DOCSLIB.ORG

Vista Procedure

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Vista Procedure Qualified Vendors List – Devices 1. Power Supplies Model IP-500 HB9024 AcBel R88 PC7063 Aero Cool STRIKE-X 600W CP-850 EA-500D Antec EA-650 EarthWatts Green HCP-1000 AYWUN A1-550-ELITE BQT L7-530W Be quiet BQT S6-SYS-YA-350W Comstars KT-450VE Extreme power plus700W CoolerMaster RS-A00-SPPA-D3 RS-D00-SPHA-D3 AX1500i 75-001971 CMPSU-1000HX CMPSU-850AX Corsair CMPSU-850TXM CS450M 75-010706 RM750 75-001937 Delux DLP-650PG EPM850EWT EnerMAX ERV1050EWT MAXREVO Enertronix EN-300 AX-310HHN FSP PT-650M Geil TTB800G GoldenField ATX-S395 ATX-350P4 GreatWall BTX-500GT HAMER MIT750 Huntkey HK400-55AP JPower SP-1000PS-1M LEPA G1600-MA OCZ OCZ-FTY-750W Power Man IP-S450HQ7-0 LIGHTNING-1000 Rosewill RBR1000-M SS-1000XP SS-1250XM Seasonic SS-760KM S12 II SS-330GB 330W Segotep SG-400PYJ ST-550P-AD Seventeam ST-552PAP ST-800PGD Copyright 2015 ASUSTeK Computer Inc. PAGE 1 Z97-PRO(Wi-Fi ac)/USB 3.1 Model SST-ST1500 SST-ST40F-ES Silverstone SST-ST85F-GS SST-60F-P SF-350P14XE Super Flower SF-550P14PE TOUGHPOWER TPX775 TOUGHPOWER1500A Thermaltake TP-1050AH3CSG TPX-1275M TR2-RX-1200AH3CH 2. Hard Drives 2.1. HDD Devices Type Model HDS723030ALA640 Hitachi HDS724040ALE640 HD103SM Samsung HD322GM ST500DM002 ST500LM000-3Y/P ST750LX003 ST1000DM003 Seagate ST1000DX001 ST2000NM0033 ST3000DM001 SATA 6G ST4000DM000 WD1002FAEX WD10EZEX WD20EFRX WD2002FAEX WD25EZRX WD WD30EFRX WD30EZRX WD4001FAEX WD5000AAKX WD5000HHTZ Copyright 2015 ASUSTeK Computer Inc. PAGE 2 Z97-PRO(Wi-Fi ac)/USB 3.1 Type Model Hitachi HDS721050CLA362 ST3750528AS Seagate ST95005620AS SATA 3G HDP725050GLA360 Simmtrnics WD10EADS Toshiba MK5061SYN 2.2. SSD Devices Type Model ADATA ADATA S511-120G Apacer AS510S-128GB CT256M4SSD1 Crucial M500 240GB CSSD-F120GB3-BK Corsair Force GS 240GB NEUTRON GTX-240GB Fujitsu SSD-FSA-128G 330 Series-120G 335 Series-180G Intel 520 Series-120G 530 Series-120G 730 Series-240G HyperX 3K SH103S3-120GB KC300S37A-120GB SATA 6G Kingston SVP200S37A V300-128GB AGT3-25SAT3-120G VTX4-25SAT3-128G OCZ VTX450-25SAT3-256G VTX460-25SAT3-256G PATRIOT PW120GS25SSDR Plextor M5 PRO PX-256M5S 830 SERIES 128GB Samgsung 840 EVO 840 PRO SERIES 128GB Seagate ST120HM000 Team TG120GS25AS3M Tigo S500-120GB Copyright 2015 ASUSTeK Computer Inc. PAGE 3 Z97-PRO(Wi-Fi ac)/USB 3.1 Type Model Intel SSDSA2CW1203K5 Kingston SVP100-S2 SATA 3G MemoRight FTM-25 Team TG120GS25ACEM Transcend TS128GSSD25S-M Apacer T60 A200-M 128G Intel 530 SSDSCKGW080A401 80GB Liteon LITEON-LGT-256M6G-2280-256GB Kingston RBU-SNS6100S3/128GC-2260-128GB M.2 SATA RBU-SNS6100S3/256GC-2260-256GB X110-2260-128GB Sandisk X110-2260-256GB Samsung MZ-NPD1280-2280-128GB (Support on ISRT 13.1) Liteon LJT-128B1P-2260-128GB Plextor PX-G128M6E M.2 PCIe A110-SD6PP4M-128G Sandisk A110-SD6PP4M-256G Samsung XP941 (UEFI RAID only) *When the plugged M.2 PCIe SSDs are used as the OS drive and IRST cache at the same time, ensure the “Launch CSM” is set to [Disabled] in BIOS. Meanwhile, for the M.2 SSDs that contained OPROM, contact the SSDs’ vendors for Microsoft signed UEFI drivers. Otherwise, they will be only available for the data drive usage. Check the manual of Intel Desktop Responsiveness Technologies for the details of IRST setup. 