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Transcend Information, Inc. and Subsidiaries Consolidated Financial Statements And
TRANSCEND INFORMATION, INC. AND SUBSIDIARIES CONSOLIDATED FINANCIAL STATEMENTS AND INDEPENDENT AUDITORS’ REVIEW REPORT JUNE 30, 2020 AND 2019 ------------------------------------------------------------------------------------------------------------------------------------ For the convenience of readers and for information purpose only, the auditors’ report and the accompanying financial statements have been translated into English from the original Chinese version prepared and used in the Republic of China. In the event of any discrepancy between the English version and the original Chinese version or any differences in the interpretation of the two versions, the Chinese-language auditors’ report and financial statements shall prevail. ~1~ TRANSCEND INFORMATION, INC. AND SUBSIDIARIES CONSOLIDATED BALANCE SHEETS (Expressed in thousands of New Taiwan Dollars) (The consolidated balance sheets as of June 30, 2020 and 2019 are reviewed, not audited) June 30, 2020 December 31, 2019 June 30, 2019 Assets Notes AMOUNT % AMOUNT % AMOUNT % Current assets Cash and cash equivalents 6(1) $ 1,987,626 9 $ 1,233,407 6 $ 1,246,352 5 Financial assets at fair value through 6(2) profit or loss - current 2,225,342 10 2,581,509 12 1,164,332 5 Current financial assets at amortised 6(3) cost, net 7,051,329 32 7,910,482 37 10,805,014 48 Notes receivable, net 6(4) 524 - 3,054 - 3,246 - Accounts receivable, net 6(4) 1,315,397 6 1,478,531 7 1,739,440 8 Accounts receivable due from 7 related parties, net 6 - 8 - - - Other receivables 103,600 1 124,077 1 106,004 -
Redacted Public Version 28
Case3:11-cv-04689-WHO Document250 Filed06/11/14 Page1 of 109 MICHAEL S. ELKIN (admitted pro hac vice) 1 [email protected] THOMAS P. LANE (admitted pro hac vice) 2 [email protected] WINSTON & STRAWN LLP 3 200 Park Avenue New York, NY 10166-4193 4 Telephone: 212.294.6700 Facsimile: 212.294.4700 5 ERIN R. RANAHAN (No. 235286) 6 [email protected] DREW A. ROBERTSON (No. 266317) 7 [email protected] WINSTON & STRAWN LLP 8 333 S. Grand Avenue, Suite 3800 Los Angeles, CA 90071-1543 9 Telephone: 213.615.1700 Facsimile: 213.615.1750 10 DANIEL B. ASIMOW (No. 165661) 11 [email protected] ROBERT D. HALLMAN (No. 239949) 12 [email protected] ARNOLD & PORTER LLP 13 Three Embarcadero Center, 10th Floor San Francisco, CA 94111-4024 14 Telephone: 415.471.3100 Facsimile: 415.471.3400 15 Attorneys for Plaintiff 16 PNY TECHNOLOGIES, INC. 17 UNITED STATES DISTRICT COURT 18 NORTHERN DISTRICT OF CALIFORNIA 19 SAN FRANCISCO DIVISION 20 21 PNY TECHNOLOGIES, INC., Case No.: 11-cv-04689 WHO 22 Plaintiff, THIRD AMENDED COMPLAINT FOR 23 ANTITRUST VIOLATIONS; v. DECLARATORY RELIEF; AND 24 UNFAIR COMPETITION SANDISK CORPORATION, 25 DEMAND FOR JURY TRIAL Defendant. 26 27 REDACTED PUBLIC VERSION 28 PNY’S THIRD AMENDED COMPLAINT 11-cv-04689-WHO LA:355215.1 Case3:11-cv-04689-WHO Document250 Filed06/11/14 Page2 of 109 1 Plaintiff PNY Technologies, Inc. (“PNY”), by and through its attorneys, Winston & Strawn 2 LLP and Arnold & Porter LLP, files this Third Amended Complaint against Defendant SanDisk 3 Corporation (“SanDisk”) to secure damages, declaratory relief and injunctive relief, and demanding 4 trial by jury, claims and alleges as follows: 5 NATURE OF ACTION 6 1. -
Product Test Report
