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Compactflash® Memory Card Product Manual

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Compactflash® Memory Card Product Manual CompactFlash® Memory Card Product Manual CORPORATE HEADQUARTERS 140 Caspian Court Sunnyvale, CA 94089-1000 408-542-0500 FAX: 408-542-0503 URL: http://www.sandisk.com SanDisk® Corporation general policy does not recommend the use of its products in life support applications where in a failure or malfunction of the product may directly threaten life or injury. Per SanDisk Terms and Conditions of Sale, the user of SanDisk products in life support applications assumes all risk of such use and indemnifies SanDisk against all damages. See “Limited Warranty” and “Disclaimer of Liability.” This document is for information use only and is subject to change without prior notice. SanDisk Corporation assumes no responsibility for any errors that may appear in this document, nor for incidental or consequential damages resulting from the furnishing, performance or use of this material. No part of this document may be reproduced, transmitted, transcribed, stored in a retrievable manner or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without the prior written consent of an officer of SanDisk Corporation. All parts of the SanDisk documentation are protected by copyright law and all rights are reserved. SanDisk and the SanDisk logo are registered trademarks of SanDisk Corporation. CompactFlash is a U.S. registered trademark of SanDisk Corporation. Product names mentioned herein are for identification purposes only and may be trademarks and/or registered trademarks of their respective companies. © 2003 SanDisk Corporation. All rights reserved. SanDisk products are covered or licensed under one or more of the following U.S. Patent Nos. 5,070,032; 5,095,344; 5,168,465; 5,172,338; 5,198,380; 5,200,959; 5,268,318; 5,268,870; 5,272,669; 5,418,752; 5,602,987. Other U.S. and foreign patents awarded and pending. Lit. No. 20-10-00038 Rev. 10.1BA 9/2003 Printed in U.S.A. Revision History • Revisions before Rev. 5—initial release and general changes. • Revision 5—general editorial changes, CF Type II information added, new higher capacities products added, some lower capacities removed, new card reader/writer vendor added. • Revision 6—added new 256 Mbit technology products, general and editorial changes. • Revision 7—changes to Translate Sector command (page 73) and Device Control Register Enable bit (page 53) • Revision 8—removed CF Type II information, added new higher capacity products, removed some lower capacity products, broadened temperature ranges for 3.3V and 5V operation, modified read & write timing specifications. • Revision 9—manual format and minor technical and editorial changes. • Revision 9.1—minor technical and editorial changes. • Revision 10.0—technical and editorial changes • Revision 10.1—technical and editorial changes ii CompactFlash® Memory Card Product Manual, Rev. 10.1 © 2003 SANDISK CORPORATION Table of Contents 1. Introduction to the CompactFlash Memory Card ............................................................................................... 1-1 1.1. Scope................................................................................................................................................. 1-2 1.2. System Features................................................................................................................................. 1-2 1.3. PCMCIA Standard ............................................................................................................................ 1-2 1.4. CompactFlash Specification.............................................................................................................. 1-3 1.5. Related Documentation ..................................................................................................................... 1-3 1.6. Functional Description ...................................................................................................................... 1-3 1.6.1. Technology Independence....................................................................................................... 1-4 1.6.2. Defect and Error Management ................................................................................................ 1-4 1.6.3. Wear Leveling......................................................................................................................... 1-4 1.6.4. Using the Erase Sector and Write without Erase Commands.................................................. 1-4 1.6.5. Automatic Sleep Mode............................................................................................................ 1-5 1.6.6. Dynamic Adjustment of Performance versus Power Consumption ........................................ 1-5 1.6.7. Power Supply Requirements ................................................................................................... 1-5 2. Product Specifications ........................................................................................................................................ 2-1 2.1. System Environmental Specifications............................................................................................... 2-1 2.2. System Power Requirements............................................................................................................. 2-1 2.3. System Performance.......................................................................................................................... 2-2 2.4. System Reliability ............................................................................................................................. 2-2 2.5. Physical Specifications...................................................................................................................... 2-2 2.6. Capacity Specifications ..................................................................................................................... 2-3 3. CompactFlash Memory Card Interface Description ........................................................................................... 3-1 3.1. Physical Description.......................................................................................................................... 3-1 3.1.1. Pin Assignments and Pin Type................................................................................................ 3-1 3.2. Electrical Description........................................................................................................................ 3-3 3.3. Electrical Specification...................................................................................................................... 3-6 3.3.1. Input Leakage Control............................................................................................................. 3-7 3.3.2. Input Characteristics................................................................................................................ 3-7 3.3.3. Output Drive Type .................................................................................................................. 3-7 3.3.4. Output Drive Characteristics................................................................................................... 3-8 3.3.5. Power-up/Power-down Timing ...............................................................................................3-8 3.3.6. Common Memory Read Timing ............................................................................................. 3-10 3.3.7. Common and Attribute Memory Write Timing ...................................................................... 3-11 3.3.8. Attribute Memory Read Timing Specification........................................................................ 3-12 3.3.9. Memory Timing Diagrams...................................................................................................... 3-12 3.3.10. I/O Read (Input) Timing Specification.................................................................................. 3-14 3.3.11. I/O Write (Output) Timing Specification.............................................................................. 3-16 3.3.12. True IDE Mode ..................................................................................................................... 3-17 3.3.12.1. Deskewing............................................................................................................ 3-17 3.3.12.2. Transfer Timing ................................................................................................... 3-17 3.4. Card Configuration............................................................................................................................ 3-20 3.4.1. Attribute Memory Function..................................................................................................... 3-21 3.4.2. Configuration Option Register (Address 200h in Attribute Memory) .................................... 3-22 3.4.3. Card Configuration and Status Register (Address 202h in Attribute Memory) ...................... 3-23 3.4.4. Pin Replacement Register (Address 204h in Attribute Memory)............................................ 3-23 3.4.5. Socket and Copy Register (Address 206h in Attribute Memory............................................. 3-24 3.5. I/O Transfer Function........................................................................................................................ 3-24 3.5.1. I/O Function ...........................................................................................................................
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