Thermal Interface Materials (TIM) for a Wide Product Range

Technical Explanation Revision: 03 Thermal Interface Issue date: 2019-09-25 Prepared by: Stefan Hopfe Materials Approved by: A.Wintrich

Keyword: Thermal Interface Material, Thermal Paste, Grease, TIM, Phase Change Material

1. Introduction ...... 1 Advantages ...... 1 2. Technical Details ...... 2 2.1 TIM Materials ...... 2 2.2 Print pattern tolerances ...... 3 2.3 Surface specification for the heat sink ...... 3 3. Qualification Tests ...... 4 3.1 Typical qualification tests for shelf life of pre-printed modules inside blister ...... 4 3.2 Typical qualification tests for reliability (module mounted on heat sink) ...... 4 3.3 Conclusion ...... 5 4. Production Handling ...... 6 4.1 Packaging units ...... 6 4.2 Surface cleaning ...... 7 4.3 Opening blister packaging ...... 7 4.4 Removing modules from blister packaging ...... 7 5. Mounting ...... 8 6. Evaluation of imprint pattern ...... 9 7. First time of operation ...... 12 8. Labelling ...... 13 8.1 Labelling on delivery packaging ...... 13 8.2 Labelling on blister packaging ...... 15 9. Catalogue acceptable / non-acceptable parts ...... 16

1. Introduction

SEMIKRON offers a broad range of pre-applied Thermal Interface Materials (TIM) for a wide product range. The TIM materials are applied to the power modules by SEMIKRON’s automated screen and stencil printing process prior to delivery to the customer.

Advantages Silicone and silicone free as well as phase changing Thermal Interface Materials are available. TIM materials with improved thermal performance are Phase Change Material HALA P8 for baseplate modules (silicone-free) and the High Performance Thermal Paste for baseplate-less modules (silicone-based). Following advantages can be utilized by using modules with pre-applied TIM: - Optimum heat dissipation, i.e. low thermal resistance thanks to the optimum conditions provided by the evenly distributed TIM layer - Easy and fast assembly of the module - Increased productivity due to reduced handling costs and logistics - Outsourcing of a “dirty” manufacturing process - Optimized thickness of thermal paste layer, which drastically reduces the risk of damage to the DBC while providing the lowest thermal resistance - Excellent long-term stability thanks to the use of well proven TIM materials

2. Technical Details

The modules with pre-applied Thermal Interface Material are printed in a clean environment on an automated and SPC controlled silk screen or stencil printing line. The amount of TIM printed on the module surface can be found in the datasheets entitled “typical thickness” or “typical weight”. The value for the thickness is valid after module is mounted and the thermal paste has been distributed evenly across the entire bottom surface of the module. If the weight is stated in the datasheet, an inhomogeneous pattern is applied to the module. For these patterns it is not applicable to define the amount of TIM material by a thickness as the calculated resulting thickness is not constant over the printed surface.

The thermal resistance values Rth(j-s) for baseplate-less and Rth(c-s) for baseplate modules specified in the module data sheets are valid in combination with the standard thermal paste material Wacker P12 (thermal conductivity λ=0.81 K/(W*m). If a module is applied with Phase Change Material (thermal conductivity λ=3.4 K/(W*m) or the High Performance Thermal Paste (thermal conductivity λ=2.5 K/(W*m), the thermal resistance Rth(c-s)/Rth(j-s) will be lowered. Therefore a second Rth value with the new TIM material is specified in the datasheet. Moreover for baseplate-less modules like MiniSKiiP, SKiM or SEMITOP the output current Ic is calculated by the thermal resistance Rth(j-s). In consequence also for the output current Ic two values are specified, one for the standard material Wacker P12 and one for the High Performance Thermal Paste. It must be noted, that the thermal conductivity λ is used here only to differentiate between the TIMs. It is not the only reason for the lower Rth. A TIM material with higher thermal conductivity could also lead to a higher Rth if the minimum layer thickness cannot be achieved or the interconnection between TIM and metal surface is poor (high contact resistance).

