IEEE Electron Devices Society Newsletter

Total Page:16

File Type:pdf, Size:1020Kb

IEEE Electron Devices Society Newsletter E ® IEEE Electron D Devices Society S Newsletter April 2002 Vol. 9, No. 2 ISSN:1074 1879 2002 IEEE Symposium Editor-in-Chief: Ninoslav D. Stojadinovic on VLSI Technology Table of Contents Upcoming Technical Meetings..................1 • 2002 VLSI • 2002 PVSC • 2002 MIEL • 2002 ISPSD Message from the President ...................2 Society News ............................................7 • December 2001 AdCom Meeting Summary • Celebrating 50 Years of Electron Devices • EDS Announces the Appointment of a New Editor-in-Chief for its Newsletter • A Message from the Outgoing EDS Editor- in-Chief Hilton Hawaiian Village, Honolulu, Hawaii • 2001 EDS Distinguished Service Award • 2001 EDS J.J. Ebers Award The 22nd Annual Symposium on VLSI Technology will be held in the • 2002 EDS J.J. Ebers Award Call for Nominations beautiful city of Honolulu, Hawaii, June 10-13, 2002. The Symposium on • EDS Members Named Winners of 2002 IEEE VLSI Technology is jointly sponsored by the Japan Society of Applied Physics Technical Field Awards (JSAP) and the IEEE Electron Devices Society (EDS). • EDS Region 9 Chapters Meeting Summary The conference will be held in the Hilton Hawaiian Village in Honolulu, • 2001 EDS Chapter of the Year Award Hawaii. The conference begins with a one-day short course held on Mon- day, June 10, 2002. This is followed by three days of technical sessions • 30 EDS Members Elected to the IEEE Grade held June 11-13, 2002. The technical sessions commence with a plenary of Fellow session given by distinguished invited speakers, and then continue with pre- • Final Call for Nominations for the 2002 EDS sentations of submitted technical papers. Evening “Rump Sessions” on topics Graduate Student Fellowship Program of current technical interest will also be held. A banquet will be held on the • Congratulations to the EDS Members Recently evening of Tuesday, June 11, 2002. Elected to IEEE Senior Member Grade The Symposium welcomes the submission of papers on all aspects of VLSI Regional & Chapter News.....................19 Technology. The scope of the Symposium includes: • New concepts and breakthroughs in VLSI devices and processes. • New functional devices including quantum effect devices with possible VLSI implementation. Contributions Welcome • Materials innovation for MOSFET and interconnect in VLSI. Readers are encouraged to submit news items con- • Advanced lithography and fine patterning technologies for high density cerning the Society and its members. Please send VLSI. your ideas/articles directly to either the Editor-in- • Process/Device modeling of VLSI devices. Chief or appropriate Editor. All contact information • Packaging and reliability of VLSI devices. is listed on the back cover page. Whenever possi- • Theories and fundamentals related to the above devices. ble, e-mail is the preferred form of submission. Newsletter Deadlines (continued on page 3) Issue Due Date January October 1st Your Comments Solicited April January 1st Your comments are most welcome. Please write directly to the Editor-in-Chief July April 1st of the Newsletter at the address given on the back cover page. October July 1st 2 Electron Devices Society Message from the President President Awards Chair Steven J. Hillenius Alfred U. Mac Rae Agere Systems Mac Rae Technologies Tel: +1 908 582 6539 Tel: +1 908 464 6769 E-Mail: [email protected] E-Mail: [email protected] Vice President Educational Activities Chair Hiroshi Iwai Ilesanmi Adesida Steven J. Hillenius Tokyo Institute of Technology University of Illinois Tel: +81 45 924 5471 Tel: +1 217 244 6379 E-Mail: [email protected] E-Mail: [email protected] Treasurer Meetings Chair Paul K. L. Yu Kenneth F. Galloway University of California at San Diego Vanderbilt University Tel: +1 858 534 6180 Tel: +1 615 322 0720 E-Mail: [email protected] E-Mail: [email protected] It is my privilege to serve as the President of the Electron Devices Society for the year 2002. This year we will be celebrat- Secretary Membership Chair ing our 50th year as a society and I look at this opportunity as a John K. Lowell James B. Kuo Consultant University of Waterloo means to give a start for the Society into the second half of our Tel: +1 972 839 4900 Tel: +1 519 888 4025 first hundred years. This Society was born two years after the E-Mail: [email protected] E-Mail: [email protected] invention of the transistor and has grown over the years as the entire field of microelectronics, photonics, power devices, vacuum Sr. Past President Publications Chair electronics and MEMS have evolved into major businesses Bruce F. Griffing Renuka P. Jindal Dupont Optolithography Agere Systems throughout the world and have affected the daily life of almost Tel: +1 512 310 6550 Tel: +1 908 582 0438 everyone. E-Mail: [email protected] E-Mail: [email