state of bit 0 References able mechanical coupling between bits video tracked in order to investigate their [1] L. J. Currano, et al.: Latching ultra-low power MEMS shock sensors for accelera- showing the state high. Additionally, the switching behavior. tion monitoring. Sensors and Actuators A, first serial following bit (n + m + 1) with the For switching bit 0 from the high to the Vol. 147, pp. 490-97, 2008 state low has to change from low to high low state, the entrance has to be moved [2] H. Mehner, et al.: A passive microsystem which is realized by the ratchets that re- 69 µm and maximal input force of about for detecting multiple acceleration events beyond a threshold. Microelectr. Eng., Vol. lease this bit in case bit (n + m) switches 10.2 mN is needed. Here the bit guid- 145, pp. 104-11, 2015 from high to low. The system design is ing springs form the largest movement [3] M. Schneider, et al.: Non-electrical-power symmetric to suppress rotational move- resistance. Their spring rate defines the temperature-time integrating sensor for RFID based on micro fluidics, Proc. SPIE 8066, ments. First demonstrator systems were necessary maximum switching force. In Prague, Czech Republic, 2011 fabricated using Silicon-on-Insulator the end of the switching sequence bit 0 (SOI) substrates with a device layer is fixed by the ratchets (see figure 4). thickness of about 40 µm and standard For switching bit 0 to the high state the microtechnology fabrication processes. entrance has to be moved 37 µm and A fabricated test chip with four 2-bit a maximum force of about 8.2 mN has systems is presented in figure 3. to be applied on the entrance. Bit 0 in its low state is held by the ratchets Measurements and Discussion against the spring force of the bit guiding For system characterization a spring springs (see figure 4). Releasing the Dipl.-Ing. Hannes Mehner steel element is used as a force sensor. coupling between the ratchets and bit 0 Technische Universität Ilmenau In the test setup, one end of the force is the main resistance for switching bit 0. IMN MacroNano® sensor is connected with a two-axis The mechanical energy for both switch Fachgebiet Mikromechanische Systeme stage (DC-motor with rotational encoder) sequences is calculated using the Max-Planck-Ring 12 that positions the force sensor with a tracked video paths of the entrance and D – 98693 Ilmenau precision of about 300 nm. The other the measured force values. It is found to Phone +49 (0)3677 - 69 - 1860 end is coupled to the entrance of the be 0.1 µJ for switching bit 0 to the high Fax +49 (0)3677 - 69 - 1840 demonstrator under test. Travel paths state and 0.36 µJ for switching it back to Mail [email protected] of several system components are the low state. Web www.tu-ilmenau.de/mms

57 Ergebnisse und Leistungen aus Forschungseinrichtungen Results and Portfolios of Research Institutions Results and Portfolios of Research Institutions

Mobile Telecommunications of Tomorrow: Aluminum Scandium Nitride (AlScN)

High frequency filters beyond AlN-based TFBAR In today’s fast pacing world, the ability to share large quantities of information be- comes more and more important every day. We also have an increasing amount of different standards, for example 3G, 4G, Wi-Fi, GPS, and Bluetooth. More- over, when we consider a smart phone, all of these different ways to communicate share the same limited space in one device, meaning that not only we require an efficient way to separate different, very narrow frequency bands, but we need to do it on a micro scale and with the power consumption as low as possible. For that reason, compact microelectro- mechanical systems (MEMS) are a very Figure 1 attractive solution. By combining well Examples of different structures with membranes produced at Fraunhofer IAF (a) top: Schematic drawing of Lamb mode wave resonator, bottom: membrane movement recorded using laser Doppler vibrometry (LDV); established silicon (Si) micromachining (b) top: piezoelectric microlense, bottom: lense movement recorded with white light interferrometry (WLI). technology with piezoelectric materials such as aluminum nitride (AlN), we can state physics – how to produce and use are well equipped for structuring material produce electroacoustic components for different compound semiconductors and to monolithically integrate the actua- many different purposes, including radio to create powerful electronics for many tor layers into MEMS. frequency filter applications. However, diverse applications. The institute is even though AlN is a dominating choice uniquely equipped to work on all levels Aluminium scandium nitride for thin film bulk acoustic wave resona- – starting with basic material develop- In a recent study it was shown that by tors (TFBAR) widely used in telecommu- ment and delivering a functioning device alloying wurtzite AlN with cubic ScN we nications, its piezoelectric properties and in the end. A part of the activities is can form a metastable wurtzite alumi- electromechanical coupling are limited. directed towards developing various num scandium nitride (AlScN) with supe- In order to produce AlN-based TFBARs novel technologies for RF-MEMS de- rior piezoelectric properties (up to 400% suitable for higher frequencies (up to vices based structures with AlN, AlScN, increase in piezoelectric coefficient d33) 5 GHz) the design of the components and diamond layers for applications in and better electromechanical coupling 2 would become too complicated. So we biomedicine, electronics, and optics. kt . Following the first report, numerous need to change to a new type of struc- This is done by employing the most theoretical and experimental studies tures, to replace the material itself, or, for suitable material synthesis techniques, have been published to confirm and the maximum effect – to do both. such as microwave chemical vapor explain this phenomenon in more detail. deposition (CVD) for diamond growth, The main reason for the enhanced MEMS technologies at Fraunhofer IAF metal-organic CVD or dedicated reactive piezoelectric response of AlScN is the The Fraunhofer IAF and more than 250 magnetron sputtering tools for nitride ongoing competition between Al and of its employees focus on applied solid layers. Our extensive cleanroom facilities Sc to bond with nitrogen in a different

60 Results and Portfolios of Research Institutions

Dr. Agnė Žukauskaitė Dr. Vadim Lebedev

way, leading to internal softening of the combine the advantages of SAW and tric constants (d33 > 15 pC/N), improved 2 material that improves the susceptibility TFBAR we are currently investigating electromechanical coupling (kt > 10%), for displacement. Only wurtzite Al1-xScxN Lamb mode wave resonators (LWR), excellent crystal quality, and homoge- shows enhanced piezoelectric proper- where a TFBAR-like membrane is neous properties over 8” substrates. The ties, and according to theoretical predic- produced with SAW-like IDT electrodes current lack of commercial 8” sputter tions it is the most stable crystal phase (Figure 1). equipment capable of reliable deposition when x < 0.5. We at Fraunhofer IAF see The application oriented research on of Al1-xScxN with varying Sc concentra- this recent discovery as a potential key thin-membrane LWR is on the rise, tion is a serious challenge hindering an to high frequency filters for the next gen- together with rapidly increasing number application related development in this eration of mobile communications. of reports on new suitable piezoelectric field. materials and functional devices operat- Lamb mode wave resonators ing in the lab environment. While the Outlook Surface acoustic wave (SAW) resona- performance of conventional, AlN based Here at Fraunhofer IAF we currently aim tors have an advantage in comparison LWRs is still limited by the moderate for rapid development of Al1-xScxN thin to TFBAR due to the comblike interdigital material constants, the recently reported film sputter deposition technique that is transducer (IDT) electrodes that make AlScN-based structures show a great reliable and scalable up to 8”. We are the devices less sensitive to fabrication potential to overcome this limitation in focusing on “market-ready” conditions, uncertainties. However, the maximum the nearest future. Our main objective cooperating with industrial partners in frequency of operation for SAW devices for current developments is to confirm the field of multi-target sputter equip- on the market is limited to 2.5 GHz and that Al1-xScxN layers can improve the RF ment (Figure 2) and RF-component the main drawback is incompatibility with device performance and reliability. This producers. Current activities are mainly Si integrated circuit (IC) technology. To demands a material with high piezoelec- focused on prospective application

fields for Al1-xScxN such as RF-electroacoustic (x > 0.25) and piezo MEMS (x > 0.4) devices (Figure 1), in order to test the first system prototypes within the next two years.

Fraunhofer Institute for Applied Solid State Physics IAF Tullastrasse 72 D – 79108 Freiburg Dr. Agné Žukauskaité Phone +49 (0)761- 5159 - 246 Fax +49 (0)761- 5159 - 71246 Mail [email protected] Dr. Vadim Lebedev Phone +49 (0)761- 5159 - 507 Fax +49 (0)761- 5159 - 71507 Figure 2 Multisource sputter tool by Evatec: 8” multi-target system used for growth of novel piezoelectric materials at Mail [email protected] Fraunhofer IAF. Inset (bottom right) – sputter process from two targets for growth of compounds, such as AlScN. Web www.iaf.fraunhofer.de

61 Results and Portfolios of Research Institutions

Solutions with Light – Micro- and Nanooptical Systems and Technology

The Fraunhofer Institute for Applied with high precision for the construction tured polymer chip and a cover foil that Optics and Precision Engineering IOF of complex optomechanical and opto- seals the channels on the chip. Current develops innovative optical systems to electronic micro- and macro systems. LOC systems feature complex fluidic control light from the generation to the The Printing of microsystems as a new structures, but require extensive external application. technology complements our portfolio. hardware, thus making the systems Our service range covers the entire Within the following paragraphs, we more bulky. photonic process chain from optome- want to show some actual examples of The goal at Fraunhofer IOF is to replace chanical and optoelectronical system microsystem technology used at or real- part of the external hardware with printed design to the manufacturing of customized by the Fraunhofer IOF. on-chip functions. Electrodes for resis- ized solutions and prototypes. tive heating elements, capacitive fluid The institute works in the five busi- Printed functional materials and struc- detectors or electrophoresis applications ness fields of Optical Components and tures for optofluidic Lab-on-a-Chip have been realized by printing metal Systems, Precision Engineering Compo- systems nanoparticle dispersions or conduc- nents and Systems, Functional Surfaces Inkjet printing is an additive manufactur- tive polymers. Furthermore, membrane and Layers, Photonic Sensors and ing technique suitable for depositing pumps based on fully printed, piezoelec- Measuring Systems, and Laser Technol- solutions or dispersions of different tric polymer actuators showed pump ogy. Outstanding basic research results functional materials. Thanks to the addi- rates of more than 200 µL/min. Proof- and strategic cooperation arrangements tive approach, material consumption is of-concepts of on-chip optical excitation with various partners in the industry low and no masking is required, which and detection by organic light sources demonstrate the research strengths of makes the process cost-effective and and photodiodes were achieved. With the Fraunhofer IOF. flexible. At Fraunhofer IOF, drop-on-de- these functions integrated on-chip, One of our core knowledge areas is mand inkjet printing is used to integrate smarter LOC systems can be realized microsystem technology, covering functions in microfluidic Lab-on-a-Chip and less external equipment is required. micro- and nanooptics, system integra- (LOC) systems. They carry out chemi- tion technologies, printing of microsys- cal or biological analyses on compact Direct writing grayscale lithography systems, and much more. The institute has chips, which would typically require large tem for micro-optical fabrication extensive expertise in the development of laboratory infrastructure. LOC systems During the last two years, Fraunhofer IOF micro- and nanooptical components and are often designed as single-use, developed a novel direct writing gray- systems, as well as technologies for the disposable devices for point-of-care ap- scale lithography system for the fabrica- hybrid integration of various components plications, and consist of a microstruc- tion of micro-optical freeform surfaces, micro-lenses, diffusors and diffractive Example of printed optics. It incorporates an accurate and silver electrodes and semiconducting highly dynamic control system which polymers for provides a resolution better than 0.1% photodiodes in the resulting height-profile. A highly on the cover foil of precise substrate positioning and a a microfluidic chip demanding online data preparation software are used to suppress stitching effects of less than 0.1% RMS error within large patterned areas, also on curved substrates. Additionally, the exposure concept allows a high structure depth of

