DOCSLIB.ORG

1 to Be Published in Part-I Section I of the Gazette of India Extraordinary

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
1 to Be Published in Part-I Section I of the Gazette of India Extraordinary To be published in Part-I Section I of the Gazette of India Extraordinary GOVERNMENT OF INDIA MINISTRY OF COMMERCE & INDUSTRY DEPARTMENT OF COMMERCE (DIRECTORATE GENERAL OF ANTI-DUMPING & ALLIED DUTIES) NOTIFICATION Dated 19th December, 2014 Final Findings Subject: Anti-dumping investigation concerning imports of USB Flash Drives, originating in or exported from China PR, Taiwan and Republic of Korea. F.No.14/22/2012-DGAD- Having regard to the Customs Tariff Act, 1975, as amended from time to time, (hereinafter also referred to as the Act), and the Customs Tariff (Identification, Assessment and Collection of Anti-Dumping Duty on Dumped Articles and for Determination of Injury) Rules, 1995, as amended from time to time, (hereinafter also referred to as the Rules) thereof; 2. WHEREAS, M/s Storage Media Products Manufacturers & Marketers Welfare Association (hereinafter also referred to as “the Association” or “the applicant”) filed an application on behalf of the domestic producers represented by M/s Moser Baer India Limited (hereinafter also referred to as the domestic industry), before the Designated Authority (hereinafter also referred to as the Authority) in accordance with the Act and the Rules for initiation of anti-dumping investigations concerning imports of USB flash drives (hereinafter also referred to as the subject goods), originating in or exported from China PR, Taiwan and Korea, RP and requested for levy of anti-dumping duties on the imports of the subject goods, originating in or exported from the said countries. 3. AND WHEREAS, the Authority, on the basis of sufficient evidence submitted by the applicant, issued a public notice vide Notification No. 14/22/2012- DGAD dated 21st June, 2013, published in the Gazette of India, Extraordinary, initiating the subject investigations in accordance with the sub Rule 5(5) of the Rules, to determine the existence, degree and effect of the alleged dumping of the subject goods, originating in or exported from the said countries, and to recommend the amount of anti-dumping duty, which, if levied, would be adequate to remove the alleged injury to the domestic industry. 1 A. PROCEDURE 4. The procedure described herein below has been followed by the Authority with regard to the subject investigation: i. The Authority notified the Embassies/Representatives of China PR, Taiwan and Korea, RP in India about the receipt of the anti-dumping application before proceeding to initiate the investigations in accordance with sub-rule (5) of Rule 5 supra. ii. In addition to the provisions of sub-rule (5) of Rule 5 supra, the Government of Korea RP was also informed through its Embassy in India about the receipt of the subject application as per provisions of Article 2.14 of Comprehensive Economic Partnership Agreement (CEPA) between India and Korea RP. iii. The Embassies of China PR, Taiwan and Korea, RP in India were informed about the initiation of the investigation in accordance with Rule 6(2) of the Rules with a request to advise the exporters/producers from their countries to respond to the questionnaire within prescribed time limit. A copy of the letter and questionnaire sent to the exporters was also sent to the concerned Embassies/Representatives along with the names and addresses of the known producers/exporters from their countries. iv. The Authority sent a copy of the initiation notification dated 21st June, 2013 to the Embassies of China PR, Taiwan and Korea, RP in India, known