TM Technology for Innovators
Wireless Terminals Solutions Guide
2007
Inside TI Technologies 4 TCS Chipset Solutions 8
OMAP™ Platform 30 OMAP-Vox™ Solutions 35 Mobile Connectivity Solutions 58 High-Performance Analog 70 2 Wireless Terminals Solutions Guide
Table of Contents
Technologies Overview of Technologies ...... 4 DRP™ Technology ...... 5 M-Shield™ Technology ...... 6 Diverse Technologies for the Global SmartReflex™ Power and Performance Management Technology ...... 7 Wireless Marketplace TCS Chipset Solutions Serving every corner of today’s global wireless industry requires Overview ...... 8 TCS2010 (GSM) ...... 10 vast experience and expertise, innovative research and development, TCS2110 (GPRS) ...... 12 advanced chip processing technologies, a network of like-minded TCS2200 (GPRS) ...... 14 technology partners and much more. For nearly 20 years, TI has TCS2300 “LoCosto” (GSM) ...... 16 TCS2310 “LoCosto” (GPRS) ...... 17 delivered technology for each generation of the wireless industry. TCS2305 “LoCosto ULC” (GSM) ...... 18 Today, TI has a diverse portfolio of technologies for every region and TCS2315 “LoCosto ULC” (GPRS) ...... 19 every market segment. TI provides industry-leading solutions for TCS2600/TCS2630 (GPRS) ...... 20 TCS2700 (GPRS) ...... 22 cost-sensitive emerging markets like China and India, as well as OMAP850 (EDGE) ...... 24 established markets, where mobile entertainment, productivity tools OMAPV1030 (EDGE) ...... 26 OMAPV1035 “eCosto” (EDGE) ...... 27 and other types of functionality are converging on mobile devices. OMAPV2230 (WCDMA) ...... 28 TI’s portfolio is comprised of a comprehensive selection of wireless Chipset Reference Designs ...... 29 chipsets, low-power baseband, modem and application processors, OMAP™ Platform digital RF technology, power management, security, high-performance Overview ...... 30 analog, functionality like single-chip Bluetooth®, Wireless LAN Integrated Modem and Applications Processors ...... 32 OMAP730 Processor ...... 32 (WLAN) and GPS, and much more. TI gives mobile device OMAP750 Processor ...... 33 manufacturers the flexibility and capability they need to deliver the OMAP850 Processor ...... 34 OMAP-Vox™ Solutions ...... 35 next billion phones. OMAPV1030 Processor ...... 36 OMAPV1035 “eCosto” Processor ...... 37 OMAPV2230 Processor ...... 38 Multimedia Processors ...... 39 OMAP331 Processor ...... 39 OMAP-DM270 ...... 40 High-Performance Multimedia-Rich Applications Processors ...... 41 OMAP1610 Processor ...... 41 OMAP1621 Processor ...... 42 OMAP1710 Processor ...... 43 OMAP2420 Processor ...... 44 OMAP2430/OMAP2431 Processors ...... 45 OMAP 3 Platform ...... 46 OMAP3430 Processor ...... 47 OMAP3420 Processor ...... 48 OMAP3410 Processor ...... 49 OMAP Platform Resources ...... 50 OMAP Platform Software ...... 51 Wireless Application Center ...... 52 Application Suite ...... 53 OMAP Gaming Development Platform ...... 54 OMAP Developer Network ...... 55 Independent OMAP Technology Centers ...... 56 Software Development Tools ...... 57 Mobile Connectivity Solutions Overview ...... 58 BlueLink™ 7.0 Bluetooth® and FM Solution ...... 59 BlueLink 6.0 Bluetooth and FM Solution ...... 60 BlueLink 5.0 Bluetooth Solution ...... 61 BRF6150 Bluetooth Solution ...... 62 WiLink™ 6.0 WLAN, Bluetooth and FM Solution ...... 63 WiLink 5.0 WLAN Platform ...... 64 WiLink 4.0 WLAN Platform ...... 65 WLAN and Bluetooth Coexistence ...... 66 NaviLink™ 5.0 GPS Solution ...... 67 NaviLink 4.0 GPS Solution ...... 68 Hollywood™ Mobile DTV Solution ...... 69 High-Performance Analog Overview ...... 70
Wireless Terminals Solution Texas Instruments 2007
Wireless Terminals Solutions Guide 3 Overview
The astounding diversity of the wireless industry will increase during more, TI’s wireless technology can form the basis for a complete line the years ahead as more technologies, applications and capabilities of mobile devices serving every geographic region and every converge on mobile devices. Emerging markets around the world are market segment. TI’s hardware and software reference designs, as driving new subscriber growth as wireless communications becomes well as functionality like Bluetooth® technology, WLAN and GPS available. The requirements of these regions place a premium on solutions, USB connectivity, removable flash cards, camera controllers, cost-effective silicon process technologies, manufacturing and stereo codecs, drivers and other solutions all simplify the development packaging innovations, breakthrough integration techniques, system process and speed new mobile devices to market. design expertise, software re-use and other factors that deliver At a time when mobile entertainment on handsets has become compelling value in handsets that are economically accessible to critical, TI technology, including the OMAP family of processors, can a broad cross section of consumers. meet the requirements of the most demanding applications, such as TI is the leading supplier to the wireless industry with solutions as 2D and 3D video gaming, stereo FM radio, high-resolution digital diverse as the industry itself. photography, CD-quality music and others. From the comprehensive TCS family of wireless chipsets to OMAP™ TI has the technology and expertise, as well as the advanced silicon applications processors, sophisticated DRP™ technology, security processes to support all of your next generation of mobile devices. technology, power management, high-performance analog and much
Ingredients for Success
Digital RF Processor
Mixed Signal A/D Process Applications Digital BB Mixed Processing Signal A/D Process System Design Digital Filtering and Control and Algorithms DRP™ Technology: RF, Baseband, Power Management, Analog
Advanced Silicon Technology Advanced (90 nm - 65 nm and beyond) Modems for 3G and Beyond Mobile Connectivity Technologies
Texas Instruments 2007 Wireless Terminals Solutions Guide 4 Technologies
Overview
To Know More SmartReflex™ Power and Performance Management Technology TI’s Foundational Innovations featured in this issue: The objective of SmartReflex technology is to optimize wireless DRP™ Single-Chip Technology 5 handset performance and functionality at the lowest possible level SmartReflex™ Power and Performance Management Technology 6 of power consumption. Achieving this goal involves intelligent and adaptive silicon IP, advanced system-on-a-chip architectural techniques M-Shield™ Security Technology 7 and innovative software. All of these aspects of SmartReflex technology address power consumption challenges such as leakage TI long ago demonstrated that true breakthrough innovations often at submicron process geometries and many others. cross over the neat lines imposed by conventional solutions. Innovation In the wireless industry, SmartReflex technology is having far-reaching knows no boundaries between product categories or end equipment effects on lowering power consumption without sacrificing system market segments. Because of the breadth of its expertise and core functionality. Millions of wireless devices have already deployed one competencies in many divergent technologies, TI has been able to or more aspects of SmartReflex technology. TI has produced more than develop innovations that are foundational to a broad range of 120 million devices that incorporate SmartReflex innovations. Moving technologies. These innovations stretch across product lines and defy forward, SmartReflex technology will leverage the momentum it has the demarcations between markets. In the end, these innovations gained from its application in wireless handsets into other high-per- render a diverse spectrum of technologies and products that are more formance, power-sensitive segments. efficient and effective. Innovations like DRP™ technology, SmartReflex™ power and performance optimization techniques and M-Shield™ security capabilities are being applied across many M-Shield™ Mobile Security Technology wireless technologies in a wide variety of handsets. M-Shield technology is one of the industry’s most robust security solutions for mobile devices. Its hardware and software features DRP™ Single-Chip Technology include a complete security infrastructure with on-chip cryptographic keys, as well as a secure execution environment, protected storage TI’s DRP technology has emerged from the demands placed on mechanisms, secure chip-to-chip interconnects and other features. wireless handset manufacturers for higher levels of integration. M-Shield technology enables a transparent security architecture Manufacturers are faced with providing greater, more compelling with standard application programming interfaces (APIs) that ensure functionality while at the same time lowering costs, improving a streamlined deployment as well as faster development and power efficiency and enabling smaller, lighter mobile devices. provisioning of security applications. TI has applied its digital expertise to migrate much of the RF analog M-Shield capabilities ensure end-to-end security for the mobile device content, which often accounts for as much as 30 to 40 percent of a itself and any sensitive personal information or high-value creative handset, to the digital domain. By doing so, DRP technology frees up content stored on the device. For example, a public-key infrastructure board space for added functionality. Digital technology can be much that ensures end-to-end security for the mobile device itself as well more power efficient than many analog devices, so standby and talk as any high-value content transmitted and stored on the device. This times can be extended. With DRP technology, handsets are able infrastructure offers a hardware-enforced secure environment for the to take advantage of the efficiencies and cost-reductions inherent in safe execution of sensitive applications and the secure storage of each new submicron digital process node. important data. For example, a public-key infrastructure with secure DRP technology has been deployed in several wireless technologies, on-chip keys (e-fuse) gives manufacturers one-time programmable such as TI’s single-chip cell phone platforms, “LoCosto” and “eCosto”, keys that are accessible only in secure mode for authentication and BlueLink™ Bluetooth® solutions, Hollywood™ mobile digital television encryption. (DTV) solution, the NaviLink™ GPS single-chip solution and the M-Shield technology is the keystone security technology for all of TI’s single-chip WiLink™ wireless LAN (WLAN) devices. TCS wireless chipsets and the complete line of OMAP™ processors.
Wireless Terminals Solutions Guide Texas Instruments 2007
Technologies 5 DRP™ Single-Chip Technology
DRP™ Single-Chip Technology Key Benefits TI’s DRP™ technology is a direct response to the dilemma wireless • Migrating RF processing from the analog to the digital domain handset manufacturers confront: attract new users by delivering makes possible higher levels of integration in wireless handsets compelling functionality to all segments of the marketplace while at • Highly integrated single-die RF and baseband processors reduce the same time fulfilling user demand for less expensive, more design complexity, size, power consumption and cost while power-efficient, smaller and lighter mobile devices. Achieving these enabling greater functionality two seemingly opposed objectives is only possible by aggressively • Takes advantage of the ongoing advances in digital CMOS integrating handset electronics. DRP technology does just that by fabrication to smaller submicron process nodes targeting the analog content of devices, which often accounts for • Simplifies testing procedures and increases manufacturing yields as much as 30 to 40 percent of total board real estate.
TI’s digital radio frequency (RF) processor architecture applies digital DRP technology oversamples analog signals and processes them in techniques to simplify RF processing and dramatically cut the cost the digital domain, capturing all of the benefits of digital CMOS and power consumption of transmitting and receiving information fabrication and the astounding advancements to smaller submicron wirelessly. The processing of radio signals with digital logic can process geometries. significantly shift the paradigm for embedding wireless communica- At each successively smaller process node, digital components tions by making it easier to implement and to scale. For handset achieve faster process switching speeds. With DRP technology, manufacturers, DRP technology delivers many benefits including: handset designers can take advantage of these faster switching • Lower solution cost and bill of materials speeds to further decrease the analog content of their designs. • Increased system performance With higher speeds, the oversampling rate of analog input signals • Longer battery life - better active and stand-by times can be increased and this, in turn, reduces noise aliasing problems • Smaller form factor to enable small, sleek mobile devices so that the design of input networks may be relaxed. • Flexibility to integrate multiple radios if the market TI’s DRP architecture has been successfully integrated onto a single conditions warrant chip for mobile phones, as well as the WiLink™ 4.0 and WiLink 5.0 • Easier design and test for wireless designers due to turn-key, WLAN platforms and four generations of Bluetooth® products, ready-to-manufacture solutions NaviLink™ GPS solution and the Hollywood™ mobile TV solution.
“LoCosto ULC” Wireless Single-Chip Solutions TCS2305/TCS2315 GSM/GPRS “eCosto” More OMAPV1035 to come... GSM/GPRS/EDGE Just Announced: Single-Chip “LoCosto” GSM/GPRS Just Announced: “LoCosto ULC”
“LoCosto”GSM/GPRS HollywoodTM Single-Chip mDTV “eCosto” WiLinkTM Multimedia Wi-Fi®
NaviLinkTM GPS
TM BlueLink 6.0 mm Bluetooth® 6.0 mm BlueLinkTM 6.0 Bluetooth® + FM
CM 0 1
Texas Instruments 2007 Wireless Terminals Solutions Guide 6 Technologies
M-Shield™ Technology
M-Shield™ Mobile Security Technology Key Benefits M-Shield™ mobile security technology is a system-level solution that • Transparent security architecture with standard APIs ensures involves both hardware and software mechanisms for the highest level a streamlined deployment as well as faster development of terminal and content security in the wireless industry. Moreover, and provisioning of security-based applications M-Shield technology sets the benchmark for the security needed for • Industry’s most robust security solution includes a complete wireless financial applications and transactions. M-Shield technology security infrastructure with on-chip cryptographic keys, secure is the keystone security technology for TI’s OMAP™ wireless platform execution environment, secure storage, secure chip-interconnects and its wireless chipsets. and other features M-Shield technology provides an infrastructure that ensures • Compelling user experience through high-performance end-to-end security for the mobile device itself as well as any hardware-based cryptographic accelerators that eliminate high-value content transmitted and stored on the device. This latencies and deliver rapid system-level response infrastructure offers a hardware-enforced secure environment for the • Tampering detection triggers effective protective actions safe execution of sensitive applications and the secure storage of • Low power consumption maintains extended battery life important data. For example, a public-key infrastructure with secure • Flexible security software solution includes device drivers, on-chip keys (e-fuse) gives manufacturers one-time programmable security software libraries and APIs to support third-party keys that are accessible only in secure mode for authentication middleware software and applications and encryption. Central to M-Shield technology is the industry’s first hardware-based Complementing M-Shield technology’s hardware-based capabilities is secure execution environment. A one-of-a-kind secure state machine a software framework that includes device drivers, security software (SSM) applies and guarantees the system’s security policy rules while libraries and application programming interfaces (APIs) that support entering, executing and exiting from the secure environment. a wide range of cryptographic functions. In addition, this software Eliminating the vulnerability of chip-interconnects is also critical to framework interfaces the cryptography engine to higher levels of the overall protection of M-Shield technology. Certain peripherals the system, such as the operating system (OS), industry-standard and partitions of the system, such as keyboards, displays, fingerprint security protocols and security interfaces like SSL, TLS, IPSec and sensors, smartcard physical interfaces and cryptoprocessors, can be Public Key Cryptography Standards. Third-party security applications disabled to ensure that sensitive information cannot be accessed are available from a wide range of TI partners. and stolen. Secure memory storage and memory access further safeguard the device and its content.
User Application
User Mode Secure Environment API
File System Secure Environment Secure Kernel Mode Storage Device Driver
SSM
Secure ROM Root Public Key Secure Mode Code Random Key
RNG Secure DMA Secure RAM SHA-1/MD5 DES/3DES Secure Protected Chip Interconnect Application AES PKA Other Security Secret Data Features
M-Shield™ Mobile Security Technology
Wireless Terminals Solutions Guide Texas Instruments 2007
Technologies 7 SmartReflex™ Power and Performance Management Technology
SmartReflex™ Power and Performance Key Benefits Management Technology • Optimized performance with lowest possible power consumption SmartReflex™ technology is a holistic approach to power reduction • Lower power with high performance enables smaller, sleeker without sacrificing performance. More so than the piecemeal power mobile devices with less heat dissipation reduction techniques of the past, the rich, product-proven portfolio • Lengthens standby time, talk time and battery life without of SmartReflex technologies takes a comprehensive system-wide sacrificing performance perspective on the interrelated issues of power and performance • Drastically limits chip-level power leakage that is exacerbated in mobile devices and offers a pathway to future solutions. as process geometries shrink SmartReflex technology has three facets: silicon intellectual property (IP); techniques that can be applied at the system-on-a-chip SmartReflex System Software (SoC) architectural design level; and system software that manages The SmartReflex portfolio includes intelligent software that controls many of the hardware-enabled SmartReflex technologies which lower-level hardware technologies to optimize power consumption seamlessly interfaces to other power management techniques based and performance. For example, workload predictor, resource manager in operating systems (OS) or third-party software subsystems. and device driver power management software are a few of the SmartReflex technologies are leveraged by TI for industry-leading system-level capabilities of SmartReflex technology. Additionally, power and performance management in custom and standard devices. SmartReflex technology features DSP/BIOS™ power management software for DSP resources. SmartReflex Silicon IP TI has developed a significant number of sophisticated power SmartReflex technology crosses over traditional boundary lines to reduction solutions at the chip level, many of which have transitioned support power reduction across multiple cores, hardware accelerators, into SmartReflex technology. One emerging power challenge relevant functional blocks, peripherals and other system components. And to wireless handsets is static leakage power. Leakage becomes a system-level SmartReflex technology is open to OS-based and significantly greater part of a device’s total power consumption at the third-party power management software developing a collaborative and smaller submicron fabrication process nodes, such as 90 nanometer cooperative environment with regards to power and performance. (nm) and 65 nm. Several SmartReflex technologies can be applied to drastically limit leakage from a device. Many of TI’s wireless SmartReflex Technology’s Pathway to the Future components already implement SmartReflex technology to reduce More than 250 billion components with SmartReflex technology have leakage power. been shipped by TI. SmartReflex technology also includes a library of power management The roadmap for SmartReflex technology stretches far into the cells to facilitate a granular approach to partitioning a device’s power future, penetrating deeper into mobile devices and leveraging the domains. These cells can be used to architect multiple power domains application of SmartReflex technology into other high-performance, so the device’s functional blocks can be independently powered down power-sensitive industry segments. or put into a standby power mode, significantly reducing power.
SmartReflex SoC Architectural and Design Technologies Beyond established power reduction techniques such as low power modes and clock gating, SmartReflex technology includes innovative techniques at the architectural level of SoC design that reduce both dynamic and static power consumption. For example, adaptive voltage scaling (AVS), dynamic voltage and frequency scaling (DVFS), dynamic power switching (DPS) and standby leakage management (SLM) are innovative technologies in the SmartReflex portfolio.
Texas Instruments 2007 Wireless Terminals Solutions Guide 8 TCS Chipset and OMAP-Vox™ Solutions
Overview
To Know More TI’s family of TCS and OMAP-Vox™ solutions give mobile device manufacturers complete, scalable platforms that meet the require- TCS chipset and OMAP-Vox solutions featured in this issue ments of all leading market segments and standards, including GSM, TCS2010 (GSM) 10 GPRS, EDGE and WCDMA. TI’s solutions provide the necessary TCS2110 (GPRS) 12 elements to bring differentiated mobile devices to market fast, including a broad range of hardware, software, reference designs, TCS2200 (GPRS) 14 development tools and support. Digital and analog baseband TCS2300 “LoCosto” (GSM) 16 processors, applications processors capable of real-time multimedia TCS2310 “LoCosto” (GPRS) 17 processing, power management ICs, RF transceivers and more are TCS2305 “LoCosto ULC” (GSM) 18 also part of TI’s broad range of TCS Chipset offerings. TCS2315 “LoCosto ULC” (GPRS) 19 TCS2600/TCS2630 (GPRS) 20 Highly integrated TCS chipsets give manufacturers: • Real-time multimedia processing TCS2700 (GPRS) 22 • High-performance processing OMAP850 (EDGE) 24 • Low power consumption OMAPV1030 (EDGE) 26 • Small form factors OMAPV1035 “eCosto” (EDGE) 27 From traditional, cost-sensitive voice-centric handsets to high-end OMAPV2230 (WCDMA) 28 multimedia-rich smartphones, TCS chipsets support leading mobile Chipset Reference Designs 29 operating systems (OSs). Standards-compliant protocol stacks,
High Volume Today In Production Announced/Sampling
Standalone Applications Processors
OMAP1710 OMAP2430 OMAP3430
OMAP1610 OMAP2431 OMAP3420
OMAP1510 OMAP2420 OMAP3410 New! ADVANCED MULTIMEDIA
New!
Integrated Modem plus Applications Processing
OMAP850 Future EDGE OMAP-Vox 3G Future OMAP730 OMAPV1030 OMAP-Vox™ EDGE 3G OMAP710 OMAPV2230 GSM/GPRS WCDMA SMART PHONE
FEATURE PHONE OMAPV1035 GSM/GPRS EDGE Single Chip DRP™ Technology Software Compatible DRP Technology TCS2310 “LoCosto” TCS2315 Single Chip “LoCosto ULC” GPRS DRP Single Chip TCS21xx Technology GPRS GSM/GPRS Chipsets TCS2300 TCS2305 New! “LoCosto” “LoCosto ULC” VALUE PHONE VALUE Single Chip Single Chip GSM GSM New! ULTRA LOW-COST PHONE LOW-COST ULTRA
Software Compatible
Wireless Terminals Solutions Guide Texas Instruments 2007
TCS Chipset and OMAP-Vox™ Solutions 9 OverviewOverview
high-level programming languages, easy-to-use APIs and development TI’s Family of Single-Chip Handset Solutions tools are part of the fully validated and tested reference designs. TI’s integration capabilities are shown in its unique “LoCosto” and Incorporating OMAP™ applications processors within many TCS chipset “eCosto”platforms, the industry’s first architectures to provide solutions allows TI to deliver the most highly integrated modems, single-chip solutions for low- to mid-range wireless handsets. Using baseband and dedicated smartphone solutions available. TI’s advanced DRP™ technology, “LoCosto” and “eCosto” solutions combine radio and baseband processing into one highly integrated TI’s TCS chipsets offer advanced real-time and general purpose device. The result is a lower BOM and savings in board space, power processing for the most advanced applications, including streaming consumption and system cost. Utilizing “LoCosto” and “eCosto” media, graphics, high-end stereo, polyphonic audio, interactive 3D technology, wireless handsets can be designed in sleeker form factors gaming and entertainment, speech processing, location-based services and at costs affordable to new markets. and more. The advanced integration of TI’s TCS chipsets reduces part count and size, delivering a low bill of materials (BOM) and continuing TI’s industry-leading track record of the lowest power consumption OMAP-Vox™ Solutions: Offering Scalable and longest battery life. and Flexible Roadmaps OMAP-Vox™ integrated solutions merge both modem and applications More recent generations of TCS chipsets address the growing functionality onto the existing OMAP architecture. These solutions importance of security, providing a comprehensive set of hardware- share a common software platform that can be re-used for a variety based security features, software libraries and services that allow of growing market requirements, thus saving manufacturers years of manufacturers to add enhanced protection. TI’s built-in M-Shield™ software design effort and reducing overall development costs. TI’s security technology enables phone manufacturers and mobile OMAP-Vox modem technology is optimized to efficiently run a dynamic operators to support value-added services including: mixture of applications and baseband communications on the same • Content protection hardware. The scalable OMAP-Vox hardware architecture has enough • Transaction security performance to run modem and applications on the same processing • Secure network access core sharing hardware resources and is designed to easily extend • Terminal security functions from 2.5G to 3G and beyond. And to meet the stringent security • Flashing and booting requirements set by mobile operators, manufacturers, content providers • Terminal identity protection and financial services, TI’s OMAP-Vox solutions include embedded • Network lock protection security technology, a set of hardware accelerators including terminal security, financial transaction security and content security, without Value-added software and services are available as part of TCS the latencies and risks associated with software-only solutions. chipsets and reference designs. The application software suite enables an easy-to-use PC-based software development environment, optimized JAVA™ Sun KVM, MIDI, MP3, WAP2.0 stack and browser, EMS and MMS KVM messaging clients, Bluetooth® wireless technology and more. TI’s OMAP Developer Network and Independent OMAP Technology Centers (OTC) serve as additional resources for quickly deploying compelling 2G/2.5G and 3G devices.
