The Wireless View 2017: Smartphones – a Slight Pickup in Growth Ahead

Total Page:16

File Type:pdf, Size:1020Kb

The Wireless View 2017: Smartphones – a Slight Pickup in Growth Ahead Global (Americas & Europe) Equity Research December 6, 2016 The Wireless View 2017: Smartphones – a slight pickup in growth ahead KEY REPORTS IT Hardware & Telco Equipment: Tech Conference Day 2 Takeaways IT Hardware & Telco Equipment: Tech Conference Day 1 Takeaways NTNX: Disrupting in the right way Capex Update – Worst in Capex behind us; early signs of stabilization in U.S. and E.U. Asia Trip 2016 - IT Hardware and Telco Equipment – Wireless Fundamentals Firming Networking Update – Cloudification comes, amidst share disruption AAPL: Factoring in a muted 7 and the 8 super cycle HPE – Could be worth $31 in a complete break-up IBM – Investor Q&A – Unconvinced by outperformance AAPL – Services: Scaling the Annuity (Summarized Version) IBM – Roadmap Blues Research Team Kulbinder Garcha: Global Communications Technology Randy Abrams: Asian Semiconductors Achal Sultania: European Technology Hardware DISCLOSURE APPENDIX AT THE BACK OF THIS REPORT CONTAINS IMPORTANT DISCLOSURES, ANALYST CERTIFICATIONS, LEGAL ENTITY DISCLOSURE AND THE STATUS OF NON-US ANALYSTS. US Disclosure: Credit Suisse does and seeks to do business with companies covered in its research reports. As a result, investors should be aware that the Firm may have a conflict of interest that could affect the objectivity of this report. Investors should consider this report as only a single factor in making their investment decision. Smartphones Key takeaways – Smartphones – a slight pickup in growth ahead Smartphones – pickup in growth. We believe smartphone growth is set to pick up. After +1% growth in 2016, we see growth at 7% growth in 2017 followed by a recovery to 8% growth in 2018 in units (revenue growth will be +1%/+5%). The key issue is that new smartphone subscribers are set to decline (contributing ~35% of smartphone volume in 2017), with replacement units making up the remaining ~65%. Going forward, we see EM as the driver of smartphone growth. As a result, we slightly raise our CY17/18 unit estimates to 1.6bn/1.7bn. High end smartphone dynamics in play, Apple share gains to build around a super cycle. By price point, we continue to see the high end of the market maturing as the high end of the market (>$400) is essentially saturated with the majority of smartphone volume growth coming from the lower end of the market, and increasingly from the sub $100 segment. However, we see the high end of the market being driven by product cycles, with Apple having ~60% market share. As such, we believe the upcoming iPhone 8 cycle will have a dramatic impact on this market. While Apple has been losing smartphone unit share for some time, we note their high end share has expanded over the long term. Specifically, entering 2017, we see an opportunity to gain share in the high end driven by an iPhone 8 Super Cycle, along with Samsung’s recent missteps around the Galaxy Note 7. Based upon our installed base model we believe iPhone units will grow to 224mn/248mn in CY17/CY18. Wireless Infrastructure may be down 10%/3% in 2016/2017. Wireless capex trends are expected to trend down again in 2017 following a weak year in 2016. We now expect wireless capex to be down 10%/3% in 2016/2017 (vs our previous estimate of down 7%/3%). However, despite our downward revision for 2016, we do believe we could be close to a cyclical low. Specifically, we now note that while the declines in the US and Western Europe are set to moderate. Going forward however, we believe that this will be offset by headwinds from China accelerating, as we see signs of slowing LTE rollout in China across all 3 telcos, leading to 17%/7% decline in wireless capex