Issue 2017 | 01

BLUETOOTH SILICON AND FOR WIRELESS COMMUNICATION SINGLE CHIP SOLUTIONS FOR THE UTMOST FLEXIBILITY ICs FOR COMPACT AND ULTRA-LOW POWER DESIGNS

Toshiba offers an all-in-one solution for high quality Bluetooth® ICs with stable, reliable Bluetooth profiles. Benefitting from over 15 years’ experience, ’s Bluetooth ICs offer low power solutions with both Bluetooth Classic and Low Energy line-ups of firmware. Toshiba’s devices realize an easy way to integrate Bluetooth for various industrial, medical, smart home, wearable and automotive applications.

All Toshiba Bluetooth devices and embedded software are Bluetooth Qualification Expert (BQE) qualified.

The next generation of devices will also support the new Bluetooth 4.2 standard.

• Embedded Bluetooth stack and selected profiles • Proven interoperability • Suitable for a variety of application scenarios • High-quality, cost-effective Bluetooth-compliant designs • Low power consumption

TC35678 TC35679 TC35670 / TC35675 The TC35678 supports the Bluetooth TC35679 supports the Bluetooth Low The TC35670 and TC35675 Bluetooth NFC Low Energy (BLE) 4.2 standard. The Energy (BLE) 4.2 standard and comes Combo devices support the BT Low Energy TC35678 is suitable for ultra-low power with embedded BLE stack and GATT (LE) 4.1 standard and include an NFC portable products and comes with profile. The TC35679 achieves extremely Forum compliant Tag Class 3. embedded BLE stack and GATT profile. low current consumption, it delivers long Easy Bluetooth pairing through NFC and TC35678 is available in both QFN40 and operating times for applications powered connection setup enables ease of use at QFN60 packages. The QFN60 package by small coin batteries making it perfectly very low power. An active NFC device may extends the number of general purpose suited for wearable technology, medical switch on the Bluetooth LSIs with zero IO from 17 to 32 making it suitable for equipment, smartphone accessories and battery power use. The devices are suitable use in equipment such as keyboards remote controls. for ultra low power portable products and and remote controls that require a large come with embedded BLE stack and GATT number of control pins. profile. An over-the-air (OTA) software update service can be realized. Both devices can be used with a host or in a standalone configuration. The TC35675 also includes embedded Flash Memory to remove the need for external EEPROM memory in standalone mode.

TC35667/ TC35676 TC35661 The TC35667 and TC35676 are highly The TC35661 is dual mode, it supports integrated RFCMOS Bluetooth devices both the Bluetooth Classic (3.0 + EDR) that support the BT Low Energy (LE) 4.1 and the new BT Low Energy (LE) 4.2 standard. Both devices are suitable for ultra standard. TC35661SBG supports the low power portable products. The devices standard Bluetooth HCI interface and come with an embedded BLE stack offers integration of stack and selected BT and GATT profile. An over-the-air (OTA) profiles on-chip as well. The device offers software update service can be realized. simple Bluetooth integration for various Both devices can be used with a host or industrial, medical, smart home, wearable in a standalone configuration. TC35676 and automotive applications. The device is also includes embedded Flash Memory also automotive qualified (AECQ100). to remove the need for external EEPROM memory in standalone mode. TC35670 / TC35675 SINGLE CHIP CONTROLLER FOR BLUETOOTH LE (4.1) + NFC TAG

The NFC Tag built into the TC35670 and TC35675 can wake up the BLE devices from sleep mode through the NFC antenna and initiate easy Bluetooth pairing after confirmation of the BT device address. This connection setup enables ease of use and a very long battery life. TC35670 and TC35675 are suitable for ultra low power portable products and come with embedded BLE stack and GATT profiles.