2.1 TIM Materials

Phase Change Material Thermal Grease

Available TIM type: Available TIM types: − HALA P8 (TPC-Z-PC-P8/Henkel Loctite PSX-Pe) − Wacker P12: silicone and zinc oxide Characteristic: − Electrolube HTC: paraffine and zinc oxide − aluminium particles as the thermal conductive − High Performance Thermal Paste: silicone and filling material zinc oxide − wax as a carrier matrix Characteristics: − resolvent for the processability − metal oxide particles as a filling material − silicone or paraffine as a carrier matrix Phase Change Material will be offered for baseplate − no resolvents modules only. HALA P8 is a compound consisting of substances Thermal greases will be offered for baseplate-free mentioned above which is pasty before application. modules only. The material is applied via screen or stencil printing The materials are applied via screen or stencil process. printing process. The application is followed by an additional heating An additional heating process is not required. process which ensures that all resolvents are evaporated. After this the appearance is stiff like candle wax at room temperature and low viscous (pasty) at temperatures above 45°C. At this temperature the material starts to flow under pressure and to wet the contact surface between heat sink and baseplate.

2.2 Print pattern tolerances

The screen printing process is subject to a process tolerance; i.e. that the amount or thickness of thermal interface material can vary. These tolerances can be found in the datasheet titled “min./max. thickness” or “min./max. weight”.

Due to the automated screen-printing process, only slight variations in print positioning occur but have no influence on the mounting process or the thermal properties.

Additionally, slight defects in the print structure may occur during the printing process and are acceptable. The maximum permissible deviation in size of the honeycomb structure is ~10%.

There might be a slight sub-surface migration of the stencil with thermal interface material. This optical change in the screen printing image does not affect the module’s thermal properties or the mounting process.

For more information about good and bad parts, please refer to chapter 9.

2.3 Surface specification for the heat sink

To achieve a good interconnection between module and heat sink and to obtain an optimum heat transfer, the heat sink must comply with the following specification (see Figure 1). It is recommended that the cooler is milled by a carbide indexable insert. This tooling method delivers the best result with a typical surface roughness of ~1-3µm.

- Heat sink must be free from residues, particles or dust - Evenness  50 µm on 100mm (DIN EN ISO 1101)

- Roughness Rz:  6.3 µm (DIN EN ISO 4287) - No steps > 10 µm

Figure 1: Surface specification

 50 µm Heat sink

> 10  6.3 µm µm

3. Qualification Tests

Thermal Interface Materials are applied to different qualification tests to quantify the max. shelf life during storage and transport of modules inside the blister packaging and to prove the reliability of assembled modules in application. The TIMs are tested according to IEC 60068-2-xx for environmental conditions (like high and low temperature storage, according to IEC 60721-3-1 for minimum 12 Month in a shelf life test and according to IEC 60749-49 in power cycle tests.

3.1 Typical qualification tests for shelf life of pre-printed modules inside blister

Tests Tests Standard P12 P8, HT and HPTP

High-Temperature IEC 60068-2-2 Bb Storage √ √

Low-Temperature IEC 60068-2-1 Ab Storage √ √

High Humidity, High Temperature √ Not applied IEC 60068-2-67 Storage

Close to Climatic Change Not applied √ IEC 60068-2-38

R measurement after test within spec, Pass Criteria th none mounting according to mounting instruction ok

18 month inside blister, 12 month inside blister, conditions: conditions: Shelf Life P8, HPTP: 5°C…+40°C,10…85% r.h. IEC 60721-3-1 -25°C…+60°C, HT: -25°C…+60°C, 10…95% r.h. 10…95% r.h.

3.2 Typical qualification tests for reliability (module mounted on heat sink)

Tests Tests Standard P12 P8, HT and HPTP

High-Temperature √ √ IEC 60068-2-2 Bb Storage

Low Temperature √ √ IEC 60068-2-1 Ab Storage

High Humidity, High √ √ IEC 60068-2-67 Temperature Storage

Close to Climatic Change √ √ IEC 60068-2-38

Power Cycling Test √ √ IEC 60749-34

Temperature Cycling √ √ IEC 60068-2-14 Na Test

Rth measurement before and after storage test/thermal cycling Pass Criteria criteria: variation of thermal resistance within spec, none For Power Cycling EOL reached at Rth+20%

3.3 Conclusion

TIM P12 HPTP HT P8

18 month inside 12 month inside blister 12 month inside blister 12 month inside blister Shelf life blister conditions: 1K2 conditions: conditions: 1K2 conditions: conditions -25°C…+60°C, 5°C…+40°C, -25°C…+60°C, 5°C…+40°C, 10…95% r.h. 10…85% r.h. 10…95% r.h 10…85% r.h.

