Tms320f280x, Tms320c280x, Tms320f2801x Digital Signal Processors
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TMS320F2809, TMS320F2808, TMS320F2806, TMS320F2802, TMS320F2801, TMS320C2802, TMS320F2809, TMS320F2808, TMS320F2806,TMS320C2801, TMS320F2802, TMS320F28016, TMS320F2801, TMS320F28015TMS320C2802, www.ti.com TMS320C2801,SPRS230P – OCTOBER TMS320F28016, 2003 – REVISED TMS320F28015 FEBRUARY 2021 SPRS230P – OCTOBER 2003 – REVISED FEBRUARY 2021 TMS320F280x, TMS320C280x, TMS320F2801x digital signal processors 1 Features • Three 32-bit CPU timers • Enhanced control peripherals • High-performance static CMOS technology – Up to 16 PWM outputs – 100 MHz (10-ns cycle time) – Up to 6 HRPWM outputs with 150-ps MEP – 60 MHz (16.67-ns cycle time) resolution – Low-power (1.8-V core, 3.3-V I/O) design – Up to four capture inputs • JTAG boundary scan support – Up to two quadrature encoder interfaces – IEEE Standard 1149.1-1990 Standard Test – Up to six 32-bit/six 16-bit timers Access Port and Boundary Scan Architecture • Serial port peripherals • High-performance 32-bit CPU (TMS320C28x) – Up to 4 SPI modules – 16 × 16 and 32 × 32 MAC operations – Up to 2 SCI (UART) modules – 16 × 16 dual MAC – Up to 2 CAN modules – Harvard bus architecture – One Inter-Integrated-Circuit (I2C) bus – Atomic operations • 12-bit ADC, 16 channels – Fast interrupt response and processing – 2 × 8 channel input multiplexer – Unified memory programming model – Two sample-and-hold – Code-efficient (in C/C++ and Assembly) – Single/simultaneous conversions • On-chip memory – Fast conversion rate: – F2809: 128K × 16 flash, 18K × 16 SARAM 80 ns - 12.5 MSPS (F2809 only) F2808: 64K × 16 flash, 18K × 16 SARAM 160 ns - 6.25 MSPS (280x) F2806: 32K × 16 flash, 10K × 16 SARAM 267 ns - 3.75 MSPS (F2801x) F2802: 32K × 16 flash, 6K × 16 SARAM – Internal or external reference F2801: 16K × 16 flash, 6K × 16 SARAM • Up to 35 individually programmable, multiplexed F2801x: 16K × 16 flash, 6K × 16 SARAM GPIO pins with input filtering – 1K × 16 OTP ROM (flash devices only) • Advanced emulation features – C2802: 32K × 16 ROM, 6K × 16 SARAM – Analysis and breakpoint functions C2801: 16K × 16 ROM, 6K × 16 SARAM – Real-time debug via hardware • Boot ROM (4K × 16) • Development support includes – With software boot modes (via SCI, SPI, CAN, I2C, and parallel I/O) – ANSI C/C++ compiler/assembler/linker ™ – Standard math tables – Code Composer Studio IDE • Clock and system control – SYS/BIOS – On-chip oscillator – Digital motor control and digital power software libraries – Watchdog timer module • Low-power modes and power savings • Any GPIO A pin can be connected to one of the three external core interrupts – IDLE, STANDBY, HALT modes supported • Peripheral Interrupt Expansion (PIE) block that – Disable individual peripheral clocks supports all 43 peripheral interrupts • Package options • Endianness: Little endian – Thin quad flatpack (PZ) • 128-bit security key/lock – MicroStar BGA™ (GGM, ZGM) – Protects flash/OTP/L0/L1 blocks • Temperature options – Prevents firmware reverse-engineering – A: –40°C to 85°C (PZ, GGM, ZGM) – S: –40°C to 125°C (PZ, GGM, ZGM) – Q: –40°C to 125°C (PZ) (AEC-Q100 qualification for automotive applications) CopyrightAn © IMPORTANT2021 Texas Instruments NOTICE Incorporated at the end of this data sheet addresses availability, warranty, changes, use inSubmit safety-critical Document applications, Feedback 1 intellectual property matters and other important disclaimers. PRODUCTION DATA. Product Folder Links: TMS320F2809 TMS320F2808 TMS320F2806 TMS320F2802 TMS320F2801 TMS320C2802 TMS320C2801 TMS320F28016 TMS320F28015 TMS320F2809, TMS320F2808, TMS320F2806, TMS320F2802, TMS320F2801, TMS320C2802, TMS320C2801, TMS320F28016, TMS320F28015 SPRS230P – OCTOBER 2003 – REVISED FEBRUARY 2021 www.ti.com 2 Applications • Digital power • Motor drive and control 3 Description The TMS320F2809, TMS320F2809-Q1, TMS320F2808, TMS320F2808-Q1 TMS320F2806, TMS320F2802, TMS320F2801-Q1, TMS320F28015-Q1, TMS320F28016-Q1, TMS320C2802-Q1, and TMS320C2801 devices, members of the TMS320C28x DSP generation, are highly integrated, high-performance solutions for demanding control applications. Throughout this document, TMS320F2809, TMS320F2809-Q1 TMS320F2808, TMS320F2808-Q1 TMS320F2806, TMS320F2802-Q1, TMS320F2801-Q1, TMS320C2802, TMS320C2801, TMS320F28015-Q1, and TMS320F28016-Q1 are abbreviated as F2809, F2808, F2806, F2802-Q1, F2801-Q1, C2802, C2801, F28015-Q1, and F28016-Q1, respectively. TMS320F28015-Q1 and TMS320F28016-Q1 are abbreviated as F2801x. Device Comparison (100-MHz Devices) and Device Comparison (60-MHz Devices) provide a summary of features for each device. Device Information PART NUMBER(1) PACKAGE BODY SIZE