protected] The fact that a society like ours has existed for 50 years is a testament to our ability to adapt to change. The challenges that Jr. Past President Regions/Chapters Chair Cary Y. Yang Hiroshi Iwai we have had over the last decade have been one of coping Santa Clara University Tokyo Institute of Technology with growth and utilizing our resources to better serve and bene- Tel: +1 408 554 6814 Tel: +81 45 924 5471 fit the membership. We have established an executive office to E-Mail: [email protected] E-Mail: [email protected] maintain a standard for service and have moved the publica- tions activities there. This has dramatically reduced the turn- EDS Executive Director IEEE Newsletter Coordinator William F. Van Der Vort Andrea Watson around time for paper publication and has reduced the burden IEEE Operations Center IEEE Operations Center on the volunteers that serve as editors and reviewers. We have 445 Hoes Lane 445 Hoes Lane also driven and have been one of the first to implement electron- Piscataway, NJ 08854 Piscataway, NJ 08854 ic distribution of journals. We have expanded our international Tel: +1 732 562 3926 Tel: +1 732 562 6345 Fax: +1 732 235 1626 Fax: +1 732 981 1855 chapter representation over the last ten years from 32% non- E-Mail: [email protected] E-Mail: [email protected] North American to 58% in 2002. This has also created a better balance of representation on our officers and AdCom members. This change in the Society is representative of the change in the business and the way the world has become smaller with the ease of communications and the advent of the internet. EDS ADCOM ELECTED MEMBERS-AT-LARGE Looking forward, I feel that the challenges that we are con- fronted with in the research and businesses that the Society rep- Term Expires: resents are greater now than they have been for our entire 2002 2003 *2004 history. We are looking at the end of the roadmap for the tran- C. L. Claeys (1) I. Adesida (2) M. Estrada del Cueto (1) sistor scaling, a globalized economy that is making many of our J. A. Dayton, Jr. (1) T. Hiramoto (1) K. F. Galloway (2) technology innovations a widely available commodity and new M. Fukuma (1) L. Lunardi (1) S. J. Hillenius (2) technology developments that will challenge and disrupt our K. M. Lau (1) A. A. Santos (2) C. Jagadish (2) K. Lee (1) S. C. Sun (2) J. K. O. Sin (1) established institutions. The viability of the Society will be deter- M. L. Ostling (1) H. S. P. Wong (1) R. Singh (2) mined by how quickly we will be able to adapt to these D. L. Pulfrey (1) P. K. L. Yu (2) N.D. Stojadinovic (1) changes and position the technical component of the Society to K. Shenai (2) the interests and needs of the people who will be driving these Number in parenthesis represents term. * Members elected 12/01 (continued on page 6) IEEE Electron Devices Society Newsletter (ISSN 1074 1879) is published quarterly by the Electron Devices Society of the Institute of Electrical and Electronics Engineers, Inc. Headquarters: 3 Park Avenue, 17th Floor, New York, NY 10016-5997. Printed in the U.S.A. One dollar ($1.00) per member per year is included in the Society fee for each member of the Electron Devices Society. Periodicals postage paid at New York, NY and at additional mailing offices. Postmaster: Send address changes to IEEE Electron Devices Society Newsletter, IEEE, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855-1331. Copyright © 2002 by IEEE: Information contained in this Newsletter may be copied without permission provided that copies are not used or distributed for direct commercial advantage, and the title of the publication and its date appear on each photocopy. IEEE Electron Devices Society Newsletter ❍ April 2002 3 Upcoming Technical Meetings VLSI For further information, please visit our Symposium Chairman: Craig Lage (continued from page 1) web site at http:// www.vlsisymposium. org, or contact the following organizations: Motorola Austin, Texas, USA • New concepts and technologies for Secretariat for VLSI Symposia (Japan) Symposium Co-Chairman: VLSI manufacturing. c/o Business Center Seiichiro Kawamura Submitted technical papers are for Academic Societies Japan Advanced Semiconductor Research Center reviewed by two technical committees 5-16-9 Honkomagome, Bunkyo-ku, Tsukuba, Japan Tokyo 113-8622, Japan. consisting of technical experts from indus- Program Chairman: Tel: +81 3 5814 5800 Yuan Taur try and academia. These two committees Fax: +81 3 5814 5823 University of California, San Diego are a North America and Europe (NAE) E-mail: [email protected] committee, and a Japan and the Far East San Diego, CA, USA (JFE) committee. Based on the combined Secretariat for VLSI Symposia (USA) Program Co-Chairman: ranking of these two committees, the best Widerkehr and Associates Kenji Maeguchi papers are selected and organized into 101 Lake Forest Blvd., Suite 400B Toshiba Corporation technical sessions.
