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VAX 4000 Model 200 (BA430) Operation Manual

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VAX 4000 Model 200 (BA430) Operation Manual VAX 4000 Model 200 (BA430) Operation Order Number EK–395AB–OM–002 Digital Equipment Corporation Maynard, Massachusetts First Printing, December 1990 Revised, June 1991 The information in this document is subject to change without notice and should not be construed as a commitment by Digital Equipment Corporation. Digital Equipment Corporation assumes no responsibility for any errors that may appear in this document. The software, if any, described in this document is furnished under a license and may be used or copied only in accordance with the terms of such license. No responsibility is assumed for the use or reliability of software or equipment that is not supplied by Digital Equipment Corporation or its affiliated companies. Restricted Rights: Use, duplication or disclosure by the U.S. Government is subject to restrictions as set forth in subparagraph (c)(1)(ii) of the Rights in Technical Data and Computer Software clause at DFARS 252.227–7013. © Digital Equipment Corporation, 1991. All rights reserved. Printed in U.S.A. The Reader’s Comments form at the end of this document requests your critical evaluation to assist in preparing future documentation. The following are trademarks of Digital Equipment Corporation: CompacTape, CX, DDCMP, DEC, DECconnect, DECdirect, DECnet, DECscan, DECserver, DECUS, DECwindows, DELNI, DEMPR, DESQA, DESTA, DSRVB, DSSI, IVAX, KDA, KLESI, KRQ50, MicroVAX, MSCP, Q-bus, Q22-bus, RA, RQDX, RV20, SA, SDI, ThinWire, TK, TMSCP, TQK, TS05, TU, VAX, VAX 4000, VAXcluster, VAX DOCUMENT, VAXELN, VAXlab, VAXserver, VMS, VT, and the DIGITAL logo. X Window System is a trademark of Massachusetts Institute of Technology. FCC NOTICE: The equipment described in this manual generates, uses, and may emit radio frequency energy. The equipment has been type tested and found to comply with the limits for a Class A computing device pursuant to Subpart J of Part 15 of FCC Rules, which are designed to provide reasonable protection against such radio frequency interference when operated in a commercial environment. Operation of this equipment in a residential area may cause interference, in which case the user at his own expense may be required to take measures to correct the interference. S1680 This document was prepared using VAX DOCUMENT, Version 1.2. Contents Preface ix Chapter 1 System Overview 1.1 Front View and Physical Description ................... 1–2 1.1.1 BA430 Enclosure . .............................. 1–6 1.1.1.1 Mass Storage Shelf ............................ 1–8 1.1.1.2 Card Cage ................................... 1–10 1.1.1.3 CPU Cover Panel .............................. 1–12 1.1.1.4 DSSI and KZQSA Connectors .................... 1–14 1.1.1.5 Power Supply Controls and Indicators . ............. 1–15 1.1.1.6 Fans . ...................................... 1–18 1.2 Functional Description of Base System ................. 1–19 1.2.1 Base System Components . ...................... 1–19 1.2.1.1 Central Processing Unit (CPU) ................... 1–20 1.2.1.2 Console Serial Line Unit (SLU) ................... 1–20 1.2.1.3 Main Memory . .............................. 1–20 1.2.1.4 Network Controller ............................ 1–20 1.2.1.5 Embedded DSSI Host Adapter .................... 1–21 1.2.2 Optional Components ............................. 1–21 1.2.2.1 Mass Storage Devices and Controllers . ............. 1–21 1.2.2.2 Mass Storage Subsystems . ...................... 1–22 1.2.2.3 Mass Storage Expanders . ...................... 1–22 1.2.2.4 Communications Controllers ..................... 1–23 1.2.2.5 Real-Time Controllers .......................... 1–25 1.2.2.6 Printer Interfaces .............................. 1–25 1.2.2.7 Other Available Options . ...................... 1–25 1.3 Dual-Host Capability (VMS Systems Only) . ............. 1–25 iii Chapter 2 Operating the System 2.1 Before You Operate the System . ...................... 2–1 2.2 Switch Settings ................................... 2–1 2.2.1 Normal Operation . .............................. 2–1 2.2.2 Special Operation . .............................. 2–2 2.3 Turning On the System ............................. 2–4 2.4 Booting the System . .............................. 2–6 2.4.1 Autobooting the System ........................... 2–6 2.4.2 Booting the System from Console Mode . ............. 2–12 2.5 Using the System .................................. 2–13 2.6 Halting the System . .............................. 2–13 2.7 Restarting the System .............................. 2–14 2.8 Turning Off the System ............................. 2–14 2.9 Recovering from an Over Temperature Condition ......... 2–15 Chapter 3 Operating the System Options 3.1 Mass Storage Options .............................. 