TMS320F2809ZGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F2808ZGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F2806ZGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F2802ZGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F2801ZGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320C2802ZGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320C2801ZGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F28016ZGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F28015ZGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F2809GGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F2808GGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F2806GGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F2802GGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F2801GGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320C2802GGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320C2801GGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F28016GGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F28015GGM BGA MicroStar (100) 10.0 mm × 10.0 mm TMS320F2809PZ LQFP (100) 14.0 mm × 14.0 mm TMS320F2808PZ LQFP (100) 14.0 mm × 14.0 mm TMS320F2806PZ LQFP (100) 14.0 mm × 14.0 mm TMS320F2802PZ LQFP (100) 14.0 mm × 14.0 mm TMS320F2801PZ LQFP (100) 14.0 mm × 14.0 mm TMS320C2802PZ LQFP (100) 14.0 mm × 14.0 mm TMS320C2801PZ LQFP (100) 14.0 mm × 14.0 mm TMS320F28016PZ LQFP (100) 14.0 mm × 14.0 mm TMS320F28015PZ LQFP (100) 14.0 mm × 14.0 mm (1) For more information on these devices, see Mechanical, Packaging, and Orderable Information. 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TMS320F2809 TMS320F2808 TMS320F2806 TMS320F2802 TMS320F2801 TMS320C2802 TMS320C2801 TMS320F28016 TMS320F28015 TMS320F2809, TMS320F2808, TMS320F2806, TMS320F2802, TMS320F2801, TMS320C2802, TMS320C2801, TMS320F28016, TMS320F28015 www.ti.com SPRS230P – OCTOBER 2003 – REVISED FEBRUARY 2021 4 Functional Block Diagram Memory Bus TINT0 Real-Time JTAG 32-bit CPU TIMER 0 (TDI, TDO,TRST , TCK, TMS, EMU0, EMU1) TINT1 7 32-bit CPU TIMER 1 TINT2 32-bit CPU TIMER 2 INT14 M0 SARAM 1K x 16 PIE (A) M1 SARAM (96 Interrupts) INT[12:1] 1K x 16 NMI, INT13 L0 SARAM External Interrupt 4K x 16 Control 32 (0-wait) 4 (B) SCI-A/B FIFO L1 SARAM 4K x 16 16 (0-wait) SPI-A/B/C/D FIFO (C) 2 H0 SARAM I2C-A FIFO 8K x 16 4 (0-wait) eCAN-A/B (32 mbox) 8 eQEP1/2 GPIOs (35) 4 eCAP1/2/3/4 C28x CPU ROM GPIO MUX (4 32-bit Timers) (100 MHz) 32K x 16 (C2802) 16K x 16 (C2801) 12 ePWM1/2/3/4/5/6 6 (12 PWM Outputs, 6 Trip Zones, 6 16-bit Timers) FLASH 128K x 16 (F2809) 64K x 16 (F2808) 32K x 16 (F2806) 32 SYSCLKOUT 32K x 16 (F2802) 16K x 16 (F2801) 16K x 16 (F2801x) System Control RS XCLKOUT XRS (Oscillator, PLL, CLKIN XCLKIN Peripheral Clocking, Low-Power Modes, X1 (D) Watchdog) OTP X2 1K x 16 ADCSOCA/B SOCA/B Boot ROM 4K x 16 12-Bit ADC (1-wait state) 16 Channels Protected by the code-security module. Peripheral Bus Copyright © 2016, Texas Instruments Incorporated A. 43 of the possible 96 interrupts are used on the devices. B. Not available in F2802, F2801, C2802, and C2801. C. Not available in F2806, F2802, F2801, C2802, and C2801. D. The 1K x 16 OTP has been replaced with 1K x 16 ROM for C280x devices. Figure 4-1. Functional Block Diagram Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TMS320F2809 TMS320F2808 TMS320F2806 TMS320F2802 TMS320F2801 TMS320C2802 TMS320C2801 TMS320F28016 TMS320F28015 TMS320F2809, TMS320F2808, TMS320F2806, TMS320F2802, TMS320F2801, TMS320C2802, TMS320C2801, TMS320F28016, TMS320F28015 SPRS230P – OCTOBER 2003 – REVISED FEBRUARY 2021 www.ti.com Table of Contents 1 Features............................................................................1 8.13 Thermal Design Considerations..............................33 2 Applications.....................................................................2 8.14 Timing and Switching Characteristics..................... 34 3 Description.......................................................................2 8.15 On-Chip Analog-to-Digital Converter...................... 60 4 Functional Block Diagram.............................................. 3 8.16 Migrating From F280x Devices to C280x Devices..66 5 Revision History.............................................................. 5 8.17 ROM Timing (C280x only).......................................67 6 Device Comparison.........................................................6 9 Detailed Description......................................................68 6.1 Related Products........................................................ 8 9.1 Brief Descriptions......................................................68 7 Terminal Configuration and Functions..........................9 9.2 Peripherals................................................................75 7.1 Pin Diagrams.............................................................. 9 9.3 Memory Maps ........................................................ 108 7.2 Signal Descriptions..................................................