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Interactive AR/VR AR-VR : Computing Gets Interactive Harsha Nagaraju Sr. Segment Manager Micron©2016 Technology Micron Technology, Inc. All rights reserved. Information, products, and/or specifications are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Statements regarding products, including regarding their features, availability, functionality, or compatibility, are provided for informational purposes only and do not modify the warranty, if any, applicable to any product. Drawings may not be to scale. Micron, the Micron logo, and all other Micron trademarks are the property of Micron Technology, Inc. All other trademarks are the property of their respective owners. Agenda – Micron – Company update – AR-VR . What is it? Where is fits? . How is the market looking . Evolution and Landscape – General Architecture . Memory Recommendations – Road to advanced AR VR Devices © 2016 Micron Technology, Inc. | Micron by the Numbers 37 Years strong in 2O Countries with 13 Manufacturing and R&D sites, 3O,OOO+ Team Members and Net Sales in 2015 of $16,1OO,OOO,OOO 3 © 2016 Micron Technology, Inc. | | November 3, 2015 | Micron Confidential Global Manufacturing Scale 1 2 3 4 5 Boise, Idaho USA Lehi, Utah USA Manassas, VA USA Agrate, Italy Muar, Malaysia 1 4 9 3 7 11 2 5 10 8 6 6 7 8 9 10 11 Singapore Taiwan (Inotera) Taiwan Xian, China Hiroshima, Japan Akita, Japan 4 © 2016 Micron Technology, Inc. | | November 3, 2015 | Micron Confidential And an expansive product offering NAND Flash Bare Die TLC, MLC, SLC Multiple Serial NAND Technologies Enterprise NAND NAND MCP DRAM Families 3D NAND SDRAM Solid State Drives DDR Client SSD DDR2 Enterprise SATA DDR3 Enterprise SAS DDR4 Enterprise PCIe RLDRAM® Mobile LPDRAM Managed NAND MCP eMMC™ DRAM Modules Embedded USB FBDIMM RDIMM VLP RDIMM VLP UDIMM UDIMM SODIMM SORDIMM NOR Flash Mini-DIMM VLP Mini-DIMM Parallel NOR LRDIMM Serial NOR NVDIMM NOR MCP 5 © 2016 Micron Technology, Inc. | | November 3, 2015 | Micron Confidential Serving a broad set of customer applications 6 © 2016 Micron Technology, Inc. | Memory Industry: FY 2008 vs Today FY2008 Memory Revenue (% of Group Total)¹ LTM Memory Revenue (% of Group Total)¹ Samsung³ 31% DRAM Samsung³ 38% Hynix 17% + NAND + NOR SK Hynix 22% Micron² 12% Developers SanDisk 8% Micron² 20% Elpida 8% Toshiba³ 10% Toshiba³ 7% DRAM + NAND SanDisk 7% Qimonda 6% Developers Spansion 6% Nanya 2% Nanya 3% Winbond Single 1% Macronix 2% Memory Macronix 1% Winbond 2% Developers 0% 10% 20% 30% 40% 0% 10% 20% 30% 40% Top Five Market Share: 75% Top Five Market Share: 96% Source: Micron Source: Micron Micron data is from FY 2008; Competitor data is from CQ4-07 – CQ3-08. Micron data is FQ1-15 – FQ4-15; Competitor data from CQ4-14 – CQ3-15. 1 Group total defined as only those companies listed on this page, although others may also exist. 1. Group total defined as only those companies listed on this page, although others may also exist. Micron data is fiscal, competitor data is calendar. Percentages vary due to rounding. 2. Micron Includes NAND sold to Intel from IM Flash 2. Micron Includes NAND sold to Intel from IM Flash. 3. Samsung and Toshiba include total memory revenue as reported. 3. Samsung and Toshiba include total memory revenue as reported. 7 © 2016 Micron Technology, Inc. || September 28, 2016| Micron Confidential AR VR – What is it? THE NEXT WAVE OF TECH AR Applications: VR Applications: Commercial & Industrial Gaming & Entertainment Medical Concerts & Theme parks Education & Training eCommerce, Advertising © 2016 Micron Technology, Inc. | Gaming & Entertainment Image Source: Wikipedia AR and VR headsets both provide stereo 3D high definition video and audio, but…. • AR is open and partly immersive – you • VR is closed and fully immersive can see through and around it. • VR puts users inside virtual worlds, • AR puts virtual things into users’ real immersing them worlds, augmenting them • Images are created using applications • Creation of an actual world, not just some that mix virtual content and real life contents of it contents together • Primary addressable markets: • Primary addressable markets: eCommerce, Voice calls, Web Browsing, 3D films, Games, Theme parks, Live Sports Education/Training, Medical, Advertising and Concerts © 2016 Micron Technology, Inc. | Image Source: Wikipedia *Other names and brands may be claimed as the property of others AR VR – Where does it fit 12 © 2016 Micron Technology, Inc. | September 28, 2016 | Micron Confidential AR VR – What’s the fuss? Past the Hype Cycle peak? © 2016 Micron Technology, Inc. | . Hardware: 18-20$B opportunity in 2020 . AR to outsell VR devices in the long term 15 © 2016 Micron Technology, Inc. || September 28, 2016| Micron Confidential Investments in AR VR . $5B capital