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Transistor Circuit Guidebook Byron Wels TAB BOOKSBLUE RIDGE SUMMIT, PA
TAB BOOKS No. 470 34.95 By Byron Wels TransistorCircuit GuidebookByronWels TABBLUE RIDGE BOOKS SUMMIT,PA. 17214 Preface beforemeIa supposepioneer (along the my withintransistor firstthe many field.experiencewith wasother Weknown. World were using WarUnlike solid-stateIIsolid-state GIs) today's asdevices somewhat experimen- receivers marks of FIRST EDITION devicester,ownFirst, withsemiconductors! youwith a choice swipedwhichor tank. ofto a sealed,Here'sexperiment, pairThen ofhow encapsulated, you earphones we carefullywe did had it: from totookand construct the veryonenearest exoticof our the THIRDSECONDFIRST PRINTING-SEPTEMBER PRINTING-AUGUST PRINTING-JANUARY 1972 1970 1968 plane,wasyouAnphonesantenna. emptywound strung jeep,apart After toiletfull outand ofclippingas paper wire,unwoundhigh closelyrollandthe servedascatchthe far spaced.wire offas as itfrom a thewouldsafetyThe thecoil remaining-pin,magnetreach-for form, you inside.which stuckwire the Copyright © 1968by TAB BOOKS coatedNext,it into youneeded,a hunkribbons of -ofwooda razor -steel, soblade.the but point Oh,aItblued was noneprojected placedblade of the -quenchat so fancy right the pointplastic-bluedangles.of -, Reproduction or publicationPrinted inof the ofAmerica the United content States in any manner, with- themindfoundphoneground pin you,the was couldserved right not wired contact lacquerspotas toa onground blade, it. theblued.blade'sAconnector, pin,bayonet bluing,and stuck antennaand you hilt thecould coil.-deep other actuallyIfin ear- youthe isoutherein. assumed express -
Effective Virtual CPU Configuration with QEMU and Libvirt
Effective Virtual CPU Configuration with QEMU and libvirt Kashyap Chamarthy <[email protected]> Open Source Summit Edinburgh, 2018 1 / 38 Timeline of recent CPU flaws, 2018 (a) Jan 03 • Spectre v1: Bounds Check Bypass Jan 03 • Spectre v2: Branch Target Injection Jan 03 • Meltdown: Rogue Data Cache Load May 21 • Spectre-NG: Speculative Store Bypass Jun 21 • TLBleed: Side-channel attack over shared TLBs 2 / 38 Timeline of recent CPU flaws, 2018 (b) Jun 29 • NetSpectre: Side-channel attack over local network Jul 10 • Spectre-NG: Bounds Check Bypass Store Aug 14 • L1TF: "L1 Terminal Fault" ... • ? 3 / 38 Related talks in the ‘References’ section Out of scope: Internals of various side-channel attacks How to exploit Meltdown & Spectre variants Details of performance implications What this talk is not about 4 / 38 Related talks in the ‘References’ section What this talk is not about Out of scope: Internals of various side-channel attacks How to exploit Meltdown & Spectre variants Details of performance implications 4 / 38 What this talk is not about Out of scope: Internals of various side-channel attacks How to exploit Meltdown & Spectre variants Details of performance implications Related talks in the ‘References’ section 4 / 38 OpenStack, et al. libguestfs Virt Driver (guestfish) libvirtd QMP QMP QEMU QEMU VM1 VM2 Custom Disk1 Disk2 Appliance ioctl() KVM-based virtualization components Linux with KVM 5 / 38 OpenStack, et al. libguestfs Virt Driver (guestfish) libvirtd QMP QMP Custom Appliance KVM-based virtualization components QEMU QEMU VM1 VM2 Disk1 Disk2 ioctl() Linux with KVM 5 / 38 OpenStack, et al. libguestfs Virt Driver (guestfish) Custom Appliance KVM-based virtualization components libvirtd QMP QMP QEMU QEMU VM1 VM2 Disk1 Disk2 ioctl() Linux with KVM 5 / 38 libguestfs (guestfish) Custom Appliance KVM-based virtualization components OpenStack, et al. -
Operating Guide
Operating Guide EPIA EN-Series Mini-ITX Mainboard January 18, 2012 Version 1.21 EPIA EN-Series Operating Guide Table of Contents Table of Contents ...................................................................................................................................................................................... i VIA EPIA EN-Series Overview.............................................................................................................................................................. 1 VIA EPIA EN-Series Layout .................................................................................................................................................................. 2 VIA EPIA EN-Series Specifications ...................................................................................................................................................... 3 VIA EPIA EN Processor SKUs .............................................................................................................................................................. 4 VIA CN700 Chipset Overview ............................................................................................................................................................... 5 VIA EPIA EN-Series I/O Back Panel Layout ...................................................................................................................................... 6 VIA EPIA EN-Series Layout Diagram & Mounting Holes .............................................................................................................. -
