Foxconn WFU03-LE
Foxconn WFU03-LE f Hardware
Specification
Rev. 1.0
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Foxconn WFU03-LE
Document Revision History
Document Date Modifier Comments Revision 1.0 Apr. 2, 2013 Yishin Wu Add PMU mode for power consumption
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Contents
1. INTRODUCTION ...... 6
1.1 Product Overview ...... 6
1.2 Key Features ...... 6
2. SYSTEM ARCHITECTURE ...... 7
3. ELECTRICAL SPECIFICATIONS ...... 8
3.1 Pin Definitions ...... 8
3.2 DC Specifications ...... 9
3.2.1 Power Consumption Specifications...... 9
4. RF SPECIFICATION ...... 10
4.1 TX Specifications (preliminary) ...... 10
4.2 RX Specifications ...... 11
4.3 Antenna Specifications ...... 錯誤! 尚未定義書籤。
5. MECHANICAL SPECIFICATIONS ...... 12
5.1 Mechanical Drawing ...... 12
5.2 Label Specifications ...... 122
6. ENVIRONMENTAL SPECIFICATIONS ...... 133
7. PART NUMBERING ...... 13
7.1 ID Definitions ...... 13
8. MODULE PHOTO...... 144
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9. PACKING SPECIFICATION ...... 155
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Figures
Figure 2.1 WFU03-LE block diagram ...... 7
Figure 4.1 WFU03-LE perspective ...... 12
Figure 5.1 WFU03-LE mechanical drawing ...... 12
Figure 5.2 RF connector Dimensions ...... 13
Figure 5.3 WFU03-LE Label drawing ...... 13
Figure 7.1 Part Numbering ...... 14
Tables
Table 3.1 Pin Definitions ...... 8
Table 3.2 DC Specifications ...... 8
Table 3.3 Power Consumption Specifications ...... 9
Table 4.1 TX Specifications ...... 10
Table 4.2 RX Specifications ...... 11
Table 6.1 Operating Conditions ...... 14
Table 6.2 Non-operating Conditions ...... 14
Table 7.1 ID Definitions ...... 15
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1. Introduction 1.1 Product Overview The Foxconn WFU03-LE wireless LAN module contains the Ralink® MT7601 single chip which is a highly integrated MAC/BBP for 2.4GHz RF transmission and supporting 150Mbps PHY rate. It fully complies with IEEE 802.11 b/g/n feature rich wireless connectivity at high standards, delivers reliable, cost-effective, throughput from an extended distance. The optimized radio frequency architecture and baseband algorithms provide super performance and low power consumption. Deploy a high efficient USB engine and hardware data processing accelerators without overloading the host processor. Security, quality of service and international regulation are supported by WFU03-LE and giving end users the greatest performance anytime in any circumstance.
1.2 Key Features
Legacy data rates 1, 2 in DSSS mode and rates 5.5, and 11 Mbps in CCK mode, 6, 9, 12, 18, 24, 36, 48, and 54 in OFDM mode Support 40MHz wide channel bandwidth Uses the 2.412 to 2.497GHz ISM frequency band defined by the IEEE 802.11b/g/n specifications Reverse direction grant data flow and frame aggregation WEP 64/128, WPA, WPA2, TKIP, AES, WAPI QoS-WMM, WMM-PS, WPS/WPS2, PIN, PBC Multiple BSSID Support Fully compliance with USB 2.0 high-speed mode Form Factor: PCI Express 1.1 Half Mini Card(single side) International Regulation – 802.11d/h/k Supports Wi-Fi Direct Low power with advanced power management WoWLAN by GPIO & USB with GTK rekey
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2. System Architecture
Figure 2.1 WFU03-LE 2 antenna block diagram
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3. Electrical Specifications 3.1 Pin Definitions Table 3.1 Pin Definitions Pin # Name Pin # Name 51 N/A 52 +3.3V 49 N/A 50 GND 47 N/A 48 N/A 45 N/A 46 N/A 43 GND 44 LED_WLAN# 41 +3.3V 42 N/A 39 +3.3V 40 GND 37 GND 38 USB_D+ 35 GND 36 USB_D- 33 N/A 34 GND 31 N/A 32 N/A 29 GND 30 N/A 27 GND 28 N/A 25 N/A 26 GND 23 N/A 24 N/A 21 GND 22 PERST# 19 N/A 20 W_DISABLE# 17 N/A 18 GND Mechanical Key 15 GND 16 N/A 13 N/A 14 N/A 11 N/A 12 N/A 9 GND 10 N/A 7 CLKREQ# 8 N/A 5 N/A 6 N/A 3 N/A 4 GND 1 WAKE# 2 +3.3V
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3.2 DC Specifications The Max Power (as max defined in the Mini-card Spec) is 2000mW 667mA (need at lease 2 Power Pins of the 5 exists in the Mini-Card spec, Max limit for each Pin is 500mA). For all MiniCard voltage rails (3.3V), it is recommended not to exceed 100mVpp noise in the frequency range of 10-500KHz.
Table 3.2 DC Specifications Parameters Symbol Conditions Min. Typ. Max. Unit 3.3V Supply Voltage +3.3V - 3.0 3.3 3.6 V Receiver 3.3 V Current consumption Icc 33rx HT 40MHz MCS 7 200 mA Transmitter 3.3 V Current consumption Icc 33tx HT 40MHz MCS 7 300 mA
3.2.1 Power Consumption Specifications Power consumption is measured using current probe loop on the Power rails of the USB interface (Pins). Assuming ASMP enabled (L1-active enabled and L0s is disabled).