Texas Instruments 2007 Wireless Terminals Solutions Guide 10 TCS Chipset and OMAP-Vox™ Solutions
GSM
TCS2010 Chipset Key Benefits Designed for low power, TI’s TCS2010 chipset offers a full Class 12 • Complete GSM/GPRS handset reference design GSM/GPRS platform with applications processing abilities. The • Dual-core digital baseband with TI proven GSM/GPRS solution combines a dual-core digital baseband processor based on modem architecture ® TI’s low power TMS320C54x™ DSP and ARM general-purpose • Reduced BOM costs for high-volume low-cost handsets processing cores, along with an analog baseband that uses power- • Low power consumption with twice the standby time down sleep modes to reduce power consumption and increase standby of previous generation time of mobile devices. • Pin compatibility with TBB2100 GSM/GPRS modem TCS2010 components include: • Integrated quad-band, direct conversion, single-chip • TBB2010 dual core digital baseband processor RF transceiver • TWL3014 analog baseband with sleep modes for • Software compatible with TCS2200 and TCS2110 reduced power consumption GSM/GPRS chipsets • TRF6151 direct conversion, quad-band RF transceiver • Class 12 GPRS support • Adaptive MultiRate Narrow Band (AMR-NB) vocoders When additional application processing is required, the TCS2010 is • Integrated EOTD location determination optimized to interface with TI OMAP™ applications processors. The • Optimized interface to OMAP™ applications processors combination of the TCS2010 and an OMAP processor delivers the • Full range of software applications through processing performance needed for advanced multimedia applications. TCS wireless software suite
TRF6151 RF Transceiver (GSM/GPRS) TBB2010 Digital Baseband 32 kHz QUARTZ TWL3014 Analog Baseband Dual TCXO Band- Voltage GSM850/GSM900 Baseband Backup I PA Serial Port Regulation SLICER Phase Asynchronous Comp RTC Q CLKM WAKE-UP MCU APC Serial Port AFC Serial GSM1800/GSM1900 SRAM Watchdog ULPD CK 32 KHz ADAC Interface SPI Test PAD INTH TPU Access Timing M SRAM Timer 1 I2C Port Div. Serial 3.6 GHz ARM7™ MCU TSP Port Core Timer 2 LPG Voiceband R Phase Voltage SIM Serial Port Clock Gen Div. Comp Regulators Switchplexer
PWT
DMA ARM® IO PWL Auxilary Baseband N Divide :2/:4 Die ID Drivers LNA850/LNA900 UART Codec uWIRE IRDA I Voltage LNA1800 TMS320C54x™ UART RIF MODEM Reference Q DSP Power Voiceband LNA1900 Subchip Control Codec MCSI VBAT Battery VBACKUP CRYPT SIM CARD Charger VCHG Monitoring JTAG Interface Interface ICHG ADC
EEPROM
External Memory LCD Battery Buzzer Keyboard SIM Card LED Vibrator
Wireless Terminals Solutions Guide Texas Instruments 2007
TCS Chipset and OMAP-Vox™ Solutions 11 GSM
TBB2010 Digital Baseband TRF6151 RF Transceiver Based on TI’s leading TMS320C54x™ DSP for wireless-centric The TFR6151 is a single-chip transceiver with quad-band support based applications, the TBB2010 is extremely efficient. The baseband’s on a direct conversion (DC) architecture. This device integrates several on-chip memory and fast, four-channel DMA controller allow for external components to reduce complexity, part count and cost of the RF quick data transfers. Page mode with external memory access also subsystem, including vocoders and vocoder tanks. By integrating what facilitates data movement. was previously several external filtering devices, the DC architecture of the TRF6151 reduces a manufacturer’s BOM by approximately 30 percent Key Features from RF devices with the super heterodyne architecture. • Dual-core architecture combining TI’s C54x™ DSP and an ® ARM7TDMI core Key Features • On-chip memory • Single-chip transceiver with quad-band support • Four-channel DMA controller • Direct conversion architecture • Page mode for external memory access • GPRS Class12/CS4 compliant • Full integration of VCO and VCO tanks TWL3014 Analog Baseband • Integrated voltage regulators, PA control loop, PLL loop The TWL3014 analog baseband integrates all the power management filters and VCXO and analog functions on a single chip, reducing board space • N-fractional synthesizer requirements, chip count and development costs. The device includes • 7 mm x 7 mm QFP package voiceband and baseband codecs and features programmable low-dropout voltage regulators. Key Features • Single-chip solution integrates power management functions • Voice band codecs • Single/Multi-slot baseband codecs • I/Q RF interface and GMSK modulator in UL path • LDO voltage regulators with programmable voltage • Battery charger interface; control of either 1-cell Li-ion or 3-series Ni-MH/Ni-CD cell batteries • 1.8-V or 3-V automatic frequency control/power Control SIM interface • 1.8-V or 3.3-V external memory • Headset audio interface, LED drivers • 10 mm x 10 mm MicroStar BGA™ package
Texas Instruments 2007 Wireless Terminals Solutions Guide 12 TCS Chipset and OMAP-Vox™ Solutions
GPRS
TCS2110 Chipset Key Benefits The TCS2110 chipset and complete reference design support • Complete hardware and software solution for GPRS handset Class 12 GPRS and offer software compatibility with TI’s TCS2010 • Class 12 GPRS with headroom for additional applications and TCS2200 GSM/GPRS chipset solutions. It provides MIPS and features processing headroom for manufacturers to add features and • Reduced BOM cost through high integration levels applications, and also incorporates a power-split technique for • Software compatible with TCS2200 and TCS2010 delivering low power consumption. GSM/GPRS chipsets TCS2110 components include: • Integrated EOTD location determination • TBB2110 digital baseband combines TMS320C54x™ DSP with • Optimized interface to OMAP™ applications processors ARM7TDMI® processor for multimedia applications • TWL3014 analog baseband with power-split technique for • Easy-to-use software development environment for low power consumption embedded applications • TRF6151 single-chip, quad-band RF transceiver with dual-conversion architecture A complete set of communication software is provided as part of the TCS2110 solution, along with a comprehensive TCS wireless software suite that provides a range of embedded applications including WAP2.0 stack and browser, EMS and MMS messaging clients, Bluetooth® protocol stack and profiles.
TBB2110 Digital Baseband TWL3014 Analog Baseband 32-kHz Crystal TCXO TRF6151 RF Transceiver (GSM/GPRS) Baseband Voltage Dual- Backup Serial Port Regulation GSM850/GSM900 Band SLICER DIV-2 RTC I PA
MCU APC Phase DPLL & CLKM WIDOG INTH ULPD Serial Port AFC Q Comp ADAC SPI Test Serial GSM1800/GSM1900 GEA Access Timing Interface ARM7™ MCU TPU Port Serial PAD Core Die ID Port M Div. TSP Voiceband Timer 1 3.6 GHz Serial Port Clock Gen SIM Timer 2 SRAM W R Phase Voltage r ® PWL Auxilary Div. Comp Regulators Switchplexer i ARM I/O Baseband DMA (4+) Drivers SRAM t Micro UART Codec e IRDA WIRE N Divide :2/:4 B PWT Voltage SRAM u LNA850/LNA900 TMS320C54x™ Reference f LPG Voiceband I f DSP CRYPT Power Codec SRAM e LNA1800 r Subchip 2 Control RIF I C VBAT Q Battery LNA1900 VBACKUP MCSI SIM CARD Charger Monitoring VCHG UART Interface Interface ADC JTAG Modem ICHG
EEPROM Battery Buzzer External Keyboard Memory SIM Card LED
LCD Vibrator
Wireless Terminals Solutions Guide Texas Instruments 2007
TCS Chipset and OMAP-Vox™ Solutions 13 GPRS
TBB2110 Digital Baseband TRF6151 RF Transceiver The TBB2110 is a dual-core, high-performance digital baseband that The TRF6151 delivers GSM/GPRS reception as part of the TCS2110 includes a powerful shared-memory architecture. It combines TI’s chipset. It is a single-chip transceiver with quad-band support based on low-power TMS320C54x™ DSP with an ARM7TDMI® RISC processor a direct conversion (DC) architecture. This device brings together several to support multi-slot GPRS Class 12 with the corresponding data external components to reduce complexity, part count and cost of the RF throughput and extra processing headroom for manufacturers to subsystem, including vocoders and vocoder tanks. By integrating what deliver their own value through added applications and features. was previously several external filtering devices, the DC architecture of the TRF6151 reduces a manufacturer’s BOM by approximately 30 percent Key Features from RF devices with the super heterodyne architecture. • TMS320C54x DSP with Data/Program memory on-chip • ARM7TDMIE™ running internal SRAM Key Features • 130-nm CMOS technology • Single-chip transceiver with quad-band support • 3.3-V I/Os, 1.8-V cores • Direct conversion architecture • Memory protection unit • GPRS Class 12/CS4 compliant • DMA controller • Full integration of VCO and VCO tanks • Real Time Clock (RTC) • Integrated voltage regulators, PA control loop, PLL loop • GSM ultra-low-power device (ULPD) filters and VCXO • HW accelerator for GPRS encryption • N-fractional synthesizer • Die-ID cell • 7 mm x 7 mm QFP package • Two UARTS, one supporting IRDA control • SIM interface (3.3-V and 1.8-V compliant) • 12 mm x 12 mm MicroStar BGA™ package
TWL3014 Analog Baseband The TWL3014 analog baseband integrates all the power management and analog functions on a single chip, reducing board space requirements, chip count and development costs. The device includes voiceband and baseband codecs and features programmable low-dropout voltage regulators. Key Features • Single-chip solution integrates power management functions • Voice band codecs • Single/Multi-slot baseband codecs • I/Q RF interface and GMSK modulator in UL path • LDO voltage regulators with programmable voltage • Battery charger interface; control of either single-cell Li-Ion or 3-series Ni-MH/Ni-CD cell batteries • 1.8-V or 3-V automatic frequency control/power Control SIM interface • 1.8-V or 3.3-V external memory • Headset audio interface, LED drivers • 10 mm x 10 mm MicroStar BGA™ package
Texas Instruments 2007 Wireless Terminals Solutions Guide 14 TCS Chipset and OMAP-Vox™ Solutions
GPRS
TCS2200 Chipset Key Benefits Targeted at multimedia Java™ handsets, TI’s TCS2200 chipset • Integrated applications processor and digital solution and reference design deliver the enhanced performance baseband leverage proven dual-core modem architecture and low power consumption required for processing-intense • Enhanced application processing with color display, multimedia applications. music and security TCS2200 components include: • Low system power consumption through split • TBB2200 digital baseband with integrated TI DSP and ARM® cores power-down techniques • TWL3016 analog baseband with integrated power management • Security protection through hardware features and • TRF6151 quad-band RF transceiver third-party security library • Fast data movement and extended memory resourced Storage and fast data movement facilities are gained through the with DMA TCS2200’s extended memory resources and fast direct memory access • Page-mode interface for external memory (DMA) controller. The solution is software compatible with the • Location determination through integrated EOTD TCS2110 and TCS2010, includes a L1/L2/L3 GSM/GPRS protocol stack • Full peripheral set including USB, MMC, Memory Stick®, and a full peripheral set with USB, MMC, Memory Stick®, Bluetooth® Bluetooth® wireless technology and others wireless technology and others. The fully type-approved TCS2200 reference design includes a full BOM, detailed board design with schematics and layout. A complete set of development tools allows manufacturers to easily differentiate capabilities.
TWL3016 Analog Baseband and Power Management TBB2200 Digital Baseband TRF6151 RF Transceiver (GSM/GPRS) Dual- GSM850/GSM900 Band MCSI I PA RAM Voltage Regulation TMS320C54x™ Rhea EDGE 32 K McBSP-128 Phase DSP MP3 McBSP Q Comp Bluetooth® Baseband Backup Serial Port Regulation Serial GSM1800/GSM1900 SRAM Controller Interface 5 MB DMA Clock APC, AFC PAD Generator Internal ADAC M UART BUS Div. Bluetooth® MCU Controller Timing 3.6 GHz ARM7TDMI® Rhea UART Serial Port Serial Port IrDA Core MMC/SD R Phase Voltage 2 Div. Regulators I C Voiceband Baseband Comp Switchplexer MEM I/F USB Client Serial Port Codec Page Mode CRYPTO N Divide :2/:4 LCD I/F Auxiliary Voiceband LNA850/LNA900 Drivers Codec I LNA1800 Voltage Stereo Q Reference LNA1900 Power Control DAC
FLASH SRAM SIM Card Battery Charger Monitoring Interface Interface ADC
Wireless Terminals Solutions Guide Texas Instruments 2007
TCS Chipset and OMAP-Vox™ Solutions 15 GPRS
TBB2200 Digital Baseband TRF6151 RF Transceiver The TBB2200 provides the connectivity and capabilities required for Specifically designed for GSM/GPRS reception as part of the TCS2200 the latest multimedia applications. It features TI’s proven digital base- chipset, the TFR6151 transceiver is a single-chip transceiver with band architecture, integrating TI’s leading, low power TMS320C54x™ quad-band support based on a direct conversion (DC) architecture. This DSP and the ARM7TDMI® core. The TBB2200 runs a complete Class 12 device integrates several external components to reduce complexity, part modem and includes a TCS wireless software suite. count and cost of the RF subsystem. By integrating what was previously several external filtering devices, the DC architecture of the TRF6151 Key Features reduces a manufacturer’s BOM by approximately 30 percent from RF • Dual core architecture including C54x™ DSP and ARM7TDMI core devices with the super heterodyne architecture. • ARM® processor with DMA and page-mode access • Complete Class 12 modem Key Features • Full suite of Java™ and embedded multimedia applications • Single-chip transceiver with quad-band support • USB client port • Direct conversion architecture • Parallel port for color LCDs • GPRS Class 12/CS4 compliant ® • Interfaces for Smart Card, Bluetooth wireless technology • Full integration of VCO and VCO tanks • External NAND flash • Integrated voltage regulators, PA control loop, PLL loop • 12 mm x 12 mm MicroStar BGA™ package filters and VCXO • 130-nm CMOS technology • N-fractional synthesizer • 7 mm x 7 mm QFP package TWL3016 Analog Baseband The TWL3016 analog baseband integrates all analog and power management functionality on a single chip. Through power-down sleep modes, the TWL3016 extends system standby time significantly, contributing to the overall battery savings the TCS2200 provides. The device also includes a D/A converter for applications like MP3 music, and an 8-Ω amplifier for hands-free speaker phone operation. Key Features • Integrated high-fidelity audio DAC • Integrated hands-free and headphone amplifiers • Overall clock input reduction of 50 percent • 10 mm x 10 mm MicroStar BGA™ package
Texas Instruments 2007 Wireless Terminals Solutions Guide 16 TCS Chipset and OMAP-Vox™ Solutions
GSM
TCS2300 “LoCosto” Single-Chip Handset Solution Key Benefits TI’s unique TCS2300 “LoCosto” solution is the industry’s first • GSM only architecture to provide single-chip solutions for ultra low-cost to • Voice codecs F/R, H/R, EF/R, AMR entry-level wireless handsets. Using TI’s advanced DRP™ technology • Dual band: 850/1900, 900/1800, 850/1800 or 900/1900 and 90-nm process technology, the TCS2300 solution combines radio • Black and white LCD (96 x 96 pixels) and color LCD support and all baseband processing into one highly integrated solution, (up to 65 k, 128 x 128 pixels) reducing component count, board space, power consumption and • SAIC and TTY support system cost. With the TCS2300 solution, wireless handsets can be • MIDI ringtone and playback - 16 polyphonics made as compact as match boxes and inexpensively enough to open • Headset, handsfree, vibrator new markets around the world. • FM connectivity The TCS2300 solution combines an ARM7™ general-purpose RISC • Hardware security (Flash content protection, ME personalization, processor core with a TMS320C54x™ DSP core, both operating at IMEI protection) OMTP1.0 compliant 104 MHz, for high performance with low power consumption. An • No external SRAM needed improved memory interface with DMA supports a variety of external • 2.0-MB flash memory types efficiently. Reference designs are available for the solutions and come with extensive software support for codecs, testing and other standards to help simplify design. The TCS2300 solution supports standard voice codecs in dual-band phones. Support for both color and monochrome displays, MIDI 16 polyphonic ringtones, system security and highly optimized memory handsets with a black-and-white display to a slightly more expensive footprint offering provides the normal complement of features device including a color display and FM radio. These sub-$40 handsets demanded in basic phones. lower the threshold for mass market adoption especially in emerging markets where the next billion subscribers will come from. The TCS2300 solution offers a scalable platform enabling cost-effec- tive development of handsets ranging from ultra low-cost GSM TI’s TCS2300“ LoCosto” solution is currently in volume production.
TCS2300 “LoCosto“ Solution
Keyboard LCD TWL3029 32 Khz
LCD CDD On/Off RTC 32 KHz SPI 13 MHz ULPD ARM7TDMIE® CDSP Power Power Subchip Sources On_nOff USIM Management Cport DMA Sim Card Wakeup_int. Voice Audio Codec Audio VSP I2S Front- Bus DRP™ USB USB Control end + PA Transceiver VSP USB Nand Flash UART EMIF Interface Vibrator USB 12C Mcsi
LED White LED I2C Boost Start ADC 26 MHz Aux NOR MADC RAM ADC IN’s FLASH
BCI
Battery
Wireless Terminals Solutions Guide Texas Instruments 2007
TCS Chipset and OMAP-Vox™ Solutions 17 GPRS
TCS2310 “LoCosto” Single-Chip Handset Solution Key Benefits Integrating TI’s groundbreaking DRP™ technology and advanced 90-nm • GPRS Class 10 process technology, the TCS2310 “LoCosto” solution successfully • SAIC and TTY support incorporates functions that previously have not been combined in a • WAP/SMS/EMS/MMS single device. With the RF section included in the device, designs save • Dual-color displays space and components while requiring less interconnect for greater • MP3/AAC player and ringers reliability. The digitization of what was formerly analog functionality • MIDI 32 polyphonics player and ringer improves testability, enables built-in calibration, reduces drift effects • Integrated camera support up to 1 megapixel and allows for auto-compensation for process and temperature • Video MPEG-4/H.263 support up to QCIF15 fps variances. All of these advantages add to the cost savings and the • TI Bluetooth® protocol stack and profiles include stereo potential to create phones in new sleeker form factors. headset and A2DP The TCS2310 solution adds support for MP3/AAC ringers and players, • Advanced connectivity support including WLAN and GPS camera and video, MIDI 32 polyphonic ringtones, Bluetooth®, • Hardware security (Flash content protection, ME personalization, non-removable and removable mass storage media, additional external IMEI protection) OMTP1.0 compliant program and data memory, peripheral interfaces and a complete set • Non-removable and removable mass storage interface of functionality required for entry-level handsets. The scalable TCS2310 solution enables cost-effective development of differentiated handsets addressing multiple market segments, from low-cost GPRS handsets with a black-and-white screen to entry-level GPRS devices featuring a basic VGA camera and MP3 player, to high-end GPRS devices with features including 1-megapixel camera, video, and advanced connectivity such as Bluetooth, WLAN or GPS. TI’s TCS2310 “LoCosto” solution is currently in volume production.
TCS2310 “LoCosto“ Solution RS MMC/T-FLASH LCD Camera TWL3029 Secondary LCD Keyboard 32 Khz LCD Keyboard CDD On/Off RTC 32 KHz SPI 13 MHz ULPD ARM7TDMIE® CDSP Power Power Subchip Sources On_nOff USIM Management Cport DMA Sim Card Wakeup_int. Voice Audio Codec VSP Audio I2S Bus Front- DRP™ end + PA USB USB Control Transceiver VSP USB Nand Flash UART EMIF Interface Vibrator USB 12C Mcsi
2 LED White LED I C ® Boost IrDA Bluetooth Start ADC Companion NOR NAND Aux MADC RAM ADC IN’s FLASH FLASH 26 MHz
BCI
Battery
Texas Instruments 2007 Wireless Terminals Solutions Guide 18 TCS Chipset and OMAP-Vox™ Solutions
GSM/GPRS
TCS2305 GSM “LoCosto ULC” and TCS2315 GPRS Key Benefits “LoCosto ULC” Chipsets TCS2305 GSM Solution: The TCS2305 (GSM) and TCS2315 (GPRS) are part of TI’s “LoCosto • Leverages 65-nm process with advanced DSP and ULC” family of single-chip third-generation Ultra Low-Cost (ULC) ARM® technologies solutions which have set a new standard for features and a compelling • Integrated DRP™ technology, single-chip solution user experience in the ULC handset segment. By combining advanced • Delivers a compelling next-generation user experience 65-nm process technology, a TMS320C54x™ DSP with a powerful in ULC handsets ARM7™ core, and integrating TI’s market-leading DRP™ technology, – Lowest cost color handset with no additional external “LoCosto ULC” handsets with high performance, robust functionality SRAM memory (128 x 160, 65-k color displays) and innovative form factors are possible in the most price-sensitive – Fast CPU processing for smooth user interface processing handsets. – CD-quality (44.1 kHz) MP3 ringers and polyphonic ringers – High-end full-duplex voice quality The TCS2305 and TCS215 “LoCosto ULC” solutions are optimized for – FM connectivity with integrated stereo support emerging regions such as India, China, Brazil and Russia. In addition – Record FM for on-the-fly ringers to enabling lowest cost color phones, these highly flexible and • Optimized system design reduces component count scalable solutions also address value-conscious segments in more and PCB board size relative to previous generation mature markets. – Over 25 percent reduction in eBOM – Lower overall component count by some 40 percent The “LoCosto ULC” solutions extend the established performance – Smaller modem by as much as 35 percent reduces of TI’s successful “LoCosto” family of single-chip wireless handset PCB board size solutions. The software portability from one generation of “LoCosto” • USB charging for universal and easy charger access solution to the next gives manufacturers and operators the ability to • Lower power consumption for longer talk (30%) and rapidly and cost-effectively differentiate products and service offerings standby (60%) times for both emerging and mature markets, crossing over every language, • Innovative handset form factors and larger batteries region and subscriber type. enabled by smaller PCB requirements
TCS2305 “LoCosto ULC“ GSM
Emulator NOR pSRAM SIM/ Pod Flash USIM
JTAG/ Memory Interface SIM Emulation I/F
I2C Display SPI ARM7TDMI® TMS320C54x™ Subsystem DSP Battery On/Off Charger GPIO DRP™ Technology Integrated Audio Speaker GSM only USB Charger Speaker I2C, MCSI Power Manager FM Timers, Interrupt Controller, Mailbox In/Out UART Boot/Secure ROM Audio/Voice LED Codec USB Connector M-Shield™ Security Technology: White-LED Vibrator Keys, RNG, SHA1/MD5, DES/3DES, Secure ROM/RAM Boost RF PA/Front End DRP™ Battery GSM DMA DUAL-BAND Keypad Key Pad
Wireless Terminals Solutions Guide Texas Instruments 2007
TCS Chipset and OMAP-Vox™ Solutions 19 GSM/GPRS
The Richest Feature Set for ULC Handsets Key Benefits The TCS2305 and TCS2315 solutions have the powerful processing capabilities required for a ULC feature set far richer than previously TCS2315 GPRS Solution: possible. • All of the benefits of the TCS2305 GSM solution plus the following: Enhanced capabilities now possible in ULC handsets include a – GPRS relatively high-resolution color display without additional external – Built-in VGA camera support, with JPEG encode/decode and SRAM, high-end full-duplex voice quality, near CD-quality MP3 and advanced imaging functions such as rotation, zoom, etc. polyphonic ringers, longer talk time and standby time, stereo FM radio – CD-quality MP3 stereo playback capability for a rich music connectivity, VGA camera support, MP3 playback and mass storage – USB connectivity for data transfer between PC and phone (SD/MMC) support, USB connectivity and charging, handsfree – Mass storage capability (SD/MMC) to store MP3 music and speakerphone operation, vibration ringer, headset support, Bluetooth® ringers, data, and contacts connectivity and other functionality. – Bluetooth® connectivity (with multiple profiles includes stereo headset) Sustainable Low Cost Structure Several chip- and system-level factors contribute to the sustainable low cost structure of “LoCosto ULC” solutions. Starting with 65-nm increased integration and advanced packaging enable handsets in process technology, additional cost-optimization techniques include an innovative and fashionable form factors. A smaller PCB means that the approximate 25 percent reduction in a ULC handset’s electronic size of the handset’s battery can be increased, giving the device a eBOM, reduced PCB area caused by smaller chips and greater silicon longer battery life with extended standby and talk times. integration, and a cost-optimized PCB technology. Integration of power management with the digital baseband into a single chip Even low-cost handsets are afforded the protection of TI’s scalable also yields reduction in the modem PCB area. and hardware-based M-Shield™ security technology. The M-Shield capabilities of the “LoCosto ULC” solutions safeguard the handset With the RF section included in one device, space requirements and owner’s sensitive personal information and defeat attempts to unlock component counts are reduced. Reduced chip count, smaller PCBs, the handset’s SIMlock code.