in 2016/2017. This means that 2H16 wireless capex could be down ~25% yoy given high 1H spend. Stock view – different drivers. Apple (Outperform, $150) – We see an opportunity for Apple to gain high end market share and build upon the recent near term momentum around the iPhone 7. In fact, our supply chain checks indicate strength, with the mix of iPhone 7 Plus appearing much stronger than we currently estimate. Specifically, we believe a super cycle around the iPhone 8, and troubles in Samsung’s product lines should help drive unit growth. Given a growing installed base, a quickening replacement rate, high levels of retention, positive impact from installment plans, and a possibly robust iPhone 7 cycle, we look to add on any weakness. Nokia (Outperform, €5.35) – We acknowledge that the demand environment remains challenging in 2017, but we expect the top-line to start stabilizing from late 2017/early 2018, as we see capacity constraints in developed markets, LTE coverage expanding in EMs, and 5G trials in select markets. With gross savings of €1.7bn and net savings of €1.2bn, we see €0.33 of EPS power by 2018. CommScope (Outperform, $36) - While the Mobility segment’s visibility remains a concern, we continue to see strength in the Connectivity business, driven by FTTX rollouts in North America. As a result, the Connectivity segment continues to grow in the revenue mix of the overall business, and could support and drive improved earnings for some time. Motorola Solutions (Outperform, $90) - With organic growth returning to the business and solid cost management, we believe the business looks to be on track. Despite the company guiding to FX headwinds in FY17, the company still expects to grow. We believe the core government business should inflect LT going forward due to a healthy backlog, a dominant market share of government business in public safety, and a LT opportunity given the aged analog infrastructure and the LTE opportunity. As a result, we increase our TP to $90 (from $80) and maintain our Outperform rating. Blackberry (Underperform, $6) – We note that BlackBerry’s top line remains challenged as it shifts its hardware strategy. However, we remain concerned about the quality of some of the software acquisitions. Furthermore, we note that despite the generous assumptions for the software business, Blackberry has material downside. Currently, the business trades at a lofty valuation, with implied P/E of ~31x and implied P/E ex cash of ~23x, on our long term EPS estimate . Ericsson (Neutral, SKr45) – Despite restructuring, we struggle to see EBITA margins going up beyond 7.5% for next year in a declining sales environment, and hence maintain our Neutral rating. Dialog (Outperform €40) – Our supply chain checks in Asia indicate a steady state for Apple build plans for 2H16 and Q117. Beyond 2H16, we believe in a stronger replacement cycle for iPhone starting from 2H17 along with potential content increase for Dialog. Given our view that earnings can grow at 15%+ CAGR over the next 2 years, we reiterate OP rating. TSMC (Outperform, NT$205) – We see growth drivers emerging for TSMC long-term, specifically in HPC, automotive and IoT supplementing mobile where 10nm will be driven by Apple, MediaTek, and HiSilicon. Furthermore, GMs are approaching 50% with less cyclical volatility and we believe the cash flow generation should support a rising dividend. MediaTek (Neutral, NT$225) – While LTE is driving a revenue up-cycle for MediaTek, we believe MediaTek’s margin pressures could weigh on the stock. Additionally, while MediaTek’s market share in China remains in the 45-50% range, competitive pricing offsets decent units tied to emerging markets and low-end Samsung inroads. 