Thickness-Dependent DC Electrical Breakdown of Polyimide Modulated by Charge Transport and Molecular Displacement
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Plasma Enhanced Chemical Vapor Deposition of Organic Polymers
processes Review Plasma Enhanced Chemical Vapor Deposition of Organic Polymers Gerhard Franz Department of Applied Sciences and Mechatronics, Munich University of Applied Sciences (MUAS), 34 Lothstrasse, Munich, D-80335 Bavaria, Germany; [email protected] Abstract: Chemical Vapor Deposition (CVD) with its plasma-enhanced variation (PECVD) is a mighty instrument in the toolbox of surface refinement to cover it with a layer with very even thickness. Remarkable the lateral and vertical conformity which is second to none. Originating from the evaporation of elements, this was soon applied to deposit compound layers by simultaneous evaporation of two or three elemental sources and today, CVD is rather applied for vaporous reactants, whereas the evaporation of solid sources has almost completely shifted to epitaxial processes with even lower deposition rates but growth which is adapted to the crystalline substrate. CVD means first breaking of chemical bonds which is followed by an atomic reorientation. As result, a new compound has been generated. Breaking of bonds requires energy, i.e., heat. Therefore, it was a giant step forward to use plasmas for this rate-limiting step. In most cases, the maximum temperature could be significantly reduced, and eventually, also organic compounds moved into the preparative focus. Even molecules with saturated bonds (CH4) were subjected to plasmas—and the result was diamond! In this article, some of these strategies are portrayed. One issue is the variety of reaction paths which can happen in a low-pressure plasma. It can act as a source for deposition and etching which turn out to be two sides of the same medal. -
Review of Technologies and Materials Used in High-Voltage Film Capacitors
polymers Review Review of Technologies and Materials Used in High-Voltage Film Capacitors Olatoundji Georges Gnonhoue 1,*, Amanda Velazquez-Salazar 1 , Éric David 1 and Ioana Preda 2 1 Department of Mechanical Engineering, École de technologie supérieure, Montreal, QC H3C 1K3, Canada; [email protected] (A.V.-S.); [email protected] (É.D.) 2 Energy Institute—HEIA Fribourg, University of Applied Sciences of Western Switzerland, 3960 Sierre, Switzerland; [email protected] * Correspondence: [email protected] Abstract: High-voltage capacitors are key components for circuit breakers and monitoring and protection devices, and are important elements used to improve the efficiency and reliability of the grid. Different technologies are used in high-voltage capacitor manufacturing process, and at all stages of this process polymeric films must be used, along with an encapsulating material, which can be either liquid, solid or gaseous. These materials play major roles in the lifespan and reliability of components. In this paper, we present a review of the different technologies used to manufacture high-voltage capacitors, as well as the different materials used in fabricating high-voltage film capacitors, with a view to establishing a bibliographic database that will allow a comparison of the different technologies Keywords: high-voltage capacitors; resin; dielectric film Citation: Gnonhoue, O.G.; Velazquez-Salazar, A.; David, É.; Preda, I. Review of Technologies and 1. Introduction Materials Used in High-Voltage Film High-voltage films capacitors are important components for networks and various Capacitors. Polymers 2021, 13, 766. electrical devices. They are used to transport and distribute high-voltage electrical energy https://doi.org/10.3390/ either for voltage distribution, coupling or capacitive voltage dividers; in electrical sub- polym13050766 stations, circuit breakers, monitoring and protection devices; as well as to improve grid efficiency and reliability. -
Biocompatibility of Polyimides: a Mini-Review
