• Full Support ▲ Limited Capability ▪ Requires more than 1 product / CONTENTS

STRUCTURES FLUIDS Vibrations...... 3 General Solver Capabilities ...... 22 Webservice...... 33 High Frequency Electromagnetics...... 44 Wave Hydrodynamics...... 3 Single Phase, Non-Reacting Flows...... 22 General...... 34 Power and Signal Integrity Board Additional Physics...... 3 Heat Transfer...... 23 Designing Optimization and Parameter Simulation Capabilities...... 47 Composite Materials ...... 5 Particle Flows (Multiphase)...... 23 Identificaton (Calibration)...... 34 RLCG Parasitic Extraciton...... 48 Durability...... 6 Free Surface Flows (Multiphase)...... 24 Data Management...... 34 Electronics Cooling...... 48 Explicit Dynamics...... 6 Dispersed Multiphase Flows (Multiphase)...... 24 Process Management...... 34 Cabel Modeling...... 49 Implicit Dynamics...... 7 Reacting Flows...... 25 Application Management...... 34 HPC for Electronics...... 49 Geometric Idealization...... 7 Turbomachinery...... 26 Integrations...... 35 System Modeling for Power Electronics...... 50 Geometry and STL File Handling...... 7 In-Flight Icing...... 26 Workflow Management...... 35 System Modeling for RF / Microwave...... 50 HPC Structures...... 8 Optimization...... 26 Tool Interoperability...... 35 System Modeling for SI / PI...... 50 Materials...... 8 High Rheology Material...... 27 Mulitphysics Platform Technologies...... 51 Miscellaneous and Usability...... 9 HPC – Fluids...... 27 SAFETY ANALYSIS Multhiphysics Electro-Thermal Interation...... 51 Modeling Capabilities...... 10 Pre And Post Processing...... 27 Materials Database for Electronics...... 51 Functional Safety Analysis ...... 36 Multi Analysis...... 10 Multiphysics ...... 28 Miscellaneous...... 51 Cybersecurity Analysis ...... 36 Nonlinear Transient Dynamics...... 10 Fluid-Structure Interaction...... 28 Optimization...... 11 Electro-Thermal Interaction...... 28 PHOTONICS Structural Solver Capabilties...... 11 Other Coupled Interactions...... 28 OPTICS AND VR Design Environment...... 52 Thermal...... 11 Ease of Use and Productivity...... 28 Ansys Products Embedded...... 37 General...... 52 Topology and Lattice Optimization...... 12 General Solver Capabilities...... 37 General Solver Capabilities...... 52 Particle Methods...... 12 Photometry / Radiometry...... 37 Materials Selection & Related Tools...... 53 Automotive...... 12 AUTONOMOUS VEHICLE Huan Vision...... 38 Optimization...... 53 SIMULATION Wavelength Range...... 38 Post Processing...... 53 SOUND SIMULATION Human Vision ...... 29 Optical Design...... 38 Headlamp Simulation...... 29 Tool Interoperability...... 54 Acoustics & Sound Quality ...... 14 Head-Up Display...... 39 System Simulation...... 29 HPC - SPEOS...... 39 Context Simulation...... 29 Simulation Preparation...... 39 DESIGN TOOLS ADDITIVE MANUFACTURING Rendering Engine...... 29 Post Processing...... 40 3D Printing...... 55 Additive Prep...... 15 VR...... 29 Optimization...... 41 Design & Concept Modeling...... 55 Workbench Additive...... 15 Optical Measurement Device...... 41 Fluid...... 55 Additive Print...... 16 DIGITAL TWIN Measurement Capability...... 41 Interfaces and Add-Ons...... 55 Additive Science...... 17 System Simulation, Validation and Use Cases...... 41 Materials Data for Designers and Simulation...... 55 Digital Twins ...... 30 System Simulation...... 42 Multiphysics...... 55 MATERIALS Context Simulation...... 42 Reverse Engineering...... 55 Materials Data Management...... 18 Rendering Engine...... 42 Structural...... 56 EMBEDDED SOFTWARE VR...... 42 Thermal...... 56 Materials Data Analysis...... 18 Model-Based Systems Engineering ...... 31 Solver...... 42 Data Flow Management...... 19 Embedded Control & HMI Software ...... 31 Integrations with CAD, CAE, PLM...... 19 Perception Software Testing ...... 32 GEOMETRY Restricted Substances...... 19 ELECTRONICS General ...... 57 Materials Selection & Related Tools...... 19 Low Frequency Electromagnetics...... 43 Data Library for Industry...... 20 PLATFORM Magnetic Transient...... 43 Licensing...... 33 Teaching Resources...... 20 Advanced Magnetic Modeling...... 43 Process Integration...... 33 Granta MI - Additive...... 21 Concept Design Solution for Workbench Connector...... 33 Electrical Maching...... 44 Post Processing...... 33 © 2021 ANSYS, Inc. All Rights Reserved.

2 MECHANICAL MECHANICAL MECHANICAL / STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent VIBRATIONS 3 = Ansys DesignXplorer Modal • • • • • 4 = Ansys SpaceClaim Modal - Pre-Stressed • • • • 5 = Ansys Customization Suite (ACS) Modal - Damped/UnSymmetric • • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Transient - Mode-Superposition • • • 7 = Ansys Granta Materials Data for Simulation Harmonic - Mode-Superposition • • • • 8 = Ansys Additive Suite Harmonic - Full • • ▲ • 9 = Ansys Composite Cure Simulation

Spectrum • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric Random Vibration • • • • 11 = Ansys SPEOS Mistuning • • 12 = Ansys SPEOS & Ansys SPEOS for NX Rotordynamics • • • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Modal Acoustic • • • DMP = Distributed-memory parallel

Harmonic Acoustic • • SMP = Shared-memory parallel WAVE HYDRODYNAMICS MAPDL = Mechanical APDL

Explicit = Autodyn Diffraction and Radiation • RBD = Rigid Body Dynamics Frequency & Time Domain Motions Analysis • Aqwa = Aqwa Moorings, Joints & Tethers • Load Transfer to Structural Analysis • ADDITIONAL PHYSICS 1-D Thermal-Flow • • • 1-D Coupled-Field Circuits • 1-D Electromechanical Transducer • MEMS ROM • Piezoelectric • Piezoresistive •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 3

MECHANICAL MECHANICAL MECHANICAL / STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent ADDITIONAL PHYSICS 3 = Ansys DesignXplorer Electromagnetic • 4 = Ansys SpaceClaim Vibro-Acoustics • • 5 = Ansys Customization Suite (ACS) Electro-Migration • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Advanced Acoustics-BEM and SEA • 7 = Ansys Granta Materials Data for Simulation Diffusion-Pore-Fluid • 8 = Ansys Additive Suite Diffusion-Thermal-Electric-Magnetic • 9 = Ansys Composite Cure Simulation

2 2 2 1-Way Fluid Structure Interaction ▪ ▪ ▪ 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric 2-Way Fluid-Structure Interaction 2 ▪ • • 11 = Ansys SPEOS Incompressible Fluid Dynamics (ICFD) • 12 = Ansys SPEOS & Ansys SPEOS for NX Arbitrary Lagrangian Eulerian Method (ALE) • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Electromagnetics (EM) - Boundary Element Method (BEM) • DMP = Distributed-memory parallel

Multi-scale Modeling • • SMP = Shared-memory parallel Conservation Element/Solution Element (CESE) • MAPDL = Mechanical APDL Explicit = Autodyn

RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 4

MECHANICAL MECHANICAL MECHANICAL / STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent COMPOSITE MATERIALS 3 = Ansys DesignXplorer Material Definitions • • • • 4 = Ansys SpaceClaim Layers Definitions • ▲ • • 5 = Ansys Customization Suite (ACS) Interface Plies • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Advanced Modeling • 7 = Ansys Granta Materials Data for Simulation Features • 8 = Ansys Additive Suite Variable Material Data • 9 = Ansys Composite Cure Simulation

Solid Extrusion • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric Lay-Up Mapping • 11 = Ansys SPEOS Draping • 12 = Ansys SPEOS & Ansys SPEOS for NX Lay-Up Exchange Interfaces • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Advanced Failure Criteria Library • DMP = Distributed-memory parallel

First-Ply Failure • • SMP = Shared-memory parallel Last-Ply failure • MAPDL = Mechanical APDL Delamination • • • Explicit = Autodyn RBD = Rigid Body Dynamics Composite Cure Simulation ▪9 Aqwa = Aqwa Honeycombs •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 5 MECHANICAL MECHANICAL MECHANICAL / STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

DURABILITY 2 = Ansys Fluent 3 = Ansys DesignXplorer Stress-Life (SN) • • • • 4 = Ansys SpaceClaim Strain-Life (EN) • • • • 5 = Ansys Customization Suite (ACS) Dang Van 1 1 1 1 ▪ ▪ ▪ ▪ 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Safety Factor • • • • 7 = Ansys Granta Materials Data Adhesive Bond ▪1 ▪1 ▪1 ▪1 for Simulation Crack Growth Linear Fracture Mechanics ▪1 ▪1 ▪1 ▪1 8 = Ansys Additive Suite 9 = Ansys Composite Cure Simulation Seam Weld ▪1 ▪1 ▪1 ▪1 10 = Ansys SPEOS for NX & ANSYS SPEOS Spot Weld ▪1 ▪1 ▪1 ▪1 for Creo Parametric Thermo-Mechanical Fatigue ▪1 ▪1 ▪1 ▪1 ▲ 11 = Ansys SPEOS 12 = Ansys SPEOS & Ansys SPEOS for NX Vibration Fatigue ▪1 ▪1 ▪1 ▪1 13 = Ansys CFD Pro - Ansys Fluent with Virtual Strain Gauge Correlation ▪1 ▪1 ▪1 ▪1 a reduced set of capabilities Python Scripting Customization ▪1 ▪1 ▪1 ▪1 DMP = Distributed-memory parallel EXPLICIT DYNAMICS SMP = Shared-memory parallel MAPDL = Mechanical APDL FE (Lagrange) Solver • • • Explicit = Autodyn Euler Solvers • • RBD = Rigid Body Dynamics Implicit-Explicit Material States • • • Aqwa = Aqwa Mass Scaling • • • • Natural Fragmentation • • • Erosion Based on Multiple Criteria • • • De-Zoning • • Part Activation and Deactivation (Multi Stage Analysis) • • Explicit Time Integration • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 6 MECHANICAL MECHANICAL MECHANICAL / STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent IMPLICIT DYNAMICS 3 = Ansys DesignXplorer Implicit Time Integration • • • 4 = Ansys SpaceClaim GEOMETRIC IDEALIZATION 5 = Ansys Customization Suite (ACS)

