Isotope Products Reference & Calibration
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Bioorganometallic Technetium and Rhenium Chemistry: Fundamentals for Applications
RadiochemistRy in switzeRland CHIMIA 2020, 74, No. 12 953 doi:10.2533/chimia.2020.953 Chimia 74 (2020) 953–959 © R. Alberto, H. Braband, Q. Nadeem Bioorganometallic Technetium and Rhenium Chemistry: Fundamentals for Applications Roger Alberto*, Henrik Braband, and Qaisar Nadeem Abstract: Due to its long half-life of 2.111×105 y, technetium, i.e. 99Tc, offers the excellent opportunity of combin- ing fundamental and ‘classical’ organometallic or coordination chemistry with all methodologies of radiochem- istry. Technetium chemistry is inspired by the applications of its short-lived metastable isomer 99mTc in molecular imaging and radiopharmacy. We present in this article examples about these contexts and the impact of purely basic oriented research on practical applications. This review shows how the chemistry of this element in the middle of the periodic system inspires the chemistry of neighboring elements such as rhenium. Reasons are given for the frequent observation that the chemistries of 99Tc and 99mTc are often not identical, i.e. compounds accessible for 99mTc, under certain conditions, are not accessible for 99Tc. The article emphasizes the importance of macroscopic technetium chemistry not only for research but also for advanced education in the general fields of radiochemistry. Keywords: Bioorganometallics · Molecular Imaging · Radiopharmacy · Rhenium · Technetium Roger Alberto obtained his PhD from the Qaisar Nadeem got his PhD from the ETH Zurich. He was an Alexander von University of the Punjab Lahore, Pakistan. Humboldt fellow in the group of W.A. He received the higher education commission Herrmann at the TU Munich and at the (HEC, Pakistan) fellowship during his PhD Los Alamos National Laboratory with and worked in theAlberto group, Department A Sattelberger. -
Sn95/Sb5 – Organic Acid 3% Core
Technical Data Sheet Sn95/Sb5 – Organic Acid 3% Core NOMINAL COMPOSITION Tin 94% Min Lead 0.1% Max Arsenic 0.01% Max Antimony 4.5% 5.5 Cadmium 0.005% Max Iron 0.04% Max Copper 0.08% Max Aluminum 0.005% Max Zinc 0.005% Max Silver 0.015% Max Bismuth 0.15% Max Flux – 3% Organic Acid Core by weight PHYSICAL PROPERTIES Solder Alloy Color White Melting Point (Solidus) 450°F (233°C) Flow Point (Liquidus) 464°F (240°C) Specific Gravity 7.26 Density (Lbs/in3) 0.263 Bulk Room Temperature Tensile Strength (PSI) 5,900 Flux Type Water Soluble Organic Acid Physical State Solid Melting Point 250°F (120°C) Chloride Content 4% SOLDERING CHARACTERISTICS Sn95/Sb5 is a general-purpose solder used in applications involving soldering of copper and copper alloys and/or ferrous base alloys where use of lead containing solder is not permitted. This soft solder may be used in applications involving higher service temperatures. Typical applications for this alloy include copper components in air conditioning industry. This alloy is also recommended in applications involving food handling or drinking water components where use of lead containing alloys is not permitted. Antimony bearing alloys are not recommended in soldering of brass parts due to formation of a brittle Sb-Zn inter-metallic. This flux-cored solder can be used on difficult to solder materials where rosin based fluxes and electronic grade organic fluxes are not strong enough. It has been used effectively in many non-electronic applications such as lamps, fuses, and jewelry. The flux is active on copper, brass, bronze, steel, nickel, and stainless steel. -
Low Melting Temperature Sn-Bi Solder
metals Review Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics Hyejun Kang, Sri Harini Rajendran and Jae Pil Jung * Department of Materials Science and Engineering, University of Seoul, 163, Seoulsiripdae-ro, Dongdaemun-gu, Seoul 02504, Korea; [email protected] (H.K.); [email protected] (S.H.R.) * Correspondence: [email protected] Abstract: Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutectic Sn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed. Keywords: low-temperature solder; Sn-58wt%Bi; melting temperature; microstructure; mechani- Citation: Kang, H.; Rajendran, S.H.; cal property Jung, J.P. Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical 1. Introduction Characteristics. Metals 2021, 11, 364. -