62 Results and Portfolios of Research Institutions

Near-to-eye display demonstrator. The Realization requires the consistent miniaturization of the usual system components: a micro-imager, eye-piece optics, and a lightguide which shifts the image to the eye motion box and permits a see-through option. The simplest realization is a plano-parallel lightguide with incoupling features to launch the image into the lightguide, and outcoupling features on its other end which direct the image to the user’s eye and enable see-through functionality. This results in an extremely slim overall optical system layout. The realized demonstrator system more than 100µm and a spatial resolu- the realization of optical elements not uses an LED-illuminated micro-imager tion below 1µm. At the same time, very only for illumination, but also for imaging model and a reflow lens array replicated steep edges of up to 80° have been and metrology applications. as a polymer-on-glass element to form achieved. The patterning speed of up to an multi-aperture eye-piece optics. 100cm²/h makes the concept suitable Ultra slim multi-aperture near-to-eye see The achieved 10° field of view image for large-scale applications. The manu- through display is launched into a 3.8 mm thick glass factured resist masters can be directly Wearable computer and communication lightguide by a binary grating which is etched into the substrate or replicated devices such as smartphones or smart replicated into a thin polymer layer on with various molding methods. Recently, watches suffer from their limited space top of the lightguide. After a 40 mm this technology has been used for the to visualize information. Near-to-eye image shift through the lightguide, an fabrication of micro-asphere-arrays with displays offer information content com- identical outcoupling grating directs the a superior low surface deviation below parable with common desktop monitors image to the observer’s eye. 0.2% RMS of the surface sag. This together with common desktop Compared to single-aperture systems, result demonstrates that the described monitors while being much smaller and the combination of multi-aperture eye- novel fabrication concept is suitable for having see-through functionality. piece optics and a lightguide enables an extremely slim and unobtrusive system High dynamic gray layout of see-through dataglasses. scale lithography setup with fast imaging violet LED exposure. Fraunhofer Institute for Applied Optics and Precision Engineering IOF Dr. Kevin Füchsel Albert-Einstein-Str. 7 D – 07745 Jena Phone +49 (0)3641- 807273 Mail [email protected] Web www.iof.fraunhofer.de

63 Results and Portfolios of Research Institutions

Fraunhofer ICT-IMM’s Streamlined Portfolio

For two years now we have been part of Continuous-flow the Fraunhofer-Gesellschaft. An intense photochemistry with the falling film microreactor: period of change, in which we were able wavelength-specific to face new challenges. And, within that irradiation of gas-liquid period, we have changed. As promised, reactions using high- power LED arrays we remain true to our high standards. It is still our mission to continually un- derstand our customers’ and partners’ needs so that we are able to offer them active ingredi- application- and customer-oriented solu- ent synthesis, tions to ensure their competitiveness. In functionalization, doing so, we still always strive for the re- food safety, sponsible handling of new technologies neurostimulation and for sustainable solutions for society and implants. and economy. This is reflected in two Point-of-care main pillars: Energy and Chemical Tech- light. Mostly, they take place at room diagnostic is one nology (Processes, Reactors and Plants) temperature and normal pressure. Such of the most important future topics when and Analysis Systems and Sensors sustainable and environmentally friendly it comes to the question of how to treat (Methods, Components and Systems). conditions allow access to reagents and patients fast and individually. This is what And within these pillars we organize our secondary products which can hardly triggered our scientists in the ERC Start- competencies based upon the follow- be realized with thermal treatment. As ing Grant Project PoCyton. Starting point ing priorities: Sustainable Economy and such, photochemistry is a viable alterna- in this case: How will a doctor know if Energy, Healthy Living, Intelligent Mobility tive to realize syntheses in a non-thermal a specific cancer therapy took effect? and Civil Security. way. Up to now, it is virtually impossible Flow cytometers measure the quantity of to perform photochemical reactions on circulating tumor cells in blood. There’s a What is behind these priorities? a large industrial scale. A conventional snag: they usually cost up to 300TEUR Keep on reading and find out: “vessel” containing any kind of solution and are as big as one or two washing Our competencies in the fieldSustain - simply cannot be irradiated sufficiently machines. Moreover, the analysis takes able Economy and Energy include uniformly so that a reasonably controlled many hours and the device can only be catalysis, hydrogen technology, biofuels, process could be achieved. This is why operated and calibrated by experts. All power to gas, heat and refrigeration ICT-IMM has brought its microreactor that makes it unaffordable for doctors’ management, energy storage, fusion technology into play which allow the light practices and hospitals. The scientists energy, continuous synthesis, nanoparti- to completely penetrate the formed thin at ICT-IMM developed a flow cytometer cles, photochemistry and electrochemis- layer of solution on its way through the which is able to do the analysis twenty try. Let’s have a closer look at ICT-IMM’s reactor. Moreover, the precisely defined times faster than the conventional large approach to photochemistry: In the con- residence time enables more control cytometer. An additional plus, the poten- text of the Green Chemistry sustainability over byproduct formation. tial investment costs are on a very dif- principles we implement photochemistry ferent scale with “only” a few thousand as an important synthesis route for future Back to the fields of competencies, euros. And this is how the profitable industrial applications. Photochemistry let’s zoom in onto Healthy Living. Our flow cytometer works: A fluorescence comprises a class of chemical reactions scientists perform research in point-of- dye is added to the blood sample. The that are initiated by the interaction with care diagnostics, targeted drug delivery, dye molecules specifically target and

64 Results and Portfolios of Research Institutions

CTCelect instrument Thermonuclear Experimental Reac- tor). The aim is to further develop so called bolometer cameras which shall monitor the plasma injection process, in the reaction vessel of ITER. ICT-IMM is working on the bolometer chip, the centerpiece of these cameras. With the help of this chip, the intensity of the attach to tumor photon flux from infrared to X-ray range, cells while leaving which is radiated by the ITER-plasma, all other cells can be measured. The material has to untouched. So be highly radiation resistant while the far, the labora- detectors have to withstand impacting tory technician fusion neutrons and temperatures up to had to add the 450 °C. This is truly what you would call dye to the blood a harsh environment. sample by hand – PoCyton manages tumor cells can therewith be detected that automatically. The blood together and counted. This procedure forms the We conclude with the last field of with the dyed tumor cells then passes highlight of PoCyton. The scientists have competencies, Civil Security, which a narrow section where a laser spot designed the narrow section in a way includes CBRN detection, water analysis lightens up all marked cells. The shining which also allows a twentyfold higher and special sensor technology. throughput as compared to conventional cytometry. Nevertheless, every passing Moreover, the following fundamentals object is recognized and no single cell we know inside out and, thus, 25 years can pass undetected. With one billion of success are built upon: process objects in only ten milliliters blood truly analytics, process control, simulation, an art and of utmost importance: Even in reactor design and development, plant the blood of severely sick patients only development, microfluidic components, five of those cells are circulating tumor sample preparation, assay development, cells. The proverbial search for a needle spectral measurement methods, preci- in a haystack certainly applies for this sion machining, surface modification, procedure. analytics, electronic engineering.

Intelligent Mobility deals with mat- ters of reformer systems, exhaust gas Fraunhofer ICT-IMM cleaning, fuel supply, leakage tests and Carl-Zeiss-Straße 18-20 harsh environment. By the way, you can D – 55129 Mainz interpret harsh environment in many Phone +49 (0)6131 - 990 - 0 ways. Here, only one example out of our Fax +49 (0)6131 - 990 - 205 projects: ICT-IMM is part of a research Mail Antonia.Winkler@imm. and development consortium for specific fraunhofer.de ICT-IMM‘s Bolometer chip plasma diagnostics at ITER (International Web www.imm.fraunhofer.de

65 Results and Portfolios of Research Institutions

Bridging the Gap between Macro and Nano

The Institute of Micro- and Nano- technologies (IMN) MacroNano® is an interdisciplinary scientific institute of the Technische Universität llmenau dedicated to research in the areas Micro-Nano- Integration, Materials for Micro and Nanotechnologies, and 3D Biosystems. It comprises scientific competences of more than 38 research groups from fundamental to applied research. Since December 2013, its comprehensive technological infrastructure has been offered to internal and external users under the umbrella of the “DFG-Core Facility Micro-Nano- Integration”.

Micro-Nano-Integration enables a new substrate platform A wafer-scale Silicon-Ceramic-Compo site-Substrate (SiCer, Fig. 1) that allows the advantageous combination of MEMS Fig. 1: Silicon-Ceramic-Composite substrate for MEMS and sensor applications and Low Temperature Cofired Ceramic (LTCC) technology was developed by a multidisciplinary group of scientist. The distribution (e.g. for interposers). Through mechanical stability. With deep reactive quasi-monolithic compound is fabricated Silicon Vias (TSV) in the silicon layer allow ion etching (DRIE), MEMS can be locally by laminating a nano-patterned silicon the vertical interconnection to the vias in defined (Fig. 1 inset right). SiCer wafers wafer with a green silicon-matched the LTCC (Fig. 1 inset middle). The silicon can combine extremely different thermal, LTCC layer stack and subsequent sinte layer can be fabricated as thin as neces- electrical and optical properties in one ring. Due to the increased surface area sary for the desired function whereas substrate, especially for a variety of RF- with adapted wetting properties for the the insulating LTCC layer ensures the MEMS and sensor applications. glass melt at the nanointerface (Fig. 1 inset left), the bond strength between the constituents is very high. SiCer is alkali-free and complies with typical wafer standards and is therefore suitable for MEMS processing. LTCC functionalities such as wiring, electrical and thermal vias, embedded passive components, fluidic channels, etc. can be included in the LTCC part. The silicon part of the Fig. 2: X-ray view of a ceramic flow control unit comprising a substrate can be either used for MEMS heater and four temperature processing or for depositing a thin film re- sensors

66 Results and Portfolios of Research Institutions

for the 3D cell culture and the removal of metabolic residues. The ceramic reactor provides suitable interfaces for optical and MEMS sensors (Fig. 2).

Microsystems integration for miniaturized satellite components A team of researchers developed and built a compact reconfigurable microwave switch matrix and peripheral components for the use in future communication satellites (Fig. 3). The applied design concept enables a tremendous reduction of weight and volume combined with faster switching speeds compared to currently used components. The technology passed a full space qualification and was successfully verified for low-earth orbits during a one year On-Orbit-Verification (OOV) mission aboard the German test satellite TET-1. Fig. 3: Switch matrix and peripheral components mounted on a printed circuit board. © TU Ilmenau/Michael Reichel The team is currently pursuing the space qualification for geostationary orbits in 3D-Biosystems for control these cell cultures’ fate. Sensors order to be part of the German Heinrich- automated cell cultivation monitor metabolic processes as well as Hertz-Mission. Experts in optics, micromechanics the impact of these stimuli, e.g. on cell and ceramics of IMN MacroNano® differentiation. Due to interactions on More detailed information about ongo- work together under the leadership molecular level, nanostructures offer a ing research is provided in the scientific of biomechatronics system design- huge potential for innovative bio micro- report which is available under www. ers and bio-material experts to create systems. The materials used for the mi- macronano.de. a bio-centered platform for the study crosystem components strongly depend of mechano-sensitive cells, that is, the on the requirements of the cell culture cells and their extra cellular matrix are and the type of experiments whereas the core of the system and stay fixed. To polymers, glass, silicon and ceramics provide in-vivo-like conditions, it is vital are the main options. Technische Universität Ilmenau to enable stable growth conditions for Multilayer LTCC substrates provide vari- IMN MacroNano® 3D cell cultures. Miniaturized structures, ous and flexible solutions for the integra- Gustav-Kirchhoff-Straße 7 e.g. microsystems, serve as hous- tion of sensors and electronic compo- D – 98693 llmenau ings and environmental conditioners. nents in microfluidic systems. Fluidic Phone +49 (0)3677- 69 - 3402 Furthermore they provide interfaces for a channels can have cross sections from Fax +49 (0)3677- 69 - 3499 range of actuators to provoke mechani- millimeters down to a couple of 10 mi- Mail [email protected] cal, electrical or biochemical stimuli to crons and enable thus nutrients supply Web www.macronano.de