producers/exporters from China PR, Taiwan and Korea, RP, known importers/users and the domestic industry as per the addresses made available by the applicant and requested them to make their views known in writing within 40 days of the initiation notification. v. The Authority provided a copy of the non-confidential version of the application to the known producers/exporters and to the Embassies of China PR, Taiwan and Korea RP in India in accordance with Rule 6(3) of the Rules supra. vi. The Authority sent exporter’s questionnaires to elicit relevant information to the following known producers/exporters in China PR, Taiwan and Korea, RP in accordance with Rule 6(4) of the Rules: a. Transcend Information, Taiwan. b. Kingmax Digital Inc., Taiwan. c. ADATA Technology Co., Ltd., Taiwan d. Hewlett-Packard Taiwan Ltd., Taiwan. 2 e. Panasonic Taiwan Co., Ltd. (PTW), Taiwan f. Toshiba Information, Industrial and Power Systems Taiwan Corporation, Taiwan g. Samsung Electronics Taiwan Co., Ltd., Taiwan h. PNY Technologies, Inc., Taiwan. i. Kingston Technology Far East Co., Taiwan j. Verbatim Taiwan International Trading Corporate Ltd., Taiwan k. Apacer Technology Inc., Taiwan. l. KobianPte Ltd, Taiwan. m. Samsung C&T Taiwan Corporation, Taiwan. n. Toshiba China Co., Ltd, China o. SanDisk Corporation, China p. Kingston Technology Company, Inc., China q. Transcend Information, Inc., China r. ADATA Technology (Suzhou) Co., Ltd.China s. Apacer Electronic (Shanghai) Co., Ltd., China t. KobianPte Ltd, China. u. Panasonic Corporation of China, China v. Verbatim Shenzhen, China w. PNY Technologies, Inc., China x. SanDisk Semiconductor (Shanghai) Co. Ltd., China y. SanDisk Trading (Shanghai) Co., Ltd., China z. ShenzenKaifa Micro Electronics Co. Ltd., China aa. Kingston Tech (Shanghai) Co Ltd, China bb. Sony (China) Co., Ltd, China vii. The following companies filed exporters questionnaire response: a. SanDisk Semiconductor (Shanghai) Co Ltd, China PR, SanDisk Trading (Shanghai) Co Ltd, China PR, SanDisk Manufacturing, Ireland, and SanDisk International Ltd, Ireland. b. PNY Technologies Asia Pacific, Taiwan and PNY Technologies Inc, Shenzhen Representative Office, China. c. ATP Electronics, Taiwan, Inc, Taiwan. d. Sony Supply Chain Solutions, Japan, Sony EMCS Corp, Japan, Sony Corporation, Japan, Sony Electronics Asia Pacific PTE Ltd, Singapore. e. ADATA Technology (Suzhou) Co., Ltd, China PR and ADATA Technology Corporation Limited, Taiwan. 3 f. Shenzhen Kaifa Micro Electronics Co Ltd, China (SKMEC), Kingston Technology Far East Corporation, Taiwan (KTFE),Kaifa Technology Hong Kong Ltd, Hong Kong and Kingston Digital International Ltd, Ireland (KDIL). g. Transcend Information (Shanghai) Co Ltd, China PR, Transcend Trading (Shanghai) Co Ltd, China PR and Transcend Information Inc, Taiwan. viii. Another EQ response filed by Silicon Power Computer & Communications Inc, Taiwan was not accepted by the Authority at the application stage itself being incomplete. The said company did not file complete response. ix. The following EQR responses were filed at a much belated stage claiming themselves as manufacturing service providers to SanDisk Semiconductor (Shanghai) Co Ltd, China PR: a. UTAC Hong Kong Ltd, Hong Kong b. UTAC Dongguan Ltd, China PR c. STATS ChipPAC Shanghai Co Ltd, Shanghai, China PR d. STATS ChipPAC (BVI), Ltd, British Verginia Island e. Flextronics Marketing (L) Ltd, Lubuan, Malaysia x. The following Chinese producers/exporters filed Market Economy Treatment (MET) questionnaire response and claimed market economy status: i. SanDisk Semiconductor (Shanghai) Co Ltd, China PR. ii. SanDisk Trading (Shanghai) Co Ltd, China PR. iii. UTAC Dongguan