2 Smartphones A pickup in global smartphone growth 2008A 2009A 2010A 2011A 2012A 2013A 2014A 2015A 2016E 2017E 2018E 2019E 2020E CAGR 07-15 CAGR 16E-20E Global mobile subscriptions (mn) 3,866 4,495 5,175 5,780 6,337 6,665 6,945 7,360 7,538 7,861 8,293 8,557 8,819 23% 4% Global new subscriptions (mn) 616 629 680 605 557 328 280 415 178 323 432 264 262 Global mobile unit sell-in shipments (mn) 18.9% 16.3% 15.1% 11.7% 9.6% 5.2% 4.2% 6.0% 2.4% 4.3% 5.5% 3.2% 3.1% -71% 6% Global smartphone subscribers (mn) 280 367 558 894 1,387 2,005 2,677 3,321 3,838 4,370 4,862 5,343 5,803 44% 11% as % of total mobile subscribers 7% 8% 11% 15% 22% 30% 39% 45% 51% 56% 59% 62% 66% Global smartphone addressable market 5,834 5,834 5,834 5,834 5,834 5,834 5,834 5,834 5,834 5,834 5,834 5,834 5,834 Smartphone Effective Penetration 0% 6% 10% 15% 24% 34% 46% 57% 1 66% 75% 83% 92% 99% Net smartphone adds (mn) 83 87 190 337 493 618 671 645 517 531 493 481 460 33% -3% as % of total smartphone units 55% 50% 62% 68% 68% 61% 52% 45% 2 35% 34% 29% 27% 24% Replacements units (mn) 67 86 114 158 234 401 630 793 940 1,024 1,189 1,307 1,420 40% 11% as % of last year's smartphone subs 34.2% 30.8% 31.1% 28.3% 26.1% 28.9% 31.4% 29.6% 28.3% 26.7% 27.2% 26.9% 26.6% as % of total smartphone units 45% 50% 38% 32% 32% 39% 48% 55% 65% 66% 71% 73% 76% Global smartphone units (mn) 151 173 305 494 727 1,019 1,302 1,437 1,457 1,555 1,681 1,788 1,880 36% 7% % change yoy 22% 15% 76% 62% 47% 40% 28% 10% 1% 7% 8% 6% 5% as % of mobile shipments 11% 13% 19% 29% 42% 55% 66% 73% 74% 79% 85% 91% 95% Smartphone ASPs ($) 366 359 363 361 328 284 257 252 233 221 215 210 206 -3% -3% % change yoy -2% 1% 0% -9% -13% -10% -2% -7% -5% -3% -2% -2% Global smartphone revenues ($ mn) 55,115 62,149 110,596 178,619 238,431 289,220 334,137 361,653 339,423 344,141 360,874 376,002 387,592 32% 3% % change yoy 38% 13% 78% 62% 33% 21% 16% 8% -6% 1% 5% 4% 3% 3 Source: IDC, Credit Suisse estimates 1) LT Addressable Market for smartphone users is 5.8bn users, Current Penetration at 66%.
Recommended publications
  • GPU Developments 2018
    GPU Developments 2018 2018 GPU Developments 2018 © Copyright Jon Peddie Research 2019. All rights reserved. Reproduction in whole or in part is prohibited without written permission from Jon Peddie Research. This report is the property of Jon Peddie Research (JPR) and made available to a restricted number of clients only upon these terms and conditions. Agreement not to copy or disclose. This report and all future reports or other materials provided by JPR pursuant to this subscription (collectively, “Reports”) are protected by: (i) federal copyright, pursuant to the Copyright Act of 1976; and (ii) the nondisclosure provisions set forth immediately following. License, exclusive use, and agreement not to disclose. Reports are the trade secret property exclusively of JPR and are made available to a restricted number of clients, for their exclusive use and only upon the following terms and conditions. JPR grants site-wide license to read and utilize the information in the Reports, exclusively to the initial subscriber to the Reports, its subsidiaries, divisions, and employees (collectively, “Subscriber”). The Reports shall, at all times, be treated by Subscriber as proprietary and confidential documents, for internal use only. Subscriber agrees that it will not reproduce for or share any of the material in the Reports (“Material”) with any entity or individual other than Subscriber (“Shared Third Party”) (collectively, “Share” or “Sharing”), without the advance written permission of JPR. Subscriber shall be liable for any breach of this agreement and shall be subject to cancellation of its subscription to Reports. Without limiting this liability, Subscriber shall be liable for any damages suffered by JPR as a result of any Sharing of any Material, without advance written permission of JPR.