Max. storage or transport +55°C +55°C +55°C +55°C temperature*

Max. operation temperature Top tested +125°C*** +125°C*** +125°C +105°C according to standard test conditions** *limited by the blister packaging **In an assembled status. For baseplate-less modules: Top to be measured on heatsink, for baseplate modules: Top to be measured on baseplate ***max. temperature used in test, silicone based greases like P12 and HPTP can handle temperatures of 180…200°C

In principal it is recommended that modules with pre-applied Thermal Interface Material are stored at room temperatures (if necessary air conditioned).

4. Production Handling

Phase Change Material Thermal grease

The HALA P8 phase change material applied on a Baseplate-less power modules are applied with baseplate of a power module is solid when delivered thermal grease and therefore have to be handled to customers and is changing to a paste-like carefully due to the pasty TIM layer. consistency only when the assembled module is heated up (e.g. during burn-in, or first operation) The main advantage of a thermal grease instead of a phase change material on a baseplate-less module Contamination with dust or particles can be easily is the increased assembly process robustness. removed from the solid phase change material The low viscous TIM layer can easily distribute layer. Please use a brush tool to remove any during the mounting and therefore reduces the contaminations. mechanical stress on the DBC.

Damage to the printed phase change material But the product has to be handled with care, pattern by e.g. accidental touching or moving over accidental touch will smudge the printed pattern and the heatsink is not likely to occur, unless a strong may influence the performance. force is applied. A contamination with particles can be removed by using a tweezer tool.

To avoid contamination of the TIM printed surface area with particles and dust, the blister packaging should be opened not earlier than the time of module assembly. To open the blister packaging please follow the instructions given in chapter 4.3.

4.1 Packaging units

Following an overview about the packaging unit size for each module family and case size:

Quantity per Module blister packaging MiniSKiiP0 66 MiniSKiiP1 40 MiniSKiiP2 24 MiniSKiiP3 16 MiniSKiiP8AxB 16 MiniSKiiP8AC 12 SKiM 63 4 SKiM 93 4 SkiM 4 4 SEMITOP 2 56 SEMITOP 3 35 SEMITOP 4 20 SEMITOP E1 28 SEMITOP E2 20 SEMiX 3p 6 SEMiX 1 8 SEMiX 3 6 SEMiX 13 4 SEMiX 5 4 SEMITRANS 3 6 SEMITRANS 10 2

4.2 Surface cleaning

Before module mounting it has to be ensured that the heat sink is free of contamination with any foreign particles or dust. A lint free wipe with isopropanol can be used to clean the surface. In case of module replacement, any residues of thermal grease or phase change material on contact surfaces can also be removed by using isopropanol and lint free wipes.

4.3 Opening blister packaging  The surrounding environment must be clean and free of dust.  The blister should remain closed during production stops to avoid contamination.  The TIM pattern should be free of contamination and the screen-printing image should not be damaged.  Larger sized particles which are visible to the naked eye can be removed by using tweezers.

All parts are subjected to a final optical inspection. In the case of contamination with particles or any damage of the printing pattern, please refer to the catalogue which parts should be rejected. (see chapter 9)

4.4 Removing modules from blister packaging All ESD regulations for electronic components (IEC 61340-5) must be observed when removing the modules from the blister packaging as well as for further handling steps. ESD gloves must be worn when handling the modules. Contamination of the modules with thermal paste or hand perspiration must be avoided at all times. For easier removal of the modules from the blister packaging it is recommended for MiniSKiiP® that the package is turned before removal so that the spring pins (upper side of modules) are visible (see Fig. 2 and 3). For SKiM®63/93 it is recommended to turn the package so that the printed DBC is visible. Than the blister package can be opened and the module can be taken out.