Ltd, China PR. iv. STATS ChipPAC Shanghai Co Ltd, Shanghai, China PR. v. Shenzhen Kaifa Micro Electronics Co Ltd, China PR. vi. Transcend Information (Shanghai) Co Ltd, China PR. vii. Transcend Trading (Shanghai) Co Ltd, China PR. xi. The Authority sent Importer’s Questionnaires to the following known importers/users of subject goods in India calling for necessary information in accordance with Rule 6(4) of the Rules: a. Rashi Peripherals Pvt Ltd b. Dynamic Overseas c. Jas International d. HanixOverseas e. Aditya Enterprises f. Veeline Media Ltd 4 g. Himalayan Times Pvt Ltd h. Allied Electronics & Magnetics Ltd i. RanaPripherralsPvt Ltd j. Beetel Teletech Limited k. Supertron Electronics Ltd l. Intra-Tech Computers Pvt. Ltd. m. MediamanInfotech n. Luminous Technologies o. Redington (India) Limited p. CompuageInfocom Limited q. Neoteric Informatiqovt Ltd r. HCL Infosystems Ltd s. Fastrack Communications t. Shree Sagarmatha Distributors Pvt. Ltd u. KBC Computech (P) Ltd. v. Shreepati Computers w. Inter Foto India Pvt. Ltd x. Fortune Marketing Pvt. Ltd. y. Ingram Micro India Ltd z. Balaji Solutions Ltd xii. Importer’s questionnaire responses in the prescribed format were received from the following importer/user of the subject goods in India: a. Sony India Pvt. Ltd., New Delhi b. Compuage Infocom Ltd. c. Digi Life Distribution & Marketing Ltd. xiii. The petitioner had relied upon import data as per CYBEX (Secondary Source) in the petition. The Authority had relied upon the said data provided by the petitioner prima facie for the purpose of initiation of present investigation. Post initiation, request was made to the Directorate General of Commercial Intelligence and Statistics (DGCI&S) to provide transaction-wise details of imports of subject goods from China PR, Taiwan and Korea, RP for injury period, including the period of investigation. The Authority has analyzed the data from both the above stated sources and relied upon the data received from the DGCI&S in this finding as the volume and value of imports as per DGCI&S data is found to be higher than CYBEX. xiv. The petitioner had submitted petition alleging dumping of the subject goods from China PR, Taiwan and Republic of Korea relying upon the imports data from the secondary source. The Authority had relied upon the said data provided by the petitioner prima facie and initiated the present 5 investigation. However,
Load more

Recommended publications
  • Transcend Information, Inc. and Subsidiaries Consolidated Financial Statements And
    TRANSCEND INFORMATION, INC. AND SUBSIDIARIES CONSOLIDATED FINANCIAL STATEMENTS AND INDEPENDENT AUDITORS’ REVIEW REPORT JUNE 30, 2020 AND 2019 ------------------------------------------------------------------------------------------------------------------------------------ For the convenience of readers and for information purpose only, the auditors’ report and the accompanying financial statements have been translated into English from the original Chinese version prepared and used in the Republic of China. In the event of any discrepancy between the English version and the original Chinese version or any differences in the interpretation of the two versions, the Chinese-language auditors’ report and financial statements shall prevail. ~1~ TRANSCEND INFORMATION, INC. AND SUBSIDIARIES CONSOLIDATED BALANCE SHEETS (Expressed in thousands of New Taiwan Dollars) (The consolidated balance sheets as of June 30, 2020 and 2019 are reviewed, not audited) June 30, 2020 December 31, 2019 June 30, 2019 Assets Notes AMOUNT % AMOUNT % AMOUNT % Current assets Cash and cash equivalents 6(1) $ 1,987,626 9 $ 1,233,407 6 $ 1,246,352 5 Financial assets at fair value through 6(2) profit or loss - current 2,225,342 10 2,581,509 12 1,164,332 5 Current financial assets at amortised 6(3) cost, net 7,051,329 32 7,910,482 37 10,805,014 48 Notes receivable, net 6(4) 524 - 3,054 - 3,246 - Accounts receivable, net 6(4) 1,315,397 6 1,478,531 7 1,739,440 8 Accounts receivable due from 7 related parties, net 6 - 8 - - - Other receivables 103,600 1 124,077 1 106,004