TCS2315 “LoCosto ULC“ GPRS
NOR Emulator NAND pSRAM SIM/ Pod Flash USIM
JTAG/ NAND Memory Interface SIM Emulation Interface I/F Camera I/F Camera SD/MMC Serial Parallel Module
2 Secondary ARM7TDMI® TMS320C54x™ I C Display SPI Subsystem DSP Battery On/Off DRP™ Technology Integrated Charger Audio GPIO GSM/GPRS USB Charger Speaker IrDA Speaker Power Manager Timers, Interrupt Controller, Mailbox In/Out Bluetooth® I2C, MCSI Audio/Voice FM UART Boot/Secure ROM Codec LED USB USB Connector M-Shield™ Security Technology: Transceiver Keys, RNG, SHA1/MD5, DES/3DES, Secure ROM/RAM Vibrator RF PA/Front End DRP™ GSM/GPRS White-LED Boost Battery DMA QUAD-BAND
Display Controller Keypad Key Pad Parallel-Serial
Primary Display
Texas Instruments 2007 Wireless Terminals Solutions Guide 20 TCS Chipset and OMAP-Vox™ Solutions
GPRS
TCS2600/TCS2630 Chipsets Key Benefits The TCS2600 and TCS2630 are complete hardware/software reference • Proven GSM/GPRS modem technology and EDGE upgradeable designs for high-performance multimedia smartphones, delivering • Complete reference design includes S60 Platform and twice the performance of TI’s previous generation while extending Microsoft® Windows Mobile® battery life. It’s reduced part count and integrated set of peripherals • Twice the performance over previous generation, on-chip lower BOM costs and free up space for additional functionality. including 70 percent audio performance improvement and 8X Java™ processing increase Designed for security, the TCS2600 and TCS2630 include 48-kB secure • High-level mobile OS support ROM and 16-kB secure RAM with dedicated NOR/NAND flash memory • Software compatible with OMAP™ processors and write production. A true random number generator (TRNG) aids in and applications encryption and authentication standards. The numerous software • OMAP Developer Network and Independent modules and hardware features of the chipsets ensure a secure mode OMAP Technology Centers support of operation where information stored on the device is safeguarded • Highly integrated with reduced smartphone BOM and ownership rights of content and programs are protected. and chip count • Memory protection on FLASH and SDRAM interface TCS2600 components include: • Hardware acceleration for Java • OMAP730 with integrated Class 12 GSM/GPRS digital baseband • Complete peripherals set: USB On-the-Go, SD/MMC/SDIO, ™ and dedicated ARM926 applications processor dedicated 802.11 a/b/g high-speed interface, Fast IrDA • TWL3016 analog baseband with complete power management and more • TRF6151 quad-band RF transceiver TCS2630 components include: • OMAP733 (OMAP730 with 256 MB stacked SDRAM) • TWL3016 analog baseband with complete power management • TRF6151 quad-band RF transceiver
TWL3016 Analog Baseband and Power Management TRF6151 RF Transceiver (GSM/GPRS) OMAP730 Integrated Digital Baseband Dual- GSM850/GSM900 Band and Dedicated Applications Processor Voltage Regulation I PA
TSP Voice Phase Baseband Baseband Backup Q Comp Serial Port Regulation GSM/GPRS SIM/SPI GSM1800/GSM1900 9-Channel Clock Serial DSP Modem OP/O APC,AFC Interface SDRAM DMA Class 12 (AMR) Generator UART/IrDA Internal ADAC PAD UART/PWMs MCU BUS M Mailbox Serial Port Controller Timing Div. Serial Port 3.6 GHz Traffic ARM9® Timer (3) Test Access Controller/ Port R Phase Voltage Application WDT/RTC Baseband NOR/NAND Memory Div. Comp Regulation Switchplexer SRAM Processors Int Ctrl Codec I/G I2C Host Voiceband µ Serial Port OMAP™ Wire/UART Voiceband N Divide :2/:4 Core Processor Keyboard Auxiliary Codec LNA850/LNA900 Drivers I UART LNA1800 Frame Voltage USB Client/OTG Stereo Q LCD Buffer 2 Reference DAC Ctrl AC97/I S Power Control LNA1900 192 KB MMC SIM Card Battery Charger Monitoring Interface Interface ADC
See OMAP™ Processor information on page 32
Wireless Terminals Solutions Guide Texas Instruments 2007
TCS Chipset and OMAP-Vox™ Solutions 21 GPRS
OMAP730 and OMAP733 Integrated Digital Baseband TWL3016 Analog Baseband and Dedicated Applications Processors The TWL3016 analog baseband integrates all analog and power TI’s OMAP730 combines an ARM926EJ-S™ applications processing management functionality on a single chip. Through power-down core with TI’s GSM/GPRS digital baseband modem, delivering twice sleep modes, the TWL3016 is able to extend system standby time the application performance of its predecessor (OMAP710), and significantly, contributing to the overall battery savings the doubling standby time for handsets and smartphones. TCS2600/TCS2630 provides. The device also includes a D/A converter for applications like MP3 music and an 8-Ω amplifier for The OMAP733 includes the same features as the OMAP730 and adds hands-free speakerphone operation. support for 256-MB stacked SDRAM. The result is less power consumption versus traditional external memory configurations, Key Features making the OMAP733 an ideal engine for space-constrained systems • Integrated high-fidelity audio DAC or small, light mobile devices. • Integrated hands-free and headphone amplifiers • Overall TCS2600/TCS2630 clock input reduction of 50 percent Over 40 on-chip integrated peripherals reduce board space by half, as compared with the previous generation, saving cost and providing space for added functionality. An SRAM frame buffer delivers faster TRF6151 RF Transceiver streaming media and application performance. The OMAP73x includes Specifically designed for GSM/GPRS reception as part of the a standard interface to 54-Mbps WLAN technology, along with TCS2600/TCS2630 chipsets, the TFR6151 transceiver is a single-chip accelerated Java™ processing, web browsing, personal information transceiver with quad-band support based on a direct conversion (DC) management (PIM) applications, location-based services and more. architecture. This device integrates several external components to A comprehensive hardware-based security system features reduce complexity, part-count and cost of the RF subsystem, including bootloaders, secure RAM and ROM, a secure mode of operation, vocoders and vocoder tanks. By integrating what was previously several and hardware accelerators to address security standards. external filtering devices, the DC architecture of the TRF6151 reduces a manufacturer’s BOM by approximately 30 percent from RF devices with Key Features the super heterodyne architecture. • Low-voltage 130-nm technology • 1.1-V to 1.5-V core, 1.8-V to 2.75 V I/O Key Features • Extremely low power consumption: less than 10 µA in • Single-chip transceiver with quad-band support standby mode • Direct conversion architecture • Split power supplies for application processing, digital baseband • GPRS Class12/CS4 compliant and real-time clock enable precise control over power consumption • Full integration of VCO and VCO tanks • Optimized clocking and power management: only two clocks • Integrated voltage regulators, PA control loop, required at 13 MHz and 32 kHz PLL loop filters and VCXO • N-fractional synthesizer • 7 mm x 7 mm, 48-pin QFP package
Texas Instruments 2007 Wireless Terminals Solutions Guide 22 TCS Chipset and OMAP-Vox™ Solutions
GPRS
TCS2700 Chipset Key Benefits The TCS2700 chipset solution and reference design includes a range • Ideal for Class 12 GSM/GPRS wireless handsets, of features that deliver improved multimedia applications performance smartphones and Internet access devices to wireless handsets, smartphones and other Internet access devices. • Leverages OMAP750 processor for enhanced performance Based on the OMAP750 applications processor, the TCS2700 chipset’s of streaming video and high-end imaging applications improved throughput and faster memory options enhance the • D/A converter in analog baseband enables longer MP3 music processing speed of applications including streaming video and playback and better hands-free speaker phone operation high-end imaging. • Extended standby time and battery savings through The TCS2700 is designed for Class 12 GSM/GPRS and includes three integrated analog baseband and power management devices components as part of the chipset, providing battery savings, reduced • Compatibility across all OMAP™ applications processors board space and lower cost. • OMAP Developer Network and Independent OMAP Technology Centers support TCS2700 components include: • Complete reference design and set of peripherals • OMAP750 integrates a GPRS modem baseband and ARM926™ • Mobile OS support core for applications processing • TWL3016 analog baseband with integrated power management • TRF6151 RF transceiver based on direct conversion (DC) architecture
TWL3016 Analog Baseband and Power Management TRF6151 RF Transceiver (GSM/GPRS) OMAP750 Integrated Digital Baseband Dual- GSM850/GSM900 Band and Dedicated Applications Processor Voltage Regulation I PA TSP Voice Phase Baseband Backup Comp Baseband Serial Port Regulation Q GSM/GPRS SIM/SPI GSM1800/GSM1900 9-Channel Clock Serial DSP Modem OP/O Generator APC, AFC Interface SDRAM/ DMA Class 12 (AMR) Mobile DDR UART/IrDA Internal ADAC PAD UART/PWMs MCU BUS M Mailbox Serial Port Controller Timing Div. Serial Port 3.6 GHz Traffic ARM9® Timer (3) Test Access Port Controller/ Applications WDT/RTC Baseband R Phase Voltage NOR/NAND Memory Div. Comp Regulators Processor Int Ctrl Voiceband Codec Switchplexer Flash I/G 2 I C Host Serial Port ™ µ OMAP Wire/UART Voiceband N Divide :2/:4 Processor Core Keyboard Auxiliary Codec LNA850/LNA900 Drivers I UART Voltage LNA1800 Frame USB Client/OTG Stereo LCD 2 Reference DAC Q Buffer AC97/I S Power Control LNA1900 Ctrl 192 KB MMC SIM Card Battery Charger Monitoring Interface Interface ADC
See OMAP™ Processor information on page 33
Wireless Terminals Solutions Guide Texas Instruments 2007
TCS Chipset and OMAP-Vox™ Solutions 23 GPRS
OMAP750 Integrated Communication and Dedicated TWL3016 Analog Baseband Applications Processor The TWL3016 analog baseband integrates all analog and power The OMAP750 extends capabilities of the OMAP73x devices while management functionality on a single chip. Through power-down including a range of features that improve multimedia application sleep modes, the TWL3016 is able to extend system standby time performance. The single-chip OMAP750 integrates an ARM926™ significantly, contributing to the overall battery savings the TCS2700 core dedicated to applications processing with a complete Class12 provides. The device also includes a D/A converter for applications GSM/GPRS modem baseband subsystem that consists of an ARM7™ like MP3 music and an 8-Ω amplifier for hands-free speakerphone core with TI’s low-power TMS320C54x™ DSP core. operation. The OMAP750 incorporates faster memory options, including support Key Features of double data rate (DDR) memory that increases processing speed • Integrated high-fidelity audio DAC over the OMAP730, which only supported SDRAM. Improved • Integrated hands-free and headphone amplifiers throughput from an internal frame buffer also enhances processing • Overall TCS2700 clock input reduction of 50 percent of multimedia applications, including streaming video and high-end imaging functions. TRF6151 RF Transceiver
Key Features The TRF6151 delivers GSM/GPRS reception as part of the TCS2700 • Improved multimedia and application performance chipset. It is a single-chip transceiver with quad-band support based on • Class 12 GSM/GPRS modem baseband and ARM926 core for a direct conversion (DC) architecture. This device brings together several applications processing external components to reduce complexity, part-count and cost of the RF • Increased processing speeds through DDR memory option subsystem, including vocoders and vocoder tanks. By integrating what and internal frame buffer was previously several external filtering devices, the DC architecture of • Security protection through hardware-based security platform the TRF6151 reduces a manufacturer’s BOM by approximately 30 percent • Extended list of peripherals, including parallel OCP camera from RF devices with the super heterodyne architecture. interface for high-resolution imaging • GPS, WLAN and Bluetooth® wireless technology Key Features • 2.0-megapixel camera • Single-chip transceiver with quad-band support • Pin-to-pin compatible with OMAP730 • Direct conversion architecture • GPRS Class12/CS4 compliant • Full integration of VCO and VCO tanks • Integrated voltage regulators, PA control loop, PLL loop filters and VCXO • N-fractional synthesizer • 7 mm x 7 mm, 48-pin QFP package
Texas Instruments 2007 Wireless Terminals Solutions Guide 24 TCS Chipset and OMAP-Vox™ Solutions
EDGE
OMAP850 Chipset Key Benefits The OMAP850 EDGE chipset and complete reference design are • Complete pre-FTA certified, smartphone EDGE targeted at wireless smartphones and PDAs. It serves as the ideal Class 12 reference design migration path to EDGE for manufacturers using the TCS2600 • Data rates of 3X the throughput of GSM/GPRS devices GSM/GPRS chipset. • Applications including MPEG-4 video and Windows ® OMAP850 chipset components include: Media video, MP3, 2.0 megapixel camera, etc. • OMAP850 applications processor with quad-band EDGE modem • Software compatible with TCS2600 GSM/GPRS chipset • TWL3027 integrated analog baseband with full power • Modules available for camera, GPS and WLAN ® management and audio codec • TI’s highly integrated BRF6150 Bluetooth wireless • BRF6150 Bluetooth® single chip featuring TI’s patented technology based on TI’s patented DRP™ technology DRP™ technology • High-level mobile OS support, including Symbian OS™, ® ® ® • Fully optimized third-party RF S60, Microsoft Windows Mobile and Linux • OMAP™ Developer Network and Independent The OMAP850 chipset is a flexible, scalable solution with the OMAP Technology Centers support performance and low power required for systems addressing EDGE applications, including multimedia, gaming and camera functionality. In addition to the solution’s components, modules are also available for incorporating camera, GPS and WLAN capabilities to bring added, optional capabilities.
TWL3027 Analog Baseband OMAP850 Integrated Digital Baseband and Power Management and Dedicated Applications Processor Voltage Regulation TSP Voice Baseband SIM/SPI Baseband Backup 9-Channel GSM/EDGE Serial Port Regulation SDRAM/ DMA DSP Modem OP/O UART/IrDA Clock Mobile DDR Generator APC,AFC UART/PWMs ADAC Mailbox Internal MCU BUS Serial Port Traffic ® Timer (3) Controller Timing ARM9 Serial Port Controller/ Applications WDT/RTC Test Access Optimized NOR/NAND Quad-band Memory Processor Int Ctrl Port GSM/GPRS/ Flash 2 EDGE RF I/G I C Host EGPRS OMAP™ µWire/UART Audio Baseband Processor Core Keyboard Serial Port Codec Auxiliary Audio UART Drivers Codec Frame USB Client/OTG LCD Buffer 2 Voltage Ctrl AC97/I S Stereo 192 KB MMC Reference DAC Power Control SIM Battery Charger Monitoring Interface Interface ADC
See OMAP™ Processor information on page 34
Wireless Terminals Solutions Guide Texas Instruments 2007
TCS Chipset and OMAP-Vox™ Solutions 25 EDGE
OMAP850 Integrated Digital Baseband and Dedicated BRF6150 Bluetooth® Solution Applications Processor TI’s BRF6150 is a highly integrated Bluetooth v1.2 single-chip solution The OMAP850 high-performance applications processor is integrated with that integrates TI’s baseband with Bluetooth® wireless technology, RF, a digital baseband and EDGE co-processor. It is based on the OMAP750 ARM7TDMI® and power management into a single device for enhanced applications processor for GSM/GPRS with added EDGE capabilities. It performance, reduced cost and reduced board space. The BRF6150 is enables applications including MPEG-4 video and Microsoft® Windows optimized for mobile terminals where performance and space are critical. Media® video, MP3, 2-megapixel camera and more. The device leverages TI’s advanced 130-nm digital CMOS process while incorporating advantages of DRP™ technology in a board layout of Key Features 50 mm2. • Based on previous generation OMAP750 applications processor • EDGE Class 12 Key Features • Quad vocoders for AMR, EFR, RF and HR • Full Bluetooth® wireless technology specification v1.2, including • Camera sensors and support for up to 2.0 megapixels eSCO, AFH and faster connection • Enhanced frame-buffer interface data rate • Direct connection to battery at 2.7 V to 5.5 V; 1.65 V to • DDR support addition 3.6 V via LDO • Secure boot, secure mode and hardware encryption accelerators • RF TX: 25 µA; RF RX: 27 µA; Deep-sleep 30 µA • Complete peripheral set • Improved RF performance with sensitivity of –85 dBm, TX Power + • Complete reference design, hardware and software 7 dBm and Class 1 ready • Blocking ~0 dBm at GSM bands TWL3027 Analog Baseband • Direct connection to battery with 8 external passives and a PCB The TWL3027 is an analog baseband device which, together with a layout area of 50 mm2 digital baseband device is part of a TI DSP solution intended for digital • Collaborative interface with WLAN and Bluetooth wireless cellular telephone applications including GSM 900, DCS 1800 and PCS technology v1.2 AFH 1900 standards (dual-band capability). • Complete reference designs with TI’s TCS chipsets and OMAP™ platform The TWL3027 includes a complete set of baseband functions to • Manufactured in TI’s 130-nm CMOS process perform the interface and processing of voice signals, interface and • Packaging: 4.5 x 4.5 x 0.8 ROM; or 4.5 x 4.5 stacked flash processing of baseband in-phase (I) and quadrature (Q) signals which prototypes support single-slot and multi-slot mode for both GMSK and 8-PSK modulations. The TWL3027 also includes associated auxiliary RF Third-Party RF Transceiver control features, supply voltage regulation, battery charging controls, and switch ON/OFF system analysis. A third-party RF transceiver has been fully optimized to work with the other above components in the OMAP850 chipset smartphone solution. Key Features • Applications include EGPRS, GSM900 and PCS1900 DSC1800 cellular telephones • Baseband codec single and multi-slot • GMSK/8PSK with I/Q RF interface • Auxiliary RF converters • SIM card interface • Five channel analog to digital converter • Audio DAC based on I2S format • Voice codec • Six low-dropout low-noise linear voltage regulators • Dedicated low quiescent current mode on regulators • High voltage (20 V), Li-Ion or NiMH battery charging control • Voltage detectors (with power-off delay) • Dedicated very low quiescent current supply domain • 143-ball MicroStar Junior BGA™ package
Texas Instruments 2007 Wireless Terminals Solutions Guide 26 TCS Chipset and OMAP-Vox™ Solutions
EDGE
OMAPV1030 Integrated GSM/GPRS/EDGE Solution Key Benefits The OMAPV1030 solution is one of the industry’s most highly integrated and optimized EDGE solutions, combining applications and modem on •Integrated modem and applications processing on a single core a single device to enable handset manufacturers to reduce costs • EDGE Class 10 support, Class 12 capable, UMA support and speed time to market. The baseband processor design expands • High-performance Java™ (including Java acceleration) on TI’s proven GSM/GPRS technology and leverages TI’s advanced • Ability to support HLOSs and Nucleus™ applications suites high-volume, 90-nm digital CMOS process technology. • Support for external memory cards including MMC/SD • Connectivity includes Wi-Fi®, Bluetooth® 2.0/EDR, IrDA The OMAPV1030 processor is based on the OMAP™ architecture and and USB OTG runs both GSM/GPRS/EDGE modem and applications processing on • Embedded security via hardware accelerators supporting a single OMAP core, ensuring a high-quality multimedia mobile terminal security, transactions security, and content security experience. The combination of the ARM926EJ-S™ and TI DSP is used • Re-usable APIs for maximum re-use across OMAP-Vox family to improve performance while reducing costs and power consumption, improving time-to-market resulting in longer battery life and usage times for consumers. Because • Complete TI system solution offering all OMAP-Vox™ solutions share a common software platform, this solution maximizes software re-use to bring overall development costs down and provides a natural and affordable roadmap from • Video: GSM/GPRS/EDGE to WCDMA. – Capture, playback and streaming MPEG-4/H.263 (QCIF) at 30-fps The OMAPV1030 solution is specifically designed to bring multimedia QVGA display functionality to mass market mobile phones, and delivers advanced – H.264 (QCIF) playback at 20-fps QVGA display capabilities to mid-range wireless handsets. The OMAPV1030 solution • 2D and 3D gaming 60 k polygons per second, 2-megapixel includes best-in-class high-end multimedia performance including: rasterization, 15 fps • Comprehensive audio/video codecs and imaging algorithms The OMAPV1030 solution supports all form factor requirements, • Ringtones: 64-polyphonic MIDI including PDAs, clamshells, bar-types and other mechanical designs. • Audio: MP3, stereo, AAC, AAC+, enhanced AAC+, WMA TI’s open-platform architecture provides manufacturers the flexibility • Still image: Camera up to 2 megapixel with 1.3 second and choice needed to differentiate their products to emerging markets shot-to-shot imaging: JPEG, GIF, EXIF, PNG, BMP worldwide. TI’s OMAPV1030 feature phone solution has been in • Dual LCD support (main LCD up to QVGA 256-k color) volume production since first quarter 2006.
SDRAM NOR/NAND SDR/DDR Flash USIM IrDA
Radio OMAPV1030 (Digital Interface) BlueLink™ EDGE Digital Baseband Processor Bluetooth®
GSM/GPRS/EDGE RF GSM/GPRS/ EDGE TMS320C55x™ Peripherals NaviLink™ GPS LED ™ Connectivity TWL3029 Analog, ARM926EJ-S Speakerphone Power Management, Subsystem Peripherals WiLink™ Audio Hi-Fi mWLAN
Microphone Sub-LCD Camera Hollywood™ USB-OTG Sensor MMC/SD/MS Connector Display Mobile TV Battery
Wireless Terminals Solutions Guide Texas Instruments 2007
TCS Chipset and OMAP-Vox™ Solutions 27 EDGE
OMAPV1035 “eCosto” Single-Chip Handset Solution Key Benefits The OMAPV1035 solution is the first to integrate GSM/GPRS/EDGE modem, digital RF and applications processor functionality onto the • Single chip with integrated RF, digital baseband and application same silicon. Codenamed “eCosto”, the device builds on the “LoCosto” processor for affordable EDGE multimedia devices single-chip cell phone solution and the multimedia capabilities of the • EDGE Class 12 release 4/5 compliant, DTM Class 11, UMA OMAP-Vox™ platform. • 65-nm process for smallest footprint and circuit board costs • Leverages TI’s innovative DRP™ technology Sharing the same platform with the OMAP-Vox family ensures software • Extensive connectivity options: BlueLink™ Bluetooth®, re-use for faster and more cost-effective feature phone development. WiLink™ WLAN, NaviLink™ GPS and Hollywood™ DTV Integrating the innovative RF capabilities of TI’s DRP technology with • USB high-speed and USB OTG support for high-speed the powerful processing of the OMAP-Vox architecture yields connectivity significant cost savings. As a result, mobile device manufacturers • TV-out support can bring compelling multimedia applications to low- and mid-range • SD/MMC/MS-Pro support for external storage wireless devices worldwide. • IMS/SIP support to enable VoIP, Push-to-Audio, Push-to-Video, The OMAPV1035 is the first 65-nm single-chip solution to support and video sharing EDGE, as well as to integrate modem, applications processor and RF • Embedded TI’s M-Shield™ technology for strong HW- assisted into a single offering. A powerful multimedia platform, the security and SmartReflex™ technologies for advanced power OMAPV1035 leverages the capabilities of advanced ARM® and DSP reduction technologies to deliver the following: • Complete TI system software offering with seamless migration from the OMAPV1030 • 30 fps video playback and record with QVGA display • A full 256-k palette of colors The OMAPV1035 is more scalable and adaptable to customer needs • 3-megapixel resolution camera support with sub-second delay with wide range of configuration and connectivity capabilities. The • User responsiveness as fast as 0.3 seconds shot-to-shot. common software foundation used across TI solutions allows for • “See What I See“ at 15 fps, 2D/3D gaming, audio/video codecs maximum software re-use, improving time to market and easing the and imaging algorithms (MP3, AAC+, eAAC+, WMA/WMV, Real) processing of porting application suites. TI’s open-platform architecture • 3D graphic processing up to 100-k polygons per second provides manufacturers the flexibility and choice needed to differentiate their products to emerging markets worldwide.