Figure 2: MiniSKiiP and SKiM63/93

Figure 3: Removal of MiniSKiiP and SKiM63/93

5. Mounting

Phase Change Material Thermal grease

Phase change material will be applied on baseplate Thermal greases will be applied on baseplate-less modules only. modules only. For each module baseplate a certain print pattern For standard thermal greases like Wacker P12 and layout is developed according to the baseplate Electrolube HTC a homogeneous honeycomb bending (see Fig.4). pattern is applied underneath the DBC (see Fig.5). This layout ensures a direct metal-to-metal contact Target is to gain a well distributed TIM layer of the module baseplate and heat sink. Only the air between DBC and cooler without any air voids. gaps coming from module bending and roughness are filled out with thermal interface material. This approach leads to two main advantages:

- Thermal resistance Rth(j-s) is optimized - No screw retightening required after phase change material has melted

Fig.5: MiniSKiiP3 – homogeneous print layout – STANDARD TIM

The module has to be mounted according to the given module specific mounting instructions. After the module assembly the thermal grease distributes and fills out the roughness and the bending of the module. Fig.4: Print pattern according to baseplate bending The High Performance Thermal Paste has a higher viscosity compared to standard pastes like Wacker For each module family (e.g. SEMITRANS, SEMiX) P12 or Electrolube HTC. To reduce mechanical mounting instructions are given. stress during the assembly the print pattern has been adapted by applying less material on the These mounting instructions with prescribed values pressure areas of the module (see Fig.6) for mounting torque and speed will not change, when the modules has been applied with phase change material.

After the module has been mounted on the heatsink and heated up for the first time, the phase change material melts above a module baseplate temperature of 45°C and fills out the bending and the roughness. Fig.6: – Optimized print layout – High Performance Thermal paste

Result: Result: -Mounting according to existing Mounting -Mounting according to existing Mounting Instructions Instructions -Even though the material is melted and -The optimized print pattern layout allow to apply distributed, always the same mounting procedure independent the module mounting screws do not have to be from the thermal grease type. re-tightened at any time.

6. Evaluation of imprint pattern

Phase Change Material Thermal grease

The pictures below show the typical appearance of The pictures below show the typical appearance of baseplate modules applied with phase change baseplate-free modules applied with thermal material HALA P8: grease:

− Fig.7 before mounting − Fig.11 before mounting − Fig.8,9,10 after mounting + thermal cycling − Fig.12,13,14 after mounting and thermal cycling

Fig.7: Typical baseplate module+TIM before mounting Fig.11: Typical baseplate-less module+TIM before mounting

Mounting and heat up procedure: Mounting and heat up procedure: − Mount the module according to mounting − Mount the module according to mounting instructions on the heat sink instructions on a heat sink − Perform 3 thermal cycles 20/90°C: − Perform 3 thermal cycles 20/90°C: Option 1: Option 1: Put the heat sink with the mounted module e.g. Put the heat sink with the mounted module e.g. on a heating plate and increase the temperature on a heating plate and increase the temperature as fast as possible up to 90°C. as fast as possible up to 90°C. As soon as the upper temperature has been As soon as the upper temperature has been reached it can be removed from the heating reached it can be removed from the heating plate plate and should be cooled down as fast as and should be cooled down as fast as possible to possible to ~20°C. Repeat this procedure at ~20°C. Repeat this procedure at minimum 2 minimum 2 times. times. Option 2: Option 2: Apply approx. 50-80% of the nominal module DC Apply approx. 50-80% of the nominal module DC current that the baseplate can heat up to a current that the heat sink can heat up to a temperature of 90°C. temperature of 90°C. Then cool down after down to a baseplate Then cool down to a heat sink temperature of temperature of ~20°C. ~20°C. Both options give the material the possibility to Both options give the material the possibility to melt, spread out and evenly distribute spread out and evenly distribute