KEY BENEFITS FEATURES • Allows the extension of battery lifetimes by supporting wake up •  (BLE) 4.1 compliant with 0 standby current. The integration of an NFC Tag and • Supports BLE GAP central and peripheral mode Bluetooth LSI allows the Bluetooth circuit to be off until woken up • by an active NFC controller signal from another device. Internal RAM for application code, data patches • TC35675: Embedded 192KB Flash Memory • Easy pairing initialization or safe out-of-band pairing, and transfer of small amounts of data with NFC Forum compliant Tag • Wake up signal from NFC tag for Bluetooth host device • Exchange of data with NFC Tag EEPROM without waking up the • Tag communication: NFC Type 3 Tag (ISO/IEC18092) Bluetooth circuit • Tag communication speed: 212kbps / 424kbps automatic • Flexible system architectures through: switchover • Embedded Bluetooth profile model (API over host UART) • On-chip 2KB EEPROM accessible from Bluetooth controller • Stand alone model (with embedded Bluetooth stack and or NFC antenna profile, no host needed) • Tag Security: Mutual recognition by Triple DES MAC (MAC: Message Authentication Code) • Bluetooth qualified embedded BLE stack and GATT profile for easy Bluetooth product qualification • On-chip balun, antenna switch, LNA, DC-DC converter • Ultra-low bill of materials due to very few external components: • Operational Voltage: 1.8V to 3.6V • With TC35675 no external EEPROM memory is needed • BLE peak power consumption: 6.3mA (depends on selected due to on-chip Flash clocking scheme and data mode) • System integration is simplified by various on-chip • Deep sleep mode: 0.05µA; sleep mode 15µA peripherals • Peak current in operation mode: 6.3mA • Only a small RF circuit is necessary due to built-in • Tag Operational Mode: 600µA discrete components • Transmitter Output Power: 0dBm to -20dBm (4dB steps) • An over-the-air (OTA) software update service can be realized • RX Sensitivity: -92dBm (typ.) • The device can operate at voltages between 1.8V and 3.6V • Operating Temperature Range: TC35670 is -30 to 85C; making it TC35675 is -40 to 85 suitable for use with various battery types such as coin cell, • AAA or AA TC35670 Package: 40pin QFN 6mm x 6mm x 0.5mm pitch, 0.9mm height • Various sleep modes and clock options to optimize power • consumption TC35675 Package: 52pin FBGA 4.5mm x 4.5mm, 0.5mm pitch, 1.2mm height • QFN40/FBGA52 package allows small form factor designs • Profiles: GATT (Generic Attribute Profile), including server and client functions • Interfaces: UART (2), SPI & I2C interface, PWM output BLOCK DIAGRAM (3channels), ADC (4 channels), 7 programmable IO

RF Block ARM® CPU UART GPIO5 GPIO4 GPIO3 DCDCEN VDDIO TMODE1 RESETX GPIO2 GPIO1 GPIO0 30 29 28 27 26 25 24 23 22 21

I2C / SPI GPIO6 31 20 GPIO15 LE MaskROM TMODE2 32 19 GPIO14 MODEM 18 ADC GPIO9 33 SLPXOIN SRAM GPIO10 34 17 SLPXOOUT 16 CLK Gen. GPIO GPIO11 35 VDD12D 15 VDD Flash GPIO12 36 14 DCDOOUT DCDC Memory* PWM GPIO13 37 13 GPIO7 38 VDD15IN

12 XOIN GPIO8 39

11 XOOUT NFC Tag VPGM 40 NFC Tag SRAM Logic Analog 1 2 3 4 5 6 7 8 9 10 Block I2C

EEPROM VSSX VSSA1 VSSA2 RFIO_P RFIO_N VDD12X TRTEST1 TRTEST2 VDD12A1 VDD12A2 *TC35675 Only TC35670 Example TC35661 SINGLE CHIP CONTROLLER FOR BLUETOOTH CLASSIC (3.0 + EDR) AND BLUETOOTH LE (4.2)

The device delivers an easy way to integrate Bluetooth for various industrial, medical, wearable and automotive applications.