    [Show full text]
  • Sensors and Data Encryption, Two Aspects of Electronics That Used to Be Two Worlds Apart and That Are Now Often Tightly Integrated, One Relying on the Other
    www.eenewseurope.com January 2019 electronics europe News News e-skin beats human touch Swedish startup beats e-Ink on low-power Special Focus: Power Sources european business press November 2011 Electronic Engineering Times Europe1 181231_8-3_Mill_EENE_EU_Snipe.indd 1 12/14/18 3:59 PM 181231_QualR_EENE_EU.indd 1 12/14/18 3:53 PM CONTENTS JANUARY 2019 Dear readers, www.eenewseurope.com January 2019 The Consumer Electronics Show has just closed its doors in Las Vegas, yet the show has opened the mind of many designers, some returning home with new electronics europe News News ideas and possibly new companies to be founded. All the electronic devices unveiled at CES share in common the need for a cheap power source and a lot of research goes into making power sources more sus- tainable. While lithium-ion batteries are commercially mature, their long-term viability is often questioned and new battery chemistries are being investigated for their simpler material sourcing, lower cost and sometime increased energy density. Energy harvesting is another feature that is more and more often inte- e-skin beats human touch grated into wearables but also at grid-level. Our Power Sources feature will give you a market insight and reviews some of the latest findings. Other topics covered in our January edition are Sensors and Data Encryption, two aspects of electronics that used to be two worlds apart and that are now often tightly integrated, one relying on the other. Swedish startup beats e-Ink on low-power With this first edition of 2019, let me wish you all an excellent year and plenty Special Focus: Power Sources of new business opportunities, whether you are designing the future for a european business press startup or working for a well-established company.
    [Show full text]
  • Hardware-Assisted Rootkits: Abusing Performance Counters on the ARM and X86 Architectures
    Hardware-Assisted Rootkits: Abusing Performance Counters on the ARM and x86 Architectures Matt Spisak Endgame, Inc. [email protected] Abstract the OS. With KPP in place, attackers are often forced to move malicious code to less privileged user-mode, to ele- In this paper, a novel hardware-assisted rootkit is intro- vate privileges enabling a hypervisor or TrustZone based duced, which leverages the performance monitoring unit rootkit, or to become more creative in their approach to (PMU) of a CPU. By configuring hardware performance achieving a kernel mode rootkit. counters to count specific architectural events, this re- Early advances in rootkit design focused on low-level search effort proves it is possible to transparently trap hooks to system calls and interrupts within the kernel. system calls and other interrupts driven entirely by the With the introduction of hardware virtualization exten- PMU. This offers an attacker the opportunity to redirect sions, hypervisor based rootkits became a popular area control flow to malicious code without requiring modifi- of study allowing malicious code to run underneath a cations to a kernel image. guest operating system [4, 5]. Another class of OS ag- The approach is demonstrated as a kernel-mode nostic rootkits also emerged that run in System Manage- rootkit on both the ARM and Intel x86-64 architectures ment Mode (SMM) on x86 [6] or within ARM Trust- that is capable of intercepting system calls while evad- Zone [7]. The latter two categories, which leverage vir- ing current kernel patch protection implementations such tualization extensions, SMM on x86, and security exten- as PatchGuard.
    [Show full text]
  • Arxiv:1910.06663V1 [Cs.PF] 15 Oct 2019
    AI Benchmark: All About Deep Learning on Smartphones in 2019 Andrey Ignatov Radu Timofte Andrei Kulik ETH Zurich ETH Zurich Google Research [email protected] [email protected] [email protected] Seungsoo Yang Ke Wang Felix Baum Max Wu Samsung, Inc. Huawei, Inc. Qualcomm, Inc. MediaTek, Inc. [email protected] [email protected] [email protected] [email protected] Lirong Xu Luc Van Gool∗ Unisoc, Inc. ETH Zurich [email protected] [email protected] Abstract compact models as they were running at best on devices with a single-core 600 MHz Arm CPU and 8-128 MB of The performance of mobile AI accelerators has been evolv- RAM. The situation changed after 2010, when mobile de- ing rapidly in the past two years, nearly doubling with each vices started to get multi-core processors, as well as power- new generation of SoCs. The current 4th generation of mo- ful GPUs, DSPs and NPUs, well suitable for machine and bile NPUs is already approaching the results of CUDA- deep learning tasks. At the same time, there was a fast de- compatible Nvidia graphics cards presented not long ago, velopment of the deep learning field, with numerous novel which together with the increased capabilities of mobile approaches and models that were achieving a fundamentally deep learning frameworks makes it possible to run com- new level of performance for many practical tasks, such as plex and deep AI models on mobile devices. In this pa- image classification, photo and speech processing, neural per, we evaluate the performance and compare the results of language understanding, etc.
