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Oppo Find X Teardown and Identification of Key Components

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Oppo Find X Teardown and Identification of Key Components STRUCTURAL REPORT Oppo Find X Teardown and Key Components Identification Teardown report by Farid Hamrani October 2018 – version 1 22 Bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 1 Table of Contents Overview / Introduction 3 Repartition 49 o Executive Summary o IC Manufacturer Design o Specifications o IC Package Repartition o Methodology o IC Package Footprint repartition Teardown of the Oppo Find X 7 PCB Analysis 53 o Views & Dimensions o Main Board Cross-section o Interfaces o Main Board – Line/Space Width o Teardown Components Identification 19 Give us your Feedbacks! o Main Board Views & Dimensions ICs Markings Company services 58 ICs Identification ICs Referencing ICs Applications o Sim Board o Screen Flex Board o Flex Connector Board ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 2 Views & Dimensions Overview / Introduction Teardown Dimensions o Views & Dimensions o Height: XXX mm o Interfaces o Width: XXX mm o Teardown o Thickness: XXX mm Components Identification Weight o Repartition XXXg PCB Analysis Related Reports About System Plus Find X Front & Back Views ©2018 by System Plus Consulting Find X Front & Rear Views ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 3 Interfaces Overview / Introduction Teardown o Views & Dimensions o Interfaces o Teardown Components Identification Repartition PCB Analysis Related Reports About System Plus Oppo Find X Front Drawing - Opened ©2018 by System Plus Consulting Oppo Find X ©2018 by System Plus Consulting Oppo Find X Front View - Closed Oppo Find X Front View - Opened ©2018 by System Plus Consulting ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 4 Teardown Overview / Introduction Teardown o Views & Dimensions o Interfaces o Teardown Cable harness folded in low position Components Identification Repartition Upper Internal Cover PCB Analysis Related Reports About System Plus Motor Close-up Upper Internal Cover Removal ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 5 Teardown Overview / Introduction Teardown o Views & Dimensions o Interfaces o Teardown Flood Illuminator Components Identification Infrared Repartition Camera PCB Analysis Ranging Related Reports Sensor About System Plus Receiver Rear Camera Module Front Camera Flex Board Dot Projector Front Camera Module Upper Chassis Camera Module Disassembly ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 6 Main Board – Top Side Overview / Introduction PCB Area: XXX mm² Teardown Front Side ICs Count: XXX Front Side ICs area: XXX mm² Components Identification o Main Board o Sim Connector Board o Flex Connector o Screen Flex Repartition PCB Analysis Related Reports About System Plus Find X Main Board (Front Side) ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 7 Main Board – Top Side – Component Marking Overview / Introduction Teardown Components Identification o Main Board o Sim Connector Board o Flex Connector o Screen Flex Repartition PCB Analysis Related Reports About System Plus Find X Main Board (Front Side) ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone ©2018 by System Plus Consulting 8 Main Board – Bottom Side – Component Description Overview / Introduction Teardown Components Identification o Main Board o Sim Connector Board o Flex Connector o Screen Flex Repartition PCB Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 9 Flex Board– Top Side – Identification Overview / Introduction Teardown Components Identification o Main Board o Sim Connector Board o Flex Connector xxxxxx o Screen Flex xxxx 2-axis gyroscope QFN16 Repartition PCB Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 10 REPARTITION ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 11 IC MANUFACTURERS DESIGN SHARES Overview / Introduction Teardown Components Identification Repartition PCB Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 12 IC Package Footprint Repartition Overview / Introduction Teardown Components Identification Repartition PCB Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 13 PCB ANALYSIS ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 14 PCB Board – Cross-Section Overview / Introduction Teardown Components Identification Repartition PCB Analysis o Cross section o Line/Space width Related Reports About System Plus Find X Main Board – PCB Cross-Section ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 