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IBM System P5 570 Technical Overview and Introduction

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IBM System P5 570 Technical Overview and Introduction Front cover IBM System p5 570 Technical Overview and Introduction Finer system granulation using Micro-Partitioning technology to help lower TCO Modular midrange solution for managing On Demand Business New POWER5+ processor options using DDR2 memory technology Giuliano Anselmi Gregor Linzmeier Wolfgang Seiwald Philippe Vandamme Scott Vetter ibm.com/redbooks Redpaper International Technical Support Organization IBM System p5 570 Technical Overview and Introduction September 2006 Note: Before using this information and the product it supports, read the information in “Notices” on page vii. Second Edition (September 2006) This edition applies to the IBM System p5 570 (9117-570) and AIX 5L™ Version 5.3, product number 5765-G03. © Copyright International Business Machines Corporation 2004, 2006. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Notices . vii Trademarks . viii Preface . ix The team that wrote this Redpaper . ix Become a published author . .x Comments welcome. .x Chapter 1. General description . 1 1.1 System specifications . 3 1.2 Physical package . 3 1.3 Minimum and optional features . 4 1.3.1 Processor card features . 5 1.3.2 Memory features . 6 1.3.3 Disk and media features . 6 1.3.4 USB diskette drive . 7 1.3.5 I/O drawers . 7 1.3.6 Hardware Management Console models . 10 1.4 System racks. 11 1.4.1 IBM 7014 Model T00 rack. 11 1.4.2 IBM 7014 Model T42 rack. 12 1.4.3 The ac power distribution unit and rack content . 12 1.4.4 Rack-mounting rules for p5-570 . 14 1.4.5 Useful rack additions. 14 1.4.6 OEM rack . 16 1.5 Statement of Direction. 18 Chapter 2. Architecture and technical overview . 19 2.1 The POWER5+ processor. 20 2.2 Processor cards . 21 2.2.1 Processor drawer interconnect cables . 22 2.2.2 Processor clock rate . 23 2.3 Memory subsystem . 24 2.3.1 Memory placement rules. 24 2.3.2 OEM memory . 24 2.3.3 Memory throughput. 25 2.4 System buses . 26 2.4.1 RIO-2 buses and GX+ card. 26 2.4.2 SP bus . 26 2.5 Internal I/O subsystem . 26 2.6 64-bit and 32-bit adapters . 27 2.6.1 LAN adapters . 27 2.6.2 Graphic accelerators. 28 2.6.3 SCSI adapters. 28 2.6.4 Integrated RAID options . 28 2.6.5 iSCSI. 29 2.6.6 Fibre Channel adapters . 31 2.6.7 InfiniBand Host Channel adapters . 31 2.6.8 Asynchronous PCI-X adapters . 32 © Copyright IBM Corp. 2004, 2006. All rights reserved. iii 2.6.9 Additional support for owned PCI-X adapters. 32 2.6.10 System ports . 32 2.6.11 Ethernet ports . 32 2.7 Internal storage . 33 2.7.1 Internal hot swappable SCSI disks . 33 2.7.2 Internal media devices . 34 2.8 External I/O subsystems . 34 2.8.1 I/O drawers . 34 2.8.2 7311 Model D11 I/O drawers . 35 2.8.3 7311 Model D20 I/O drawer . 35 2.8.4 7311 I/O drawer and RIO-2 cabling . 37 2.8.5 7311 I/O drawer and SPCN cabling . 38 2.9 External disk subsystems . 38 2.9.1 IBM TotalStorage EXP24 Expandable Storage . 38 2.9.2 IBM System Storage N3000 and N5000. 39 2.9.3 IBM TotalStorage Storage DS4000 Series . 39 2.9.4 IBM TotalStorage Enterprise Storage Server . 39 2.10 Logical partitioning . 40 2.10.1 Dynamic logical partitioning . 40 2.11 Virtualization . 40 2.11.1 POWER Hypervisor . 41 2.12 Advanced POWER Virtualization feature . 43 2.12.1 Micro-Partitioning technology . ..
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