67 Results and Portfolios of Research Institutions

Bridging the Gap from Nanoscience to Applications

The research within the Helmholtz on the use of direct laser Programme “Science and Technology of writing (DLW) to produce Nanosystems” (STN) at the Karlsruhe minute 3D structures with Institute of Technology (KIT) takes on the optical properties that do challenge to discover fundamentally new not exist in nature. Using scientific insights and to transfer these to 3D Stimulated Emission industrially relevant nano- and micro- Depletion (STED) DLW, technology applications. It combines the STN scientists have basic scientific research in the nanosci- succeeded in refining the ences, the application of tailor-made metamaterial to produce materials, the development of process the first 3D invisibility technologies and the creation of sys- cloak for non-polarized tems ready for the market. Special focus visible light. [2] This invis- is on nanocarbon devices based on ibility cloak principle can carbon nanotubes and graphene, tune- be applied to increase Fig. 1: Infrared image of the Ni-Co-Mn-In film actuator when in contact to the heat source (top) and to the magnet (bottom) able nanomaterials, printed electronics, the efficiency of solar and optics and photonics. cells. Up to one tenth of Energy harvesting is of increasing inter- the surface area of solar cells is covered the industrial scale. [4] Another compo- est as a local energy source for sensors by so-called contact fingers that extract nent serving fast data transmission is the and sensor networks. A method for ther- the generated current. This project did Mach-Zehnder modulator (MZM) which mal energy harvesting at small tempera- not focus on visually hiding the contact is able to convert electronic signals into ture difference and high cycling frequen- fingers, but rather on the deflected light optical signals. Scientists of KIT and cy that exploits the unique magnetic that reaches the active surface area of ETH Zurich have developed a plasmonic properties and actuation capability of the solar cell thanks to the invisibility MZM of only 12.5 µm length which con- magnetic shape memory alloy films has cloak (Fig. 2). Prototypes show that the verts digital electrical signals into optical been proven. Polycrystalline films of the loss can be recovered completely. [3] signals at a rate of up to 108 gigabit per Ni-Co-Mn-In alloy, were tailored to show Compact optical transmission is of great second. [5] a large abrupt change of magnetization interest in faster and and low thermal hysteresis well above more energy-efficient room temperature. A free-standing film data exchange between device, based on this alloy, has been electronic chips. A demonstrated which exhibits thermo- novel optical connection magnetically induced actuation between between semiconductor a heat source and sink with short heat chips has been devel- transfer times (Fig. 1). [1] oped using a polymer- The first 3D invisibility cloak at visible based optical wave- wavelengths has been realized in our guide. “Photonic wire research area transformation optics and bonding” reaches data metamaterials. Metamaterials consist of transmission rates in the homogeneous, regularly arranged ele- range of several terabits ments that interact with electromagnetic per second and is ideally Fig 2: A special invisibility cloak (right) guides sunlight past the contacts waves. The breakthrough was based suited for production on for current removal to the active surface area of the solar cell

68 Results and Portfolios of Research Institutions

The Karlsruhe Nano Micro Facility (KNMF) process. Two calls per year are pub- offers open access to a state-of-the-art lished and proposals are evaluated by an portfolio of micro and nano structuring independent peer review board. Details and characterisation technologies which of the full range of technologies and the can often be adapted to suit individual contact data of the technology experts user needs. The close proximity of the are available on www.knmf.kit.edu. in-house research at KIT ensures that the latest advances scientific knowledge Literature and state-of-the-art the technology [1] M. Gültig et al., High frequency thermal energy harvesting using magnetic shape development are also available to our memory films, Adv. Energy Mater. 4, Fig 3: Polymeric auxetic structure with outer dimen- users. We are a collaboration-oriented 1400751 (2014) sions of 40 µm x 40 µm x 40 µm and a smallest [2] C.M. Soukoulis and M. Wegener, Past facility, where our technology experts feature size of 1,000 nm made with 3D-DLW work together with our users to achieve achievements and future challenges in the development of three-dimensional photonic the desired results. metamaterials, Nature Photon. 5, 523 In the Laboratory for Micro and Nano (2011) Structuring, a portfolio of technologies [3] M. F. Schumann et al., Cloaked contact grids on solar cells by coordinate transfor- specialising in multimaterial structuring mations: designs and prototypes, Optica 2, and replication of nano and micro-scale 850-853 (2015) features may be combined in process [4] N. Lindenmann et al., Photonic wire bonding: a novel concept for chip-scale intercon- chains as required. Technologies such nects, Opt. Express 20, 17667 (2012) as the above mentioned 3D-DLW enable [5] C. Haffner et al., All-plasmonic Mach- users to create 3D structures with di- Zehnder modulator enabling optical high- mensions down to 200 nm, by 2 photon speed communication at the microscale, Nature Photonics 9, 525 (2015) absorption of in a tightly focused laser Fig. 4: Combination of 2D and 3D laser lithography [6] S. Hengsbach and A. Díaz Lantada, Direct to fabricate fractal surfaces in micro fluidic channels spot in a resist. 3D-DLW may be used in laser writing of auxetic structures: present combination with lithographic processes The Laboratory for Microscopy and capabilities and challenges, Smart Mater. Struct. 23, 085033 (2014) for multi-scale structuring and patterning Spectroscopy offers a range of methods [7] S. Hengsbach and A. Díaz Lantada, Rapid on arbitrary shaped surfaces which are for the investigation of the microstructure prototyping of multi-scale biomedical micro- accessible by the laser beam. This is and elemental and chemical composition devices by combining additive manufacturing technologies, Biomed Microdevices 16, useful for producing e.g. novel aux- of samples. 3D Atom Probe Tomography 617 (2014) etic structures (Fig. 3) or fluidic devices allows atom by atom, three-dimensional with surfaces functionalized by nano investigation of various types of samples Karlsruhe Institute of Technology (KIT) structures (Fig. 4) needed in biological such as metals, nanoglasses or even Programme STN / KNMF analysis systems (lab-on-chip). [6, 7] insulating materials with low conductivity. Dr. Susan Anson, Dr. Michael Harms Atomic-layer-deposition is another recent A recently installed helium ion microscope Hermann-von-Helmholtz-Platz 1 addition to KNMF. The Picosun SUNALE provides high-resolution imaging with high D – 76344 Eggenstein-Leopoldshafen R-200 Advanced system features a hot surface sensitivity and a depth-of-field 5-10 Phone +49 (0)721 - 608 - 25578 wall reactor for temperatures of up to times higher than in a modern FE-SEM. Fax +49 (0)721 - 608 - 25579 500 °C, an ozone generator, a plasma Users from both industry and academia Mail [email protected] / generator and has the capability to han- can access KNMF. No fee access, for [email protected] dle three liquid and three solid precursor work intended for publication is pos- Web www.stn.kit.edu / materials at the same time. sible via a straightforward peer review www.knmf.kit.edu

69 Results and Portfolios of Research Institutions

From Microsystems to Nanosystems

M. Vogel, D. Reuter, S. Hermann, P. Matthes, C. Stöckel, S. Schulz, T. Otto, T. Gessner

The particular strength of the Fraunhofer dustry automation, mechanical engineer- double full Wheatstone bridges, see Fig- Institute for Electronic Nano Systems ing, automotive industry, environmental ure 1. For a maximum signal-to-noise ENAS lies in the development of smart engineering, power engineering, logistics ratio, an antiparallel alignment (“pinning”) integrated systems for different applica- as well as aeronautics. of the magnetic axes of neighbouring tions. Fraunhofer ENAS develops single In order to increase the accuracy of sen- meanders is accomplished. In addi- components, technologies for their manu- sors and actuators as well as to develop tion, the axes of the two nested bridges facturing as well as system concepts complete new systems, the application must be rotated by 90° relative to each and system integration technologies and of nanomaterials and nanotechnologies other for providing 2D sensitivity, see transfers them into production. are in the focus of the institute. Thereby Fig.1. The developed 2D sensors can Fraunhofer ENAS cooperates with the readily be employed for determining the The product and service portfolio of Center for Microtechnologies at Tech- magnitude and the direction of small Fraunhofer ENAS covers high-precision nische Universität Chemnitz. In the fol- magnetic fields with high spatial (~1 mm) sensors for industrial applications, sen- lowing four different topics are described and temporal (~1 ms) resolution. The sor and actuator systems with control in detail. development of 3D sensors is currently units and evaluation electronics, printed undergoing as well as the implementa- functionalities as well as material and re- Starting in 2010, the design and fabrication of TMR based technology. liability research for microelectronics and tion of magnetic field sensors has been microsystem technology. The develop- in the focus of the work, resulting ulti- Motivated by the outstanding proper- ment, the design and the test of MEMS/ mately in the development of 2D GMR ties of carbon nanotubes (CNT), the NEMS, methods and technologies for spin valve sensors in an innovative and young research group Carbon Nano their encapsulation and integration with cost-effective monolithic integration. For Devices aims to bridge the gap between electronics as well as metallization and this, the sensor devices are fabricated science on CNTs and their application interconnect systems for micro- and on wafer-level and subjected to specific in electronics and NEMS by means of nanoelectronics and 3D-integration laser-based post-processing steps for industrial compatible technologies. The are especially in the focus of the work. magnetic patterning. As sensor materi- group focuses in particular on a holistic Application areas are semiconductor als, we use partially exchange-coupled wafer-level approach. industry, communication technology, metallic nanolayers and structure them medical engineering, biotechnology, in- in the form of meanders integrated as The technology team in Chemnitz in cooperation with cfaed (Center for Advanc- Fig. 1: ing Electronics Dresden) partners at TU Double Wheatstone Dresden already managed to fabricate bridge layout for a 2D GMR spin valve CNT transistors on 6 inch wafers which sensor in monolithic operate already at a frequency of up integration. The yellow to 3 GHz (Figure 2). Ongoing work is arrows illustrate the focusing on increasing of performance locally set magnetization of the pinned with respect to higher frequency and layers. low-power consumption. Moreover, the group applies its established nanotechnology platform for realizing a new generation of ultra-sensitive electromechanical sensors. Latest developments on CNT-strain sensors in-

70 Results and Portfolios of Research Institutions

Fig. 2: High frequency characterization of CNT transistors on a wafer (left). Schematic cross sectional view of fabricated CNT transistors in bottom-gate configuration (right).

dicate a sensitivity significantly surpass- For measuring mechanical events like able shaped electron beam lithography ing commercially available silicon-based movement of objects, machines and system (model ID: SB254) from Vistec strain gauges. bodies, shocks or impacts MEMS inertial Electron Beam GmbH. By combining sensors are the common solutions. In or- the proven technological competences Aluminum nitride AlN is a seminal der to optimize the power consumption a in the field of micro- and nanosystems material for MEMS and NEMS sen- wake-up generator (PDIG – Power Down with the new nanolithography capabili- sors and actuators. The energy density Interrupt Generator) has been developed ties down to 20 nm and the great flex- for piezoelectric working principles is based on thin film aluminum nitride. If ibility with respect to substrate dimen- much higher compared to capacitive any mechanical event occurs, the PDIG sion and materials, a unique research MEMS driving and sensing principles. generates electric energy by itself and portfolio is created at one location in This allows the shrinking of MEMS and “wakes up” any electric circuit, e.g. inertial Saxony. NEMS, which reduces costs and energy sensors. This wake-up module with ASIC By the possibility of conducting ad- consumption and increases the areas of control requires less than 300 nA current vanced research in the whole process application. Thereby, piezoelectric driven consumption. In result, the lifetime of chain Fraunhofer ENAS is an interest- MEMS could be an alternative for actua- an independent battery-based system ing partner for the application fields of tors with smaller feature sizes. increases significantly. high-precision MEMS, nanosystem Furthermore, AlN is highly capable of technologies as well as interconnect being integrated into micromechanical Since 2015 Fraunhofer ENAS is running technologies for nanoelectronics and and CMOS processes. a nanolithography lab based on a vari- nanosystems.