Evaluation of print pattern: Evaluation of print pattern: - Dismount the module and take it carefully off - Dismount the module (unscrew, wait 24 hours the heat sink till the module can be taken off easily without - For baseplate modules it is not mandatory that separation of the DBC and the module housing the TIM material is completely spread out over - it is absolutely mandatory that the predominant the whole baseplate area. Only in the central part of the DBC surface (except the DBC edges area of the module it should be ensured that with the dimples) and the cooler area is wetted the honey combs have disappeared and the with TIM material. All honeycombs should have material is well distributed. (Fig.8) touched the heat sink surface or better - Especially the area around the mounting holes completely disappeared. and the module edges are free of TIM material - An optimum imprint pattern is when the that metal-metal contacts can be established. honeycombs are disappeared and the thermal This approach leads to an optimum thermal paste has spread out evenly without any air voids (Fig.12). Any significant air gaps will

resistance and an additional retightening increase the thermal resistance and lead to a process is not required. chip temperature increase during operation. - Figure 9 shows a suboptimal imprint pattern Figure 13 show an still acceptable but not after disassembly, where the TIM material has optimal imprint pattern. Some areas with honey not completely spread out after 3 thermal combs are still visible but all of them have cycles. But the largest baseplate bending already touched the heat sink. It can be underneath the chips is filled out with TIM supposed that during the next 10 power cycles material and all honey combs have touched the these air voids will fully disappear. heat sink surface. It can be supposed that with - Picture 14 shows an unacceptable imprint further thermal or power cycles the distribution pattern. Large areas of honey combs have even of the TIM material further improves. not touched the cooler. It is not expected that - Figure 10 show a unacceptable imprint pattern any load cycles will close these air voids. after disassembly. Even though 3 thermal cycles were performed the TIM material has filled out the baseplate bending insufficiently. The majority of honey combs is still visible. Imprint pattern: Imprint pattern: Good : Good:

Fig.12: After 3 thermal cycles 20°C/85°C and disassembly Fig.8: After 3 thermal cycles 20°C/85°C and disassembly

Not optimum but still acceptable: Not optimum but still acceptable:

Fig.13: After 3 thermal cycles 20°C/85°C and disassembly

Fig.9: After 3 thermal cycles 20°C/85°C and disassembly

Not acceptable: Not acceptable:

Fig.10: After 3 thermal cycles 20°C/85°C and disassembly

Fig.14: After 3 thermal cycles 20°C/85°C and disassembly

When assembly trials have been performed and the imprint pattern after disassembly shows a bad interconnection between module and heat sink as shown in Fig.10 and 14, it is mostly related to a deviation to the cooler surface specification. (refer to chapter 2.3) Anyway, to verify a proper thermal interconnection it is recommended to evaluate the thermal resistance junction to heat sink Rth(j-s).

7. First time of operation

Phase Change Material Thermal grease

After the power module has been mounted to the After the module has been mounted on the heat sink heat sink according to the Mounting Instructions it according to the standard Mounting Instructions it can be put directly into operation with nominal can be put into operation. current. The Rth(j-s) of the module directly after mounting will After the assembly of a baseplate-less module the be higher than after the phase change material has thermal grease starts to spread out and distributes melted and distributed. The melting process starts at evenly. In this stage the initial thermal resistance a temperature as low as Tc=45°C so that Rth(j-s) will Rth(j-s) is approx. 15-20% above the final Rth(j-s). drop very quickly and will not cause any junction Thanks to a “settling process” this Rth improves temperature overshoot exceed the desired steady significantly with an exponential curve progression state value under nominal load conditions. over time until the final Rth(j-s) is obtained after Nevertheless thanks to relaxation and distribution several days (see Fig.15). Thermal pumping effects effects, the Rth(j-s) will slightly improve during the first induced e.g. by thermal cycles or active power cycles heat up/cool down phases. will accelerate this settling process. The final Rth(j-s) is typically reached after the first 50- In consequence following the module mounting is 100 power cycles. recommend to either: a) wait 1 to 2 days before applying a load to the In consequence a certain load pattern or burn in power module with full load process is not required as long as the power module or is not exposed to a high overload condition during b) do 3 thermal cycles with a heat sink temperature the first time of operation. swing of 20 to 90°C or c) do 3 load cycles with a heat sink temperature swing of 20°C to 90°C and a max. current limited to 70% to 80% of the nominal load current, to achieve full power capability

For reference: The datasheet values for Rth(j-s) were measured after 3 thermal cycles (20°C to 90°C) had been performed. This corresponds to approx. 2 to 5 days relaxation time.