2.3. PCIE SSD Type Model ASUS ASUS RAIDR EXPRESS 240G PCIE OCZSSDPX-ZD2P88512G OCZ RevoDrive3 MAX IOPS Copyright 2015 ASUSTeK Computer Inc. PAGE 4 Z97-PRO(Wi-Fi ac)/USB 3.1 3. Peripheral 3.1. USB Storage 3.1.1. Card Readers Type Model KINYO KCR-318 USB 3.0 SanDisk Extreme PRO UHS-II SD Reader USB 2.0 EasyATM K100 3.1.2. External Enclosures Type Model Nobility NH13 500GB ADATA SE720 128G SSD AGESTAR 3U2B3A AKITIO ADRIVE-U3-240GB ARCHGON MH-2619-U3-640GB HD-LB2.0TU3-A2 HD-LX2.0TU3-AP Buffalo HD-PATU3 1TB HDW-P500U3-AP-500GB BYTECC T-200U3 docking station S25U3-6GUASP CyberSLIM S2-U3C-6G iomega eGo 2TB LACIE Rugged 1TB 3548RUS3 USB 3.0 ORICO 8618SUS3 OYEN DIGITAL MiniPro FW800/USB 3.0 SSD 128GB RATOC RS-EC3-U3 Seagate 1AYBA2-1TB Silcon Power ARMOR A30 STARDOM SR2-WBS3 BlackX Duet 5G Thermaltake Max 5G Transcend TS500GSJ25H3P UNITEK Y-1077 NST-330SU3-BK VANTEC NST-D300S3 My Passport Edge 500G WD My Passport Enterprise WDBHEZ5000ABK My BOOK 3.0-3TB Thermaltake BlackX Duet USB 2.0 VANTEC NST-D100FBSU WD ELEMENTS SE 1TB Copyright 2015 ASUSTeK Computer Inc. PAGE 5 Z97-PRO(Wi-Fi ac)/USB 3.1 Type Model Buffalo HD-PATU3-1TB Rugged 1TB LACIE THUNDERBOLT Little Big Disk 1TB Thunderbolt PROMISE PEGASUS R6 Seagate GoFlex Thunderbolt(STAE121) WD My Book Thunderbolt Duo 4TB Buffalo HDW P500U3 AP 500GB WiFi Seagate 1AYBA2 1TB 3.1.3. USB Pen Drives Type Model ADATA UE700 64G APACER AH350 32GB CMFSV3 32GB Corsair CMFVY3S 32GB VOYAGER GTX 128GB IN-TECH USB3.0 FLASH 64GB KINGMAX UI-06 32GB DataTraveler Workspace 32GB DT100G3 64GB KINGSTON DTHX30 64GB DTU30G3 32GB LEXAR S73 32GB MACH XTREME MX-ES 32GB USB 3.0 MUSHKIN MKNUFDVS32GB 32GB PATRIOT SUPERSONIC MAGNUM 256GB T3 32GB PNY TURBO PLUS 128GB Thunder 1 PQI I-mini 32GB Pretec i-Disk Rex250 128GB Sandisk SDCZ80 16GB SILICON POWER MARVEL M60 64GB SONY USM32GQX 32GB SUPERTALENT EXPRESS RC4 128GB TEAM T132 64GB TOSHIBA EXII 64GB Transcend TS32GJF780 32GB KINGMAX Super Stick mini 16GB PEF32GUSB 32GB PATRIOT XPORTER MAGNUM 210X 64GB PNY PFU6016-BC 16GB USB 2.0 PQI I828 16GB SanDisk CZ8 16GB Team Fusion Plus II F105+ 8GB Toshiba U2P-016GTA 16GB Copyright 2015 ASUSTeK Computer Inc. PAGE 6 Z97-PRO(Wi-Fi ac)/USB 3.1 3.1.4. USB Hubs Type Model TUH300 TekRepublic TUH3400 USB 3.0 TRANSCEND TS-HUB3K SIIG JU-H40512-S2 ORICO W8PH4 BELKIN F5U237 USB 2.0 D-Link DUB-H7 SANWA 236SV 3.2. Audio 3.2.1. Audio Decoder Type Model PIONEER VSX-1020-K SPDIF Yamaha DSP-AX4600 3.2.2. Earphone Devices Type Model Philips SHM3100 Line Out VIONET Audio350 3.2.3. Microphone Devices Type Model KOSS SB45 MIC