    [Show full text]
  • Product Line Card
    Product Line Card ® CABLES Lenovo KEYBOARDS & NAS/SAN POWER SOLID STATE Accell MSI MICE D-Link PROTECTION/UPS DRIVES APC Cables by BAFO Shuttle Adesso Intel APC ADATA Link Depot ViewSonic Alaska Promise Opti-UPS Corsair StarTech.com ZOTAC Azio QNAP Tripp Lite Crucial SYBA Cooler Master SansDigital Intel EXTERNAL Corsair Synology POWER Kingston CASES ENCLOSURES Genius Thecus SUPPLIES OCZ AIC AcomData KeyTronic WD Antec PNY Antec Cremax Lenovo Apex Samsung Apex Eagle Tech Logitech NETWORKING Cooler Master WD CHENBRO iStarUSA Microsoft ASUS Corsair Compucase SIIG Razer Cisco Epower SURVEILLANCE Cooler Master Smarti SIIG D-Link FSP PRODUCTS Corsair StarTech.com Thermaltake Edimax In Win AVer Intel TRENDnet Emulex Intel D-Link In Win Vantec MEMORY Encore Electronics iStarUSA TP-LINK iStarUSA Zalman ADATA EnGenius Nspire TRENDnet Lian Li AMD Huawei Seasonic Vivotek Nspire FANS/HEATSINKS Corsair Intel Sentey Vonnic NZXT Antec Crucial Keebox Shuttle Zmodo Sentey Cooler Master Kingston NETGEAR Sparkle Power Edimax Supermicro Corsair Patriot SIIG Thermaltake Keebox Thermaltake Dynatron Samsung StarTech.com Zalman Winsis USA Enermax SYBA TABLETS Zalman Intel MONITORS TP-LINK PROJECTORS ASUS Noctua AOC TRENDnet ASUS GIGABYTE CONTROLLER StarTech.com ASUS Tripp Lite ViewSonic Lenovo CARDS Supermicro Hanns.G ZyXEL ViewSonic 3Ware Thermaltake Lenovo SERVERS HighPoint Vantec LG Electronics NOTEBOOKS/ AIC USB DRIVES Intel Zalman Planar NETBOOKS ASUS ADATA LSI ViewSonic ASI ASI Corsair Microwise HARD DRIVES ASUS Intel Kingston Promise ADATA MOTHERBOARDS
    [Show full text]
  • Redacted Public Version 28
    Case3:11-cv-04689-WHO Document250 Filed06/11/14 Page1 of 109 MICHAEL S. ELKIN (admitted pro hac vice) 1 [email protected] THOMAS P. LANE (admitted pro hac vice) 2 [email protected] WINSTON & STRAWN LLP 3 200 Park Avenue New York, NY 10166-4193 4 Telephone: 212.294.6700 Facsimile: 212.294.4700 5 ERIN R. RANAHAN (No. 235286) 6 [email protected] DREW A. ROBERTSON (No. 266317) 7 [email protected] WINSTON & STRAWN LLP 8 333 S. Grand Avenue, Suite 3800 Los Angeles, CA 90071-1543 9 Telephone: 213.615.1700 Facsimile: 213.615.1750 10 DANIEL B. ASIMOW (No. 165661) 11 [email protected] ROBERT D. HALLMAN (No. 239949) 12 [email protected] ARNOLD & PORTER LLP 13 Three Embarcadero Center, 10th Floor San Francisco, CA 94111-4024 14 Telephone: 415.471.3100 Facsimile: 415.471.3400 15 Attorneys for Plaintiff 16 PNY TECHNOLOGIES, INC. 17 UNITED STATES DISTRICT COURT 18 NORTHERN DISTRICT OF CALIFORNIA 19 SAN FRANCISCO DIVISION 20 21 PNY TECHNOLOGIES, INC., Case No.: 11-cv-04689 WHO 22 Plaintiff, THIRD AMENDED COMPLAINT FOR 23 ANTITRUST VIOLATIONS; v. DECLARATORY RELIEF; AND 24 UNFAIR COMPETITION SANDISK CORPORATION, 25 DEMAND FOR JURY TRIAL Defendant. 26 27 REDACTED PUBLIC VERSION 28 PNY’S THIRD AMENDED COMPLAINT 11-cv-04689-WHO LA:355215.1 Case3:11-cv-04689-WHO Document250 Filed06/11/14 Page2 of 109 1 Plaintiff PNY Technologies, Inc. (“PNY”), by and through its attorneys, Winston & Strawn 2 LLP and Arnold & Porter LLP, files this Third Amended Complaint against Defendant SanDisk 3 Corporation (“SanDisk”) to secure damages, declaratory relief and injunctive relief, and demanding 4 trial by jury, claims and alleges as follows: 5 NATURE OF ACTION 6 1.