Spring • • ▲ • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Mass • • • • • 7 = Ansys Granta Materials Data for Simulation Damper • • • • 8 = Ansys Additive Suite Spar • • • • 9 = Ansys Composite Cure Simulation Beam • • • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric Cable • • • • 11 = Ansys SPEOS Pipe/Elbow • • • 12 = Ansys SPEOS & Ansys SPEOS for NX Shell - Thin • • • • • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Layered Shell -Thin (Composite) • • • • DMP = Distributed-memory parallel Shell - Thick (Solid Shell) • • • • SMP = Shared-memory parallel

Layered Shell - Thick (Solid Shell) (Composite) • • • • MAPDL = Mechanical APDL 2D Plane / Axisymmetric • • • • Explicit = Autodyn 3D Solids • • • • • RBD = Rigid Body Dynamics Aqwa = Aqwa Layered 3D Solids (Composite) • • Infinite Domain • • • • • 2.5D Elements • • Reinforcement Elements • • • • ▪ Coupled Field ROM Element Technology • • Iso-Geometric Analysis (IGA) • GEOMETRY AND STL FILE HANDLING SpaceClaim Direct Modeler •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 7 MECHANICAL MECHANICAL MECHANICAL / STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent HPC - STRUCTURES 3 = Ansys DesignXplorer 4 cores (DMP or SMP) MAPDL, 4 cores (DMP or 4 cores (DMP 4 = Ansys SpaceClaim Default Number of Cores 4 for Explicit, 4 SMP) MAPDL, 4 or SMP) 4 cores 1 core 4 cores for RBD, 4 for for RBD 5 = Ansys Customization Suite (ACS) AQWA 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Parallel Solving on Local PC and Cluster • • • • • • 7 = Ansys Granta Materials Data MAPDL - Yes for Simulation Explicit - No GPU Acceleration 6 6 RBD - No ▪ ▪ 8 = Ansys Additive Suite AQWA - No 9 = Ansys Composite Cure Simulation MAPDL - Yes 10 = Ansys SPEOS for NX & ANSYS SPEOS Explicit - No MAPDL - Yes Ansys Cloud Support MAPDL - Yes for Creo Parametric RBD - No RBD - No • AQWA - No 11 = Ansys SPEOS

MATERIALS 12 = Ansys SPEOS & Ansys SPEOS for NX

Basic Linear Materials (Linear, Anisotropic, Temperature 13 = Ansys CFD Pro - Ansys Fluent with Dependent) • • • • • • a reduced set of capabilities DMP = Distributed-memory parallel Basic Nonlinear Materials (Hyperelastic, Plasticity, Rate • • ▲ • • Independent, Isotropic, Concrete, Viscoelasticity) SMP = Shared-memory parallel Advanced Nonlinear Materials (Rate dependent, Anisotropic, MAPDL = Mechanical APDL Damage Models, Geomaterials, Multiphysics, Acoustics • • • Specialty Materials (Glass, Foam, Kevlar, Fabric, Biomechanic, Explicit = Autodyn Paper, Cardboard) • RBD = Rigid Body Dynamics

Field Dependent • • • Aqwa = Aqwa Reactive Materials (Equations of State, High Explosives, Propellants) • • User Defined Materials • • • Fracture Mechanics and Crack Growth • ▲ Material Designer • Granta Materials Data for Simulation ▪7 ▪7 ▪7

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 8 MECHANICAL MECHANICAL MECHANICAL / STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

MISCELLANEOUS AND USABILITY 2 = Ansys Fluent 3 = Ansys DesignXplorer Ansys SpaceClaim • ▪4 ▪4 ▪4 ▪4 4 = Ansys SpaceClaim Ansys Customization Suite (ACS) • ▪5 ▪5 5 = Ansys Customization Suite (ACS) Support ACT Extensions • • • • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Journaling and Scripting • • • • ▲ 7 = Ansys Granta Materials Data Command Snippet Support • • • for Simulation Batch run capability • • • • • • 8 = Ansys Additive Suite 9 = Ansys Composite Cure Simulation Read/Write 3rd Party Matrix CAE Data • • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS CDB and 3rd party FE Model Import • • • • for Creo Parametric Nastran Bulk File Export • • • 11 = Ansys SPEOS 12 = Ansys SPEOS & Ansys SPEOS for NX Direct Input of Nastran Bulk Data Files • 13 = Ansys CFD Pro - Ansys Fluent with Pre-stressing from Nastran Linear Solution • a reduced set of capabilities Global/Selective Mass Scaling • • • DMP = Distributed-memory parallel SMP = Shared-memory parallel Keyword Input • • • • MAPDL = Mechanical APDL Splitting of Input File into Subfiles • • • • Explicit = Autodyn User Subroutines • • • RBD = Rigid Body Dynamics Re-mapping • • • Aqwa = Aqwa Transmitting boundaries • • • Dynamic Storage Allocation • • • • Extensive Output Data Controls (ascii/binary) • • • • Sense Switch Controls - Monitor Simulations Status ▲ ▲ ▲ • Interactive Real-Time Graphics • • • • • Double Precision • • • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 9 MECHANICAL MECHANICAL MECHANICAL / STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent MODELING CAPABILITIES 3 = Ansys DesignXplorer Contact - Linear • • • • • 4 = Ansys SpaceClaim Contact - Nonlinear • • • • • 5 = Ansys Customization Suite (ACS) Joints • • • • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Spot Welds • • • • • 7 = Ansys Granta Materials Data Element Birth and Death • • for Simulation 8 = Ansys Additive Suite Gasket Elements • 9 = Ansys Composite Cure Simulation Rezoning and Adaptive Remeshing • 10 = Ansys SPEOS for NX & ANSYS SPEOS Inverse Analysis • for Creo Parametric 11 = Ansys SPEOS MULTI ANALYSIS 12 = Ansys SPEOS & Ansys SPEOS for NX Submodeling • • • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Data Mapping • • • DMP = Distributed-memory parallel Multiphysics Data Mapping • • ▲ SMP = Shared-memory parallel Initial State • • • • MAPDL = Mechanical APDL

Advanced Multi-Stage 2-D to 3-D Analysis • • Explicit = Autodyn

NONLINEAR TRANSIENT DYNAMICS RBD = Rigid Body Dynamics Rigid Body Mechanisms • • Aqwa = Aqwa Rigid Body Dynamics with CMS Components for Flexible Bodies • Full Transient • • • • CMS with Substructuring •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 10 MECHANICAL MECHANICAL MECHANICAL / STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

OPTIMIZATION 2 = Ansys Fluent DesignXplorer included • • • ▪3 ▪3 3 = Ansys DesignXplorer 4 = Ansys SpaceClaim Parameters • • • • • 5 = Ansys Customization Suite (ACS) Design Point Studies • • • • • 6 = Ansys HPC, ANSYS HPC Pack Correlation Analysis • • • • or Ansys HPC Workgroup Design of Experiments 7 = Ansys Granta Materials Data • • • • for Simulation

Sensitivity Analysis • • • • 8 = Ansys Additive Suite Goal Drive Optimization • • • • 9 = Ansys Composite Cure Simulation Six Sigma Analysis 10 = Ansys SPEOS for NX & ANSYS SPEOS • • • • for Creo Parametric STRUCTURAL SOLVER CAPABILITIES 11 = Ansys SPEOS Linear Static • • • • 12 = Ansys SPEOS & Ansys SPEOS for NX

Nonlinear Static • • • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Pre-Stress Effect, Linear Perturbation • • • ▲ ▲ DMP = Distributed-memory parallel Nonlinear Geometry • • • • • SMP = Shared-memory parallel Buckling - Linear Eigenvalue • • • MAPDL = Mechanical APDL

Buckling - Nonlinear Post Buckling Behavior • • • • Explicit = Autodyn Buckling - Nonlinear Post Buckling Behavior - Arc Length • • RBD = Rigid Body Dynamics Steady State Analysis Applied to a Transient Condition • Aqwa = Aqwa Advanced Wave Loading • THERMAL Steady State Thermal • • • • Transient Thermal • • • • Conduction • • • • • Convection • • • • Radiation to Space • • • • Radiation - Surface to Surface • • • • Phase Change • • • • • Thermal Analysis of Layered Shells and Solids • • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 11 MECHANICAL MECHANICAL MECHANICAL / STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

TOPOLOGY AND LATTICE OPTIMIZATION 2 = Ansys Fluent 3 = Ansys DesignXplorer Structural Optimization • • • 4 = Ansys SpaceClaim Modal Optimization • • • 5 = Ansys Customization Suite (ACS) Thermal Loads • • • 6 = Ansys HPC, ANSYS HPC Pack Inertial Loads • • • or Ansys HPC Workgroup 7 = Ansys Granta Materials Data Optimized Design Validation • • • for Simulation Manufacturing Constraints • • • 8 = Ansys Additive Suite Stress Constraints • • • 9 = Ansys Composite Cure Simulation Symmetry 10 = Ansys SPEOS for NX & ANSYS SPEOS • • • for Creo Parametric 8 Lattice Optimization ▪ 11 = Ansys SPEOS

8 Overhang/Additive Constraints ▪ 12 = Ansys SPEOS & Ansys SPEOS for NX PARTICLE METHODS 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Smooth Particle Hydrodynamics (SPH) • • DMP = Distributed-memory parallel Smooth Particle Galerkin (SPG) • SMP = Shared-memory parallel Corpuscular Particle Method (CPM) • MAPDL = Mechanical APDL Discrete Element Method (DEM) • Explicit = Autodyn AUTOMOTIVE RBD = Rigid Body Dynamics

Seat-belts - including modeling of accelerometer, pretensioner, Aqwa = Aqwa retractor, sensor, and slip ring • Inflator Models • Airbag Fabric Constitutive Models • Accelerometers • Airbag Sensors • Airbag Breakout • Eulerian Deployment of Airbags • Airbag Folder • Unfolded Reference Geometry for Airbags •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 12 MECHANICAL MECHANICAL MECHANICAL / STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

AUTOMOTIVE 2 = Ansys Fluent 3 = Ansys DesignXplorer Dummy Positioner • 4 = Ansys SpaceClaim Side-Impact Dummy Special Damper • 5 = Ansys Customization Suite (ACS) Airbag Deployment • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup

7 = Ansys Granta Materials Data for Simulation

8 = Ansys Additive Suite

9 = Ansys Composite Cure Simulation

10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric

11 = Ansys SPEOS

12 = Ansys SPEOS & Ansys SPEOS for NX

13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities

DMP = Distributed-memory parallel

SMP = Shared-memory parallel

MAPDL = Mechanical APDL

Explicit = Autodyn

RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 13 VRXPERIENCE / SOUND SIMULATION SOUND 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent ACOUSTICS & SOUND QUALITY 3 = Ansys DesignXplorer Analyze, Listen & Modify • 4 = Ansys SpaceClaim Psychoacoustics, Automatic Detection and Separation, Play 3D Sound • 5 = Ansys Customization Suite (ACS)