Recommended publications
  • Procesory Ve Směrovačích Firmy Cisco Motorola MPC857DSL
    Procesory ve směrovačích firmy Cisco Pokročilé architektury počítačů Marek Malysz, mal341 Obsah Motorola MPC857DSL.............................................................................................................................1 Motorola 68360.........................................................................................................................................2 Motorola 68030.........................................................................................................................................3 Motorola MPC860 PowerQUICC............................................................................................................3 PMC-Sierra RM7061A.............................................................................................................................4 Broadcom BCM1250................................................................................................................................5 R4600.........................................................................................................................................................5 R5000.........................................................................................................................................................6 R7000.........................................................................................................................................................6 QuantumFlow Processor...........................................................................................................................6
    [Show full text]
  • Miniaturization Technologies
    Chapter 1 Introduction and Summary “Small is Beautiful.” The truth of that state- technology is driven by a product or market dom- ment is debated in economic and sociological inated by another nation’s industry. circles, but when it comes to technology, there is no debate; small is beautiful because small is fast, The trends in silicon electronics miniaturiza- small is cheap, and small is profitable. The revo- tion show no signs of slowing in the near future. lution begun by electronics miniaturization dur- The current pace of miniaturization will pro- ing World War II is continuing to change the duce memory chips (dynamic random access world and has spawned a revolution in miniatur- memory, DRAM) with a billion transistors and ized sensors and micromechanical devices. the capacity to store 1 billion bits (1 gigabit) of in- Miniaturization plays a major role in the tech- formation around the year 2000.1 Transistors will nical and economic rivalry between the United continue to shrink until the smallest feature is States and its competitors. It translates to market around 0.1 micron (1 micrometer or one millionth share and competitive advantage for many com- of a meter). By comparison, today’s most ad- mercial and scientific products. Those compa- vanced mass-produced integrated circuits have nies and nations that can successfully develop features as small as 0.8 microns. A human hair is and capitalize on miniaturization developments 50 to 100 microns in width (see figure l-l). will reap handsome rewards. Personal comput- Achieving such tiny features will require a huge ers, portable radios, and camcorders are exam- engineering and research effort.
    [Show full text]
  • Modelagem Abstrata Para O Hardware De Mpsocs
    Pontifícia Universidade Católica do Rio Grande do Sul Faculdade de Informática Programa de Pós-Graduação em Ciência da Computação MODELAGEM ABSTRATA PARA O HARDWARE DE MPSOCS CARLOS ALBERTO PETRY Dissertação apresentada como requisito parcial à obtenção do grau de Mestre em Ciência da Computação na Pontifícia Universidade Católica do Rio Grande do Sul. Orientador Prof. Dr. Ney Laert Vilar Calazans Porto Alegre 2009 Dados Internacionais de Catalogação na Publicação (CIP) P498m Petry, Carlos Alberto Modelagem abstrata para o hardware de MPSoCS / Carlos Alberto Petry. – Porto Alegre, 2009. 113 p. Diss. (Mestrado) – Fac. de Informática, PUCRS Orientador: Prof. Dr. Ney Laert Vilar Calazans 1. Informática. 2. Multiprocessamento. 3. Modelagem de Sistemas. I. Calazans, Ney Laert Vilar. II. Título. CDD 004.35 Ficha Catalográfica elaborada pelo Setor de Tratamento da Informação da BC-PUCRS AGRADECIMENTOS Meu primeiro agradecimento é, com toda a certeza, ao divino Pai Eterno, Aquele que tudo provê e minha vida conduz. Em segundo lugar quero agradecer à minha família. À minha esposa pela paciência, pelo estímulo e pelas palavras carinhosas que sempre recebi. Aos meus filhos, por acreditarem e apoiarem meus sonhos, mesmo que isto tenha implicado, em muitas ocasiões, minha ausência em momentos de alegria, de tristeza e de necessidade. Agradeço também à minha família ascendente. À minha Mãe pela pessoa santa que é por dedicar toda a sua vida em prol de sua família, em especial a mim. Ao meu Pai, em memória, pelos exemplos de vida que me deixou. Aos meus irmãos José Alfredo, Ademar e Gelson, pelos grandes companheiros que tenho. E por fim à minha tia Lita por tantas orações que a mim dedicou.