In Philips SHM3100 3.2.4. Sound Adapters Type Model ASUS ROG XONAR PHOEBUS PCIEX1 Creative Creative BLASTER Z ASUS STRIX DSP XONAR U7 Sound Blaster E1 USB 2.0 Creative Sound Blaster Omni Surround 5.1 SB1560 SADES SA901C SOMIC G909 3.2.5. Speaker Type Model Line out Logitech X530 Copyright 2015 ASUSTeK Computer Inc. PAGE 7 Z97-PRO(Wi-Fi ac)/USB 3.1 3.3. Controller Cards 3.3.1 Graphic Cards Type Model HD5450-SL-2GD3-L (BIOS:V68F9.12.20.0.62.AS10) ARES2-6GD5-2D4S (BIOS: V6798.15.29.0.4.AS01M.U2 V6798.15.29.0.4.AS01M.U3) EAH6750 FML/DI/1GD5 (BIOS:V12.20.50.AS01) EAH6770/DI/1GD5 (BIOS: V12.20.0.50.AS05) EAH6990/3DI4S/4GD5 (BIOS: V671D.13.11.0.14.AS01) HD6450-SL-2GD3-L (BIOS:V6779.13.12.0.41.AS06) HD6570-2GD3-L (BIOS:V6759.13.12.0.41.AS06) HD7750 -1GD5-V2ASUS HD7750-O-1GD5-DIS(C445PI) (BIOS: V683F.15.14.0.4.AS01) HD7770 -DC-1GD5-V2 HD7770-DCO-1GD5-2DIS(C441PI) ASUS (BIOS: V683D.15.14.0.1.AS02) HD7790-DC2OC-1GD5 (BIOS: V665C.15.32.0.1.AS02) HD7790-DC2OC-2GD5 AMD Chipset (BIOS: V665C.15.32.0.1.AS07) HD7850-DC2T-2GD5-DI2S (C403)(BIOS: V6819.15.17.0.0.AS02) HD7870 -DC2-2GD5 HD7870-DC2O-2GD5-DI2S(C401) (BIOS:V6818.15.15.0.2.AS01) HD7970/3GD5/DI2S (BIOS: V6798.15.12.0.4.AS02) HD7970-DC2-3GD5 (BIOS:V6798.15.12.0.4.AS08) HD7990-6GD5-1D4S (BIOS: V679B.15.32.0.4.AS01M V679B.15.32.0.4.AS01S) Matrix HD7970-P-3GD5 (BIOS: V6798HB.15.32.0.0.AS02 U2/U3) R7250-DI-1GD5 (UEFI VBIOS: V6610HB.15.38.0.0.AS01) HD6570 Vortex/1G/DDR5 PowerColor (BIOS :V013.012.000) HD7750 ICEQ X Turbo/1GB/GDDR5 HIS H775QLT1G2M/1GB/128bit/GDDR5 (BIOS: V015.021.000.000.000000) R7770-1024GD5 P1 Yeston (BIOS: V015.020.000.000.000000) Copyright 2015 ASUSTeK Computer Inc. PAGE 8 Z97-PRO(Wi-Fi ac)/USB 3.1 Type Model EN210/DI/512MD2/A (BIOS:70.18.2D.00.AS01) GT610 SL 1GD3 L GT610-SL-1GD3-DI(C1310M) (BIOS: V75.19.55.00.AS01) GT620 1GD3 L GT620-1GD3-D I(C1071PLM) (BIOS: 70.08.AD.00.AS01) GT630-4GD3 (BIOS: V70.08.B1.00.AS07) GT630-SL- 2GD3-L (BIOS: V80.28.3E.00.AS01) GT640 2GD3 GT640-2GD3-2DI(C2011PI) (BIOS: 80.07.26.00.AS01) GTX 650-E 2GD5 (BIOS: V80.07.35.00.AS13) ASUS GTX 650TIB DC2OC 2GD5 (BIOS: V80.06.59.00.AS01) nVidia Chipset GTX Titan (BIOS: V80.10.2C.00.AS01) GTX650-DC-1GD5 (BIOS: V80.07.35.00.AS04) GTX660 DC2T 2GD5 (BIOS: V80.06.10.00.AS04) GTX670-DC2-4GD5 (BIOS: V80.04.31.00.AS07) GTX680-2GD5 (BIOS: V80.04.09.00.AS01) GTX690-4GD5 (BIOS: V80.04.1E.00.AS01) GTX780-3GD5-2DIS (UEFI BIOS: V80.10.36.00.AS01) GTX780Ti-3GD5-2DIS (UEFI BIOS: V80.80.30.00.AS01) GV-N670C-2GD Gigabyte (BIOS: V80.04.19.00.2E) NE5X660S1049-1060F Palit (BIOS: V80.06.59.00.2C) 3.3.2. 1394 Cards Type Model PCIEX1 Rosewill RC-504 3.3.3. SATA/SAS Controller Cards Type Model PCIEX1 SYBA SI-PEX40064 ASUS U3S6-1.02G PCIEX4 HighPoint Rocket 640L PCIEX8 ATTO ExpressSAS H6F0 GT 3.3.4. SATA RAID Controller Cards Type Model PCIEX1 Adaptec AAR-1220SA (BIOS: V6.0-0 Build 2330) Copyright 2015 ASUSTeK Computer Inc. PAGE 9 Z97-PRO(Wi-Fi ac)/USB 3.1 3.3.5.