Fig.15: Typical thermal resistance over relaxation time

8. Labelling

8.1 Labelling on delivery packaging

From the outside of a delivery packaging it is not visible if the modules come with or without pre-applied Thermal Interface Material. The label gives only information about the module type, quantity and order number. (see Fig. 16 and 17)

Figure 16: Position of type label on delivery boxes

The label contains the following items:

Figure 17: Type label on paper box

1. SEMIKRON Logo 2. Product type designation 3. “Lot :“ Date code - 6 digits: YYWWL (YY=Year, WW=Week, L=Lot of same type per week) 4. “Order :” Order Confirmation number / Item on Order Confirmation 5. “QTY:” Quantity on modules inside the card box– also as bar code

6. “Id.-Nr :” SEMIKRON part number – also as bar code 7. “Date of Thermal Paste application:” application date 8. “Advice! Check Thermal Paste after:” date of expiry (an evaluation of the imprint pattern give information whether the TIM material is still in good condition, therefor see chapter “6.Evaluation of imprint pattern”)

Bar Code in compliance with: - Standard: EEC 200 - Format: 19/9

Each delivery box contains a note with the following information:

Figure 18: Delivery paper box

Always observe the thermal paste manufacturer’s specifications as set down in the safety data sheet. The latest versions can be found on the following websites:

Wacker P12: https://www.drawin.com/drawin/de/produkte/produktgruppen/siliconp asten/siliconpasten.jsp

Electrolube HTC: http://www.electrolube.com/products/thermal-management/27/16/

HALA TPC-Z-PC-D_P: http://www.hala-tec.de/fileadmin/user_upload/datenblaetter- en/E_HALA_TPC-Z-PC-D_P.pdf

High Performance Thermal Paste, (HPTP): https://www.semikron.com/dl/service- support/downloads/download/MSDS_TC-6000HP.pdf

No guarantee is given, either expressly or implied, for the accuracy, completeness, timeliness, efficacy or reliability of the information given in the safety data sheets. Further, we accept no liability for any direct or indirect damages arising from the use of the safety datasheets.

8.2 Labelling on blister packaging If the service “pre-applied thermal interface material” is requested, one label gives information about the date of application and the date of expiry (Fig. 19). A second label warns of opening the blister too early (Fig.20). Both are fixed to the blister packaging (Fig. 21).

Figure 19: Label with date of expiry

Thermal Paste Type: P12: Wacker P12 P8: HALA P8 HP: High Performance Thermal Paste HT: HALA HT

Figure 20: Advice label on blister packaging

Figure 21: Position of labels on blister packaging

Further, our General Terms and Conditions (GTC) in the currently applicable version apply exclusively. These can be viewed or downloaded on our website http://www.semikron.com.

9. Catalogue acceptable / non-acceptable parts

The TIM application process is done in a separated, controlled environment and the printing process is subjected to an automated process control which ensures a consistent and reproducible printing quality. Despite all precautions a damage or contamination of the printing pattern cannot completely avoided and therefore cannot constitute a cause for complaints.

The modules should be visually checked and any contamination with particles, fibers that are visible to the naked eye needs to be removed prior to the assembly by using a tweezer!

In this case the pattern has to be evaluated as shown in the table below.

Deviation due to the stencil or screen printing process

Quality Mechanical defect picture Defect description acceptance

Slight defects in OK printing pattern

(small voids)

Deformed honeycomb edges

Slight sub-surface OK migration

Few dots contain a OK plateau

Defects caused by handling or assembly process

Quality Mechanical defect picture Defect description acceptance

Only a few dots are OK blurred

Formation of shades caused by removed OK residues

Contamination with particles e.g. hairs, fibers OK only when removed prior to the assembly

(removable with tweezers)

OK only when removed prior to the assembly

(removable with tweezers)

NOT

Many dots or whole printed sub-areas NOT are blurred or OK smeared

(The application of a new TIM layer is recommended)

Surface ok discolouration

IMPORTANT INFORMATION AND WARNINGS The information in this document may not be considered as guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). This document describes only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.

SEMIKRON INTERNATIONAL GmbH Sigmundstrasse 200, 90431 Nuremberg, Germany Tel: +49 911 6559 6663, Fax: +49 911 6559 262 [email protected], www.semikron.com