    [Show full text]
  • Computer Architectures an Overview
    Computer Architectures An Overview PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 25 Feb 2012 22:35:32 UTC Contents Articles Microarchitecture 1 x86 7 PowerPC 23 IBM POWER 33 MIPS architecture 39 SPARC 57 ARM architecture 65 DEC Alpha 80 AlphaStation 92 AlphaServer 95 Very long instruction word 103 Instruction-level parallelism 107 Explicitly parallel instruction computing 108 References Article Sources and Contributors 111 Image Sources, Licenses and Contributors 113 Article Licenses License 114 Microarchitecture 1 Microarchitecture In computer engineering, microarchitecture (sometimes abbreviated to µarch or uarch), also called computer organization, is the way a given instruction set architecture (ISA) is implemented on a processor. A given ISA may be implemented with different microarchitectures.[1] Implementations might vary due to different goals of a given design or due to shifts in technology.[2] Computer architecture is the combination of microarchitecture and instruction set design. Relation to instruction set architecture The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. The ISA includes the execution model, processor registers, address and data formats among other things. The Intel Core microarchitecture microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements.
    [Show full text]
  • Alocação De Tarefas E Comunicação Entre Tarefas Em Mps Ocs
    PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO GRANDE DO SUL FACULDADE DE INFORMÁTICA PROGRAMA DE PÓS-GRADUAÇÃO EM CIÊNCIA DA COMPUTAÇÃO ALOCAÇÃO DE TAREFAS E COMUNICAÇÃO ENTRE TAREFAS EM MPS OCS por CRISTIANE RAQUEL WOSZEZENKI Prof. Dr. Fernando Gehm Moraes Orientador Dissertação de mestrado submetida como requisito parcial à obtenção do grau de Mestre em Ciência da Computação. Porto Alegre, Março de 2007. Pontifícia Universidade Católica do Rio Grande do Sul Dados Internacionais de Catalogação na Publicação (CIP) W935a Woszezenki, Cristiane Raquel Alocação de tarefas e comunicação entre tarefas em MPSoCs / Cristiane Raquel Woszezenki. – Porto Alegre, 2006. 123 f. Diss. (Mestrado) – Fac. de Informática, PUCRS Orientador: Prof. Dr. Fernando Gehm Moraes 1. Multiprocessadores. 2. Alocação de Tarefas. 3. Arquitetura de Computadores. 4. Informática. I. Título. CDD 004.35 Ficha Catalográfica elaborada pelo Setor de Processamento Técnico da BC-PUCRS Campus Central Av. Ipiranga, 6681 – prédio 16 – CEP 90619-900 Porto Alegre – RS – Brasil Fone: +55 (51) 3320-3544 – Fax: +55 (51) 3320-3548 Email: [email protected] www.pucrs.br/biblioteca Resumo MPSoCs (do inglês, Multiprocessor System On Chip ) constituem uma tendência no projeto de sistemas embarcados, pois possibilitam o melhor atendimento dos requisitos da aplicação. Isso se deve ao fato de que a arquitetura desses sistemas é composta por vários processadores, módulos de hardware dedicados, memória e meio de interconexão, fornecendo um maior poder computacional quando comparados a sistemas monoprocessados equivalentes. No entanto, estratégias que possibilitem o aproveitamento da capacidade de processamento destas arquiteturas precisam ser mais bem entendidas e exploradas. Para isso, é necessário dispor de infra-estruturas de hardware e software que habilitem gerenciar a execução de tarefas no MPSoC.