Engine Sound Design and Engine Sound Enhancement 6 = Ansys HPC, ANSYS HPC Pack • or Ansys HPC Workgroup Active Sound Design for Electric Vehicles • 7 = Ansys Granta Materials Data for Simulation 3D Sound for Listening Room and VR • 8 = Ansys Additive Suite

Interactive Sound for Driving Simulator • 9 = Ansys Composite Cure Simulation Measure Sound Perception with Listening Test 10 = Ansys SPEOS for NX & ANSYS SPEOS • for Creo Parametric Listen to ANSYS Mechanical, Fluent, LSDyna ad 11 = Ansys SPEOS Motion Simulations • 12 = Ansys SPEOS & Ansys SPEOS for NX Generate, Filter and Mix Acoustic Measurements and • CAE Simulations 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities

DMP = Distributed-memory parallel

SMP = Shared-memory parallel

MAPDL = Mechanical APDL

Explicit = Autodyn

RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 14 ADDITIVE ADDITIVE ADDITIVE / ADDITIVE MANUFACTURING PREP PRINT SUITE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent ADDITIVE PREP 3 = Ansys DesignXplorer Define Build Envelope • ▪ • 4 = Ansys SpaceClaim Multiple Parts • ▪ • 5 = Ansys Customization Suite (ACS)

Optimize Part Orientation Based upon Distortion Tendency, 6 = Ansys HPC, ANSYS HPC Pack Build Time and Supports • ▪ • or Ansys HPC Workgroup Support Region Detection and Manual Modification • • • 7 = Ansys Granta Materials Data for Simulation Created Multiple Support Types in One Region • • • 8 = Ansys Additive Suite

Control of Support Parameters • • • 9 = Ansys Composite Cure Simulation Multiple Support Types 10 = Ansys SPEOS for NX & ANSYS SPEOS • • • for Creo Parametric

Angled Supports • ▪ • 11 = Ansys SPEOS

Perforations, Tooth Patterns, Intrusion, Sizing and Distribution 12 = Ansys SPEOS & Ansys SPEOS for NX of Support Walls • ▪ • 13 = Ansys CFD Pro - Ansys Fluent with Automatic Support Generation • • • a reduced set of capabilities Export of STL and SpaceClaim Files • • • DMP = Distributed-memory parallel SMP = Shared-memory parallel Export of Additive Manufacturing Equipment (OEM) Build Files • • • MAPDL = Mechanical APDL Cost Estimation • • • Explicit = Autodyn

Layer/Scan Vector Visualization • • • RBD = Rigid Body Dynamics WORKBENCH ADDITIVE Aqwa = Aqwa Nonlinear and Temperature Dependent Material Properties • Thermo-Mechanical Coupled Strain Solution • Native Mechanical Environment • Stress-Based Automatically Generated Supports • Part Distortion and Residual Stress after Support Removal • Blade Crash Detection • Identification of High Strain (Crack) Locations • Layer by Layer Stress and Distortion Visualizations • Option to Output Only the Last Layer of the Build or Every Nth Layer •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 15 ADDITIVE ADDITIVE ADDITIVE / ADDITIVE MANUFACTURING PREP PRINT SUITE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent WORKBENCH ADDITIVE 3 = Ansys DesignXplorer User-Defined Step Option as 1st or Last Sequence Step • 4 = Ansys SpaceClaim Layered Tetrahedral Meshing • 5 = Ansys Customization Suite (ACS) Post Build Heat Treatment • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Import of STL Supports • 7 = Ansys Granta Materials Data for Simulation Inherent Strain Isotropic and Anisotropic Released • 8 = Ansys Additive Suite Strain Scaling Factor for Thermal and Structural Analyses • 9 = Ansys Composite Cure Simulation STL Files can be Exported from STL Supports • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric Voxel Mesh Generation • 11 = Ansys SPEOS Wizards to Transfer Results from Additive Print to Workbench Additive • 12 = Ansys SPEOS & Ansys SPEOS for NX

Calibration setup in AM Wizard 13 = Ansys CFD Pro - Ansys Fluent with • a reduced set of capabilities AM Bond Implementation • DMP = Distributed-memory parallel Recoater interference detection and layer end temperature output • SMP = Shared-memory parallel MAPDL = Mechanical APDL ADDITIVE PRINT Explicit = Autodyn Nonlinear and Temperature Dependent Material Properties • • RBD = Rigid Body Dynamics Uniform Assumed Isotropic Strain • • Aqwa = Aqwa Scan Pattern Based Anisotropic Strain • • Thermal Ratcheting Based Anisotropic Strain • • Desktop and Cloud Stand-Alone Environments • • Stress-Based Automatically Generated Supports • • Part Distortion and Residual Stress (as-built) • • Part Distortion and Residual Stress after Support Removal • • Distortion Compensation • • Blade Crash Detection • • Identification of High Strain (Crack) Locations • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 16 ADDITIVE ADDITIVE ADDITIVE / ADDITIVE MANUFACTURING PREP PRINT SUITE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent ADDITIVE PRINT 3 = Ansys DesignXplorer Input Strain Hardening Factor • • 4 = Ansys SpaceClaim Import of STL Supports • • 5 = Ansys Customization Suite (ACS) Subvoxel Material Density Assignment • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Layer by Layer Stress, Distortion and Blad Crash Visualizations • • 7 = Ansys Granta Materials Data for Simulation Build File Readers for Multiple AM Machines • • 8 = Ansys Additive Suite Auto Queue Multiple Successive Simulations • • 9 = Ansys Composite Cure Simulation Additive Print to Workbench Additive Transfer for Post Processing • • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric ADDITIVE SCIENCE 11 = Ansys SPEOS Meltpool Dimensions • 12 = Ansys SPEOS & Ansys SPEOS for NX Detailed Thermal History ▲ 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities % Porosity • DMP = Distributed-memory parallel

Sensor Measurement Predictions • SMP = Shared-memory parallel Ability for Add User-Defined Materials • MAPDL = Mechanical APDL Explicit = Autodyn Material Tuning Wizard • RBD = Rigid Body Dynamics Morphology Prediction • Aqwa = Aqwa Microstructure Prediction •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 17 GRANTA MI GRANTA MI GRANTA GRANTA OR MATERIALS DATA FOR 1 = Ansys nCode DesignLife Products / MATERIALS ENTERPRISE PRO SELECTOR CES EDUPACK SIMULATION MATERIALS DATA MANAGEMENT 2 = Ansys Fluent Granta MI Database - "Gold Source" System to Store Corporate 3 = Ansys DesignXplorer Materials Information • • 4 = Ansys SpaceClaim Manage Specialist Materials Data Types • • 5 = Ansys Customization Suite (ACS)

Manage Meta-Data and Context for Materials • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Traceability for All Materials Data • • 7 = Ansys Granta Materials Data Access Control • ▲ for Simulation Version Control • 8 = Ansys Additive Suite 9 = Ansys Composite Cure Simulation Multiple Unit System Support • • • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS Admin UI to Setup and Configure Database • for Creo Parametric Template Data Structures for Key Materials Use Cases: Metals, 11 = Ansys SPEOS Composites, AM, Restricted Substances • 12 = Ansys SPEOS & Ansys SPEOS for NX Toolbox for Import, Export, Manipulation of Materials Data • ▲ 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Web App for Fast Upload of Materials Data • • DMP = Distributed-memory parallel Browse Materials Data • • • • SMP = Shared-memory parallel Edit and Update Materials Data • • ▲ ▲ MAPDL = Mechanical APDL Search and Query Materials Data • • • • Explicit = Autodyn Represent Property Data in Interactive Charts • ▲ • • RBD = Rigid Body Dynamics

Comparison Tables and Comparison Charts • ▲ • • Aqwa = Aqwa Generate Reports on Selected Materials Records • Export Data to Excel and Third Party Software • ▲ • • Personalize System Homepages and User Profiles • Configure Web App UI for Specific User Groups • MATERIALS DATA ANALYSIS Interactive Plotting of Data: Scatter, Contour, Error Bar, Surface, Plotyy, Semilogx, Semilogy, Loglog • Custom Curve Fitting • Cross-Table Comparisons of Materials Data • Scripting Toolkit for Python •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 18 GRANTA MI GRANTA MI GRANTA GRANTA OR MATERIALS DATA FOR 1 = Ansys nCode DesignLife Products / MATERIALS ENTERPRISE PRO SELECTOR CES EDUPACK SIMULATION DATA FLOW MANAGEMENT 2 = Ansys Fluent Design and develop material data flow • 3 = Ansys DesignXplorer 4 = Ansys SpaceClaim Execute material data flows - Processes, Approvals, Notifications • 5 = Ansys Customization Suite (ACS) INTEGRATION WITH CAD, CAE, PLM 6 = Ansys HPC, ANSYS HPC Pack Ansys Workbench • • ▲ ▲ or Ansys HPC Workgroup Abaqus 7 = Ansys Granta Materials Data • for Simulation ANSA • 8 = Ansys Additive Suite

HyperMesh • • 9 = Ansys Composite Cure Simulation Creo • • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric NX • • 11 = Ansys SPEOS Windchill • 12 = Ansys SPEOS & Ansys SPEOS for NX

Teamcenter • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities File Export (CATIA v5, SOLIDWORKS, and others) • ▲ ▲ ▲ DMP = Distributed-memory parallel RESTRICTED SUBSTANCES SMP = Shared-memory parallel Data Structures to Support Restricted Substance Analytics, Store Specs, Materials, Legislations, Substances, Parts • MAPDL = Mechanical APDL

