Intel® Server Board S7200AP and Intel® Compute Module HNS7200AP TPS
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Intel® Server Board S7200AP Intel® Compute Module HNS7200AP Technical Product Specification A document providing an overview of product features, functions, architecture, and support specifications Revision 1.2 Aug, 2017 Intel® Server Boards and Systems Intel® Server Board S7200AP and Intel® Compute Module HNS7200AP TPS <This page is intentionally left blank.> Intel® Server Board S7200AP and Intel® Compute Module HNS7200AP TPS Revision History Date Revision Modifications Number June 2015 0.5 Initial Release- Alpha January 2016 0.75 Illustration update; usage update; node feature update March 2016 0.80 Update riser slot information; update CPU TDP June 2016 1.0 Update environmental specifcation table; update air flow table; update 2130w PSU section; update product weight; update BMC sensor table Aug 2016 1.1 Corrected the model name for Intel® Ethernet Controller I210 May 2017 1.2 Image updates; updates to CPU section; updates to connector numbers; updates to power supply section; updates Fabric Kit section i Intel® Server Board S7200AP and Intel® Compute Module HNS7200AP TPS Document Disclaimer Statements No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest TPS. The products and services described may contain defects or errors known as errata which may cause deviations from published specifications. Current characterized errata are available on request. Intel, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others © 2018 Intel Corporation. ii Intel® Server Board S7200AP and Intel® Compute Module HNS7200AP TPS Table of Contents 1 Introduction .................................................................................................................................................................. 1 1.1 Chapter Outline ............................................................................................................................................................................ 1 1.2 Server Board Use Disclaimer ................................................................................................................................................... 1 2 Product Features Overview ....................................................................................................................................... 3 2.1 Components and Features Identification ........................................................................................................................... 6 2.2 Rear Connectors and Back Panel Feature Identification ............................................................................................. 7 2.3 Intel® Light Guided Diagnostic LED ....................................................................................................................................... 8 2.4 Jumper Identification ................................................................................................................................................................. 9 2.5 Mechanical Dimensions and Weight................................................................................................................................. 10 2.6 Product Architecture Overview............................................................................................................................................ 11 2.7 Power Docking Board .............................................................................................................................................................. 12 2.8 Bridge Board ............................................................................................................................................................................... 12 2.9 Riser Card Support ................................................................................................................................................................... 13 2.9.1 Riser Slot 1 x 16 Riser Card ........................................................................................................................................... 13 2.9.2 Riser Slot 2 x16 Riser Card ............................................................................................................................................ 13 2.9.3 Riser Slot 2 x8 Riser Card ............................................................................................................................................... 13 2.10 Compute Module Fans ........................................................................................................................................................... 14 2.11 Air Duct ........................................................................................................................................................................................ 15 2.12 Intel® Remote Management Module 4 (Intel® RMM4) Lite ........................................................................................ 15 2.13 System Software Overview .................................................................................................................................................. 16 2.13.1 System BIOS ...................................................................................................................................................................... 16 2.13.2 Field Replaceable Unit (FRU) and Sensor Data Record (SDR) Data ............................................................. 20 2.13.3 Baseboard Management Controller (BMC) Firmware ....................................................................................... 21 3 Processor Support .................................................................................................................................................... 22 3.1 Intel® Xeon™ Phi™ processor (Knights Landing) Overview ........................................................................................ 22 3.1.1 New Technology MCDRAM ............................................................................................................................................ 22 3.2 Processor Socket and Mechanical Retention Assembly .................................... 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Bookmark not defined. 3.3 Processor Thermal Design Power (TDP) Support ........................................................................................................ 26 3.4 Processor Initialization Error Summary ........................................................................................................................... 27 3.5 Processor Heatsink ................................................................................................................................................................... 28 4 Memory Support....................................................................................................................................................... 29 4.1 Memory Subsystem Architecture........................................................................................................................................ 29 4.1.1 IMC Modes of Operation ................................................................................................................................................ 30 4.1.2 Memory RASM Features ................................................................................................................................................. 30 4.2 Supported Memory .................................................................................................................................................................. 31 iii Intel® Server Board S7200AP and Intel® Compute Module HNS7200AP TPS 4.3 Memory Slot Identification and Population Rules ....................................................................................................... 31 4.3.1 Recommendations for Installing, Adding, or Upgrading Memory ................................................................ 32 4.3.2 S7200AP Series DIMM Population Sample Matrix .............................................................................................. 32 4.4 System Memory Sizing and Publishing ............................................................................................................................ 33 4.4.1 Effects of Memory Configuration on Memory Sizing ......................................................................................... 33 4.4.2 Publishing System Memory .......................................................................................................................................... 33 4.5 Memory Initialization .............................................................................................................................................................. 34 4.5.1 MCDRAM Initialization ...................................................................................................................................................