KEY BENEFITS • Dual Mode core for classic and new Bluetooth 4.2 standard • BQE qualified hardware and software for easy Bluetooth EPL System System Product ID (*) Configuration • Flexible system architectures through: • HCI model BT 4.2 HCI standard HCI TC35661-009 • Embedded stack and profile model • Standalone model (with embedded stack and profile) SPP (with EDR) TC35661-203 BT 4.2 Embedded Profile • Embedded on-chip Bluetooth stack and selected profiles for SPP+BLE GATT TC35661SBG-503 easy Bluetooth system design BT 4.2 with LE secure connections SPP+BLE GATT TC35661SBG-551 • Stand alone operation with embedded SPP or HID profile for small applications is feasible without a host MCU • Ultra low bill of materials due to very few external components • Multiple programmable IO and peripheral options • On-chip voltage controller and low power modes • Consumer and automotive qualification (AEC-Q100)

(*) Subject to firmware updates. Subject to change without notice

FEATURES TC35661SBG (FBGA64) • Bluetooth Core Spec 3.0 and 4.2, EDR and LE support

• TC35661–00X: HCI type RF BLOCK • TC35661–XXX: embedded profile type UART Class 2 • BT Class 2 support ARM® CPU • RX Sensitivity –91dBm (typ.) 13–52 MHZ • EDR / LE Baseband with ARM® CPU - 13 to 52 MHz USB 2.0 • On–chip ROM, RAM, including Patch–RAM Modem • On–chip balun, antenna switch, LNA, LDO • Interfaces: UART, SPI, USB2.0(FS), I2C, I2S/PCM, GPIO I2C, I2S • ROM Data transfer up to 2 Mbps (DH5 packets) net SPI • Package: 64ball BGA (ROM version), 0.5/0.8mm pitch, 1.2/1.4mm height • Operational voltage: 1.8V or 3.3V (typ.) GPIO SRAM • Low power sleep mode 30uA (max) • Operation current well below 30mA (depends on packet type and selected operational mode) • AEC-Q100 automotive qualification (0.8mm pitch) HCI SYSTEM CONCEPT TC35661-00X The Bluetooth HCI (host controller interface) model: 26 MHz HOST OSC the low layer stack (RF, LC, LM) runs on the TC35661 RF Analog PROCESSOR device for both Bluetooth Classic and BLE (4.0). SLEEP CLK for v4.0, EDR & LE Through a UART or USB it is connected to an 1.2V LDO external host processor, which executes the upper UART (HCI) Bluetooth stack (L2CAP, RFCOMM) and profiles. BT STACK / UART PROFILE Beyond the upper stack the host processor runs the USB (HCI) EDR + LE USB 2.0 application software. This application processor may Modem Middleware also run additional tasks such as middleware and EEPROM 2 ® (optional) I C ARM CPU multimedia functions. This concept is suitable for SBC Dec BT_WKUP voice and data. It can be combined with third-party SPIO SRAM Bluetooth protocol stacks over the standardized HCI HP_WKUP software interface. PATCH RAM Voice IF I2S / PCM 1.8V MASK ROM (HCI) or BLUETOOTH 3.3V PROCESSOR

EMBEDDED PROFILE SYSTEM CONCEPT TC35661-XXX The embedded profile model integrates both the 26 MHz HOST OSC lower and upper stack as well as some selected RF Analog PROCESSOR profiles in the TC35661. The UART interface carries for v4.0, EDR & LE control and payload data to/from the embedded 1.2V LDO API. The entire Bluetooth functionality is managed UART (HCI) Application SW by the Blue­tooth LSI. The host processor handles + UART Data Transfer the application data and some basic system control. EDR + LE USB 2.0 Depending on the complexity of the application, the Modem SENSOR High Level host CPU performance requirement is very minor. EEPROM API Driver 2 ® (optional) I C / SPI ARM CPU This concept is for data only. The embedded profile DISPLAY BT_WKUP models for BT4.0 feature Smart Ready (dual mode) GPIO SRAM or Smart (BLE single mode) Bluetooth marking. HP_WKUP Toshiba offers source code for an optional high level I2S / PCM PATCH RAM host driver fitting to the embedded API in order to MASK ROM (HCI) 1.8V (EMB. PROTOCOL simplify design to enable fast time to market. JTAG STACK & PROFILE) or BLUETOOTH 3.3V PROCESSOR