Report on Restricted Substance Risk for Materils and Explicit = Autodyn Process Portfolio • RBD = Rigid Body Dynamics Build and Edit Bills of Materials within a Web App • Aqwa = Aqwa At-a-Glance Restricted Substance Complaince for a BoM ▲ Run Reports Across Multiple BoMs ▲ Integrate Restricted Substance Reporting with PLM, CAD ▲ MATERIALS SELECTION & RELATED TOOLS Reference Data for Materials Selection on PC/Laptop • • Interactive 'Ashby Charts' of Materials Property Space ▲ • • Systematic Materials Selection Methodology • • Filter Materials Based on Property Profile • • • • Flilter Materials Based on Links to Other Materials / Processes / Objects ▲ • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 19 GRANTA MI GRANTA MI GRANTA GRANTA OR MATERIALS DATA FOR 1 = Ansys nCode DesignLife Products / MATERIALS ENTERPRISE PRO SELECTOR CES EDUPACK SIMULATION MATERIALS SELECTION & RELATED TOOLS 2 = Ansys Fluent Materials Substitution and Equivalency - 'Find Similar' • • 3 = Ansys DesignXplorer 4 = Ansys SpaceClaim Performance Index Finder • • 5 = Ansys Customization Suite (ACS) Engineering Solver - Convert Engineering Requirements to Materials Properties • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Synthesizer - Predict Properties of Hybrid Materials • • 7 = Ansys Granta Materials Data Part Cost Estimator • • for Simulation Selection Reports and Export of Charts for Presentations • • 8 = Ansys Additive Suite 9 = Ansys Composite Cure Simulation Eco Audit for a Product or Conceptual Design • • 10 = Ansys SPEOS for NX & ANSYS SPEOS Early stage batter pack design, configuration and performance for Creo Parametric evaluation - incl. battery cells database • • 11 = Ansys SPEOS DATA LIBRARY FOR INDUSTRY 12 = Ansys SPEOS & Ansys SPEOS for NX Core MaterialUniverse™ Data • • ▲ 13 = Ansys CFD Pro - Ansys Fluent with Core JAHM Curve Data • • a reduced set of capabilities MI Pro Simulation Data • DMP = Distributed-memory parallel SMP = Shared-memory parallel Advanced Metals Data ▪ ▪ MAPDL = Mechanical APDL Advanced Polymers Data ▪ ▪ Explicit = Autodyn Advanced Composites Data ▪ ▪ RBD = Rigid Body Dynamics Advanced Medical Data ▪ ▪ Aqwa = Aqwa Advanced Aero Data ▪ ▪ Advanced ESDU Aero Alloys ▪ ▪ Advanced Additive Manufacturing Data ▪ ▪ Advanced Eco Design ▪ ▪ TEACHING RESOURCES Granta EduPack Level 1-3 Teaching Databases • The Elements Teaching Database • Materials Science and Engineering Teaching Database • Sustainability Teaching Database • Bioengineering Teaching Database •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 20 GRANTA MI GRANTA MI GRANTA GRANTA OR MATERIALS DATA FOR 1 = Ansys nCode DesignLife Products / MATERIALS ENTERPRISE PRO SELECTOR CES EDUPACK SIMULATION 2 = Ansys Fluent TEACHING RESOURCES 3 = Ansys DesignXplorer Architecture Teaching Database • 4 = Ansys SpaceClaim Lecture units • 5 = Ansys Customization Suite (ACS) Student exercises • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Videos • 7 = Ansys Granta Materials Data for Simulation Mciro-Projects • 8 = Ansys Additive Suite White Papers • 9 = Ansys Composite Cure Simulation Case Studies • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric Active Learning Toolkits • 11 = Ansys SPEOS Data Booklets • 12 = Ansys SPEOS & Ansys SPEOS for NX Sample Project Files • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Phase Diagram Tool • DMP = Distributed-memory parallel

Medical Devices Teaching Database • SMP = Shared-memory parallel Design Teaching Database • MAPDL = Mechanical APDL GRANTA MI - ADDITIVE Explicit = Autodyn RBD = Rigid Body Dynamics Traceability and Capture of Additive Manufacturing Data • Aqwa = Aqwa AM Data Analytics • Integration with CAD CAE and PLM Systems •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 21 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent GENERAL SOLVER CAPABILITIES 3 = Ansys DesignXplorer Comprehensive Inlet and Outlet Conditions • • • • • • • 4 = Ansys SpaceClaim Steady-State Flow • • • • • • • 5 = Ansys Customization Suite (ACS) Transient Flow • • • • • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup 2-D and 3-D Flow • • ▲ ▲ ▲ • • 7 = Ansys Granta Materials Data Reduced Order Models (ROM) • • for Simulation Time Dependent Boundary Conditions • • • • • • 8 = Ansys Additive Suite 9 = Ansys Composite Cure Simulation Customizable Materials Library • • • • • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS Granta Materials Data for Simulation ▪7 ▪7 for Creo Parametric Fan Model • • • • 11 = Ansys SPEOS 12 = Ansys SPEOS & Ansys SPEOS for NX Periodic Domains • • • • • • 13 = Ansys CFD Pro - Ansys Fluent with Flow-Drive Solid Motion (6DOF) • • ▲ • a reduced set of capabilities Presuure-Based Coupled Solver • • • • • • • DMP = Distributed-memory parallel Density-Based Coupled Solver • • • SMP = Shared-memory parallel MAPDL = Mechanical APDL Dymanic/Moving-Deforming Mesh • • • • • Explicit = Autodyn Oveset Mesh • RBD = Rigid Body Dynamics Immersed-Soild/MST Method for Moving Parts • • • Aqwa = Aqwa Automatic On-the-fly Mesh Generation with Dynamic Refinement • • • Dynamic Solution-Adaptive Mesh Refinement • • • • ▲ Polyhedral Unstructured Solution-Adpative Mesh Refinement • SINGLE PHASE, NON-REACTING FLOWS Incompressible Flow • • • • • Compressible Flow • • • • • • Porous Media • • • ▲ • ▲ Non-Newtoniam Viscosity • • • • Turbulence -Isotropic • • • • • • Turbulence - Anisotropic (RSM) • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 22 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent SINGLE PHASE, NON-REACTING FLOWS 3 = Ansys DesignXplorer Turbulence - Unsteady (LES/SAS/DES) • • • 4 = Ansys SpaceClaim Turbulence - Laminar/Turbulent Transition • • • • 5 = Ansys Customization Suite (ACS) Flow Pathlines (Massless) • • • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Acoustics (Source Expert) • • • 7 = Ansys Granta Materials Data Acoustics (Noise Prediction) • ▲ for Simulation HEAT TRANSFER 8 = Ansys Additive Suite Natural Convection • • • • • • 9 = Ansys Composite Cure Simulation 10 = Ansys SPEOS for NX & ANSYS SPEOS Conduction & Conjugate Heat Transfer • • • • • for Creo Parametric Shell Conduction (inlcuding Multi-Layer Model) • 11 = Ansys SPEOS Internal Radiation - Participating Media • • • • • 12 = Ansys SPEOS & Ansys SPEOS for NX 13 = Ansys CFD Pro - Ansys Fluent with Internal Radiation - Transparent Media • • • • a reduced set of capabilities External Radiation • • DMP = Distributed-memory parallel Solare Radiation & Load • • SMP = Shared-memory parallel Simplified Heat Exchange Model • MAPDL = Mechanical APDL Explicit = Autodyn Non- Equilibrium Thermal Model • RBD = Rigid Body Dynamics Porous Media • • Aqwa = Aqwa PARTICLES FLOWS (MULTIPHASE) Coupled Discrete Phase Modeling including Thin Wall Films • • ▲ • • Macroscopic Particle Model • Inert Particle Tracking (with Mass) • • Liquid Droplet (including Evaporation) • • ▲ • • Combusting Particles • • • • • Multicomponent Droplets • • ▲ • • Discrete Element Model (DEM) • • Break-Up and Coalescence • • ▲ • • Erosion • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 23 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent FREE SURFACE FLOWS (MULTIPHASE) 3 = Ansys DesignXplorer Implicit VOF • • • 4 = Ansys SpaceClaim Explicit VOF • • • 5 = Ansys Customization Suite (ACS) Coupled Level Set/VOF • • • 6 = Ansys HPC, ANSYS HPC Pack Complex Multiphase Regime Transitions (AIAD and or Ansys HPC Workgroup GENTOP Model) • 7 = Ansys Granta Materials Data for Simulation VOF to DPM Spray Model • 8 = Ansys Additive Suite DPM to VOF Model • 9 = Ansys Composite Cure Simulation

Open Channel Flow and Wave • • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric Surface Tension • • • • 11 = Ansys SPEOS Phase Change • • • • 12 = Ansys SPEOS & Ansys SPEOS for NX Cavitation • • • • 13 = Ansys CFD Pro - Ansys Fluent with Cavitation Where Mulitple Fluids and Non-Condensing a reduced set of capabilities Gases are Present • DMP = Distributed-memory parallel

DISPERSED MULTIPHASE FLOWS (MULTIPHASE) SMP = Shared-memory parallel Mixture Fraction • • MAPDL = Mechanical APDL Eulerian Model including Thin Wall Films • • • • Explicit = Autodyn Boiling Model • • ▲ • RBD = Rigid Body Dynamics Aqwa = Aqwa Surface Tension • • • Phase Change • • ▲ • Drag and Lift • • • Wall Lubrication • • • Heat and Mass Transfer • • • • Population Balance • • • • Reactions Between Phases • • • • Granular Model for Dense Bed of Solids • • Dense Particulate Coupling (DDPM) • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 24 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent REACTING FLOWS 3 = Ansys DesignXplorer Species Transport • • • • • 4 = Ansys SpaceClaim Non-Premixed Combustion • • • • 5 = Ansys Customization Suite (ACS) Premixed Combustion • • • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Partially Premixed Combustion • • • • 7 = Ansys Granta Materials Data Composition PDF Transport • • for Simulation Finite Rate Chemistry • • • • • 8 = Ansys Additive Suite 9 = Ansys Composite Cure Simulation Polluntants and Soot Modelig • • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS Sparse Chemistry Solver with Dynamic Cell Clustering and for Creo Parametric Dynamic Adaptive Chemistry • • • 11 = Ansys SPEOS Ability to Use Model Fuel Library Mechansisms • • • 12 = Ansys SPEOS & Ansys SPEOS for NX Flame-speed from Fuel-Component Library • • • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities DPIK Spark-Ignition Model • • DMP = Distributed-memory parallel Flame-Propogation Using Level-Set Method (G-Equation) • • SMP = Shared-memory parallel Internal Combustion Engine Specific Solution • • • MAPDL = Mechanical APDL 0-D/1-D/2-D Reactor Models and Reactor Networks • Explicit = Autodyn Plasma Reactions • RBD = Rigid Body Dynamics Comprehensive Surface-Kinetics • • Aqwa = Aqwa Chemical and Phase Equilibrium • • Flamelet Table Generation • • Flamespeed and Ignition Table Generation • Reaction Sensitivity, Uncertainty and Path Analysis • Surrogate Blend Formulation and Optimization • Mechanism Reduction • Detailed Electrochemistry Model for Li-ion Batteries • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 25 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent TURBOMACHINERY 3 = Ansys DesignXplorer MRF/Frozen-Rotor • • • 4 = Ansys SpaceClaim Sliding-Mesh/Stage • • 5 = Ansys Customization Suite (ACS) Transient Blade Row • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Pitch Change • 7 = Ansys Granta Materials Data Time Transformation • for Simulation Fourier Transformation • 8 = Ansys Additive Suite 9 = Ansys Composite Cure Simulation Harmonic Analysis • 10 = Ansys SPEOS for NX & ANSYS SPEOS Blade Flutter Analysis • for Creo Parametric Performance Maps • 11 = Ansys SPEOS IN-FLIGHT ICING 12 = Ansys SPEOS & Ansys SPEOS for NX 13 = Ansys CFD Pro - Ansys Fluent with Simulation of Standard Droplets, SLD and Ice Crystals • • a reduced set of capabilities Inclusion of Vapor/Humidity Effects on Icing • • DMP = Distributed-memory parallel Icing Environments of Appendices C, O (SLD) and D (Ice Crystals) • • SMP = Shared-memory parallel Various Pre-Defined Droplet Size Distributions • • MAPDL = Mechanical APDL Simulation of Rime, Glaze and Mixed Icing • • Explicit = Autodyn RBD = Rigid Body Dynamics Single and Multi-Shot Icing Simulations with Mesh Deformation for Prediction of Ice Accredtion and Aerodynamic Performance • • Aqwa = Aqwa Degradation Single and Multi-Shot Icing Simulations with Automatic Re-Mesh- ing for Prediction of Ice Accredtion and Aerodynamic Performance • Degradation Conjugate Heat Transfer (CHT) for Anti and De-Icing Simulations ▪ ▲ Ice Cracking • Ice Shedding • OPTIMIZATION Parameters • • • ▪ • Design Point Studies • • • ▪ • Correlation Analysis • • • Design of Experiments • • ▪ ▪ •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 26 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent OPTIMIZATION 3 = Ansys DesignXplorer Sensitivity Analysis • • • • 4 = Ansys SpaceClaim Goal Drive Optimization • • • 5 = Ansys Customization Suite (ACS) Six Sigma Analysis • • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Adjoint Solver for Shape Optimization • 7 = Ansys Granta Materials Data Adjoint Solver Supports Rotating Reference Frames for Simulation and Conjugate Heat Transfer • 8 = Ansys Additive Suite Mulit-Objective Constrained Optimization • 9 = Ansys Composite Cure Simulation