Load more

Recommended publications
  • COST to COST Toshiba 2600 MORA 1St Floor, Farm Bhawan, 14-15 Nehru Place WD 2700 Seagate 2800 8GB-189/- 16GB-284/- Rate List Date: 05/09/2015
    PEN DRIVE HDD 500 GB COST TO COST Toshiba 2600 MORA 1st Floor, Farm Bhawan, 14-15 Nehru Place WD 2700 Seagate 2800 8GB-189/- 16GB-284/- Rate List Date: 05/09/2015 A-DATA SSD (M-sata) 32GB 1790 40 AMD SEMPRON (2650) 2142 81 GIGABYTE H170- GAMING 3(11 10990 122 ASUS M5A78L-M/USB3 4090 41 AMD SEMPRON 145 1590 82 GIGABYTE H170- MD3H (1151) 8990 123 GIGABYTE AM1M-S2H 1990 CPU INTEL 42 AMD TRINITY A10 9190 83 GIGABYTE H81M-S (1150) 3090 124 GIGABYTE 78LMT-S2 2990 1 INTEL CELERON (G470)(1155) 2090 43 AMD TRINITY A4 2790 84 GIGABYTE Z170- D3H (1151) 12090 125 GIGABYTE 78LMT-USB 3 3990 2 INTEL DUAL CORE (G-2030)(115 3290 44 AMD TRINITY A6 3990 85 GIGABYTE Z170 GAMING 5 (11 17290 126 GIGABYTE 970A- DS3P 5290 3 INTEL DUAL CORE (G-3220)(115 3240 45 AMD TRINITY A8 5990 86 GIGABYTE Z170 GAMING 7 (11 20290 127 GIGABYTE A58M-S1 2990 4 INTEL DUAL CORE (G-3240)(115 3400 87 GIGABYTE Z170- MD3H (1151) 11290 128 GIGABYTE A68H-S-1 3390 5 INTEL E3 1220 V3 (SERVER) 13990 88 GIGABYTE ATOM KIT (J1800M-D 3790 129 GIGABYTE A88XM D3H 6290 6 INTEL E3 1230 V3 (SERVER) ASK BOARD INTEL CPU 89 GIGABYTE B85M D3H (1150) 5390 7 INTEL E3 1246 V3 (SERVER) ASK 46 ASROCK B85 (B95M-DGS)(1150 4190 90 GIGABYTE B85M DS3H-A (1150) 4990 8 INTEL I-3 (3220) (1155) 6590 47 ASROCK B85 M (1150) 5190 HARD DISK 91 GIGABYTE G1 SNIPER M5 (Z 87) 14490 9 INTEL I-3 (4130) (1150) 7090 48 ASROCK H61M-S1 PLUS (1155) 2890 130 1 TB WD BLACK CAVIOUR 5142 92 GIGABYTE GA H61M S (1155) 2990 10 INTEL I-3 (4150) (1150) 7090 49 ASROCK H61-VS4 2590 131 1 TB WD LAPTOP (2 YEAR) 3895 93 GIGABYTE GA- Z77M-D3H
    [Show full text]
  • North American Company Profiles 8X8
    North American Company Profiles 8x8 8X8 8x8, Inc. 2445 Mission College Boulevard Santa Clara, California 95054 Telephone: (408) 727-1885 Fax: (408) 980-0432 Web Site: www.8x8.com Email: [email protected] Fabless IC Supplier Regional Headquarters/Representative Locations Europe: 8x8, Inc. • Bucks, England U.K. Telephone: (44) (1628) 402800 • Fax: (44) (1628) 402829 Financial History ($M), Fiscal Year Ends March 31 1992 1993 1994 1995 1996 1997 1998 Sales 36 31 34 20 29 19 50 Net Income 5 (1) (0.3) (6) (3) (14) 4 R&D Expenditures 7 7 7 8 8 11 12 Capital Expenditures — — — — 1 1 1 Employees 114 100 105 110 81 100 100 Ownership: Publicly held. NASDAQ: EGHT. Company Overview and Strategy 8x8, Inc. is a worldwide leader in the development, manufacture and deployment of an advanced Visual Information Architecture (VIA) encompassing A/V compression/decompression silicon, software, subsystems, and consumer appliances for video telephony, videoconferencing, and video multimedia applications. 8x8, Inc. was founded in 1987. The “8x8” refers to the company’s core technology, which is based upon Discrete Cosine Transform (DCT) image compression and decompression. In DCT, 8-pixel by 8-pixel blocks of image data form the fundamental processing unit. 2-1 8x8 North American Company Profiles Management Paul Voois Chairman and Chief Executive Officer Keith Barraclough President and Chief Operating Officer Bryan Martin Vice President, Engineering and Chief Technical Officer Sandra Abbott Vice President, Finance and Chief Financial Officer Chris McNiffe Vice President, Marketing and Sales Chris Peters Vice President, Sales Michael Noonen Vice President, Business Development Samuel Wang Vice President, Process Technology David Harper Vice President, European Operations Brett Byers Vice President, General Counsel and Investor Relations Products and Processes 8x8 has developed a Video Information Architecture (VIA) incorporating programmable integrated circuits (ICs) and compression/decompression algorithms (codecs) for audio/video communications.