    [Show full text]
  • A Comparative Study of 64 Bit Microprocessors Apple, Intel and AMD
    Special Issue - 2016 International Journal of Engineering Research & Technology (IJERT) ISSN: 2278-0181 ICACT - 2016 Conference Proceedings A Comparative Study of 64 Bit Microprocessors Apple, Intel and AMD Surakshitha S Shifa A Ameen Rekha P M Information Science and Engineering Information Science and Engineering Information Science and Engineering JSSATE JSSATE JSSATE Bangalore, India Bangalore, India Bangalore, India Abstract- In this paper, we draw a comparative study of registers, even larger .The term may also refer to the size of microprocessor, using the three major processors; Apple, low-level data types, such as 64-bit floating-point numbers. Intel and AMD. Although the philosophy of their micro Most CPUs are designed so that the contents of a architecture is the same, they differ in their approaches to single integer register can store the address of any data in implementation. We discuss architecture issues, limitations, the computer's virtual considered an appropriate size to architectures and their features .We live in a world of constant competition dating to the historical words of the work with for another important reason: 4.29 billion Charles Darwin-‘Survival of the fittest ‘. As time passed by, integers are enough to assign unique references to most applications needed more processing power and this lead to entities in applications like databases. an explosive era of research on the architecture of Some supercomputer architectures of the 1970s and microprocessors. We present a technical & comparative study 1980s used registers up to 64 bits wide. In the mid-1980s, of these smart microprocessors. We study and compare two Intel i860 development began culminating in a 1989 microprocessor families that have been at the core of the release.
    [Show full text]
  • Bibliography
    BIBLIOGRAPHY 1. Aditya, S., Rau, B. R., and Johnson, R., “Automatic Design of VLIW and EPIC Instruction Formats”, HP Labs Technical Report HPL-1999-94, 1999. 2. Baruch, Z. F., Arhitectura Calculatoarelor. Todesco, Cluj-Napoca, 2000. 3. Baruch, Z. F., Structura sistemelor de calcul cu aplicaţii. Todesco, Cluj-Napoca, 2001. 4. Bondurant, D., “DRAM IOs Proliferate as Old Standards Fall”. Electronic Products, http://www.electronicproducts.com. 5. Compaq Computer Corp., Alpha 21164 Microprocessor Hardware Reference Manual, EC- QP99C-TE, 1998. 6. Compaq Computer Corp., Alpha 21264 Microprocessor Hardware Reference Manual, EC- RJRZA-TE, 1999. 7. DEW Associates Corp., “DDR vs. Dual Channel RDRAM”, 2001, http://www.dewassoc.com. 8. DEW Associates Corp., “Memory: Evolution or Revolution”, 2000, http://www.dewassoc.com. 9. Digital Equipment Corp., Alpha 21064A Microprocessors Data Sheet, EC-QFGKC-TE, Maynard, Massachusetts, 1996. 10. Digital Equipment Corp., Alpha 21066 and Alpha 21066A Microprocessors Data Sheet, EC-QC4HB-TE, Maynard, Massachusetts, 1995. 11. Digital Equipment Corp., Digital Semiconductor Alpha 21164PC Microprocessor Product Brief, EC-R2W2B-TE, 1997. 12. Digital Equipment Corp., Alpha 21164 Microprocessors Data Sheet, EC-QAEPD-TE, Maynard, Massachusetts, 1996. Bibliography 385 13. Dipert, Brian, “The Slammin’, Jammin’ DRAM Scramble”. EDN, January 20, 2000, pp. 68-82. 14. Enhanced Memory Systems, Inc., “64Mbit Enhanced SDRAM Product Brief”, 2000, http://www.edram.com. 15. Enhanced Memory Systems, Inc., “64Mbit High Speed SDRAM Data Sheet”, 1999, http://www.edram.com. 16. Enhanced Memory Systems, Inc., “Enhanced DDR-II: The Memory Architecture of the Future.”, http://www.edram.com. 17. Fujitsu Microelectronics, Inc., “16 M-Bit Mobile FCRAM: MB82D01171A-90/90L/ 90LL”.
    [Show full text]
  • Miniaturization Technologies (November 1991)
    Miniaturization Technologies November 1991 OTA-TCT-514 NTIS order #PB92-150325 Recommended Citation: U.S. Congress, Office of Technology Assessment, Miniaturization Technologies, OTA-TCT- 514 (Washington, DC: U.S. Government Printing Office, November 1991). For sale by the U.S. Government Printing Office Superintendent of Documents, Mail Stop: SSOP, Washington, DC 20402-9328 ISBN O-16-035983–X Advances in miniaturization technologies have had dramatic impacts on our lives. Radios, com- puters, and telephones that once occupied large volumes now fit in the palm of a hand. Dozens of sen- sors are sent on spacecraft to the planets and on instruments into the human body. Electronic brains are in everything from bombs to washing machines. This report analyzes various technologies that may be important for future advances in miniatur- ization. Current research in the United States and other nations is pushing the limits of miniaturization to the point that structures only hundreds of atoms thick will be commonly manufactured. Researchers studying atomic and molecular interactions are continuing to push the frontiers, creating knowledge needed to continue progress in miniaturization. Scientists and engineers are creating microscopic me- chanical structures and biological sensors that will have novel and diverse applications. OTA characterizes U.S. research and development in miniaturization technologies as the best in the world. Despite the growing prowess of foreign research, American researchers continue to innovate and push the frontiers of miniaturization. The more elusive challenge is to translate success in the labo- ratory to success in the global marketplace. OTA gratefully acknowledges the contributions of the workshop participants, contractors, review- ers, and contributors who provided information, advice, and assistance.
    [Show full text]
  • RM5271™ Microprocessor with External Cache Interface
    RM5271™ Microprocessor with External Cache Interface Document Rev. 1.3 Date: 02/2000 FEATURES • Dual Issue superscalar microprocessor • High-performance floating point unit - up to 700 MFLOPS — 200, 250, 266, 300, 350 MHz operating frequencies — Single cycle repeat rate for common single precision opera- — 420 Dhrystone 2.1 MIPS maximum tions and some double precision operations • High-performance system interface — Two cycle repeat rate for double precision multiply and dou- — 64-bitmultiplexed system address/data bus for optimum ble precision combined multiply-add operations price/performance with up to 125MHz operation frequency — Single cycle repeat rate for single precision combined multi- — High-performance write protocols to maximize uncached ply-add operation write bandwidth • MIPS IV instruction set — Processor clock multipliers 2, 2.5, 3, 3.5, 4, 4.5, 5, 6, 7, 8, 9 — Floating point multiply-add instruction increases perfor- — IEEE 1149.1 JTAG boundary scan mance in signal processing and graphics applications • Integrated on-chip caches — Conditional moves to reduce branch frequency — 32KB instruction and 32KB data - 2-way set associative — Index address modes (register + register) — Virtually indexed, physically tagged • Embedded application enhancements — Write-back and write-through on a per-page basis — Specialized DSP integer Multiply-Accumulate instructions — Pipeline restart on first doubleword for data cache misses and 3-operand multiply instruction • Integrated secondary cache controller (R5000 compatible) — Instruction
    [Show full text]
  • Alocaçào De Tarefas E Comunicaçào Entre Tarefas Em Mpsocs
    PONTIFÈCIA UNIVERSIDADE CATÌLICA DO RIO GRANDE DO SUL FACULDADE DE INFORMÊTICA PROGRAMA DE PÌS-GRADUAÇÀO EM CIÂNCIA DA COMPUTAÇÀO ALOCAÇÀO DE TAREFAS E COMUNICAÇÀO ENTRE TAREFAS EM MPSOCS por CRISTIANE RAQUEL WOSZEZENKI Prof. Dr. Fernando Gehm Moraes Orientador Dissertação de mestrado submetida como requisito parcial à obtenção do grau de Mestre em Ciência da Computação. Porto Alegre, Março de 2007. Resumo MPSoCs (do inglês, Multiprocessor System On Chip ) constituem uma tendência no projeto de sistemas embarcados, pois possibilitam o melhor atendimento dos requisitos da aplicação. Isso se deve ao fato de que a arquitetura desses sistemas é composta por vários processadores, módulos de hardware dedicados, memória e meio de interconexão, fornecendo um maior poder computacional quando comparados a sistemas monoprocessados equivalentes. No entanto, estratégias que possibilitem o aproveitamento da capacidade de processamento destas arquiteturas precisam ser mais bem entendidas e exploradas. Para isso, é necessário dispor de infra-estruturas de hardware e software que habilitem gerenciar a execução de tarefas no MPSoC. A partir destas infra-estruturas deve ser possível, por exemplo, mapear tarefas dinamicamente nos processadores, balanceando a carga de trabalho do MPSoC através de estratégias de alocação dinâmica de tarefas. O estado da arte da bibliografia no tema explora estratégias de alocação estática e dinâmica de tarefas sobre MPSoCs e avalia a viabilidade e eficiência das mesmas. Contudo, a necessidade de criação das infra-estruturas de hardware e software para viabilizar a exploração destas estratégias constitui-se um gargalo no avanço desta tecnologia. Adicionalmente, a maioria dos trabalhos utiliza plataformas modeladas em níveis muito abstratos de modelagem para avaliação das abordagens pesquisadas, reduzindo a confiabilidade dos resultados relatados.
    [Show full text]
  • Mellanox Technologies Strengthens Board of Directors with Key Appointments
    Mellanox Technologies Strengthens Board of Directors with Key Appointments Industry Veterans Thomas Riordan and Doug Spreng Join InfiniBand Silicon Leader Santa Clara, California and Yokneam, Israel, - April 15, 2003 - Mellanox® Technologies, Ltd., the leading provider of InfiniBandSM silicon, is pleased to announce the appointment of Tom Riordan and Doug Spreng to its Board of Directors. Together, Mr. Riordan and Mr. Spreng bring extensive semiconductor, networking, computer, and communications industry and management expertise to the Mellanox board. "Doug and Tom bring to the board many years of experience and proven track records at leading technology companies," said Eyal Waldman, Chairman of the board and CEO of Mellanox Tech- nologies. "As 2003 holds the promise to be the beginning of the significant ramp of the Infini- Band market, we look forward to having the great expertise and guidance of these two veteran strategic and operational executives benefiting Mellanox at this critical time." "Given the very large potential of the InfiniBand market, I'm pleased to join the board of the lead- ing company in the segment", said Mr. Riordan. "With their current production shipments of full 2nd generation 10 Gigabit/sec solutions, Mellanox is very well positioned for success, and I look forward to helping the company realize that success". "InfiniBand holds the promise for dramatic improvement in the performance, capital cost, and operational cost of enterprise data centers and computer systems", said Mr. Spreng. "I'm excited to join the Mellanox board and I look forward to advising the company on taking an optimal path as the InfiniBand market develops." Mellanox Technologies Inc.
    [Show full text]
  • Datasheet Search Engine
    External Cache for the RM5271 Application Note Introduction Quantum Effect Devices, Inc. (QED) was founded in 1991 to design and develop MIPS RISC microprocessors to MIPS Technologies, Inc. (MTI) specifications. MTI sub-licensed those designs to MIPS licensees. In 1996 QED obtained a license to manufacture and sale MIPS microprocessor. QED is currently producing three 64-bit MIPS microprocessors that support external cache; the RM5270, RM5271, and RM7000. The R5000, a QED designed and licensed product, also supports external cache. This paper is applicable to all four devices, but only the RM5271 will be directly reference herein. This paper will discuss only the external cache, its implementation, and enhancements made to the secondary cache controller. For the RM5270, RM5271, and R5000 the external cache is a second level cache. For the RM7000 the external cache is a third level cache. The RM5271 provides an on-chip controller for external second level cache. The second level cache is a unified direct- mapped block write-through cache with byte parity protection. It requires two types of pipelined synchronous burst SRAM, a Tag SRAM and a Data SRAM. The Tag SRAM is used to maintain a list of cache lines stored in the Data SRAM plus a single bit with each Tag to define whether the cache line that tag points to, or indexes, in the data SRAM contains valid data or not. The Data SRAM must have a parity bit for each byte since the system interface uses even parity to protect data transfers. Not all transactions on the System Interface reference the external secondary cache.
    [Show full text]