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IBM System P Update

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IBM System P Update IBM Power Systems IBM System P Update Piyush Chaudhary [email protected] © 2008 IBM Corporation IBM Power Systems IBM supercomputing leadership June 2007 TOP100 IBM is clear leader with 46% Linux Semiannual independent Networx, 4 Other, 11 IBM, 45 ranking of top 500 Apple, 2 supercomputers in the world SGI, 9 June 2007 Aggregate Performance IBM: 2,060 of 4,946 TF (41.9%) Cray, 9 NEC Linux HP, 7 2.1% Networx Other Dell, 13 Dell 2.1% 7.2% 8.8% IBM leads several key TOP500 metrics ... Sun IBM #1 System – DOE/LLNL – Blue Gene/L (280.6 TF) 0.9% 41.7% Most installed aggregate throughput with over Cray 2,060 Teraflops (41.7%) 7.3% Most in TOP10 with 6 systems (40%) HP Most in TOP100 systems with 45 (45%) SGI 5.7% 24.2% Fastest machines in USA (BG/L) Fastest machine in Europe (MareNostrum) Fastest machine in China (Sinopec) Source: www.top500.org 2 © 2008 IBM Corporation IBM Power Systems InfiniBand POWER 3 © 2008 IBM Corporation IBM Power Systems POWER6 System Highlights POWER6 Processor Technology 5th Implementation of multi-core design ~100% higher frequencies 4X increase in L2 Cache POWER6 System Architecture New generation of servers Blades to High End offerings New IO PCIe, SAS / SATA, New IO Drawers Enhanced power management Enhanced Virtualization Partition Mobility Workload Partitions Availability Micro-Partition New RAS features Shared Processor Pool Dedicated Processor Instruction Retry Processor Workload Mobility LPAR LPAR LPAR LPAR LPAR Power Management VIOS #1 #2 #3 # 4 Power Save option VNET VSCSI Power Hypervisor Boot HMC 4 © 2008 IBM Corporation IBM Power Systems Power Everywhere Power Technology 5 © 2008 IBM Corporation IBM Power Systems POWER Processor Roadmap 2001-4 2004-6 2007 Future POWER4 / 4+ POWER5 / 5+ POWER6 POWER7 65 nm Advanced Multi 90 nm ≥3.5GHz ≥3.5GHz Core Design 130 nm Core Core 180 nm 130 nm AltiVec AltiVec Cache 1.9GHz 1.9GHz Advanced 1.65+ Core1.5+ Core Cache Cache System Features 1.5+ GHz 1.5+ GHz GHz GHz Advanced Core Core Core Core System Features Modular & Enterprise 1+ GHz 1+ GHz Shared L2 Balanced system design Core Core SharedDistributed L2 Switch Advanced Architecture Shared L2 Leadership RAS Distributed Switch Distributed Switch Shared L2 High Frequencies 3.5-4.7GHz Enhanced Scaling Enhanced Virtualization Distributed Switch Simultaneous Multi-Threading (SMT) Advanced Memory Subsystem Enhanced Distributed Switch Altivec Chip Multi Processing Enhanced Core Parallelism Instruction Retry - Distributed Switch Improved FP Performance Dynamic Energy Management - Shared L2 Increased memory bandwidth Improved SMT Dynamic LPARs (32) Reduced memory latencies Virtualization BINARY COMPATIBILITY 6 © 2008 IBM Corporation IBM Power Systems POWER6 Architecture POWER Design 3.5/4.2/4.7 GHz 790M transistors .065 micron POWER6 Characteristics Alti P6 P6 Alti Ultra-high frequency dual-core chip: ≥ 3.5 GHz Vec Core Core Vec 7-way superscalar, 2-way SMT core Up to 5 instr. for one thread, up to 2 for other 9 execution units L3 4 MB 4 MB L3 2LS, 2FP, 2FX, 1BXU, 1VMX, 1DP L3 Ctrl L2 L2 Ctrl L3 790M transistors, 341 mm 2 die Up to 64-core SMP systems 2x4MB on-chip L2 – point of coherency Chip Chip On-chip L3 directory and controller to Chip Fabric Bus to Chip Two memory controllers on-chip Controller Technology Cntrl Cntrl Memory CMOS 