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Server Architecture and Kingston Memory Solutions Ingram Micro Kingston Technology Server Architecture and Kingston Memory Solutions Ingram Micro May 2015 Mike Mohney Senior Technology Manager, TRG ©2015 Kingston Technology Corporation. All rights reserved. All trademarks and registered trademarks are the property of their respective owners. Kingston Server Upgrades • Introduction to Kingston • Kingston Solutions and Memory Roadmap • Memory Configurations for Intel server platforms 2 Kingston Snapshot • Founded in 1987, 27+ years • Privately Held Company • Financially Secure • For 8 years , revenue exceeding $4B • 4,000 Employees Worldwide • Worldwide Manufacturing & Testing • Focused Business: Memory Modules, Flash Products & Tech Solutions • Delivering over 1M units per day • Products distributed in 125 Countries and available in over 30,000 locations worldwide; widely accepted brand 3 Source: Kingston Technology Kingston Global Infrastructure • Manufacturing Centers are all ISO 9001:2008 certified • 2014 worldwide capacity: Over 30 million units per month • Over 50 SMT manufacturing lines in 4 global facilities, producing both DRAM & Flash products * * * * ** ** * 4 Kingston Technology Manufacturing Facilities Worldwide ** Panram and OSE are subcontractors to Kingston 4 Source: Kingston Technology, June 2014 Kingston Investments & Expertise Kingston manages all six processes required to build modules, cards, and drives. Wafer Production Wafer Testing Wafer Processing/Chip Production Component Testing Module, Card & Drive Production Module, Card & Drive Testing 5 Strategic Alliances: Server Compatibility Check Kingston works with many facets of technology to ensure server memory compatibility. Industry Leading OS, PC OEM’s Motherboard Manufacturers Software, Hardware 6 Intel and Kingston DDR3 DRAM chip validation testing on Checking early FB-DIMM prototype new Advantest tester (DDR4 capable) against specifications Since 1998, Intel and Kingston have jointly developed memory technology validation testing processes for PC133, RDRAM, DDR, DDR2, FB-DIMM, DDR3, LRDIMM, and DDR4. 7 Kingston Performance Upgrades • Introduction to Kingston • Kingston Solutions and Memory Roadmap • Memory Configurations for Intel server platforms 8 Reliability: The Challenges of Memory Testing Memory Capacity Number of Cells 1GB Over 8.5 billion cells 2GB Over 17 billion cells 4GB Over 34 billion cells 8GB Over 68 billion cells 16GB Over 136 billion cells Kingston Quality Standard: Zero bad cells 1 bad cell = defective module 9 Semiconductor Reliability This curve of semiconductor failures over time is called a ‘bathtub’ curve Early-Life Useful Life Of Semiconductor End-of-Life Failures Failures A typical useful life would be 20 years or more (in units)(in Failures Failures Field Of Failure curve for lower-quality semiconductor products Number Time Ship out from Typically the first few Factory to user months of usage 10 Kingston Production Testing and Dynamic Server Burn-In 100% Testing • No spot testing! Kingston memory is 100% tested prior to leaving our factories, as we have always done Dynamic Server Memory Burn-In • Shrinking DRAM lithography increases sensitivity to temperature, forcing higher error rates and exposing weak memory cells • Kingston’s advanced burn-in process screens these by simulating 3 months of heavy server use at higher temperatures under full system environment and frequency stress Proprietary Production Testers • Kingston’s test engineers designed the first automated production testers in the memory industry • New patented automated testers build upon our test engineering legacy to meet the more stringent demands of evolving memory technology 35 Quality Control Checkpoints • Kingston uses AQL sampling methods to re-inspect and re-test every lot to ensure our quality standards are being met Kingston holds 29 patents related to memory testing 11 Memory Roadmap (1987 – 2017) DDR4-2400 2007- 2010- 2015 2016 2017 2004- 2014 2001- 2006 2009 2013 1997- 2005 1987- 2000 2003 1999 1990 DDR4-2666 DDR4-2933 DDR3L 1.35V DDR200 DDR2-800 DDR4-2133 PC66 DDR3-1600 FAST DDR266 FB-DIMMs DDR3L-1600 PAGE PC100 RDRAM DDR333 DDR2-400 DDR3-800 DDR3-1866 MODE PC133 PC600 DDR400 DDR2-533 DDR3-1066 LRDIMM EDO PC700 RDRAM DDR2-667 DDR3-1333 PC800 PC1066 Technology Data Rate Module Classification Peak Bandwidth 800 DDR3-800 / PC3-6400 6400 MB/s or 6.4 GB/s DDR3-1066 / PC3-8500 1066 8500 MB/s or 8.5 GB/s DDR3L-1066 / PC3L-8500 DDR3 (1.5V) DDR3-1333 / PC3-10600 1333 10600 MB/s or 10.6 GB/s DDR3L (1.35V) DDR3L-1333 / PC3L-10600 DDR3U (1.25V) DDR3-1600 / PC3-12800 1600 12800 MB/s or 12.8 GB/s DDR3L-1600 / PC3L-12800 1866 DDR3-1866 / PC3-14900 14900 MB/s or 14.9 GB/s 2133 DDR4-2133 / PC4-2133 17000 MB/s or 17 GB/s 2400 DDR4-2400 / PC4-2400 19200 MB/s or 19.2 GB/s DDR4 (1.2V) 