The Development of the Periodic Table and Its Consequences Citation: J
Firenze University Press www.fupress.com/substantia The Development of the Periodic Table and its Consequences Citation: J. Emsley (2019) The Devel- opment of the Periodic Table and its Consequences. Substantia 3(2) Suppl. 5: 15-27. doi: 10.13128/Substantia-297 John Emsley Copyright: © 2019 J. Emsley. This is Alameda Lodge, 23a Alameda Road, Ampthill, MK45 2LA, UK an open access, peer-reviewed article E-mail: [email protected] published by Firenze University Press (http://www.fupress.com/substantia) and distributed under the terms of the Abstract. Chemistry is fortunate among the sciences in having an icon that is instant- Creative Commons Attribution License, ly recognisable around the world: the periodic table. The United Nations has deemed which permits unrestricted use, distri- 2019 to be the International Year of the Periodic Table, in commemoration of the 150th bution, and reproduction in any medi- anniversary of the first paper in which it appeared. That had been written by a Russian um, provided the original author and chemist, Dmitri Mendeleev, and was published in May 1869. Since then, there have source are credited. been many versions of the table, but one format has come to be the most widely used Data Availability Statement: All rel- and is to be seen everywhere. The route to this preferred form of the table makes an evant data are within the paper and its interesting story. Supporting Information files. Keywords. Periodic table, Mendeleev, Newlands, Deming, Seaborg. Competing Interests: The Author(s) declare(s) no conflict of interest. INTRODUCTION There are hundreds of periodic tables but the one that is widely repro- duced has the approval of the International Union of Pure and Applied Chemistry (IUPAC) and is shown in Fig.1. -
Major Causes of Solder Cracks Applications and Boards That Specially Require Solder Crack Countermeasures Comparison of 2 Soluti
Solder Crack Countermeasures in MLCCs Outline This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Fig. 1: Appearance of a solder crack Ceramic Chip Capacitors). (cross-section) Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile. TDK offers following MLCC products as solder crack countermeasures. 1) Metal terminals “disperse” thermal shock : 2) Equipped with resin layers that absorb stress applied on solder MEGACAP joints and resistant to dropping: Soft termination Comparison of 2 solutions: Summary of “Solder Crack Countermeasures in MLCCs” Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions Fig. 2: Major causes of solder cracks and their impact after going on the market and during manufacturing processes such as soldering. The following causes can be listed as the major cause of solder cracks. (1) Thermal shock (heat shock), heat fatigue caused by temperature cycle Solder cracks occur when heat stress is applied to a solder joint due to the difference in the thermal coefficients of the MLCC and PCB, in an environment in which changes between high temperatures and low temperatures are repeated. In addition, it can also occur when temperature control is insufficient during the process of soldering. (2) Lead-free solder Lead-free solder, which started to be used due to environmental considerations, has properties of being rigid and fragile, and has a higher risk of solder cracks compared to conventional eutectic solder; therefore, caution is required when using it. -
Bismuth Chloride Solution SDS US