STANDALONE SYSTEM CONCEPT Stand alone operation with embedded SPP or HID profile for small applications is feasible without a host MCU.

TC35661 EMBEDDED PROFILE SOFTWARE MODELS

TC35661-2XX TC35661-5XX

Profile API SPP-API GATT-API

SPP SPP GATT SMP SDP SDP GAP RFCOMM RFCOMM Attribute Profile GAP

L2CAP L2CAP

LC/LMP (v4.2) LC/LMP (v4.2)

RF Driver RF Driver

with GATT and SPP profile for BT 4.2 dual mode with Profile (SPP) for wireless cable replacement enabled accessory products TC35667 / TC35676 SINGLE CHIP CONTROLLERS FOR BLUETOOTH LE (4.1)

TC35667 and TC35676 are suitable for ultra low power portable products. The devices come with embedded BLE stack and GATT profiles. Toshiba has tested the Bluetooth interoperability extensively and performed Bluetooth Qualification Expert (BQE) qualification.

KEY BENEFITS • Flexible system architectures through: GPIO5 GPIO4 GPIO3 DCDCEN VDDIO TMODE1 RESETX GPIO2 GPIO1 GPIO0 • Embedded Bluetooth profile model (API over host 30 29 28 27 26 25 24 23 22 21 UART) GPIO6 31 20 GPIO15 • Stand alone model (with embedded Bluetooth stack 19 GPIO14 and profile, no host needed) TMODE2 32 18 SLPXOIN • Bluetooth qualified embedded BLE stack and GATT GPIO9 33

profile for easy Bluetooth product qualification GPIO10 34 17 SLPXOOUT

• Ultra-low bill of materials due to very few external GPIO11 35 16 VDD12D components: 15 GPIO12 36 VDD • With TC35676 no external EEPROM memory is 14 DCDOOUT needed due to on-chip Flash GPIO13 37 13 VDD15IN • System integration is simplified by various on-chip GPIO7 38 12 XOIN peripherals GPIO8 39

• 11 XOOUT Only a small RF circuit is necessary due to built-in VPGM 40 discrete components 1 2 3 4 5 6 7 8 9 10 • An over-the-air (OTA) software update service can be realized VSSX VSSA1 VSSA2 RFIO_P RFIO_N • VDD12X TRTEST1 TRTEST2 VDD12A1

The device can operate at voltages between 1.8V and VDD12A2 3.6V making it suitable for use with various battery types TC35667 Example such as coin cell, AAA, or AA • Various sleep modes and clock options to optimize power consumption STANDALONE APPLICATION EXAMPLE • QFN40 package and CSP41 (for TC35667) allows small and cheap form factor designs. BASE CLOCK