    [Show full text]
  • Gables: a Roofline Model for Mobile Socs
    2019 IEEE International Symposium on High Performance Computer Architecture (HPCA) Gables: A Roofline Model for Mobile SoCs Mark D. Hill∗ Vijay Janapa Reddi∗ Computer Sciences Department School Of Engineering And Applied Sciences University of Wisconsin—Madison Harvard University [email protected] [email protected] Abstract—Over a billion mobile consumer system-on-chip systems with multiple cores, GPUs, and many accelerators— (SoC) chipsets ship each year. Of these, the mobile consumer often called intellectual property (IP) blocks, driven by the market undoubtedly involving smartphones has a significant need for performance. These cores and IPs interact via rich market share. Most modern smartphones comprise of advanced interconnection networks, caches, coherence, 64-bit address SoC architectures that are made up of multiple cores, GPS, and many different programmable and fixed-function accelerators spaces, virtual memory, and virtualization. Therefore, con- connected via a complex hierarchy of interconnects with the goal sumer SoCs deserve the architecture community’s attention. of running a dozen or more critical software usecases under strict Consumer SoCs have long thrived on tight integration and power, thermal and energy constraints. The steadily growing extreme heterogeneity, driven by the need for high perfor- complexity of a modern SoC challenges hardware computer mance in severely constrained battery and thermal power architects on how best to do early stage ideation. Late SoC design typically relies on detailed full-system simulation once envelopes, and all-day battery life. A typical mobile SoC in- the hardware is specified and accelerator software is written cludes a camera image signal processor (ISP) for high-frame- or ported.
    [Show full text]
  • VIV:Vivo-X60-5G-Phone Datasheet Overview
    VIV:vivo-X60-5G-Phone Datasheet Get a Quote Overview Note: Shipment will start on January 10. Vivo X60 5G, samsung Exynos 1080 flagship chip, zeiss optical lens, micro-head black light night market 2.0 Compare to Similar Items Table 2 shows the comparison. Product Code Vivo X50 5G Phone Vivo X60 5G Phone Front Camera 32 MP 8 MP Battery 4200 mAh 4500 mAh Processor Qualcomm Snapdragon 765G Exynos 880 Display 6.56 inches 6.53 inches Ram 8 GB 6 GB Rear Camera 48 MP + 13 MP + 8 MP + 5 MP 48 MP + 2 MP + 2 MP Fingerprint Sensor Position On-screen Side Fingerprint Sensor Type Optical \ Other Sensors Light sensor, Proximity sensor, Accelerometer, Acceleration, Proximity, Compass Compass, Gyroscope Fingerprint Sensor Yes Yes Quick Charging Yes \ Operating System Android v10 (Q) \ Sim Slots Dual SIM, GSM+GSM Dual SIM, GSM+GSM Custom Ui Funtouch OS \ Brand Vivo Vivo Sim Size SIM1: Nano SIM2: Nano SIM1: Nano, SIM2: Nano Network 5G: Supported by device (network not rolled- 5G: Supported by device (network not rolled- out in India), 4G: Available (supports Indian out in India), 4G: Available (supports Indian bands), 3G: Available, 2G: Available bands),, 3G: Available, 2G: Available Fingerprint Sensor Yes Yes Audio Jack USB Type-C 3.5 MM Loudspeaker Yes Yes Chipset Qualcomm Snapdragon 765G Exynos 880 Graphics Adreno 620 Mali-G76 Processor Octa core (2.4 GHz, Single core, Kryo 475 + Exynos 880 2.2 GHz, Single core, Kryo 475 + 1.8 GHz, Hexa Core, Kryo 475) Architecture 64 bit 64 bit Ram 8 GB 6 GB Width 75.3 mm 76.6 mm Weight 173 grams 190 grams Build Material
    [Show full text]
  • Gamma Correction Using ARM Neon