    [Show full text]
  • Vista Procedure
    Qualified Vendors List – Devices 1. Power Supplies Model ipower90 500W AcBel R88 PC7063 700W Aero Cool STRIKE-X 600W EA-500D 500W EDG750 750W Antec HCP-1300 1300W NEOECO-II 650 TP-750C 750W AYWUN A1-550-ELITE 550W BQ L8-500W Be quiet PURE POWER 9 700W BitFenix FURY 650G 650W BUBALUS PG800AAA 700W MPZ-C001-AFBAT 1200W RS-350-PSAR-I3 350W CoolerMaster RS-450-AMAA-B1 450W RS-750-AFBA-G1 750W RS-850-AFBA-G1 850W AX1500i 75-001971 1500W CX-450M 450W CX-650 CX-750 HX1000 Corsair HX1200 RPS0017(RM850X) 850W SF-600 600W TX-850M 850W Vengeance 550M 550W VS-400 400W Cougar GX-1050 1050W D.HIGH DHP-200KGH-80P 1000W ERV1200EWT-G 1200W EnerMAX ERX730AWT 730W ETL450AWT-M 450W 220-P2-1200-X1 1200W EVGA SuperNova-750-G2 750W HydroX-450 450W PT-650M 650W FSP RAIDER-II 450W RAIDER 650W Huntkey WD600 600W LEPA B550-SA 550W OCZ OCZ-FTY750W 750W HIVE-850S 850W Rosewill PHOTON-1200 1200W Copyright 2017 ASUSTeK Computer Inc. PAGE 1 Devices Model S12 II SS-330GB 330W SS-1200XP3 Active PFC F3 1200W Seasonic SS-400FL 400W SSR-450RM Active PFC F3 450W PAT-800W Seventeam ST-550P-AD 550Wll SST-60F-P 600W Silverstone SST-ST85F-GS 850W Super Flower SF-1000F14MP 1000W Smart DPS G 650 650W Toughpower TPX775 775W Thermaltake TPG-0850D 850W TPD-1200M 1200W ZUMAX ZU-500G-JP 500W 2. Hard Drives 2.1. HDD Devices Type Model Hitachi HDN726060ALE610 Seagate ST2000NX0243 Seagate Seagate ST8000AS0002 SATA 6G WD6001FZWX WD60PURX WD WD60EZRX WD10J31X 2.2.
    [Show full text]
  • Product Test Report
    PCIe 2280 M.2 SSD MTE652T2 Datasheet Products Product Description TS512GMTE652T2 M.2 2280, PCIe Gen3x4, M-Key, 3D TLC, PE: 3K, 4CH, 30u” TS256GMTE652T2 TS128GMTE652T2 Datasheet version 1.1 No.70, Xingzhong Rd., Neihu Dist.,Taipei City 114, Taiwan, R.O.C. Tel:+886-2-2792-8000 Fax:+886-2-2792-1614 www.transcend-info.com Copyright© Transcend Information, Inc. All Rights Reserved. 1 Revision History Revision No. History Released Date Editor by 1.0 First version (WD BICS4) 2020/05/26 TSD Extended the Temperature Storage from -55°C to 85°C 1.1 Added 5.2.11 Early Move Function 2020/08/25 TSD Added 5.2.12 Read Retry Function 2 Transcend MTE652T2 Features Part Name Capacity TS512GMTE652T2 512GB TS256GMTE652T2 256GB TS128GMTE652T2 128GB FEATURES PCI Express Gen3 x 4, NVMe 3D TLC NAND Flash UBER 10-15 M.2 PCIe 2280 M Key DWPD 2 DWPD DDR3 DRAM cache MTBF 3,000,000 hours Global wear-leveling function Data Retention 1 year Enhance Bad block management Warranty 3 years Power shield function LDPC ECC (Error correction code) functionality ENVIRONMENTAL SPECIFICATIONS1) NVM command support Temperature Advanced Garbage Collection - Operating -20°C to 75°C Internal RAID Engine - Non-operating -55°C to 85°C Supports S.M.A.R.T. Function Humidity(non-condensing) 5%~95% PCB Gold Finger 30u” Shock 1500G, 0.5ms Dynamic Thermal Throttling (Default) Vibration 20G, 7~2000Hz Self-encrypting drives(SED) with AES-256 (Optional) POWER REQUIREMENTS1) Corner Bond (Key components) Supply voltage / Tolerance 3.3V±5% Active (max) 3.3W 1) PERFORMANCE Idle (max) 0.6W Data Transfer Rate - Sequential Read Up to 2100 MB/s PHYSICAL DIMENSION - Sequential Write Up to 1000 MB/s Width 22.00±0.15mm Length 80.00±0.15mm 1) RELIABILITY Height(max) 3.58mm TBW Weight Up to 9g - 512GB 1,080TB Note: - 256GB 540TB 1) For detail information, please refer to document content.