NOR Trace Emulator NAND pSRAM Mobile SIM/ Analyzer Pod Flash FLASH DDR USIM
Trace JTAG/ Memory Interface SIM Fast Emulation IrDA IrDA I/F NaviLink™ OMAPV1035 Camera I/F Camera GPS I2C Serial Parallel Sensor
Hollywood™ ARM926EJ-S™ TMS320C55x ™ Mobile DTV Subsystem DSP SPI I2C TWL3034 On/Off
WiLink™ DRP™ Technology Integrated Battery 32 kHz Crystal Charger mWLAN SDIO GSM/GPRS/EDGE RF System Interface Audio Power Reset Power Manager Coexistence Clock Manager Timers, Interrupt Controller, Mailbox BRF6300 Audio/Voice BlueLink™ Codec In/Out ® I2C, MCSI Boot/Secure ROM USB 2 OTG Controller 5.0Bluetooth Solution UART LED M-Shield™ Security Technology: SHA-1/MD5, DES/3DES, RNG, AES, PKA, Secure WDT, Keys USB Connector Vibrator Battery Shared Memory Controller/DMA RF PA/Front End DRP™ GSM/ GPRS/EDGE Keypad Key Pad Display Controller Parallel-Serial MS/MMC/SD/SDIO
MS/MMC/ QVGA SD/SDIO Color TFT Sub Display CARD Display
Texas Instruments 2007 Wireless Terminals Solutions Guide 28 TCS Chipset and OMAP-Vox™ Solutions
WCDMA
OMAPV2230 Integrated Solution Key Benefits The OMAPV2230 solution for 3G handsets provides size, performance and power consumption benefits by integrating both modem and • Advanced applications and modem integrated in one device applications on a single device. The digital baseband is based on enable a low-power, high-performance system solution proven WCDMA/EDGE/GPRS/GSM technology, and the applications • Enables worldwide operation for WCDMA/EDGE/GPRS/GSM processor is based on TI’s OMAP™ 2 architecture. Manufactured using modem standards TI’s 90-nm advanced CMOS process technology, the OMAPV2230 • Advanced Imaging, Video and Audio Accelerator (IVA™ 2) enables worldwide roaming and supports a variety of multimedia boosts video performance in mobile phones up to 4X and applications with consumer electronics quality. The OMAP-Vox™ imaging performance up to 1.5X architecture makes it easy to migrate existing OMAP software, and • Delivers a multimedia experience with consumer electronics the open platform and flexible connectivity options enable product quality to the handset differentiation with value-added features. • Multi-engine parallel processing architecture supports complex usage scenarios The integrated applications processor enables a variety of mobile • Embedded M-Shield™ mobile security technology enables entertainment applications at streaming speeds up to 384 Kbps. value-added services and terminal security The platform is capable of supporting video codecs such as H.263, • Support for all major HLOSs aids applications development ® MPEG-4, H.264, WMV and RealVideo , plus high-quality audio codecs • Optimized power management companion chip: TWL4030 such as MP3, WMA, RealAudio® and AAC/AAC+. An advanced IVA™ 2 accelerator and a 3D graphics accelerator core enable: • Video streaming and playback with high-quality audio up to 30-fps VGA • Camcorder with high-quality audio up to 30-fps VGA • Two-way video teleconferencing up to 30-fps CIF • >5 megapixel digital still camera with < 1 second shot-to-shot delay • Interactive 3D gaming rendering up to 1 M triangles/second • Fast audio and video download • Mobile digital TV decode and display
NOR NAND Trace Emulator Mobile SIM/USM Analyzer Pod FLASH Flash DDR
Trace JTAG/ GPMC SDRC SIM Fast Emulation GPIO GPIO IrDA UART/IrDA I/F NaviLink™ Camera I/F Camera GPS Serial Parallel Module I2C OMAPV2230 Camera-Serial Sub Camera Hollywood™ ARM1136™ Mobile DTV GSM/GPRS/ SPI EDGE/WCDMA 2 IVA™ 2 I C TWL4030 On/Off 2D/3D Graphics ARM9™ System Interface Battery WiLink™ TMS320C55x™ DSP mWLAN Accelerator Power Reset Charger Reset SDIO Clock Manager Power Manager 32 kHz Crystal Coexistence Shared Memory Controller/DMA Voice Audio Data McBSP Audio/Voice BlueLink™ UART Codec ® Timers, Interrupt Controller, Mailbox Audio Bluetooth Voice McBSP McBSP Boot/Secure ROM In/Out High-Speed (HS) USB2 OTG Controller HS USB USB M-Shield™ Security Technology: SHA-1/MD5, Transceiver RF Subsytem Connector Digital Radio DES/3DES, RNG, AES, PKA, Secure WDT, Keys GSM/GPRS EDGE/WCDMA Interface LED Key Pad Display Keypad Controller MS/MMC/SD/SDIO TV Out (DAC) Parallel-Serial SPI
MS/MMC/ TV QVGA VGA TSC2046 Touch Battery SD/SDIO PAL/NTSC Color TFT Color TFT Screen Controller CARD Display Display
Wireless Terminals Solutions Guide Texas Instruments 2007
TCS Chipset and OMAP-Vox™ Solutions 29 Chipset Reference Designs
Chipset Reference Designs Key Benefits TI’s chipset family and supporting reference designs speed manufacturers’ new product development and time to market, • Manufacturing quality, with competitive BOM costs and and address market segments ranging from voice-centric phones full component list to application-rich smartphones. In some cases, manufacturers can • Designs tailored to all market segments leverage a reference design to deliver a new product to market in • Low power consumption less than six months. • Board design and layout • Complete and fully-validated wireless software suite Because they are fully tested and type-approved, TI’s wireless includes communication protocol stacks and leading OS support reference designs allow manufacturers to focus on product • Customizable-ready user interface differentiation and product development. They come with a complete • Multimedia and PIM applications BOM and component list, along with board design and layout. • Worldwide support structure A complete and fully validated wireless software suite includes communication protocol stacks for 2G, 2.5G and 3G, along with support for major mobile OS and the applications suite for the TI Chipset Reference Designs wireless chipsets. • TCS2010 GSM/GPRS • TCS2630 GSM/GPRS/WCDMA TI’s best-in-class customer support guides manufacturers from design • TCS2110 GSM • TCS2700 GSM/GPRS start through full-scale production. Worldwide locations are based in • TCS2200 GSM/GPRS • OMAP850 EDGE Europe, USA, China, Taiwan and Japan. • TCS2300 “LoCosto” GSM • OMAPV1030 GSM/GPRS/EDGE • TCS2310 “LoCosto” GPRS • OMAPV1035 “eCosto” • TCS2305 “LoCosto ULC” GSM GSM/GPRS/EDGE • TCS2315 “LoCosto ULC”GPRS • BRF6100 Bluetooth® • TCS2600 GSM/GPRS • And more
“LoCosto” GSM/GPRS TCS2600 GSM/GPRS Chipset OMAP850 BlueLink™ 5.0 Reference Desgin Reference Design Reference Design Bluetooth® Solution
Texas Instruments 2007 Wireless Terminals Solutions Guide 30 OMAP™ Platform
To Know More OMAP™ processors featured in this issue: Integrated Modem and Applications Processors 32-34 OMAP-Vox™ Solution 35-38 Multimedia Processors 39-40 High-Performance Multimedia-Rich Applications Processors 41-49 OMAP Platform Resources 50-57
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 31 Overview
For designers looking to deliver the most compelling, multimedia-rich TI also offers support with its full complement of reference designs. applications that will attract users to next-generation devices and Wireless design centers in the Americas, Europe and Asia provide services, TI’s OMAP™ platform is the answer. Its comprehensive mix quick access to TI expertise. Additionally, the worldwide Independent of processors, software and support deliver the real-time processing OMAP Technology Centers are staffed by development experts who and low power consumption necessary for 2.5G and 3G applications, provide system integration, development and other critical support for including streaming media, security, interactive gaming, mobile OMAP processor-based product development. Finally, TI offers training, commerce, location-based services and more. technical documentation, an online knowledge base and interactive discussion groups—all designed to speed the development process The OMAP platform includes applications processors and integrated and work with manufacturers to quickly get to market baseband and applications processors suited for a wide range of mobile devices from general-purpose handsets to high-end power-efficient multimedia smartphones and other Internet access OMAP™ 3 Platform devices. TI has maximized software re-use and has incorporated a TI’s OMAP 3 platform builds on the robust multimedia performance high level of compatibility, making the OMAP platform an effective of TI’s OMAP 2 processors and adds a new realm of support for even choice for implementing a complete multi-line product family for all higher-performance entertainment and productivity applications. market segments. As the industry’s first architecture to be based on the ARM® Cortex™-A8 processor, the OMAP 3 platform can triple the ARM Optimized software, including the operating system port, is an performance of ARM11™-based processors. In addition, the DSP-based essential element of the OMAP platform. TI delivers optimized OMAP IVA™ 2+ accelerator provides up to 4X the performance of previous reference software for all leading operating systems with key driver OMAP multimedia processing. Software-compatible with previous support and DSP-accelerated applications. An extensive selection of generations of OMAP technology, the OMAP 3 platform introduces integrated peripherals and manufacturing-ready reference designs a new level of performance that enables laptop-like productivity and reduces a system’s bill-of-materials (BOM) cost, reduces board space advanced entertainment in 3G handsets. The OMAP 3 platform is a and accelerates time to market. complete system solution for advanced graphics standards including A comprehensive, open-software infrastructure makes the OMAP OpenGL® ES 2.0 and Open VG™. Support for these open graphic platform an ideal complement to TCS wireless chipset solutions. standards gives developers the tools to create effects that deliver TI provides support for the most prevalent OSs, high-level a level of cinematic realism rivaling that of Hollywood movies. Rich programming languages, third-party applications, multimedia effects such as facial features and textured backgrounds that components, basic building block algorithms and a host of software previously were only possible with PCs and gaming consoles will development tools. In addition, TI’s OMAP Developer Network of be brought to the mobile environment. third-party application developers includes an extensive selection of innovative applications and media components that manufacturers can easily integrate into products for differentiation.
Texas Instruments 2007 Wireless Terminals Solutions Guide 32 OMAP™ Platform
Integrated Modem and Applications Processors
OMAP730 Processor Key Benefits The OMAP730 builds on the proven foundation of previous processors and offers twice the application performance and double • Twice the application performance over the the standby time for handsets, smartphones and PDAs. It includes a previous generation dedicated TI-enhanced ARM926™ processor for applications processing, • Double the standby time for handsets, smartphones and TI’s Class 12 GSM/GPRS digital baseband that incorporates an and PDAs ARM7TDMI® and TMS320C54x™ DSP core. The ARM926 applications • Half the board space over the previous generation processor enables applications like high-quality streaming audio, and reduced system cost hardware-based security, accelerated Java™ processing, web browsing, • Enables applications including accelerated Java™ personal information management (PIM) applications, location-based processing, web browsing, personal information management, services and more. The OMAP730’s integrated SRAM frame buffer location-based services and more boosts streaming media performance and lowers IDLE-mode power. • Increased space for adding functionality including WLAN, GPS or Bluetooth® wireless technology Forty integrated on-chip peripherals included as part of the OMAP730 • Security protection through hardware security subsystem reduce board space by half over the previous generation and overall • Integrated peripherals including USB On-the-Go and VLYNQ™ system cost by one-third. This integration provides additional space for • 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch ® functionality such as WLAN, GPS or Bluetooth wireless technology. • Mobile SDR memory stacked option (OMAP733-256 MB) A comprehensive hardware security subsystem is also included and consists of a secure bootloader, secure execution environment with secure RAM and ROM, and hardware accelerators for encryption and authentication. The OMAP730 processor is available as part of the TCS2600 chipset and reference design.
WiLink™ Compact NAND NavilInk™ Fast mWLAN FLASH FLASH GPS IrDA Emulator Pod Mobile FLASH SDRAM
JTAG/ High Speed WLAN EMIF/CF UART/IrDA I2C Debug Messaging Emulation a/b/g I/F Keypad Serial OMAP730 GPIO GPIO
LPG LED BlueLink™ GSM/GPRS Data UART Bluetooth® Digital Baseband LPG LED Voice ™ ARM926™ ARM7 MCU Wire Secondary µ LCD Enhanced TMS320C54x™ Audio TRF6151 TWL3016 Voice/ PWT Buzzer Audio Controller GSM/GPRS Analog Shared Memory Controller/DMA I2S/AC97 Debugger Quad-band Baseband EMT9 Direct 2D Graphic Accelerator CMOS Voice/High Control/ Camera I/F Conversion Sensor RF Fidelity Data Audio RIF/SPI Codec GSM Frame Buffer/Internal SRAM SD/MMC MMC Flash Card, Real-Time SDIO SD Flash Card Power Control Management GSM Clock Timers, Interrupt Controller, RTC HDQ/1 wire Battery 13 MHz Management M-Shield™ Security Technology: Clock In/Out SHA-1/MD5 DES/3DES RNG Audio SIM and 32 kHz LCD Reset Mgt. Reset SPI USB OTG Controller PWL GSM Subscriber Identity TSC2046 Client/Host Liquid LCD Module Optical or Crystal Light Touch Screen Controller Display Controller
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 33 Integrated Modem and Applications Processors
OMAP750 Processor Key Benefits Targeted at wireless handsets, smartphones, PDAs and Internet access devices, the OMAP750 extends capabilities of the OMAP73x • Improved multimedia and application performance device while including a range of features that improve multimedia • Class 12 GSM/GPRS modem baseband and ARM926 core application performance. The OMAP750 integrates an ARM926™ core for applications processing dedicated to applications processing with a complete Class12 • Increased processing speeds through DDR memory option GSM/GPRS modem baseband subsystem that consists of an ARM7™ and internal frame buffer core with TI’s low power TMS320C54x™ core. • Protection through hardware-based security platform • Extended list of peripherals, including parallel OCP camera The OMAP750 incorporates faster memory options, including interface for high resolution imaging support of double data rate (DDR) memory that increases processing • GPS, WLAN and Bluetooth® wireless technology capable speed over the OMAP730, which only supported SDRAM. Improved • 2-megapixel camera throughput from an internal frame buffer also enhances processing • Pin-to pin compatible with OMAP730 of multimedia applications, including streaming video and high-end • 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch imaging functions. The OMAP750 provides strong security safeguards, as its hardware- based measures offer a higher degree of protection over software-only features. A secure bootloader, secure memory (ROM and RAM), and random number generators are included. Security hardware accelerators also address popular security standards like MD5/SHA1 and DES/3DES.
WiLink™ NAND NaviLink™ Fast mWLAN FLASH GPS IrDA Emulator Pod Mobile FLASH DDR
JTAG/ High-Speed WLAN EMIF/CF UART/IrDA I2C Debug Messaging Emulation a/b/g I/F Keypad Serial OMAP750 GPIO GPIO
GSM/GPRS LPG LED BlueLink™ Data UART Bluetooth® Digital Baseband LPG LED ™ Voice ARM7™ MCU ARM926 Wire Secondary µ LCD Enhanced TMS320C54x™ Audio TRF6151 TWL3016 Voice/ PWT Buzzer Audio Controller GSM/GPRS Analog Shared Memory Controller/DMA I2S/AC97 Debugger Quad-band Baseband 2D Graphic Accelerator EMT9 Direct CMOS Voice/High Control/ OCP Camera I/F Conversion Sensor RF Fidelity Data Audio RIF/SPI Frame Buffer/Internal SRAM Codec GSM SD/MMC MMC Flash Card, Real-Time SDIO SD Flash Card Power Control Management GSM Clock Timers, Interrupt Controller, RTC HDQ/1 wire Battery 13 MHz Management M-Shield™ Security Technology: SHA-1/MD5 DES/3DES RNG Clock In/Out Audio SIM and 32 kHz LCD Reset Mgt. Reset SPI USB OTG Controller PWL GSM Subscriber Identity TSC2046 Client/Host Liquid LCD Module Optical or Crystal Light Touch Screen Controller Display Controller
Texas Instruments 2007 Wireless Terminals Solutions Guide 34 OMAP™ Platform
Integrated Modem and Applications Processors
OMAP850 Processor Key Benefits The OMAP850 integrated modem and applications processor offers the high performance and low power required for GSM/GPRS and EDGE • Enables multimedia, gaming and camera functions in applications including multimedia, gaming and camera functionality. high-performance smartphones and PDAs Because it is software compatible with other OMAP™ applications • Based on previous generation OMAP730 applications processor processors, it serves as an ideal choice for upgrading wireless • GSM/GPRS/EDGE capable smartphones and PDAs to meet the EDGE standard requirements. • Software compatible with family of OMAP™ applications processors ® The OMAP850 processor integrates into a single package an ARM9 - • Support for various software standards including MPEG-4 video, based applications processor and a GSM/GPRS/EDGE digital baseband. Microsoft® Windows Media® Video, MP3, 2-megapixel ® The OMAP850 supports MPEG-4 video, Windows Media Video, MP3, camera and others up to 2.0 megapixel still image capture and more. • HLOSs support TI includes a security hardware platform as part of the OMAP850 that • Broad range of applications through OMAP Developer Network includes secure mode, secure boot and hardware encryption accelera- • 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch tors. It supports high-level mobile OSs, such as Symbian OS™, Microsoft® Windows Mobile®, S60 and Linux®.
WiLink™ NAND NaviLink™ Fast mWLAN FLASH GPS IrDA Emulator Pod Mobile FLASH DDR
JTAG/ High-Speed WLAN EMIF/CF UART/IrDA I2C Emulation a/b/g Debug Messaging I/F Keypad Serial OMAP850 GPIO GPIO
EDGE LPG LED BlueLink™ GSM/GPRS/EDGE Co-processor Bluetooth® Data UART Digital Baseband LPG LED ™ Voice ™ ARM926 ARM7 MCU µWire Secondary LCD Enhanced TMS320C54x™ TWL3016 Voice/ Audio PWT Buzzer Audio EDGE Analog Controller Shared Memory Controller/DMA 2 Debugger RF Baseband I S/AC07 EMT9 2D Graphic Accelerator OCP Camera I/F CMOS Voice/High Control/ Sensor Fidelity Data Audio RIF/SPI Codec GSM Frame Buffer/Internal SRAM SD/MMC MMC Flash Card, Real-Time SDIO SD Flash Card Power Control GSM Clock HDQ/1 wire Battery Management Timers, Interrupt Controller, RTC 13 MHz Management M-Shield™ Security Technology: Clock In/Out SHA-1/MD5 DES/3DES RNG Audio SIM and 32 kHz Reset Mgt. LCD Reset SPI USB OTG Controller PWL GSM Subscriber Identity TCS2046 Module Client/Host Liquid LCD Optical or Crystal Light Touch Screen Display Controller Controller
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 35 OMAP-Vox™ Solutions
OMAP-Vox™ Solutions One important aspect of 2.5G and 3G success is the ability to bring The OMAP-Vox family includes the OMAPV1030 (GSM/GPRS/EDGE), advanced services to the broadest possible population of mobile users. OMAPV1035 “eCosto”GSM/GPRS/EDGE and OMAPV2230 (WCDMA) TI’s OMAP-Vox™ platform is the answer. With OMAP-Vox solutions, TI integrated solutions. Optimized to enable mid-range multimedia adds modem functionality to its successful OMAP™ architecture. With devices, the OMAPV1030 supports applications such as high-quality software compatibility across the platform, customers can easily scale video capture and playback, video streaming and downloads, megapix- across multiple market segments from GSM/GPRS/EDGE to WCDMA. el digital still cameras and interactive 2D/3D gaming. OMAP-Vox solutions are optimized to efficiently run a dynamic mix of A powerful multimedia solution, the OMAPV1035 is the first 65-nm application and communication functions on the same hardware. They single-chip solution to support EDGE, as well as to integrate modem, integrate proven modem, multimedia and applications processing onto applications processor and RF into a single offering. a single chip with a compatible software foundation that can be re-used for evolving market segment requirements. The OMAPV2230, designed for high-end mobile communications, enables worldwide roaming and supports an even wider variety of Designed to scale from cost-effective handsets to high-end mobile multimedia applications with consumer electronics quality. OMAP-Vox entertainment phones, the OMAP-Vox platform continues TI’s legacy solutions are built on TI’s leading modem and OMAP technology and of software compatibility and re-use, saving years of software design leverage TI’s advanced high-volume 90-nm digital process technology. effort. This software serves as the foundation for applications, multimedia and communications development on all OMAP-Vox Customers using TI’s wireless chipsets will also be able to solutions, saving manufacturers time and money. re-use the GSM/GPRS protocol stack software when migrating to the OMAP-Vox platform. These complete, scalable solutions deliver the The OMAP-Vox platform offers complete system solutions necessary elements to bring differentiated mobile devices to market encompassing an integrated modem and applications processor, fast, including a broad range of hardware, software, reference designs, RF, analog and power management functions, complete field-tested development tools and support. protocol stack software, high-performance multimedia codecs and functions, applications software suite via ecosystem partners, a competitive handset reference design and a complete development toolkit.
Texas Instruments 2007 Wireless Terminals Solutions Guide 36 OMAP™ Platform
OMAP-Vox™ Solutions
OMAPV1030 Integrated GSM/GPRS/EDGE Solution Key Benefits The OMAPV1030 solution is one of the industry’s most highly integrated and optimized EDGE solutions, combining applications and modem •Integrated modem and applications processing on a single core on a single device to enable handset manufacturers to reduce costs • EDGE Class 10 support, Class 12 capable, UMA support and speed time to market. The baseband processor design expands • High-performance Java™ (including Java acceleration) on TI’s proven GSM/GPRS technology and leverages TI’s advanced • Ability to support HLOSs and Nucleus™ applications suites high-volume, 90-nm digital CMOS process technology. • Support for external memory cards including MMC/SD • Connectivity includes Wi-Fi®, Bluetooth® 2.0/EDR, IrDA The OMAPV1030 processor is based on the OMAP™ architecture and and USB OTG runs both GSM/GPRS/EDGE modem and applications processing on • Embedded security via hardware accelerators supporting a single OMAP core, ensuring a high-quality multimedia mobile terminal security, transactions security, and content security experience. The combination of the ARM926EJ-S™ and TI DSP is used • Re-usable APIs for maximum re-use across OMAP-Vox family to improve performance while reducing costs and power consumption, improving time-to-market resulting in longer battery life and usage times for consumers. Because • Complete TI system solution offering all OMAP-Vox™ solutions share a common software platform, this solution maximizes software re-use to bring overall development costs down and provides a natural and affordable roadmap from • Video: GSM/GPRS/EDGE to WCDMA. – Capture, playback and streaming MPEG-4/H.263 (QCIF) at 30-fps The OMAPV1030 solution is specifically designed to bring multimedia QVGA display functionality to mass market mobile phones, and delivers advanced – H.264 (QCIF) playback at 20-fps QVGA display capabilities to mid-range wireless handsets. The OMAPV1030 solution – 2D and 3D gaming 60 k polygons per second, 2-megapixel includes best-in-class high-end multimedia performance including: rasterization, 15 fps • Comprehensive audio/video codecs and imaging algorithms The OMAPV1030 solution supports all form factor requirements, • Ringtones: 64-polyphonic MIDI including PDAs, clamshells, bar-types and other mechanical designs. • Audio: MP3, stereo, AAC, AAC+, enhanced AAC+, WMA TI’s open-platform architecture provides manufacturers the flexibility • Still image: Camera up to 2 megapixel with 1.3 second shot-to-shot and choice needed to differentiate their products to emerging markets • imaging: JPEG, GIF, EXIF, PNG, BMP worldwide. TI’s OMAPV1030 feature phone solution has been in • Dual LCD support (main LCD up to QVGA 256-k color) volume production since first quarter 2006.