Mesh Morphing (RBF Morph) ▪ 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric HIGH RHEOLOGY MATERIAL 11 = Ansys SPEOS Viscoelasticity • 12 = Ansys SPEOS & Ansys SPEOS for NX Specialty Extrusion Models • 13 = Ansys CFD Pro - Ansys Fluent with Specialty Blow Molding Models • a reduced set of capabilities DMP = Distributed-memory parallel Speciality Fiber Spinning Models • SMP = Shared-memory parallel HPC - FLUIDS MAPDL = Mechanical APDL Parallel Solving on Local PC Option • • • • • • • • Explicit = Autodyn Parallel Solving over Network Option • • • • • • • • RBD = Rigid Body Dynamics Parallel Solving over Cloud launched from Desktop • Aqwa = Aqwa GPU Support • • Parallet Mesh Generation • PRE AND POST PROCESSING Compare Multiple Runs, Datasets, Physics, Graphs in a Single Window • • • • • • Simulation Reports • • • Advanced, Automated Data Exchange • • • • Accurate Data Interpolation between Dissimilar Meshes • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 27 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

MULTIPHYSICS 2 = Ansys Fluent Drag-n-Drop Multiphysics • • • 3 = Ansys DesignXplorer 4 = Ansys SpaceClaim Direct Coupling between Physics • • • 5 = Ansys Customization Suite (ACS) Collaborative Workflows • • 6 = Ansys HPC, ANSYS HPC Pack Fully Managed Co-Simulation • • or Ansys HPC Workgroup Flexiable Solver Coupling Options 7 = Ansys Granta Materials Data • • • for Simulation Functional Mock Up Unit (FMU) Coupling • • 8 = Ansys Additive Suite

Force Induced Motion/Deformation ▪ ▪ 9 = Ansys Composite Cure Simulation Fluid Thermal Deformation ▪ ▪ • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric FLUID-STRUCTURE INTERACTION 11 = Ansys SPEOS Intrinsic FSI • • 12 = Ansys SPEOS & Ansys SPEOS for NX Thermo-elasticity • 13 = Ansys CFD Pro - Ansys Fluent with Convection Cooled Electronics • • a reduced set of capabilities DMP = Distributed-memory parallel Conduction Cooled Electronics • • SMP = Shared-memory parallel ELECTRO-THERMAL INTERACTION MAPDL = Mechanical APDL High Frequency Thermal Management • • Explicit = Autodyn Electromechanical Thermal Management • • RBD = Rigid Body Dynamics Aero-Vibro Acoustics • Aqwa = Aqwa Acoustic-Structural • • OTHER COUPLED INTERACTIONS Fluid Magnetohydrodynamics • • Support ACT Simulation Apps • Mosaic-Enabled Meshing Technology • • EASE OF USE AND PRODUCTIVITY Task-Based Workflow - Watertight Geometries • • Task-Based Workflow - Fault Tolerant Geometries • Directly Enter Expressions • • • Parallel Solving with Ansys Cloud Launched from Desktop • Parallel Solving with Ansys Cloud Launched from VDI • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 28 VRXPERIENCE Driving VRXPERIENCE VRXPERIENCE Simulator powered 1 = Ansys nCode DesignLife Products / AUTONOMOUS VEHICLE SIMULATION by SCANeR Sensors Headlamp HUMAN VISION 2 = Ansys Fluent Glare Simulation • 3 = Ansys DesignXplorer HEADLAMP SIMULATION 4 = Ansys SpaceClaim 5 = Ansys Customization Suite (ACS) Virtual Measurement • 6 = Ansys HPC, ANSYS HPC Pack Lamp Control • or Ansys HPC Workgroup IIHS Test 7 = Ansys Granta Materials Data • for Simulation SYSTEM SIMULATION 8 = Ansys Additive Suite Ground-Truth Sensor • 9 = Ansys Composite Cure Simulation Camera Sensor ▲ • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric LiDAR Sensor ▲ • 11 = Ansys SPEOS Radar Sensor ▲ • 12 = Ansys SPEOS & Ansys SPEOS for NX HUD ▲ 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Advanced Lighting Component • DMP = Distributed-memory parallel CONTEXT SIMULATION SMP = Shared-memory parallel Basic Driving Scenario • • MAPDL = Mechanical APDL Advanced Driving Scenario • ▪ ▪ Explicit = Autodyn Advanced Vehicle Dynamic • ▪ ▪ RBD = Rigid Body Dynamics Environement Creation • • ▲ Aqwa = Aqwa MiL/SiL Connectivity • ▪ • HiL Connectivity • ▪ ▪ RENDERING ENGINE Real-Time Physics-Based Lighting • • VR HMD • CAVE, Powerwall •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 29 / DIGITAL TWIN TWIN BUILDER 1 = Ansys nCode DesignLife Products

SYSTEM SIMULATION, VALIDATION AND DIGITAL TWINS 2 = Ansys Fluent Integrated Graphical Modeling Environment • 3 = Ansys DesignXplorer 4 = Ansys SpaceClaim Standard Modeling Languages and Exchange Formats • 5 = Ansys Customization Suite (ACS) Mulit-domain Systems Modeler • 6 = Ansys HPC, ANSYS HPC Pack Extensive 0D Application-Specific Libraries • or Ansys HPC Workgroup 3rd Party Tool Integrations 7 = Ansys Granta Materials Data • for Simulation

3D ROM • 8 = Ansys Additive Suite Embedded Software Integration • 9 = Ansys Composite Cure Simulation Mulit-Domain System Simulation 10 = Ansys SPEOS for NX & ANSYS SPEOS • for Creo Parametric Rapid HMI Prorotyping • 11 = Ansys SPEOS

System Optimization • 12 = Ansys SPEOS & Ansys SPEOS for NX

XIL Integration 13 = Ansys CFD Pro - Ansys Fluent with • a reduced set of capabilities IIOT Connectivity • DMP = Distributed-memory parallel Digital Twin Runtime Deployment • SMP = Shared-memory parallel

MAPDL = Mechanical APDL

Explicit = Autodyn

RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 30 SCADE SCADE SCADE SCADE SCADE SCADE SCADE for A661 / EMBEDDED SOFTWARE Architect Suite Display Vision Test Lifecycle Applications 1 = Ansys nCode DesignLife Products MODEL-BASED SYSTEMS ENGINEERING 2 = Ansys Fluent 3 = Ansys DesignXplorer Systems Requirements Analysis ▲ ▲ 4 = Ansys SpaceClaim System & Software Architecture Design ▲ • 5 = Ansys Customization Suite (ACS)

SysML Models Import • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Collaborative Work through Libraries and Model Synchronizations • • 7 = Ansys Granta Materials Data for Simulation Model Checks • • 8 = Ansys Additive Suite Model Diff/Merge • • 9 = Ansys Composite Cure Simulation System/Software Bi-Directional Sync • • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric Model Sharing and IP Protection • • 11 = Ansys SPEOS Model-Based Interface Control Document Production • • 12 = Ansys SPEOS & Ansys SPEOS for NX

Configurable for Industry Standards (IMA, AUTOSAR, etc.) • • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Product Configuration for Automotive Developers • • DMP = Distributed-memory parallel EMBEDDED CONTROL & HMI SOFTWARE SMP = Shared-memory parallel

Traceability with Requirement Management Tools • • • • • • MAPDL = Mechanical APDL Automatic Document Generation • • • • • • Explicit = Autodyn RBD = Rigid Body Dynamics Data Flow and State Machine Design and Simulation Capabilities • • Aqwa = Aqwa Extensive Set of Libraries • • • • Record and Playback Scenarios • • • Plant Model co-Simulation including FMI • • • • On Host and on Target Testing • • • Model and Code Structural Coverage • • • Formal Verification • Timing and Stack Optimization • Worst Case Execution Time Estimates on Target • Integration with Real-Time Operating Systems •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 31 SCADE SCADE SCADE SCADE SCADE SCADE SCADE for A661 1 = Ansys nCode DesignLife Products / EMBEDDED SOFTWARE Architect Suite Display Vision Test Lifecycle Applications 2 = Ansys Fluent EMBEDDED CONTROL & HMI SOFTWARE 3 = Ansys DesignXplorer Certified Code Generation for DO-178C, EN 50128, ISO26262, IEC 61508 • • 4 = Ansys SpaceClaim Certification Kits for DO-178C, EN50128, ISO 26262, IEC 61508 • • • • • 5 = Ansys Customization Suite (ACS) Model-Based Prototyping and Specification of HMIs 6 = Ansys HPC, ANSYS HPC Pack • • or Ansys HPC Workgroup Support of OpenGL, OpenGL SC and OpenGL ES • • 7 = Ansys Granta Materials Data for Simulation Font Management • • 8 = Ansys Additive Suite

Optimization of Graphical Specifications • 9 = Ansys Composite Cure Simulation Solutions for ARINC 661 10 = Ansys SPEOS for NX & ANSYS SPEOS • • for Creo Parametric

PERCEPTION SOFTWARE TESTING 11 = Ansys SPEOS Preception Software Robustness Testing • 12 = Ansys SPEOS & Ansys SPEOS for NX Triggering Conditions Identification 13 = Ansys CFD Pro - Ansys Fluent with • a reduced set of capabilities Automatic Safety Report Generation • DMP = Distributed-memory parallel

