• Full Support ▲ Limited Capability ▪ Requires more than 1 product / CONTENTS STRUCTURES FLUIDS Vibrations .................................................................................................................... 3 General Solver Capabilities ........................................................................22 Webservice ..............................................................................................................33 High Frequency Electromagnetics ....................................................44 Wave Hydrodynamics ...................................................................................... 3 Single Phase, Non-Reacting Flows ......................................................22 General .......................................................................................................................34 Power and Signal Integrity Board Additional Physics ................................................................................................ 3 Heat Transfer ..........................................................................................................23 Designing Optimization and Parameter Simulation Capabilities ................................................................................. 47 Composite Materials ......................................................................................... 5 Particle Flows (Multiphase) ........................................................................23 Identificaton (Calibration) ..........................................................................34 RLCG Parasitic Extraciton ...........................................................................48 Durability .....................................................................................................................6 Free Surface Flows (Multiphase) ...........................................................24 Data Management ..........................................................................................34 Electronics Cooling ..........................................................................................48 Explicit Dynamics .................................................................................................6 Dispersed Multiphase Flows (Multiphase) ...................................24 Process Management ...................................................................................34 Cabel Modeling ...................................................................................................49 Implicit Dynamics ................................................................................................ 7 Reacting Flows .....................................................................................................25 Application Management ..........................................................................34 HPC for Electronics ..........................................................................................49 Geometric Idealization ..................................................................................... 7 Turbomachinery ................................................................................................. 26 Integrations .............................................................................................................35 System Modeling for Power Electronics ........................................50 Geometry and STL File Handling ............................................................ 7 In-Flight Icing ....................................................................................................... 26 Workflow Management ...............................................................................35 System Modeling for RF / Microwave ...............................................50 HPC Structures .......................................................................................................8 Optimization ......................................................................................................... 26 Tool Interoperability ..........................................................................................35 System Modeling for SI / PI ........................................................................50 Materials .......................................................................................................................8 High Rheology Material ............................................................................... 27 Mulitphysics Platform Technologies ...................................................51 Miscellaneous and Usability ........................................................................9 HPC – Fluids ........................................................................................................... 27 SAFETY ANALYSIS Multhiphysics Electro-Thermal Interation ......................................51 Modeling Capabilities .....................................................................................10 Pre And Post Processing ............................................................................. 27 Materials Database for Electronics ........................................................51 Functional Safety Analysis ........................................................................ 36 Multi Analysis .........................................................................................................10 Multiphysics ..........................................................................................................28 Miscellaneous .........................................................................................................51 Cybersecurity Analysis ................................................................................. 36 Nonlinear Transient Dynamics ................................................................10 Fluid-Structure Interaction ........................................................................28 Optimization ............................................................................................................11 Electro-Thermal Interaction .....................................................................28 PHOTONICS Structural Solver Capabilties .......................................................................11 Other Coupled Interactions ......................................................................28 OPTICS AND VR Design Environment .......................................................................................52 Thermal .........................................................................................................................11 Ease of Use and Productivity ...................................................................28 Ansys Products Embedded .......................................................................37 General ........................................................................................................................52 Topology and Lattice Optimization ......................................................12 General Solver Capabilities .........................................................................37 General Solver Capabilities .........................................................................52 Particle Methods ..................................................................................................12 Photometry / Radiometry ...........................................................................37 Materials Selection & Related Tools .....................................................53 Automotive ...............................................................................................................12 AUTONOMOUS VEHICLE Huan Vision ............................................................................................................38 Optimization ..........................................................................................................53 SIMULATION Wavelength Range ..........................................................................................38 Post Processing ....................................................................................................53 SOUND SIMULATION Human Vision ...................................................................................................... 29 Optical Design .....................................................................................................38 Headlamp Simulation ................................................................................... 29 Tool Interoperability .........................................................................................54 Acoustics & Sound Quality .........................................................................14 Head-Up Display ................................................................................................ 39 System Simulation ........................................................................................... 29 HPC - SPEOS ........................................................................................................ 39 Context Simulation .......................................................................................... 29 Simulation Preparation ................................................................................ 39 DESIGN TOOLS ADDITIVE MANUFACTURING Rendering Engine ...........................................................................................