** EEPROM BLE Single LSI l2C TC35667 / TC35676 SENSOR LED ADC BLE Stack & GATT Profile (*) 2 FEATURES BLE Profile • Bluetooth Low Energy (BLE) 4.1 compliant Application SW BATTERY BUZZER • Supports BLE GAP central and peripheral mode 1 GPIO • Internal RAM for application code, data patches * Supports BLE central and • TC35676; Embedded 192KB Flash Memory peripheral mode DISPLAY KEYS ** TC35667 ONLY • On-chip balun, antenna switch, LNA, DC-DC converter • Operational Voltage: 1.8V to 3.6V • BLE peak power consumption: 6.3mA (depends on selected clocking scheme and data mode) • Deep sleep mode: 0.05µA; sleep mode 15µA BLOCK DIAGRAM • Peak current in operation mode: 6.3mA • Transmitter Output Power: 0dBm to -20dBm (4dB steps) RF Block ARM® CPU UART • RX Sensitivity: -92dBm (typ.) • Operating Temperature Range: -40°C to 85°C I2C / SPI • Package: 40pin QFN 6mm x 6mm 0.5mm ball pitch LE MaskROM or 5mm x 5mm 0.4mm ball pitch, height 0.9mm, MODEM or CSP41 3mm x 3mm SRAM • Profiles: GATT (Generic Attribute Profile), including server Flash and client functions CLK Gen. Memory* GPIO • Interfaces: UART (2), SPI & I2C interface, PWM output (3channels), ADC (4 channels), 16 programmable IO DCDC ADC PWM

*TC35676 Only TC35678 ULTRA-LOW CURRENT SINGLE-CHIP CONTROLLER FOR BLUETOOTH LOW ENERGY (4.2) WITH BUILT-IN FLASH ROM

The TC35678 achieves class-leading* low current consumption1 and incorporates 256 KB of built-in Flash ROM to store user programs and data in stand-alone operations. This built-in Flash ROM eliminates the need for an external EEPROM and contributes to reductions in both cost and mounting-area.

KEY BENEFITS

• Flexible system architectures through: • Embedded Bluetooth profile model (API over host UART) • Stand alone model (with embedded Bluetooth stack and profile, no host needed) • Bluetooth qualified embedded BLE stack and GATT profile for easy Bluetooth product qualification • Ultra-low bill of materials due to very few external components: • No external memory is needed, on-chip Flash and RAM stores BLOCK DIAGRAM small to medium size application code and data ARM® • System integration is simplified by various on-chip peripherals UART RF Block CORTEX®-MO • On-chip silicon oscillator for sleep mode removes the need for an external crystal or clock source SPI LE MaskROM • Only a small RF circuit is necessary due to built-in discrete MODEM components I2C • Supports over-the-air (OTA) update of system software SRAM CLK Gen. GPIO • The device can operate at voltages between 1.8V and 3.6V making it suitable for use with various battery types such as coin cell, AAA, or ADC AA DCDC PWM • Various sleep modes and clock options to optimize power consumption FLASH ROM • QFN40 or QFN60 packages allow small and cheap form factor designs

Features / Profile TC35678

FEATURES LE Secure Connections √

• Bluetooth Low Energy (BLE) 4.2 compliant LE Data Packet Length Extension √ • Supports BLE GAP central and peripheral mode • Embedded 256KB Flash Memory and internal RAM for application Privacy Feature 1.2 √ code, data patches Slave-initiated feature exchange √ • On-chip balun, antenna switch, LNA, DC-DC converter • Operational Voltage: 1.8V to 3.6V Extended Reject Indication √ • BLE TX peak power consumption: 3.6mA (@0dBm) Connection parameter request √ • BLE RX peak power consumption: 3.3mA • On-chip silicon oscillator for sleep mode LE Credit based Flow Control √ • Deep sleep mode: Less than 50nA (@3.0V) LE Data Channel √ • Transmitter Output Power: 0dBm to -20dBm (4dBM steps) • RX Sensitivity: -93dBm (typ.) Act as LE slave to more than 1 master √ • Operating Temperature Range: -40°C to 85°C LE Read local P-256 key √ • Package: 40pin QFN 5mm x 5mm 0.4 mm pitch, or 60pin QFN 7mm x 7mm 0.4 mm pitch LE Generate DHKey √ • Profiles: GATT (Generic Attribute Profile), including server and client functions SMP Signing Key √ • Interfaces: UART (2), SPI & I2C interface, PWM output (4 channels), ADC (6/8 channels), 17/32 programmable IO Generation/resolution of private address √ • Single Wire Debug (SWD) interface