PCIe 2280 M.2 SSD MTE652T2 Datasheet Products Product Description TS512GMTE652T2 M.2 2280, PCIe Gen3x4, M-Key, 3D TLC, PE: 3K, 4CH, 30u” TS256GMTE652T2 TS128GMTE652T2 Datasheet version 1.1 No.70, Xingzhong Rd., Neihu Dist.,Taipei City 114, Taiwan, R.O.C. Tel:+886-2-2792-8000 Fax:+886-2-2792-1614 www.transcend-info.com Copyright© Transcend Information, Inc. All Rights Reserved. 1 Revision History Revision No. History Released Date Editor by 1.0 First version (WD BICS4) 2020/05/26 TSD Extended the Temperature Storage from -55°C to 85°C 1.1 Added 5.2.11 Early Move Function 2020/08/25 TSD Added 5.2.12 Read Retry Function 2 Transcend MTE652T2 Features Part Name Capacity TS512GMTE652T2 512GB TS256GMTE652T2 256GB TS128GMTE652T2 128GB FEATURES PCI Express Gen3 x 4, NVMe 3D TLC NAND Flash UBER 10-15 M.2 PCIe 2280 M Key DWPD 2 DWPD DDR3 DRAM cache MTBF 3,000,000 hours Global wear-leveling function Data Retention 1 year Enhance Bad block management Warranty 3 years Power shield function LDPC ECC (Error correction code) functionality ENVIRONMENTAL SPECIFICATIONS1) NVM command support Temperature Advanced Garbage Collection - Operating -20°C to 75°C Internal RAID Engine - Non-operating -55°C to 85°C Supports S.M.A.R.T. Function Humidity(non-condensing) 5%~95% PCB Gold Finger 30u” Shock 1500G, 0.5ms Dynamic Thermal Throttling (Default) Vibration 20G, 7~2000Hz Self-encrypting drives(SED) with AES-256 (Optional) POWER REQUIREMENTS1) Corner Bond (Key components) Supply voltage / Tolerance 3.3V±5% Active (max) 3.3W 1) PERFORMANCE Idle (max) 0.6W Data Transfer Rate - Sequential Read Up to 2100 MB/s PHYSICAL DIMENSION - Sequential Write Up to 1000 MB/s Width 22.00±0.15mm Length 80.00±0.15mm 1) RELIABILITY Height(max) 3.58mm TBW Weight Up to 9g - 512GB 1,080TB Note: - 256GB 540TB 1) For detail information, please refer to document content. -
SPANSION INC., Et Al. Debtors. Chapter 11 Cases
THIS PROPOSED DISCLOSURE STATEMENT IS NOT A SOLICITATION OF ACCEPTANCES OR REJECTIONS OF THE PLAN. ACCEPTANCES AND REJECTIONS MAY NOT BE SOLICITED UNTIL A DISCLOSURE STATEMENT HAS BEEN APPROVED BY THE BANKRUPTCY COURT. THIS PROPOSED DISCLOSURE STATEMENT IS BEING SUBMITTED FOR APPROVAL BUT HAS NOT YET BEEN APPROVED BY THE BANKRUPTCY COURT. UNITED STATES BANKRUPTCY COURT FOR THE DISTRICT OF DELAWARE In re: Chapter 11 Cases SPANSION INC., et al.1 Case No. 09-10690 (KJC) Debtors. (Jointly Administered) FIRST AMENDED DISCLOSURE STATEMENT FOR DEBTORS’ FIRST AMENDED JOINT PLAN OF REORGANIZATION DATED NOVEMBER 25, 2009 LATHAM & WATKINS LLP Michael S. Lurey Gregory O. Lunt Kimberly A. Posin 355 South Grand Avenue Los Angeles, CA 90071 Telephone: (213) 485-1234 Facsimile: (213) 891-8763 DUANE MORRIS, LLP Michael R. Lastowski Richard W. Riley Sommer L. Ross 1100 North Market Street, Suite 1200 Wilmington, DE 19801 Telephone: (302) 657-4900 Facsimile: (302) 657-4901 Counsel for the Debtors and Debtors in Possession 1 The Debtors in these cases, along with the last four digits of each Debtor’s federal tax identification number, are: Spansion Inc., a Delaware corporation (8239); Spansion Technology LLC, a Delaware limited liability company (3982); Spansion LLC, a Delaware limited liability company (0482); Cerium Laboratories LLC, a Delaware limited liability company (0482), and Spansion International, Inc., a Delaware corporation (7542). The mailing address for each Debtor is 915 DeGuigne Dr., Sunnyvale, California 94085. LA\2030380.6 TABLE OF CONTENTS -