15 PCB Board – Line/Space Width Overview / Introduction Teardown Components Identification Repartition PCB Analysis o Cross section o Line/Space width Related Reports About System Plus XX µm XX XX µm XX Find X Main Board –PCB metal Layer ©2018 by System Plus Consulting Find X Main Board – Spacing ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 16 Related Reports Overview / Introduction Teardown Components Identification REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT Repartition SYSTEM & PACKAGING ADVANCED PACKAGING & IMAGING & RF PCB Analysis • Samsung Galaxy S9+ Teardown and Identification of Key • Status of the Advanced Packaging Industry 2018 Components • Status of the CMOS Image Sensor Industry 2018 Related Reports • Apple iPhone X Teardown and Identification of Key • VCSELs - Technology, Industry and Market Trends Components • 3D Imaging & Sensing 2018 About System Plus • Huawei P20 Pro Teardown and Identification of Key • 5G’s Impact on RF Front-End Module and Connectivity for Cell Components Phones 2018 • Status of the MEMS Industry 2018 • Hardware and Software for AI 2018 – Consumer focus ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 17 STRUCTURE REPORT Oppo Find X Teardown and Identification of Key Components Discover key devices used by Oppo for its first European Smartphone market entry. The Oppo Find-X smartphone hit the shelves of the COMPLETE TEARDOWN WITH European market for the first time this fall. To make an • Smartphone teardown impact in this new market, Oppo has been very • Integrated circuits identification, innovative by including a sliding element, facial including marking, manufacturer, recognition and a curved, bezel-less, cutout-free Active reference, function, package type, size and pin count Matrix Organic Light Emitting Diode (AMOLED) display, • Printed circuit board characteristics, and other features. including cross-section and Through a teardown of the Oppo Find-X, this report minimum line width describes the main Integrated Circuits (ICs) from the • Distribution graphs main boards. TABLE OF CONTENT It identifies the manufacturers, the different packaging • Overview/Introduction sizes, types and pitches as well as the function of the Executive summary main chipset. • Physical Analysis Views and dimensions of the A physical analysis of the main substrates highlights Oppo Find X internal structures and technologies used for the Teardown Printed Circuit Boards (PCBs). Electronic boards high definition photos The report includes teardown photos, detailed package Main component markings identifications and descriptions and is supplied with an and package identification: Excel file summarizing the Oppo Find-X chipset and the type, dimensions, pitch, pin distributions by supplier, packages and footprint. count Title: Oppo Find PCB surface area, cross X Teardown sections and minimum line AUTHORS width Pages: 60 Farid Hamrani joined System Plus IC package distribution Date: October Consulting as a system cost engineer. IC manufacturer design wins 2018 He’s in charge of systems reverse cost IC package footprint analysis with a focus on embedded Format: PDF & RELATED REPORTS Excel file systems. • Samsung Galaxy S9+ Teardown and Price: EUR 1,990 Véronique Le Troadec has joined Identification of Key Components System Plus Consulting as a laboratory • Apple iPhone X Teardown and engineer. She has extensive knowledge Identification of Key Components in failure analysis of components and • Huawei P20 Pro Teardown and in deprocessing of integrated circuits. Identification of Key Components IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY OPPO FIND X TEARDOWN AND IDENTIFICATION OF KEY COMPONENTS STRUCTURE REPORT ORDER FORM Please process my order for “Oppo Find X Teardown and Identification of Key Components” Structure Report Ref: SP18435 Return order by: Full Structure Report : EUR 1,990* FAX: +33 (0)472 83 01 83 Annual Subscription offers possible from 3 reports, including this MAIL: YOLE DEVELOPPEMENT report as the first of the year. Contact us for more information. 75 Cours Emile Zola 69100 Villeurbanne – France SHIP TO *For price in dollars please use the day’s exchange rate Name (Mr/Ms/Dr/Pr): ............................................................. *All reports are delivered electronically in Job Title: ……............................................................................. pdf format Company: …............................................................................
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