SDRAM NOR/NAND SDR/DDR Flash USIM IrDA
Radio OMAPV1030 (Digital Interface) BlueLink™ EDGE Digital Baseband Processor Bluetooth®
GSM/GPRS/ GSM/GPRS/EDGE RF EDGE TMS320C55x™ Peripherals NaviLink™ GPS LED ® Connectivity TWL3029 Analog, ARM926EJ-S Speakerphone Power Management, Subsystem Peripherals WiLink™ Audio mWLAN Hi-Fi
Microphone Sub-LCD Camera Hollywood™ USB-OTG Sensor MMC/SD/MS Connector Display Mobile TV Battery
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 37 OMAP-Vox™ Solutions
OMAPV1035 “eCosto” Single-Chip Handset Solution Key Benefits The OMAPV1035 solution is the first to integrate GSM/GPRS/EDGE modem, digital RF and applications processor functionality onto the • Single chip with integrated RF, digital baseband and application same silicon. Codenamed “eCosto”, the device builds on the “LoCosto” processor for affordable EDGE multimedia devices single-chip cell phone solution and the multimedia capabilities of the • EDGE Class 12 release 4/5 compliant, DTM Class 11, UMA OMAP-Vox™ platform. • 65-nm process for smallest footprint and circuit board costs • Leverages TI’s innovative DRP™ technology Sharing the same platform with the OMAP-Vox family ensures software • Extensive connectivity options: BlueLink™ Bluetooth®, re-use for faster and more cost-effective feature phone development. WiLink™ WLAN, NaviLink™ GPS and Hollywood™ DTV Integrating the innovative RF capabilities of TI’s DRP technology with • USB High-Speed and USB OTG support for high-speed the powerful processing of the OMAP-Vox architecture yields connectivity significant cost savings. As a result, mobile device manufacturers • TV-out support can bring compelling multimedia applications to low- and mid-range • SD/MMC/MS-Pro support for external storage wireless devices worldwide. • IMS/SIP support to enable VoIP, Push-to-Audio, Push-to-Video, The OMAPV1035 is the first 65-nm single-chip solution to support and video sharing EDGE, as well as to integrate modem, applications processor and RF • Embedded TI’s M-Shield™ technology for strong HW- assisted into a single offering. A powerful multimedia platform, the OMAPV1035 security and SmartReflex™ technologies for advanced power leverages the capabilities of advanced ARM® and DSP technologies to reduction deliver the following: • Complete TI system software offering with seamless migration from the OMAPV1030 • 30-fps video playback and record with QVGA display • A full 256-k palette of colors The OMAPV1035 is more scalable and adaptable to customer needs • 3-megapixel resolution camera support with sub-second delay with wide range of configuration and connectivity capabilities. The • User responsiveness as fast as 0.3 seconds shot-to-shot. common software foundation used across TI solutions allows for • “See What I See“ at 15 fps, 2D/3D gaming, audio/video codecs maximum software re-use, improving time to market and easing the and imaging algorithms (MP3, AAC+, eAAC+, WMA/WMV, Real) processing of porting application suites. TI’s open-platform architec- • 3D graphic processing up to 100-k polygons per seconds ture provides manufacturers the flexibility and choice needed to differentiate their products to emerging markets worldwide.
NOR Trace Emulator NAND pSRAM Mobile SIM/ Analyzer Pod Flash FLASH DDR USIM
Trace JTAG/ Memory Interface SIM Fast Emulation IrDA IrDA I/F NaviLink™ OMAPV1035 Camera I/F Camera GPS I2C Serial Parallel Sensor
Hollywood™ ARM926EJ-S™ TMS320C55x™ Mobile DTV Subsystem DSP SPI I2C TWL3034 On/Off
WiLink™ DRP™ Technology Integrated Battery 32 kHz Crystal Charger mWLAN SDIO GSM/GPRS/EDGE RF System Interface Audio Power Reset Power Manager Clock Manager Coexistence Timers, Interrupt Controller, Mailbox BRF6300 Audio/Voice BlueLink™ Codec In/Out ® I2C, MCSI Boot/Secure ROM USB 2 OTG Controller 5.0Bluetooth Solution UART LED M-Shield™ Security Technology: SHA-1/MD5, DES/3DES, RNG, AES, PKA, Secure WDT, Keys USB Connector Vibrator Battery Shared Memory Controller/DMA RF PA/Front End DRP™ GSM/ GPRS/EDGE Keypad Key Pad Display Controller Parallel-Serial MS/MMC/SD/SDIO
MS/MMC/ QVGA SD/SDIO Color TFT Sub Display CARD Display
Texas Instruments 2007 Wireless Terminals Solutions Guide 38 OMAP™ Platform
OMAP-Vox™ Solutions
OMAPV2230 Integrated WCDMA Solution Key Benefits The OMAPV2230 WCDMA solution for 3G handsets provides size, performance and power consumption benefits by integrating both • Advanced applications and modem integrated in one device modem and applications on a single device. The digital baseband is enable a low-power, high-performance system solution based on proven WCDMA/EDGE/GPRS/GSM technology, and the • Enables worldwide operation for WCDMA/EDGE/GPRS/GSM applications processor is based on TI’s OMAP™ 2 architecture. modem standards Manufactured using TI’s 90 nm advanced CMOS process technology, • Advanced Imaging, Video and Audio Accelerator (IVA™ 2) the OMAPV2230 enables worldwide roaming and supports a variety boosts video performance in mobile phones up to 4X and of multimedia applications with consumer electronics quality. The imaging performance up to 1.5X OMAP-Vox™ architecture makes it easy to migrate existing OMAP • Delivers a multimedia experience with consumer electronics software, and the open platform and flexible connectivity options quality to the handset enable product differentiation with value-added features. • Multi-engine parallel processing architecture supports complex usage scenarios The integrated applications enables a variety of mobile entertainment • Embedded M-Shield™ mobile security technology enables applications at streaming speeds up to 384 Kbps. The platform is value-added services and terminal security capable of supporting video codecs such as H.263, MPEG-4, H.264, • Support for all major HLOSs aids applications development WMV and RealVideo, plus high-quality audio codecs such as MP3, • Optimized power management companion chip: TWL4030 WMA, RealAudio and AAC/AAC+. An advanced IVA™ 2 accelerator and a 3D graphics accelerator core enable: • Video streaming and playback with high-quality audio up to 30-fps VGA • Camcorder with high-quality audio up to 30-fps VGA • Two-way video teleconferencing up to 30-fps CIF • >5 megapixel digital still camera with < 1 second shot-to-shot delay • Interactive 3D gaming rendering up to 1M triangles/second • Fast audio and video download • Mobile digital TV decode and display
NOR NAND Trace Emulator Mobile SIM/USM Analyzer Pod FLASH Flash DDR
Trace JTAG/ GPMC SDRC SIM Fast Emulation GPIO GPIO IrDA UART/IrDA I/F NaviLink™ Camera I/F Camera Serial Parallel Module GPS I2C OMAPV2230 Camera-Serial Sub Camera Hollywood™ ™ Mobile DTV ARM1136 GSM/GPRS/ SPI EDGE/WCDMA 2 IVA™ 2 I C TWL4030 On/Off 2D/3D Graphics ARM9™ System Interface Battery WiLink™ TMS320C55x™ DSP mWLAN Accelerator Power Reset Charger Reset SDIO Clock Manager Power Manager 32 kHz Crystal Coexistence Shared Memory Controller/DMA Voice Audio BRF6300 Data McBSP Audio/Voice BlueLink™ UART BlueLink™® Timers, Interrupt Controller, Mailbox Audio Codec 5.0Bluetooth Solution Voice McBSP McBSP Boot/Secure ROM In/Out High-Speed (HS) USB2 OTG Controller HS USB USB M-Shield™ Security Technology: SHA-1/MD5, Transceiver RF Subsytem Connector Digital Radio DES/3DES, RNG, AES, PKA, Secure WDT, Keys GSM/GPRS EDGE/WCDMA Interface LED Key Pad Display Keypad Controller MS/MMC/SD/SDIO TV Out (DAC) Parallel-Serial SPI
MS/MMC/ TV QVGA VGA TSC2046 Touch Battery SD/SDIO PAL/NTSC Color TFT Color TFT Screen Controller CARD Display Display
Texas Instruments 2007 Wireless Terminals Solutions Guide
OMAP™ Platform 39 Multimedia Processors
OMAP331 Processor Key Benefits The OMAP331 processor provides a feature-rich platform for price-sensitive 2.5G and 3G handsets, PDAs and other mobile devices. • 17 percent faster performance and enhanced features Based on an ARM926™ processing core, the OMAP331 delivers over the previous generation multimedia functionality while maintaining power efficiency. Software • Low power consumption re-use and compatibility with higher end OMAP™ devices provide • Software re-use and compatibility with other OMAP™ devices manufacturers a migration path to higher performing smartphones, • On-chip frame buffer and 2D-graphics accelerator speeds Internet appliances and multimedia devices. multimedia performance • High-resolution imaging through OCP camera port Features found in the OMAP331 include robust multimedia • Hardware-based security platform performance, fast processing speeds, a 2D-graphics accelerator • 802.11 capable up to 54 Mbps engine, a high-throughput direct memory access interface and much • 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch more. An on-chip frame buffer improves performance of multimedia applications like streaming video and graphics. Enhanced, high-resolu- tion imaging is possible through a parallel OCP camera port. The OMAP331 includes a hardware-based security engine and random number generator for transparent security algorithm processing. Hardware accelerators are also included to address industry security standards such as MD5/SHA1 and DES/3DES.
WiLink™ Compact NAND NaviLink™ Fast mWLAN FLASH FLASH GPS IrDA Emulator Pod Mobile FLASH DDR
JTAG/ High-Speed WLAN EMIF/CF UART/IrDA I2C I2C Peripheral Emulation a/b/g I/F Keypad Keypad OMAP331 GPIO GPIO LPG LED ARM926™ LPG LED
PWT Buzzer Shared Memory Controller/DMA Debugger EMT9 2D Graphic Accelerator OCP Camera I/F CMOS Sensor Voice MCSI Memory Stick TCS Memory Stick Card, Timers, Interrupt Controller, RTC MMC-SD MMC-SD Card Modem Control Chipset UART Memory Stick Memory Stick Card, MMC-SD MMC-SD Card Data Frame Buffer/Internal SRAM (750 k-bit) McBSP HDQ/1Wire Battery M-Shield™ Security Technology: 12 MHz SHA-1/MD5 DES/3DES RNG Clock and 32 kHz LCD Reset Mgt. Reset SPI McBSP USB OTG Controller PWL
TSC2301TLC320AIC23 Client/Host Liquid LCD Audio CodecAudio Crystal Light Touch Screen ControllerCodec Display Controller Audio Amplifier
In/Out Audio
Texas Instruments 2007 Wireless Terminals Solutions Guide 40 OMAP™ Platform
Multimedia Processors
OMAP-DM270 Key Benefits The OMAP-DM270 combines image-processing capabilities with a highly integrated imaging peripheral set in a programmable platform. • Integrated programmable platform lets manufacturers Consisting of ARM7TDMI® and TMS320C54x™ DSP cores with on-chip add image-processing algorithms program and data memory, the OMAP-DM270 offers enhanced • Performance delivers high image quality and rich performance and flexibility for camera-enabled mobile handsets and features in a cost-effective solution PDAs and fulfills customer demands for image quality, feature richness • Broad range of encoding support, including support and low cost. of all major audio, video, imaging and voice standards • MPEG-4 video support of up to 30 fps (VGA) Platform programmability is achieved through a DSP-based imaging • Live view and digital zoom through preview engine co-processor that gives manufacturers the ability to implement • Real-time auto focus, auto-white balance and proprietary image processing algorithms in software and differentiate auto-balance statistics their products. In addition, the OMAP-DM270 architecture supports • Highly integrated peripheral set various types of CCD and CMOS sensors, signal conditioning circuits, • Leverages 130-nm process technology for power management, SDRAM, shutter, iris and auto-focus motor low power and increased performance controls. The OMAP-DM270 supports all the popular audio, video, imaging and voice standards, including MPEG-4 video up to 30 fps (VGA). A full set of peripherals includes on-screen display and an interface for color LCD. Seamless interface to CompactFlash™, SmartMedia™, Secure Digital™ and Memory Stick™ cards are also provided as part of the OMAP-DM270 multimedia processor.
SDRAM Flash SDRAM Emulator CFC Pod SSFDC
JTAG/ SDRAM Emulation I/F OMAP-DM270
I2C ™ TMS320C54x ARM7TDMI® UART x2 DSP
SPI x2 Memory Traffic Controller iMX/VLCD Camera I/F Camera Image Buffers MMC-SD MMC-SD Modem Data Control Chipset EMIF Preview Engine Memory Stick Memory Stick Card Card Interrupt GPIO AE/AF/AWB
12 MHz Timers, Interrupt Controller Clock NTSC/ and 48 MHz LCD PAL Reset Mgt. Reset McBSP McBSP USB Client Controller Encoder
TLC320AIC23 Host Liquid TV TSC2301 Crystal Monitor Audio CodecAudio Codec Display
In/Out Audio
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 41 High-Performance Multimedia-Rich Applications Processors
OMAP1610 Processor Key Benefits The OMAP1610 applications processor features a dual-core architecture based on TI’s TMS320C55x™ DSP and TI-enhanced ARM926™ cores. • Multimedia applications including videoconferencing, Each core has processing capabilities of up to 200 MHz, resulting in interactive gaming, speech processing, m-commerce, enhanced performance for processing multimedia applications in location-based services and others handsets for 2.5G, 3G and beyond, including videoconferencing, • Supports all cellular standards interactive gaming, speech processing, location-based services, video • Migration path to high-end market segments streaming and others. Manufacturers benefit with scalability across through scalability of the OMAP™ platform the OMAP™ processor family and gain a path to higher end market • Reduced power consumption through hardware-based segments. accelerators • Secure mode of operation with wireless security hardware ® The high-speed DSP and ARM engines include hardware-based • Dedicated on-chip 2D-graphics engine application accelerators such as a dedicated on-chip 2D-graphics engine • TI-enhanced ARM926™ core that eliminates the need for discrete graphic chips and multimedia • Leverages TI’s TMS320C55x™ DSP and TI-enhanced acceleration. Java™ program accelerators are also incorporated into the 200 MHz processing capabilities OMAP1610, and a hardware-based security system provides protection • 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch of creative content or software, guarding confidential information and securing information transmission. The OMAP1610 applications processor maintains standby power consumption levels of less than 10 µA, which is among the lowest in the industry. It supports all cellular standards, and complements any modem technology.
WiLink™ Compact NAND NaviLink™ Fast mWLAN FLASH Flash GPS IrDA Emulator Pod Mobile Flash DDR
JTAG/ EMIF UART/IrDA I2C I2C Peripheral Emulation Debug Messaging I/F Keypad Keypad Serial OMAP1610 GPIO GPIO LPG LED
BlueLink™ LPG LED Bluetooth® ™ Data UART TMS320C55x DSP ARM926™ Voice PWT Buzzer MCSI Debugger EMT9 Shared Memory Controller/DMA Camera I/F CMOS Sensor Voice 2D Graphic Accelerator TCS MCSI Memory Stick Memory Stick Card, Modem MMC-SD MMC-SD Card Control Chipset UART Timers, Interrupt Controller, RTC Memory Stick Memory Stick Card, MMC-SD MMC-SD Card Data McBSP M-Shield™ Security Technology: HDQ/1Wire Battery SHA-1/MD5 DES/3DES RNG 12 MHz Clock and 32 kHz LCD Reset Mgt. Reset µWireMcBSP USB OTG Controller PWL
TSC2301TLC320AIC23 Client Host Liquid LCD Audio CodecAudio Crystal Light Touch Screen ControllerCodec Display Controller Audio Amplifier
In/Out Audio
Texas Instruments 2007 Wireless Terminals Solutions Guide 42 OMAP™ Platform
High-Performance Multimedia-Rich Applications Processors
OMAP1621 Processor Key Benefits The OMAP1621 applications processor is a software compatible upgrade to the OMAP1610 processor. The OMAP1621 boasts improved • The OMAP1621 processor enjoys all the same features, ARM® and DSP performance versus previous devices to meet the functionality and benefits of the OMAP1610 and more increasing performance demands of multimedia-enabled handsets. • Increased DSP and ARM® performance Additionally, the OMAP1621 processor adds 2 MB of internal SRAM • Improved graphics and streaming media performance optimized to act as a frame buffer enabling higher graphics and • Improved support for higher resolution camera via an enhanced streaming media performance. To support higher resolution cameras, camera port interface bus the OMAP1621 includes an enhanced camera port interface bus that • Support of all cellular standards results in higher throughput. • WLAN-capable to speeds up to 54-Mbps data throughput with integrated VLYNQ™ interface The OMAP1621 includes several hardware-based application • Scalable solution provides path to high-end market segments accelerators that eliminate the need for discrete graphic chips and • Reduced power consumption through hardware-based multimedia accelerators. Java™ acceleration is also included in accelerators the ARM and a hardware-based security system enables secure • Secure mode of operation through wireless security hardware e-commerce applications and the replay of copyright-protected digital • 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch media content. • Mobile DDR memory stacked option (OMAP1623-512 Mb) The OMAP1621 and other OMAP16xx applications processors maintain standby power consumption levels of less than 10 µA and are among the lowest in the industry. The processors support all cellular standards and complement any modem technology.
WiLink™ Compact NAND NaviLink™ Fast mWLAN FLASH FLASH GPS IrDA Emulator Pod Mobile FLASH DDR
JTAG/ High-Speed WLAN EMIF/CF UART/IrDA I2C I2C Peripheral Emulation a/b/g Debug Messaging I/F Keypad Keypad Serial OMAP1621 GPIO GPIO LPG LED TMS320C55x™ BlueLink™ ARM926™ LPG LED Bluetooth® DSP Data UART Voice PWT Buzzer MCSI Shared Memory Controller/DMA Debugger 2D Graphic Accelerator EMT9 Camera I/F CMOS Sensor Voice TCS MCSI Timers, Interrupt Controller, RTC Memory Stick Memory Stick Card, Modem MMC-SD MMC-SD Card Control Chipset UART Frame Buffer/Internal SRAM (2 Mb) Memory Stick Memory Stick Card, MMC-SD MMC-SD Card Data McBSP M-Shield™ Security Technology: HDQ/1Wire Battery SHA-1/MD5 DES/3DES RNG 12 MHz Clock and 32 kHz LCD Reset Mgt. Reset µWire McBSP USB OTG Controller PWL
TSC2301TLC320AIC23 Client Host Liquid LCD Audio CodecAudio Crystal Light Touch Screen ControllerCodec Display Controller Audio Amplifier
In/Out Audio
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 43 High-Performance Multimedia-Rich Applications Processors
OMAP1710 Processor Key Benefits The OMAP1710 applications processor combines an ARM926™ processor with a TMS320C55x™ DSP core operating at 220 MHz. • Advanced 90-nm CMOS process technology Manufactured on TI’s advanced 90-nm CMOS process technology, the • 40 percent performance improvement in a variety OMAP1710 provides up to 40 percent more performance for a variety of mobile applications compared to previous generations of applications, while consuming half the power of previous TI • TMS320C55x™ DSP and ARM926 at 220 MHz applications processors in active mode. • Software re-use due to compatibility and flexibility across other OMAP devices A range of software and hardware accelerators are included as part • Multiple engines enable concurrent features and of the OMAP1710, including video encode and decode, still picture service without quality degradation compression, Java™ and security. TI’s advanced security hardware • High-performance camera interface supports up to provides a secure execution environment and an ideal platform to 2 megapixels address a range of security threats. Features including a secure • 802.11 capable up to 54-Mbps data throughput bootloader, secure mode of operation, secure RAM and ROM and with integrated VLYNQ™ interface various accelerators are all aspects of TI’s security-based capabilities. • Integrated hardware and software security The OMAP1710 is designed to handle a variety of applications in • Improved multimedia and graphics parallel for concurrent features and service. This unique approach • Optimized for TI’s TCS wireless chipsets ensures that applications are not interrupted or degraded when • High-level OS support additional operations are launched or run simultaneously. • Broad range of applications through OMAP Developer Network For manufacturers looking to increase performance and multimedia • Development support and access to open capabilities of their product line, the OMAP1710 offers an easy programming interfaces and development tools migration path due to software compatibility with previous generations • 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch of OMAP™ applications processors.
WiLink™ Compact NAND NaviLink™ Fast mWLAN FLASH Flash GPS IrDA Emulator Pod Mobile Flash DDR
JTAG/ High-Speed WLAN EMIF UART/IrDA I2C I2C Peripheral Emulation a/b/g Debug Messaging I/F Keypad Keypad Serial OMAP1710 GPIO GPIO LPG LED
BlueLink™ LPG LED Bluetooth® ™ Data UART TMS320C55x DSP ARM926™ Voice PWT Buzzer MCSI Debugger EMT9 Shared Memory Controller/DMA OCP Camera I/F CMOS Sensor Voice 2D Graphic Accelerator TCS MCSI Modem Chipset Control Memory Stick Memory Stick Card, UART Timers, Interrupt Controller, RTC MMC-SD MMC-SD Card
Data McBSP M-Shield™ Security Technology: HDQ/1Wire Battery SHA-1/MD5 DES/3DES RNG 12 MHz Clock and 32 kHz LCD Reset Mgt. Reset µWireMcBSP USB OTG Controller PWL
TSC2301TLC320AIC23 Client Host Liquid LCD Audio CodecAudio Crystal Light Touch Screen ControllerCodec Display Controller Audio Amplifier
In/Out Audio
Texas Instruments 2007 Wireless Terminals Solutions Guide 44 OMAP™ Platform
High-Performance Multimedia-Rich Applications Processors
OMAP2420 Processor Key Benefits The OMAP2420, software compatible with previous OMAP™ processors, adds capabilities for further enhancing the “All-in-One • Dedicated 2D/3D graphics accelerator at 2 million polygons Entertainment” capabilities that the OMAP 2 architecture brings to per second smartphones and wireless PDAs. • IVA™ enables high-resolution still image capture, larger screen sizes and higher video frame rates The OMAP2420 includes the benefits of the OMAP 2 architecture’s • Supports high-end features including 4+ megapixel cameras, parallel processing, giving users the ability to instantly run applications VGA-quality video, high-end interactive gaming functionality and operate multiple functions simultaneously without compromising and analog/digital TV video output quality of service. The OMAP2420 includes an integrated ARM1136™ • 5-MB internal SRAM boosts streaming media performance processor (330 MHz), a TI TMS320C55x™ DSP (220 MHz), 2D/3D • Software compatibility with previous OMAP™ processors graphics accelerator, imaging and video accelerator (IVA™), • Parallel processing ensures no interruptions or degradation high-performance system interconnects and industry-standard of service with simultaneously running applications peripherals. • Optimized power management companion chip: TWL92230 Multimedia enhancements made in the OMAP2420 include an • 14 mm x 14 mm, MicroStar BGA™, memory stackable package imaging and video accelerator for higher resolution still capture • 12 mm x 12 mm MicroStar BGA package applications, multi-megapixel cameras and full-motion video encode • Mobile DDR memory stacking options (OMAP2422-512 Mb; and decode with VGA resolution up to 30 frames per second. An OMAP2423-768 Mb) added TV video output supports connections to television displays for displaying images and video captured from the handset. Streaming media performance is boosted by 5-MB internal SRAM.