ONFI:ONFI: Leadingleading Thethe Wayway Toto Higherhigher NANDNAND Performanceperformance
ONFI:ONFI: LeadingLeading thethe WayWay toto HigherHigher NANDNAND PerformancePerformance AmberAmber HuffmanHuffman PrincipalPrincipal EngineerEngineer IntelIntel CorporationCorporation JuneJune 7,7, 20072007 1 AgendaAgenda yyPCPC platformplatform andand needneed forfor aa standardstandard yyHighHigh speedspeed andand PCPC opportunityopportunity yyOtherOther keykey ingredientsingredients forfor PCPC useuse ofof NANDNAND 2 TheThe PCPC isis aa KeyKey ComponentComponent ofof NANDNAND GrowthGrowth Unit: in 1Gb E., Million units Q307F Q407F Shipment Demand Shipment Demand y NAND growth is projected to be 26.8 697.9 31.5 884.6 Digital Still Cameras 140% YoY for 06/07 13.7% 32.0% 17.4% 27.0% 271.7 880.2 309.7 1,271.5 Cell phones y Largest growth area is “Others” 7.0% 38.0% 14.0% 44.0% 35.1 615.2 38.9 734.5 USB Drives – More than 50% projected QoQ 14.8% 29.0% 10.7% 19.0% 32.6 779.7 46.7 1,223.4 Flash-based MP3/PMP growth for Q3/Q4 9.5% 32.0% 43.3% 57.0% Other 359.6 578.2 y A key component of the (DVs、Game 54.0% 61.0% Total NAND Flash 3,309.0 4,692.2 “Others” category is PC uses Demand 33.0% 42.0% in 1Gb E., Million units Worldwide NAND Flash IC Output (M 1Gb) 1,800 1,600 1,400 1,200 1,000 800 600 400 200 0 Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec 2006 220.8 267.1 278.2 336.1 355.8 373.0 427.9 461.7 488.8 573.2 619.0 655.5 2007 629.7 671.8 703.8 777.6 829.8 869.9 1,027.2 1,095.6 1,147.8 1,416.3 1,511.4 1,584.0 Source: DRAMeXchange, 4/2007 3 NANDNAND InteroperabilityInteroperability ImpactsImpacts AdoptionAdoption inin PCPC PlatformsPlatforms -
Flash Memory Summit Pocket Guide 2017
2017 FLASH MEMORY SUMMIT POCKET GUIDE AUGUST 8-10 SANTA CLARA CONVENTION CENTER AUGUST 7 PRE-CONFERENCE TUTORIALS Contents 3 4 Highlights 6 Exhibitors 8 Exhibit Hall Floor Plan 11 Keynote Presentations 2017 Sponsors Gold Sponsors Mobiveil Executive Premier Sponsors SANBlaze Technology Samsung SD Association SK Hynix Bronze Sponsors AccelStor Toshiba America ADATA Technology Electronic Components Apeiron Data Systems ATP Electronics Premier Sponsors Broadcom Brocade Communications Hewlett Packard Enterprise Systems Development Cadence Design Systems Intel Calypso Systems CEA LETI Marvell Semiconductor Celestica Micron Technology CNEX Labs Microsemi Epostar Electronics Excelero NetApp FADU Seagate Technology Fibre Channel Industry Assoc. Foremay Silicon Motion Technology Hagiwara Solutions Western Digital IBM JEDEC Platinum Sponsors Kroll Ontrack Crossbar Lam Research Maxio E8 Storage Mentor Graphics Everspin Technologies Newisys Innodisk NVMdurance NVXL Technology Lite-On Storage Sage Microelectronic NGD Systems SATA-IO Nimbus Data SCSI Trade Association Silicon Storage Technology One Stop Systems SiliconGo Microelectronics Radian Memory Systems SNIA-SSSI Synopsys Smart IOPS Tegile SMART Modular Teledyne LeCroy Technologies Teradyne Transcend Information Swissbit UFSA Symbolic IO ULINK Technology Viking Technology UNH-IOL UniTest Emerald Sponsors VARTA Microbattery VIA Technologies Advantest Virtium Amphenol Xilinx Dera Storage Participating Organizations Diablo Technologies Chosen Voice Gen-Z Consortium Circuit Cellar Connetics USA Hyperstone -
Vanguard Total World Stock Index Fund Annual Report October 31, 2020