    [Show full text]
  • SPANSION INC., Et Al. Debtors. Chapter 11 Cases
    THIS PROPOSED DISCLOSURE STATEMENT IS NOT A SOLICITATION OF ACCEPTANCES OR REJECTIONS OF THE PLAN. ACCEPTANCES AND REJECTIONS MAY NOT BE SOLICITED UNTIL A DISCLOSURE STATEMENT HAS BEEN APPROVED BY THE BANKRUPTCY COURT. THIS PROPOSED DISCLOSURE STATEMENT IS BEING SUBMITTED FOR APPROVAL BUT HAS NOT YET BEEN APPROVED BY THE BANKRUPTCY COURT. UNITED STATES BANKRUPTCY COURT FOR THE DISTRICT OF DELAWARE In re: Chapter 11 Cases SPANSION INC., et al.1 Case No. 09-10690 (KJC) Debtors. (Jointly Administered) FIRST AMENDED DISCLOSURE STATEMENT FOR DEBTORS’ FIRST AMENDED JOINT PLAN OF REORGANIZATION DATED NOVEMBER 25, 2009 LATHAM & WATKINS LLP Michael S. Lurey Gregory O. Lunt Kimberly A. Posin 355 South Grand Avenue Los Angeles, CA 90071 Telephone: (213) 485-1234 Facsimile: (213) 891-8763 DUANE MORRIS, LLP Michael R. Lastowski Richard W. Riley Sommer L. Ross 1100 North Market Street, Suite 1200 Wilmington, DE 19801 Telephone: (302) 657-4900 Facsimile: (302) 657-4901 Counsel for the Debtors and Debtors in Possession 1 The Debtors in these cases, along with the last four digits of each Debtor’s federal tax identification number, are: Spansion Inc., a Delaware corporation (8239); Spansion Technology LLC, a Delaware limited liability company (3982); Spansion LLC, a Delaware limited liability company (0482); Cerium Laboratories LLC, a Delaware limited liability company (0482), and Spansion International, Inc., a Delaware corporation (7542). The mailing address for each Debtor is 915 DeGuigne Dr., Sunnyvale, California 94085. LA\2030380.6 TABLE OF CONTENTS
    [Show full text]
  • ONFI:ONFI: Leadingleading Thethe Wayway Toto Higherhigher NANDNAND Performanceperformance
    ONFI:ONFI: LeadingLeading thethe WayWay toto HigherHigher NANDNAND PerformancePerformance AmberAmber HuffmanHuffman PrincipalPrincipal EngineerEngineer IntelIntel CorporationCorporation JuneJune 7,7, 20072007 1 AgendaAgenda yyPCPC platformplatform andand needneed forfor aa standardstandard yyHighHigh speedspeed andand PCPC opportunityopportunity yyOtherOther keykey ingredientsingredients forfor PCPC useuse ofof NANDNAND 2 TheThe PCPC isis aa KeyKey ComponentComponent ofof NANDNAND GrowthGrowth Unit: in 1Gb E., Million units Q307F Q407F Shipment Demand Shipment Demand y NAND growth is projected to be 26.8 697.9 31.5 884.6 Digital Still Cameras 140% YoY for 06/07 13.7% 32.0% 17.4% 27.0% 271.7 880.2 309.7 1,271.5 Cell phones y Largest growth area is “Others” 7.0% 38.0% 14.0% 44.0% 35.1 615.2 38.9 734.5 USB Drives – More than 50% projected QoQ 14.8% 29.0% 10.7% 19.0% 32.6 779.7 46.7 1,223.4 Flash-based MP3/PMP growth for Q3/Q4 9.5% 32.0% 43.3% 57.0% Other 359.6 578.2 y A key component of the （DVs、Game 54.0% 61.0% Total NAND Flash 3,309.0 4,692.2 “Others” category is PC uses Demand 33.0% 42.0% in 1Gb E., Million units Worldwide NAND Flash IC Output (M 1Gb) 1,800 1,600 1,400 1,200 1,000 800 600 400 200 0 Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec 2006 220.8 267.1 278.2 336.1 355.8 373.0 427.9 461.7 488.8 573.2 619.0 655.5 2007 629.7 671.8 703.8 777.6 829.8 869.9 1,027.2 1,095.6 1,147.8 1,416.3 1,511.4 1,584.0 Source: DRAMeXchange, 4/2007 3 NANDNAND InteroperabilityInteroperability ImpactsImpacts AdoptionAdoption inin PCPC PlatformsPlatforms
    [Show full text]
  • Flash Memory Summit Pocket Guide 2017
    2017 FLASH MEMORY SUMMIT POCKET GUIDE AUGUST 8-10 SANTA CLARA CONVENTION CENTER AUGUST 7 PRE-CONFERENCE TUTORIALS Contents 3 4 Highlights 6 Exhibitors 8 Exhibit Hall Floor Plan 11 Keynote Presentations 2017 Sponsors Gold Sponsors Mobiveil Executive Premier Sponsors SANBlaze Technology Samsung SD Association SK Hynix Bronze Sponsors AccelStor Toshiba America ADATA Technology Electronic Components Apeiron Data Systems ATP Electronics Premier Sponsors Broadcom Brocade Communications Hewlett Packard Enterprise Systems Development Cadence Design Systems Intel Calypso Systems CEA LETI Marvell Semiconductor Celestica Micron Technology CNEX Labs Microsemi Epostar Electronics Excelero NetApp FADU Seagate Technology Fibre Channel Industry Assoc. Foremay Silicon Motion Technology Hagiwara Solutions Western Digital IBM JEDEC Platinum Sponsors Kroll Ontrack Crossbar Lam