SAFETY DATA SHEET Issue Date 10-Nov-2015 Revision Date 11-Nov-2015 Version 1 1. IDENTIFICATION Product identifier Product Name Bismuth Trichloride Solution Other means of identification Product Code 0650 UN/ID no. UN1760 Synonyms Bismuth chloride; Trichlorobismuth, Trichlorobismuthine Recommended use of the chemical and restrictions on use Recommended Use Laboratory chemicals. Uses advised against No information available Details of the supplier of the safety data sheet Manufacturer Address Harrell Industries, Inc. 2495 Commerce Drive Rock Hill, SC 29730 www.harrellindustries.com Emergency telephone number Company Phone Number 803-327-6335 Fax Number 803-327-7808 24 Hour Emergency Phone Number (800) 633-8253 PERS Emergency Telephone (800) 633-8253 (PERS) 2. HAZARDS IDENTIFICATION Classification OSHA Regulatory Status This chemical is considered hazardous by the 2012 OSHA Hazard Communication Standard (29 CFR 1910.1200) Acute toxicity - Inhalation (Gases) Category 4 Acute toxicity - Inhalation (Dusts/Mists) Category 4 Skin corrosion/irritation Category 1 Sub-category A Serious eye damage/eye irritation Category 1 Specific target organ toxicity (single exposure) Category 3 Label elements Emergency Overview Warning Hazard statements Corrosive to metals. Causes severe skin burns and eye damage May cause respiratory irritation _____________________________________________________________________________________________ Page 1 / 8 0650 - Bismuth Trichloride Solution Revision Date 11-Nov-2015 _____________________________________________________________________________________________ Appearance Clear, colorless to yellow Physical state liquid Odor Faint hydrochloric acid odor. liquid Precautionary Statements - Prevention Wash skin thoroughly after handling Wear eye protection/ face protection Wear protective gloves Precautionary Statements - Response Immediately call a POISON CENTER or doctor IF ON SKIN: Wash with plenty of soap and water IF IN EYES: Rinse cautiously with water for several minutes. -
Safety Data Sheet
Safety data sheet Page: 1/13 BASF Safety data sheet according to UN GHS 4th rev. Date / Revised: 23.10.2017 Version: 2.0 Product: Pearl-Glo® SF PG1099 (ID no. 30322522/SDS_COS_00/EN) Date of print 24.10.2017 1. Identification Product identifier Pearl-Glo® SF PG1099 Chemical name: Pearl-Glo SF CAS Number: 7787-59-9 Relevant identified uses of the substance or mixture and uses advised against Relevant identified uses: cosmetic ingredient Details of the supplier of the safety data sheet Company: BASF SE 67056 Ludwigshafen GERMANY Telephone: +49 621 60-48799 E-mail address: [email protected] Emergency telephone number International emergency number: Telephone: +49 180 2273-112 2. Hazards Identification Classification of the substance or mixture According to UN GHS criteria No need for classification according to GHS criteria for this product. Page: 2/13 BASF Safety data sheet according to UN GHS 4th rev. Date / Revised: 23.10.2017 Version: 2.0 Product: Pearl-Glo® SF PG1099 (ID no. 30322522/SDS_COS_00/EN) Date of print 24.10.2017 Label elements Globally Harmonized System (GHS) The product does not require a hazard warning label in accordance with GHS criteria. Other hazards According to UN GHS criteria No specific dangers known, if the regulations/notes for storage and handling are considered. 3. Composition/Information on Ingredients Substances Chemical nature INCI Name: BISMUTH OXYCHLORIDE Contains: Bismuth chloride oxide CAS Number: 7787-59-9 EC-Number: 232-122-7 Hazardous ingredients (GHS) According to UN GHS criteria No particular hazards known. Mixtures Not applicable 4. First-Aid Measures Description of first aid measures Remove contaminated clothing. -
RADIOACTIVE MATERIALS SECTION Revisions 3 and 4 Filing Instructions
Jeb Bush John O. Agwunobi, M.D., M.B.A Governor Acting Secretary August 2001 Bureau of Radiation Control RADIOACTIVE MATERIALS SECTION Information Notice 2001-04 Revisions 3 and 4 Filing Instructions: Changes to Chapter 64E-5, Florida Administrative Code (F.A.C.) Changes were made to “Control of Radiation Hazard Regu lations,” Chapter 64E-5, F.A.C., that became effective August 8 and September 11, 2001. These changes are indicated as Revision 3 or (R3) and Revision 4 (R4) in the margin. Enclosed are copies of the pages to be inserted. This update is printed on blue paper. These instructions apply to the complete version (brown cover) of Chapter 64E -5, F.A.C. Be sure that Revision 1 and Revision 2 changes have been made before making these changes. This can be verified by checking page ii of the index. PART PAGES TO BE REMOVED PAGES TO BE INSERTED Page Number Page Number Index i through xii i through xii I Part I Index Part I Index General Provisions I-1 through I-22 I-1 through I-22 II Part II Index Part II Index Licensing of Radioactive II-45 through II-46 II-45 through II-46 Materials II-53 through II-54 II-53 through II-54 IV Part IV Index Part IV Index Radiation Safety Requirements IV-1 through IV-16 IV-1 through IV-24 for Industrial Radiographic Operations VI Part VI Index Part VI Index Use of Radionuclides in the VI-1 through VI-2 VI-1 through VI-2 Healing Arts VI-5 through VI-6 VI-5 through VI-6 VI-23 through VI-26 VI-23 through VI-26 Attachment Attachment page not Attachment not numbered Certificate – Disposition of numbered (mailing -
