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Oppo Find X Teardown and Identification of Key Components

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Oppo Find X Teardown and Identification of Key Components STRUCTURAL REPORT Oppo Find X Teardown and Key Components Identification Teardown report by Farid Hamrani October 2018 – version 1 22 Bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 1 Table of Contents Overview / Introduction 3 Repartition 49 o Executive Summary o IC Manufacturer Design o Specifications o IC Package Repartition o Methodology o IC Package Footprint repartition Teardown of the Oppo Find X 7 PCB Analysis 53 o Views & Dimensions o Main Board Cross-section o Interfaces o Main Board – Line/Space Width o Teardown Components Identification 19 Give us your Feedbacks! o Main Board Views & Dimensions ICs Markings Company services 58 ICs Identification ICs Referencing ICs Applications o Sim Board o Screen Flex Board o Flex Connector Board ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 2 Views & Dimensions Overview / Introduction Teardown Dimensions o Views & Dimensions o Height: XXX mm o Interfaces o Width: XXX mm o Teardown o Thickness: XXX mm Components Identification Weight o Repartition XXXg PCB Analysis Related Reports About System Plus Find X Front & Back Views ©2018 by System Plus Consulting Find X Front & Rear Views ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 3 Interfaces Overview / Introduction Teardown o Views & Dimensions o Interfaces o Teardown Components Identification Repartition PCB Analysis Related Reports About System Plus Oppo Find X Front Drawing - Opened ©2018 by System Plus Consulting Oppo Find X ©2018 by System Plus Consulting Oppo Find X Front View - Closed Oppo Find X Front View - Opened ©2018 by System Plus Consulting ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 4 Teardown Overview / Introduction Teardown o Views & Dimensions o Interfaces o Teardown Cable harness folded in low position Components Identification Repartition Upper Internal Cover PCB Analysis Related Reports About System Plus Motor Close-up Upper Internal Cover Removal ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 5 Teardown Overview / Introduction Teardown o Views & Dimensions o Interfaces o Teardown Flood Illuminator Components Identification Infrared Repartition Camera PCB Analysis Ranging Related Reports Sensor About System Plus Receiver Rear Camera Module Front Camera Flex Board Dot Projector Front Camera Module Upper Chassis Camera Module Disassembly ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 6 Main Board – Top Side Overview / Introduction PCB Area: XXX mm² Teardown Front Side ICs Count: XXX Front Side ICs area: XXX mm² Components Identification o Main Board o Sim Connector Board o Flex Connector o Screen Flex Repartition PCB Analysis Related Reports About System Plus Find X Main Board (Front Side) ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 7 Main Board – Top Side – Component Marking Overview / Introduction Teardown Components Identification o Main Board o Sim Connector Board o Flex Connector o Screen Flex Repartition PCB Analysis Related Reports About System Plus Find X Main Board (Front Side) ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone ©2018 by System Plus Consulting 8 Main Board – Bottom Side – Component Description Overview / Introduction Teardown Components Identification o Main Board o Sim Connector Board o Flex Connector o Screen Flex Repartition PCB Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 9 Flex Board– Top Side – Identification Overview / Introduction Teardown Components Identification o Main Board o Sim Connector Board o Flex Connector xxxxxx o Screen Flex xxxx 2-axis gyroscope QFN16 Repartition PCB Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 10 REPARTITION ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 11 IC MANUFACTURERS DESIGN SHARES Overview / Introduction Teardown Components Identification Repartition PCB Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 12 IC Package Footprint Repartition Overview / Introduction Teardown Components Identification Repartition PCB Analysis Related Reports About System Plus ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 13 PCB ANALYSIS ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 14 PCB Board – Cross-Section Overview / Introduction Teardown Components Identification Repartition PCB Analysis o Cross section o Line/Space width Related Reports About System Plus Find X Main Board – PCB Cross-Section ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 15 PCB Board – Line/Space Width Overview / Introduction Teardown Components Identification Repartition PCB Analysis o Cross section o Line/Space width Related Reports About System Plus XX µm XX XX µm XX Find X Main Board –PCB metal Layer ©2018 by System Plus Consulting Find X Main Board – Spacing ©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 16 Related Reports Overview / Introduction Teardown Components Identification REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT Repartition SYSTEM & PACKAGING ADVANCED PACKAGING & IMAGING & RF PCB Analysis • Samsung Galaxy S9+ Teardown and Identification of Key • Status of the Advanced Packaging Industry 2018 Components • Status of the CMOS Image Sensor Industry 2018 Related Reports • Apple iPhone X Teardown and Identification of Key • VCSELs - Technology, Industry and Market Trends Components • 3D Imaging & Sensing 2018 About System Plus • Huawei P20 Pro Teardown and Identification of Key • 5G’s Impact on RF Front-End Module and Connectivity for Cell Components Phones 2018 • Status of the MEMS Industry 2018 • Hardware and Software for AI 2018 – Consumer focus ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 17 COMPANY SERVICES ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 18 Business Models Fields of Expertise Overview / Introduction Teardown Components Identification Repartition Custom Analyses PCB Analysis (>130 analyses per year) Related Reports About System Plus o Company Services Reports o Contact (>40 reports per year) Costing Tools Trainings ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 19 Contact Overview / Introduction Teardown Components Identification FRANKFURT/MAIN Repartition Europe Sales Office PCB Analysis NANTES LYON KOREA Headquarter YOLE HQ YOLE Related Reports TOKYO PHOENIX YOLE KK YOLE Inc. About System Plus GREATER CHINA o Company Services YOLE o Contact Headquarters Europe Sales Office America Sales Office Asia Sales Office 21 rue La Noue Bras de Fer Lizzie LEVENEZ Steve LAFERRIERE Takashi ONOZAWA 44200 Nantes Frankfurt am Main Phoenix, AZ Tokyo FRANCE GERMANY WESTERN US JAPAN +33 2 40 18 09 16 +49 151 23 54 41 82 T : +1 310 600 8267 [email protected] [email protected] [email protected] [email protected] Mavis WANG Troy Blanchette GREATER CHINA EASTERN US [email protected] www.systemplus.fr T : +1 704 859 0456 [email protected] ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 20 OPPO FIND X TEARDOWN AND IDENTIFICATION OF KEY COMPONENTS STRUCTURE REPORT ORDER FORM Please process my order for “Oppo Find X Teardown and Identification of Key Components” Structure Report Return order by: Ref: SP18435 FAX: +33 2 53 55 10 59 MAIL: SYSTEM PLUS CONSULTING Full Structure Report : EUR 1,990* 22, bd Benoni Goullin Annual Subscription offers possible from 3 reports, including this Nantes Biotech report as the first of the year. Contact us for more information. 44200 Nantes – France EMAIL: [email protected] SHIP TO Name (Mr/Ms/Dr/Pr): ............................................................. *For price in dollars please use the day’s Job Title: ……............................................................................. exchange rate *All reports are delivered electronically in Company: …............................................................................. pdf format Address: ……............................................................................. *For French customer, add 20 % for VAT City: ………………………………… State: .......................................... *Our prices are subject to change. Please check our new releases and price Postcode/Zip: .......................................................................... changes on www.systemplus.fr. The Country: ……............................................................................ present document is valid 6 months after VAT ID Number for EU members: .......................................... its publishing date: October 2018 Tel: ………………......................................................................... Email: ..................................................................................... ANNUAL SUBSCRIPTIONS Date: ...................................................................................... Signature: .............................................................................. Each year System Plus Consulting releases a comprehensive collection BILLING CONTACT of new reverse engineering and
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