Trace Emulator NOR NAND Mobile Analyzer Pod FLASH Flash DDR NaviLink™ Fast GPS IrDA
Trace JTAG/ GPMC SDRC I2C I2C Peripheral Emulation UART/IrDA I/F Keypad GPIO Keypad Hollywood™ GPIO GPIO Mobile DTV SPI OMAP2420 Camera I/F Camera TM ARM11™ TMS320C55x Serial Parallel Module DSP WiLink™ Imaging mWLAN High-Speed 2D/3D Graphics HDQ/1Wire Battery WLAN a/b/g Video Accelerator Accelerator (IVA) TWL92230 Reset BlueLink™ Data Shared Memory Controller/DMA System Interface UART Bluetooth® Power Reset Clock Mgr Power On/off Manager Voice Timers, Interrupt Controller, Mailbox EAC BT MS/MMC/SD/SDIO MS/MMC/SD/SDIO Media Card Controller Card Voice Transceivers EAC MD Internal SRAM, Boot/Secure ROM MS/MMC/SD/SDIO TCS Control Power Regulators Card Modem UART M-Shield™ Security Technology: Chipset SHA-1/MD5 DES/3DES RN, AES, PKA, Real-Time LED Data TV McBSP Secure WDT, Keys I2C Clock (RTC) 32k Hz Crystal Display SPI EAC AC USB OTG TV Out (DAC) Controller
TSC2301TLC320AIC23 Client Host TV VGA Color QVGA Color Audio CodecAudio PAL/NTSC TFT TFT Touch Screen Controller Codec Display Display Audio Amplifier
In/Out Audio
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 45 High-Performance Multimedia-Rich Applications Processors
OMAP2430 and OMAP2431 Processors Key Benefits The OMAP2430 and OMAP2431 high-performance applications processors deliver best-in-class performance to multimedia-enabled • Advanced IVA™ 2 boosts video performance in mobile phones handsets and wireless PDAs for 2.5G, 3G and beyond. Based on TI’s by up to 4X and imaging performance by up to 1.5X enhanced OMAP™ 2 multi-engine parallel processing architecture • Delivering a multimedia experience with consumer electronics and high-performance, low-leakage 90-nm CMOS process technology, quality to the handset the OMAP2430 and OMAP2431 processors balance multimedia • Multi-engine parallel processing architecture for supporting performance, flexibility, power and cost. IVA™ 2, TI’s latest-generation complex usage scenarios imaging, video and audio accelerator (OMAP2430 only), boosts mobile • Embedded M-Shield™ mobile security technology enables video playback performance to DVD quality. The processors also inte- value-added services and terminal security grate a 330-MHz ARM1136® RISC processor core, dedicated 2D/3D • Support for all major HLOSs aids applications development graphics hardware acceleration, high-speed system interconnect, • Optimized power management companion chip: TWL4030 numerous peripherals, and camera, display and memory subsystems. • 14 mm x 14 mm, MicroStar BGA™, memory stackable package
Multimedia features supported include: • Downloadable media playback and digital TV decode: MPEG-4, H.264, Windows Media® Video (VC-1), RealVideo® version 10 The OMAP2430 and OMAP2431 support HLOSs, including Linux®, decode up to D1 (720 x 480) 30 fps Microsoft® Windows Mobile® and Symbian™. The processors’ high • Still image capture: > 5 megapixel with 1 second shot-to-shot delay performance enables the use of more highly compressed codecs that • Motion video capture: MPEG-4, H.264 encoding up to VGA 30 fps bring spectral efficiency and cost savings. Embedded M-Shield™ • Video teleconferencing: H.263, H.264 videoconferencing with security technology enables value-added services for content simultaneous recording of VTC session up to CIF 30 fps protection, transaction security and secure network access, plus • 2D/3D gaming: rasterization up to 1 million polygons per second terminal security functions such as secure flashing and booting, (OMAP2430 only) terminal identity protection and network lock protection.
Trace Emulator NOR NAND Mobile Analyzer Pod FLASH Flash DDR
Trace JTAG/ GPMC SDRC GPIO GPIO Emulation Fast UART/IrDA I/F IrDA Camera I/F Camera NaviLink™ Serial Parallel Module GPS I2C OMAP2430/OMAP2431 Camera-Serial Sub Camera Hollywood™ ARM1136™ Mobile DTV SPI Imaging Video and Audio 2D/3D Graphics Accelerator WiLink™ Accelerator (IVA™ 2) I2C TWL4030 mWLAN SDIO (OMAP2430 only) On/Off System Interface Battery Power Reset Charger Reset Coexistence Shared Memory Controller/DMA Clock Manager Power Manager 32 kHz Crystal BlueLink™ Data UART Bluetooth® Timers, Interrupt Controller, Mailbox Voice Audio Voice McBSP Audio/Voice McBSP Audio Codec Boot/Secure ROM McBSP Flashing In/Out USB M-Shield™ Security Technology: SHA-1/MD5, High-Speed (HS) TCS USB2 OTG Controller Modem Control/Data DES/3DES, RNG, AES, PKA, Secure WDT, Keys HS USB USB Chipset McBSP Transceiver Connector Display Voice McBSP Controller LED MS/MMC/SD/SDIO TV Out (DAC) Parallel-Serial SPI Key Pad Keypad
TV QVGA VGA TSC2046 Touch MS/MMC/SD/SDIO PAL/NTSC Color TFT Color TFT Screen Controller Card Display Display Battery
Texas Instruments 2007 Wireless Terminals Solutions Guide 46 OMAP™ Platform
High-Performance Multimedia-Rich Applications Processors
OMAP™ 3 Applications Processors Key Features The OMAP™ 3 family of multimedia applications processors from Texas Instruments (TI) introduces a new level of performance that enables • Proven OMAP™ 3 architecture combines mobile entertainment laptop-like productivity and advanced entertainment in multimedia with high performance productivity applications to meet the enabled handsets. The OMAP 3 family includes the OMAP3430 needs of all multimedia enabled handsets targeted at high-end multimedia enabled handsets that require a • Advanced Superscalar ARM® Cortex™-A8 RISC core high-level of performance and productivity, the OMAP3420 targeted at • 65-nm CMOS process technology adds processing performance mid-tier multimedia enabled handsets, and the OMAP3410 targeted at while reducing power consumption basic multimedia enabled handsets. TI’s OMAP 3 family of applications processors integrate the ARM® Cortex™-A8 superscalar microprocessor core, delivering up to 3X gain in performance over ARM11-based Key Benefits processors. These new processors leverage industry-leading technolo- gies to provide mobile phone battery life together with the performance • Seamless connectivity to Hard Disk Drive (HDD) devices for needed for laptop-comparable productivity software and an audio-video mass storage experience equivalent to that of consumer electronics devices. • Leverages SmartReflex™ technologies for advanced power reduction The OMAP 3 family is the industry’s first applications processors to be • M-shield™ mobile security enhanced with ARM TrustZone™ designed in a 65-nm CMOS process technology, reflecting TI’s support commitment to providing advanced silicon technology that drives a • Software-compatible with OMAP™ 2 and OMAP™ 3 processors revolution in mobile communications. The device can operate at a • HLOS support for customizable interface higher frequency than previous generation OMAP processors, increasing • Optimized power management companion chip: TWL4030 its clock speed over the OMAP 2 platform, while lowering the core voltage and adding power reduction features to help prolong battery life. Multimedia applications benefit from faster, higher-quality image capture and processing for cameras, exceptional audio/video techniques that dynamically control voltage, frequency and power performance, enhanced support for external displays and high-speed based on device activity, modes of operation and temperature. connectivity interfaces. Compatible with a wide range of modems, The OMAP 3 processors support HLOS including Linux®, Microsoft® the OMAP 3 family opens new areas for compelling new mobile Windows Mobile® and Symbian™. Built-in M-Shield™ security technol- applications that will revolutionize handheld communications in both ogy enables value-added services for content protection, transaction work and play. security and secure network access, plus terminal security functions The OMAP 3 family of applications processors boast the most advanced such as secure flashing and booting, terminal identity protection and and effective power management techniques in the market. The chips network lock protection. Enhanced with ARM TrustZone™ support, make exhaustive use of TI’s SmartReflex™ technologies which include OMAP 3 security is based on open APIs, providing an environment for a broad range of intelligent and adaptive hardware and software secure applications that deliver robust performance and interoperability.
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 47 High-Performance Multimedia-Rich Applications Processors
OMAP3430 Processor Key Features and Benefits The OMAP3430 applications processor with the ARM® Cortex™-A8 core delivers up to 3X the performance of ARM11-based processors, • Industry’s first processor with advanced superscalar ARM® enabling laptop-like productivity and advanced entertainment in 3G Cortex™-A8 RISC core enabling 3X gain in performance handsets. The industry’s first applications processor to be designed in • Industry’s first processor designed in 65-nm CMOS process a 65-nm CMOS process, the OMAP3430 combines the optimal mix of technology adds processing performance advanced technology and innovation to provide the most advanced • IVA™ 2+ accelerator enables multi-standard (MPEG-4, WMV9, applications processor in the market. Designed in a 65-nm CMOS RealVideo®, H.263, H.264) encode/decode at D1 (720 x 480 process, the OMAP3430 operates at a higher frequency than previous pixels) 30 fps generation OMAP processors, while lowering the core voltage and • Integrated image signal processor (ISP) for faster, higher-quality adding power reduction features. image capture and lower system cost • Flexible system support IVA™ 2+ a second-generation, power-optimized version of TI’s imaging, – Composite and S-video TV output video and audio accelerator used in TI’s DaVinci™ technology provides – XGA (1024 x 768 pixels), 16 M-color (24-bit definition) up to 4X performance improvement in multimedia processing versus display support previous OMAP processors. The increased capabilities of the IVA2+ – Flatlink™ 3G-compliant serial display and parallel display support enables multi-standard (MPEG-4, H.264, Windows® Media Video®, – High-speed USB 2.0 On-The-Go support RealVideo®, etc.,) encode and decode at DVD resolutions. With the • Seamless connectivity to HDD devices for mass storage advanced multi-media capabilities a multi-standard DVD-quality cam- • SmartReflex™ technologies for advanced power reduction corder can be added to a phone for the first time. In addition, the ARM’s • M-shield™ mobile security enhanced with ARM TrustZone™ vector floating-point acceleration, coupled with the OMAP3430’s support dedicated 2D/3D graphics hardware accelerator, provides outstanding • Software-compatible with OMAP™ 2 and OMAP 3 processors gaming capabilities. • HLOS support for customizable interface System features include an integrated image signal processor, support • Optimized power management companion chip: TWL4030 for parallel and serial displays and cameras, Composite and S-video TV output, high-speed USB 2.0 OTG support and much more.
Trace Emulator NOR NAND Mobile Analyzer Pod FLASH Flash DDR
Trace JTAG/ GPMC SDRC GPIO GPIO Emulation Fast UART/IrDA I/F IrDA Camera I/F Camera NaviLink™ Serial-Parallel Module GPS I2C OMAP3430 Camera-Serial Sub Camera Hollywood™ ARM® Imaging Video and Mobile DTV Cortex™-A8 Audio Accelerator SPI (IVA™ 2+)
WiLink™ PowerVR SGX Image Signal I2C TWL4030 mWLAN SDIO Processor (ISP) On/Off System Interface Battery Shared Memory Controller/DMA Power Reset Charger Reset Coexistence Clock Manager Power Manager 32 kHz Crystal BlueLink™ Data UART Bluetooth® Timers, Interrupt Controller, Mailbox Voice Audio Voice McBSP Audio/Voice McBSP Audio Codec Boot/Secure ROM McBSP Flashing In/Out USB M-Shield™ Security Technology: SHA-1/MD5, High-Speed (HS) TCS USB 2 OTG Controller Modem Control/Data DES/3DES, RNG, AES, PKA, Secure WDT, Keys HS USB USB Chipset McBSP Transceiver Connector Display Voice Video DAC Controller LED McBSP S-Video MS/MMC/SD/SDIO Parallel-Serial SPI Key Pad Keypad
TV QVGA XGA TSC2046 Touch MS/MMC/SD/SDIO PAL/NTSC Color TFT Color TFT Screen Controller Card Display Display Battery
Texas Instruments 2007 Wireless Terminals Solutions Guide 48 OMAP™ Platform
High-Performance Multimedia-Rich Applications Processors
OMAP3420 Processor Key Features and Benefits The OMAP3420 is designed to provide the right mix of performance and cost to meet the needs of the mid-tier multimedia enabled hand- • Advanced Superscalar ARM® Cortex™-A8 RISC core sets market. Like the OMAP3430 and 3410 devices, the OMAP3420 • 65-nm CMOS process technology adds processing performance is designed in a 65-nm CMOS process to allow a higher operating while reducing power consumption frequency while lowering core voltage and power consumption. The • IVA™ 2 accelerator enables VGA resolution video playback for ARM® Cortex™-A8 superscalar microprocessor core provides exception- multiple video standards al performance to deliver laptop-like productivity and entertainment at • Integrated image signal processor (ISP) for faster, higher-quality a price point for the mid-tier multimedia enabled handsets market. image capture and lower system cost • Flexible system support The IVA™ 2 imaging, video and audio accelerator in the OMAP3420 – Composite and S-video TV output enables VGA quality video camcorder and playback for multiple stan- – VGA (640 x 480 pixels), 16 M-color (24-bit definition) display dards, including MPEG-4, H.264, Windows Media Video, and RealVideo. support Like the OMAP3430, the OMAP3420 device includes a 2D/3D graphics – Flatlink™ 3G-compliant serial display and parallel display hardware accelerator to provide high quality, OpenGL® ES gaming support capabilities. – High-speed USB 2.0 OTG support Additional system features include an image signal processor which • Seamless connectivity to HDD devices for mass storage allows up to 5-megapixel still image capture, as well as support for • SmartReflex™ technologies for advanced power reduction parallel and serial displays and cameras, composite and S-Video TV • M-shield™ mobile security enhanced with ARM TrustZone™ output, high-speed USB 2.0 OTG support and seamless hard disk drive support interfaces. In addition, the OMAP3420 is software compatible with all • Software-compatible with OMAP™ 2 and OMAP 3 processors OMAP 2 and OMAP 3 processors, allowing a fully software scalable • HLOS support for customizable interface solution. • Optimized power management companion chip: TWL4030
Trace Emulator NOR NAND Mobile Analyzer Pod FLASH Flash DDR
Trace JTAG/ GPMC SDRC GPIO GPIO Emulation Fast UART/IrDA I/F IrDA Camera I/F Camera NaviLink™ Serial-Parallel Module GPS I2C OMAP3420 Camera-Serial Sub Camera Hollywood™ ARM® Imaging Video and Mobile DTV Cortex™-A8 Audio Accelerator SPI (IVA™ 2)
WiLink™ PowerVR Image Signal I2C TWL4030 SGX mWLAN SDIO Processor (ISP) On/Off System Interface Battery Shared Memory Controller/DMA Power Reset Charger Reset Coexistence Clock Manager Power Manager 32 kHz Crystal BlueLink™ Data UART Bluetooth® Timers, Interrupt Controller, Mailbox Voice Audio Voice McBSP Audio/Voice McBSP Audio Codec Boot/Secure ROM McBSP Flashing In/Out USB M-Shield™ Security Technology: SHA-1/MD5, High-Speed (HS) TCS USB2 OTG Controller Modem Control/Data DES/3DES, RNG, AES, PKA, Secure WDT, Keys HS USB USB Chipset McBSP Transceiver Connector Display Voice Video DAC Controller LED McBSP S-Video MS/MMC/SD/SDIO Parallel-Serial SPI Key Pad Keypad
TV QVGA VGA TSC2046 Touch MS/MMC/SD/SDIO PAL/NTSC Color TFT Color TFT Screen Controller Card Display Display Battery
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 49 High-Performance Multimedia-Rich Applications Processors
OMAP3410 Processor Key Features and Benefits The OMAP3410 is designed to meet the needs of the basic multimedia enabled handsets market, which includes CIF quality video • Advanced Superscalar ARM Cortex-A8 RISC core camcorder and playback for multiple standards (MPEG-4, Window® • 65-nm CMOS process technology adds processing performance Media Video® 9, RealVideo®, H.264), up to 3-megapixel still image while reducing power consumption capture, music playback and 3D gaming. The lowest cost member of • IVA™ 2 accelerator enables CIF resolution video playback for the OMAP™ 3 family, the OMAP3410 shares many of the technologies multiple video standards that are present in the OMAP3430 and OMAP3420 devices, including • Seamless connectivity to HDD devices for mass storage a 65-nm CMOS process, the ARM® Cortex™-A8 superscalar • SmartReflex™ technologies for advanced power reduction microprocessor core as well as IVA™ 2 imaging, video and audio • M-shield™ mobile security enhanced with ARM TrustZone™ accelerator, for a rich multimedia experience and targeted general support purpose processing. In addition, the OMAP3410 is software compatible • Software-compatible with OMAP 2 and other OMAP 3 processors with all OMAP 2 and OMAP 3 processors, allowing a fully software • HLOS support for customizable interface scalable solution. • Optimized power management companion chip: TWL4030
Trace Emulator NOR NAND Mobile Analyzer Pod FLASH Flash DDR
Trace JTAG/ GPMC SDRC GPIO GPIO Emulation Fast UART/IrDA I/F IrDA Camera I/F Camera NaviLink™ Serial-Parallel Module GPS I2C OMAP3410 Camera-Serial Sub Camera Hollywood™ ARM® Imaging Video and Mobile DTV Cortex™-A8 Audio Accelerator SPI (IVA™ 2)
WiLink™ I2C TWL4030 mWLAN SDIO On/Off System Interface Battery Shared Memory Controller/DMA Power Reset Charger Reset Coexistence Clock Manager Power Manager 32 kHz Crystal BlueLink™ Data UART Bluetooth® Timers, Interrupt Controller, Mailbox Voice Audio Voice McBSP Audio/Voice McBSP Audio Codec Boot/Secure ROM McBSP Flashing In/Out USB M-Shield™ Security Technology: SHA-1/MD5, High-Speed (HS) TCS USB2 OTG Controller Modem Control/Data DES/3DES, RNG, AES, PKA, Secure WDT, Keys HS USB USB Chipset McBSP Transceiver Connector Display Voice McBSP Controller LED MS/MMC/SD/SDIO Parallel-Serial SPI Key Pad Keypad
QCIF QVGA TSC2046 Touch MS/MMC/SD/SDIO Color TFT Color TFT Screen Controller Card Display Display Battery
Texas Instruments 2007 Wireless Terminals Solutions Guide 50 OMAP™ Platform
OMAP Platform Software
Operating Systems Optimized for the OMAP™ Platform OS, especially designed for media rich mobile phones. These user interface platforms are designed to offer easy access to the wide Through close collaboration with OS providers and key third parties, variety of data services for networks supporting 2.5G, 3G and beyond. TI provides robust development packages for the OMAP™ platform that support all wireless communications standards and the most widely used high-level programming languages. Complete reference Microsoft® Windows Mobile® designs, board support packages (BSP) and reference software Collaboration with Microsoft has enabled TI to design optimized packages provide everything needed to get started with the OMAP solutions that get manufacturers to market fast. Windows Mobile platform, including integrated development environments, driver software is certified for OMAP processors, and TI will continue to support, accelerated DSP software, JTAG emulators, and more support further OS versions. TI offers DSP hardware accelerated depending on the selected OS. TI’s OMAP 2 and OMAP 3 platforms Windows Media in certain OMAP platforms. Platform reference include innovative power management and hardware acceleration for designs with software packages and BSPs for Microsoft Windows multimedia codecs and graphics which provide a richer multimedia Mobile-based devices on Pocket PC, Pocket PC Phone Edition, and experience with leading enterprise and entertainment applications. Microsoft Smartphone are included. A full range of easy-to-use These platform capabilities and tools, in addition to applications and software development tools is also available through the OMAP support available through the OMAP Developer Network and Developer Network and Microsoft’s mobile2market programs. Independent OMAP Technology Centers (OTCs), enable developers to create and optimize real-time execution of applications that leverage the processing power and low power consumption of the OMAP platform. Linux® A full board support package for Linux helps software developers get started quickly with the performance and power efficiency of the Symbian OS™ OMAP platform. The open source BSP includes the basics plus a set Developing with the Symbian OS and the OMAP platform gives of advanced and fully tested tools to accelerate development. This developers an open, easy-to-develop software environment with includes GNU Linux OS, source-level debugging tools, Linux trace access to DSP-based hardware acceleration through a high-level API. tools, language tools including C, C++ and Java™. Commercial support TI is a Symbian Platinum Partner and offers full support for Symbian is available from MontaVista, for both their MontaVista CEE 3.x and OS v8 and v9 ports. TI is also qualified to support S60 Software Mobilinux 4.x products, Wind River also is offering commercial grade Platform and has access to S60 APIs. This gives TI’s hardware platform Linux on the OMAP platform. These offerings include the Linux kernel, a higher level of integration with S60 Software Platform. Software software updates, utilities, development tools and technical support. libraries from TI and the OMAP Developer Network provide manufac- Additionally, there are partners including Trolltech and Access that turers with innovative software applications to further differentiate offer complete user interface (UI) and application platforms on the devices. Also supported is UIQ, a user interface platform for Symbian OMAP platform with Linux.
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 51 OMAP Platform Software
Java™ TI, Sun Microsystems and other Java™ leaders have created a complete Java solution and development environment for TI’s wireless chipsets and the OMAP™ platform. Through Java virtual machines (VMs) companies like Aplix, Esmertec and TAO Group combine enhanced Java applications and services with TI’s TCS wire- less chipsets, OMAP-Vox™ chipsets and OMAP processors. Enhanced Java features include MIDP and CDLC, which provide a complete J2ME™ (Java 2 Micro Edition) application runtime environment. TI’s OMAP platform supports Mobile Media APIs (JSR-135), MPEG-4, MP3, MIDI and other MIME types.
Texas Instruments 2007 Wireless Terminals Solutions Guide 52 OMAP™ Platform
OMAP Platform Resources
Wireless Applications Center The Wireless Applications Center helps handset makers to see a variety of solutions for cellular, Wireless LAN and Bluetooth® wireless technology. Manufacturers use the applications center to gain firsthand experience with new wireless software programs and services on the market and under development from TI’s OMAP Developer Network. Current locations include Dallas, Bangalore, Taipei and Nice. Within each center are targeted areas to meet customer needs, including a wireless demo area to see actual solutions in use. The OMAP Developer Network Support Lab provides extensive support tools and programs to assist design from the beginning of development through to customer demonstrations and volume manufacturing. Additionally, several advanced test systems facilitate thorough and rapid testing of new systems and subsystems. Other offerings of the center include an application benchmarking program to compare OMAP technology performance numbers with those of competitive platforms; a device loan and support program that gives customers access to tools and devices for development and demonstrations at tradeshows and customer meetings; and a website database where demos are accessible online.
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 53 OMAP Platform Resources
Application Suite Ecosystem Key Benefits Broadening its commitment to accelerate wireless development in high-growth markets worldwide, TI is working with leading application • All partner application suites are available on TI’s “LoCosto” software providers to offer a scalable, integrated application suite for platform today affordable feature phones. Partner application suites are integrated • Accelerated porting on OMAP-Vox™ solutions allowing onto TI’s “LoCosto” single-chip mobile phone solution and OMAP-Vox™ manufacturing production as early as 3Q07 product family for a highly customizable application solution that • Committed and aligned roadmap with all partners for greatly reduces the overall handset development cycle. Working with future TI products market-leading solutions including Motorola AJAR, OpenPlug’s ELIPS, Sasken Application Framework and SKY MobileMedia’s SKY-MAP™, TI gives its customers the flexibility to select an application suite that can be easily adapted to the unique needs of handsets and specific operator and consumer requirements. Porting, validating and integrating software requires significant monetary and time investment. Working with an ecosystem of application software providers, TI handset customers have the flexibility to choose a preintegrated solution, simplifying the development process. With the technical integration work complete, handset manufacturers reduce time to market by approximately six months, opening doors to quickly deliver new phone models, particularly for high-growth markets. A common TI software foundation built with open industry standard application programming interfaces (APIs) allows for software re-use and easy consistent migration across TI’s roadmap of “LoCosto” solutions and OMAP-Vox platforms. TI is committed to delivering solutions for emerging markets as they require increasingly advanced technologies. TI and its applications suite partners make efficient use of system resources and promote seamless interaction between applications. These integrated offerings reduce time to market, allowing mobile device manufacturers to introduce new differentiated models faster and reduce costs.
Enabling Innovation in Multimedia Communications
Texas Instruments 2007 Wireless Terminals Solutions Guide 54 OMAP™ Platform
OMAP Platform Resources
OMAP Gaming Development Platform Key Features The OMAP Gaming Development Platform allows developers and publishers to create a portfolio of mobile games with significantly • Complete hardware and software package to enable developers reduced time and monetary investments. With this gaming platform to optimize performance-, timing- and memory-related design based on Ideaworks3D’s Airplay™ and TI’s OMAP2430 processor, factors early in the game development process developers will be able to create games targeting a broad range of • Based on the OMAP2430 processor with Ideaworks3D Airplay™ mobile handsets. Developers will be able to create the majority of software a game before new handsets are available on the market, enabling • Increases the target market for a game by increasing prompt availability of games on new mobile phones as they enter the footprint the market. • Reduces mobile gaming fragmentation and developers costs • Offers a complete single-game developer package enabling The combined solution from TI and Ideaworks3D changes the current 3D development across multiple operating systems mobile gaming development process by allowing developers to create one game which runs on leading open operating systems (OSs), including Symbian OS™, Linux® and Microsoft® Windows Mobile®. As part of this effort, Ideaworks3D will optimize and integrate its industry leading Airplay game software development kit (SDK) for TI’s OMAP2430 processor-based mobile gaming platform is a complete TI’s OMAP2430 processor which benefits TI’s extensive OMAP™ hardware and software package that will enable developers to ecosystem of leading game publishers and developers, serving optimize performance-, timing- and memory-related design factors handset manufacturers and mobile operators worldwide. early in the game development process.
TI’s OMAP2430 processor integrates advanced 3D graphics hardware TI’s mobile gaming website provides additional resources for acceleration enabling mobile game developers to extract new levels developers, handset manufacturers and operators. The site contains of performance and enhance the game-play experience. The new information on all of TI’s mobile gaming developments and includes OMAP Gaming Platform with Ideaworks3D allows developers to take downloadable SDK and tools, and market and standards information. full advantage of the powerful 3D graphics capabilities of the OMAP Visit www.ti.com/omap gaming to learn more about how TI is architectures for popular mobile operating systems. changing the mobile gaming market.
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 55 OMAP Platform Resources
OMAP Developer Network Member Benefits/Product Exposure TI’s OMAP™ Developer Network provides innovative applications, Prospective customers will be exposed to developer product services and multimedia modules for TI’s OMAP processors, cellular information through a variety of marketing opportunities including: modem solutions and non-cellular wireless technologies including • OMAP Developer Network online catalog WLAN, Bluetooth®and GPS. Consisting of an extensive range of third • TI collateral party software developers, the ready-to-implement OMAP software • Wireless Access e-newsletter and algorithms deliver the latest, most compelling applications for • Website promotions handsets in 2.5G and 3G and beyond. • Online demos OMAP Developer Network members are continuously building new Network members may have their application demos selected for multimedia-rich applications and capabilities on the entire TI wireless use in one or more of TI´s regional Wireless Applications Centers for portfolio to enable product differentiation, quick time to market and direct exposure to TI customers. Members may also be invited to fast return on investment. Just a few of the applications available participate at select tradeshows using TI booth properties and exhibit through the OMAP Developer Network include streaming media, voice space. Members can also be included in OEM/ODM proposals and recognition, 3D gaming, Java™ virtual machines, high-end audio, Requests for Quotation to complement TI’s products. speech recognition, text-to-speech, videoconferencing, location-based services and security. TI works with the industry’s most innovative developers, including Access, Aricent, Ingenient, McubeWorks, Ideaworks3D, InterVideo, HI Corp, Nuance, PacketVideo, NXP Software, SafeNet, Sasken, Trolltech, Trusted Logic, Motorola TTPCom Product Group, SKY MobileMedia, Open-Plug, and hundreds more.
Training Various online and live workshop training opportunities are available for software development, DSP algorithm development, development tools and other subjects.
Developer Catalog TI’s online OMAP Developer Network catalog serves as an important place to assist TI customers in identifying solutions offered by Developer Network members. Application descriptions and services are provided for additional information to aid in selecting an application mix or to seek engineering assistance in a particular application area.
Invitation to Join Network If you are developing software applications for handsets and PDAs supporting 25, 3G and beyond, apply for membership to the OMAP Developer Network. www.ti.com/omapdevnet
Texas Instruments 2007 Wireless Terminals Solutions Guide 56 OMAP™ Platform
OMAP Platform Resources
Independent OMAP Technology Centers OTCs are valued members of TI’s wireless offering with proven track records. As wireless designs become more integrated and complex, Wireless manufacturers are seeking expert support for emerging TI and its OTCs are working to ensure that manufacturers receive the technologies and specialized techniques that are continually evolving. support and solutions they need to capitalize on the rapidly changing While TI is the world leader in wireless expertise, the skills and wireless market in the locale they want it. When you plan your next time-to-market requirements of manufacturers in the wireless industry product development, consider the benefits of partnering with TI and today are tremendously divergent. Manufacturers must consider an OTC for support. communications protocols, baseband processors and other wireless www.ti.com/otc design technologies, in addition to other requirements like security, HLOSs, multimedia coders/decoders (codecs), consumer applications Symbian™ OS and services, interactive gaming, location-based services, WLAN Elektrobit (802.11), and Bluetooth® wireless technology. Fujitsu Broad Solution & Consulting Hampex To further streamline the development process, TI offers support and Intrinsyc service through its worldwide Independent OMAP Technology Centers MPC Data Limited (OTCs). Manufacturers can use OTCs to leverage leading expertise in Sasken hardware design, embedded software development, HLOSs support SysOpen Digia and system integration. It’s possible to assemble a team of world TapRoot Systems class experts locally for your project using OTCs. Teleca Wipro TI’s global network of OTCs provides the diverse expertise that wireless manufacturers need locally: Linux® • Systems integration Elekrobit • Full turnkey design (hardware and software) Intrinsyc Sasken • Wireless systems architecture SysOpen Digia • Embedded software development TapRoot System – Device drivers Teleca – OS baseport development Wipro – OS optimization ® ® – Middleware Microsoft Windows Mobile – Applications BSQUARE • Hardware design Fujitsu Broad Solution & Consulting • RF and antenna design Intrinsyc • Communication protocols and telephony MPC Data Limited • GSM/GPRS, EDGE, WCDMA protocols Sasken Teleca • WLAN 802.11x, Bluetooth® wireless technology TapRoot System • Multimedia codec development Wipro • ARM® and DSP algorithm development Nucleus™ Elektrobit Intrinsyc MPC Data Limited Sasken SysOpen Digia Wipro Palm® OS HandEra Teleca Wipro
Wireless Terminals Solutions Guide Texas Instruments 2007
OMAP™ Platform 57 OMAP Platform Resources
OMAP™ Software Development Tools OMAP2430 Software Development Platform (SDP) From early development to final optimization, TI and partners provide a complete line of products that enable effective, efficient development The OMAP2430 SDP offers an easy, cost-effective way to for architectures based on the OMAP™ platform. Even before silicon is develop, evaluate and test software for next-generation available, models allow you to simulate the device. Then, when silicon advanced smartphones and converged portable multimedia is ready, development platforms aid you in coding and debugging devices based on the OMAP™ 2 architecture. The SDP provides performance-critical applications. a full range of software, services and support, including board TI’s highly optimized Code Composer Studio™ integrated development support packages for access to HLOSs such as Symbian™, ® ® ® environment (IDE) provides best-in-class support for development of Linux and Microsoft Windows Mobile . Throughout DSP-based codecs and multimedia functions. TI also includes ARM® development, designers have flexible tools for developing all compilers with industry-standard ABI support that deliver fast, compact aspects of the system, including peripheral drivers. Visibility executable files. For debugging, TI’s XDS-560 emulator allows you to into each software component streamlines the debug process take advantage of the emulation capabilities designed into OMAP considerably. Tools for debugging mobile connectivity ® processors. Finally, our innovative visualization and optimization tools capabilities such as Bluetooth or wireless LAN are also help you to achieve the greatest performance possible with your design. included. Complementary tool solutions are also available from TI’s many partners. Close support from the emulation developer community helps third parties to develop their products early and effectively. For example, companies such as Lauterbach and Sophia Systems provide powerful products for OMAP devices. Analyze Application The comprehensive toolset for OMAP developers gives TI customers and Tune Design significant options to help system integrators solve the functional Algorithm Integrate requirements, performance goals and power constraints they face Design when developing wireless handsets. Partner
Code and Simulate Build
Debug Model and Evaluate
TI’s OMAP2430 SDP saves time to market by providing all the hardware and software needed for cost-effective development of OMAP 2 processor-based systems.
TI tools and partner solutions provide a full circle of support for developers of handheld products based on OMAP processors.
Texas Instruments 2007 Wireless Terminals Solutions Guide 58 Mobile Connectivity Solutions
Overview
To Know More interoperability across mobile standards bring embedded and battery- powered applications a new level of functionality and extended Mobile Connectivity Solutions featured in this issue: battery life. TI also offers support for Voice over WLAN (VoWLAN) BlueLink™ 7.0 Bluetooth® and FM Solution 59 technologies to deliver seamless voice and data connectivity between BlueLink 6.0 Bluetooth and FM Solution 60 WLAN and cellular networks. BlueLink 5.0 Bluetooth Solution 61 TI has created a coexistence package for WLAN and Bluetooth BRF6150 Bluetooth Solution 62 wireless technologies in co-located environments. TI’s coexistence platform enables data and voice to be transmitted without interfer- WiLink™ 6.0 WLAN, Bluetooth and FM Platforms 63 ence while optimizing system throughput, range, and responsiveness. WiLink 5.0 WLAN Platform 64 Additionally with no antennae isolation requirements, even providing WiLink 4.0 WLAN Platform 65 for shared antenna designs, it is ideal for mobile handsets. WLAN and Bluetooth Coexistence 66 NaviLink™ 5.0 GPS Solution 67 Mobile Digital TV NaviLink 4.0 GPS Solution 68 Mobile digital TV (DTV) combines the two best-selling consumer Hollywood™ Mobile DTV Solution 69 products in history—TVs and mobile phones. TV will be an ingredient that drives demand for the next generation of mobile phones because consumers want both communications and entertainment—all in one place and in one device. TI technology is driving mobile digital TV To deliver mobile connectivity on multiple networks in today’s complex with OMAP™ processors and Hollywood™ mobile broadcast solution, mobile devices, TI’s integrated, proven wireless connectivity solutions the wireless industry’s first digital TV on a single piece of silicon, ensure multi-mode operation and access to a variety of network which captures broadcast signals and allows consumers to watch live connections for service anytime, anywhere. TI offers single-chip TV programming on their handset. Together, a Hollywood single chip solutions for Bluetooth® technology, mobile WLAN, GPS, FM radio and and an OMAP™ processors will bring you the same TV experience you mobile digital TV using TI’s DRP™ technology and 90-nm process have at home—but on your mobile phone. technology. TI’s mobile connectivity solutions are tightly integrated with TI’s cellular modem solutions, OMAP™ processors and OMAP- GPS Vox™ solutions so manufacturers can get products to market quickly. TI addresses GPS with a highly integrated single-chip solution that TI is also looking to the future by driving development of future mobile interfaces with TI’s wireless chipsets and delivers precision location technologies such as Ultra Wideband and others. capabilities to markets ranging from voice-centric handsets to high- end multimedia smartphones. TI’s GPS5300 NaviLink™ 4.0 single-chip Bluetooth® Wireless Technology solution is optimized for mobile phones. Through DRP technology, TI By leveraging its innovative DRP technology, TI’s single-chip Bluetooth is able to provide the smallest size and lowest cost GPS discrete wireless solutions integrate an RF and Bluetooth processor that is solution with low power and high performance to mobile phone optimized to mix with the various communication standards for 2.5G, manufacturers. 3G and beyond. TI’s single-chip Bluetooth solutions deliver high performance with low power and lower system cost, enabling manu- Ultra Wideband facturers to provide optimized Bluetooth wireless personal area Ultra Wideband (UWB) is a wireless technology for transmitting networking (WPAN) connectivity to their mobile devices. TI also offers digital data at very high rates over a wide spectrum of frequency a single chip that integrates the industry’s best performing Bluetooth bands using very low power, targeted for wireless personal area with high fidelity FM stereo and mono performance. networks (PANs). UWB is ideally suited for wireless communications, particularly short-range and high-speed data transmissions. TI is 802.11/WLAN actively involved with the WiMedia™ Alliance to promote and enable Optimized at the hardware, firmware and driver level, TI solutions the rapid adoption and standardization of UWB worldwide for deliver the power efficiency, small size, data/access security and high-speed wireless, multimedia-capable personal-area connectivity spectrum sharing required for mobile WLAN handsets. Innovative in the PC, CE and mobile market segments. performance levels, the industry’s lowest power and smallest size and
Wireless Terminals Solutions Guide Texas Instruments 2007
Mobile Connectivity Solutions 59 BlueLink™ 7.0 Bluetooth® and FM Solution
® BlueLink™ 7.0 WPAN Solution: Bluetooth Key Benefits and FM RX/TX Single Chip The BL6450 BlueLink™ 7.0 single chip is the industry’s first Bluetooth • Industry’s smallest Bluetooth® and FM single-chip solution solution manufactured in 65-nm CMOS and provides a complete based on TI’s 65-nm CMOS process and DRP™ technology with hardware and software solution for Bluetooth and FM, enabling ease of low power and cost design and expediting time to market for mobile device manufacturers. • Supports Bluetooth Specification 2.1+ EDR and relevant features The solution’s Bluetooth function is based on TI’s fifth-generation in next SIG releases Bluetooth core, and its FM function presents state-of-the-art performance • Fully embedded FM and radio data system (RDS) receiver and in all critical FM parameters, such as current consumption, stereo transceiver, supporting U.S./European and Japanese FM band signal-to-noise ratio (SNR) and sensitivity. • Enhanced Bluetooth and FM performance • Highly optimized for mobile phones systems Since both the Bluetooth and FM functions are integrated on the same • Advanced power management for extended battery life and silicon, the solution ensures optimal RF coexistence. Consequently, the ease of design two functions can work simultaneously so that the FM function • Flexibility for easy integration into various host system receives/scans/sends radio data system (RDS) information to a host, topologies with shared and separated interfaces for while the Bluetooth function is in any operational mode. Bluetooth and FM functions Additionally, the BlueLink 7.0 solution adds support for FM transmit, • Supports multiple Bluetooth profile use-cases (complex including a programmable gain power amplifier with levels compliant to scenarios) working concurrently with FM FCC and ETSI specifications, and higher power levels. It also includes FM analog and digital (I2S) data interfaces supporting voice quality sample rate and MP3 audio quality sample rates. TI’s power management hardware and software algorithms provide • Significantly smaller number of interfaces (for the FM function) significant power savings in the most commonly used Bluetooth modes compared to a discrete Bluetooth and FM solutions of operation, such as page and inquiry scan. The BL6450 BlueLink 7.0 single chip also incorporates TI’s Leveraging TI’s DRP™ technology and 65-nm process technology, the Bluetooth/WLAN coexistence hardware and software solution, BL6450 is the industry’s smallest Bluetooth and FM single-chip solution. providing a collaborative interface with TI’s WiLink™ mobile WLAN This allows customers to realize significant cost and size savings due to: solutions for optimal bandwidth. TI’s coexistence solution enables • Significantly lower number of external components compared to advanced usage scenarios such as VoIP over WLAN with Bluetooth discrete Bluetooth and FM solutions voice using a shared antenna.
Host 2.4 GHz Clocks ® Audio Bluetooth Bluetooth Filter Interfaces MAC/BB Radio Host I/F SDIO/SPI FM Legacy Host I/F FM Filter MAC/BB FM Radio
Texas Instruments 2007 Wireless Terminals Solutions Guide 60 Mobile Connectivity Solutions
BlueLink™ 6.0 Solution (WPAN)
® BlueLink™ 6.0 Bluetooth and FM Solution Key Benefits The BlueLink™ 6.0 platform provides a complete hardware and software solution, enabling ease of design and faster time to market. The BRF6350 • Bluetooth® Specification 2.0 + EDR and high-fidelity FM BlueLink 6.0 single chip is the only 90-nm solution available in the WPAN stereo and mono performance on a single chip marketplace. The solution’s Bluetooth function is based on TI’s 4th • Integration of Bluetooth and FM in the same silicon provides generation Bluetooth core that has been shipped in millions of units 25 percent solution size savings compared to discrete solution worldwide, while its FM function delivers state of the art performance • Proven FM-Bluetooth RF coexistence in all critical FM parameters, such as current consumption, stereo SNR, • Complete software stack support for Bluetooth and FM, enabling and sensitivity. ease of design and quick time to market • On-chip power management adapted to cellular applications Since both Bluetooth and FM functions are integrated on the same • Incorporates TI’s Bluetooth and WLAN coexistence hardware silicon, the solution ensures optimal RF coexistence. Consequently, the and software solution, providing a collaborative interface with two functions can work simultaneously in such a way that the FM TI’s mobile WLAN solutions function receives/scans/sends RDS information to a host, while the • TI’s DRP single-chip technology delivers smallest and lowest Bluetooth function is in any operational mode. cost solution BlueLink 6.0 platform software offers designers the flexibility to work with various operating systems, including Linux®, Microsoft® Windows • Lower number of external components compared to discrete Mobile®, Symbian™ and Nucleus. The BlueLink 6.0 software includes Bluetooth and FM solutions; TI’s Bluetooth Protocol Stack (BTIPS) running on Nucleus. BTIPS is • Lower number of balls (for the FM function) compared to discrete optimized to work with TI’s OMAP™ and OMAP-Vox™ platforms and Bluetooth and FM solutions; TCS wireless chipsets. In addition to BTIPS, the BlueLink 6.0 software • Power savings in the most commonly used Bluetooth modes of package includes an FM protocol stack. operation, such as page and inquiry scan through hardware and Leveraging TI’s DRP™ technology and 90-nm process, the BRF6350 software algorithms. BlueLink 6.0 single chip is an integrated Bluetooth and FM solution in a The BlueLink 6.0 single chip also incorporates TI’s Bluetooth/WLAN small form factor. This allows manufacturers to realize significant cost, coexistence hardware and software solution, providing a collaborative size and power savings due to: interface with TI’s WiLink™ mobile WLAN solution for optimal • 25 percent smaller device size compared to discrete Bluetooth bandwidth. TI’s coexistence solution enables advanced usage scenarios and FM solutions; such as VoIP over WLAN with Bluetooth voice using a shared antenna.
2 WLAN PCM I S Codec UART HCI SDIO HCI Coexistence Codec I2C HCI FM Interface Clocks Interface Interface (Digital FM Interface Interface Interface Interrupt Audio)
Bluetooth Baseband ROM Matching Network ARM7TDMI® FM Receiver Balun Rx/Tx Bluetooth® Switch Transceiver Analog RAM Audio Outputs Clock & Power Peripherals Management
FM Wakeup Module
BRF6350 BlueLink™ 6.0 Functional Block Diagram
Wireless Terminals Solutions Guide Texas Instruments 2007
Mobile Connectivity Solutions 61 BlueLink™ 5.0 Bluetooth® Solution
® BlueLink™ 5.0 Bluetooth Single-Chip Solution Key Benefits Optimized for mobile terminals, the BlueLink™ 5.0 platform from TI is a highly integrated, digital CMOS, single-chip solution supporting • Supports Specification v2.0 and Enhanced Data Rate (EDR) Bluetooth® Specification v2.0 and all software needed for Bluetooth single-chip solutions for mobile terminals operation. The BRF6300 BlueLink 5.0 solution is based on TI’s prior • Industry best power management including lowest power generation BRF6150, leveraging and exceeding its capabilities to provide consumption, direct connection to battery (up to 5.4 V) and maximum Enhanced Data Rate (EDR) support, lowest power consumption shut-down (6 µA) to enable market’s longest talk, in most Bluetooth scenarios and lowest cost and bill of materials (BOM). standby times • Complete solution for faster time to market and integration TI’s BRF6300 BlueLink 5.0 solution integrates the Bluetooth baseband, • Cost savings RF transceiver, ARM7TDMI®, memory (ROM and RAM) and power – Complete set of reference designs with TI’s management on one chip. The single chip utilizes TI’s DRP™ technology, OMAP™ processors and TCS chipsets a revolution in RF technology offering major advantages over the existing – WLAN coexistence solution solutions based on analog RF. All-digital single-chip benefits include • TI’s 90-nm CMOS and DRP™ single-chip technology increased scalability, lower power consumption, reduced size and ultimately lower system cost. The single chip is optimized for mobile terminals delivering the RF performance and ease of integration required by manufacturers. TI’s OMAP™ processors. The single chip includes TI’s proven collaborative advanced process and novel design enable the BRF6300 BlueLink 5.0 coexistence mechanism between WLAN and Bluetooth networks. This solution to connect directly to the battery (up to 5.4 V). This saves the feature combined with Bluetooth Specification v2.0 adaptive frequency cost and space of an external regulator and simplifies the interface and hopping (AFH) and extended Synchronous Connection Oriented (eSCO) integration with the host by separating their power management entities. allows TI to deliver a high-quality Bluetooth voice and enhanced data For ease of design, the BlueLink 5.0 platform is pre-integrated in throughput when co-located in small mobile products such as complete reference designs with TI’s cellular modem chipsets and smartphones and wireless PDAs.
WLAN GSM/GPRS
Digital OMAP™ RF BRF6300 Baseband Applications BlueLink™ 5.0 Processor Analog
Clock
Smartphone application: BRF6300 BlueLink 5.0 solution interconnects with the OMAP™ applications processor, GSM/GPRS chipset and WLAN.
Texas Instruments 2007 Wireless Terminals Solutions Guide 62 Mobile Connectivity Solutions
BRF6150 Solution (WPAN)
BRF6150 Single-Chip Bluetooth® Wireless Technology Key Benefits Optimized for mobile terminals, TI’s BRF6150 is a highly integrated Bluetooth® wireless technology Specification v1.2 solution that • Direct connection to battery provides improved power combines TI’s Bluetooth wireless technology baseband, RF, management (2.7 V to 5.5 V) ARM7TDMI® and power management into a single chip. Its extreme • Full Bluetooth® Specification v1.2, including AFH and levels of integration enhance performance and lower power consumption faster connection while reducing cost and minimizing board space. • Low cost and part count due to high integration and improved interfaces The BRF6150 offers improved RF performance and power management • Reduced development time through availability of pin-to-pin capabilities deliver higher integration and reduced package size, resulting compatible stacked-flash prototypes (4.5 mm x 4.5 mm) 2 in a 50 mm PCB layout Bluetooth wireless technology solution for • Complete reference designs with TI’s OMAP™ platform and mobile phones. The BRF6150 is tailored to suit mobile applications GSM/GPRS chipsets provide fast time to market requirements, including RF performance, power consumption, solution • WLAN collaborative coexistence solution size, ease of integration and cost. It connects directly to the battery, saving cost and space of external regulators and simplifying the interface with the host by separating power management entities. The BRF6150, which utilizes adaptive frequency hopping (AFH), offers an coexistence scenarios for simultaneous Bluetooth wireless technology upgrade to the current coexistence solution. When manufacturers com- voice/data and high speed Wi-Fi data. It also enhances WLAN data bine the v1.2 compliant BRF6150 with TI’s Bluetooth/WLAN coexistence throughput to maximum performance when co-located into mobile hardware and software package and with a TI WLAN solution, improved products such as smartphones and wireless PDAs. The BRF6150 includes coexistence performance is achieved. This results in better utilization complete reference designs with TI’s GSM/GPRS chipsets and of the 2.4 GHz frequency band and solves the most demanding OMAP™ platform.
WLAN GSM/GPRS
Digital OMAP™ RF Baseband BRF6150 Applications Processor Analog
Clock
Smartphone application: BRF6150 interconnects with the OMAP™ applications processor, GSM/GPRS chipset and WLAN.
