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H181 Wifi Module H181 WiFi Module Product Specification 802.11b/g/n 1T1R WiFi Module Version Ver1.0 History Document Release Date Modification Initials Approved Version V1.0 2020/05/06 Overview H181 is a highly integrated 2.4 GHz Wi-Fi SoC that packs the IEEE 802.11b/g/n baseband and RF circuit. The RF circuit consists of the power amplifier (PA), low noise amplifier (LNA), RF balun, antenna switch, and power management module. It supports 20MHz standard bandwidth, and provides a physical layer rate up to 72.2Mbit/s. The Hi3881V100 Wi-Fi baseband supports the orthogonal frequency division multiplexing (OFDM) technology and is backward compatible with the direct sequence spread spectrum (DSSS) and complementary code keying (CCK) technologies, offering various data rates defined in the IEEE 802.11 b/g/n protocol. Hi3881V100 integrates a high-performance 32-bit microprocessor, a hardware security engine. Hi3881V100 SoC is applicable to IPC,IoT low-power intelligent products such as smart home appliances, intelligent lock, set box etc . Key Specifications General Specifications 1x1 2.4GHz frequency band (channels 1–11) PHY supporting IEEE 802.11b/g/n MAC supporting IEEE 802.11d/e/h/i/k/v/w Built-in PA and LNA, integrated with TX/RX Switch and Balun Station (STA) and access point (AP) modes, up to six STA devices allowed for access as an AP WFA WPA, WFA WPA2 personal, and WPS2.0 2/3/4-line PTA solution with BT and BLE chips coexisting Input voltage range: 2.3–3.6 V；I/O power voltage: 1.8 V or 3.3 V RF auto-calibration solution PHY Features All single-antenna data rates of IEEE802.11b/g/n Maximum rate of 72.2Mbit/s@HT20 MCS7 Standard 20MHz bandwidth STBC RX Short GI MAC Features A-MPDU and A-MSDU Blk-ACK QoS Other Information Operating temperature: –40°C to +85°C (–40°F to 185°F) Solution Features Stable and Reliable Communication Capability Reliable communication algorithms, including TPC, automatic rate adjustment, and weak interference immunity in complex environments Flexible Networking 256-node mesh networking Networking with standard 20MHz bandwidth Complete Network Support IPv4/IPv6 network DHCPv4/DHCPv6 client/server DNS client function mDNS function CoAP/MQTT/HTTP/JSON basic components Powerful Security Engine AES128/256 encryption and decryption algorithms HASH-SHA256 and HMAC_SHA256 algorithms RSA and ECC signature verification algorithms Random number generation, compliant with the FIPS 140-2 random test standard TLS/DTLS acceleration Built-in eFUSE, supporting secure storage, secure boot, and hardware ID Built-in MPU feature for memory isolation Module Size（Units: mm） Module Pin definition Pin Function Type Voltage Description 1 GND GND - GND 2 WL_ANT ORF - WLAN RF In/Out 3 GND GND - GND 4 NC NC - NC 5 NC NC - NC 6 NC NC - NC 7 NC NC - NC 8 NC NC NC 9 VBAT IPMU 3.3V VBAT Power Supply 10 NC NC NC 11 NC NC NC 12 POW_ON IANA VDDIO PMU Power ON Enable（0：Power OFF，1：Power ON） 13 WL_WAKE_HOST I/O VDDIO WL_WAKE_HOST 14 SDIO_DAT2 I/O VDDIO SDIO_DAT2 15 SDIO_DAT3 I/O VDDIO SDIO_DAT3 16 SDIO_CMD I/O VDDIO SDIO_CMD 17 SDIO_CLK I VDDIO SDIO_CLK 18 SDIO_DAT0 I/O VDDIO SDIO_DAT0 19 SDIO_DAT1 I/O VDDIO SDIO_DAT1 20 GND GND - GND 21 NC NC NC NC 22 VDDIO IPMU VDDIO IO Power Pin，Support 1.8 or 3.3V 23 NC NC - NC 24 NC NC - NC 25 NC NC - NC 26 NC NC - NC 27 NC NC - NC 28 NC NC - NC 29 NC NC - NC 30 NC NC - NC 31 GND GND - GND 32 NC NC - NC 33 GND GND - GND 34 NC NC - NC 35 NC NC - NC 36 GND GND - GND 37 NC NC - NC 38 NC NC - NC 39 NC NC - NC 40 NC NC - NC 41 NC NC - NC 42 NC NC - NC 43 NC NC - NC 44 NC NC - NC TEST Characteristics 1. TX TEST: Transmit Output Power 802.11b TX :Data Rate=11Mbps Channel 1 2 3 4 5 6 7 8 9 10 11 12 13 TX Pw (dBm) 15.75 15.72 15.17 15.23 15.95 16.04 16.10 15.77 15.79 15.47 15.95 15.56 15.55 EVM (dB) -14.62 -14.65 -14.50 -14.43 -14.69 -15.03 -14.99 -14.85 -14.83 -14.88 -15.06 -15.03 -14.98 Freq.Offset (ppm) -2.90 -3.06 -3.20 -3.18 -3.10 -3.24 -3.20 -3.18 -3.22 -3.24 -3.18 -3.24 -3.26 Criterion: Power > 16dBm, EVM < -10dB, Frequency Offset < ±1 0ppm 802.11g TX : Data Rate= 54Mbps Channel 1 2 3 4 5 6 7 8 9 10 11 12 13 TX Pw (dBm) 15.74 15.70 16.10 16.14 16.04 16.20 15.46 15.85 15.86 15.76 15.36 15.60 15.55 EVM (dB) -27.37 -27.58 -27.73 -27.48 -27.51 -28.33 -28.30 -28.52 -28.70 -28.50 -28.88 -28.88 -29.38 Freq.Offset (ppm) -2.62 -2.66 -2.80 -2.78 -2.78 -2.88 -2.88 -2.82 -2.90 -2.90 -2.86 -2.88 -2.90 Criterion: Power > 14dBm, EVM < -25dB, Frequency Offset < ±10ppm 802.11n(20) MCS7 TX : Data Rate= 65Mbps Channel 1 2 3 4 5 6 7 8 9 10 11 12 13 TX Pw (dBm) 16.36 16.36 15.79 15.87 15.75 15.86 16.22 15.62 15.67 15.66 16.16 16.34 16.28 EVM (dB) -27.40 -27.51 -27.63 -27.61 -27.60 -28.36 -28.38 -28.26 -28.59 -28.28 -28.72 -29.07 -29.30 Freq.Offset (ppm) -2.00 -1.76 -1.92 -1.94 -2.08 -2.26 -2.34 -2.34 -2.50 -2.50 -2.48 -2.56 -2.60 Criterion: Power > 13dBm, EVM < -27dB, Frequency Offset < ±10ppm 2. RX TEST: RX Receiver Sensitivity 802.11b RX : Data Rate = 11Mbps Channel 1 2 3 4 5 6 7 8 9 10 11 12 13 PER (dB) -90 -90 -90 -90 -90 -90 -90 -90 -90 -90 -90 -90 -90 Criterion: (11b,11Mbps)@8% ，PER<-76dBm 802.11g RX : Data Rate= 54Mbps Channel 1 2 3 4 5 6 7 8 9 10 11 12 13 PER (dB) -77 -77 -77 -77 -77 -77 -77 -77 -77 -77 -77 -77 -77 Criterion: (11g,54Mbps)@10% ，PER<-65dBm 802.11n (20) MCS7 RX : Data Rate= 65Mbps Channel 1 2 3 4 5 6 7 8 9 10 11 12 13 PER (dB) -73 -73 -73 -73 -73 -73 -73 -73 -73 -73 -73 -73 -73 Criterion: (11n,HT20,MCS7)@10%，PER<-64dBm Parameter Requirements on Lead-Free Reflow Soldering shows the thermal profile of lead-free reflow soldering Parameters of lead-free reflow soldering Zone Time Heating Rate Peak Temperature Cooling Rate Preheat zone(40～150℃) 60～150s ≤2.0℃/s - - Soak zone(150～200℃) 60～120s <1.0℃/s - - Reflow zone(>217℃) 60～90s - 230～260℃ - Cooling zone(Tmax～180℃) - - - 1.0℃/s≤Slope≤4.0℃/s Note： Preheat zone: The temperate range is 40–150°C (104–302°F), the heating rate must be about 2.0°C/s (36°F/s), and the zone duration must be 60–150s. Soak zone: The temperature range is 150–200°C (302–392°F), the heating rate must be less than 1.0°C/s (34°F/s), and the zone duration must be 60–120s. Slow heating is required; otherwise, soldering is poor. Reflow zone: The zone temperature increases from 217°C (423°F) to Tmax and then decreases to 217°C (423°F) again. The zone duration must be 60–90s. Cooling zone: The zone temperature decreases from Tmax to 180°C (356°F). The cooling rate cannot exceed 4.0°C/s (39°F/s). It should take no more than 6 minutes for the ambient temperature to increase from 25°C (77°F) to 250°C (482°F). The thermal profile shown in the preceding figure provides recommended values. Customers need to adjust the values based on actual production. Typically, the duration of the reflow zone is 60–90s. For the boards with great heat capacity, the duration can be prolonged to 120s. For details about the requirements on package thermal resistance, see the IPC/JEDEC J-STD-020D standard. For details about the method of measuring the package temperature, see the JEP 140 standard. Thermal resistance standard for the lead-free package Volume mm3 Volume mm3 Volume mm3 Package Thickness <350 350～2000 >2000 <1.6mm 260℃ 260℃ 260℃ 1.6mm～2.5mm 260℃ 250℃ 245℃ >2.5mm 250℃ 245℃ 245℃ The component soldering terminals (such as the solder balls and pins) and external heat sinks are not considered for volume calculation. The method of measuring the reflow soldering thermal profile is as follows: According to the JEP140 standard, to measure the package temperature, you are advised to place the temperature probe of the thermocouple close to the chip surface if the chip package is thin, or to drill a hole on the package surface and place the temperature probe of the thermocouple into the hole if the chip package is thick. The second method is recommended based on the thickness of most chip packages. However, this method is not applicable if the chip package is too thin to drill a hole. Federal Communication Commission Statement (FCC, U.S.) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
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