Oppo Find X Teardown and Identification of Key Components

STRUCTURAL REPORT

Oppo Find X Teardown and Key Components Identification Teardown report by Farid Hamrani October 2018 – version 1

Overview / Introduction 3 Repartition 49

o Executive Summary o IC Manufacturer Design o Specifications o IC Package Repartition o Methodology o IC Package Footprint repartition

Teardown of the Oppo Find X 7 PCB Analysis 53

o Views & Dimensions o Main Board Cross-section o Interfaces o Main Board – Line/Space Width o Teardown

Components Identification 19 Give us your Feedbacks!

o Main Board  Views & Dimensions  ICs Markings Company services 58  ICs Identification  ICs Referencing  ICs Applications o Sim Board o Screen Flex Board o Flex Connector Board

Overview / Introduction

Teardown Dimensions o Views & Dimensions o Height: XXX mm o Interfaces o Width: XXX mm o Teardown o Thickness: XXX mm

Components Identification Weight o Repartition XXXg

PCB Analysis

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About System Plus

Overview / Introduction

Teardown o Views & Dimensions o Interfaces o Teardown

Components Identification

Repartition

PCB Analysis

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Overview / Introduction

Teardown o Views & Dimensions o Interfaces o Teardown Cable harness folded in low position Components Identification

Repartition Upper Internal Cover PCB Analysis

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Motor Close-up

Overview / Introduction

Teardown o Views & Dimensions o Interfaces o Teardown Flood Illuminator

Components Identification Infrared Repartition Camera

PCB Analysis Ranging Related Reports Sensor

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Receiver

Rear Camera Module Front Camera

Flex Board Dot Projector

Front Camera Module Upper Chassis

Overview / Introduction PCB Area: XXX mm² Teardown Front Side ICs Count: XXX Front Side ICs area: XXX mm² Components Identification o Main Board o Sim Connector Board o Flex Connector o Screen Flex

Repartition

PCB Analysis

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Overview / Introduction

Teardown

Components Identification o Main Board o Sim Connector Board o Flex Connector o Screen Flex

Repartition

PCB Analysis

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Overview / Introduction

Teardown

Components Identification o Main Board o Sim Connector Board o Flex Connector o Screen Flex

Repartition

PCB Analysis

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Overview / Introduction

Teardown

Components Identification o Main Board o Sim Connector Board o Flex Connector xxxxxx o Screen Flex xxxx 2-axis gyroscope QFN16 Repartition

PCB Analysis

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Overview / Introduction

Teardown

Components Identification

Repartition

PCB Analysis

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Overview / Introduction

Teardown

Components Identification

Repartition

PCB Analysis

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Overview / Introduction

Teardown

Components Identification

Repartition

PCB Analysis o Cross section o Line/Space width

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Overview / Introduction

Teardown

Components Identification

Repartition

PCB Analysis o Cross section o Line/Space width

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About System Plus XX µm XX

Teardown

Components Identification REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT Repartition SYSTEM & PACKAGING ADVANCED PACKAGING & IMAGING & RF PCB Analysis • Samsung Galaxy S9+ Teardown and Identification of Key • Status of the Advanced Packaging Industry 2018 Components • Status of the CMOS Image Sensor Industry 2018 Related Reports • Apple iPhone X Teardown and Identification of Key • VCSELs - Technology, Industry and Market Trends Components • 3D Imaging & Sensing 2018 About System Plus • Huawei P20 Pro Teardown and Identification of Key • 5G’s Impact on RF Front-End Module and Connectivity for Cell Components Phones 2018 • Status of the MEMS Industry 2018 • Hardware and Software for AI 2018 – Consumer focus

Oppo Find X Teardown and Identification of Key Components

Discover key devices used by Oppo for its first European Smartphone market entry.