Fraunhofer Institut für Elektronische Nanosysteme Technologie-Campus 3 D – 09126 Chemnitz Phone +49 (0)371 - 45001 - 100 Fax +49 (0)371 - 45001 - 101 Mail [email protected] Fig. 3: PiezoMEMS at wafer-level, PDIGs with integrated piezoelectric aluminum nitride Web www.enas.fraunhofer.de

71 Results and Portfolios of Research Institutions

MEMS Technologies at the Fraunhofer Institute for Photonic Microsystems

Fraunhofer IPMS offers its customers how in integrating MEMS comprehensive services for the devel- and CMOS is used for the opment of micro-electromechanical development of monolithic systems (MEMS) and micro-opto- systems, where sensors and electromechanical systems (MOEMS) on / or actuators are manu- 150 mm wafers. Until 2017, the institute factured, together with the will upgrade its cleanroom to 200mm control electronics, in a single wafers. These services range from fabrication process. technology feasibility studies to process Wafer processing is car- development all the way to complete ried out in a 15,000 square fabrication processes including in-line foot clean room, rated at process monitoring, post-process elec- Class 4 per ISO 14644-1, or trical characterization, and full process Class 10 per U.S. Standard One-dimensional SLM for Laser Direct Imaging and device qualification. If desired, we 209E. The clean room has will drive a process and device develop- been planned and built according to the micromirrors on semiconductor chips. ment through to pilot production in our latest industry standards. Its open and In most cases this demands a highly own facility. Besides the development flexible architecture allows Fraunhofer integrated application specific electronic and production of complete MEMS IPMS to respond rapidly to future tech- circuit (ASIC) as basis for the compo- technologies, we provide foundry ser- nological developments and innovations nent architecture. CMUTs can send and vices for individual process steps as well in fab equipment. Using this facility as a receive ultrasound in an energy efficient as technology modules. foundation, Fraunhofer IPMS is able to manner, are environmentally friendly, We are able to offer these compre- realize the widest range of customers’ provide miniaturization capabilities, and hensive services because of our deep wishes: from analysis of initial ideas to expand the applications of ultrasound technological expertise in the fields of full, high-yield pilot production. beyond today’s state of the art piezo- surface and bulk micromachining. In ad- MEMS devices developed and manu- electric materials. dition, we have considerable experience factured at Fraunhofer IPMS include combining these MEMS technologies among other components micro with more conventional CMOS device scanning mirrors manufactured by bulk and process technology. Our know- micromachining as well as spatial light modulators and Capacitive Micromachined Ultrasonic Transducers (CMUTs), both Dr. Michael Scholles done in surface microma- Head of Business Development and chining. Applications for Strategy scanning mirrors range from Fraunhofer Institute reading barcode and data for Photonic Microsystems (IPMS) code, through 3D metrol- Maria-Reiche-Strasse 2 ogy, and right up to laser D – 01109 Dresden projection and spectroscopy. Phone +49 (0)351- 8823 - 201 Spatial light modulators of Fax +49 (0)351- 8823 - 266 Fraunhofer IPMS consist of Mail Chip on carrier containing many CMUT arrays arrays of up to several million Web www.ipms.fraunhofer.de

72 Smart Solutions with Microsystems Engineering

Visions to Products

We develop intelligent products for you: from the initial idea through to production – across all industry sectors.

We stand for application-oriented research, development and production in microsystems engineering. In close cooperation with industry, we implement products and technologies in the future-oriented fields of life sciences and medical technology, mobility and movement, Industry 4.0 and sustainability, energy and the environment.

■ Services ■ Technologies ■ Production > Sensors > Silicon technologies > MEMS Foundry > Actuator technology + > Precision machining > TransferFab dosing technology > Polymer and molding technologies > Lab-on-a-Chip > Microelectronics > Structuring of surfaces Design + Foundry Service > Integrated microsystems > Micro assembly + packaging > Lab-on-a-chip + analytics > Printing techniques > Micro energy harvesting + energy management > Information technology > Measurement + testing technology, damage analysis > Modeling + reliability

Hahn-Schickard is certified according to "DIN ISO-Norm 9001:2008" www.Hahn-Schickard.de [email protected] Innovationen und Kompetenzen aus Unternehmen Innovations and Competencies of Companies Innovations and Competencies of Companies

ADZ NAGANO GmbH Gesellschaft für Sensortechnik

Dresden, Saxony’s metropolis at the a crucial role when it comes to making products are also designed in accor- eastern end of the A 4 motorway, is said top quality products or ensuring reliable, dance with state-of-the-art technology. to be Europe’s largest semiconductor safe operation of machines. Develop- Customers in process engineering, the centre and the world’s fifth key semi- ment work in the young SME company automotive industry and all sectors using conductor location. This is where ADZ focuses primarily on customised solu- pneumatic and hydraulic systems have Sensortechnik was founded in 1998 by tions for pressure measuring technol- come to place their trust in solutions Dietmar Arndt and Wolfgang Dürfeld, ogy. Today, ADZ NAGANO GmbH has by ADZ NAGANO. The technologically two former employees of Dresden’s a workforce of nearly 100 employees at challenging aerospace industry also ad- microelectronic research centre ZMD the company site in Ottendorf-Okrilla to vocates products by Saxony’s sensory (Zentrum Mikroelektronik Dresden), the north of Dresden, including a devel- specialists. Every year, several hun- together with two business friends. opment team of twelve. This is where dred thousand pressure transmitters in The first products consisted of pressure not only individual customised solutions 3,000 different variants are supplied to transmitters for industrial applications. are produced, but where new standard customers all over the world. From Asia The technology that was used via Europe to America, increasing led to top quality products numbers of users are convinced which soon made a name for by the ADZ NAGANO products. themselves on the market. The so-called SML series is supplied with various output signals. ADZ NAGANO GmbH The technically mature, robust Gesellschaft für Sensortechnik sensors produced by ADZ Bergener Ring 43 NAGANO are used all over the D – 01458 Ottendorf-Okrilla world in many different industrial Phone +49 (0)35205 - 596930 applications. Sensors are the Fax +49 (0)35205 - 596959 sensory organs of automated Mail [email protected] plants and machinery. They play Web www.adz.de

76 Innovations and Competencies of Companies

AEMtec GmbH: Electronics Development and Manufacture with Highest Precision

AEMtec GmbH based in the prestigious time. With an x-ray inspection science and technology location of Berlin- system, complex requirements Adlershof develops, qualifies and pro- can be shown down to the duces complex micro and optoelectronic smallest detail, particularly in modules through to complete systems for the use of special soldering sophisticated applications in a wide range technologies. of industries. AEMtec is a member of exceet Group S.E. with excellent technol- Positioning passive components ogy competence in the area of intelligent quickly and cost-effectively electronics and safety technology through A scalable SMD placement to complete safety solutions. platform with a modular structure and heads allows easy Picture 1: Micro-mirror assembly Our customer-specific products are head replacement for construc- highly complex assemblies with pre- tion elements of different sizes cise placement. We therefore place that are to be placed. The great emphasis on the development automatic correction technol- work. However, product development ogy and the image capture does not mean merely creating a new and processing guarantee product; the requirements for costs high system accuracy. Our and high quality must be satisfied at customers benefit from faster the same time. A small design cor- lead times and reduced unit rection in advance is enough to avoid costs as well as process setup unnecessary follow-up costs. As such, that is reduced to a minimum diverse concept developments, exact with intelligent fully automated specifications, feasibility and systematic feeder units. Picture 2: High-precision placement (VCSEL array) risk analysis form the basis for safe and All common substrates are reliable results. processed, for example such as stan- of sophisticated electronic components, dard circuit boards (rigid, rigid-flex), film, in compliance with all the relevant quality Precise placement “Made in Germany” ceramic, silicon wafer, glass or IMS. The standards (ISO 9001, ISO 13485, ISO AEMtec produces medium to high process ultimately selected is primarily 14001 and ISO/TS 16949), AEMtec has quantities in a cleanroom environment. dependent on the desired result and the positioned itself as a reliable partner for In our cleanrooms (ISO 5, 7, 8), we have complexity. the manufacture of products with a high broad technological diversity: chip-on- With longstanding experience in the level of integrity and reliability in recent board, die bonding (with positioning product development and manufacture years. accuracy up to +/- 1 µm), SMT, 3D integration, opto-packaging, SiP method, AEMtec GmbH precision saws and X-rays. Ever since James-Franck-Straße 10 2008, AEMtec has been active in the D – 12489 Berlin area of high-precision placement and it Phone +49 (0)30 - 6392 - 7300 has continuously expanded its produc- Fax +49 (0)30 - 6392 - 7302 tion capacities for this requirement and Mail [email protected] the necessary experience since that Web www.AEMtec.com

77 Innovations and Competencies of Companies

Diversification in CMOS-technology: Nano-Sensors using Photonics and Plasmonics

Nano-technology has already and fabrication of sensor devices revolutionized the world of ap- applying new materials and nano- plied electronics in many fields scopic architectures using its state beginning with data processing of the art CMOS-clean room, i. a. and storage up to the improve- with special tools for nanolithogra- ment of sensing devices for nu- phy processes as Ebeam, deep merous applications. Especially UV interference lithography and UV here, deviating from the classical (SCIL) nanoimprint. All processes electronic approach, photonics are steadily refined and adapted and plasmonics are benefiting to the demands of a permanently from the developing potentials in changing and challenging market. Nano-technology. Here AMO, being a technology Integrated Nano-photonics have venture with 20 years experience in evolved on the basic fabrication nanotechnology, has accumulated schemes used in CMOS-tech- knowhow in designing nanoscopic nology. sensor surfaces also based on Guiding and processing light in innovative materials as graphene nanoscopic high refractive index with respect to the technical feasi- materials has proven to be an bility for a multitude of application asset for optical communica- fields. tion technology, yet the used fundamental devices, especially We would be happy if we have the ring resonator and Mach- piqued your interest and you intend Zehnder-interferometer have an to take advantage of the experi- even higher potential as ultra- ence and technology of the AMO sensitive elements especially for to explore new concepts and biotechnology and, depending components in the field of MEMS- on surface functionalization, as NEMS. environmental sensors. We place ourselves anytime at As the dimensions of device your disposal for requests. architectures shrink beneath the wavelength of light modern probe units can effectively boost selectivity and sensitivity of AMO GmbH analytical procedures by imple- Otto-Blumenthal-Straße 25 menting plasmonic reactions D – 52074 Aachen induced by light or THz exposure Phone +49 (0)241 - 8867 - 125 in the vicinity of an analyte. These so systems to identify airborne explosives, Fax +49 (0)241 - 8867 - 560 called plasmonic nano-antennas can be hazardous components or pathogens. Mail [email protected] used to amplify spectroscopic detection AMO offers activities in development Web www.amo.de