SMP = Shared-memory parallel

MAPDL = Mechanical APDL

Explicit = Autodyn

RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 32 Ansys / PLATFORM Ansys Cloud optiSLang Ansys Minerva 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent LICENSING 3 = Ansys DesignXplorer Support of HPC solver licenses • 4 = Ansys SpaceClaim Elastic Licensing • 5 = Ansys Customization Suite (ACS)

PROCESS INTEGRATION 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup DPS connector • 7 = Ansys Granta Materials Data for Simulation AEDT node: Simulation data purge options • 8 = Ansys Additive Suite AEDT node: Remote simulation using scheduler submission option • 9 = Ansys Composite Cure Simulation AEDT node: Support of post-processing variables • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric ANSYS Workbench Node: Reuse of project data • 11 = Ansys SPEOS

WORKBENCH CONNECTOR 12 = Ansys SPEOS & Ansys SPEOS for NX Data Receive to External Data • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Extract and reuse of DX data in optiSLang components • DMP = Distributed-memory parallel

POST PROCESSING SMP = Shared-memory parallel

Fitting of discrete distributions • MAPDL = Mechanical APDL CSVImportWizard • Explicit = Autodyn Residual plot: Fitting Residuals • RBD = Rigid Body Dynamics design comparison plot • Aqwa = Aqwa Reliability input importance plot for adaptive sampling • Design set 'All archive designs' for new NOA-EA • Cloud-based 3D results visualization • WEBSERVICE Basic web-based postprocessing • Download and/or preview project and node result files • Install as a service on Windows platforms and a daemon on Linux platforms • PyOWA Wizard •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 33 Ansys / PLATFORM Ansys Cloud optiSLang Minerva 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent GENERAL 3 = Ansys DesignXplorer Added node status overview table for displaying and altering status per node/designs • 4 = Ansys SpaceClaim Import/export designs of Json format • 5 = Ansys Customization Suite (ACS) Python-API documentation: examples and descriptions 6 = Ansys HPC, ANSYS HPC Pack • or Ansys HPC Workgroup

DESIGN OPTIMIZATION AND PARAMETER IDENTIFICATION (CALIBRATION) 7 = Ansys Granta Materials Data for Simulation AMOP: multi-objective refinement • 8 = Ansys Additive Suite

AMOP: Convergence criteria for single-objective refinement • 9 = Ansys Composite Cure Simulation Nature inspired optimization algorithm 10 = Ansys SPEOS for NX & ANSYS SPEOS • for Creo Parametric

Evolution Strategy with Covariance Matrix Adaptation • 11 = Ansys SPEOS DATA MANAGEMENT 12 = Ansys SPEOS & Ansys SPEOS for NX

Data Comparison 13 = Ansys CFD Pro - Ansys Fluent with • a reduced set of capabilities Enhanced Branching • DMP = Distributed-memory parallel Custom Digital Thread Configurability • SMP = Shared-memory parallel MAPDL = Mechanical APDL Automatic file conversion • Explicit = Autodyn New folder widger, saved search for details list • RBD = Rigid Body Dynamics Added file support for metadata extraction • Aqwa = Aqwa PROCESS MANAGEMENT Work Request History Report • New Voting Dialog • Enhanced Gantt Chart • APPLICATION MANAGEMENT New Applications Page Layout • Ansys optiSLang web apps • Ansys LS-Dyna Batch Job Template •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 34 Ansys / PLATFORM Ansys Cloud optiSLang Minerva 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent INTEGRATIONS 3 = Ansys DesignXplorer Ansys Electronics Desktop Add-In • 4 = Ansys SpaceClaim

WORKFLOW MANAGEMENT 5 = Ansys Customization Suite (ACS)

Completely secure workflows • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup TOOL INTEROPERABILITY 7 = Ansys Granta Materials Data for Simulation Ability to submit HPC jobs from desktop apps to Ansys Cloud • • 8 = Ansys Additive Suite Supported running Ansys Cloud In browser interactively • • 9 = Ansys Composite Cure Simulation Support of HPC Solver Licenses • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric Improved submission in AEDT • 11 = Ansys SPEOS

12 = Ansys SPEOS & Ansys SPEOS for NX

13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities

DMP = Distributed-memory parallel

SMP = Shared-memory parallel

MAPDL = Mechanical APDL

Explicit = Autodyn

RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 35 medini medini analyze for medini analyze for / SAFETY ANALYSIS analyze Semiconductors Cybersecurity 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent FUNCTIONAL SAFETY ANALYSIS 3 = Ansys DesignXplorer Safety Concept Modeling • • 4 = Ansys SpaceClaim Model Based Safety Analysis • • 5 = Ansys Customization Suite (ACS) Reliability Prediction and Analysis • • 6 = Ansys HPC, ANSYS HPC Pack or Ansys HPC Workgroup Traceability and Validation Teamwork • • 7 = Ansys Granta Materials Data for Simulation Integration into Engineering Environment • • 8 = Ansys Additive Suite Customization and Process Adaption • • 9 = Ansys Composite Cure Simulation Ansys Product Integration • • 10 = Ansys SPEOS for NX & ANSYS SPEOS for Creo Parametric Reporting and Documentation • • 11 = Ansys SPEOS Safety of Intended Functional Analysis • • 12 = Ansys SPEOS & Ansys SPEOS for NX

CYBERSECURITY ANALYSIS 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Analysis Contect Establishment and Asset Identification • DMP = Distributed-memory parallel

Systems Vulnerability Analysis • SMP = Shared-memory parallel Threat Identification • MAPDL = Mechanical APDL Explicit = Autodyn Attack Trees, Attack Path Calculation and Attack Collections • RBD = Rigid Body Dynamics Threat Assessment and Treatment • Aqwa = Aqwa Requirement Analysis and Management • Rich Traceability • Teamwork and Integrated Task Management • Reporting and Customization •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 36 SPEOS SPEOS SPEOS SPEOS SPEOS SPEOS SPEOS HUD SPEOS FAR OPTICAL OMD OMD VRXPERIENCE VRXPERIENCE VRXPERIENCE / OPTICS AND VR PRO PREMIUM ENTERPRISE OPTICAL PART OPTICAL DESIGN AND INFARED DESIGN OMD PRO PREMIUM ENTERPRISE PERCEIVED LIGHT HMI DESIGN SENSOR TEST ANALYSIS EXTENSION OPTIMIZER QUALITY SIMULATION ANSYS PRODUCTS EMBEDDED Ansys SpaceClaim Direct Modeler • • • Ansys SpaceClaim Catia V5 Interface • • • Ansys DesignXplorer • • • Ansys License Manager • • • GENERAL SOLVER CAPABILITIES Monte-Carlo Forward Ray Tracing • • • Monte-Carlo Backward Ray Tracing • • Deterministic Simulation ▲ • • Spectral Propagation • • • Dispersion • • • Surface Diffusion • • • Volumic Diffusion • • • Ambiant Material • • • SPEOS Live Preview (GPU Acceleration) •11 •11 Virtual BSDF •10 PHOTOMETRY / RADIOMETRY Intensity • • • Illuminance • • • 3D Illuminance • • • Luminance ▲ • • 3D Energy Density • • 360 View - Observer • • 360 View - Immersive • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 37 SPEOS SPEOS SPEOS SPEOS SPEOS SPEOS SPEOS HUD SPEOS FAR OPTICAL OMD OMD VRXPERIENCE VRXPERIENCE VRXPERIENCE / OPTICS AND VR PRO PREMIUM ENTERPRISE OPTICAL PART OPTICAL DESIGN AND INFARED DESIGN OMD PRO PREMIUM ENTERPRISE PERCEIVED LIGHT HMI DESIGN SENSOR TEST ANALYSIS EXTENSION OPTIMIZER QUALITY SIMULATION HUMAN VISION Dynamic Adaption • Glare Simulation • HDR10 Screen Support • WAVELENGTH RANGE Visible (360nm - 830nm) • • • UV (100nm - 360 nm) • • Near IR (830nm - 2.5um) • • Far Infra-Red (2.5um - 100um) • OPTICAL DESIGN Parabolic Surface •12 •12 •12 TIR Lens •12 •12 •12 Projection Lens •12 •12 •12 Optical Lens • Optical Surface • Light Guide • Sharp Cut-Off Reflector • Poly-Ellipsoidal Surface • Micro Optical Stripes • Freeform Lens •11 Honeycomb Lens • Field of View • Export Sensor Grid as Geometry • Camera Sensor • Camera Raw Signal Export • Camera Sensor Post Processing • • Full Support ▲ Limited Capability ▪ Requires more than 1 product 38 SPEOS SPEOS SPEOS SPEOS SPEOS SPEOS SPEOS HUD SPEOS FAR OPTICAL OMD OMD VRXPERIENCE VRXPERIENCE VRXPERIENCE / OPTICS AND VR PRO PREMIUM ENTERPRISE OPTICAL PART OPTICAL DESIGN AND INFARED DESIGN OMD PRO PREMIUM ENTERPRISE PERCEIVED LIGHT HMI DESIGN SENSOR TEST ANALYSIS EXTENSION OPTIMIZER QUALITY SIMULATION OPTICAL DESIGN SPEOS Lens System Importer (ZEMAX OpticStudio) • LiDAR Sensor • LiDAR Rotating & Scanning • LIDAR Raw Time of Flight generation • HEAD-UP DISPLAY HUD Optical Analysis • HUD Optical Design • HUD Visualisation • HPC-SPEOS

Default Number of Cores 4 4 4 Parallel Solving on Local PC • • • Parallel Solving on Cluster • • • Parallel Solving with Ansys Cloud Launched from Desktop • • • Ansys RSM Compatibility • • • SIMULATION PREPARATION Source Group • • • Geometry Group • • • Local Meshing • • • 3D Textures • • Polarisation Plate • • Fluorescent Converter • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 39 SPEOS SPEOS SPEOS SPEOS SPEOS SPEOS SPEOS HUD SPEOS FAR OPTICAL OMD OMD VRXPERIENCE VRXPERIENCE VRXPERIENCE / OPTICS AND VR PRO PREMIUM ENTERPRISE OPTICAL PART OPTICAL DESIGN AND INFARED DESIGN OMD PRO PREMIUM ENTERPRISE PERCEIVED LIGHT HMI DESIGN SENSOR TEST ANALYSIS EXTENSION OPTIMIZER QUALITY SIMULATION SIMULATION PREPARATION Texture Mapping (Bamp, Multi-Layer) • • Uniform Ambiant Source • • • HDRI Source • • • CIE Sky Source • • Natural Light Source • • Near Infrared Extended Ambient Source • • Thermic Source • Earth Atmosphere Model ▪ POST PROCESSING Virtual Lighting Controller • • Photometric Numerical Certification • • • Colorimetric Analysis • • • Spectral Analysis • • Light Expert • • • Layer by Source • • Layer by Face • • Layer by Sequence • • Stray Light Analysis • • Layer by Polarisation • • Visibility and Legilbility • Night Vision Goggle • Script Automation • • • Interpolation Enhancement ▲ • • SPEOS Labs • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 40 SPEOS SPEOS SPEOS SPEOS SPEOS SPEOS SPEOS HUD SPEOS FAR OPTICAL OMD OMD VRXPERIENCE VRXPERIENCE VRXPERIENCE / OPTICS AND VR PRO PREMIUM ENTERPRISE OPTICAL PART OPTICAL DESIGN AND INFARED DESIGN OMD PRO PREMIUM ENTERPRISE PERCEIVED LIGHT HMI DESIGN SENSOR TEST ANALYSIS EXTENSION OPTIMIZER QUALITY SIMULATION OPTIMIZATION Parameters • • • Design of Experiment •3 •3 •3 Design Optimisation •3 •3 •3 •10 Ansys optiSLang Interface (12) ▪ ▪ ▪ OPTICAL MEASUREMENT DEVICE INCLUDED OMS2 Hardware • OMS4 Hardware • • Portable OMD Software • Laboratory OMD Software • • MEASUREMENT CAPABILITY BRDF • • • BTDF • • 380 - 725nm • 380 - 1000nm • Roughness (Unpolished) • • Volume Absorption • • Volume Diffusion • • Anisotropic Measurement • • Target Dynamic Range 10^6 10^8 10^8