The Oppo Find-X smartphone hit the shelves of the COMPLETE TEARDOWN WITH European market for the first time this fall. To make an • Smartphone teardown impact in this new market, Oppo has been very • Integrated circuits identification, innovative by including a sliding element, facial including marking, manufacturer, recognition and a curved, bezel-less, cutout-free Active reference, function, package type, size and pin count Matrix Organic Light Emitting Diode (AMOLED) display, • Printed circuit board characteristics, and other features. including cross-section and Through a teardown of the Oppo Find-X, this report minimum line width describes the main Integrated Circuits (ICs) from the • Distribution graphs main boards. TABLE OF CONTENT It identifies the manufacturers, the different packaging • Overview/Introduction sizes, types and pitches as well as the function of the  Executive summary main chipset. • Physical Analysis  Views and dimensions of the A physical analysis of the main substrates highlights Oppo Find X internal structures and technologies used for the  Teardown Printed Circuit Boards (PCBs).  Electronic boards high definition photos The report includes teardown photos, detailed package  Main component markings identifications and descriptions and is supplied with an and package identification: Excel file summarizing the Oppo Find-X chipset and the type, dimensions, pitch, pin distributions by supplier, packages and footprint. count Title: Oppo Find  PCB surface area, cross X Teardown sections and minimum line AUTHORS width Pages: 60 Farid Hamrani joined System Plus  IC package distribution Date: October Consulting as a system cost engineer.  IC manufacturer design wins 2018 He’s in charge of systems reverse cost  IC package footprint analysis with a focus on embedded Format: PDF & RELATED REPORTS Excel file systems. • Samsung Galaxy S9+ Teardown and Price: EUR 1,990 Véronique Le Troadec has joined Identification of Key Components System Plus Consulting as a laboratory • Apple iPhone X Teardown and engineer. She has extensive knowledge Identification of Key Components in failure analysis of components and • Huawei P20 Pro Teardown and in deprocessing of integrated circuits. Identification of Key Components

IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY OPPO FIND X TEARDOWN AND IDENTIFICATION OF KEY COMPONENTS STRUCTURE REPORT ORDER FORM Please process my order for “Oppo Find X Teardown and Identification of Key Components” Structure Report Ref: SP18435 Return order by:  Full Structure Report : EUR 1,990* FAX: +33 (0)472 83 01 83  Annual Subscription offers possible from 3 reports, including this MAIL: YOLE DEVELOPPEMENT report as the first of the year. Contact us for more information. 75 Cours Emile Zola 69100 Villeurbanne – France

SHIP TO *For price in dollars please use the day’s exchange rate Name (Mr/Ms/Dr/Pr): ...... *All reports are delivered electronically in Job Title: ……...... pdf format Company: …...... *For French customer, add 20 % for VAT *Our prices are subject to change. Please Address: ……...... check our new releases and price City: ………………………………… State: ...... changes on www.i-micronews.com. The Postcode/Zip: ...... present document is valid 6 months after its publishing date: October 2018 Country: ……...... VAT ID Number for EU members: ...... Tel: ………………...... Email: ...... ANNUAL SUBSCRIPTIONS Date: ...... Each year System Plus Consulting Signature: ...... releases a comprehensive collection BILLING CONTACT of new reverse engineering and costing analyses in various domains. First Name : ...... You can choose to buy over 12 Last Name: ……...... months a set of 3, 4, 5, 7, 10 or 15 Email: …...... Reverse Costing® reports. Up to 47% discount! Phone: ……...... PAYMENT More than 60 reports released each year on the following topics By credit card: (considered for 2018): Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| • MEMS & Sensors: Accelerometer |__|__|__|__| – Environment - Fingerprint - Gas - Gyroscope - IMU/Combo - Expiration date: |__|__|/|__|__| Microphone - Optics - Oscillator - Card Verification Value: |__|__|__| Pressure • Power: GaN - IGBT - MOSFET - Si Diode - SiC • Imaging: Camera - Spectrometer By bank transfer: • LED and Laser: UV LED – VCSEL - HSBC, 1 place de la Bourse, F-69002 Lyon, France White/blue LED SWIFT or BIC code: CCFRFRPP • Packaging: 3D Packaging - Bank code : 30056 - Branch code : 00170 - Account : Embedded - SIP - WLP 0170200156587 • Integrated Circuits: IPD – IBAN: FR76 3005 6001 7001 7020 0156 587 Memories – PMIC - SoC • RF: FEM - Duplexer • Systems: Automotive - Consumer - Energy - Telecom COMPANY SERVICES

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Teardown

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Teardown

Components Identification FRANKFURT/MAIN Repartition Europe Sales Office PCB Analysis NANTES LYON Headquarter YOLE HQ Related Reports TOKYO PHOENIX YOLE KK YOLE Inc.

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