materials Review Biocompatibility of Polyimides: A Mini-Review Catalin P. Constantin 1 , Magdalena Aflori 1 , Radu F. Damian 2 and Radu D. Rusu 1,* 1 “Petru Poni” Institute of Macromolecular Chemistry, Romanian Academy, Aleea Grigore Ghica Voda 41A, Iasi-700487, Romania; [email protected] (C.P.C.); mafl[email protected] (M.A.) 2 SC Intelectro Iasi SRL, Str. Iancu Bacalu, nr.3, Iasi-700029, Romania; [email protected] * Correspondence: [email protected]; Tel.: +40-232-217454 Received: 14 August 2019; Accepted: 25 September 2019; Published: 27 September 2019 Abstract: Polyimides (PIs) represent a benchmark for high-performance polymers on the basis of a remarkable collection of valuable traits and accessible production pathways and therefore have incited serious attention from the ever-demanding medical field. Their characteristics make them suitable for service in hostile environments and purification or sterilization by robust methods, as requested by most biomedical applications. Even if PIs are generally regarded as “biocompatible”, proper analysis and understanding of their biocompatibility and safe use in biological systems deeply needed. This mini-review is designed to encompass some of the most robust available research on the biocompatibility of various commercial or noncommercial PIs and to comprehend their potential in the biomedical area. Therefore, it considers (i) the newest concepts in the field, (ii) the chemical, (iii) physical, or (iv) manufacturing elements of PIs that could affect the subsequent biocompatibility, and, last but not least, (v) in vitro and in vivo biocompatibility assessment and (vi) reachable clinical trials involving defined polyimide structures. The main conclusion is that various PIs have the capacity to accommodate in vivo conditions in which they are able to function for a long time and can be judiciously certified as biocompatible. -
An Introduction to Peek Extrusions
No. 3, APRIL 2017 RESINATE Your quarterly newsletter to keep you informed about trusted products, smart solutions, and valuable updates. POWERING MOTOR PERFORMANCE: AN INTRODUCTION TO PEEK EXTRUSIONS KEVIN J. BIGHAM, Ph.D. © 2017 POWERING MOTOR PERFORMANCE: AN INTRODUCTION TO PEEK EXTRUSIONS 1 ABSTRACT PEEK is a polymer that is a highly versatile and thus popular thermoplastic. As a polarizable dielectric, PEEK has also become popular for its insulating characteristics and is increasingly being explored towards these applications. We at Zeus examined these aspects of PEEK and its potential for applications involving electric motors. We compared motor performance of a readily obtainable 0.75 horsepower, 4-pole, 460 volt, AC induction motor with same motor rebuilt with Zeus PEEK insulated magnet wire and other PEEK insulating products. We found that the motor rebuilt with Zeus PEEK insulated wire performed equal to or better than the OEM motor in nearly every general performance attribute that was tested. INTRODUCTION TO PEEK POLYMER Polyether ether ketone, or PEEK, is a highly popular thermoplastic polymer. A This organic compound is part of the family of PAEK (polyaryl ether ketone) polymers which includes other familiar names such as PEK (polyether ketone), and PEKK (polyether ketone ketone). B PEEK, like many PAEK family members, is a semi-crystalline polymer at room temperature and is composed of ether and ketone linkages on either side of single aryl moieties (Fig. 1). As a thermoplastic, C PEEK does not decompose at its melt temperature making it very amenable to melt processing where it can be made into Figure 1: Polyether ether ketone polymer, or a highly diverse collection of other forms. -
Chapter 5 Capacitance and Dielectrics
Chapter 5 Capacitance and Dielectrics 5.1 Introduction...........................................................................................................5-3 5.2 Calculation of Capacitance ...................................................................................5-4 Example 5.1: Parallel-Plate Capacitor ....................................................................5-4 Interactive Simulation 5.1: Parallel-Plate Capacitor ...........................................5-6 Example 5.2: Cylindrical Capacitor........................................................................5-6 Example 5.3: Spherical Capacitor...........................................................................5-8 5.3 Capacitors in Electric Circuits ..............................................................................5-9 5.3.1 Parallel Connection......................................................................................5-10 5.3.2 Series Connection ........................................................................................5-11 Example 5.4: Equivalent Capacitance ..................................................................5-12 5.4 Storing Energy in a Capacitor.............................................................................5-13 5.4.1 Energy Density of the Electric Field............................................................5-14 Interactive Simulation 5.2: Charge Placed between Capacitor Plates..............5-14 Example 5.5: Electric Energy Density of Dry Air................................................5-15 -