    [Show full text]
  • Final 2014 Return Shares for Electronics Manufacturers Washington State Electronic Products Recycling Program 4/24/2014
    Final 2014 Return Shares for Electronics Manufacturers Washington State Electronic Products Recycling Program 4/24/2014 The E-Cycle Washington program conducted 42 sampling events in 2013 gathering data on over 13,600 TVs, monitors and computers. That data was used to determine Return Share by manufacturer, summarized below. Identified Proportional Total Manufacturer Name Weight (lbs) Brands Return Orphan* Return Share (%) Share (%) Share (%) 605484 92.80937069 Sony Electronics, Inc. 66834 11.04 0.86 11.89 Panasonic Corporation of North America 54226 8.96 0.69 9.65 Philips Electronics 47779 7.89 0.61 8.50 Toshiba America Information Systems, Inc. 43922 7.25 0.56 7.82 Dell Computer Corp. 43199 7.13 0.55 7.69 Thomson, Inc. USA 43078 7.11 0.55 7.67 Hewlett Packard 26370 4.36 0.34 4.69 JVC Americas Corp. 25979 4.29 0.33 4.62 Sharp Electronics Corporation 20274 3.35 0.26 3.61 Acer America Corp. 19327 3.19 0.25 3.44 LG Electronics USA, Inc. 18656 3.08 0.24 3.32 Mitsubishi Electric Visual Solutions America, Inc. 17906 2.96 0.23 3.19 Osram Sylvania 15226 2.51 0.19 2.71 Samsung Electronics Co. 14872 2.46 0.19 2.65 Apple 14537 2.40 0.19 2.59 Hitachi America, LTD. Digital Media Division 11235 1.86 0.14 2.00 ViewSonic Corp. World HQ 9934 1.64 0.13 1.77 Emerson Radio Corp. 7163 1.18 0.09 1.27 General Electric Co. 5691 0.94 0.07 1.01 NEC Display Solutions 4833 0.80 0.06 0.86 TMAX Digital, Inc.
    [Show full text]
  • Driver Download Instructions
    Download Instructions Microtek Scanmaker 6700 Usb Driver 8/13/2015 For Direct driver download: http://www.semantic.gs/microtek_scanmaker_6700_usb_driver_download#secure_download Important Notice: Microtek Scanmaker 6700 Usb often causes problems with other unrelated drivers, practically corrupting them and making the PC and internet connection slower. When updating Microtek Scanmaker 6700 Usb it is best to check these drivers and have them also updated. Examples for Microtek Scanmaker 6700 Usb corrupting other drivers are abundant. Here is a typical scenario: Most Common Driver Constellation Found: Scan performed on 8/15/2015, Computer: Toshiba Dynabook T451/59DB Outdated or Corrupted drivers:10/21 Updated Device/Driver Status Status Description By Scanner Motherboards Corrupted By Microtek Scanmaker Intel(R) N10/ICH7 Family PCI Express Root Port - 27D4 6700 Usb Mice And Touchpads Synaptics ThinkPad UltraNav Pointing Device Up To Date and Functioning Usb Devices Corrupted By Microtek Scanmaker Microsoft PM23300 6700 Usb Corrupted By Microtek Scanmaker usb-audio.de Burr-Brown USB Audio Codec 2706 (commercial 2.8.45) 6700 Usb Sound Cards And Media Devices NVIDIA NVIDIA GeForce GT 635M Up To Date and Functioning AVerMedia AVerMedia M791 PCIe Combo NTSC/ATSC Up To Date and Functioning Network Cards ASIX ThinkPad OneLink Dock USB GigaLAN Up To Date and Functioning Keyboards Microsoft HID Keyboard Up To Date and Functioning Hard Disk Controller NVIDIA NVIDIA nForce3 Parallel ATA Controller Outdated Others Intel Intel(r) AIM External Flat Panel
    [Show full text]
  • Product Line Card