3–1 3.1.1 RF-Series Integrated Storage Elements . ............. 3–2 3.1.1.1 RF-Series Controls and Indicators ................. 3–2 3.1.1.2 Changing the Bus Node ID Plugs ................. 3–5 3.1.2 TF85 Tape Drive . .............................. 3–6 3.1.2.1 Design of the Drive ............................ 3–8 3.1.2.2 Labeling a Tape Cartridge . ...................... 3–8 3.1.2.3 Write-Protecting a Tape Cartridge ................. 3–9 3.1.2.4 Inserting a Tape Cartridge . ...................... 3–12 3.1.2.5 Removing a Tape Cartridge ...................... 3–15 3.1.2.6 Summary of TF85 Tape Drive Controls and Indicators . 3–17 3.1.2.7 Cleaning the TF85 Tape . ...................... 3–18 3.1.3 TK70 Tape Drive . .............................. 3–18 3.1.3.1 Design of the Drive ............................ 3–20 3.1.3.2 Labeling a Tape Cartridge . ...................... 3–20 3.1.3.3 Write-Protecting a Tape Cartridge ................. 3–21 3.1.3.4 Tape Cartridge Handling and Storage Guidelines ..... 3–24 3.1.3.5 Inserting a Tape Cartridge . ...................... 3–24 3.1.3.6 Removing a Tape Cartridge ...................... 3–27 iv 3.1.3.7 Summary of TK70 Tape Drive Controls and Indicator Lights . ...................................... 3–29 3.1.4 TLZ04 Tape Drive . .............................. 3–30 3.1.4.1 Proper Handling of Cassette Tapes . ............. 3–32 3.1.4.2 Setting the Write-Protect Tab on the Cassette Tape .... 3–33 3.1.4.3 Inserting a Cassette Tape into the Drive ............ 3–34 3.1.4.4 System Software .............................. 3–35 3.1.4.5 Cleaning the Heads ............................ 3–36 3.1.5 RV20 Optical Disk Subsystem ...................... 3–37 3.1.6 RRD40-Series Compact Disc Drive Subsystem .......... 3–38 3.1.7 TSV05 Tape Drive . .............................. 3–38 3.1.8 TSZ07 Tape Drive . .............................. 3–38 3.1.9 TU81E Tape Drive . .............................. 3–38 3.2 Communications Controller Options ................... 3–38 3.2.1 Asynchronous Serial Controllers .................... 3–38 3.2.1.1 Asynchronous Controllers Without Modem Support .... 3–39 3.2.1.2 Asynchronous Controllers with Modem Support . ..... 3–40 3.2.2 Synchronous Controllers .......................... 3–40 3.2.3 Network Controllers .............................. 3–41 3.3 Real-Time Options . .............................. 3–42 3.4 Printer Options ................................... 3–42 3.5 Adding Options ................................... 3–43 Appendix A Related Documentation Appendix B Programming Parameters for DSSI Devices B.1 DSSI Device Parameters ............................ B–1 B.2 How VMS Uses the DSSI Device Parameters ............ B–3 B.3 Examining and Setting DSSI Device Parameters .......... B–4 B.3.1 Entering the DUP Driver Utility .................... B–7 B.3.2 Setting Allocation Class ........................... B–8 B.3.3 Setting Unit Number ............................. B–9 B.3.4 Setting Node Name .............................. B–12 B.3.5 Setting System ID . .............................. B–12 B.3.6 Exiting the DUP Server Utility ..................... B–13 v Appendix C Backup Procedures C.1 Overview of Standalone BACKUP ..................... C–1 C.1.1 Installing Standalone BACKUP on the System Disk ..... C–2 C.1.2 Booting Standalone BACKUP from the System Disk ..... C–2 C.1.3 Installing Standalone BACKUP on a Tape Cartridge ..... C–3 C.1.4 Booting Standalone BACKUP from a Tape Cartridge .... C–5 C.2 Backing Up the System Disk . ...................... C–6 C.3 Restoring the System Disk ........................... C–9 Appendix D Removing Unwanted VMS Files D.1 Using VMSTAILOR . .............................. D–1 Glossary Index Examples B–1 SHOW DSSI Display (Embedded DSSI) ................. B–6 B–2 SHOW UQSSP Display (KFQSA-Based DSSI) ............ B–7 B–3 Starting the DUP Driver Utility (Embedded DSSI) . ..... B–8 B–4 Starting the DUP Driver Utility (KFQSA-Based DSSI) ..... B–8 B–5 Setting Allocation Class for a Specified Device ........... B–9 B–6 Setting a Unit Number for a Specified Device ............ B–10 B–7 Changing a Node Name for a Specified Device ............ B–12 B–8 Changing a System ID for a Specified Device ............ B–13 B–9 Exiting the DUP Driver Utility for a Specified Device . ..... B–14 B–10 SHOW DSSI Display . .............................. B–14 B–11 SHOW UQSSP Display (KFQSA-Based DSSI) ............ B–15 vi Figures 1–1 VAX 4000 Model 200 (BA430) System .................. 1–2 1–2 Key Positions ..................................... 1–3 1–3 Upper Door Opened . .............................. 1–4 1–4 Entire Door Opened . .............................. 1–5 1–5 Front View of the BA430 Enclosure .................... 1–7 1–6 Mass Storage Shelf . .............................. 1–8 1–7 Card Cage . .....................................
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