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Modification of the Microcontact Printing Process for Conductive Ink Printing Adam J Worcester Polytechnic Institute Digital WPI Major Qualifying Projects (All Years) Major Qualifying Projects November 2017 Modification of the Microcontact Printing Process for Conductive Ink Printing Adam J. Cyran Worcester Polytechnic Institute Michaela Dowling Worcester Polytechnic Institute Follow this and additional works at: https://digitalcommons.wpi.edu/mqp-all Repository Citation Cyran, A. J., & Dowling, M. (2017). Modification of the Microcontact Printing Process for Conductive Ink Printing. Retrieved from https://digitalcommons.wpi.edu/mqp-all/2225 This Unrestricted is brought to you for free and open access by the Major Qualifying Projects at Digital WPI. It has been accepted for inclusion in Major Qualifying Projects (All Years) by an authorized administrator of Digital WPI. For more information, please contact [email protected]. Modification of the Microcontact Printing Process for Conductive Ink ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Printing A Major Qualifying Project Report ​ ​ ​ ​ ​ ​ ​ ​ submitted to the faculty of ​ ​ ​ ​ ​ ​ ​ ​ WORCESTER POLYTECHNIC INSTITUTE ​ ​ ​ ​ in partial fulfillment of the requirements for the ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Degree of Bachelor of Science ​ ​ ​ ​ ​ ​ ​ ​ NTB: Interstaatliche Hochschule fur Technik Buchs ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ (The Interstate University of Applied Sciences of Technology Buchs) ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Project Advisor: Prof. Sarah Wodin-Schwartz, WPI ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Submitted By: ​ ​ Adam Cyran & Michaela Dowling ​ ​ ​ ​ ​ ​ ​ ​ November 3, 2017 ​ ​ ​ ​ Abstract The goal of this project was to adhere miniature circuit chips to flex prints using ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ conductive epoxy and microcontact printing techniques. To accomplish this goal, the printing ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ process was first optimized. Tool properties were varied to determine their influence on final ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ print quality. Optimized parameters included ideal ranges for inking force and acceptable ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ alignment during inking. The prints created with the optimized parameters were used to bond ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ substrates for shear resistance and electrical conductivity tests. Both tests showed that using ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ microcontact printing to apply conductive epoxy for establishing continuity has potential to ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ become an alternative solution for bonding electrical components. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 1 Acknowledgements Our team would like to thank every individual who provided assistance and guidance ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ throughout the course of this project. Our WPI advisor, Professor Wodin-Schwartz, as well as ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ our advisors at the Interstaatliche Hochschule fur Technik Buchs (NTB): Katrin Albrecht, Emine ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Cagin, and Mathias Mӓchler. Additionally, we’d like to thank the Switzerland project center ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ director, Professor Nancy Burnham (WPI) and faculty members at the Interdisciplinary and ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Global Studies Division (WPI). We would like to give a special thank you to the entire staff of ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ NTB for welcoming us and supporting our project in every way possible. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 2 Authorship All sections of this paper were written and edited equally by both authors, Adam Cyran ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ and Michaela Dowling. ​ ​ ​ ​ 3 Table of Contents ​ ​ ​ ​ Abstract 1 Acknowledgements 2 Authorship 3 Executive Summary 10 ​ ​ ​ 1.0 Introduction 13 ​ ​ ​ 2.0 Background 15 ​ ​ ​ 2.1 Soft Lithography 15 ​ ​ ​ ​ ​ 2.2 Microcontact Printing 15 ​ ​ ​ ​ ​ 2.2.1 μCP Process for Adhesives 15 ​ ​ ​ ​ ​ ​ ​ ​ ​ 2.3 Master 16 ​ ​ ​ 2.4 Poly(dimethylsiloxane) Stamp 17 ​ ​ ​ ​ ​ 2.5 Conductive Epoxy 20 ​ ​ ​ ​ ​ 2.5.1 Blade Coating Application Method 20 ​ ​ ​ ​ ​ ​ ​ ​ ​ 2.5.2 Pot Life of the Epoxy 21 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 2.5.3 Curing 22 ​ ​ ​ 2.6 Substrate 22 ​ ​ ​ 2.7 Stamping 23 ​ ​ ​ 2.7.1 The Microcontact Printing Tool 24 ​ ​ ​ ​ ​ ​ ​ ​ ​ 2.8 Materials for Application 25 ​ ​ ​ ​ ​ ​ ​ 2.8.1 Flex Print 25 ​ ​ ​ ​ 2.8.2 Miniature Circuit Chips 26 ​ ​ ​ ​ ​ ​ ​ 3.0 Methodology 27 ​ ​ ​ 3.1 Overview of Optimization Process 27 ​ ​ ​ ​ ​ ​ ​ ​ ​ 3.2 Master 28 ​ ​ 3.2.1 Master Selection 28 ​ ​ ​ ​ 3.2.2 Master Characterization 29 ​ ​ ​ ​ 3.3 Ink Pad 30 ​ ​ ​ ​ ​ 3.3.1 Ink Pad Creation 30 ​ ​ ​ ​ ​ ​ ​ 3.3.2 Ink Pad Characterization 30 ​ ​ ​ ​ ​ ​ ​ 3.4 Stamp 30 ​ ​ ​ 3.4.1 Stamp Creation 30 ​ ​ ​ ​ ​ 3.4.2 Stamp Characterization 32 ​ ​ ​ ​ ​ 3.5 Optimizing the μCP Process 34 ​ ​ ​ ​ ​ ​ ​ ​ ​ 3.5.1 μCP Process Optimization