    Product Line Card 3Com Corporation ATI Technologies Distribution CCT Technologies 3M Attachmate Corporation Century Software 4What, Inc. Autodesk, Inc. Certance 4XEM Avaya, Inc. Certance LLC Averatec America, Inc. Chanx Absolute Software Avocent Huntsville Corp. Check Point Software ACCPAC International, Inc. Axis Communications, Inc. Cherry Electrical Products Acer America Corporation Chicony Adaptec, Inc. Barracuda Networks Chief Manufacturing ADC Telecommunications Sales Battery Technology, Inc. Chili Systems Addmaster Bay Area Labels Cingular Interactive, L.P. Adesso Bay Press & Packing Cisco Systems, Inc. Adobe Systems, Inc. Belkin Corporation CMS Products, Inc. Adtran Bell & Howell CNET Technology, Inc. Advanced Digital Information BenQ America Corporation Codi Advanced Micro Devices, Inc. Best Case & Accessories Comdial AEB Technologies Best Software SB, Inc. Computer Associates Aegis Micro/Formosa– USA Bionic CCTV ComputerLand AI Coach Bionic Video Comtrol Corporation Alcatel Internetworking, Inc. Black Box Connect Tech All American Semi Block Financial Corel Corporation Allied Telesyn BorderWare Corporate Procurement Altec Lansing Technologies, Inc. Borland Software Corporation Corsair Althon Micro Boundless Technologies, Inc. Corsair Altigen Brady Worldwide Countertrade Products Alvarion, Inc. Brands, Inc. Craden AMCC Sales Corp. Brenthaven Creative Labs, Inc. AMD Bretford Manufacturing, Inc. CRU-Dataport American Portwell Technology Brooktrout Technology, Inc. CryptoCard American Power Conversion Brother International Corporation CTX Anova Microsystems Buffalo Technology/Melco Curtis Young Corporation Antec, Inc. Business Objects Americas AOpen America, Inc. BYTECC Dantz Development Corp. APC Data911 Arco Computer Products, LLC Cables To Go, Inc. Datago Ardence Cables Unlimited Dataram Areca. US Caldera Systems, Inc. Datawatch Corporation Arima Computer Cambridge Soundworks Decision Support Systems Artronix Canon USA Inc. Dedicated Micros Aspen Touch Solutions, Inc. Canton Electronics Corporation Dell Astra Data, Inc.
    [Show full text]
  • Managing Electronic Manufacturing Service (EMS) – Terry Gou and the Making of Foxconn
    Kindai Management Review Vol. 4, 2016 (ISSN: 2186-6961) Managing Electronic Manufacturing Service (EMS) – Terry Gou and the Making of Foxconn Ho-Don Yan Feng Chia University, Taiwan Abstract To explain how Foxconn has become the global number one provider of electronic manufacturing service (EMS), this paper incorporates three main driving forces—entrepreneurship, strategic management, and leadership—to study how they contribute towards opportunity discovery, capa- bility accumulation, and firm transformation. By dividing the growth path of Foxconn into four stages, including initiation, expansion, maturity, and diversification, we examine how at each stage these three driving forces help in the making of Foxconn. We conclude that high and fast growth is no guarantee for firm endurance. The limitation of expansion in the EMS industry and impend- ing succession problem pose challenges for the longevity of Foxconn. Keywords: strategic management, dynamic capability, entrepreneurship, leadership, mergers and acquisitions, competitive advantage equipment manufacturing (OEM) (Hobday, 2001), INTRODUCTION one of the forms of EMS. Many small and medium The making of Foxconn Group (known as Hon Hai sized enterprises (SMEs) in Taiwan have succeeded in Taiwan) is associated with the prevalence of in collaborating with MNCs to improve their pro- electronics manufacturing service (EMS), which is ductivity and to benefit from fast growth (Krywulak used by firms that design, test, manufacture, dis- and Kukushkin, 2009). tribute, and provide repair services for electronics With a humble start at making plastic TV knobs components and assemblies for global brands of in 1974, Foxconn transformed itself in the 1990s multinational corporations (MNCs) (Lüthje, 2002; into producing connectors and entered the personal Zhai et al., 2007).