Pentium Processors Have Slightly Different Requirements to Enable and Disable Paging
D Pentium® Processor Family Developer’s Manual Volume 1: Pentium® Processors NOTE: The Pentium® Processor Family Developer’s Manual consists of three books: Pentium® Processors, Order Number 241428; the 82496/82497/82498 Cache Controller and 82491/82492/82493 Cache SRAM, Order Number 241429; and the Architecture and Programming Manual, Order Number 241430. Please refer to all three volumes when evaluating your design needs. 1995 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. The Pentium® processor may contain design defects or errors known as errata. Current characterized errata are available on request. *Third-party brands and names are the property of their respective owners. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 7641 Mt. -
Electronic Circuit Design and Component Selecjon
Electronic circuit design and component selec2on Nan-Wei Gong MIT Media Lab MAS.S63: Design for DIY Manufacturing Goal for today’s lecture • How to pick up components for your project • Rule of thumb for PCB design • SuggesMons for PCB layout and manufacturing • Soldering and de-soldering basics • Small - medium quanMty electronics project producMon • Homework : Design a PCB for your project with a BOM (bill of materials) and esMmate the cost for making 10 | 50 |100 (PCB manufacturing + assembly + components) Design Process Component Test Circuit Selec2on PCB Design Component PCB Placement Manufacturing Design Process Module Test Circuit Selec2on PCB Design Component PCB Placement Manufacturing Design Process • Test circuit – bread boarding/ buy development tools (breakout boards) / simulaon • Component Selecon– spec / size / availability (inventory! Need 10% more parts for pick and place machine) • PCB Design– power/ground, signal traces, trace width, test points / extra via, pads / mount holes, big before small • PCB Manufacturing – price-Mme trade-off/ • Place Components – first step (check power/ground) -- work flow Test Circuit Construc2on Breadboard + through hole components + Breakout boards Breakout boards, surcoards + hookup wires Surcoard : surface-mount to through hole Dual in-line (DIP) packaging hap://www.beldynsys.com/cc521.htm Source : hap://en.wikipedia.org/wiki/File:Breadboard_counter.jpg Development Boards – good reference for circuit design and component selec2on SomeMmes, it can be cheaper to pair your design with a development -
Integrated Circuits
CHAPTER67 Learning Objectives ➣ What is an Integrated Circuit ? ➣ Advantages of ICs INTEGRATED ➣ Drawbacks of ICs ➣ Scale of Integration CIRCUITS ➣ Classification of ICs by Structure ➣ Comparison between Different ICs ➣ Classification of ICs by Function ➣ Linear Integrated Circuits (LICs) ➣ Manufacturer’s Designation of LICs ➣ Digital Integrated Circuits ➣ IC Terminology ➣ Semiconductors Used in Fabrication of ICs and Devices ➣ How ICs are Made? ➣ Material Preparation ➣ Crystal Growing and Wafer Preparation ➣ Wafer Fabrication ➣ Oxidation ➣ Etching ➣ Diffusion ➣ Ion Implantation ➣ Photomask Generation ➣ Photolithography ➣ Epitaxy Jack Kilby would justly be considered one of ➣ Metallization and Intercon- the greatest electrical engineers of all time nections for one invention; the monolithic integrated ➣ Testing, Bonding and circuit, or microchip. He went on to develop Packaging the first industrial, commercial and military ➣ Semiconductor Devices and applications for this integrated circuits- Integrated Circuit Formation including the first pocket calculator ➣ Popular Applications of ICs (pocketronic) and computer that used them 2472 Electrical Technology 67.1. Introduction Electronic circuitry has undergone tremendous changes since the invention of a triode by Lee De Forest in 1907. In those days, the active components (like triode) and passive components (like resistors, inductors and capacitors etc.) of the circuits were separate and distinct units connected by soldered leads. With the invention of the transistor in 1948 by W.H. Brattain and I. Bardeen, the electronic circuits became considerably reduced in size. It was due to the fact that a transistor was not only cheaper, more reliable and less power consuming but was also much smaller in size than an electron tube. To take advantage of small transistor size, the passive components too were greatly reduced in size thereby making the entire circuit very small. -