Test Matrix 34 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 3.5.2 Leveling Calibration of the μCP Tool 35 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 4 3.5.3 Inking the Stamp using the μCP Tool 38 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 3.5.3a Characterization of Ink on the Stamp 38 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 3.5.4 Printing using the μCP Tool 39 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 3.5.4a Visual Print Analysis 39 ​ ​ ​ ​ ​ ​ 3.5.4b Print Characterization 40 ​ ​ ​ ​ ​ 3.6 Printing Large Structures for Flex Print Application 41 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 3.6.1 Defining Tolerance for Acceptable Prints 42 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 3.6.2 Epoxy Spread Testing 43 ​ ​ ​ ​ ​ ​ ​ 3.6.3 Shear Resistance Testing 44 ​ ​ ​ ​ ​ ​ ​ 3.6.4 Resistivity Testing 46 ​ ​ ​ ​ ​ 4.0 Results and Discussion 47 ​ ​ ​ ​ ​ ​ 4.1 Generating an Ink Pad 47 ​ ​ ​ ​ ​ ​ ​ ​ 4.2 Optimizing the μCP Process 51 ​ ​ ​ ​ ​ ​ ​ ​ ​ 4.2.1 Inking the Stamp using the μCP Tool 51 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 4.2.1a Force 51 ​ ​ ​ 4.2.1b Roll and Pitch Adjustment for Stage - Print Head Parallel Alignment 55 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 4.3 Epoxy Spread 60 ​ ​ ​ ​ 4.4 Shear Resistance 62 ​ ​ ​ ​ ​ 4.5 Resistivity Trials 63 ​ ​ ​ ​ ​ 4.6 Time Constraints 64 ​ ​ ​ ​ ​ 4.6.1 Epoxy Pot Life 65 ​ ​ ​ ​ ​ ​ ​ 4.6.2 Printing Time 65 ​ ​ ​ ​ ​ 5.0 Conclusion 67 ​ ​ ​ 6.0 Future Work 69 ​ ​ ​ ​ 6.1 Parameter Limits 69 ​ ​ ​ ​ 6.2 Stamp Holder on μCP tool 69 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 6.3 μCP Tool Calibration & Alignment 69 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 6.4 Utilizing Flex Prints with Non-Solder Stopping Contacts 70 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 6.5 Surface Functionalization/Wettability 70 ​ ​ ​ ​ Appendices 71 Appendix A: EPO-TEK H2OE-PFC Data Sheet 71 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Appendix B: EPO-TEK H2OS Data Sheet 72 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ References 73 5 Table of Figures ​ ​ ​ ​ Figure 1: Project outline 14 ​ ​ ​ ​ ​ ​ ​ Figure 2: Microcontact printing process 16 ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 3: Master creation 17 ​ ​ ​ ​ ​ ​ ​ Figure 4: Mold tool with master placed at center 18 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 5: Closed mold tool being filled with PDMS 18 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 6: Stamp creation 18 ​ ​ ​ ​ ​ ​ ​ Figure 7: Contact angle 19 ​ ​ ​ ​ ​ ​ Figure 8: Blade coating method 21 ​ ​ ​ ​ ​ ​ ​ ​ Figure 9: Microcontact printing tool & specifications (NTB, 2017) 24 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 10: Flex print dimensions 25 ​ ​ ​ ​ ​ ​ ​ ​ Figure 11: Miniature chip examples 26 ​ ​ ​ ​ ​ ​ ​ ​ Figure 12: μCP process flow chart 27 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 13: Master layout (top pictures) and structure characterization (bottom picture) 29 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 14: Stamp characterization, stamp 1.1 structure 1 right 32 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 15: Stamp characterization, stamp 1.1 structure 1 right. Length measurement (top two ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ pictures) and width measurement (bottom two pictures) 33 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 16: Major components of the μCP tool 35 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 17: Top view of uCP tool, isolating print head motor assembly 36 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 18: Enlarged view of an adjustment dial 37 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 19: Top view diagram of μCP stage 37 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​​ ​ ​ ​ ​ Figure 20: μCP tool Labview front panel 38 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 21: Visual print comparison [unacceptable (left) vs. acceptable (right)] 40 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 22: Printed structure 41 ​ ​ ​ ​ ​ ​ ​ Figure 23: Definition of length and width measurements 41 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 24: Enlarged view of miniature circuit chip (left) and flex print ribbon (right) 42 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 25: Enlarged diagram of chip and flex print contact spacing 43 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 26: Weighted bonding of substrates 44 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 27: Shear testing machine 45 ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 28: Shear Tester Labview GUI 45 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 29: Resultant inking profile of 90+ μm ink pad 48 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 30: EPO-TEK H2OS, 10 μm ink pad edge (top left) and center (bottom left), EPO-TEK ​ ​ ​ ​​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ H2OS 20 μm ink pad edge (top right) center (bottom right) 49 ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Figure 31: EPO-TEK H2OS, 20 μm ink pad edge (left), EPO-TEK H2OE-PFC, 20 μm ink pad ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ edge (right) 50 ​ ​ ​ Figure 32: EPO-TEK H2OS,
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