2018 Award, Plenary & Keynotes Announced! Technical Session and Organizers: 2018 Program Chair Plasma on Surface and Interfaces Joelle Frechette, Johns Hopkins University, USA Carlos Barrios, 3M Company, USA Additive Manufacturing Mark Strobel, 3M Company, USA Michael Bortner, Virginia Tech, USA Particulate Adhesion Amy Peterson, Worcester Polytechnic Institute, USA Carson Meredith, Georgia Institute of Technology, USA Erich Bain, US Army Research Laboratory, USA Physical Properties and Design of Bioadhesives Novel Tools & Methods for Characterization Boxin Zhao, University of Waterloo, USA Chelsea Davis, Purdue University, USA Dan Sameoto, University of Alberta, Canada Aaron Forster, National Institute of Standards & Technology, USA Jason Nadler, Georgia Institute of Technology, USA Surface Preparation for Bonding Bioadhesive Chemistry Frank Palmieri, NASA-LARC, USA Niels Holten-Andersen, Massachusetts Institute of Award of Excellence Honoree Dan Knorr, US Army Research Laboratory, USA Technology, USA Ray Pearson, Lehigh University, USA Transportation Haeshin Lee, Korea Advance Institute of Science Aaron Mann, LORD Corporation, USA and Technology, Republic of Korea Terry Steele, Plenary Speakers Kay Blohowiak, The Boeing Company, USA Nanyang Technological University, Singapore Eduard Arzt, Leibniz Institute for New Materials, Germany Fracture Mechanics Organismal Adhesion Jian Ping Gong, Hokkaido University, Japan Alyssa Stark, Chenglin Wu, Missouri University of Science and Technology, USA Villanova University, USA Elie Raphael, ESPCI, France Alexis Noel, Bamber Blackman, Imperial College London, UK Georgia Institute of Technology, USA Hung-Jue Sue, Texas A&M University, USA Elasticity and Capillarity in Adhesion Biomedical Adhesives and Clinical Applications Bruce Lee, Michael Bartlett, Iowa State University, USA Michigan Technological University, USA Keynote Speakers Kolbe Ahn, Robert Style, ETH Zurich, Switzerland University of California, Santa Barbara, USA Jin-Soo Ahn, Seoul National University, South Korea Yuhan Lee, Harvard Medical School, USA Arnaud Antkowiak, Université Pierre et Marie Curie, France Materials and Interfaces for Soft Technology Kay Blohowiak, The Boeing Company, USA Michael Bartlett, Iowa State University, USA Adhesives for Electronics Chris Campbell, David Bourell, University of Texas, Austin, USA Robert Style, ETH Zurich, Switzerland 3M Company, USA John Connell, NASA Langley, USA Arlin Weikel, Corning, Inc., USA Alfred Crosby, University of Massachusetts, Amherst, USA Gels Costantino Creton, ESPCI, France Rheology Mark Dadmun, University of Tennessee, Knoxville, USA Ali Dhinojwala, University of Akron, USA Pascal Damman, Université de Mons, Belgium Tribology Vivek Sharma, University of Illinois at Chicago, USA Michael Dickey, North Carolina State University, USA Frederic Restagno, Université Paris-Sud, France Mark Foster, University of Akron, USA Noshir Pesika, Tulane University, USA Novel Chemistry David Hays, 3M Company, USA Karl Benson, 3M Company, USA Jia Cho Ho, Industrial Technology Research Institute (ITRI), Taiwan Wettability and Surface Interactions Scott Phillips, Boise State University, USA Jacob Israelachvili, University of California, Santa Barbara, USA Alidad Amirfazli, York University, Canada Chuck Extrand, Colder Products Company, USA Innovative Polyurethane Adhesives Huda Jerri, Firmenich, USA José Miguel Martín Martínez, Laboratorio de Pierre Lambert, Université Libre de Bruxelles, Belgium Adhesión y Adhesivos Universidad de Alicante, Spain Anke Linder, ESPCI, France Alba Marcellan, ESPCI, France Robin Ras, University of Alto, Finland Call for Abstract, We strongly encourage you to submit an abstract for the 2018 Annual Meeting being held on February 25-March Gregory Sawyer, University of Florida, USA SubmissionS 1 in conjunction with the 6th World Congress on Adhesion and Related Phenomena at the Catamaran Resort Hotel. Manfred Schmid, ETH Zurich, Switzerland You can submit an abstract at www.adhesionsociety.org/. Mark Strobel, 3M Company, USA Abstract deadline: If you have any questions regarding the relevant topics, please contact Joelle Frechette at [email protected]. Michael Thouless, University of Michigan, USA September 15, 2017 For questions regarding submissions, please contact Malinda Armstrong at [email protected]. Yu Tian, Tsinghua University, China Orlin Velev, North Carolina State University, USA Peebles & Poster Awards – see website for submission and qualifications. Herbert Waite, University of California, Santa Barbara, USA www.adhesionsociety.org