SIMD Extensions
SIMD Extensions PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 12 May 2012 17:14:46 UTC Contents Articles SIMD 1 MMX (instruction set) 6 3DNow! 8 Streaming SIMD Extensions 12 SSE2 16 SSE3 18 SSSE3 20 SSE4 22 SSE5 26 Advanced Vector Extensions 28 CVT16 instruction set 31 XOP instruction set 31 References Article Sources and Contributors 33 Image Sources, Licenses and Contributors 34 Article Licenses License 35 SIMD 1 SIMD Single instruction Multiple instruction Single data SISD MISD Multiple data SIMD MIMD Single instruction, multiple data (SIMD), is a class of parallel computers in Flynn's taxonomy. It describes computers with multiple processing elements that perform the same operation on multiple data simultaneously. Thus, such machines exploit data level parallelism. History The first use of SIMD instructions was in vector supercomputers of the early 1970s such as the CDC Star-100 and the Texas Instruments ASC, which could operate on a vector of data with a single instruction. Vector processing was especially popularized by Cray in the 1970s and 1980s. Vector-processing architectures are now considered separate from SIMD machines, based on the fact that vector machines processed the vectors one word at a time through pipelined processors (though still based on a single instruction), whereas modern SIMD machines process all elements of the vector simultaneously.[1] The first era of modern SIMD machines was characterized by massively parallel processing-style supercomputers such as the Thinking Machines CM-1 and CM-2. These machines had many limited-functionality processors that would work in parallel. -
Wdv-Notes Stand: 29.DEZ.1994 (2.) 329 Intel Pentium – Business Must Learn from the Debacle
wdv-notes Stand: 29.DEZ.1994 (2.) 329 Intel Pentium – Business Must Learn from the Debacle. Wiss.Datenverarbeitung © 1994–1995 Edited by Karl-Heinz Dittberner FREIE UNIVERSITÄT BERLIN Theo Die kanadische Monatszeitschrift The Im folgenden sowie in den wdv-notes verbreitet werden, wenn dabei die folgen- Computer Post, Winnipeg veröffentlicht Nr. 330 werden diese Artikel im Original den Spielregeln beachtet werden. in mehreren Artikeln in ihrer Januar-Aus- nachgedruckt. Der Dank dafür geht an Permission is hereby granted to copy gabe 1995 eine exzellente erste Zusam- Sylvia Douglas von The Computer Post, this article electronically or in any other menfassung des Debakels um den Defekt 301 – 68 Higgins Avenue, Winnipeg, Ma- form, provided it is reproduced without des Pentium-Mikroprozessors [1–2] des nitoba, Canada, Email: SDouglas@post. alteration, and you credit it to The Compu- Computergiganten Intel. mb.ca. Diese Artikel dürfen auch weiter- ter Post. Intel’s top of the line Pentium™ microproc- This particular error in the Pentium was in essor chip has turned out to have a slight flaw the floating-point divide unit. Intel manage- Editorial: The Computer Post – Jan.95 in its character: when dividing certain rare ment was concerned enough about it that pairs of floating point numbers, it gives the they pulled together a special team to assess The Way it Will Be wrong answer. For anyone who owns a Pen- the implications. tium-based computer, or was thinking about This month you’ll find we’re reporting a In the words of Andrew Grove, Intel’s CEO, buying one, or is just feeling curious, here lot of background information on Intel’s posting later to the Internet [3], “We were are.. -
HELLAS: a Specialized Architecture for Interactive Deformable Object Modeling
HELLAS: A Specialized Architecture for Interactive Deformable Object Modeling Shrirang Yardi Benjamin Bishop Thomas Kelliher Department of Electrical and Department of Computing Department of Mathematics Computer Engineering Sciences and Computer Science Virginia Tech University of Scranton Goucher College Blacksburg, VA Scranton, PA Baltimore, MD [email protected] [email protected] [email protected] ABSTRACT more realistic models, it is likely that the computational Applications involving interactive modeling of deformable resources required by these simulations may continue to ex- objects require highly iterative, floating-point intensive nu- ceed those provided by the incremental advances in general- merical simulations. As the complexity of these models in- purpose systems [12]. This has created an interest in the creases, the computational