Angular Optical Resolution (FWHM) 0.5 0.1 0.1 (or 0.5) White LED Light Sources • Laser Light Source • • Broadband Visible White Source • USE CASES Light Modelling and Photometrical Simulations • • Visual Ergonomics and Style Studies • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 41 SPEOS SPEOS SPEOS SPEOS HUD SPEOS FAR VRXPERIENCE VRXPERIENCE SPEOS SPEOS SPEOS OPTICAL PART OPTICAL DESIGN AND INFARED OPTICAL OMD PRO OMD OMD VRXPERIENCE / OPTICS AND VR PRO PREMIUM ENTERPRISE DESIGN PREMIUM ENTERPRISE PERCEIVED LIGHT HMI DESIGN SENSOR TEST ANALYSIS EXTENSION OPTIMIZER QUALITY SIMULATION SYSTEM SIMULATION Virtual Display Prototype • Display software in the Loop (SCADE) • HUD • • Advanced Lighting Component • • CONTEXT SIMULATION Basic Driving Scenario ▲ ▲ Advanced Driving Scenario ▪ Advanced Vehicle Dynamic ▪ Environement Creation • ▲ • Trigger & Animation • • MiL/SiL Connectivity • Virtual Display & Actuators Interaction • RENDERING ENGINE Real-Time Physics-Based Lighting • • • Advanced Raytraced Lighting • • Full Physics GPU Lighting • VR HMD • • CAVE, Powerwall • • Finger Tracking • SOLVER Tolerance Variation Engine •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 42 Electronics Electronics / ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

LOW FREQUENCY ELECTROMAGNETICS Electrostatics • • • AC Conduction • • • DC Conduction • • • Magnetostatics • • • Adaptive Field Mesh • • • AC Harmonic Magnetic • • • Electric Transient • • • MAGNETIC TRANSIENT Translational Motion • • • Fully Automatic Symmetrical Mesh Generation • • • Rotational Motion • • • Non-Cylindrical Motion • • • Advanced Embedded Circuit Coupling • • • Circuit Coupling with Adaptive Time Stepping • • • Direct and Iterative Matrix Solvers • • • ADVANCED MAGNETIC MODELING Vector Hysteresis Modeling • • • Hysteresis Modeling for Anisotropic Material • • • Frequency Dependent Reduced Order Models • • • Reduced Order Model Extraction (Linear-Motion, Rotational-Motion, No- Motion) • • • Functional Magnetization Direction • • • Magnetization/De- Magnetization Modeling • • • Manufacturing Dependent Core L Loss Models • • • Noise – Vibration Modeling ▪ ▪ ▪ Temperature Dependent De-Magnetization Modeling • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 43 Electronics Electronics / ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

ADVANCED MAGNETIC MODELING Temperature Dependent Core Loss Computation • • • Lamination Modeling • • • Magnetostriction and Magnetoelastic Modeling • • • Hardware in the Loop Modeling • • • Integrated Motor Synthesis and Design Kit • • • Integrated Planar Magnetics Synthesis and Design Kit • • • Litz Wire Modeling • • • CONCEPT DESIGN SOLUTION FOR ELECTRICAL MACHINE Template-Based Magnetic Topologies • Template-Based Cooling Topologies • Magnetic 2D FEA with Analytical Solution • Thermal 2D FEA • 3D Thermal and Fluid Network • Temperature Dependent Duty-Cycle Analysis • Manufacturing Effects Due to Winding Impregnation and Housing Interfaces • Linear Structural 2D FEA • Electrothermal Reduced Order Model (FMU) • HIGH FREQUENCY ELECTROMAGNETICS Fully Automated Adaptive Mesh Refinement • • Multi-Frequency Broadband Adaptive Meshing • • Frequency Domain Finite Element (FEM) Analysis • • Frequency Domain Integral Equation (MoM) Analysis • • Time Domain FEM Analysis • • FEM Eigenmode Analysis • • MoM Characteristic Mode Analysis • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 44 Electronics Electronics / ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

HIGH FREQUENCY ELECTROMAGNETICS Physical Optics (PO) Analysis • • Shooting and Bouncing Ray+ (SBR+) Analysis • • Physical Theory of Diffraction (PTD) Correction for SBR • • Uniform Theory of Diffraction (UTD) Correction for SBR • • Visual Ray Tracing for SBR+ Analysis • • SBR+ Creeping Wave Correction for RCS of Curved Obects • • Range Doppler Plots for Radar Scenario Analyses • Accelerated Doppler Processing (ADP) for SBR+ Range Doppler Analyses • Domain Decomposition Method (DDM) for Frequency Domain FEM Analysis • • Hybrid Finite Element/ Integral Equation Analysis • • UI Coupled Finite Element and/or IE with SBR+ Analysis • • Modal Wave Port Excitation • • Terminal Wave Port Excitations • • Lumped, Voltage and Current Excitations • • Circuit Port Excitations • • Parametric Antenna Excitations for SBR+ • • Floquet Excitations • • Incident Wave Excitation • • Magnetic Ferrite Bias Excitation • • Perfect Electric and Magnetic Boundary • • Finite Conductivity Boundary • • Lumped RLC Boundary • • Symmetry Boundary • • Periodic Boundary • • Frequency Dependant Materials • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 45 Electronics Electronics / ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

HIGH FREQUENCY ELECTROMAGNETICS Spatial XYZ Material Properties Via Dataset • • Higher and Mixed Order Elements • • Curvilinear Element Mesh Correction • • S,Y,Z Matrix Results • • E, H, J, P Field Results • • Direct and Iterative Matrix Solvers • • Antenna Parameter Calculation • • Infinite and Finite Antenna Array Calculations • • Radar Cross Section Calculation • • FSS, EBG and Metamaterial Calculation • • Specific Absorption Rate Calculation • • EMI/EMC Calculation • • System Level EMI and RFI Analysis • • • Linear Circuit Analysis with EM Dynamic link • • Integrated Antenna Synthesis and Design Kit • • 5G SAR Standards Toolkit • • Power Density and CDF • • Radar Prep/Post Simulation Wizards • • 3D Component Libraries with User Controled Parametrics • • 3D Component with Encryption Creation • • 3D Component with Encryption Utilization • • Mutlipaction Solver • • Accelerated Doppler Processing (ADP) for SBR+ Range-Doppler Analysis •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 46 Electronics Electronics / ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

POWER AND SIGNAL INTEGRITY BOARD SIMULATION CAPABILITIES Electronics Desktop 3D Layout GUI • • • • ECAD Translation (Altium, Cadence, Mentor, Pulsonix, & Zuken) • • • • • MCAD (.sat) Generation from ECAD • • • Lead Frame Editor • • • DC Voltage, Current and Power Analysis for PKG/PCB • • DC Joule Heating with Ansys Icepak • • • • Passive Excitation Plane Resonance Analysis • • Driven Excitation Plane Resonance Analysis • • Automated Decoupling Analysis • • Capacitor Loop Inductance Analysis • • AC SYZ Analysis • • Dynamically Linked Electromagnetic Field Solvers • • Chip, Package, PCB Analysis (CPM) • • • Near-Field EMI Analysis • Far-Field EMI Analysis • EMI/EMC Full Board Scan • Characteristic Impedance (Zo) L PKG/PCB Scan • Full PCB/PKG Cross-Talk Scanning • • TDR Wizard • TDR Analysis • • • • • Transient IBIS Circuit Analysis • • • Signal Net Analyzer • SerDes IBIS-AMI Circuit Analysis • Macro-Modeling (Network Data Explorer) • • • • • Steady State AC (LNA) Analysis • • Virtual Compliance - DDRx, GDDRx, & LPDDRx •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 47 Electronics Electronics / ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

POWER AND SIGNAL INTEGRITY BOARD SIMULATION CAPABILITIES SPISIM Com and USB-C Compliance • SPISIM IBIS AMI Generation • Synopsys HSPICE Integration • • Cadence PSPICE Support • • Electromagnetically Circuit Driven Field Solvers • • • RLCG PARASITIC EXTRACTION DCRL, ACRL & CG Solver • • • IC Packaging RLCG IBIS Extraction for Signals & Power • • Touchpanel RLCG Unit Cell Extraction • • Adaptive Meshing for Accurate Extraction • • • Bus Bar RLCG Extraction • • • • Power Inverter & Converter Component Extraction • • 3D Component Library • • Reduced RLCG Matrix Operations • • SPICE Equivalent Modeling Export • • • DCRL & ACRL Joule Heating Analysis with Icepak • • Macro-Modeling (Network Data Explorer) • • 2D Cable Modeling Toolkit • • ELECTRONICS COOLING Multi-Mode Heat Transfer • • Steady-State and Transient • • CFD Analysis • • Turbulent Heat Transfer • • Multiple-Fluid Analysis • • Species Transport • • Solar Loading • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 48 Electronics Electronics / ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

ELECTRONICS COOLING Reduced Order Flow and Thermal • • Network Modeling ▪ ▪ ▪ ▪ • • Joule Heating Analysis • • Thermo-Electric Cooler Modeling • • Thermostat Modeling • • Package Characterization • • CABLE MODELING Finite Difference Time Domain Analysis • Multi-Conductor Transmission Line Analysis • • • • • • • • Two-Way Coupling FDTD and Transmission Line Solver ▲ • ▲ Twisted Conductors • Seam Impedance • Cable Junctions • Braided Shield Support • Pin Voltage, Current Density, Plane Wave Excitations • Multi-Conductor and Multi-Shield Support • • Uses SpaceClaim Design Modeler UI • Thin Surface and Thin Wire Algorithms • HPC FOR ELECTRONICS GPU Support ▪ ▪ • HPC Accelerated Frequency Sweeps • • • • HPC Distributed Hybrid Solving • • HPC Enabled Domain Decomposition Method • • • HPC Time Decomposition Method • • • HPC Enabled Multi-port Excitation Acceleration • • HPC Acceleration for DCRL, ACRL and CG • • HPC Enabled Parallel Processing • • • • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 49 Electronics Electronics / ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