78 Innovations and Competencies of Companies

Finetech – Customized Sub-Micron Die Bonding Equipment

Today’s advanced packaging and bonding technologies are characterized by rapid transformation and ever-more specific demands regarding the assembly equipment. Investing in a machine solution is not only about specs. Equally important is to rely on a solution which ensures maximum technological flexibility, compatibility with future technologies, longevity, and all-around economics. With an industry-leading product line-up ranging from manual to fully-automated sub-micron bonding systems, Finetech from Berlin offers equipment for high- precision micro assembly challenges that ticks all the boxes. In the spirit of true developer’s platforms, all FINE Worldwide, more than 2.300 FINE pable of bonding on chip and wafer level PLACER® sub-micron bonders can PLACER® systems have been suc- up to 300 mm as well as automated be configured to provide an optimal cessfully installed in industries such as platforms for high-mix/high yield produc- process environment for each applica- research departments of major OEMs, tion environments. tion. Their modular system architecture aerospace & defense, consumer elec- For Finetech, a close partnership with allows highly-individualized machine tronics, medical technologies, telecom- the customer is paramount. With indus- configurations. Instead of acquiring munication, government-funded labs trial grade cleanroom environments, ex- another machine, new processes and and academic institutions, to support tensive design and engineering resourc- technologies can be added by retrofit- precise and complex applications: es and modern manufacturing facilities, ting the system with extension modules. 3D/MEMS/MOEMS packaging, sen- Finetech can offer a consistent service This makes a FINEPLACER® system a sor assembly, photonics packaging, flip chain from application evaluations to long-standing and future-proof invest- chip, laser bars, VCSELs, and many optimal customer-specific machine solu- ment. Each FINEPLACER® system has more. The entire spectrum of micro as- tions to operator training. been 100% designed and manufactured sembly and packaging technologies is To ensure quick response times any- in Germany, with highest production supported, including thermocompres- time, Finetech maintains direct sub- standards being guaranteed through an sion and ultrasonic bonding, adhesive sidiaries in the USA, China, Japan and ISO 9001 certified quality management. technologies, curing, soldering, bump Malaysia, providing consultation and bonding, copper pillar bonding, preci- service in global core markets. sion vacuum die bonding or laser-assisted bonding. Finetech GmbH & Co. KG FINEPLACER® sub micron die bonders Boxberger Str. 14 mainly vary in their degree of automa- D – 12681 Berlin tion, their optical resolution and sup- Phone +49 (0)30 - 936681 - 0 ported substrate and component sizes. Fax +49 (0)30 - 936681 - 144 The portfolio includes highly flexible lab Mail [email protected] bonder, high bond force systems ca- Web www.finetech.de

79 Innovations and Competencies of Companies

Competence in Micropositioning for more than 10 Years

Ultra-high precision spatial position- innovative and highly flexible ing of objects is of prime importance control systems for multiple in the emerging field of nanotechnol- axes operation. ogy. mechOnics patented new type of As a market leader for micro-/ precision-positioning technology is based nanopositioning devices we on an innovative concept that meets those continuously work on support- market demands. The ultra-compact ing our customers to achieve translation stages allow operation under reliable scientific results ambient and extreme environmental efficiently. Thus, our aim is conditions such as cryogenic tem- to open up new possibilities peratures (4 K) and ultra high vacuum ranging from scientific research environments (10-9 mbar). These features to industrial applications. present a revolutionary advancement for Linear positioners are avail- the positioning market leading to new able with travel ranges up to research in numerous areas. 50 mm for ambient temperatures and UHV applications, Applications of these outstanding for cryogenic application linear nanopositioning modules, well-known stages up to 20 mm can be in many labs around the world, include delivered. Together with the open and closed loop nanoposition- open or closed loop controllers ing stages with resolution up to 1 nm, you can reach a repeatability ultra compact 3D-positioner with up up to 1 nm over the total travel ✦✦ Linear stages up to 30 mm travel to 10 mm in travel, or monomode range. ✦✦ Ultra compact 3D-stages (travels 2 coupler for fibres, to name just a few. and 10 mm) Furthermore, they are suitable for Range of standard products ✦✦ Monomode coupler (travel 2 mm) general beam manipulation applications ✦✦ New: Multiphase Micropositioner ✦✦ Ultra low temperature stages (4 K) involving optical fibers and solid state DSP 50 with 1 nm resolution and ✦✦ Ultra high vacuum stages waveguides. 15 N driving force (10-9 mbar) The product line of mechOnics ag ✦✦ New: Nova Controller for mixing ✦✦ Mirror mounts for transmitting optics ranges from these stand-alone simple of open and closed loop stages (tilt ± 3 deg.) positioning components for laboratory (stepper motor driven and ultra-low ✦✦ Linear measuring systems (resolution applications to complete automated temperature stages can be integrat- up to 1 nm) and integrated solutions. The product ed as well) ✦✦ Handheld battery driven controller range includes ✦✦ USB-controller (open or closed loop) different sizes and travel of the mechOnics ag stages for ambient Unnuetzstr. 2/B temperature up to D – 81825 Munich low temperature Phone +49 (0)89 - 42 02 42 07 operation. Fax +49 (0)89 - 42 02 42 06 The product range Mail [email protected] is completed by Web www.mechOnics.de

80 Innovations and Competencies of Companies

Two New Modalities in X-ray Imaging with microworks’ TALINT System

Gratings of around 250 µm in height and The system can be directly installed The TALINT system’s range of possible 2.5 µm in width that use gold to absorb in existing x-ray hutches or micro-CT specifications: high-energy x-rays are the key compo- machines. It is based on precision- ✦✦ Energies from 8–50 keV; higher nents of microworks’ TALINT system. aligned gratings and holders which can energies upon request Two new x-ray imaging modalities are be moved with nanometer exactitude ✦✦ Field of view: up to 10 cm Ø (using now available to engineers and scientists: using piezoelectric actuators. The soft- bent gratings) phase-contrast imaging and dark-field ware is intuitive, producing radiographic ✦✦ Phase-stepping visibility: typically imaging. images in three modes: classic absorp- >25% tion, phase contrast and dark field. ✦✦ Minimum distance between source Gratings based on x-ray phase-contrast and detector: 50 cm imaging exploit the Talbot self-imaging Microworks provides instructions which ✦✦ Sensitivities ((G1–G2)/p2) can be effect to obtain information on the tiny make installation straightforward and customized to client‘s needs (as high angle deflections of x-rays which result simple for experienced as 250,000) from refraction and scattering. This has x-ray imaging users. Thanks to the ✦✦ Phase drift of the system: less than potential applications for a variety of quality control of the system at KIT/ 3 rad/h (for a g2-period of 4.8 µm) fields, from medical imaging to materials ANKA’s Detector Lab, Moiré fringes are ✦✦ Software: Python, to ensure easy research. Microworks’ TALINT system is readily seen at first use, and only a fine- adaptation by the user a compact, adaptable and inexpensive tuning of the alignment is required. TALbot INTerferometer designed for use. The key components of the system are x-ray absorbing gratings made by The modular system is easily adjusted microworks using the LIGA process microworks GmbH to many different specifications, includ- (LIthography, GAlvanisation [electroform- Schnetzler Str. 9 ing design energy, total setup length ing]). D – 76137 Karlsruhe and sensitivity. A two-grating setup This technique is the core competence Phone +49 (0)721- 608 - 22750 will serve for microfocus tubes, and a of microworks, and the TALINT system’s Fax +49 (0)721- 6089 - 24438 three-grating setup is used for standard performance reflects the superior quality Mail [email protected] x-ray tubes or rotating anode tubes. of these gratings. Web www.micro-works.de

From microstructure to microsystem: 1-µm thin, 50-µm high gold lamellae absorb x-rays very well (left). An intensity image of a phase grating is projected onto this absorption grating, and Moiré patterns show the mismatch of the two gratings (center). Microworks’ TALINT system provides the necessary actuators and software to use this configuration in x-ray phase-contrast and dark-field imaging.

81 Innovations and Competencies of Companies

Dr. Klaus Martin Baumgärtner MUEGGE-PLASMA SYSTEMS CEO of MUEGGE

SU-8 stripping process

SU-8 stripping challenges SU-8 Stripping Experiments

a. Deposition of an epoxy based negative resist (SU-8) up to 2 mm thick onto a carrier substrate with electrically conducting top layer

b. Lithographic exposure through a mask by parallel UV- light or X-ray from synchrotron c. Dissolving away the unexposed parts of the resist by a suitable developer

d. Galvanic deposition (electroplating) of metal into open resist structures just above the resist height

e. Uniformity after grinding and polishing to get uniform

f. Metal structure after removal (stripping) of the resist SU-8 Stripping Results

g. Metal structures (microparts) after removal of the carrier substrate

Capability of SU-8 resist SU-8 structures

Before stripping After stripping

UV exposure (e. g. i-line 365 nm) up to 400 µm height, accuracy 3 - 5 µm X-ray exposure (Synchrotron) up to > 2 mm height, accuracy 1 µm Partial stripping of SU-8 resist after Small gears after resist removal; Ni galvanic; 50 % of the resist still Gear wheels ~250 um height, SU-8 Stripping requirements present; faster resist etch rate near the ~3 mm diameter Ni surface ✦✦ fast (i.e. economical) etch rates ✦✦ etch rate independent of layer thickness ✦✦ stripping of very thick resist layers possible ( > 1 mm) ✦✦ no damage by ions (high selectivities achievable) ✦ ✦ no attack to metals Combination of lithography and galvanizing using Muegge’s Stripping Tool enables ✦✦ high aspect ratios (> 100) fast and precise production of microparts, e. g. for high end watch industries. ✦✦ no residues ✦✦ simultaneous etching of substrates with different resist thicknesses ✦✦ no overheating during stripping ✦✦ end point detection

82 Innovations and Competencies of Companies

MUEGGE GMBH Hochstraße 4–6 D – 64385 Reichelsheim Phone +49 (0)6164 - 93 07 11 Fax +49 (0)6164 - 93 07 93 SU-8 stripping technology Mail [email protected] Web www.muegge.de

Technology for SU-8 stripping SU-8 Stripping Tool STP 2020 Worldwide the new rapid reactive radicals technology shows The MUEGGE SU-8 Stripping Tool STP 2020 for MEMS- ap- for the first time the capability for stripping very thick layers of plications is the only tool in the market which enables fast dry all kinds of organic materials, like SU-8 resist or other epoxy etching of thick SU-8 resist. Unique features of the SU-8 Strip- based materials, with excellent throughput and free of resi- ping Tool STP 2020 are providing leading edge technology for dues especially at structures with high aspect ratio (e. g. LIGA dry etching of SU-8 photoresist. process). These materials are normally not strippable by wet chemicals or standard plasma etching/stripping equipment.

Remote Plasma Source (RPS) Remote Plasma Source (RPS) means a plasma is only generated and exists in the RPS itself, not in the process chamber. The microwave energy is generated by a magnetron, coupled into the waveguide and transfered into the discharge system. The microwave energy is completely dissipated within the plasma zone of the pure alumina / sapphire / quartz chamber. No microwave radiation measurable on the radicals output. STP 2020 etch process - special features The all-side water ✦✦ High etch rate (>200 um/h) on large areas (e.g. batch cooled alumina / of 5 x 6“ wafers) independent of thickness; more than sapphire / quartz 20 µm/min for small samples. plasma chamber ✦✦ Etch rates nearly independent of pretreatment like hard is the unique way bake conditions: differences in etch rate smaller than 10 % to get contamina- between no HB and 200 °C HB. tion free radicals ✦✦ Stripping of very thick (>1 mm) SU-8 resist layers for with highest ef- MEMS is possible. ficiency. ✦✦ Remote high oxygen radical output plasma source, no damage by ions, heat impact only by reaction energy. Key Elements ✦✦ No attack to metals like Ni, Ni/Fe, Au, Cu etc. ✦✦ Remote microwave plasma source with unique water ✦✦ Minimal damage to Si and Si compounds like SiO2 or cooled plasma zone composed of alumina/sapphire/quartz Si3N4. guarantees outstanding lifetime of the plasma chamber ✦✦ No organic residues; inorganic residues (i.e. decapsulation) ✦✦ Very high etch rate and low cost of ownership removable by additional cleaning step. ✦✦ High environmental compliance due to very high dissocia- ✦✦ Simultaneous etching of substrates with different resist tion of warming gases as CF4 and NF3. thicknesses possible. ✦✦ Pure chemical etching with no attack on the etching ✦✦ End point detection for each individual substrate. sample by ions; therefore high selectivity is achievable. MUEGGE STP Compact ✦✦ Dense plasma excitation leads to high amount of radical generation which is necessary to start the stripping The MUEGGE STP Compact micro- process wave plasma system is the latest and ✦✦ Remote plasma for much less thermal load in the chamber most advanced generation of MW than conventional plasma batch ashers offered today.