Release of Patients Administered Radioactive Materials
NEW YORK STATE DEPARTMENT OF HEALTH BUREAU OF ENVIRONMENTAL RADIATION PROTECTION DRAFT RADIATION GUIDE 10.17 RELEASE OF PATIENTS ADMINISTERED RADIOACTIVE MATERIALS A. INTRODUCTION Section 16.123(b) of 10 NYCRR Part 16 requires licensees to assess the radiation exposure to individuals from patients administered radioactive materials and take action, as appropriate, to reduce exposures to other individuals. These requirements apply for both diagnostic and therapeutic uses regardless of the amount administered. Section 16.123(b), Medical uses of radioactive material, states: P The licensee shall confine patients undergoing procedures authorized by ...until the total effective dose equivalent for the individuals (other than the patient) likely to receive the greatest dose is 5 mSv (500 mrem) or less. P When the total effective dose equivalent to any individual that could result from the release of a patient is likely to exceed 1 mSv (100 mrem), the licensee shall: • provide the patient, or his/her competent representative, written information on risks of radiation and methods for reducing the exposure of individuals; and • keep records of such patients release for a period of five years. This document is designed to provide guidance on determining the potential dose to an individual likely to receive the highest dose from exposure to the patient, to establish appropriate activities and dose rates for release, to provide guidelines for instructions to patients on how to reduce exposures to other individuals, to describe recordkeeping requirements, and to inform licensees of other potential problems associated with the release of patients containing radioactive materials. B. DISCUSSION The radiation dose to another individual from a patient is highly dependent on a number of factors, including the amount and type of radioactive material administered, the patient's living/working arrangements, ability/willingness to follow instructions, etc. -
BISMUTH(III)CHLORIDE ENVIRONMENTALLY BEGIN ONE–POT SYNTHESIS of COUMARIN DERIVATIVE Pankaj S
[Chaudhari* et al., 5(7): July, 2016] ISSN: 2277-9655 IC™ Value: 3.00 Impact Factor: 4.116 IJESRT INTERNATIONAL JOURNAL OF ENGINEERING SCIENCES & RESEARCH TECHNOLOGY BISMUTH(III)CHLORIDE ENVIRONMENTALLY BEGIN ONE–POT SYNTHESIS OF COUMARIN DERIVATIVE Pankaj S. Chaudhari*, Dr. Shrikant S.Patil * Babasaheb Naik College of Engineering, Pusad (MS) India DOI: ABSTRACT Bismuth(III)chloride is used as an efficient catalyst in the Von–Pachmann condensation of phenol with derivative of phenols with B–ketoesters leading to the formation of coumarine and their derivative with good yields, high purity and eco-friendly synthesis. KEYWORDS: Coumarin, Von-Pachmann reaction, B–ketoesters, Substituted phenol, Bismuth (III) chloride. INTRODUCTION Coumarins are naturally occurring compound and found in various plants in large quantities, coumarins are biologically active compound used in various aspects of cosmetics, medicines & pharmaceutical industries (1) recently used in anti–tuberculosis and anti–HIV and active drugs (2). Coumarin is the best known aromatic lactone (3) the isolation of coumarin was first reported by Vogel in Munich is 1820 (4) The IUPAC nomenclature of the coumarin ring system is 2H – 1 benzopyran – 2– one (5). The synthesis of coumarins and their derivatives has attracted considerable attention from the organic and medicinal chemist for many years as a large number of natural products contain this heterocyclic nucleus. The Von – Pechmann reaction is a venerable reaction and it is one of the most simple & straightforward methods used to produce coumarins classically, the process consists of the condensation of phenols with B– ketoesters in the presence of a variety of reagents and gives a good yield of G– substituted coumarin(6).Several acid catalysts have been used in the Von- Pechmann reaction including sulfuric acid, aluminum chloride (7). -