Annual Report | October 31, 2020 Vanguard Total World Stock Index Fund See the inside front cover for important information about access to your fund’s annual and semiannual shareholder reports. Important information about access to shareholder reports Beginning on January 1, 2021, as permitted by regulations adopted by the Securities and Exchange Commission, paper copies of your fund’s annual and semiannual shareholder reports will no longer be sent to you by mail, unless you specifically request them. Instead, you will be notified by mail each time a report is posted on the website and will be provided with a link to access the report. If you have already elected to receive shareholder reports electronically, you will not be affected by this change and do not need to take any action. You may elect to receive shareholder reports and other communications from the fund electronically by contacting your financial intermediary (such as a broker-dealer or bank) or, if you invest directly with the fund, by calling Vanguard at one of the phone numbers on the back cover of this report or by logging on to vanguard.com. You may elect to receive paper copies of all future shareholder reports free of charge. If you invest through a financial intermediary, you can contact the intermediary to request that you continue to receive paper copies. If you invest directly with the fund, you can call Vanguard at one of the phone numbers on the back cover of this report or log on to vanguard.com. Your election to receive paper copies will apply to all the funds you hold through an intermediary or directly with Vanguard. -
Ts8gssd25-S Ts16gssd25-S Ts32gssd25-M
TTSS88GGSSSSDD2255--SSS TTSS1166GGSSSSDD2255--SS TTSS3322GGSSSSDD2255--MM 2.5” Solid State Disk Description Features Due to smaller size (fit the standard dimensions of • RoHS compliant 2.5” IDE Hard Disk Drives), huge capacity, high • Fully compatible with devices and OS that support the speed, and low power consumption, Solid State Disk IDE standard (44-Pin, pitch = 2.00 mm) is perfect replacement storage device for PCs, • Non-volatile Flash Memory for outstanding data Laptops, gaming systems, and handheld devices. retention • Built-in ECC (Error Correction Code) functionality and Placement wear-leveling algorithm ensures highly reliable of data transfer • Supports up to PIO Mode 4 and Ultra DMA Mode 4 • Lower Power Consumption • Shock resistance Dimensions Side Millimeters Inches A 100.00 ± 0.40 3.937 ± 0.016 B 69.85 ± 0.20 2.750 ± 0.008 C 7.40 ± 0.15 0.292 ± 0.004 Transcend Information Inc. 1 V1.02 TTSS88GGSSSSDD2255--SSS TTSS1166GGSSSSDD2255--SS TTSS3322GGSSSSDD2255--MM 2.5” Solid State Disk Specifications Physical Specification Form Factor 2.5-inch HDD Storage Capacities 8 GB to 32 GB Length 100.0 0 ± 0.40 Dimensions (mm) Width 69.85 ± 0.20 Height 7.40 ± 0.15 Input Voltage 5V ± 5% Weight 80 g Connector 44-Pin standard IDE/ATA connector (Pitch 2.0 mm) Environmental Specifications Operating Temperature 0 ℃ to 70 ℃ Storage Temperature - 40 ℃ to 85 ℃ Power Requirements Input Voltage 5V ± 10% Mode TYP (mA) MAX (mA) TS32GSSD25-M Write 78.0 112.8 Power Consumption Read 57.7 78.2 (DC 5V @25℃) Standby 1.5 3.2 Mode TYP (mA) MAX (mA) TS16GSSD25-S Write 57.8 112.4 Power Consumption Read 55.8 104.7 (DC 5V @25℃) Standby 1.9 3.3 Mode TYP (mA) MAX (mA) TS8GSSD25-S Write 51.8 98.4 Power Consumption Read 47.3 91.2 (DC 5V @25℃) Standby 1.1 3.0 Transcend Information Inc. -
Micron: NAND Flash Architecture and Specification Trends