Introduction] [Tuning-Capacitors] [Coupling Methods] [My First STL] [My Second STL] [Motor Drive for Capacitor] [References]
This page provides a top-level description of Small Transmitting Loop (STL) antennas (a.k.a. "Magnetic Loop Antenna", MLA), and my two versions of such an antenna for 80 mtrs and up. My smaller 40-20 loop is described here. My helically wound "Slinky" loop is described here. [Introduction] [Tuning-capacitors] [Coupling methods] [My first STL] [My second STL] [Motor drive for capacitor] [References] INTRODUCTION I wanted a small transmitting loop (STL) antenna that covers at least the 80 and 40 meter bands (preferable 80 - 20). Why? I want to do 80 mtrs DX, but I have no room for a decent 80 m wire-antenna, nor would I be able to install such an antenna high enough above ground. I have had some success with short, loaded vertical antennas with a single elevated radial, see here and here. But I cannot install those permanently at my QTH. Below 10 MHz, our apartment building generates a large amount of "electro-smog" QRM. An STL tends to be less sensitive to picking up electrical noise in the near-field (< 1 λ), which appears to be the reason why this type of antenna is also referred to as a "magnetic loop antenna". STLs have a radiation pattern with directivity. They are also small enough to rotate with a small motor, or TV-antenna rotor. They are less conspicuous (to my friends of the home-owners association "police") than a wire antenna that is strung along the outside of the building. I don't want to have to mess with radials, counterpoises, RF-grounds, etc. -
Chapter 1 POLYIMIDES
Chapter 1 POLYIMIDES: chemistry & structure-property relationships – literature review 1.1 Introduction Polyimides are a class of thermally stable polymers that are often based on stiff aromatic backbones. The chemistry of polyimides is in itself a vast area with a large variety of monomers available and several methodologies available for synthesis. However, there has been considerable debate on the various reaction mechanisms involved in different synthesis methods. This review however, covers only the important fundamentals regarding the polyimide synthesis. The focus in this review will rest only on ‘aromatic’ polyimides as they constitute the major category of such materials. Secondly, the properties of polyimides can be dramatically altered by minor variations in the structure. The subtle variations in the structures of the dianhydride and diamine components have a tremendous effect on the properties of the final polyimide. This chapter reviews several such features that are important towards understanding these structure-property relationships. Specifically, the effects of changing the diamines, dianhydrides or the overall flexibility of the chain on the basic parameters like Tg and Tm are also examined. 1.2 Two step method for polyimide synthesis The most widely practiced procedure in polyimide synthesis is the two-step poly(amic acid) process. It involves reacting a dianhydride and a diamine at ambient conditions in a dipolar aprotic solvent such as N,N-dimethylacetamide (DMAc) or N- methylpyrrolidinone (NMP) to yield the corresponding poly(amic acid), which is then CHAPTER 1 3 cyclized into the final polyimide. This process involving a soluble polymer precursor was pioneered by workers at Dupont1 in 1950’s, and to this day, continues to be the primary route by which most polyimides are made. -
Preparation and Characterization of Polystyrene Hybrid Composites Reinforced with 2D and 3D Inorganic Fillers