    [Show full text]
  • Logos De Fabricantes De Semiconductores Semiconductor Manufacturers Logos
    2013 Logos de fabricantes de semiconductores Semiconductor manufacturers logos EugenioNieto Vilardell Fidestec 15/03/2013 Logos de fabricantes de semiconductores 2013 2 8x8 Acer Acer Laboratories Acrian Actel ADDtek ADMtek Advanced Analogic Technology Advanced Communication Devices(ACD) Advanced Hardware Architectures Advanced Linear Devices Advanced Micro Devices(AMD) Advanced Micro Systems Advanced Monolithic Systems Advanced Power Technology Aeroflex Agere (formerly Lucent) Agilent Technologies Aimtron AITech International aJile Systems AKM Semiconductor Alchemy Semiconductor Alesis Semiconductor Allayer Communications(Now Broadcom) Allegro Microsystems Alliance Semiconductor Alogics Alpha & Omega Semiconductor Alpha Industries Alpha Microelectronics Alpha Semiconductor(Now Sipex) Altera Altima Communications AME Inc American Microsystems American Power Devices Logos de fabricantes de semiconductores 2013 3 AMIC Technology Anachip ANADIGICS Anadigm Analog Devices Analog Express Corp. Analog Integrations Corporation Analog Systems Anchor Chips Andigilog Anpec Ansaldo (Now Poseico) Apex Microtechnology API NetWorks Arizona Microtek ARK Logic Array Microsystems Astec Semiconductor AT&T ATAN Technology ATecoM ATI Technologies Atmel Auctor AudioCodes AUK Semiconductor Corp. Aura Vision Aureal Aurora Systems Austin Semiconductor Austria Mikro Systeme International Avance Logic Avantek Averlogic Avic Electronics Corp. AXElite Technology Co., Ltd BCD Semiconductor Manufacturing Limited Bel Fuse Logos de fabricantes de semiconductores 2013
    [Show full text]
  • Brand Association List Is Your Registration up to Date?
    Last updated: 7/30/19 Brand Association List Below is the list of brands used in the 2020 Tier Assignment Schedule for Washington’s Electronic Product Recycling Program. Brands are associated with the responsible manufacturer. The manufacturers listed are those Ecology has identified as the brand owners of electronic products covered by this program (computers, monitors, laptops, televisions, portable DVD players, tablets, and e-Readers). Is Your Registration Up to Date? • Manufacturers who own additional brands of covered electronic products not currently registered must add those brands to their registration. • Brand owners of covered electronic products that are not on this list must register as a new participant. • Access your registration by going to our webpage for manufacturers and clicking “Submit my annual registration.” If you have questions, please contact Jade Monroe at 360-407-7157 or [email protected]. Brand Manufacturer 2go PC Computer Technology Link 3D Corporation 3D Corporation 3M Dynapro 3M Touch Systems 4th Dimension Computer 4th Dimension Computer 888 (Chinese Characters) Fry's Electronics, Inc. Abacus Abacus Office Machines ABS ABS Computer Technologies Inc ABS Newegg ACC Tech ACC Tech ACC Tech Angel Computer Systems Inc Access HD GXi International Accu Scan J.C. Penney Corporation, Inc. Accurian General Wireless Operations Inc dba RadioShack Accuvision QubicaAMF Acer Acer America Corp ACI Micro ACI Micro ACW Computer Warehouse of Central Florida, Inc ADEK ADEK Industrial Computers Ademco Honeywell ACS Division ADP ADP ADT ADT LLC dba ADT Security Services ADVENT VOXX International Corp. Affinity Kith Consumer Product Inc. AFUNTA Afunta LLC Last updated: 7/30/19 AG Neovo AG Neovo Technology Corp Agasio Amcrest Technologies LLC AGPTEK Mambate USA, Inc.
    [Show full text]
  • 2005 Annual Report(PDF/2823KB)
    Information updated to 2006.04.20 48 2005 Annual Report Key figures Unit: NT$ million Year 2001 2002 2003 2004 2005 Sales Revenue 58,820 93,229 108,699 147,770 124,407 Net Income 3,031 7,400 7,500 7,619 (5,226) Net Margin (%) 5 8 7 5 (4) Retroactively Adjusted Earnings Per Share (NT$/share) 1.32 3.08 3.03 3.10 (2.12) Net Asset Value 28,141 41,278 45,462 49,078 44,431 Note: All financials are non-consolidated figures (Taiwan parent company level) 48 2005 Annual Report Message To Our Shareholders Our Shareholders To Message Dear Esteemed BenQ Shareholders, BenQ announced in June 2005 it will acquire Siemens AG’s mobile handset business (Siemens MD) in an acquisition that successfully propelled BenQ onto the global stage as a renowned brand. Following the closing of the acquisition, we began our first step in Q4 of 2005 when the Company incurred a net loss of 5.2 billion NT$ in 2005, translating to a loss of 2.12 NT$ per share on revenue of NT$ 162.3 billion on consolidated basis. Since fourth quarter 2005, we have worked seamlessly with our Germany-based co-workers and re-enforced managerial resources in areas where BenQ has a strong comparative advantage. In a truly complementary merger of mobile handset assets without breaking our stride, we introduced twelve breathtaking new handsets in Q1 of 2006. Since October, the Company has undertaken restructuring initiatives to cut costs, to accelerate time-to-market for new products, and to restore customer confidence.