power required for their simula- use of specialized hardware that provides high performance tion quickly grows beyond the capabilities of current gen- computational engines to accelerate such floating-point in- eral purpose systems. In this paper, we present the design tensive applications [6, 7]. of a low–cost, high–performance, specialized architecture to Our research focuses on the design of such specialized sys- accelerate these simulations. Our aim is to use such special- tems. However, our approach has several important differ- ized hardware to allow complex interactive physical model- ences as compared to previous work in this area: (i) we ing even on consumer-grade PCs. In this paper, we present specifically target algorithms that are numerically stable, details of the target algorithms, the HELLAS architecture, but are much more computationally intensive than those simulation results and lessons learned from our implemen- used by existing hardware implementations [3,6]; (ii) we aim tation. -
RISC-V Vector Extension Webinar I
RISC-V Vector Extension Webinar I July 13th, 2021 Thang Tran, Ph.D. Principal Engineer Who WeAndes Are Technology Corporation CPU Pure-play RISC-V Founding Major Open-Source CPU IP Vendor Premier Member Contributor/Maintainer RISC-V Ambassador 16-year-old Running Task Groups Public Company TSC Vice Chair Director of the Board Quick Facts + NL 100 years 80% FR BJ KR USA JP IL SH CPU Experience in Silicon Valley R&D SZ TW (HQ) 200+ 20K+ 7B+ Licensees AndeSight IDE Total shipment of Andes- installations Embedded™ SoC Confidential Taking RISC-V® Mainstream 2 Andes Technology Corporation Overview Andes Highlights •Founded in March 2005 in Hsinchu Science Park, Taiwan, ROC. •World class 32/64-bit RISC-V CPU IP public company •Over 200 people; 80% are engineers; R&D team consisting of Silicon Valley veterans •TSMC OIP Award “Partner of the Year” for New IP (2015) •A Premier founding member of RISC-V Foundation •2018 MCU Innovation Award by China Electronic News: AndesCore™ N25F/NX25F •ASPENCORE WEAA 2020 Outstanding Product Performance of the Year: AndesCore™ NX27V •2020 HsinChu Science Park Innovation Award: AndesCore™ NX27V Andes Mission • Trusted Computing Expert and World No.1 RISC-V IP Provider Emerging Opportunities • AIoT, 5G/Networking, Storage and Cloud computing 3 V5 Adoptions: From MCU to Datacenters • Edge to Cloud: − ADAS − Datacenter AI accelerators − AIoT − SSD: enterprise (& consumer) − Blockchain − 5G macro/small cells − FPGA − MCU − Multimedia − Security − Wireless (BT/WiFi) 5G Macro • 1 to 1000+ core • 40nm to 5nm • Many in AI Copyright© 2020 Andes Technology Corp. 4 Webinar I - Agenda • Andes overview • Vector technology background – SIMD/vector concept – Vector processor basic • RISC-V V extension ISA – Basic – CSR – Memory operations – Compute instructions • Sample codes – Matrix multiplication – Loads with RVV versions 0.8 and 1.0 • AndesCore™ NX27V introduction • Summary Copyright© 2020 Andes Technology Corp. -
Amd Epyc 7351
SPEC CPU2017 Floating Point Rate Result spec Copyright 2017-2019 Standard Performance Evaluation Corporation Sugon SPECrate2017_fp_base = 176 Sugon A620-G30 (AMD EPYC 7351) SPECrate2017_fp_peak = 177 CPU2017 License: 9046 Test Date: Dec-2017 Test Sponsor: Sugon Hardware Availability: Dec-2017 Tested by: Sugon Software Availability: Aug-2017 Copies 0 30.0 60.0 90.0 120 150 180 210 240 270 300 330 360 390 420 450 480 510 560 64 550 503.bwaves_r 32 552 165 507.cactuBSSN_r 64 163 130 508.namd_r 64 142 64 141 510.parest_r 32 146 168 511.povray_r 64 175 64 121 519.lbm_r 32 124 64 192 521.wrf_r 32 161 190 526.blender_r 64 188 164 527.cam4_r 64 162 248 538.imagick_r 64 250 205 544.nab_r 64 205 64 160 549.fotonik3d_r 32 163 64 96.7 554.roms_r 32 103 SPECrate2017_fp_base (176) SPECrate2017_fp_peak (177) Hardware Software CPU Name: AMD EPYC 7351 OS: Red Hat Enterprise Linux Server 7.4 Max MHz.: 2900 kernel 3.10.0-693.2.2 Nominal: 2400 Enabled: 32 cores, 2 chips, 2 threads/core Compiler: C/C++: Version 1.0.0 of AOCC Orderable: 1,2 chips Fortran: Version 4.8.2 of GCC Cache L1: 64 KB I + 32 KB D on chip per core Parallel: No L2: 512 KB I+D on chip per core Firmware: American Megatrends Inc. BIOS Version 0WYSZ018 released Aug-2017 L3: 64 MB I+D on chip per chip, 8 MB shared / 2 cores File System: ext4 Other: None System State: Run level 3 (Multi User) Memory: 512 GB (16 x 32 GB 2Rx4 PC4-2667V-R, running at Base Pointers: 64-bit 2400) Peak Pointers: 32/64-bit Storage: 1 x 3000 GB SATA, 7200 RPM Other: None Other: None Page 1 Standard Performance Evaluation -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References .............................................