65nm lithography, SOI Cu GX++ Bus Cntrl Memory High-speed elastic bus interface at 2:1 freq Full error checking and recovery GX++ Dynamic power saving Bridge Advanced Clock gating Memory+ Memory+ 7 © 2008 IBM Corporation IBM Power Systems POWER Architecture POWER4 POWER5 POWER6 Alti P6 P6 Alti POWER4 POWER4 POWER5 POWER5 Core Core Core Core Vec Core Core Vec L3 L2 L3 Ctl L2 L3 4 MB 4 MB L3 Ctrl L2 L2 Distributed Enhanced Switch Distributed Switch L3 Mem Fabric Bus Cntrl Ctl Controller L3 Memory GX Bus Cntrl GX GX Cntrl Bus Mem Ctl Bus Memory GX+ Bridge Memory Memory+ 8 © 2008 IBM Corporation IBM Power Systems Chip Breakthroughs 9 © 2008 IBM Corporation IBM Power Systems Servers Servers 10 © 2008 IBM Corporation IBM Power Systems Scale up. Scale out. Scale within. 2.1 / 2.3 GHz 3.5- 4.7GHz IBM Power Architecture™: p5 590/595 POWER5 1.65 to 2.3 GHz POWER6 3.5 – 4.7 GHz p575 p570 1.9-2.2 GHz 1.9 GHz p5 570 p5 560Q p5 550 & 550Q p5 520 & 520Q p5 510 & 510Q 1.8 GHz IBM IBM IntelliStation p5 505 & BladeCenter POWER 505Q JS21 / JS22 185 and 285 1.65 GHz *Source: http://www.ibm.com/systems/p/benchmarks/ 11 © 2008 IBM Corporation IBM Power Systems POWER6 p575 Node Compute Node New 32 Core node Architecture 1 – 14 Nodes / rack ( 448 Cores ) 4.7 GHz Cache L3: 32MB / Chip DDR2 Memory 4 to 256 GB ( Buffered ) DASD / Bays 2 SAS DASD ( 2.5”) Expansion PCIe / PCI-X Support IVE Yes Integrated SAS Yes Expansion Slots Dual GX Bus Adapters Integrated Two Dual 10/100/1000 Ethernet Ethernet Optional Dual 10Gb N+1 Support POWER 1 - 4 Nodes 2 Line Cords AIX 5.3 5+ Nodes 4 Line Cords Linux Cooling Combination Water / Air Remote IO Yes Quantity: 1 Drawers PCI-X ( 20 Slots ) 12 © 2008 IBM Corporation IBM Power Systems POWER6 575 Water Cooled Node Photo of p575 Mechanical Model 13 © 2008 IBM Corporation IBM Power Systems POWER6 p575 Top View Dual 2 port 4x Host Channel Adapter (Displaces Lower PCI Slot) Processor Unit I/O Section PCI Riser (2 x PCIe or 1x PCIe, 1x PCI-X DDR2) 32 x DIMM 32 x DIMM I/O Unit 16x DCM Air Moving Device (Lite or FF) (p6 + L3) (Fans) PCI Riser (2 x PCIe or 1x PCIe, 1x PCI-X DDR2) Cold Plate Dual 2 port 4x Host Channel Adapter (Displaces Lower PCI Slot) 14 © 2008 IBM Corporation IBM Power Systems POWER6 p575 Rear view… SAS DASD Dual Drives: 73 or 146 GB IO Interconnect 12X Ethernet Support (IVE) Single IO Drawer Two Dual 10/100/1000 I/O Optional Dual 10Gb PCIe 0 / 2 / 4 slots PCI-X 0 / 2 slots Expansion slots Two GX++ slots 15 © 2008 IBM Corporation IBM Power Systems Water Cooling…. Redundant Modular Water Unit Redundant Modular Water Unit With Non-Redundant Facilities Water ( MWU ) With Redundant Facilities Water (MWU) MWU MWU MWU MWU Facility Facility Water Water 16 © 2008 IBM Corporation IBM Power Systems MWU (Modular Water Unit) Control Valve Heat Exchanger Pump Reservoir 4U Tall by Half of a 24” Rack Unit Contains Control Valve, Heat Exchanger, Pump, Reservoir, Sensors, Motor Drive & Interface/Control Card 17 © 2008 IBM Corporation IBM Power Systems Blades Blades 18 © 2008 IBM Corporation IBM Power Systems Blade Architecture & OS Flexibility All blades refreshed in 2007 AIX V5.3 HS2X Blades HS4X Blade Introduced 2003 Introduced 2002 JS2X Blade 2-socket 4-socket Introduced 2004 APV Intel Xeon DP Intel Xeon MP 2-socket Up to 7 IBM PowerPC / P6 Up to 14 Per Chassis Up to 14 Per Chassis Per Chassis LS2X Blade Introduced 2005 QS21 Blade 2-socket Introduced 2007 AMD Opteron 18 cores Up to 14 per blade