IBM Power 595 Technical Overview and Introduction

Front cover IBM Power 595 Technical Overview and Introduction PowerVM virtualization technology including Live Partition Mobility World-class performance and flexibility Mainframe-inspired continuous availability Charlie Cler Carlo Costantini ibm.com/redbooks Redpaper International Technical Support Organization IBM Power 595 Technical Overview and Introduction August 2008 REDP-4440-00 Note: Before using this information and the product it supports, read the information in “Notices” on page vii. First Edition (August 2008) This edition applies to the IBM Power Systems 595 (9119-FHA), IBMs most powerful Power Systems offering. © Copyright International Business Machines Corporation 2008. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Notices . vii Trademarks . viii Preface . ix The team that wrote this paper . ix Become a published author . .x Comments welcome. .x Chapter 1. General description . 1 1.1 Model overview and attributes . 2 1.2 Installation planning . 4 1.2.1 Physical specifications . 4 1.2.2 Service clearances . 5 1.2.3 Operating environment . 6 1.2.4 Power requirements . 7 1.3 Minimum configuration requirements . 9 1.3.1 Minimum required processor card features. 11 1.3.2 Memory features . 12 1.3.3 System disks and media features . 12 1.3.4 I/O Drawers attachment (attaching using RIO-2 or 12x I/O loop adapters) . 15 1.3.5 IBM i, AIX, Linux for Power I/O considerations . 16 1.3.6 Hardware Management Console models . 17 1.3.7 Model conversion . 18 1.4 Racks power and cooling . 29 1.4.1 Door kit . 30 1.4.2 Rear door heat exchanger . 31 1.4.3 Power subsystem . 31 1.5 Operating system support . 32 1.5.1 IBM AIX 5.3. 33 1.5.2 IBM AIX V6.1 . 33 1.5.3 IBM i 5.4 (formerly IBM i5/OS V5R4) . 34 1.5.4 IBM i 6.1 . 35 1.5.5 Linux for Power Systems summary. 35 Chapter 2. Architectural and technical overview . 37 2.1 System design. 38 2.1.1 Design highlights. 38 2.1.2 Center electronic complex (CEC) . 40 2.1.3 CEC midplane. 42 2.1.4 System control structure (SCS). 43 2.1.5 System controller (SC) card . 47 2.1.6 System VPD cards . 48 2.1.7 Oscillator card . 49 2.1.8 Node controller card . 49 2.1.9 DC converter assembly (DCA) . 50 2.2 System buses . 51 2.2.1 System interconnects . 51 2.2.2 I/O subsystem . 55 2.3 Bulk power assembly . 57 © Copyright IBM Corp. 2008. All rights reserved. iii 2.3.1 Bulk power hub (BPH) . 58 2.3.2 Bulk power controller (BPC) . 60 2.3.3 Bulk power distribution (BPD) . 60 2.3.4 Bulk power regulators (BPR). 61 2.3.5 Bulk power fan (BPF) . 62 2.3.6 Integrated battery feature (IBF). 63 2.3.7 POWER6 EnergyScale . 63 2.4 System cooling . 69 2.5 Light strips. 69 2.6 Processor books . 70 2.6.1 POWER6 processor . 73 2.6.2 Decimal floating point . 76 2.6.3 AltiVec and Single Instruction, Multiple Data . 77 2.7 Memory subsystem . 78 2.7.1 Memory bandwidth . 79 2.7.2 Available memory features . 80 2.7.3 Memory configuration and placement. 81 2.8 Internal I/O subsystem . 82 2.8.1 Connection technology . 83 2.8.2 Internal I/O drawers . 84 2.8.3 Internal I/O drawer attachment . 88 2.8.4 Single loop (full-drawer) cabling . 89 2.8.5 Dual looped (half-drawer) cabling . 90 2.8.6 I/O drawer.

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