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Three-Dimensional Mesostructures As High-Temperature Growth Templates

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Three-Dimensional Mesostructures As High-Temperature Growth Templates Three-dimensional mesostructures as high-temperature PNAS PLUS growth templates, electronic cellular scaffolds, and self-propelled microrobots Zheng Yana,b,1, Mengdi Hanc,d,e,1, Yan Shif,g,h,i, Adina Badeaj, Yiyuan Yangk, Ashish Kulkarnic,d, Erik Hansonl, Mikhail E. Kandelm, Xiewen Wenn, Fan Zhangf,g,h, Yiyue Luoc,d, Qing Linc,d, Hang Zhangf,g,h, Xiaogang Guof,g,h, Yuming Huangc,d, Kewang Nano, Shuai Jian, Aaron W. Orahamj, Molly B. Mevisj, Jaeman Limc,d, Xuelin Guoc,d, Mingye Gaoc,d, Woomi Ryuc,d, Ki Jun Yup, Bruno G. Nicolauj, Aaron Petronicoj, Stanislav S. Rubakhinj, Jun Loun, Pulickel M. Ajayann, Katsuyo Thorntonl, Gabriel Popescum, Daining Fangq,r, Jonathan V. Sweedlerj, Paul V. Braunc,d, Haixia Zhange, Ralph G. Nuzzoc,d,j, Yonggang Huangk,s,t, Yihui Zhangf,g,h,2, and John A. Rogersk,t,u,v,w,x,y,2 aDepartment of Chemical Engineering, University of Missouri, Columbia, MO 65211; bDepartment of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO 65211; cDepartment of Materials Science and Engineering, University of Illinois at Urbana–Champaign, Urbana, IL 61801; dFrederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign, Urbana, IL 61801; eNational Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing 100871, People’s Republic of China; fCenter for Mechanics and Materials, Tsinghua University, Beijing 100084, People’s Republic of China; gCenter for Flexible Electronics Technology, Tsinghua University, Beijing 100084, People’s Republic of China; hApplied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, People’s Republic of China; iState Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, People’s Republic of China; jSchool of Chemical Sciences, University of Illinois at Urbana–Champaign, Urbana, IL 61801; kDepartment of Mechanical Engineering, Northwestern University, Evanston, IL 60208; lDepartment of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109; mBeckman Institute of Advanced Science and Technology, Quantitative Light Imaging Laboratory, University of Illinois at Urbana–Champaign, Urbana, IL 61801; nDepartment of Materials Science and NanoEngineering, Rice University, Houston, TX 77005; oDepartment of Mechanical Science and Engineering, University of Illinois at Urbana– Champaign, Urbana, IL 61801; pSchool of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea; qInstitute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, People’s Republic of China; rBeijing Key Laboratory of Lightweight Multi-Functional Composite Materials and Structures, Beijing Institute of Technology, Beijing 100081, People’s Republic of China; sDepartment of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208; tDepartment of Materials Science and Engineering, Northwestern University, Evanston, IL 60208; uDepartment of Biomedical Engineering, Northwestern University, Evanston, IL 60208; vDepartment of Neurological Surgery, Northwestern University, ENGINEERING Evanston, IL 60208; wDepartment of Chemistry, Northwestern University, Evanston, IL 60208; xDepartment of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208; and yCenter for Bio-Integrated Electronics, Simpson Querrey Institute for BioNanotechnology, Northwestern University, Evanston, IL 60208 Contributed by John A. Rogers, September 29, 2017 (sent for review August 7, 2017; reviewed by Firat Guder and Glaucio H. H. Paulino) Recent work demonstrates that processes of stress release in pre- electromechanical components (14), optics, and optoelectronics strained elastomeric substrates can guide the assembly of sophisti- (15). Existing fabrication methods include nozzle- and light-based cated 3D micro/nanostructures in advanced materials. Reported methods in 3D printing (16–19), stress-controlled bending (20– application examples include soft electronic components, tunable electromagnetic and optical devices, vibrational metrology platforms, Significance and other unusual technologies, each enabled by uniquely engi- neered 3D architectures. A significant disadvantage of these systems Exploiting advanced 3D designs in micro/nanomanufacturing in- is that the elastomeric substrates, while essential to the assembly spires potential applications in various fields including biomedical process, can impose significant engineering constraints in terms of engineering, metamaterials, electronics, electromechanical com- operating temperatures and levels of dimensional stability; they also ponents, and many others. The results presented here provide prevent the realization of 3D structures