    Tegra Xavier Introduction to ARMv8 Kristoffer Robin Stokke, PhD Dolphin Interconnect Solutions And Debugging Goals of Lecture qTo give you q Something concrete to start on q Some examples from «real life» where you may encounter these topics qEvery year I try to include something new... q Which means more freebees for you! J qSimple introduction to ARMv8 NEON programming environment q Register environment, instruction syntax q «Families» of instructions q Important for debugging, writing code and general understanding qProgramming examples q Intrinsics q Inline assembly qPerformance analysis using gprof qIntroduction to GDB debugging Keep This Under Your Pillow qARM’s overview and information on NEON instructions q https://developer.arm.com/documentation/dui0204/j/neon-and-vfp-programming qGNU compiler intrinsics list: q https://gcc.gnu.org/onlinedocs/gcc-4.6.4/gcc/ARM-NEON-Intrinsics.html qSome non-formal calling conventions and snacks q https://medium.com/mathieugarcia/introduction-to-arm64-neon-assembly-930c4a48bb2a qThis may also be useful q https://community.arm.com/developer/tools-software/oss-platforms/b/android-blog/posts/arm- neon-programming-quick-reference Modern Heterogeneous SoC Architectures Manufacturer CPU CPU Cache RAM GPU DSP Hardware Accelerators Tegra X1 Nvidia 4 ARM Cortex 2 MB L2, 4 GB 256-core - • ISP A57 + 4 A53 48 kB I$ Maxwell 32 kB D$ (L1) Tegra Xavier Nvidia 8 CarMel 2 MB L3 (shared) 16 GB 512-core Volta - • CNN ARMv8 8 MB L2 (shared 2 Blocks cores) • ISP 128 kB I$ 64 kB D$ Myriad X Intel Movidius 2 SPARC Kilobytes 4 GB - 16 VLIW cores • ISP • CNN Blocks • ++ More SDA845 QualcoMM 8 Kryo ARM- 8 GB Adreno GPU Hexagon VLIW • ISP based + SIMD • LTE IMX6Q Freescale 4 ARM Cortex 1 MB L2 Impl.
    [Show full text]
  • Lecture 1: Introduction Advanced Digital VLSI Design I Bar-Ilan University, Course 83-614 Semester B, 2021 11 March 2021 Outline
    Lecture 1: Introduction Advanced Digital VLSI Design I Bar-Ilan University, Course 83-614 Semester B, 2021 11 March 2021 Outline © AdamMarch Teman, 11, 2021 Introduction Section 2 Section 3 Section 4 Section 5 Conclusions Motivation Course Motivation Snapdragon??? • How many of you understand this recent news item? • Qualcomm Snapdragon 710I mobilethought platform so… (SDM710) specifications: • CPU – 8x Qualcomm Kryo 360 CPU @ up to 2.2 GHz (in two clusters) • GPU – Qualcomm Adreno 616, DirectX 12 • DSP – Qualcomm Hexagon 680 • Memory I/F – LPDDR4x, 2x 16-bit up to 1866MHz, • Video: H.264 (AVC), H.265 (HEVC), VP9, VP8 • Camera: Qualcomm Spectra 250 ISP • Audio – Qualcomm Aqstic & aptX audio • Cellular Connectivity–Snapdragon X15 LTE modem • Wireless : 802.11ac Wi-Fi, Bluetooth 5, NFC • Manufacturing Process – Samsung 10nm LPP 4 © AdamMarch Teman, 11, 2021 Motivation •Welcome to EnICS. • To get you started on your graduate studies, let me introduce you to a wonderful invention… • Don’t you think it’s about time you know what’s inside? 5 © AdamMarch Teman, 11, 2021 Course Objective • To make sure that you – graduate students working on chip design – get to know the environment around your circuits. • Basic Terminology • Components • Systems (on a chip) • Software • Methodology • And since we’re leading one of the flagship programs of the Israel Innovation Authority • I’m going to familiarize you with RISC-V 6 © AdamMarch Teman, 11, 2021 Course Syllabus • Well, that’s a tough one… • In general, I call it “Microprocessors, Microcontrollers, SoC, and Embedded Computing” • I’ll let you know exactly what we’re going to learn as we go along.