83 Innovations and Competencies of Companies

Optical 3D Surface Measuring Technology for Industry and Research: Accurate Profile Reproduction of the Finest Structures Thanks to Piezo Technology and Confocal Technology

NanoFocus AG, located in Oberhausen, multi-pinhole disc onto the surface. Only Germany, has been considered for many the portion of the light that is reflected years as a pioneer in optical-confocal from one point of the surface and which 3D surface measuring technology. For lies precisely in the focal distance of the rapid wide-area measurements the µsurf objective can pass the point openings systems for example work with vertical of the MPD. By rotating the MPD, the resolutions up to 1 nm, laterally up to entire sample surface can be quickly 300 nm. This means they are suitable and completely scanned. both for the lab as well as for demanding By moving the objective vertical to the industrial use (Fig. 1), such as three- sample surface, all contour lines of dimensional surface measurements in the sample are focused one after the Fig.2: 200 to 400 individual 2D images are converted into a 3D image by the measurement software. medical technology, the semiconductor other. The CCD camera used stores (Photo: NanoFocus) industry, forensics, electronics, the auto- the brightness values of the visual field mobile industry, materials management for each objective position. Points with ed to precisely meet the application and the steel industry. maximum brightness are located on one requirements, was able to be easily in- contour line. The 3D structure of the tegrated into the objective holder thanks Extremely Low-Scatter Signaling sample can be determined from the total to its compact dimensions and moves The core of each of these µsurf sys- number of images at different height the objective at a constant speed. The tems is the integrated confocal-optical intervals, this is called the image stack core requirement of the positioning filter unit that is combined with a highly (Fig. 2). system is a high velocity constancy in precise and fast focusing module. The the nanometer range. This is the only patented multi-pinhole disc (MPD) is Piezo Positioning System way absolutely accurate (down to a few used as an optical filter of reflected light for the Objective nanometers) roughness measurements rays and distinguishes itself through ex- In order to achieve such a high mea- can be taken that are compatible with tremely low scatter light intensity as well surement resolution, the objective must tactile processes and meet the require- as robust signaling with a high light yield. be moved in the direction of the z axis ments of the corresponding industrial The objective focuses light from a high- with great precision. “The positioning norms. Repeatability is just as important performance LED source through the system for our objective is therefore when positioning the objective, so as to based on piezo actuators. They work prevent a height offset when assessing free of wear and friction with zero play the stack of individual images. and they are suitable for high record- ing frequencies due to their dynamics,” explains Dr. Georg Wiora, responsible for strategic development and innovation management at NanoFocus. Zero Physik Instrumente (PI) play and highly precise flexure guides GmbH & Co. KG together ensure high focus stability. Auf der Roemerstrasse 1 The piezo-based, single-axis positioning D – 76228 Karlsruhe system used in the µsurf system origi- Phone +49 (0)721 - 4846 - 0 Fig.1: The optical 3D surface inspection is ideal nates from the comprehensive product Fax +49 (0)721 - 4846 - 1019 both for the lab as well as demanding industrial use, e.g. for checking paint appearance in the automotive portfolio of the Karlsruhe-based compa- Mail [email protected] industry. (Photo: NanoFocus) ny PI (Physik Instrumente). It was adapt- Web www.pi.ws

84 Innovations and Competencies of Companies

Optical Measurement Tools for State-of-the-Art Microstructure Development and Testing

Precise experimental characteriza- System Analyzers allow for an easy and WAFER-LEVEL PRODUCTION TESTING tion of micro-devices such as MEMS highly productive data exchange with Wafer-level testing can save money by is increasingly important in research FEM systems. the early characterization and separa- and development as well as for routine tion of bad devices prior to packaging. measurements at wafer-level. Optical IMPROVING MEMS RELIABILITY For this task the MSA-500 can eas- interferometric measurement systems It is very important to determine reliability ily be integrated into automated and are the tools of choice for determining under mechanical excitation, radiation, semi-automated probe stations. Fast properties as resonance frequencies, temperature, humidity and pressure measurement allows high throughput damping, transfer functions, deflection stress by targeting the device inside an and is an important tool to monitor the shapes, transient response and also environmental or vacuum chamber. The manufacturing process. static topography. Polytec MSA-500 Micro System Ana- For dynamic measurements Laser Dop- lyzer has a stand-off distance that allows STUDYING MICROACOUSTICS pler Vibrometry is well established as the researcher to characterize static IN THE GHZ-REGIME the standard method because the entire and dynamic behavior under specific Combining micro- and nanotechnology frequency spectrum is obtained in real environmental conditions and can be with ultrasonic actuation, engineers time, without contact, phase-resolved easily interfaced to vacuum or pressure need new methods and instruments for and with resolution down to the sub- chambers and probe stations. characterizing mechanical responses pm-range for both OOP and IP motion. up to the GHz frequency regime and Therefore transient response, settling FIND PARAMETERS RELEVANT displacements in the pm range. Laser- characteristics and indeed any vibration TO MANUFACTURING based, non-contact optical testing is waveform, not just periodic motion, can Information about current process the best choice since it avoids mass be investigated very quickly and easily. parameters and their impact on dimen- loading from direct contact. Polytec’s sions and material parameters of the award-winning UHF-120 Vibrometer can VALIDATION OF SIMULATION MODELS MEMS devices is needed to control the characterize the out-of-plane vibrations MEMS researchers use various en- manufacturing process. For instance, at such ultra-high frequencies, featuring gineering tools to take a design from when silicon-on-insulator technology a measurement bandwidth up to 1.2 GHz. concept to simulation, prototyping and is used to build three-dimensional testing. Simulation models are validated micro-machined sensors and actuators, Dr. Heinrich Steger and fine-tuned through comparisons topographic analysis is critical to their Polytec GmbH with precise experimental data. By using development. White-light interferom- Polytec-Platz 1-7 light as the probe, the measurement etry, available from Polytec as system D – 76337 Waldbronn procedure has virtually no influence on option or stand-alone solution, provides Phone +49 (0)7243 - 604 - 0 the MEMS device. Extensive data import these data quickly and reliably with high Mail [email protected] and export functions in Polytec’s Micro accuracy and precision. Web http://www.polytec.com/mems

85 Innovations and Competencies of Companies

Networks between Research and Industry

86 Netzwerke zwischen Forschung und Industrie Networks between Research and Industry

ZVEI - German Electrical and Electronic Manufacturers´ Association

Micro-electro-mechanical systems young technology by partnering (MEMS) are intelligent miniature in the pre-competitive phase. products combining materials, com- The ZVEI - Electronic Compo- ponents and functions. They are used nents and Systems Division for processing data and are also con- hosts an own industry group for nected to their natural environment MEMS technology which is an through sensors and actuators. ideal platform for the representatives of the branch to share Germany has a leading posi- © First Sensor experience and to be kept up tion in the MEMS world market. to date with the latest develop- Control and automation requirements. Furthermore the group ments particularly with regard to the develops position papers in megaproject „Industrie 4.0“ and to order to advise involved deci- automotive customers are steadily sion makers about the position increasing and the intensified use of of the industry. The efficiency of MEMS in medical applications will the ZVEI in this respect is indeed further foster this development. Also a valuable asset. The partner smart grids, smart buildings etc. organisations AMA Association are not imaginable without MEMS © First Sensor for Sensor Technology and IVAM technology. Microtechnology Network further MEMS contribute significantly to strengthen the cooperation of all the competitiveness of the German companies related to MEMS. industry and enable and secure future-oriented jobs in Germany. Furthermore, this makes it The MEMS companies within possible to transport nationally the ZVEI - German Electrical and generated content in a larger, Electronic Manufacturers´ Associa- international context through the tion confirm thepositive outlook. pro-active input of our member- The group of companies represents ship on European level. leading automotive suppliers, semi- The many success stories conductor manufacturers, MEMS underline the strong activities of suppliers and small and medium © X-FAB the association for and together sized companies. with the member companies and show the great importance of the The group activities of the ZVEI association for the industry. membership focus on the development of basic technologies and tools representing key drivers for innovation. The aim of these activities is to further strengthen microsystem technology in Germany and to facilitate a sustainable growth of this © Infineon

88 Networks between Research and Industry

ZVEI - Zentralverband Elektrotechnik- und Elektronikindustrie e.V.

Die Mikrosystemtechnik verknüpft Zulieferern und Halbleiterunternehmen nik interessierten Unternehmen weiter Materialien, Komponenten und Funktionen auch industrielle Mikrosystemtechnik- gestärkt. zu intelligenten miniaturisierten Gesamt Anbieter bis hin zu hoch spezialisierten Darüber hinaus können national erarbei- systemen. Diese dienen der Informations Klein- und Mittelstandsunternehmen tete Verbandsthemen auch im interna- verarbeitung und sind zudem über (KMU). tionalen Kontext durch die Aktivität der Sensoren und Aktoren mit der natürlichen Mitgliedsfirmen auf europäischer Ebene Umgebung verbunden. Im Vordergrund des Verbandsenga- verfolgt werden. gements steht das Ziel, die Basistech- Die Erfolge engagierter Verbandsar- Deutschland hat im Bereich der Mikro nologien und Werkzeuge gemeinsam beit, welche zusammen mit und für die systeme eine führende Position auf dem weiterzuentwickeln sowie Innovation zu Mitgliedsunternehmen erzielt wurden, Weltmarkt. Der zunehmende Regelungs- unterstützen. Ziel ist es, eine weitere zeigen den Nutzen der Verbandsaktivität und Automatisierungsbedarf, insbe- Stärkung der Mikrosystemtechnik für die Industrie. sondere angesichts des Megaprojekts in Deutschland und das langfristige Industrie 4.0 und in der Automobiltech- Wachstum dieser noch jungen Technik nik sowie der vermehrte Einsatz von im vorwettbewerblichen Umfeld partner- Mikrosystemen in der Medizintechnik schaftlich zu fördern. wird diese Stellung weiter fördern. Auch Der ZVEI bietet hierzu mit der Fachgrup- Smart Grids, Smart Buildings etc. sind pe Mikrosystemtechnik im Fachverband ohne Mikrosystemtechnik nicht vorstell- Electronic Components and Systems bar. eine geeignete Plattform, die den Die Mikrosystemtechnik leistet somit ei- Vertretern der Branche einen intensiven ZVEI - Zentralverband Elektrotechnik- nen wichtigen Beitrag zur Wettbewerbs- Erfahrungsaustausch ermöglicht. Hier und Elektronikindustrie e.V. fähigkeit der deutschen Industrie und werden Positionspapiere erarbeitet, Fachverband Electronic Components ermöglicht die Schaffung und Sicherung die wirkungsvoll bei politischen Entschei- and Systems zukunftsorientierter Arbeitsplätze in dungsträgern platziert werden. Hierbei Christoph Stoppok, Geschäftsführer Deutschland. konnte sich der ZVEI als Vertreter der Lyoner Straße 9 Dieses positive Bild bestätigen die im Branche bewähren. Durch die Partner D – 60528 Frankfurt am Main ZVEI - Zentralverband Elektrotechnik- „AMA Fachverband für Sensorik e.V.“ Phone +49 (0)69 - 6302 - 276 und Elektronikindustrie e. V. organisier- und „IVAM e.V. Fachverband für Mikro- Fax +49 (0)69 - 6302 - 407 ten Mikrosystemtechnikunternehmen. technik“ wird die Zusammenarbeit aller Mail [email protected] Hierzu gehören neben großen Kfz- in Deutschland an der Mikrosystemtech- Web www.zvei.org