2666 DDR4-2666 / PC4-2666 21300 MB/s or 21.3 GB/s 2933 DDR4-2933 / PC4-2933 23400 MB/s or 23.4 GB/s 1 2 New Module Key Location Form Factors 288-pin DIMM 260-pin SODIMM Performance 1600MT/s, 1866MT/s, 2133MT/s, 2400MT/s, 2666MT/s, 2933MT/s 4000MT/s (possible extension) 4266MT/s (possible extension) Power 1.2V with improved refreshes, ½K page for x4 12V for NVDIMM (4-pins) DRAM Densities/DIMM Capacities Slightly thicker for 4Gb, 8Gb, 16Gb (x4, x8, x16) improved performance Future DIMM capacities of 64GB, 128GB, 256GB New Features 3D chip stacking support (up to 8 stacked dies) Point-to-Point Memory Channel addressing More stable than DDR3 with improved error correction code Curved edge for better socket connection 13 “Low Voltage” (LV) DDR3L = Low Voltage 1.35V JEDEC (industry spec) • Modules are classified as PC3L-xxx Reducing memory power consumption 10% by dropping module voltage requirement, lowering energy costs to data centers DDR3U (1.25V) Kingston DDR3L modules are dual-voltage supporting 1.35V / 1.5V Ultra Low Voltage Supported on current and legacy server platforms • Intel SNB/IVB/HSW (Xeon E3+ Series) JEDEC Spec for Mobile, Server • Intel WSM-EP/SNB-EP/IVB-EP/HSW-EP (Xeon 5600/E5 v1/v2 Series) • Intel WSM-EX/IVB-EX (Xeon E7/v2 Series) Low Voltage spec • AMD Magny-Cours+ (Opteron 6100/6200/6300 Series) for DDR4 deemed • AMD Lisbon+ (Opteron 4100/4200/4300 Series) not possible by Supported on mobile/desktop platforms from Intel and AMD DRAM semiconductors • Skylake (DDR3L Only), Broadwell, Haswell, & Ivybridge (Core i5 / Core i7) • AMD A-Series 14 Load-Reduced DIMMs for Servers JEDEC Industry Standard Specification LRDIMMs overcome the impact of Ranks (Loads) upon memory speed • Parallel memory bus impacted by memory module Ranks • Enable greater memory capacity and speeds while reducing “load” • Require special buffer chips Eight-Rank modules now possible with less loading on memory bus • Will enable faster 32GB, 64GB, 128GB LRDIMMs Supported on 2012+ Intel and AMD servers Included in DDR4 spec with new, more efficient design – Q1 2015 Kingston launched Q1 2013 DDR3 LRDIMMs KVR13LL9Q4/32 KVR16LL11Q4/32 KVR18L13Q4/32 DDR4 LRDIMMs KVR21L15Q4/32 KVR21L15Q4/64 Coming soon 15 Source: Intel IDF, September 2011 Load-Reduced DIMMs for DDR4 – New Design, Reduced Latency 16 Source IDT: www.idt.com/document/whp/ddr4-lrdimms-both-memory-capacity-and-speed Non-Volatile DIMM (NVDIMM) What Is It? A non-volatile memory module directly accessed by the memory controller (approximately 10x faster than PCIe interface). Silicon based memory technology is reaching its perfomance and efficiently limit. Types of NVDIMM standards NVDIMM-F – An all FLASH memory module accessible by the memory controller. NVDIMM-N – A DRAM memory module made persistent by the use of NAND flash silicon. NVDIMM-N2 – Similar to NVDIMM-N but with system accessible Flash. NVDIMM-M – MRAM based memory module accessible by the memory controller. NVDIMM-x – New technology. PRAM? RRAM? HMC? Viking ArxCis-NV DDR3 NVDIMM Diablo/SanDisk ULLtra DIMM SK Hynix 16GB DDR4 NVDIMM 17 Source: Google Images Kingston Memory Product Lines ValueRAM System Specific o o Generic / JEDEC Specification Also known as “Branded” o Guaranteed compatibility o Ideal for system builders or small o Ideal for users who want to upgrade datacenters OEM machines OEM / Private Label HyperX o Customized in box solutions o Enthusiast gaming market o Contracted supply agreements o Overclocking o Brand focused 18 System Specific Memory Guaranteed Compatible • Testing conducted in the system in which the memory will be installed Importance of Branded Memory • Different chips provide varying performance levels • Chip Compatibility can vary • Possible constraints in module height or width • Presence Detect Configuration 19 ValueRAM Product Decoder • Kingston ValueRAM is built to industry standard specifications outlined by J.E.D.E.C., the Joint Electron Device Engineering Council, on which Kingston holds a seat. Intel, AMD, and other computing chipset architects adhere to these standards for industry agreement and cross-platform compatibility. • J.E.D.E.C. provides the specifications for Pin Count, Form Factor, Speed, Power, and Memory Technology Types 20 ValueRAM Server Focused Programs Intel Certified intended specifically for customers who are using Intel branded server/workstation motherboards or systems • Qualified and supported by Intel • Controlled builds (BOMs) • PCNs with 45-90 Day Notice Server Premier intended for server builders with fully controlled BOM requirements (PCB, chip brand/die revision, etc) regardless of brand of motherboard used • Fully BOM controlled • PCNs with 45-90 Day Notice • Easily manage what is ordered • No price premium 21 ValueRAM Qualifications In addition to the strategic partnerships
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