in freestanding forms. Here, enabling concepts in an area of broad, current interest to the we introduce concepts in interfacial photopolymerization, nonlinear materials community––strategies for forming sophisticated 3D mechanics, and physical transfer that bypass these limitations. The micro/nanostructures and means for using them in guiding the results enable 3D mesostructures in fully or partially freestanding growth of synthetic materials and biological systems. These ideas forms, with additional capabilities in integration onto nearly any offer qualitatively differentiated capabilities compared with class of substrate, from planar, hard inorganic materials to textured, those available from more traditional methodologies in 3D soft biological tissues, all via mechanisms quantitatively described by printing, multiphoton lithography, and stress-induced bending–– theoretical modeling. Illustrations of these ideas include their use in the result enables access to both active and passive 3D meso- 3D structures as frameworks for templated growth of organized structures in state-of-the-art materials, as freestanding systems lamellae from AgCl–KCl eutectics and of atomic layers of WSe from 2 or integrated with nearly any type of supporting substrate. vapor-phase precursors, as open-architecture electronic scaffolds for formation of dorsal root ganglion (DRG) neural networks, and as Author contributions: Z.Y., M.H., Y.S., Yonggang Huang, Y.Z., and J.A.R. designed research; catalyst supports for propulsive systems in 3D microswimmers with Z.Y., M.H., Y.S., A.B., Y.Y., A.K., E.H., M.E.K., X.W., F.Z., Y.L., Q.L., Hang Zhang, Xiaogang geometrically controlled dynamics. Taken together, these methodol- Guo, Yuming Huang, K.N., S.J., A.W.O., M.B.M., J. Lim, Xuelin Guo, M.G., W.R., K.J.Y., B.G.N., ogies establish a set of enabling options in 3D micro/nanomanufac- A.P., and S.S.R. performed research; Z.Y., M.H., Y.S., A.B., Y.Y., A.K., E.H., M.E.K., X.W., S.S.R., Y.Z., and J.A.R. analyzed data; and Z.Y., M.H., A.B., A.K., E.H., J. Lou, P.M.A., K.T., G.P., D.F., turing that lie outside of the scope of existing alternatives. J.V.S., P.V.B., Haixia Zhang, R.G.N., Yonggang Huang, Y.Z., and J.A.R. wrote the paper. Reviewers: F.G., Imperial College London; and G.H.H.P., Georgia Institute of Technology. three-dimensional printing | three-dimensional microstructures | The authors declare no conflict of interest. eutectics | two-dimensional materials | electronic cellular scaffolds This open access article is distributed under Creative Commons Attribution-NonCommercial- NoDerivatives License 4.0 (CC BY-NC-ND). rowing interest in approaches for 3D micro/nanomanufacturing 1Z.Y. and M.H. contributed equally to this work. Gderives, in part, from the potential to exploit advanced, 3D 2To whom correspondence may be addressed. Email: [email protected] or jrogers@ designs in emergent technologies, from biomedical devices (1–4), northwestern.edu. – microrobotics (5 7), metamaterials (8, 9) and platforms for energy This article contains supporting information online at www.pnas.org/lookup/suppl/doi:10. storage and conversion (10, 11) to integrated electronics (12, 13), 1073/pnas.1713805114/-/DCSupplemental. www.pnas.org/cgi/doi/10.1073/pnas.1713805114 PNAS Early Edition | 1of10 Downloaded by guest on October 2, 2021 22), colloidal self-assembly (23, 24), templated growth, and others Fig. 1D). In all cases, the 3D structures are mechanically robust (25–27). Although each offers powerful capabilities, none is and can be mechanically manipulated onto other objects such as without significant, intrinsic limitations––some in realizable ge- human hairs and needle tips as shown in Fig. 1 F and G and SI ometries, feature sizes, and/or throughputs, others in access to high- Appendix, Fig. S2 B–D, without fracture. Bases with other geom- performance materials, and yet others in compatibility with state-of- etries, such as thin rings (thickness: ∼50 μm, inner radius: 700 μm, the-art 2D processing techniques such as photolithography, laser outer radius: 1.1 mm), are also possible (Fig. 1H). Finite-element cutting, thin-film deposition, epitaxial growth, etching, and doping. analysis (FEA) simulations can capture all of the fine details ob- In this context, routes to 3D mesostructures that exploit non- served in experiment (SI Appendix,Fig.S3A). The success rate of linear buckling of 2D precursors initiated through stress relaxation forming 3D freestanding with photodefined bases is ∼90% (i.e., of in prestrained elastomeric substrates offer some important capa- ∼50 samples, 5 failed). Fracture of the bases, typically near the bilities. In particular, these methods provide
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