89 Networks between Research and Industry

VDMA The German Engineering Federation

Micro cameras in cell phones, magnetic affordable products it is necessary that the respective sector industries. The field and location sensors in playstations, production technology takes those new association develops joint activities be- micro pumps for insulin and touch sensi- markets into consideration and spurs tween both Sector Groups and with the tive surfaces are available already today. development together with manufactur- Organic Electronics Association (OE-A), The “Internet of Things”, video contact ers and material suppliers. VDMA Photovoltaics Equipment as well lenses, nano robots, lab-on-a-chip, In order to meet production require- as with VDMA Battery Production. mentally operable prostheses, autono- ments of the manufacturers in the future mous driving, and self-organizing produc- it was necessary to constantly take on Productronics and Micro Technologies tion (“Industry 4.0”) are demonstrated new technological developments. in Detail: product developments with a high future VDMA acted accordingly and founded From highly specialized controllers in market potential. new divisions: Displays in 2000, Or- automotive applications to tablet PCs ganic Electronics in 2004, Photovoltaic as a mass product: Electronics produc- They all combine sensors, actuators and Equipment in 2007 followed by Battery tion equipment enables high-tech for wireless connections with data process- Production in 2011. Although VDMA everyone. “Productronics” is a common ing, power supply, display systems Productronics and VDMA Micro Tech- term for these machines, systems, and storage devices and appear in nology had occasionally cooperated in materials and components used for two high-tech sectors: micro and nano the past it became necessary to join electronics production. Semiconductor electronics as well as micro and nano forces for the benefit of our members chips and highly integrated electronic technologies. In the past, those two and their customers. assemblies are two main product cat- sectors have developed side by side. egories. In the meantime, however, they have In 2014 VDMA therefore founded the As production processes in elec- merged increasingly. System integra- Sector Association “Electronics, Micro tronics manufacturing are becoming tion is the magic word – it enables and Nano Technologies (EMINT)”, increasingly interchangeable all over the more miniaturization and creates higher gaining synergies from the Sector world, companies can maintain their product diversity. Groups Productronics (Electronics competitive position only by enhanc- Production) and Micro Technologies ing their automation. Industry 4.0 – the Therefore, research and industry join (micro products and micro production intelligent, adaptable automation made forces in order to align the develop- technology). The Sector Groups define in Europe – electronics enables it and ment of both sectors. In order to provide and realize custom-made activities for benefits from it at the same time.

Fig.1: PCB with Camerasensor Source: Westend61 bei fotolia

Fig.2: Soldering machines finalize the assembly of components on printed circuit boards. Source: kurtz-ersa Group

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of the benefits and the potentials of micro technology is recognized from the different application fields. The wide- ranging usage of these components and subsystems in the different fields of the engineering sector, and this is true for many others technology sectors, is growing. A great potential of opportunities is offered by micro technologies. For small and medium sized companies. For large groups. For service providers. For manufacturers.

Benefits for users everywhere Miniaturisation has gained its place as successful strategy for modern technologies. Developers all over the globe expect benefits in terms of energy, materials and space savings. As more and more the competence for solving Fig.3: Source: VDMA Micro Technologies problems, the suitability for industry, quality standards, the performance and Only innovative production technologies Micro Technologies - opportunities creativity plays a important part, shows can ensure recyclable, eco-friendly and and potentials that the productronic and microtech- long lasting products. Machines and The modern world was expanded by nology industries contribute a growing production equipment are pacemakers micro technologies which pave the way share of value added. for both, ecology and economy. VDMA to new -hence unknown -realms of EMINT is member of “BlueCompetence” feasibility. Altogether new applications Furthermore the nationally gener- – the sustainability initiative of the Ger- of existing products become possible in ated content of VDMA EMINT can be man engineering industry. the capital goods, pharmaceutical, life transferred via the VDMA network on The complexity of products and produc- science industries, medical technolo- the European level. The European and tion processes in electronics has led gies, precision engineering, automotive international activities of our member to a strong specialization among the engineering, electrical and electronics companies are supported by VDMA machine makers. Our small and medium industries, information and communica- offices located in Japan, China, India, sized member companies concentrate tion technology, to name only a few. Russia , Brazil, Berlin and Brussels. on specific types of machines covering VDMA Electronics, Micro and Nano a large scale of electronics’ segments The usage of micro technologies is Technologies (EMINT) is one of the 38 and customers’ markets. In some areas broadening every day: The technology Sector Associations within VDMA. even suppliers of turn-key factories have gets a partner, the Market-Pull. This been established. trend will continue, as more and more

Fig.4: Assembly VDMA of Micro Annular Electronics, Micro and Nanotechnologies Gear Pumps (EMINT) Source: HNP Mikrosysteme Thilo Brückner GmbH Dr. Eric Maiser Klaus Zimmer Lyoner Str. 18 D – 60528 Frankfurt am Main Phone +49 (0)69 - 6603 - 1130 Fax +49 (0)69 - 6603 - 2130 eMail: [email protected] Web: emint.vdma.org

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Sensors and Measurement: Tiny Smart Devices Keep Up Big Advances

The demand for intelligent devices continues to grow worldwide. Produc- tion costs and energy consumption are supposed to drop, while product quality is to improve. Microsystem, sensor, and measuring technologies need to cope with this challenging demand. The AMA Association for Sensors and Measure- ment (AMA) reckons that the number of sensors applied in this area will double every five years.

Challenges and Opportunities The Internet of Things, Industry 4.0, and the Digital Agenda can hardly be implemented without an intelligent microsystem technology, state-of-the art sensors, and capable measuring systems. Today’s microsystems are smart, networked, and energy autonomous – and Fig.1: © AMA/B.Oertwig: Protecting what we hold dear – sensors see what we do no certainly more than just another component. In fact, they have transformed into and the importance of signal processing measuring systems need to provide independent nodes in intelligent sys- is ever-increasing. Measuring technol- reliable data in real-time and without the tems, such as sensor networks. Thanks ogy, as a facet of automation, must need for maintenance, recalibration, or to continued miniaturization, ever new meet extremely high requirements, readjustment, and they must be capable areas of application are being opened filter relevant data, and deliver results of autodiagnosis. on the way to an intelligent environment. in real-time. Sensors are getting faster Future-oriented projects, such as Smart sensors can perform self-diagno- and faster and even have integrated “Industry 4.0” and the “Internet of ses, they encapsulate the complexity of system knowledge. Such sensors and Things,” let the traditional walls between sophisticated systems, and are capable the branches of industry crumble and of a much improved level of commu- considerably transform the value-chain nication. Thus the increased flexibility processes. For developers and suppli- and autonomy attained, in turn enables ers of sensors and measuring equip- autonomous machines to communicate ment, these changes offer infinite new with other machines. Hence, sensors challenges and opportunities to master and sensor systems can be considered the intrinsic complexities. This drives the as the sensory organs of industry: With- demand for smart sensors. out these sensors, machines would stay deaf and blind. The AMA Association has noted that Fig.2: © AMA/B.Oertwig: Greater safety in traffic – imaging technologies are on the rise, sensors and measuring systems for intelligent driver miniaturization is continuing its advance, assist and traffic control systems for safer travel

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Fig.3: © AMA/B.Oertwig: Sensors and measuring technology paves the way for electric cars and vehicle networks The Sensor and Measurement Industry is Growing and Investing The AMA estimates that there are approximately 2,500 suppliers on the Ger- man sensor and measurement market. This segment of industry comprises suppliers, distributors, engineering con- sultants, specialized service providers, and research institutes. It has 250,000 employees – mostly highly qualified professionals – and a turnover of 35 billion euros per year.

According to a statistics poll among AMA members on the economic development, the sensor and measurement industry had a growth in revenue of eight percent in 2014. This result shows the increasing demand for sensor and measuring technology. Exemplary is the industry’s research and development Networking and Exchanging Information scientific Open Access Journal, the area. The mostly small and medium- The AMA Association for Sensors Journal of Sensors and Sensor Sys- sized enterprises are investing an aver- and Measurement is the network and tems with the latest research results in age of ten percent of their revenue in representative of the interests of the sensor and measuring technology. Last research and development, making the key industry: sensor, measuring, and not least, the Association sponsors the sensor and measuring branch one of the testing technology. The AMA can call yearly AMA Innovation Award and offers most innovative industries. on the know-how of its 480 members comprehensive training opportunities in in industry and research. It cultivates an sensor, measuring, and microsystem Sensors and measurement technology exchange of information among supplier, technologies. from German-speaking countries are researcher, and user industries. considered worldwide as leading with a The AMA offers all participants a network share of just about thirty percent of the with a broad communication platform: world market. The tiny smart devices are The AMA’s annual SENSOR+TEST trade AMA Verband für Sensorik a German export success: Sixty percent fair invites all to take part its Innovation und Messtechnik e.V. of these sensors “made in Germany” Dialog. The AMA Centers for Sensors Sophie-Charlotten-Str. 15, are used domestically, 40 percent go and Measurement represent the industry D – 14059 Berlin to the rest of the world. However, if we at other major fairs in Europe and Phone +49 (0)30 - 2219 0362 - 0 include all the sensors that are already overseas. Biannually, the AMA Science Mail: [email protected] integrated in exported machines and Board invites professionals from industry Web www.ama-sensorik.de systems, the export quota for sensors and research to discuss current topics www.ama-science.org and measurement attains almost 80 and publishes its studies in SENSOR- www.journal-of-sensors- percent. TRENDS. The AMA also publishes the and-sensor-systems.net

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IVAM Microtechnology – International High-tech Network

IVAM Microtechnol- many marketable products are already ogy Network, being in use. The market for medical devices an international has experienced a rapid upswing in high-tech associa- recent years. More than 70% of IVAM’s tion, has been sup- members deal with this issue and are porting companies looking for appropriate marketplaces to and institutions sell their products. from all around the world for more Business platforms at medical technology than 20 years. The trade fairs worldwide central mission of High-tech solutions for the medical the association is device industry are bundled on the IVAM to create synergies Product Market “High-tech for Medical and to support Devices” at the COMPAMED fair in Dus- its members in seldorf. The exhibition has constantly exchanging knowl- grown in recent years and became one edge, initiating of the leading international marketplaces joint projects and Hannover Messe fair for suppliers of medical manufacturing. networking with each other and potential customers. cross-cutting technologies that are indis- At the MD&M West, the world’s largest IVAM uses targeted technology market- pensable for the future implementation trade fair for design and manufacturing ing activities to speed up the implemen- of innovations. in medical technology, held annually in tation of innovative ideas into market- Since the 1990s, microtechnology has February in California, IVAM organizes able products. Further activities include been transforming to become more and the special exhibition area MicroNano- lobbying, market analysis and the more application-oriented. The applica- tech and is thereby offering an opportu- continuous development of international tions are as diverse as the technologies nity for its members to step into the US markets. Furthermore, IVAM strength- themselves. They include applications medical market. ens cooperation between industry and in the fields of logistics, transport or research in order to promote the transfer consumer goods, environmental and en- Even Latin America offers great potential of technology, to make the high-tech ergy technology, mechanical and plant for medical technology manufacturers. industries globally competitive and to engineering as well as optimization of Brazil, for example, is one of the largest create and secure jobs in the field of production processes for almost every economies in South America with the new technologies. industry. highest potential for companies in the IVAM promotes the dissemination of healthcare market. In May 2016, São Microsystems technology in a state of applications of KET e.g. by informing Paulo will once again host the HOS- transition – focus on application areas the public about the possibilities of new PITALAR, Latin America’s largest and Microtechnology and related technolo- technologies. For this reason, IVAM most important trade fair for medical gies such as nanotechnology, advanced observes developments and changes technology. The main topics are medical materials, optical technologies, organic of technologies and markets and is thus devices, equipment, services and tech- electronics, systems integration or addi- able to adapt its activities to trends nologies for the health care sector. IVAM tive manufacturing are the so-called Key In particular in the field of healthcare, organizes a joint pavilion at HOSPITALAR Enabling Technologies (KET) – essential biomedicine and the AAL technologies, as well.