Per Chassis Up to 14 Per Chassis LS4X Blade Introduced 2006 4-socket AMD Opteron Up to 7 Per Chassis 19 © 2008 IBM Corporation IBM Power Systems POWER6 JS22 Blade JS22 Blade New Architecture 4 core / 2 Socket @ 4.0 GHz L3 Cache N / A DDR2 Memory 2GB to 32GB ( ChipKill ) DASD / Bays 0 – 1 SAS disk ( 73 / 146 GB ) Daughter Card Options PCI-X and/or PCIe Dual Port 10/100/1000 Ethernet Integrated Options SAS Controller & USB Fiber Support Yes ( via Blade Center ) Media Bays 1 Blade Center Redundant Power Yes BladeCenter Redundant Cooling Yes BladeCenter Service Processor Yes IBM Director and CSM Systems Management IBM EnergyScale™ OS Support AIX 5.3 , 6.1, Linux and i5/OS AIX V5.3 BC Chassis BC-H and BC-S (SoD ) Linux NEBS Support Yes 20 © 2008 IBM Corporation IBM Power Systems JS22 Blade 21 © 2008 IBM Corporation IBM Power Systems JS22 Expansion Cards CFFv (Vertical) expansion cards: QLogic 4 GB 2 Port Fibre Channel Expansion Card (CFFv) Ethernet Expansion Card (CFFv) SAS Expansion Card (CFFv) Emulex 4 GB Fibre Channel Expansion Card (CFFv) CFFh (Horizontal) expansion cards: QLogic Ethernet and 4 GB Fibre Channel Expansion Card (CFFh) 4X InfiniBand DDR Expansion Card (CFFh) Cisco 4X InfiniBand DDR Expansion Card (CFFh) Voltaire 4X InfiniBand DDR Expansion Card (CFFh) One combination form factor vertical (CFFv) may be installed with a combination form factor horizontal (CFFh) expansion card and one SAS HDD. 22 © 2008 IBM Corporation IBM Power Systems JS22 Operating Systems One or more of the following operating systems is required: AIX V5.3 Technology Level 5300-06 with Service Pack 4, or later AIX V5.3 Technology Level 5300-07, or later AIX V6.1 Technology Level 6100-00, or later Novell SUSE Linux Enterprise Server 10 for POWER SP1 Update 1, or later Red Hat Enterprise Linux for POWER, V4.6, or later Red Hat Enterprise Linux for POWER, V5.1, or later iSCSI boot is available through an iSCSI software initiator running on the embedded Ethernet controller or the iSCSI expansion card (#8238). AIX operating system supports iSCSI boot through an iSCSI software initiator on any supported Ethernet controller including Ethernet expansion cards 23 © 2008 IBM Corporation IBM Power Systems IBM BladeCenter JS22 vs JS21 JS21 JS22 2.5GHz POWER PC970 4.0 GHz POWER6 SCM Architecture 4 core (2 Socket x 2 Core) 4 core (2 Socket x 2 Core) Single Wide Single Wide Memory 1GB to 16GB DDR2 (Chip Kill) 533MHZ 2GB to 32GB DDR2 (Chip Kill) 667MHz DASD / Bays 0-2 SAS disk (73 or 146 GB) 0-1 SAS disk (73 or 146 GB) Daughter Cards Legacy, SFF, or High speed DC PCI-X and/or PCIe Dual Port 1Gb Ethernet Keyboard, Video and Mouse Integrated Features SAS Controller Dual Port 1Gb Ethernet USB SAS Controller & USB Fiber Support Yes (via BladeCenter) Yes (via BladeCenter) Redundant Power Yes (via BladeCenter) Yes (via BladeCenter) Redundant Cooling Yes (via BladeCenter) Yes (via BladeCenter) AIX 5L V5.3 & Linux AIX 5L V5.3, AIX 6 & Linux Virtualization Advanced Power Virtualization (Standard) Advanced Power Virtualization (Standard) Integrated Virtualization Manager Integrated Virtualization Manager IBM Director and CSM Systems Management IBM Director and CSM IBM EnergyScale Technology Mobility Support No Yes OS Support AIX 5.3, AIX 6 and Linux AIX 5.3, AIX 6 and Linux JS22 Advantages POWER6 @ 4GHZ 2X Memory Capacity @ 667MHz KVM Support IBM EnergyScale 24 © 2008 IBM Corporation.
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