Research Maxio E8 Storage Mentor Graphics Everspin Technologies Newisys Innodisk NVMdurance NVXL Technology Lite-On Storage Sage Microelectronic NGD Systems SATA-IO Nimbus Data SCSI Trade Association Silicon Storage Technology One Stop Systems SiliconGo Microelectronics Radian Memory Systems SNIA-SSSI Synopsys Smart IOPS Tegile SMART Modular Teledyne LeCroy Technologies Teradyne Transcend Information Swissbit UFSA Symbolic IO ULINK Technology Viking Technology UNH-IOL UniTest Emerald Sponsors VARTA Microbattery VIA Technologies Advantest Virtium Amphenol Xilinx Dera Storage Participating Organizations Diablo Technologies Chosen Voice Gen-Z Consortium Circuit Cellar Connetics USA Hyperstone
    [Show full text]
  • Vanguard Total World Stock Index Fund Annual Report October 31, 2020
    Annual Report | October 31, 2020 Vanguard Total World Stock Index Fund See the inside front cover for important information about access to your fund’s annual and semiannual shareholder reports. Important information about access to shareholder reports Beginning on January 1, 2021, as permitted by regulations adopted by the Securities and Exchange Commission, paper copies of your fund’s annual and semiannual shareholder reports will no longer be sent to you by mail, unless you specifically request them. Instead, you will be notified by mail each time a report is posted on the website and will be provided with a link to access the report. If you have already elected to receive shareholder reports electronically, you will not be affected by this change and do not need to take any action. You may elect to receive shareholder reports and other communications from the fund electronically by contacting your financial intermediary (such as a broker-dealer or bank) or, if you invest directly with the fund, by calling Vanguard at one of the phone numbers on the back cover of this report or by logging on to vanguard.com. You may elect to receive paper copies of all future shareholder reports free of charge. If you invest through a financial intermediary, you can contact the intermediary to request that you continue to receive paper copies. If you invest directly with the fund, you can call Vanguard at one of the phone numbers on the back cover of this report or log on to vanguard.com. Your election to receive paper copies will apply to all the funds you hold through an intermediary or directly with Vanguard.
    [Show full text]
  • Ts8gssd25-S Ts16gssd25-S Ts32gssd25-M
    TTSS88GGSSSSDD2255--SSS TTSS1166GGSSSSDD2255--SS TTSS3322GGSSSSDD2255--MM 2.5” Solid State Disk Description Features Due to smaller size (fit the standard dimensions of • RoHS compliant 2.5” IDE Hard Disk Drives), huge capacity, high • Fully compatible with devices and OS that support the speed, and low power consumption, Solid State Disk IDE standard (44-Pin, pitch = 2.00 mm) is perfect replacement storage device for PCs, • Non-volatile Flash Memory for outstanding data Laptops, gaming systems, and handheld devices. retention • Built-in ECC (Error Correction Code) functionality and Placement wear-leveling algorithm ensures highly reliable of data transfer • Supports up to PIO Mode 4 and Ultra DMA Mode 4 • Lower Power Consumption • Shock resistance Dimensions Side Millimeters Inches A 100.00 ± 0.40 3.937 ± 0.016 B 69.85 ± 0.20 2.750 ± 0.008 C 7.40 ± 0.15 0.292 ± 0.004 Transcend Information Inc. 1 V1.02 TTSS88GGSSSSDD2255--SSS TTSS1166GGSSSSDD2255--SS TTSS3322GGSSSSDD2255--MM 2.5” Solid State Disk Specifications Physical Specification Form Factor 2.5-inch HDD Storage Capacities 8 GB to 32 GB Length 100.0 0 ± 0.40 Dimensions (mm) Width 69.85 ± 0.20 Height 7.40 ± 0.15 Input Voltage 5V ± 5% Weight 80 g Connector 44-Pin standard IDE/ATA connector (Pitch 2.0 mm) Environmental Specifications Operating Temperature 0 ℃ to 70 ℃ Storage Temperature - 40 ℃ to 85 ℃ Power Requirements Input Voltage 5V ± 10% Mode TYP (mA) MAX (mA) TS32GSSD25-M Write 78.0 112.8 Power Consumption Read 57.7 78.2 (DC 5V @25℃) Standby 1.5 3.2 Mode TYP (mA) MAX (mA) TS16GSSD25-S Write 57.8 112.4 Power Consumption Read 55.8 104.7 (DC 5V @25℃) Standby 1.9 3.3 Mode TYP (mA) MAX (mA) TS8GSSD25-S Write 51.8 98.4 Power Consumption Read 47.3 91.2 (DC 5V @25℃) Standby 1.1 3.0 Transcend Information Inc.