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Dr. Thomas R. Dietrich

COMPAMED fair

The range of technologies presented ogy. Optical processes, e.g. in minimally At the industrial fair HANNOVER MESSE by IVAM’s members at these medical invasive procedures or imaging, have the IVAM members present innovations technology fairs all over the world covers proven to be particularly low-risk and that make it possible to greatly increase miniaturized components, functional ma- patient-friendly. Miniaturized optical sen- the efficiency and speed of industrial terials and high-precision processes that sors make measuring and evaluating processes, enhance the reliability and will improve cost-effectiveness, safety blood levels such as blood glucose pain quality of industry products while at and reliability of medical technology free, laser beams reduce bleedings in the same time reducing costs. High- products in the future, e.g. in the manu- surgical incisions and high-tech micro- precision micro solutions already play facture of mobile analysis, treatment scopes determine the perfect, personal- an important role in industrial automa- and monitoring devices. Manufacturing ized fit for implants. tion – a key aspect of automated and wearable devices requires miniaturized integrated industry. sensors that reliably and continuously Promising applications in industry and deliver accurate readings. This way, vital building technology signs can be monitored with devices In addition to the already established directly on the body, e.g. in-ear or at the applications in the field of medical wrist. technology, further application fields of IVAM Fachverband für Mikrotechnik micro- and nanotechnology are currently Dr. Thomas R. Dietrich Enabled by continuously increasing particularly promising. In the area of Mona Okroy-Hellweg requirements for reliability and precision “smart homes”, high efficiency in heating Joseph-von-Fraunhofer-Straße 13 in medical diagnostic and therapeutic and power supply, autonomous energy D – 44227 Dortmund devices, the topics biophotonics, laser production, increase of comfort and Phone +49 (0)231- 9472 - 168 technology and micro-optics are also safety, information and entertainment are Mail [email protected] gaining a foothold in medical technol- goals of current technical developments. Web www.ivam.de

95 Networks between Research and Industry microTEC Südwest The Cluster for Smart Solutions

Smart Production Smart Health

The cluster microTEC Südwest is locat- is also further fostered. In our focus Cyber-physical ed in the state of Baden-Württemberg areas we present some samples as production systems in the southwest of Germany, one of follows: Miniaturized sensors and actuators will Europe’s high-performance areas of sci- play a central role in the development ence and industry. The cluster, with its ✦✦ Smart Production of cyber-physical production systems over 380 cluster partners, is one of the Intelligent workpiece carriers – which can be used as intelligent, net- largest technology networks in Europe. Carl Zeiss 3D Automation GmbH, along worked and autonomous sub- or overall The microTEC Südwest cluster has won with a consortium of R&D partners, systems in manufacturing or in logistics the Spitzencluster (leading-edge cluster) component manufacturers and system (“Industry 4.0”). competition launched by the German providers, has developed an intelligent Federal Ministry of Research and Educ- workpiece carrier system equipped with ✦✦ Smart Health tion (BMBF) in 2010. In 2012 the quality its own intelligence and interfaces to the Quick diagnostics label “Cluster-Exzellenz Baden-Württem- outside world. Roche Professional Diagnostics devel- berg” was given to microTEC Südwest oped an “intelligent” in-vitro cartridge for for outstanding cluster management. Intelligent service robots better test efficiency in the field of in-vitro This award officially includes the Gold Festo AG & Co. KG has developed diagnostics. In addition, members of Label on a European level. miniaturized 3D optics for a modular the cluster are working on detectors for robot system. In the future, intelligent viruses and metastasizing cancer cells. Progress, trends and developments products and workpiece carriers will The cluster microTEC Südwest focuses communicate with the machines in their Intelligent implants on the application areas of Smart vicinity as cyber-physical production The “CorTec Brain Interchange” of Cor- Production, Smart Health, Smart Energy systems (CPPS) and will partially control Tec GmbH connects the human brain and Smart Mobility. These fields have the manufacturing system autono- with an intelligent microsystem: a high- special potential for microsystems tech- mously. The ability of intelligent systems performance closed-loop technology nology and high potential with regard to communicate independently with a can measure and influence brain activity to world markets and innovation. Not user, with other intelligent systems or in long-term service. only do new partnerships arise with a even between functional groups within Retina Implant AG developed the retina quicker exchange of knowledge, but a a single system will be a major contri- chip “Alpha IMS”, the first subretinal positive climate for company founding bution to realizing the vision of “Indus- implant to receive marketing rights in as well. Economic growth in the region try 4.0”. Europe. Cicor has produced a flexible

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Smart Mobility Smart Energy antenna coil for the sensor. It sup- nance of photovoltaic power plants to tion processes, surfaces and smart ports the transmission of the data and monitor the functions of all photovoltaic systems. provides power to the micro sensor modules in plants individually and eco- The cluster microTEC Südwest has also for the wireless intraocular pressure nomically. built up strategic partnerships across measuring. national borders to set-up research and Energy efficiency innovation projects in Europe. Further- ✦✦ Smart Mobility Precision Motors Deutsche Minebea more, the cluster offers various market- Mobility: resource-saving GmbH utilizes the difference in tempera- ing and sales activities. The competen- and low in emissions ture between the heating element and cies in the region can be accessed on Sensors that measure internal cylinder the room to produce electrical energy the “Kompetenzatlas”, a smart search pressure promise more efficiency and and in this way can save 20% to 30% in engine that provides complete profiles therefore optimal combustion methods. energy. of institutions, small and large compa- These sensors must be robust as well nies, start-ups as well as institutions and as reasonably priced. And that is exactly microTEC Südwest in a Nutshell universities that are working in the field of what silicon carbide technology offers The cluster microTEC Südwest brings microsystem technology. and it is being further developed for use together industry, research and poli- in motor vehicles. tics. It connects experts to ensure the ongoing development of different Safety in traffic technologies. Thus, innovations can be Bosch is involved in research of solu- formulated and actioned. The microTEC tions which allow the generation of real- Südwest cluster does this by promot- time maps that display vacant parking ing the transfer of technological and spaces to detect if a car is on a parking application-oriented know-how by place or not. special interest groups. These groups microTEC Südwest e.V. point out developments in microsystem Emmy-Noether-Straße 2 ✦✦ Smart Energy technology and their effects on German D – 79110 Freiburg Energy monitoring industry and deal with the following the- Phone +49 (0)761 - 386909 - 0 SmartExergy WMS has developed radio matic focal points: Printing technologies, Fax +49 (0)761 - 386909 - 10 modules for more efficient, decentralized energy supply, intelligent implants, in Mail [email protected] cost-efficient monitoring and mainte- vitro diagnostics, cooperative innova- Web www.microtec-suedwest.com

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The Stage is set for Micro Photonics 2016 in Berlin

With the micro photonics the Berlin- projects, products and systems. Parallel Brandenburg Photonics Cluster has with the micro photonics preview event a new market place for its broad the first Biophotonics Symposium, spectrum of innovative products at organised by the European Photonics the interface of microsystems and Industry Consortium (EPIC), an important optical technologies. partner of micro photonics, took place in adjacent rooms. At the micro photonics prevíew Jose Pozo, director of EPIC, responsible event, which came to a close on for technology and innovation: 27 of November in Berlin, the focus ”This was a high-level exchange was on the latest research findings Source: Ferdinand Braun Institute between members of industry and sci- in the field of microphotonics and ence, due to the EPIC Symposium and biophotonics as well as their uses in micro photonics preview event taking industry and medicine. 250 special- place at the same. ists from 20 countries participated in the plenary sessions, poster ses- First micro photonics from 11 to 13 Octo- sions and networking events on the ber 2016 in Berlin Berlin Exhibition Grounds. In addition The first edition of micro photonics will to leading researchers, university take place on 11 to 13 October 2016 at lecturers and industry representatives Berlin ExpoCenter City, after which this from Europe, experts from Australia three-day trade fair and conference will and Japan were also among the take place annually. micro photonics is speakers. organised by Messe Berlin in associa- Source: TOPTICA Photonics tion with Berlin Partner für Wirtschaft und Professor Dr. Popp, scientific chair of Technologie GmbH, the K.I.T. Group the micro photonics preview event: and other partners. “The micro photonics preview event www.micro-photonics.de definitely more than fullfilled all our high expectations, and created a desire for more. It means we are very much looking forward to the first regular micro photonics next year and will be doing Gerrit Roessler our best to put together a compre- Cluster Manager Photonics hensive and fascinating biophotonics Berlin Partner for Business Source: Messe Berlin event in 2016.“ An internationally and Technology renowned scientist and university Fasanenstr. 85 lecturer, Professor Popp is director Besides offering an outstanding programme D – 10623 Berlin of the Institute of Physical Chemistry of congress events the preview event was Phone +49 (0)30 - 46302 - 456 at Friedrich Schiller University in Jena a marketplace with many opportunities for Mail [email protected] and the science head of the Leibniz networking, where companies and institutes Web www.berlin-partner.de Institute of Photonic Technology. presented their latest research findings, www.photonics-bb.com

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DORTMUND Top Location for Micro- and Nanotechnology!

At the heart of it all: We are here to help: Excellent prospects: Anyone looking to achieve big things As an industry expert for micro- and Micro- and nanotechnology is a key with microtechnology is certainly at nanotechnology, I am your contact technology of the 21st century. Boasting the right place in Dortmund. The city within the City of Dortmund Economic technological diversity, it is making a sig- is leading the way across in Europe in Development Agency. We combine nificant contribution towards developing the development and industrial use of urban, economic and scientific dynam- solutions for the future challenges facing micro- and nanotechnology, with its local ics to form strong sectors. In addition to society and towards continued growth. cluster creating a unique environment for micro- and nanotechnology, this involves Be a part of this success story. And growth and settlement. logistics, biotechnology, ICT, efficiency make full use of the advantages Dort- ✦✦ 45 companies with approximately technology, production management, mund has to offer you! 2,600 employees and a skilled work- health care, creative industries and eco- ✦✦ Innovative technological location force rate quota of 85% - and rising. nomic services. with many world market-leaders and ✦✦ MST.factory dortmund - the compe- specialist suppliers as well as strong tence center for micro- and nano- Benefit from our industry expertise and networking for crosscutting issues. technology is located here. diverse activities that promote Dortmund ✦✦ Support for technology transfer be- ✦✦ Scientific expertise – thanks to the as a business location. This involves: tween scientific establishments and city’s renowned research and devel- ✦✦ Setting the stage for Dortmund’s companies in the region. opment centers. stakeholders to network on a local ✦✦ Effective network in the science and ✦✦ Headquarters of the international and regional level, as well as facilitat- business communities to support IVAM Microtechnology Network. ing the close integration of neigh- both startups and established com- ✦✦ Well-qualified specialist staff through bouring sectors. panies. sector-specific training programs and ✦✦ Presenting this location’s technologi- ✦✦ Support from the City of Dortmund university courses. cal expertise in specialist media, at Economic Development Agency congresses and at major internation- together with its partners from the al fairs Discover what the micro- and worlds of science, business and nanotechnology sector in Dortmund economics. has to offer you! Talk to us!

Michaela Franzes City of Dortmund Economic Development Agency Töllnerstraße 9–11 D – 44122 Dortmund Phone +49 (0)231 - 5029211 Mail [email protected] Web wirtschaftsfoerderung- dortmund.de

100 DORTforschen Und vom Know-How-Transfer mit der Wirtscha pro tieren

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