    [Show full text]
  • O:\BPJ 2001\BPJ 2001 Final\Fina
    The Silicon Valley-Hsinchu Connection, Saxenian The Silicon Valley-Hsinchu Connection: Technical Communities and Industrial Upgrading AnnaLee Saxenian Silicon Valley in California and the Hsinchu-Taipei region of Taiwan are among the most frequently cited ‘miracles’ of the information technology era. The dominant ac- counts of these successes treat them in isolation, focusing either on free markets, multina- tionals or the state. This paper argues that the dynamism of these regional economies is attributable to their increasing interdependencies. A community of US-educated Tai- wanese engineers has coordinated a decentralized process of reciprocal industrial up- grading by transferring capital, skill, and know-how and by facilitating collaboration between specialist producers in the two regions. This case underscores the significance of technical communities and their institutions in diffusing ideas and organizing produc- tion at the global as well as the local level. Silicon Valley in California and the Hsinchu-Taipei region of Tai- wan are among the most frequently cited ‘miracles’ of industrializa- tion in the information technology era. Since the region’s transforma- tion from an agricultural valley into the birthplace of the semicon- ductor industry in the 1950s, Silicon Valley firms have pioneered a wide range of technology-related industries. The regional economy has adapted flexibly to fast changing markets, and local producers continue to define the state-of-the-art in successive generations of tech- nology—from semiconductor equipment, personal and handheld com- puters, and networking hardware and software, to biotechnology, mul- timedia software, and internet-related infrastructure and services. Taiwan’s technology achievements are more recent, but no less impressive.
    [Show full text]
  • China's Labor Question
    Christoph Scherrer (Ed.) China’s Labor Question Rainer Hampp Verlag München, Mering 2011 Bibliographic information published by the Deutsche Nationalbibliothek Deutsche Nationalbibliothek lists this publication in the Deutsche Nationalbibliografie; detailed bibliographic data are available in the Internet at http://dnb.d-nb.de. ISBN 978-3-86618-387-2 Picture on cover: Workers are seen inside a Foxconn factory in the township of Longhua in the southern Guangdong province May 26, 2010 (reproduced by permission of REUTERS/Bobby Yip) First published in 2011 © 2011 Rainer Hampp Verlag München, Mering Marktplatz 5 86415 Mering, Germany www.Hampp-Verlag.de All rights preserved. No part of this publication may be reprinted or reproduced or util- ized in any form or by any electronic, mechanical, or other means, now known or hereaf- ter invented, including photocopying and recording, or in any information storage or re- trieval system, without permission in writing from the publisher. In case of complaints please contact Rainer Hampp Verlag. TABLE OF CONTENTS Acknowledgements............................................................................................................. vi Notes on Contributors........................................................................................................ vii Introduction: The many Challenges of Chinese Labor Relations..................................1 Christoph Scherrer Part I: The Basic Setting 1. Perspectives on High Growth and Rising Inequality .......................................................7
    [Show full text]
  • 2009 Preliminary Tier Assignment, Alphabetic by Manufacturer
    Last updated 10/13/11 Brand Association List Below is the list of brands used in the 2012 Final Tier Assignment Schedule for Washington’s Electronic Product Recycling Program. Brands are associated with the responsible manufacturer. The manufacturers listed are those Ecology has identified as the brand owners of electronic products covered by this program (computers, monitors, laptops, televisions, and e-Readers). Is Your Registration Up to Date? Manufacturers who own additional brands of covered electronic products not currently registered must add those brands to their registration. Brand owners of covered electronic products that are not on this list must register as a new participant. If you have questions, please contact Christine Haun at 360-407-6107 or [email protected]. Brand Manufacturer 2go PC Computer Technology Link 3D Corporation 3D Corporation 3M Dynapro 3M Touch Systems 4th Dimension Computer 4th Dimension Computer A1 Best Computer, Inc A-1 Best Computer Abacus Abacus Office Machines ACC Tech ACC Tech Accu Scan J.C. Penney Corporation, Inc. Accurian RadioShack Corp Acer Acer America Corp ACS Associated Computer Specialists ACTION America Action Inc ACW Computer Warehouse of Central Florida, Inc ADEK ADEK Industrial Computers ADP ADP ADT ADT, Ltd ADVENT Audiovox Electronics Corp. Advueu ProMedia Technologies Inc AG Neovo Ag Neovo Technology Corp Aiwa Sony Electronics Inc Alden 3MD Inc. Alienware Dell Computer Corp ALR Acer America Corp Aluratek Aluratek, Inc. AMA Computer Services AMA Computer Services, LLC Amazon Kindle Amazon Fulfillment Services, Inc. Amazon Kindle DX Amazon Fulfillment Services, Inc. Ambassador Macy's Inc. 1 AMBRA International Business Machines Corp.
    [Show full text]