    [Show full text]
  • Micron: NAND Flash Architecture and Specification Trends
    NAND Flash Architecture and Specification Trends Michael Abraham ([email protected]) Applications Engineering Manager Micron Technology, Inc. Santa Clara, CA USA August 2009 1 Abstract As NAND Flash continues to shrink, page sizes, block sizes, and ECC requirements are increasing while data retention, endurance, and performance are decreasing. These changes impact systems including random write performance and more. Learn how to prepare for these changes and counteract some of them through improved block management techniques and system design. This presentation also discusses some of the tradeoff myths – for example, the myth that you can directly trade ECC for endurance Santa Clara, CA USA August 2009 2 NAND Flash: Shrinking Faster Than Moore’s Law 200 100 Logic 80 DRAM on (nm) ii 60 NAND Resolut 40 Micron 32Gb NAND (34nm) 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 Semiconductor International, 1/1/2007 Santa Clara, CA USA August 2009 3 Memory Organization Trends Over time, NAND block size is increasing. • Larger page sizes increase sequential throughput. • More pages per block reduce die size. 4,194,304 1,048,576 262,144 65,536 16,384 4,096 1, 024 256 64 16 Block size (B) Data Bytes per Page Pages per Block Santa Clara, CA USA August 2009 4 Consumer-grade NAND Flash: Endurance and ECC Trends Process shrinks lead to less electrons ppgger floating gate. ECC used to improve data retention and endurance. To adjust for increasing RBERs, ECC is increasing exponentially to achieve equivalent UBERs. For consumer applications, endurance becomes less important as density increases.
    [Show full text]
  • Turning Data Into Insight with IBM Machine Learning for Z/OS
    Front cover Turning Data into Insight with IBM Machine Learning for z/OS Samantha Buhler He Sheng Yang Guanjun Cai Dai Yi John Goodyear Xavier Yuen Edrian Irizarry Hao Zhang Nora Kissari Zhuo Ling Nicholas Marion Aleksandr Petrov Junfei Shen Wanting Wang Redbooks International Technical Support Organization Turning Data into Insight with IBM Machine Learning for z/OS August 2018 SG24-8421-00 Note: Before using this information and the product it supports, read the information in “Notices” on page vii. First Edition (August 2018) This edition applies to IBM Machine Learning for z/OS version 1.1.0. © Copyright International Business Machines Corporation 2018. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Notices . vii Trademarks . viii Preface . ix Authors. ix Acknowledgements . xi Now you can become a published author, too! . xi Comments welcome. xii Stay connected to IBM Redbooks . xii Chapter 1. Overview . 1 1.1 Challenges of exponential data growth . 2 1.2 Trends in artificial intelligence and cognitive systems. 2 1.3 IBM’s approach to artificial intelligence and cognitive systems. 3 1.4 IBM Machine Learning for z/OS: An enterprise machine learning solution. 4 1.5 Unmatched capabilities of Machine Learning for z/OS . 4 1.5.1 Secure IBM Z platform for running machine learning with data in place. 5 1.5.2 Full lifecycle management of models . 5 1.5.3 Enterprise grade performance and high availability . 6 1.5.4 Flexible choice of machine learning languages and scoring engines .
    [Show full text]