    [Show full text]
  • Today's Smartphone Architecture
    Today’s Smartphone Architecture Malik Wallace Rafael Calderon Agenda History Hardware Future What is a Smartphone? Internals of Smartphones - SoC Future Technologies Smartphone Innovations CPU Architecture Today’s Smartphones Supported ISA Examples What is a Smartphone? It is a cellphone and PDA combined with additional computer-like features Initially cellphones were only able to make calls, and PDAs were only able to store contact information and create to-do lists Over time people wanted wireless connectivity, which was restricted to computers and laptops, integrated onto PDAs and cellphones thus came the smartphone Smartphone Innovations - Timeline 1993 2007 The First Smartphone - IBM Simon The iPhone with iOS, first phone with multi-touch capabilities 1996 Nokia’s First Smartphone 2008 HTC Dream with Android OS 1997 Ericsson GS88 - The first device labeled as a smartphone 2000 Symbian OS 2001 Windows CE Pocket PC OS 2002 Palm OS and Blackberry OS Today’s Smartphones Dominated by Android and Apple Features rich user interface with a variety of applications that integrate with the phone's architecture. Utilizes specific mobile operating systems which combines the features of personal computers with those of mobile phones. Built for efficiency, meant to use the least amount of power as possible (debatable!) Let’s Talk about the Hardware System-on-Chip (SoC) In order to maintain portability and lower power consumption system-on-chips were the chosen IC for smartphones CPU I/O GPU Networking Memory Anything extra Busses and Channels Harvard Architecture Instructions and data are treated the same Instructions are read and accessed just like data However..
    [Show full text]
  • 1 in the United States District Court for the Northern
    Case: 1:18-cv-06255 Document #: 1 Filed: 09/13/18 Page 1 of 19 PageID #:1 IN THE UNITED STATES DISTRICT COURT FOR THE NORTHERN DISTRICT OF ILLINOIS EASTERN DIVISION COMPLEX MEMORY, LLC, Plaintiff Civil Action No.: 1:18-cv-6255 v. PATENT CASE MOTOROLA MOBILITY LLC Jury Trial Demanded Defendant COMPLAINT FOR PATENT INFRINGEMENT Plaintiff Complex Memory, LLC (“Complex Memory”), by way of this Complaint against Defendant Motorola Mobility LLC (“Motorola” or “Defendant”), alleges as follows: PARTIES 1. Plaintiff Complex Memory is a limited liability company organized and existing under the laws of the State of Texas, having its principal place of business at 17330 Preston Road, Suite 200D, Dallas, Texas 75252. 2. On information and belief, Defendant Motorola is a Delaware limited liability company headquartered at 222 W. Merchandise Mart Plaza, Chicago, IL 60654. JURISDICTION AND VENUE 3. This is an action under the patent laws of the United States, 35 U.S.C. §§ 1, et seq., for infringement by Motorola of claims of U.S. Patent Nos. 5,890,195; 5,963,481; 6,658,576; 6,968,469; and 7,730,330 (“the Patents-in-Suit”). 4. This Court has subject matter jurisdiction pursuant to 28 U.S.C. §§ 1331 and 1338(a). 5. Motorola is subject to personal jurisdiction of this Court because, inter alia, on 1 Case: 1:18-cv-06255 Document #: 1 Filed: 09/13/18 Page 2 of 19 PageID #:2 information and belief, (i) Motorola is registered to transact business in the State of Illinois; (ii) Motorola conducts business in the State of Illinois and maintains a facility and employees within the State of Illinois; and (iii) Motorola has committed and continues to commit acts of patent infringement in the State of Illinois, including by making, using, offering to sell, and/or selling accused products and services in the State of Illinois, and/or importing accused products and services into the State of Illinois.