Radiation Sources- Radiating Health and Progress…
RADIATION SOURCES- RADIATING HEALTH AND PROGRESS…. ….. BUT NEED REGULATION NEVERTHELESS!!! Anuradha V ATOMIC ENERGY REGULATORY BOARD Contents- The four W’s What are radiation sources? Where are they used? Why do we need them? When is their use dangerous and how to overcome this? 3 Applications of Radiation- All areas of life Medical- Diagnosis and treatment Industrial- Food processing, Radiography, Gauges and measurement Research – Irradiation of samples, Calibration sources, tracers Agriculture- Tracer studies MEDICAL USES RADIOTHERAPY INTERVENTIONAL RADIOLOGY RADIO-PHARMACEUTICALS COMPUTED TOMOGRAPHY BLOOD/TISSUE IRRADIATOR INDUSTRIAL USES FOOD IRRADIATION INDUSTRIAL RADIOGRAPHY NUCLEONIC GAUGES RESEARCH TRACER STUDY IRRADIATION OF SAMPLES Department of Atomic Energy Atomic Department of Image courtesy: courtesy: Image Alexander L.- Polonium poisoning of Russian spy Atomic bomb survivors “RADIATION GOOGLE IS INDEED DISASTROUS” Image courtesy: socialistworld.net Image courtesy: courtesy: Image THE QUESTION TO ASK IS NOT "IS THERE ANY RADIOACTIVITY PRESENT?" BUT RATHER, "HOW MUCH, AND IS IT ENOUGH TO BE HARMFUL?" Atomic Energy Regulatory Board, Anushakti nagar Mumbai 10 Safety Research Institute at Kalpakkam Regional Centers at Chennai, New Delhi and Kolkata Effects Linear- Non Threshold model for Radiation AERB mandates in this area for safety DNA damage reduction CANCER RISK Epilation Erythema GI/ CNS Symptoms area for Prevention Prevention area for Death mandates in this AERB These effects are more profound in the foetus and children “Licence in accordance with Atomic Energy (Radiation Protection)Rules, 2004 from AERB is mandatory requirement for the procurement and use of radiation sources in India”. 12 Safety Research funding Safety in application of nuclear and radiation facilities Environmental Impact Assessment Transport of Radioactive material Radioactive Waste Management Civil and Structural Engineering Spent Fuel Storage Reactor Physics Thermal Hydraulics/Fluid Structure Interactions in Reactors under Accident Conditions . -
Industrial Radiography
RADIATION PROTECTION OF WORKERS Industrial Radiography RADIATION AND RADIOGRAPHS RADIOACTIVE SOURCES PROCEDURES RADIOGRAPHERS DO follow the procedures. Ionizing radiation can pen- Materials of higher den Sealed sources are small þ Safe storage Precautions þ DO use the appropriate equipment, including collimators. in size and contain material etrate objects and create sity absorb more radiation. þ DO confi rm that there are no other people working in the images on photographic The metal components are which emits penetrating area of radiography. fi lm. The technique is revealed inside this tele radiation continuously. Radioactive sources should be kept in a secure, fi re þ DO use clear working signs and signals. called radiography and phone because they have Special containers made þ DO set up the controlled area and the necessary barriers. the processed fi lms are absorbed more radiation of dense metal shielding resistant and adequately shielded storage location þ DO confi rm the location of the source, or that X rays are called radiographs. than the surrounding plastic. are necessary to store, not being generated, by use of a survey meter. when not in use, and should move and manipulate these þ DO secure and store the source or X ray machine when sources. Due to their small be kept separate from other not in use. materials. The storage loca- size and manoeuvrability, Portable and mobile radiographic þ DO wear your personal dosimeter. sealed sources can be containers. ~ tion for X ray machines that used in confined spaces. are not in use is not required to be shielded. OTHER WORKERS Iridium-192 is a common radioactive source used þ DO observe the access restrictions, however remote it may in gamma radiography.