NAND Flash Architecture and Specification Trends Michael Abraham ([email protected]) Applications Engineering Manager Micron Technology, Inc. Santa Clara, CA USA August 2009 1 Abstract As NAND Flash continues to shrink, page sizes, block sizes, and ECC requirements are increasing while data retention, endurance, and performance are decreasing. These changes impact systems including random write performance and more. Learn how to prepare for these changes and counteract some of them through improved block management techniques and system design. This presentation also discusses some of the tradeoff myths – for example, the myth that you can directly trade ECC for endurance Santa Clara, CA USA August 2009 2 NAND Flash: Shrinking Faster Than Moore’s Law 200 100 Logic 80 DRAM on (nm) ii 60 NAND Resolut 40 Micron 32Gb NAND (34nm) 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 Semiconductor International, 1/1/2007 Santa Clara, CA USA August 2009 3 Memory Organization Trends Over time, NAND block size is increasing. • Larger page sizes increase sequential throughput. • More pages per block reduce die size. 4,194,304 1,048,576 262,144 65,536 16,384 4,096 1, 024 256 64 16 Block size (B) Data Bytes per Page Pages per Block Santa Clara, CA USA August 2009 4 Consumer-grade NAND Flash: Endurance and ECC Trends Process shrinks lead to less electrons ppgger floating gate. ECC used to improve data retention and endurance. To adjust for increasing RBERs, ECC is increasing exponentially to achieve equivalent UBERs. For consumer applications, endurance becomes less important as density increases. -
Onfi Overview
An Update Jim Cooke NAND Marketing Micron Technology, Inc. Thursday, August 6, 2009 Outline . ONFi Overview . ONFi Provides Speed Enhancements . The Path to Higher Performance Santa Clara, CA USA August 2009 2 Thursday, August 6, 2009 Why ONFi ? . NAND was the only commodity memory with no standard interface . The Open NAND Flash Interface (ONFi) Workgroup was formed in May 2006 to drive standardization for the raw NAND Flash interface . ONFi has been busy… Santa Clara, CA USA August 2009 3 Thursday, August 6, 2009 Why ONFi ? . NAND was the only commodity memory with no standard interface . The Open NAND Flash Interface (ONFi) Workgroup was formed in May 2006 to drive standardization for the raw NAND Flash interface . ONFi has been busy… ONFi 1.0 (Dec ’06) Defined a standard electrical and protocol interface for NAND, including the base command set. Santa Clara, CA USA August 2009 3 Thursday, August 6, 2009 Why ONFi ? . NAND was the only commodity memory with no standard interface . The Open NAND Flash Interface (ONFi) Workgroup was formed in May 2006 to drive standardization for the raw NAND Flash interface . ONFi has been busy… ONFi 1.0 (Dec ’06) (Jul ’07) DefinedBlock a standard Abstracted electrical and protocol NAND interface for NAND,1.0 includingDefined the a managed base command NAND set.solution that utilizes the raw NAND interface. Santa Clara, CA USA August 2009 3 Thursday, August 6, 2009 Why ONFi ? . NAND was the only commodity memory with no standard interface . The Open NAND Flash Interface (ONFi) Workgroup was formed in May 2006 to drive standardization for the raw NAND Flash interface . -
Onfi: Achieving Breakthrough NAND Performance