micro Article Preparation and Characterization of Polystyrene Hybrid Composites Reinforced with 2D and 3D Inorganic Fillers Athanasios Ladavos 1,* , Aris E. Giannakas 2 , Panagiotis Xidas 3, Dimitrios J. Giliopoulos 3 , Maria Baikousi 4 , Dimitrios Gournis 4 , Michael A. Karakassides 4 and Konstantinos S. Triantafyllidis 3 1 Laboratory of Food Technology, Department of Business Administration of Food and Agricultural Enterprises, University of Patras, 30100 Agrinio, Greece 2 Department of Food Science and Technology, University of Patras, 30100 Agrinio, Greece; [email protected] 3 Department of Chemistry, Aristotle University of Thessaloniki, 54124 Thessaloniki, Greece; [email protected] (P.X.); [email protected] (D.J.G.); [email protected] (K.S.T.) 4 Department of Materials Science & Engineering, University of Ioannina, 45110 Ioannina, Greece; [email protected] (M.B.); [email protected] (D.G.); [email protected] (M.A.K.) * Correspondence: [email protected] Abstract: Polystyrene (PS)/silicate composites were prepared with the addition of two organoclays (orgMMT and orgZenith) and two mesoporous silicas (SBA-15 and MCF) via (i) solution casting and (ii) melt compounding methods. X-ray diffraction (XRD) analysis evidenced an intercalated structure for PS/organoclay nanocomposites. Thermogravimetric analysis indicated improvement in the thermal stability of PS-nanocomposites compared to the pristine polymer. This enhancement was more prevalent for the nanocomposites prepared with a lab-made organoclay (orgZenith). Citation: Ladavos, A.; Giannakas, Tensile measurement results indicated that elastic modulus increment was more prevalent (up to A.E.; Xidas, P.; Giliopoulos, D.J.; 50%) for microcomposites prepared using mesoporous silicas as filler. Organoclay addition led to Baikousi, M.; Gournis, D.; a decrease in oxygen transmission rate (OTR) values. -
Capacitors and Dielectrics Dielectric - a Non-Conducting Material (Glass, Paper, Rubber….)
Capacitors and Dielectrics Dielectric - A non-conducting material (glass, paper, rubber….) Placing a dielectric material between the plates of a capacitor serves three functions: 1. Maintains a small separation between the plates 2. Increases the maximum operating voltage between the plates. 3. Increases the capacitance In order to prove why the maximum operating voltage and capacitance increases we must look at an atomic description of the dielectric. For now we will show that the capacitance increases by looking at an experimental result: Experiment Since VVCCoo, then Since Q is the same: Coo V CV C V o K CVo C K Dielectric Constant Co Since C > Co , then K > 1 C kCo V V o k kvacuum = 1 (vacuum) k = 1.00059 (air) kglass = 5-10 Material Dielectric Constant k Dielectric Strength (V/m) Air 1.00054 3 Paper 3.5 16 Pyrex glass 4.7 14 A real dielectric is not a perfect insulator and thus you will always have some leakage current between the plates of the capacitor. For a parallel-plate capacitor: C kCo kA C o d From this equation it appears that C can be made as large as possible by decreasing d and thus be able to store a very large amount of charge or equivalently a very large amount of energy. Is there a limit on how much charge (energy) a capacitor can store? YES!! +q K e- - F =qE E e e- E dielectric -q As charge ‘q’ is added to the capacitor plates, the E-field will increase until the dielectric becomes a conductor (dielectric breakdown). -
Formation of Plastic Creases in Thin Polyimide Films
B. Yasara Dharmadasa Ann and H.J. Smead Department of Aerospace Engineering Sciences, University of Colorado Boulder, Boulder, CO 80309 e-mail: [email protected] Matthew W. McCallum Ann and H.J. Smead Department of Aerospace Engineering Sciences, University of Colorado Boulder, Boulder, CO 80309 e-mail: [email protected] Formation of Plastic Creases Seyon Mierunalan in Thin Polyimide Films Department of Civil Engineering, University of Moratuwa, We present a combined experimental and analytical approach to study the formation of Katubedda 10400, Sri Lanka creases in tightly folded Kapton polyimide films. In the experiments, we have developed a e-mail: [email protected] robust procedure to create creases with repeatable residual fold angle by compressing ini- tially bent coupons. We then use it to explore the influence of different control parameters, Sahangi P. Dassanayake such as the force applied, and the time the film is being pressed. The experimental results Department of Civil