invested since 2010 with more than 60% in the 2014-2016 . $1.1B already invested in Q1 2016 . Diverse range of investor types – VCs have led the way, strategic capital and private equity have followed 16 © 2016 Micron Technology, Inc. || September 28, 2016| Micron Confidential Source: Pitchbook 2015 AR VR – Evolution and Landscape Tethered/Untethered…Immersive/Non-Immersive • Places the user in a virtual world, immersing them • Puts virtual things into users’ real worlds, • Limited mobility augmenting them • Use can see through and around glass • 3D Films, Gaming, Theme parks, Live sports, Concerts and Training • Mobile experiences possible • eCommerce, Voice Calls, Web Browsing, Medical, Advertising, Automobile 18 © 2016 Micron Technology, Inc. || September 28, 2016| Micron Confidential AR-VR Evolution Virtual Reality© 2016 Evolution Micron Technology, Inc. | Augmented Reality Evolution *Other names and brands may be claimed as the property of others Competitive Landscape Virtual: real world is blocked out (i.e. user can only see the virtual world and virtual objects) Augmented: real world is not blocked out (i.e. user can see the real world and virtual objects) Immersive: trick the user’s brain into reacting as though it was a real experience Ambient: one or more of the characteristics(position tracking, FOV etc.) doesn’t provide the same level of experience as Immersive © 2016 Micron Technology, Inc. | *Other names and brands may be claimed as the property of others AR VR – Architecture & Recommendations Typical HMD Design . VR experiences are complex with many moving pieces involved . They must all come together near perfectly for a realistic experience 22 © 2016 Micron Technology, Inc. || September 28, 2016| Micron Confidential Keys Specifications . Key to good VR Experience – Refresh rates (min: 60fps) – Field of View (min: 100 deg) – Display quality (OLED or LCDs) . Memory utilization – Not all designs will have significant memory in them – Due to its mobile nature, requirement for continuous image processing, AR and untethered VR devices likely to be memory rich 23 © 2016 Micron Technology, Inc. || September 28, 2016| Micron Confidential Teardown of HTC Vive* (Tethered VR) • Tethered devices likely to outsource computing to standalone computing devices like PC/Gaming Consoles • Flash Memory(Serial NOR) in densities ranging from 4Mb -256Mb most popular • Likely to migrate to Serial NAND as sophisticated features push for higher densities 24 © 2016 Micron Technology, Inc. | September 28, 2016 | Micron Confidential Image Source: Wikipedia Source: iFixit *Other names and brands may be claimed as the property of others Microsoft Hololens* (Untethered) • Untethered devices likely pack powerful processors and high density memory for local compute capabilities • Cutting Edge Mobile Memory – 16-64Gb LPDDR4/LPDDR5 most popular • Higher Storage Density requirements – 32-128GB eMMC. UFS likely as well 25 © 2016 Micron Technology, Inc. | September 28, 2016 | Micron Confidential Image Source: Wikipedia Source: Windows Central *Other names and brands may be claimed as the property of others Recommended Memory Technologies (Summary) Application Package Memory Storage SPI NOR - TODAY (4Mb – 256Mb) Discrete SPI NAND LPDRAM Tethered VR (1Gb – 8Gb) FUTURE MCP LPDRAM + Flash (Multi-Chip Package) eMMC (NAND + uC) (8GB – 128GB) TODAY LPDDR 4 UFS (NAND + uC) (8Gb – 32Gb) (64GB-256GB) Discrete Untethered SD Cards*** LPDDR 5* (32GB – 512GB) AR VR BGA SSDs*** (128GB – 512GB) FUTURE MCP eMCP (e.MMC + LPDDR) (Multi-Chip Package) uMCP (UFS + LPDDR) 26 © 2016 Micron Technology, Inc. | September 28, 2016 | Micron Confidential * Likely follow mobile adoption *** Potential data storage for future designs ** All densities are package only. Different pkgs. Possible. Package Options ePOP e.MMC NAND MCP e.MMC eMCP POP LPDRAM SLC NAND MLC NAND LPDRAM e.MMC Application Application Application Application Processor -Driver LPDRAM Processor -Driver LPDRAM Controller Processor -Driver Processor -Driver Substrate Substrate Substrate Substrate Premium smart phones & Mid-to-Low cost smart phones, High end smart watches, Ultra low cost smart Phones Tablets, Auto, Wearables., AR/VR Wearables, IoT, M2M, IMM, High-to-Mid cost wearables, AIMM, DSC, CH Telemetrics, AR/VR Industrial, IoT Likely Packages for AR/VR Devices 27 © 2016 Micron Technology, Inc. | September 28, 2016 | Micron Confidential AR VR – Road to Advanced Devices WINDOW OF INNOVATION Machine Vision/ Light Field Battery Tech Advanced Depth Sensing improvements AR/VR Devices AR/VR Tech 2016 2018 2020 (Current Gen) Virtual Reality Accurate Eye Headphone Content tracking Technology High performing GPU Efficient semiconductors 29 © 2016 Micron Technology, Inc. || September 28,
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