Table 3.3 Power Consumption Specifications
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4. RF Specification 4.1 TX Specifications (preliminary)
Table 4.1 TX Specifications Data Rate Tx Typical Power Data Rate Tx Typical Power Modulation Modulation (Mbps) (dBm) (Mbps) (dBm) 1 DBPSK 15 HT20-7.22 BPSK 15
2 DQPSK 15 HT20-14.44 BPSK 15
5.5 CCK 15 HT20-21.67 QPSK 15
11 CCK 15 HT20-28.89 QPSK 15
6 OFDM 15 HT20-43.33 16-QAM 15
9 OFDM 15 HT20-57.78 16-QAM 15
12 OFDM 15 HT20-65 64-QAM 15
18 OFDM 15 HT20-72.22 64-QAM 15 24 OFDM 15 HT40-15 BPSK 13 36 OFDM 15 HT40-30 QPSK 13 48 OFDM 15 HT40-45 QPSK 13 54 OFDM 15 HT40-60 16-QAM 13 HT40-90 16-QAM 13 HT40-120 64-QAM 13 HT40-135 64-QAM 13 HT40-150 64-QAM 13 ※Each tolerance is ±2dBm
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4.2 RX Specifications
Table 4.2 RX Specifications (Main antenna & Aux antenna) Rx Sensitivity Rx Sensitivity Data Rate (dBm) Data Rate (dBm) Modulation Modulation (Mbps) (Mbps) Min. Typ. Min. Typ.
1 DBPSK -82 -88 HT20-7.22 BPSK -82 -85
2 DQPSK -80 -88 HT20-14.44 QPSK -79 -82
5.5 CCK -78 -86 HT20-21.67 QPSK -77 -80
11 CCK -76 -84 HT20-28.89 16-QAM -74 -78
6 OFDM -82 -85 HT20-43.33 16-QAM -70 -74
9 OFDM -81 -84 HT20-57.78 64-QAM -66 -70
12 OFDM -79 -82 HT20-65 64-QAM -65 -69
18 OFDM -77 -80 HT20-72.22 64-QAM -64 -67 24 OFDM -74 -77 HT40-15 BPSK -79 -82 36 OFDM -70 -74 HT40-30 QPSK -76 -80 48 OFDM -66 -70 HT40-45 QPSK -74 -78 54 OFDM -65 -68 HT40-60 16-QAM -71 -75 HT40-90 16-QAM -67 -71 HT40-120 64-QAM -63 -67 HT40-135 64-QAM -62 -66 HT40-150 64-QAM -61 -64
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5. Mechanical Specifications 5.1 Mechanical Drawing
Figure 5.1 WFU03-LE mechanical drawing
5.2 Label Specifications
Figure 5.3 WFU03-LE Label Drawing
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6. Environmental Specifications The following tables provide normal operating conditions and maximum rating requirements for WFU03-LE hardware. Table 6.1 Operating Conditions Environment Limits
Operating -10-70℃ ※The radio parts at operating state and above temperature of T-shield. Table 6.2 Non-operating Conditions Temperature Humidity Environment Min. Typ. Max. Unit Min. Typ. Max. Unit Non-Operating -40 25 85 ℃ 45 - 90 % ※ Temperature condition for storage (Packaged) in warehouse is Maximum 40℃ up to 6 months. 7. Part Numbering 7.1 ID Definitions Table 7.1 ID Definitions WLAN Type Mode PID VID WFU03-LEUXXX-MT7601U BGN 0x7601 0x148F
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8. Module Photo Top side
Bottom side
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9. Packing Specification
包 裝 作 業 圖 示 說 明 PACKING OPERATON DIAGRAM & INSTRUCTION ※ 1. 1PCS D F WFU03 DB 包裝方式 2. NO. ITEM QTY 3. A PCA FOXCONN箱 1PCS 內 緩 B 防靜電泡棉(墊板) 2PCS 用手輕輕按壓托盤的邊沿部分 D C 防護袋 1PCS E 間位置 防靜電泡棉托盤(料號：086- 統一 D 0300-6594） 16PCS 4. E PCBA(WFU03 DB )板 672PCS 时，需要用静电泡棉垫板填充满一箱 F 乾燥劑 1PCS 乾燥劑 B 5. C ※ 出貨標簽一 壞 包裝條碼 和有效接地的有線防靜電手環 出貨標簽二
A 箱的作業 碼上的數量 滿空餘的空間，以保证产品在箱子里完全固定。
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包 裝 作 業 圖 示 說 明 PACKING OPERATON DIAGRAM & INSTRUCTION WFU03 DB 包裝方式 托盤切口處 ※ 圖一 圖二 圖三 靜電泡棉墊板
（如圖三）且每層主板有金手指的一邊朝同一個方向（如 圖四）的 示
16 然後放入一包乾燥劑
3.35 圖六 圖五 圖四 或少放板
金 ※ 手 指 一 有線防靜電手環 邊 朝 同 一 如果有未裝滿一箱子的就需修改包裝條碼上的數量 個 相符 方 里完全固定。 向 5. 圖七 實際重量
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