SYSTEM MODELING FOR POWER ELECTRONICS Circuit Simulation • • • • • • • Block Diagram Simulation • • • • • • • State Machine Simulation • • • • • • • VHDL-AMS Simulation • • • • • • • Integrated Graphical Modeling Environment • • • • • • • Power Electronics Component Libraries • • • • • • • Reduced Order Modeling • • • • • • • Power Electronic Device and Module Characterization • • • • • • • Co-Simulation with Low Frequency Electromagnetics • • • Co-Simulation with MathWorks Simulink • • • • • • • SYSTEM MODELING FOR RF / MICROWAVE Radio Frequency Interference (RFI) System Solver • • • Electromagnetic Interference System Solver • • • RF Link Budget Analysis • • • RF Co-Site and Antenna Coexistence Analysis • • • Automated Diagnostics for Rapid Root-Cause Analysis • • • RF Component Library • • • Wireless Propagation Models • • • Multi-Fidelity Parametric Radio Models • • • SYSTEM MODELING FOR SI/PI SerDes Channel Modeling - IBIS-AMI, QuickEye and VerifEye • Multi-Drop & Parallel Bus Modeling - IBIS, HSPICE, Spectre, PSPICE, and Nexxim Transient ▲ • • Network Data Exploration • • • • • TDR analysis • • • Steady State AC (LNA) Analysis • • • Virtual Compliance - DDRx, GDDRx, & LPDDRx •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 50 Electronics Electronics / ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

MULTIPHYSICS-PLATFORM TECHNOLOGIES Advanced, Automated Data Exchange • • • • • • Drag-n-Drop Multiphysics • • • • • • Direct Coupling Between Physics • • • • • • Collaborative Workflows • • • • • • Fully Managed Co-Simulation • • • • • • Flexible Solver Coupling Options • • • • • • MULTIPHYSICS ELECTRO-THERMAL INTERACTION Convection Cooled Electronics • • • Conduction Cooled Electronics • • • High Frequency Thermal Management • • • • Electromechanical Thermal Management • • • • MATERIALS DATABASE FOR ELECTRONICS GRANTA Materials Data for Simulation ▪ ▪ ▪ ▪ ▪ MISCELLANEOUS Integrated Windows HPC Support • • • • • Integrated IBM Spectrum LSF Support • • • • • Customizable 3rd Party Scheduler Support • • • • •

Support ACT Extensions ▲ ▲ ▲ ▲ ▲ ▲

Parallel Solving with Ansys Cloud Launched from Desktop • • • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 51 CML Verilog-A PHOTONICS CHARGE Compliler DGTD FDTD FEEM HEAT INTERCONNECT MODE MQW STACK Platform

DESIGN ENVIRONMENT Finite Element IDE (with 2D/3D modeling) • • • • Finite Difference IDE (with 2D/3D modeling) • • • Hierarchical Schematic Editor • GENERAL HPC-ready / compatible with cloud providers • • PIC Element Library • Supports CML development and distribution • • Automated CML generation • Version controlled CMLs • Structured input with template and data validation • Automated test case generation • IP protected CMLs • • INTERCONNECT and Verilog-A models from single source • • Leverage build-in analysis from 3rd party EDA tools • Design and model using Verilog-A in 3rd party EDA tools • GENERAL SOLVER CAPABILITIES Charge transport (electrostatic potential and drift diffusion) • Self-consistent heat/charge modeling ◻ ◻ Heat transport (heat flux, convention, and radiation) • Finite Element Eigenmode Solver • Discontinuous Galerkin Time Domain Solver • Finite Difference Time Domain solver • Finite Difference Eigenmode solver • • Bidirectional eigenmode expansion • 2.5D variational FDTD (varFDTD) • Advanced conformal meshing • • Quantum mechanical band structure calc. (kp method) •

• Full Support ▲ Limited Capability ◻ Requires more than 1 product 52 CML Verilog-A / PHOTONICS CHARGE Compliler DGTD FDTD FEEM HEAT INTERCONNECT MODE MQW STACK Platform

GENERAL SOLVER CAPABILITIES Waveguide and band diagram calculation • Gain and spontanious emission calculation • Temperature, strain, and field effects • Analytic solver for rapid multilayer thin-film analysis • Planewave and dipole illumination • Capture Interface and microcavity effects • Circuit frequency domain analysis • Circuit transient mode simulator • Circuit transient block mode simulator • Circuilt multi-mode and multi-channel support • Circuit mixed signal representation • Laser library with TWLM solver • System library including optical fibre, FEC and MLSE models • MATERIALS SELECTION & RELATED TOOLS Comprehensive Material Models • • • • • • • • Multi-coefficient models • • • Non-linearity and Anisotropy modeling • ▲ OPTIMIZATION Inverse Design with lumopt • ▲ Particle Swarm • • • • • • • • Parameter Sweeps • • • • • • • ▲ ▲ POST PROCESSING Far-Field Projection • • • • Band Structure Analysis • Bidirectional Scattering Distribution Function • Q-Factor Analysis • • Charge Generation Rate • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 53 CML Verilog-A / PHOTONICS CHARGE Compliler DGTD FDTD FEEM HEAT INTERCONNECT MODE MQW STACK Platform

POSTPROCESSING Bend Loss Analysis • Overlap analysis • Model area analysis • Helical waveguides • Extract gain/absorption and spontaneous emission coefficients for TWLM model (INTERCONNECT) • Statistical support (Monte-Carlo Analysis) • • • • • • • Statistical Support (Corner analysis) • Small-signal analysis • Steady-state and transient analysis • • TOOL INTEROPERABILITY Multiphysics Solver Interoperabilty • • • • • • Automation API (Lumerical script/Matlab/Python) • • • • • • • • • Circuit electronic photonic co-simulation (3rd party tools) • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 54 / DESIGN TOOLS SpaceClaim DesignModeler Discovery 1 = Ansys nCode DesignLife Products

3D PRINTING 2 = Ansys Fluent 3 = Ansys DesignXplorer Import, Repair, Edit Faceted Data • • 4 = Ansys SpaceClaim Shelling and Infills • ▪ 5 = Ansys Customization Suite (ACS) Thickness Detection • • 6 = Ansys HPC, ANSYS HPC Pack DESIGN & CONCEPT MODELING or Ansys HPC Workgroup

Concept Modeling or Detail Design 7 = Ansys Granta Materials Data • • • for Simulation

Part/Assembly Creation or Import • • • 8 = Ansys Additive Suite Large Assembly Import • • • 9 = Ansys Composite Cure Simulation Geometric Parameterization 10 = Ansys SPEOS for NX & ANSYS SPEOS • • • for Creo Parametric FLUID 11 = Ansys SPEOS Steady-state Flow • 12 = Ansys SPEOS & Ansys SPEOS for NX

Transient Flow • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Incompressible Flow • DMP = Distributed-memory parallel Compressible Flow ▲ SMP = Shared-memory parallel INTERFACES AND ADD-ONS MAPDL = Mechanical APDL Simulation Transfer to Mechanical • • • Explicit = Autodyn Simulation Transfer to Fluent • • • RBD = Rigid Body Dynamics Algoryx Momentum • ▪ Aqwa = Aqwa MATERIALS DATA FOR DESIGNERS AND SIMULATION Materials Data for Simulation ▪ MULTIPHYSICS Conjugate Heat Transfer ▪ Thermal-Stress • REVERSE ENGINEERING Autosurface of Scanned Data • ▪ Build Solid/Surfaces on Scanned Data • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 55 / DESIGN TOOLS SpaceClaim DesignModeler Discovery 1 = Ansys nCode DesignLife Products

STRUCTURAL 2 = Ansys Fluent 3 = Ansys DesignXplorer Static Structural Analysis • 4 = Ansys SpaceClaim Modal Analysis • 5 = Ansys Customization Suite (ACS) Pre-Stressed Modal Analysis ▪ 6 = Ansys HPC, ANSYS HPC Pack Point Masses • or Ansys HPC Workgroup 7 = Ansys Granta Materials Data Nonlinear Contact and Joints ▪ for Simulation Pre-Tension Bolts ▪ 8 = Ansys Additive Suite Large Deformation ▪ 9 = Ansys Composite Cure Simulation Topology Optimization 10 = Ansys SPEOS for NX & ANSYS SPEOS • for Creo Parametric

THERMAL 11 = Ansys SPEOS

Steady-state Thermal • 12 = Ansys SPEOS & Ansys SPEOS for NX Transient Thermal • 13 = Ansys CFD Pro - Ansys Fluent with a reduced set of capabilities Conduction • DMP = Distributed-memory parallel Convection • SMP = Shared-memory parallel

MAPDL = Mechanical APDL

Explicit = Autodyn

RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 56 / GEOMETRY SpaceClaim DesignModeler Discovery 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent

3 = Ansys DesignXplorer Direct Modeling Technology • • 4 = Ansys SpaceClaim Feature Based Modeling Technology • 5 = Ansys Customization Suite (ACS) Open Data from All Major CAD Systems • • • 6 = Ansys HPC, ANSYS HPC Pack Export Data to Neutral File Formats • • • or Ansys HPC Workgroup 7 = Ansys Granta Materials Data Modify Imported Geometry • • • for Simulation Defeaturing and Simplification Tools • • • 8 = Ansys Additive Suite Model Repair • • • 9 = Ansys Composite Cure Simulation Add Parameters for Deisgn Exploration 10 = Ansys SPEOS for NX & ANSYS SPEOS • • • for Creo Parametric

Extract Mid-Surfaces/Shells and Beams • • ▪ 11 = Ansys SPEOS Extract Volumes and Create Inner Fluid Domains • • • 12 = Ansys SPEOS & Ansys SPEOS for NX Extract Outer Air Enclosures 13 = Ansys CFD Pro - Ansys Fluent with • • • a reduced set of capabilities Shared Topology for Conformal Meshing • • ▪ DMP = Distributed-memory parallel Booleans and Slicing • • • SMP = Shared-memory parallel Create Weid Bodies • • ▪ MAPDL = Mechanical APDL Boundary Condition Mapping • • ▪ Explicit = Autodyn Scripting • • ▪ RBD = Rigid Body Dynamics Aqwa = Aqwa Sketching and Editing Tools • • • 3D Comparison Tools • ▪ Repair and Edit Faceted Data • • Icepak Integration • • ▪ Reverse Engineering Faceted Data • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 57