Orbbec's Front 3D Depth Sensing System in the Oppo Find X
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REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT Orbbec 3D Depth Sensing System Oppo Find X features Orbbec’s 3D systems IMAGING report by Stéphane ELISABETH November 2018 – version 1 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 1 Table of Contents Overview / Introduction 4 SoC Die Process o Executive Summary SoC Die Cross-Section o Reverse Costing Methodology SoC Die Process Characteristic Company Profile 8 Oppo vs. Apple 116 o Orbbec Manufacturing Process 124 o Oppo Find X Teardwown o NIR Image Sensor Die Front-End Process & Fabrication Unit Market Analysis 27 o NIR VCSEL Process Flow o Ecosystem & Forecast o NIR VCSEL Die Front-End Process & Fabrication Unit o SoC Die Front-End Process & Fabrication Unit Physical Analysis 31 o Summary of the main parts o Summary of the Physical Analysis 32 Cost Analysis 134 o NIR Camera Module Assembly 35 o Summary of the cost analysis 135 Module Views o Yields Explanation & Hypotheses 137 Module Cross-Section o NIR Camera Module 139 o NIR Image Sensor Die 51 Sensor Die & Optical Front-End Cost Sensor Die View & Dimensions Sensor Die Probe Test, Thinning & Dicing Sensor Delayering & main Blocs Sensor Die Wafer Cost Sensor Die Process Lens Module & Component Cost Sensor Die Cross-Section o DOT Projector Module 147 Sensor Die Process Characteristic NIR VCSEL Front-End Cost o DOT Projector Module Assembly 71 NIR VCSEL Probe Test, Thinning & Dicing Module Views NIR VCSEL Die Wafer Cost Module Cross-Section Lens Module & Component Cost o NIR VCSEL Die 89 o SoC Component 156 Die View & Dimensions SoC Die Front-End Cost Die Process SoC Die Probe Test, Thinning & Dicing Die Cross-Section SoC Component Cost Die Process Characteristic Feedbacks 164 o SoC Component 103 SystemPlus Consulting services 166 SoC Die View & Dimensions SoC Delayering & main Blocs ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 2 Executive Summary Overview / Introduction o Executive Summary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price o Reverse Costing Methodology o Glossary of the Orbbec 3D sensing system found in the Oppo Find X. Company Profile & Supply Chain • Located in the Find X’s front, around the speaker, the optical hub is packaged in one metal enclosure. It has several modules Market Analysis like a DOT projector, a Red/Green/Blue Camera, a flood illuminator, an ALS/Proximity sensor and a NIR camera Sensor. An Physical Analysis additional SoC component is soldered on the main board to process the signal from the latter devices. Separated into two dimensions, the optical hub has a flood illuminator, an RGB camera and a proximity sensor for the 2D sensing and a NIR Physical Comparison camera and DOT projector for the 3D sensing. This report will be focused on the 3D sensing system. Manufacturing Process Flow Cost Analysis • With standard component found on the market, a GS Image sensor featuring 3 µm pixel size and standard resolution of 1 MP and a VCSEL, the system is very cost efficient compared to other solutions. The camera and dot projector module Related Reports assembly use standard wire bonding to connect the sensor or the VCSEL dies, along with an optical module comprising four lenses for both modules. In order to structured the light, a special mask unlike a DOE system is used to give a dot pattern. About System Plus • This report analyzes the complete 3D sensing system, including a complete analysis of the NIR camera module, the DOT projector and the SoC, along with a cost analysis and a price estimation for the system. It also includes a physical and technical comparison with other 3D sensing system, such as those from Apple in the iPhone X facing the system integration, the NIR camera module and the DOT projector architecture. Finally, to give an idea of the complete optical hub cost and compare it to other systems, the complete 3D sensing systems cost is estimated. ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 3 Oppo Find X Teardown Overview / Introduction Flood Illuminator Proximity Sensor Front Camera Company Profile & Supply Chain o Orbbec NIR Camera Speaker o Oppo Find X Teardown Dot projector Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus Oppo Find X Front View – Opened Oppo Find X Front View – Opened ©2018 by System Plus Consulting ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 4 Oppo Find X Teardown Overview / Introduction Company Profile & Supply Chain o Orbbec o Oppo Find X Teardown Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 5 Front Sensing System Overview / Introduction Company Profile & Supply Chain o Orbbec o Oppo Find X Teardown Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 6 Summary of the Physical Analysis Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section o SoC Component o Die Views & Dimensions o Die Delayering & Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 7 NIR Camera Views & Dimensions Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section o SoC Component o Die Views & Dimensions o Die Delayering & Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 8 NIR Camera Cross-Section Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section o SoC Component o Die Views & Dimensions o Die Delayering & Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus NIR Camera Sensor – Cross-Section – Optical View ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 9 Sensor Die Overview & Dimensions Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section o SoC Component o Die Views & Dimensions o Die Delayering & Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 10 Sensor Die – Die Delayering – Pixels Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section o SoC Component o Die Views & Dimensions o Die Delayering & Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 11 Lenses Dot projector Disassembly Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section o SoC Component o Die Views & Dimensions o Die Delayering & Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 12 Lens #1 – View & Cross-Section Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section o SoC Component o Die Views & Dimensions o Die Delayering & Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 13 VCSEL Die Cross-Section Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor