DOCSLIB.ORG

PIXI-9377 Qualcomm QCA9377 802.11Ac/B/G/N 1T1R + Bluetooth 5

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
PIXI-9377 Qualcomm QCA9377 802.11Ac/B/G/N 1T1R + Bluetooth 5 PIXI-9377 Qualcomm QCA9377 802.11ac/b/g/n 1T1R + Bluetooth 5 M.2 LGA Type 1216 Module REV. A1 – VER. 1.02 March 29, 2019 PIXI-9377 REV. A1. HARDWARE MANUAL – VER 1.02 – MAR 29 2019 REVISION HISTORY Revision Date Originator Notes 1.00 April 5, 2018 TechNexion Initial Public release 1.01 January 6, 2019 TechNexion Add 1.8V mode details 1.02 March 29, 2019 TechNexion Add Bluetooth 5 Page 2 of 36 PIXI-9377 REV. A1. HARDWARE MANUAL – VER 1.02 – MAR 29 2019 TABLE OF CONTENTS 1. Introduction ......................................................................................................................................... 4 1.1 General Introduction ...................................................................................................................... 4 1.2 Product Key Features .................................................................................................................... 5 1.3 Product Variants ............................................................................................................................ 6 1.4 Add-On Card Variants ................................................................................................................... 7 1.5 Block Diagrams ............................................................................................................................. 8 1.6 Dimensional Drawing PIXI-9377 ................................................................................................. 10 2. PIXI-9377 Signal Pinout .................................................................................................................... 11 3. RF Characteristics ............................................................................................................................. 13 4. Power ................................................................................................................................................ 14 4.1. WLAN Power Consumption ........................................................................................................ 14 4.2. Bluetooth Power Consumption ................................................................................................... 15 5. Electric Specifications ....................................................................................................................... 16 5.1 Power domain associated pins .................................................................................................... 16 6. Power Sequence Specifications ....................................................................................................... 17 6.1 All power rails supplied with 3.3 V ............................................................................................... 17 6.2 I/O Power Rails Supplied with 1.8V ............................................................................................. 18 6.2.1 With Removable Power Source. .............................................................................................. 18 6.2.2. Without Removable Power Source ......................................................................................... 19 7 Reference Schematics ....................................................................................................................... 20 7.1 PIXI-9377-S (SDIO) ..................................................................................................................... 20 7.2 PIXI-9377-P (PCIe) ...................................................................................................................... 21 7.3 Signal Connection Checklist while integrating PIXI-9377 ........................................................... 22 7.3.1 Module Integration Considerations - Circuit Implementation ................................................... 22 7.3.2 PCIe Decoupling Capacitors on PIXI-9377-P Designs ............................................................ 22 7.3.3 Bluetooth UART Signal Swapping on PIXI-9377-S Designs. ................................................... 22 7.3.4 Bluetooth PCM Audio Signal Swapping on PIXI-9377-S Designs. .......................................... 23 8. EMC Compliance certification ........................................................................................................... 24 8.1 FCC Testing Requirements for End-Product............................................................................... 24 8.2 FCC Wireless certification: New Filing vs. Permissive Change .................................................. 25 9 Antenna Integration Guidelines .......................................................................................................... 27 9.1 Antenna Connector Specifications .............................................................................................. 27 9.2 Certified Antenna Options ........................................................................................................... 28 10. SMT and Layout Data. .................................................................................................................... 29 11. Packaging Information .................................................................................................................... 33 11.1. Reel Packaging Information ..................................................................................................... 33 12. Labelling Information ....................................................................................................................... 34 13. Ordering Information ....................................................................................................................... 34 14. Important Notice .............................................................................................................................. 35 15. Disclaimer ....................................................................................................................................... 36 Page 3 of 36 PIXI-9377 REV. A1. HARDWARE MANUAL – VER 1.02 – MAR 29 2019 1. Introduction 1.1 General Introduction PIXI-9377 is a high performance 2.4 + 5GHz WLAN and Bluetooth combo module based on latest- generation silicon (Qualcomm Atheros QCA9377). With an industrial temperature rating, broad country certifications, and the availability in different package styles, the PIXI-9377 provides significant flexibility to meet various end user application needs. The on-module chip antenna package style for the PIXI-9377 eliminates complexity for design integration, simplifies manufacturing assembly with larger pin outs, and features an advanced chip antenna that offers greater resistance to de-tuning than typical trace or chip antennas. The module includes the MAC, Baseband and Radio to support WLAN applications and an independent, high-speed UART is provided for the Bluetooth host interface. In addition, the latest Linux and Android drivers are supported directly by TechNexion and Qualcomm Atheros. • Need to get to market quickly? • Not an expert in 802.11 wireless connectivity? • Need a custom antenna? • Would you like a custom design? • Not quite sure what you need? • Do you need help with your host board? TechNexion has a Design Services Team standby that is happy to develop custom hardware or software or assist with integrating the design. Contact your TechNexion Sales Contact Window or email us at [email protected]. Page 4 of 36 PIXI-9377 REV. A1. HARDWARE MANUAL – VER 1.02 – MAR 29 2019 1.2 Product Key Features General Specification Chipset Qualcomm QCA-9377 Formfactor M.2 LGA Type 1216 Antenna IPEX MHF-4 Connector Operation Temperature -40 to +85 Degrees Celsius Operation Humidity 10 – 90 % Non-Condensing Wi-Fi Specification Chipset Qualcomm QCA-9377 PIXI-9377-S SDIO Host Interface PXI-9377-P PCIE Standards 802.11a/b/g/n/ac Radio Stream 1T1R 2.4Ghz 2412 – 2484Mhz Frequency Range 5Ghz 4900 – 5925Mhz 2.4GHz 802.11b/g/n 5Mhz 5Ghz 802.11a/n/ac 20Mhz Frequency Step 5Ghz 802.11 n/ac 40Mhz 5Ghz 802.11ac 80Mhz 802.11b 1,2, 5.5, 11 Mbps 802.11a/g 6,9,12,18,244,36,48,54 Mbps Link Data Rate 802.11n MCS 0,1,2,3,4,5,6,7 802.11ac MCS 0,1,2,3,4,5,6,7,8,9 802.11b DSSS (DBPSK, DQPSK, CCK) OFDM (BPSK, QPSK, 16QAM, 802.11a/g/n Modulation Type 64QAM) OFDM (BPSK, QPSK, 16QAM, 802.11ac 256QAM) RC4 128 bits Encryption AES 128 bits Bluetooth Specification Chipset Qualcomm QCA-9377 PIXI-9377-S UART Host Interface PXI-9377-P USB Standards Bluetooth 5 (backwards compatible with 4.2, 4.1, 4.0 LE, 3.0+HS, 2.1+EDR) Frequency Range 2402 – 2480Mhz Channels 0 – 79 Link Data Rate 1 Mbps, 2Mbps and Upto 3Mbps EDR Modulation Type FHSS, GFSK, DPSK, DQPSK Page 5 of 36 PIXI-9377 REV. A1. HARDWARE MANUAL – VER 1.02 – MAR 29 2019 1.3 Product Variants The PIXI-9377 Base Module is a System in Package (SIP) module, which can be assembled into an OEM end product and is available in the following configurations. Partnumber Description PIXI QCA9377 M.2 SIP Module PIXI-9377-S Wi-Fi : SDIO BT : UART + PCM PIXI QCA9377 M.2 SIP Module PIXI-9377-P Wi-Fi : PCIe BT : USB Page 6 of 36 PIXI-9377 REV. A1. HARDWARE MANUAL – VER 1.02 – MAR 29 2019 1.4 Add-On Card Variants TechNexion offers a range of “add-on cards” for customers that want to add the PIXI-9377 in their OEM project but don’t have the freedom or technical design or manufacturing knowledge to work with SIP packages Partnumber Description CLIX QCA9377 Module CLIX-9377 Wi-Fi : SDIO BT : UART + PCM M.2 Key AE QCA9377 Module STIX-M2-9377-AE Wi-Fi : PCIe BT : USB M.2 Key B QCA9377
Load more

Recommended publications
  • QCNFA324 Product Name: 2X2 802.11 A/B/G/N/AC Wifi + Bluetooth Module Mistral Confidential
    Mistral Confidential QCNFA324 Product name: 2x2 802.11 A/B/G/N/AC WiFi + Bluetooth Module Mistral Confidential NOTICE The information in this document is reviewed and is believed to be accurate. Nonetheless, this document is subject to change without Notice and Mistral Solutions private Limited (Mistral) assumes no responsibility for any inaccuracies that may be contained in this document, and make no commitment to update or to keep current the contained information, or to notify a person or organization of any updates. Mistral reserves right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Mistral does not represent that products described herein are free from patent infringement or from any third party right. No part of this document may be reproduced, adapter or transmitted in any form or by any means, electronic or mechanical, for any purpose, except as expressly set forth in a written agreement signed by Mistral. Mistral or its affiliates may have patents or pending patent applications, trademarks, copyrights, mask work rights or other intellectual property rights that apply to the ideas, material and information expressed herein. No license to such rights is provided except as expressly set forth in a written agreement signed by Mistral. Mistral makes no warranties of any kind with regard to the content of this document. In no event shall Mistral be liable for direct, indirect, special, incidental, speculator or consequential damages arising from the use or inability to use this product or documentation, Even if advised of the possibility of such damages.
    [Show full text]
  • Wi-Fi Penetration Across the Automobile
    Alessandro Norscia, Director Product Management Wi-Fi Penetration Across the Automobile 1 Wi-Fi and Bluetooth Connectivity in the Car Infotainment System Multiple use-cases, concurrencies and profiles supported by the Qualcomm Technologies’ platform Multiple BT profiles AP and STA Bluetooth network 2.4GHz WLAN network • BT Headset (HSP) • Phone tethering • Phone calls (HFP, • Mirroring PBAP) • Email • Music streaming • Web browsing (A2DP) • Video streaming AP and P2P GO 5GHz WLAN network • Video streaming- client Qualcomm® • Miracast/ Mirroring- VIVE™ P2P client QCA6574A Qualcomm Snapdragon and Qualcomm Gobi are products of Qualcomm Technologies, IncQualcomm VIVE is a product of Qualcomm Atheros, Inc. 2 Wi-Fi and Bluetooth in Telematics Applications In-car Wi-Fi/BT, connectivity to outside of car with LTE, Wi-Fi and BT Cell Phone Tower Wi-Fi connectivity to home, service center or other infrastructure Remote access to car from personal device OPEN 802.11ac 802.11ac In-car Wi-Fi and BT Qualcomm® VIVE™ Bluetooth QCA6574 Qualcomm Snapdragon and Qualcomm Gobi are products of Qualcomm Technologies, Inc. Qualcomm VIVE is a product of Qualcomm Atheros, Inc. 3 Vehicle to Vehicle and Vehicle to Infrastructure Communication Dedicated Short Range Communication solution for comprehensive Telematics platform Cell Phone Tower • Wi-Fi based technology based on 802.11p Wi-Fi standard • Acquire security − For latency critical communication certificates and CRLs • Send information to • 360 degree no line of sight (NLOS) awareness remote vehicles and infrastructure • Increased safety • Augmented positioning DSRC Other use cases - Location • - Velocity − Traffic congestion − Emergency help − Payment for tolling, parking DSRC V2I DSRC - Road hazard information Qualcomm® - Services VIVE™ QCA6574 RSU or other infrastructure Qualcomm Snapdragon and Qualcomm Gobi are products of Qualcomm Technologies, Inc.
    [Show full text]
  • The 1000X Data Challenge, the Latest on Wireless, Voice, Services and Chipset Evolutions
    The 1000x Data Challenge, The latest on Wireless, Voice, Services and Chipset Evolutions. 4G World, Wednesday October 31st Agenda 4G World Wednesday October 31st 1:30pm to 4:30pm 1:30 pm The 1000x mobile data challenge - 1:30 How do we enable 1000x? Rasmus Hellberg, Sr Director, Tech Marketing, - 1:45 How do we get access to new spectrum to reach 1000x? Prakash Sangam Director, Tech Marketing - 2:00 Taking HetNets to the next level for 1000x Rasmus Hellberg Sr Director, Tech Marketing - 2:15 The small cell products to power 1000x Prakash Sangam, Director, Tech Marketing (3G/4G small cells, Wi-Fi) 2:45pm The Chipset evolution and multimode challenges - 2:45 Smartphone signaling and power enhancements Sunil Patil, Director, Product Management - 3:05 Solving the global multimode and carrier aggregation challenges Peter Carson ,Sr Director Marketing - 3:25 Circuit switched fallback, performance and interworking Sunil Patil, Director, Product Management (LTE FDD/TDD GSM, UMTS, TD-SCDMA, 1X) 3:45pm The Voice and data Service evolution—together with Ericsson - 3:45 The latest on VoLTE Eric Parsons, Strategic Product Manager, (RCS, SRVCC VoLTE, VoIP over other accesses) , LTE, Ericsson - 4:00 How do we achieve the Smart Pipe? (QoS and more) Peter Carson, Sr Director Marketing - 4:10 LTE Broadcast services and opportunities Mazen Chmaytelli, Sr Dir, Business Dev. 2 The 1000x Mobile Data Challenge More Spectrum, More Small Cells, More Indoor Cells and Higher Efficiency October 31st 2012 Driving Network Evolution To learn more, Go to www.qualcomm.com/1000x
    [Show full text]
  • Freescale Embedded Solutions Based on ARM Technology Guide
    Embedded Solutions Based on ARM Technology Kinetis MCUs MAC5xxx MCUs i.MX applications processors QorIQ communications processors Vybrid controller solutions freescale.com/ARM ii Freescale Embedded Solutions Based on ARM Technology Table of Contents ARM Solutions Portfolio 2 i.MX Applications Processors 18 i.MX 6 series applications processors 20 Freescale Embedded Solutions Chart 4 i.MX53 applications processors 22 i.MX28 applications processors 23 Kinetis MCUs 6 Kinetis K series MCUs 7 i.MX and QorIQ Kinetis L series MCUs 9 Processor Comparison 24 Kinetis E series MCUs 11 Kinetis V series MCUs 12 Kinetis M series MCUs 13 QorIQ Communications Kinetis W series MCUs 14 Processors 25 Kinetis EA series MCUs 15 QorIQ LS1 family 26 QorIQ LS2 family 29 MAC5xxx MCUs 16 MAC57D5xx MCUs 17 Vybrid Controller Solutions 31 Vybrid VF3xx family 33 Vybrid VF5xx family 34 Vybrid VF6xx family 35 Design Resources 36 Freescale Enablement Solutions 37 Freescale Connect Partner Enablement Solutions 51 freescale.com/ARM 1 Scalable. Innovative. Leading. Your Number One Choice for ARM Solutions Freescale is the leader in embedded control, offering the market’s broadest and best-enabled portfolio of solutions based on ARM® technology. Our end-to-end portfolio of high-performance, power-efficient MCUs and digital networking processors help realize the potential of the Internet of Things, reflecting our unique ability to deliver scalable, systems- focused processing and connectivity. Our large ARM-powered portfolio includes enablement (software and tool) bundles scalable MCU and MPU families from small from Freescale and the extensive ARM ultra-low-power Kinetis MCUs to i.MX ecosystem.
    [Show full text]
  • Open-Q™ 660 Μsom (Micro System on Module) Based on the Qualcomm® Snapdragon™ SDA660 Processor
    25mm 50mm Open-Q™ 660 µSOM (micro System on Module) Based on the Qualcomm® Snapdragon™ SDA660 processor Intrinsyc’s Open-Q™ 660 µSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the powerful Qualcomm® Snapdragon™ SDA660 SoC, with built-in Artificial Intelligence Engine, Spectra™ ISP, Kryo™ CPU, and Hexagon™ DSP. The feature-rich SOM will provide a leap in performance for applications requiring on- device artificial intelligence, advanced photography and image processing, or enhanced gaming. In addition to the advanced SoC features, the SOM includes advanced Wi-Fi with 802.11ac 2x2 MU-MIMO, support for USB Type-C with 4K DisplayPort video out, a wealth of other I/O interfaces, and on-SOM power management and battery charging. Key Features Applications • Qualcomm® Snapdragon™ SDA660 processor • Advanced photography platforms • 4GB LPDDR4X and 32GB eMMC • Advanced graphics and 3D gaming • High-end Camera Features • On-device artificial intelligence • High-performance 802.11ac 2x2 MU-MIMO Wi-Fi • Machine learning modeled devices • Bluetooth 5.x • Multi-camera systems • Ultra-compact 50mm x 25mm • Machine vision platforms • Android™ 9 Datasheet: Open-Q 660 µSOM v1.2 www.intrinsyc.com Copyright 2019 Intrinsyc Technologies Corporation Hardware Specifications Processors Qualcomm® Snapdragon™ SDA660 built on 14nm FinFET technology Qualcomm® Kryo™ 260 CPU: 4 Kryo Gold High-performance 2.20GHz cores + 4 Kryo Silver low-power 1.84GHz cores Qualcomm® Hexagon™ 680 DSP with Hexagon Vector eXtensions (dual-HVX512) 787 MHz Qualcomm®
    [Show full text]
  • Tips for Using This Template
    Qualcomm Overview Samir Khazaka, Sr Dir Head of Analyst Relations April 2012 Placeholder for Opening Video Mobile: A Vibrant, Unprecedented Opportunity 6B+ $1.3T #1 Mobile Connections Annual Revenue (2011) Most Used Device Source: Wireless Intelligence, Dec. ’11, CIA World Factbook, Dec. ’11, Chetan Sharma Consulting, Jul. ’11 3 The First Natural Wave of Growth Mobile Computing Taking the Impact of the WEB to the Next Level Retail Advertising Media/ Entertainment Computing Another Wave of Growth Coming Reshaping Industries Retail Energy Health Care Advertising Media/ Entertainment Banking/Finance Auto Computing Mobile Experience Becoming the Expectation in Other Device Categories Mobile Is the New Architectural Approach Always Connected Always On and Up to Date Power Efficient Scale An Era of Smart Connected Devices Mobile at the Center of the Ecosystem Enabling Smart Connected Devices 3G/4G Migration into Smartphone New, Adjacent New Connected Expansion into New Categories Opportunities Mobile Categories Leadership Position Across Businesses Mobile Computing Consumer Internet of Networking Electronics Everything Growth Drivers Smartphones Non-Handset Emerging Advanced Connectivity Devices Regions Network Technologies 10 Smartphones Consumer Demand Driving Continued Smartphone Innovation Visually Stunning Graphics High Performance Mobile Broadband Seamless Connectivity (3G/4G) (WiFi, BT) ~4B Cumulative Smartphone Unit Sales Between 2011 and 2015 Source: Average of Gartner (September 2011), Strategy Analytics (September 2011), and IDC (September
    [Show full text]
  • Leading the World to 5G
    Leading the world to 5G February 2016 Qualcomm Technologies, Inc. Our 5G vision: a unifying connectivity fabric Enhanced Mission-critical Massive Internet mobile broadband services of Things • Multi-Gbps data rates • Uniformity • Ultra-low latency • High availability • Low cost • Deep coverage • Extreme capacity • Deep awareness • High reliability • Strong security • Ultra-low energy • High density Mobile devices Networking Automotive Robotics Health Wearables Smart cities Smart homes Unified design for all spectrum types and bands from below 1GHz to mmWave 2 Scalable to an extreme variation of requirements Deep coverage To reach challenging locations Strong security Ultra-low energy e.g. Health/government / financial trusted 10+ years of battery life Ultra-high reliability <1 out of 100 million packets lost Ultra-low complexity Massive Internet 10s of bits per second of Things Mission-critical control Ultra-low latency Ultra-high density As low as 1 millisecond 2 1 million nodes per Km Enhanced Extreme capacity mobile broadband 10 Tbps per Km2 Extreme user mobility Or no mobility at all Extreme data rates Deep awareness Multi-Gigabits per second Discovery and optimization Based on target requirements for the envisioned 5G use cases 3 Enhancing mobile broadband Ushering in the next era of immersive experiences and hyper-connectivity UHD video 3D/UHD video telepresence Tactile Internet streaming Demanding conditions, e.g. venues Broadband ‘fiber’ to the home Virtual reality Extreme throughput Ultra-low latency Uniform experience multi-gigabits
    [Show full text]
  • Case5:11-Cv-00640-LHK Documental Filed06/30/11 Pagel of 33
    Case5:11-cv-00640-LHK Documental Filed06/30/11 Pagel of 33 1 FARUQI & FARUQI, LLP VAHN ALEXANDER (167373) 2 1901 Avenue of the Stars, Second Floor Los Angeles, CA 90067 3 Telephone: (310) 461-1426 Facsimile: (310) 461-1427 4 valexanderriblaruqilalAi.corn 5 Attorneys for Plaintiff 6 UNITED STATES DISTRICT COURT 7 NORTHERN DISTRICT OF CALIFORNIA 8 SAN JOSE DIVISION 9 JOEL KRIEGER, Individually and on Behalf Case Number 11-CV-00640-LHK (HRL) 10 of All Others Similarly Situated, CLASS ACTION 11 Plaintiff, FIRST AMENDED CLASS ACTION 12 vs. COMPLAINT FOR VIOLATIONS OF SECTIONS 14(a) AND 20(a) OF THE 13 SECURITIES EXCHANGE ACT OF ATHEROS COMMUNICATIONS, INC., 1934 14 DR. WILLY C. SHIH, DR. TERESA H. MENG, DR. CRAIG H. BARRATT, JURY TRIAL DEMANDED 15 ANDREW S. RAPPAPORT, DAN A. ARTUSI, CHARLES E. HARRIS, Judge: Hon. Lucy H. Koh 16 MARSHALL L. MOHR, CHRISTINE Ctrm.: #4 5th Floor KING, QUALCOMM INCORPORATED, Date Action Filed: February 10 2011 17 and T MERGER SUB, INC., 18 Defendants. 19 20 21 22 23 24 25 26 27 28 FIRST AMENDED CLASS ACTION COMPLAINT FOR VIOLATIONS OF SECTIONS 14(a) AND 20(a) OF THE SECURITIES EXCHANGE ACT OF 1934 Case5:11-cv-00640-LHK Document50 Filed06130111 Page2 of 33 1 Plaintiff Joel Krieger ("Plaintiff'), by and through his attorneys, alleges the following as to 2 himself and on information and belief (including the investigation of counsel and review of publicly 3 available information) as to all other matters stated herein: 4 INTRODUCTION 5 1. This is a shareholder class action brought by Plaintiff on behalf of himself and 6 similarly situated shareholders of Atheros Communications, Inc.
    [Show full text]
  • Product Brief
    QUALCOMM® USER EXPERIENCES SNAPDRAGONTM Integrated X5 LTE Integrated 4G LTE with support for fast Cat 4 speeds (up to 150Mbps) and for Qualcomm 415 RF360™ front end solution PROCESSOR Hi-Res Camera and smooth HD display The “X5 LTE with Snapdragon 415 processor captures incredible HD” Processor night shots, with great image quality for low-light photography, at up to 13 MP The Snapdragon 415 processor offers many advantages: Record and + Integrated X5 LTE • Support for Cat 4 download speeds playback 1080p up to 150 Mbps videos • Support for Global Mode and advanced modem technologies, Multi-core processing and advanced video codec including LTE-FDD, LTE-TDD, CDMA, offer high-res video capturing and editing while UMTS/HSPA+ and TD-SDCMA conserving battery power + Octa-core CPU performance — based on ARM® Cortex®-A53 CPUs designed to deliver a robust multimedia experience Stunning 3D gaming Adreno 405 GPU supports avid online gamers with + 5.1 surround sound with Dolby and DTS eye-catching 3D imagery and support for the latest APIs + Qualcomm® Adreno™ 405 Graphics with support for advanced APIs and Hardware Tessellation + Qualcomm® Reference Design availability for all Snapdragon 415 Qualcomm® Quick features Charge™ technology Snapdragon 415 processor supports Quick Charge 2.0 technology, so your device can charge up to 75% faster than conventional methods* To learn more visit: snapdragon.com or mydragonboard.org *Based on internal tests charging a 3300mAh battery using a [1] QC2.0 USB wall adapter (9V, 2A), [2] USB wall adapter (5V, 2A), and [3] USB wall adapter (5V, 1A), respectively. (February 2013) Qualcomm Snapdragon, Qualcomm Adreno, Qualcomm RF360 and Qualcomm Quick Charge are products of Qualcomm Technologies, Inc.
    [Show full text]
  • DART-SD410 43 Mm
    DART-SD410 43 mm Bringing the Snapdragon™ Magic to the Embedded Market 25 mm from $57 Bringing the Snapdragon™ magic to the embedded market, the DART-SD410 supports the Qualcomm® Snapdragon™ 410 (APQ8016) 1.2GHz quad ARM Cortex-A53 with both 32-bit and 64-bit architecture. In an amazing 25mm x 43mm ultra compact size, the DART-SD410 offers a staggering processing power High-resolution camera, advanced multimedia support and highly optimized power consumption, ideal for and broad connectivity options are just some of the embedded portable devices and battery-operated features that ensure a richer experience in various products. embedded segments and applications. Main Features Qualcomm® Snapdragon™ 410 (APQ8016) Audio • 1.2GHz quad ARM® Cortex® A53 64/32-bit • Digital microphone processor • 2 x analog microphone • 400MHz Qualcomm® Adreno™ 306 2D/3D • Stereo headphone Graphics accelerator • Mono speaker • 1080p30 encode/decode • 2 x I2S • Up to 2GB LP-DDR3 and 16GB eMMC Other Interfaces Display Support • Up to 6 x SPI, 6 x I2C, 2 x UART, GPIOs • 4-lane DSI • SD/MMC, JTAG • HDMI and LVDS supported on carrier • Backlight PWM • Up to 720p60/1080p30, 24-bit OS Support Wireless Connectivity • Android, Linux, Windows 10 • Wi-Fi 802.11b/g/n • Bluetooth: 4.1/LE backward compatible to Power 2.x+EDR and 3.0 • Power in 3.7 - 4.5V • FM radio -25 to 85°C Temperature range GPS Dimensions (W x L x H) • Qualcomm® IZatTM Gen 8C location engine • 25mm x 43mm x 4mm • GPS, Compass and Glonass/Galileo Qualcomm Snapdragon and Qualcomm Adreno are products of Qualcomm USB Technologies, Inc.
    [Show full text]
  • Smart Link Homeplug Av2 1200Mbps with Pass Through
    SMART LINK HOMEPLUG AV2 1200MBPS WITH PASS THROUGH OVERVIEW The Solwise PL1200 Smart Link HomePlug AV2 1200Mbps AC Pass-Thru Ethernet Adapter embarks on a concept of No New Wires ® data communications, and transforms your in-house powerline into a networking infrastructure. It provides SmartLink Plus coupling to the Line-Neutral pair and the Line-Ground pair of the AC mains. It successfully reduces “dead spot” and increases throughput and network coverage within a home. Surf the Internet and share data at speeds of up to 1200Mbps PHY rates through powerline in any outdoor environment and rest assured with the best security from eavesdroppers through encryption on the power circuit. PL1200 Smart Link HomePlug engine utilizes a Qualcomm Atheros QCA7500 chipset and a QCA8334 Giga Ethernet chipset. IC QCA7500 provides HPAV2 SISIO and MIMO dual integrated line drivers. Two transmitters possible to transmit on any two of three plug pairs: Line, Neutral and Ground. PHY layer takes single PB stream and segments into two independent bit streams. Two receivers provide independent bit streams and recombines into a single PB stream. It features faster processing power and Fast Ethernet host interfaces. The solution is in compliance with the IEEE1901 , Homeplug AV and Homeplug AV2, hence allowing hassle-free compatibility with existing Homeplug AV devices and other suppliers of IEEE1901 PLC (Powerline Line Communication) devices. Enhanced Quality of Service (QOS) also provides the guaranteed bandwidth reservations for multimedia payloads including HDTV, SDTV over IP (IPTV), higher data rate broadband sharing, Online-Gaming, VoIP Calls, extending Wireless LANs coverage, printer and peripheral sharing, Audio-Video transmission across the network and Network camera connectivity as well.
    [Show full text]
  • 802.11Ac Wave 2 with MU-MIMO: the Next Mainstream Wi-Fi Standard
    RF & Wireless 802.11ac Wave 2 with MU-MIMO: The Next Mainstream Wi-Fi Standard RF & Wireless Components (RFWC) Report Snapshot The 802.11ac Wave 2 standard provides significant benefits to users and a better Wi-Fi user experience compared to 802.11n and 802.11ac Wave 1. Despite low initial consumer awareness and OEM concerns over client device availability, OEMs, service providers and enterprises have embraced the standard, which is now gaining rapid traction and will become the highest shipping Wi-Fi standard yet. November 2015 Christopher Taylor Tel: (617) 614-0706 Email: [email protected] www.strategyanalytics.com RF & Wireless Contents 1. Executive Summary 3 2. WLAN Terminology 3 3. Market Growth & Standards 4 3.1 Evolution of Wi-Fi 4 4. Benefits of MU-MIMO Under 802.11ac Wave 2 6 4.1 How Wave 2 Works 7 4.2 More Technical Considerations of Wave 2 MU-MIMO 7 5. Wave 2 and the Wi-Fi Infrastructure Market 8 5.1 Wave 2 for Residential 9 5.2 Wave 2 for Enterprise 13 6. Client Devices 15 7. Conclusions & Implications 17 Exhibits Exhibit 1 Typical Residential or Small Office Wi-Fi Network ..................................................................................3 Exhibit 2 Wi-Fi Device Historical Shipments ..........................................................................................................4 Exhibit 3 Future Evolution of Mainstream Wi-Fi Standards....................................................................................5 Exhibit 4 802.11ac Wave 1 (SU-MIMO) Vs. Wave 2 (MU-MIMO)..........................................................................6
    [Show full text]