ONFi: Achieving Breakthrough NAND Performance Amber Huffman Principal Engineer Intel Corporation Agenda ONFi Workgroup Update – Mission and membership – ONFi 2.0 specification completed – NAND connector specification completed – JEDEC collaboration established High-speed NAND interface details Extending the high-speed interface 2 Agenda ONFi Workgroup Update – Mission and membership – ONFi 2.0 specification completed – NAND connector specification completed – JEDEC collaboration established High-speed NAND interface details Extending the high-speed Interface 3 Mission… Possible. NAND has been the only commodity memory with no standard interface – Command set, timings, and pin-out are similar among vendors NAND has been ripe for standardization due to a few inflection points: – 1) Explosion in use of NAND for MP3 players, phones, caches, and SSDs – 2) Increase in number of NAND vendors serving the market (2 to 6+) ONFi Workgroup was formed in May 2006 to address “gap” – ONFI = Open NAND Flash Interface ONFi revision 1.0 delivered in December 2006, defines: – Uniform NAND electrical and protocol interface • Raw NAND component interface for embedded use • Includes timings, electrical, protocol • Standardized base command set – Uniform mechanism for device to report its capabilities to the host ONFI 1.0 sets a solid foundation for NAND (r)evolution. 4 A-Data Afa Technologies Alcor Micro Aleph One Anobit Tech. Apacer Arasan Chip Systems ASMedia Technology ATI Avid Electronics BitMicro Biwin Technology Chipsbank Cypress DataFab Systems DataIO Datalight Denali Software Entorian FCI FormFactor Foxconn Fusion Media Tech Genesys Logic Hagiwara Sys-Com HiperSem Hitachi GST Hyperstone InCOMM Indilinx Inphi Intelliprop ITE Tech Jinvani Systech Kingston Technology Lauron Technologies Lotes LSI Macronix Marvell Mentor Graphics Metaram Members Moai Electronics Molex NVidia Orient Semiconductor P.A. -
FTSE Publications
2 FTSE Russell Publications 28 October 2020 FTSE Taiwan USD Net Tax Index Indicative Index Weight Data as at Closing on 27 October 2020 Constituent Index weight (%) Country Constituent Index weight (%) Country Constituent Index weight (%) Country Accton Technology 0.45 TAIWAN Formosa Petrochemical 0.44 TAIWAN SinoPac Financial Holdings Co. Ltd. 0.45 TAIWAN Acer 0.29 TAIWAN Formosa Plastics Corp 1.56 TAIWAN Synnex Technology International 0.23 TAIWAN Advantech 0.49 TAIWAN Formosa Taffeta 0.13 TAIWAN Taishin Financial Holdings 0.53 TAIWAN Airtac International Group 0.42 TAIWAN Foxconn Technology 0.23 TAIWAN Taiwan Business Bank 0.19 TAIWAN ASE Technology Holding 0.87 TAIWAN Fubon Financial Holdings 1.21 TAIWAN Taiwan Cement 0.82 TAIWAN Asia Cement 0.38 TAIWAN Genius Electronic Optical 0.2 TAIWAN Taiwan Cooperative Financial Holding 0.75 TAIWAN ASMedia Technology 0.24 TAIWAN Giant Manufacturing 0.31 TAIWAN Taiwan Fertilizer 0.15 TAIWAN Asustek Computer Inc 0.7 TAIWAN GlobalWafers 0.36 TAIWAN Taiwan Glass Industrial 0.08 TAIWAN AU Optronics 0.42 TAIWAN HIWIN Technologies Corp. 0.29 TAIWAN Taiwan High Speed Rail 0.26 TAIWAN Capital Securities 0.09 TAIWAN Hon Hai Precision Industry 3.82 TAIWAN Taiwan Mobile 0.64 TAIWAN Catcher Technology 0.54 TAIWAN Hotai Motor 0.81 TAIWAN Taiwan Secom 0.1 TAIWAN Cathay Financial Holding 1.28 TAIWAN HTC Corporation 0.08 TAIWAN Taiwan Semiconductor Manufacturing 42.94 TAIWAN Chailease Holding 0.73 TAIWAN Hua Nan Financial Holdings 0.67 TAIWAN TECO Electric & Machinery 0.21 TAIWAN Chang Hwa Commercial Bank 0.45 TAIWAN Innolux 0.34 TAIWAN TPK Holding Co Ltd 0.07 TAIWAN Cheng Shin Rubber Industry 0.27 TAIWAN Inventec Co.