Wireless Terminals Solutions Guide Texas Instruments 2007
Mobile Connectivity Solutions 63 WiLink™ 6.0 WLAN Bluetooth® and FM Solution
WiLink™ 6.0 Single-Chip WLAN, Bluetooth® Key Benefits and FM Solutions TI’s WiLink™ 6.0 mobile platform is a complete hardware and software • Single-chip mobile WLAN, Bluetooth® and FM solution offering comprising proven, carrier-quality mobile WLAN, Bluetooth and implemented in 65-nm CMOS process using TI’s DRP™ FM cores integrated onto a single chip. technology enables: – Reduced power consumption for extended talk and There are two solutions in the WiLink 6.0 product offering. The WL1271 standby times supports 802.11b/g, while the WL1273 supports 802.11a/b/g/n. Both – Bill of material reduction single-chip solutions support Bluetooth Specification 2.1 + EDR and FM – Small form factor transmit and receive. • Proven carrier quality to enhance the user experience with The WiLink 6.0 single-chip solutions are manufactured in 65-nm CMOS range-extended mobile WLAN (802.11a/b/g/n), Bluetooth process and use TI’s DRP™ technology to deliver low power, a small form Specification 2.1 and FM functional cores factor and low cost requirements of handset manufacturers worldwide. • Sophisticated ELP™ low-power technology and VoWLAN support with on-chip UMA and IMS acceleration for extended TI’s WiLink 6.0 platform is designed to work with OMAP™ 2 processors, talk time and battery life OMAP 3 processors, the OMAPV1030 processor, and the “eCosto” • Coexistence features enable simultaneous operation of each OMAPV1035 solution to provide an optimized modem, applications integrated function processor and mWLAN/Bluetooth/FM solution for low- to mid-tier handsets. The WiLink 6.0 solution includes TI’s proven, robust coexistence platform, The WiLink Software Development Kit (SDK) 6.x included with the which addresses system-wide interference issues, encompassing radio WiLink 6.0 platform is optimized for mobile phone applications. This design, and hardware and software solutions. Coexistence expertise is includes support for Linux®, Windows® WinCE™, and Symbian™ becoming increasingly important as more radios are being added to the operating systems, as well as lab testing and manufacturing software. It handset. TI leads the market in coexistence solutions for Bluetooth and is also partitioned to minimize host CPU loading and power consumption mWLAN with more than 30 handsets using TI’s coexistence platform. in mobile applications.
Texas Instruments 2007 Wireless Terminals Solutions Guide 64 Mobile Connectivity Solutions
WiLink™ 5.0 WLAN Platform
WiLink™ 5.0 Mobile WLAN Solution Key Benefits The WiLink™ 5.0 platform integrates mobile WLAN (mWLAN), Bluetooth® and FM stereo audio all in a space-saving platform for • Integrates TI’s BlueLink™ 6.0 solution, which combines mobile phones. The WiLink™ 5.0 solution provides fast time to market Bluetooth® with high-fidelity FM stereo and mono performance for handset manufacturers and caters to evolving consumer tastes for on a single chip rapid data access, mobile entertainment and seamless connectivity • VoWLAN functionality, optimized on TI’s OMAP-Vox™ and between the WLAN and cellular networks. WiLink solutions, enabling UMA on the handset • 20 percent reduction in solution size and power consumption TI brings seamless cellular and Wi-Fi® connectivity to consumers with through use of TI's innovative DRP™ technology at 90-nm VoWLAN functionality, optimized on TI’s OMAP-Vox™ and WiLink • Advanced Bluetooth and WLAN coexistence through use of TI’s solutions, enabling UMA on the handset across multiple operating second generation of Bluetooth/WLAN hardware and software systems such as Symbian™, Microsoft® Windows Mobile®, Linux® and co-existence package, enabling re-use of existing systems, quick low level operating systems. UMA provides consumers on-the-go voice time to market, and antenna sharing, reducing the bill of access over WLAN or the cellular network using their mobile phones, and materials (BOM) for manufacturers will transition to IMS as the fixed mobile convergence market matures. • Support for multiple operating systems: Symbian™, Microsoft® ® ® The WiLink 5.0 platform integrates TI’s WiLink 4.0 mWLAN single chip Windows Mobile , Linux and low level OSs with its BlueLink ™ 6.0 solution, which combines Bluetooth with • Multiple package options, including on-board and module high-fidelity FM stereo and mono performance on a single chip. The solutions combination of mWLAN, Bluetooth and FM functionality allows users to perform a variety of simultaneous tasks, such as listening to the radio music on a Bluetooth headset while checking email via Wi-Fi. WiLink 5.0 platform takes advantage of TI’s expertise from the Both devices in the WiLink 5.0 module are manufactured in TI’s company’s previous generations of mobile WLAN solutions, which are innovative DRP™ technology at the 90-nm node, which cuts both solution being shipped in more than 30 mobile handset devices and cellular size and power consumption by up to 20 percent over competitive convergence products today. The platform uses the second generation solutions, in critical modes of operation. of TI’s Bluetooth/WLAN hardware and software coexistence package, With three co-located radios, efficient management of RF is required for enabling re-use of existing systems, quick time to market and antenna simultaneous operation of WLAN, Bluetooth and FM applications. The sharing, reducing the bill of materials (BOM) for manufacturers.
WiLink™ 5.0 Platform: WLAN, Bluetooth® + FM
Power WLAN Front Battery Management End MAC/BB/RF 2.4-GHz RF
Bluetooth Coexistence BlueLink™ 6.0 Bluetooth + FM
Wireless Terminals Solutions Guide Texas Instruments 2007
Mobile Connectivity Solutions 65 WiLink™ 4.0 WLAN Platform
WiLink™ 4.0 Mobile WLAN Single-Chip Solutions Key Benefits TI’s WiLink™ 4.0 mobile WLAN platform is a complete hardware and software offering optimized for mobile phones. TI’s WiLink 4.0 platform • Complete WLAN hardware and software solutions offers two different hardware single-chip implementations to provide optimized for mobile 802.11b/g, 802.11a/b/g applications flexibility for OEMs to offer 802.11b/g or 802.11a/b/g operation. The • Single-chip 802.11 Media Access Controller/Baseband/RF WL1251 802.11b/g solution and the WL1253 802.11a/b/g solution transceiver WLAN solutions (WL1251 and WL1253) are single chips which integrate the media access controller (MAC), reduce BOM, save PCB space and extend standby and talk times baseband processor and RF transceiver. • Voice over WLAN (VoWLAN)-ready: Sophisticated power-saving sleep modes match the packet and traffic characteristics of The WL1251 and WL1253 WiLink 4.0 single-chip solutions are VoWLAN applications manufactured in 90-nm process technology and extend TI’s leadership • First WLAN solutions using 90-nm manufacturing process in single-chip integrated solutions using TI’s DRP™ technology. Both and uses TI’s DRP technology to enable market leading single-chip solutions are pin-for-pin compatible to simplify manufacturers’ physical size (6 mm x 6 mm BGA) and low power consumption product line strategies for 802.11b/g and 802.11a/b/g products. This • Industry’s lowest power consumption with TI’s ELP™ compatibility enables just-in-time manufacturing options that are technology extends battery life of handsets, wireless responsive to marketplace demand and design re-use to speed PDAs and other mobile devices time to market of new products. • Bluetooth® coexistence technology ensures high quality The WiLink Software Development Kit (SDK) 4.X included with the of service during simultaneous voice and data WLAN and WiLink 4.0 platform is optimized for embedded applications. This Bluetooth operations includes support for Linux®, Windows® WinCE™, Symbian™ operating systems, as well as lab testing and manufacturing software. It is also partitioned to minimize host CPU loading and power consumption in mobile applications.
WL1253FE
Power Amplifier WL1251/WL1253 5-GHz Antenna Filter
Host Clocks WL1251FE WLAN ADC MAC Baseband Radio Power WLAN Host I/F Host Amplifier Interface DAC 2.4-GHz Antenna Filter
Bluetooth® Coexistence Bluetooth BRF6150/BRF6300
Texas Instruments 2007 Wireless Terminals Solutions Guide 66 Mobile Connectivity Solutions
WLAN and Bluetooth® Coexistence
® WLAN and Bluetooth Coexistence Key Benefits TI has developed a coexistence solution for simultaneous functionality of 802.11b/g WLAN and Bluetooth® personal area networking in • Simultaneous 802.11 and Bluetooth functionality for mobile devices. Because 802.11b/g and Bluetooth occupy the same data and voice applications 2.4-GHz ISM range of wireless communications spectrum, their RF • Hardware and software solution signals can cause interference for each other unless a coexistence • Flexibility: supported by TI’s WLAN and Bluetooth solution is deployed. single-chip solutions • Low power consumption for mobile battery-operated platforms TI’s coexistence package provides intelligent and seamless • No RF isolation requirements reduces board space coordination between TI’s WLAN and Bluetooth technologies at the • Shared antenna design media access control (MAC) layer. With this level of time domain • Intelligent MAC-layer coordination eliminates performance coordination, no RF isolation is needed between the 802.11 and penalties caused by allocating dedicated bandwidth Bluetooth antennas, simplifying designs and ensuring effective • Small footprint ideal for compact handheld devices operations in small form factors. Designed for interoperability and coexistence, TI’s WLAN and Bluetooth single-chip solutions are capable of cost-efficient collabora- tion and effective coexistence with each other. For instance, WLAN and Bluetooth technologies are able to share the same antenna and antenna filter, reducing bill of materials (BOM) costs and circuit board space. In addition, TI’s WLAN/Bluetooth coexistence technology ensures effective simultaneous operations of voice and data.
2.4-GHz or Radio BlueLink™ and WiLinkTM Single Antenna Sharing BlueLink™ Solution WiLinkTM Coexistence BUS Platform
Bluetooth® WLAN Host Host Interface Interface
Coexistence Solution Architecture
Wireless Terminals Solutions Guide Texas Instruments 2007
Mobile Connectivity Solutions 67 NaviLink™ 5.0 Solution (GPS)
NL5350 NaviLink™ 5.0 Single-Chip GPS Solution Key Benefits Consumers are becoming accustomed to using global positioning system (GPS) services on handheld devices and are demanding similar functional- • Single chip using TI’s DRP™ technology and 90-nm ity on their mobile phone so it is with them at all times. TI’s NL5350 manufacturing process NaviLink™ 5.0 single-chip solution for GPS and assisted GPS (A-GPS) • The smallest GPS solution with a board area around 25 mm2 applications is optimized for mobile phones to deliver applications such as • Lowest total bill of materials for a complete GPS system with mobile navigation, 3D maps, location-based services and safety services. only 11 external passives required • Low power with integrated power management The NaviLink 5.0 GPS single-chip solution is manufactured in 90-nm • High GPS performance with weaker satellite signals, exceeding process technology and uses TI’s DRP™ technology. Through DRP technol- 3GPP and 3GPP2 requirements ogy, TI is able to provide the smallest size, lowest cost, low power, and • Optimized to interface with TI’s 3G chipsets and OMAP™ high performance discrete GPS solution to mobile phone manufacturers. processors to deliver a complete solution for handset OEMs • Smallest Size: The NL5350 NaviLink 5.0 solution integrates a complete GPS system into one chip, significantly reducing the board layout area for a discrete GPS engine. The single chip enables a board area for the complete system of around 25 mm2. • Lowest Cost: As a single chip the NL5350 only requires 11 external passives, a significant reduction over existing solutions which require up to 30 external passives. This level of integration delivers • High Performance: The NL5350 NaviLink 5.0 solution enables a a total bill of materials that is almost 50 percent less than rapid time to first fix (TTFF) from weak satellite signals exceeding competition today. the GPS requirements for 3GPP and 3GPP2 operation. • Low Power: The NL5350 NaviLink 5.0 solution has power The NL5350 NaviLink 5.0 single-chip solution is expected to sample in management integrated on-chip, which simplifies design and further 2Q 2007. Additionally, TI is collaborating with Murata to deliver a small reduces the bill of materials. The single chip also allows direct module to handset OEMs to speed time to market of NaviLink connect to battery for easy incorporation into mobile phone designs. solution-based GPS mobile phones.
Applications HLOS OS Location API
GPS Controller GPS Modem L1, 2, Engine Software 3 stack
NL5350 UART or I2C Base Station NaviLink™ 5.0 Cellular Single Chip Modem Chipset
2 OMAP™ UART or I C Applications (alternative connection Processor to modem) GPS Server
Texas Instruments 2007 Wireless Terminals Solutions Guide 68 Mobile Connectivity Solutions
NaviLink™ 4.0 Solution (GPS)
NaviLink™ 4.0 GPS Single-Chip Solution Key Benefits Global positioning system (GPS) applications are increasing in popularity in mobile phones worldwide for mobile navigation, mapping and safety • Single chip using TI’s DRP™ technology and 90-nm services. TI’s GPS5300 NaviLink™ 4.0 single-chip solution for assisted manufacturing process 2 global positioning system (A-GPS) and stand-alone GPS applications is • Small A-GPS solution with a board area less than 50 mm optimized for 3G mobile phones. • Lowest total bill of materials for a complete A-GPS system with only 11 external passives required The NaviLink single-chip solution is manufactured in 90-nm process • Low power with integrated power management technology and uses TI’s DRP™ technology. Through DRP technology, TI is • High A-GPS performance with weaker satellite signals, able to provide a small size, low cost, low power and high performance exceeding 3GPP and 3GPP2 requirements discrete A-GPS solution to mobile phone manufacturers. • Optimized to interface with TI’s 3G chipsets and OMAP™ processors to deliver a complete solution for handset OEMs • Small Size: The GPS5300 NaviLink 4.0 solution integrates a complete • Small module speeds time to market for A-GPS enabled phones GPS system into one chip, significantly reducing the board layout area for a discrete A-GPS engine. The single chip enables a board area for the complete system of less than 50 mm2. • High Performance: The GPS5300 NaviLink 4.0 solution enables a • Lowest Cost: As a single chip the GPS5300 only requires 11 external rapid time to first fix (TTFF) from weak satellite signals exceeding the passives, a significant reduction over existing solutions which require A-GPS requirements for 3GPP and 3GPP2 operation. up to 30 external passives. To further speed time to market, manufacturers can work with members • Low Power: The GPS5300 NaviLink 4.0 solution has power of TI’s worldwide wireless ecosystem to assist in integrating the management integrated on-chip, which simplifies design and further NaviLink 4.0 solution into new GPS-enabled handsets. Additionally, TI reduces the bill-of-materials. The single chip also allows direct connect is collaborating with Murata to deliver a small module to handset OEMs to battery for easy incorporation into mobile phone designs. to speed time to market of NaviLink chip-based A-GPS mobile phones.
Applications HLOS OS Location API
GPS Controller GPS Modem L1, 2, Engine Software 3 stack
GPS5300 UART or I2C Base Station NaviLink™ 4.0 Cellular Single Chip Modem Chipset
2 OMAP™ UART or I C Applications (alternative connection Processor to modem) GPS Server
Texas Instruments 2007 Wireless Terminals Solutions Guide
Mobile Connectivity Solutions 69 Hollywood™ Mobile DTV Single-Chip Solution
Hollywood™ Mobile Single-Chip Solution Key Benefits TI’s Hollywood™ mobile single chip is the first in the industry to integrate the mobile TV tuner and demodulator into one piece of silicon using • First mobile DTV single chip solution—integrates RF, standard 90-nm digital process. By using TI’s DRP™ technology, the demodulator, decoder and memory Hollywood solution delivers low cost and long battery life in the smallest • World’s smallest footprint package—less than 30 mm2 board area. resulting in low-cost BOM • Low-Power Design—90-nm RF CMOS design, The DTV1000 Hollywood mobile DTV solution supports DVB-H (digital low 1-V core design video broadcast - handheld) operating at 470-750 MHz (UHF) and 1.6 GHz • Fast time to market: development platform, operating system (L-band) frequency ranges. agnostic driver and API integration package The DTV1000 chip interfaces with TI’s family of OMAP™ applications processors and OMAP-Vox™ integrated processor and cellular modem solutions to deliver crisp, clear video and stereo audio, offering consumers the quality of a living room TV-viewing experience in the palm of their hand. • Low Power: Low 1-V RF CMOS process and low power design Through TI’s innovative DRP technology, the DTV1000 device combines a techniques have resulted in only 30 mW of power consumption for two-chip or system in package (SIP) solution into a single piece of silicon a typical category B DVB-H terminal. Combined with TI's low power in standard 90-nm digital process to deliver: OMAP application processors this can deliver four to seven hours of view time depending on display size and battery rating. • Smallest Board Area: High degree of integration and low ball count has lead to a footprint of less than 1cm2 for the entire solution • Fast Time to Market: Significant value-added processing in the including all passive and power switch components, which is DTV1000 results in a simple software driver and API package significantly smaller than current solutions that require a separate accelerating integration with host processors, such as OMAP tuner, demodulator and external memory. applications processors, and reducing time to market. • Low Part Count and Smaller Bill of Materials: High integration • High Performance: Multiple concurrent television channels has lead to a small number of low cost external components driving (elementary streams) can be supported and fast channel switching the estimated bill of materials in volume under $10. times under 1.5 seconds are possible.
Analog BB or Switcher 1.8 V TPS62300 V Core DTV100x Clock UHF-FE Clock REF TS OFDM PreSelect Antenna Manager RTC DEMUX Demod ADC Filter Module CLK 1.6G-FE DTV_CLK_REQ Antenna OMAP2420 MPE-FEC Selection OMAP2430 Or Link GPIO DTV Layer Buffer 0-2 OMAP-DM270 NSHUTDOWN OMAPV1030 WSPI/SDIO ARM966E Power, Reset PWM V GPIO ANT WSPI/SDIO 128 I-RAM Clock 3 Low Pass IRQ 128 D-RAM Management Filter Antenna UART GPIO 9 Tuning Optional 5 or 3.3 V Debug to PC
Wireless Terminals Solutions Guide Texas Instruments 2007 70 High-Performance Analog
Overview
Texas Instruments provides a broad portfolio of high-performance analog 3 Audio Power Amplifiers - Headphone and logic products, plus application knowledge, local technical Device Description support and easy-to-use design tools to help you differentiate your TPA4411 80-mW DirectPathTM Stereo HP Amplifier handset design and get to market faster. TI’s high-performance 138-mW DirectPathTM Stereo HP Amplifier with TPA6130A2 analog offers the greatest amount of performance and efficiency I2C Volume Control from the smallest solution size. Visit www.ti.com/analogportable TPA610xA2 Ultra Low Voltage Stereo Headphone Audio Amp for data sheets, samples and evaluation modules. Visit TPA611xA2 Stereo Headphone Audio Amplifier www.ti.com/analoglit for a complete listing of TI literature including guides for Audio, Video, Amplifiers, Data Converters, Interface, 4 Video and Interface Power Management and RF. Device Description OPA360/1 3-V Video Amplifier with 6dB Gain and Filter SN65LVDS301/302 subLVDS 24-bit RGB Serdes for LCD Modules 1 Audio Power Amplifiers - Speaker SN74AVCA406L Transceiver for MMC, SD Card, and Memory Stick Device Description TPA2005D1 1.4-W Mono, Fully Diff, Filter-Free Class-D Audio Amp 5 TPA2006D1 Similar to TPA2005D1 with 1.8-V Shutdown Logic Touch Screen Controllers 2.5-W Mono, Fully Differential, Filter-Free Device Description TPA2010D1 Class-D Audio Amplifier in WCSP TSC2003 4-Wire Touch Screen Controller with I2C Interface TPA2032D1 2.75-W Fixed Gain Class-D Audio Amplifier in WCSP TSC2004/5 4-Wire Pre-Processing TSC with I2C/SPI, 1.5-V to 3.6-V in CSP TPA2012D2 2.1-W Stereo Class-D Audio Amplifier in WCSP TSC2046 4-Wire Touch Screen Controller with Low-Voltage Digital I/O TPA6203A1 1.25-W Mono, Fully Differential, Class-AB Audio Amp with Integrated Audio Converters Programmable 4-Wire Touch Screen Controller with Stereo TPA6204A1 1.7-W Mono Fully Differential, Class-AB Audio Amp TSC2100 TPA6205A1 Similar to TPA6203A1 with 1.8-V Shutdown Logic Audio Codec and Headphone/Speaker Amplifier Programmable 4-Wire Touch Screen Controller with 6 Audio TSC2101 Inputs, Stereo Audio Codec and Headphone/Speaker Amp 2 Audio Codecs and DACs Device Description TLV320AIC23B Low-Power Stereo Audio Codec with Headphone Amp 1 TLV320DAC23 Low-Power Stereo Audio DAC with Heaphone Amp TLV320AIC28/29 Low-Power Stereo Audio Codec w/Integrated Headphone and Speaker Amps 6 TLV320AIC31 Low-Power Stereo Codec with 4 Inputs, 6 Outputs, HP/Speaker Amps, 3D Effects TLV320AIC3104 Enhanced AIC31 Functionality without Speaker Amps 5 8 TLV320AIC33 Low-Power Stereo Codec with 6 Inputs, 7 Outputs, HP/Speaker Amps, 3D Effects 7 TLV320AIC3106 Enhanced AIC33 Functionality without Speaker Amps 4
9
10 3
11 2
12
Wireless Terminals Solutions Guide Texas Instruments 2007
High-Performance Analog 71 Overview
6 OLED and TFT Display Supplies 10 DC/DC Converter and LDO Supplies Device Description Device Description Dual Output, Single Inductor Boost Converter for OLED 400-mA, 1.25-MHz Step-Down Converter in TPS61140 TPS62220 Sub- and WLED Main Display Thin SOT-23 500-mA, 3-MHz, High Accuracy Step-Down TPS65110 3-Channel Charge Pump for TFD Displays TPS62300 DC/DC Converter with 1µH Inductor TPS65120 4-Channel Small Form-Factor TFT Display Power Supply 800-mA, 3-Mz Step-Down Converter with I2C TPS65130 Dual + Output Driver for Active-Matrix OLED Displays TPS62350 for Dynamic Voltage Scaling Dual, 2.25-MHz Step-Down Converter with TPS62400/20 7 White LED and Xenon Camera Flash 1-Wire Interface (0.4A/0.6A; 0.6A/1A) Device Description TPS63000 96% 1.2-A Buck-Booster Converter in 3 x 3 QFN TPS61058/9 500/700-mA WLED Flash Driver in 3 x 3 QFN TPS712xx Dual 250-mA Output, Ultra-Low-Noise, PSRR LDO TPS65552A Photo Flash Charger for Xenon Lamps TPS799xx 200-mA, Low Noise, High PSRR LDO in CSP Package
8 White LED Backlight Drivers 11 Battery Management and Authentication Device Description Device Description 1-Cell Li-Ion Fully Integrated Charger for AC/DC TPS60230/1 5/3 WLED Charge Pump, Current-Regulated, 125 mA bq24020 Adapter and USB Inductive White LED Driver with Digital and PWM TPS6106x Single-Chip Charge and System Power-Path Brightness Control bq24070 Management IC Dual Output, Single Inductor Boost Converter TPS61150 for up to 12 WLEDs bq26150 CRC-Based Battery Authentication IC 1-Cell Li-Ion Fully Integrated Battery Fuel TPS68000 CCFL Controller for Full Bridge Phase Shift Topologies bq27000/200 Gauge with I2C Low Battery Detector, 1.8 V to 5.5 V, 6 µs Comparator TLV3012 9 Integrated Power Management and 1.242 V 1% Reference, 5 µA Max, SC-70 Device Description 2 TPS65020 6-Channel Power Management IC with I C for Li-Ion 12 Analog Switches and Logic Powered Systems Device Description TPS65800 10-Channel fully integrated Power Management IC TS5A23166 0.9-Ohm Dual SPST Analog Switch with Li-Ion Charger PCA9536 Remote 8-bit I2C and SMBus I/O Expander TPS75100 2 Bank WLED Driver with PWM Brightness Control for Up to 4 LEDs SN74AUP1Gxx Advanced Ultra-Low Power CMOS Single-Gate Logic Partner Products TPS65030 Power Management IC for USG-OTG in CSP TUSB6010 USB 2.0 High-Speed On-the-Go Local Bus Interface Bridge Controller
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