    [Show full text]
  • OPERATING NEURAL NETWORKS on MOBILE DEVICES by Peter Bai
    OPERATING NEURAL NETWORKS ON MOBILE DEVICES by Peter Bai A Thesis Submitted to the Faculty of Purdue University In Partial Fulfillment of the Requirements for the degree of Master of Science in Electrical and Computer Engineering School of Electrical & Computer Engineering West Lafayette, Indiana August 2019 2 THE PURDUE UNIVERSITY GRADUATE SCHOOL STATEMENT OF COMMITTEE APPROVAL Dr. Saurabh Bagchi, Chair School of Electrical and Computer Engineering Dr. Sanjay Rao School of Electrical and Computer Engineering Dr. Jan Allebach School of Electrical and Computer Engineering Approved by: Dr. Dimitrios Peroulis Head of the Graduate Program 3 To my parents and teachers who encouraged me to never stop pushing on. 4 TABLE OF CONTENTS LIST OF TABLES .......................................................................................................................... 5 LIST OF FIGURES ........................................................................................................................ 6 ABSTRACT .................................................................................................................................... 7 CHAPTER 1. INTRODUCTION ................................................................................................ 8 1.1 Background ......................................................................................................................... 8 CHAPTER 2. HARDWARE SETUP .......................................................................................... 9 2.1 Hardware Selection
    [Show full text]
  • Linux Betriebssystem Linux Testen Und Parallel Zu Windows Installieren
    CNXSoft – Embedded Systems News News, Tutorials, Reviews, and How-Tos related to Embedded Linux and Android, Arduino, ESP8266, Development Boards, TV Boxes, Mini PCs, etc.. Home About Development Kits How-Tos & Training Materials Contact Us Type text to search here... Home > AllWinner A1X, AllWinner A2X, AllWinner A8X, Allwinner H-Series, AMD Opteron, AMLogic, Broadcom BCMxxxx, HiSilicon, Linux, Linux 4.x, Marvell Armada, Mediatek MT2xxx, Mediatek MT8xxx, NXP i.MX, Qualcomm Snapdragon, Rockchip RK33xx, Samsung Exynos, STMicro STM32, Texas Instruments OMAP 3, Texas Instruments OMAP 4, Texas Instruments OMAP 5 > Linux 4.6 Release – Main Changes, ARM and MIPS Architectures Linux 4.6 Release – Main Changes, ARM and MIPS Architectures May 16th, 2016 cnxsoft Leave a comment Go to comments Linux Betriebssystem Linux testen und parallel zu Windows installieren. So gehts! Linus Torvalds released Linux Kernel 4.6 earlier today: Tweet It’s just as well I didn’t cut the rc cycle short, since the last week ended up getting a few more fixes than expected, but nothing in there feels all that odd or out of line. So 4.6 is out there at the normal schedule, and that obviously also means that I’ll start doing merge window pull requests for 4.7 starting tomorrow. Since rc7, there’s been small noise all over, with driver fixes being the bulk of it, but there is minor noise all over (perf tooling, networking, filesystems, documentation, some small arch fixes..) The appended shortlog will give you a feel for what’s been going on during the last week. The 4.6 kernel on the whole was a fairly big release – more commits than we’ve had in a while.
    [Show full text]