Engineering, are compared with a simplified one-dimensional elastica model, as well as a high fidelity University of Moratuwa, finite element model; both models take into account the elasto-plastic behavior of the Katubedda 10400, Sri Lanka film. The models are able to predict the force required to create the crease, as well as e-mail: [email protected] the trend in the residual angle of the fold once the force is removed. We non-dimensionalize our results to rationalize the effect of plasticity, and we find robust scalings that extend our Chinthaka H. M. Y. findings to other geometries and material properties. [DOI: 10.1115/1.4046002] Mallikarachchi Keywords: constitutive modeling, material properties, thin-films, plastic creases Department of Civil Engineering, University of Moratuwa, Katubedda 10400, Sri Lanka e-mail: [email protected] Francisco Lopeź Jimeneź 1 Ann and H.J. -
Dielectric Strength of Insulator Materials
electrical-engineering-portal.com http://electrical-engineering-portal.com/dielectric-strength-insulator-materials Dielectric Strength Of Insulator Materials Edvard The atoms in insulating materials have very tightly- bound electrons, resisting free electron flow very well. However, insulators cannot resist indefinite amounts of voltage. With enough voltage applied, any insulating material will eventually succumb to the electrical ”pressure” and electron flow will occur. However, unlike the situation with conductors where current is in a linear proportion to applied voltage (given a fixed resistance), current through an insulator is quite nonlinear: for voltages below a certain threshold level, virtually no electrons will flow, but if the voltage exceeds that threshold, there will be a rush of current. Once current is forced through an insulating material, breakdown of that material’s molecular structure has Medium voltage mastic tape - self-amalgamating insulating compound occurred. After breakdown, the material may or may designed for quick, void-free insulation layering not behave as an insulator any more, the molecular structure having been altered by the breach. There is usually a localized ”puncture” of the insulating medium where the electrons flowed during breakdown. Dielectric strength comparison between materials Material * Dielectric strength (kV/inch) Vacuum 20 Air 20 to 75 Porcelain 40 to 200 Paraffin Wax 200 to 300 Transformer Oil 400 Bakelite 300 to 550 Rubber 450 to 700 Shellac 900 Paper 1250 Teflon 1500 Glass 2000 to 3000 Mica 5000 * = Materials listed are specially prepared for electrical use. Thickness of an insulating material plays a role in determining its breakdown voltage, otherwise known as dielectric strength. -
Department of Physics United States Naval Academy Lecture 12: Capacitance; Electric Potential Energy & Energy Density Learni
Department of Physics United States Naval Academy Lecture 12: Capacitance; Electric Potential Energy & Energy density Learning Objectives • Explain how the work required to charge a capacitor results in the potential energy of the capacitor and apply the relationship between the potential energy U, the capacitance C, and the potential difference V . For any electric field, apply the relationship between the potential energy density u in the field and the field’s magnitude E. Capacitors in Parallel and in Series: When there is a combination of capacitors in a circuit, we can sometimes replace that combination with an equivalent capacitor Capacitors in Parallel: The total charge q stored on the capacitors is the sum of the charges stored on all the ca- pacitors. The equivalent capacitances Ceq is n X Ceq = C1 + C2 + ··· + Cn = Ci i=1 Capacitors in Series: The sum of the potential differ- ences across all the capacitors is equal to the applied po- tential difference V . The equivalent capacitances Ceq is n 1 1 1 1 X 1 = + + ··· = C C C C C eq 1 2 n i=1 i Electric Potential Energy: The electric potential energy U of a charged capacitor, q2 U = = 1 CV 2 2C 2 is equal to the work required to charge the capacitor. This energy can be associated with the capacitor’s electric field E~ . That is, the potential energy of a charged capacitor may be viewed as being stored in the electric field between its plates. Every electric field, in a capacitor or from any other source, has an associated stored energy.