1. Products with the same ratings (currentconsumption of 3.6 milliamps (mA) at 3V in transmitting mode with 0dBm) are the lowest in the industry as of July 14, 2016, Toshiba survey TC35679 ULTRA-LOW CURRENT SINGLE-CHIP CONTROLLER FOR BLUETOOTH LOW ENERGY (4.2) FLASH ROM

The TC35679 achieves extremely low current consumption, it delivers long operating times for applications powered by small coin batteries making it perfectly suited for wearable technology, medical equipment, smartphone accessories and remote controls. TC35679 supports the Bluetooth Low Energy (BLE) 4.2 standard and comes with embedded BLE stack and GATT profile.

KEY BENEFITS

• Flexible system architectures through: • Embedded Bluetooth profile model (API over host UART) • Host or stand alone mode are possible (with embedded Bluetooth stack and profile, external EEPROM needed for stand alone mode application code) • Bluetooth qualified embedded BLE stack and GATT profile for easy Bluetooth product qualification BLOCK DIAGRAM • Ultra-low bill of materials due to very few external components: • System integration is simplified by various on-chip peripherals ARM® UART RF Block CORTEX®-MO • On-chip silicon oscillator for sleep mode removes the need for an external crystal or clock source SPI • Only a small RF circuit is necessary due to built-in discrete LE MaskROM MODEM components I2C • Supports over-the-air (OTA) update of system software SRAM CLK Gen. • The device can operate at voltages between 1.8V and 3.6V making GPIO it suitable for use with various battery types such as coin cell, AAA, ADC or AA DCDC PWM • Various sleep modes and clock options to optimize power consumption • QFN40 packages allow small and cheap form factor designs

FEATURES Features / Profile TC35679 • Bluetooth Low Energy (BLE) 4.2 compliant • Supports BLE GAP central and peripheral mode LE Secure Connections √ • Internal RAM for application code, data patches LE Data Packet Length Extension √ • On-chip balun, antenna switch, LNA, DC-DC converter • Operational Voltage: 1.8V to 3.6V Privacy Feature 1.2 √ • BLE TX peak power consumption: 3.6mA (@0dBm) Slave-initiated feature exchange √ • BLE RX peak power consumption: 3.3mA • On-chip silicon oscillator for sleep mode Extended Reject Indication √ • Deep sleep mode: Less than 50nA (@3.0V) Connection parameter request √ • Transmitter Output Power: 0dBm to -20dBm (4dB steps) • RX Sensitivity: -93dBm (typ.) LE Credit based Flow Control √ • Operating Temperature Range: -40°C to 85°C LE Data Channel √ • Package: 40pin QFN 5mm x 5mm 0.4 mm pitch • Profiles: GATT (Generic Attribute Profile), including server and client Act as LE slave to more than 1 master √ functions • Interfaces: UART (2), SPI & I2C interface, PWM output (4 channels), LE Read local P-256 key √ ADC (6/8 channels), 17 programmable IO LE Generate DHKey √ • Single Wire Debug (SWD) interface SMP Signing Key √

Generation/resolution of private address √ BLUETOOTH DEVELOPMENT TOOLS

Toshiba’s development boards allow designers to develop and test their own Bluetooth software and application designs. Bluetooth SDK and pre-compiled software projects can be obtained by contacting Toshiba team at [email protected]. Receipt of e-mail and successful execution of a mutual NDA are prerequisites before Toshiba releases the software package.

BLUETOOTH SMART DEVELOPMENT BOARDS FOR TC35678/ TC35679 The EVAL-BOARD-TC35678-00X Bluetooth evaluation and development board enables quick and easy use of Toshiba Bluetooth Smart (BLE) chipsets when used in conjunction with Toshiba’s pre-compiled software projects with commercial software development tools such as IAR and Keil/MDK toolchains. Using IAR or Keil/MDK, the evaluation boards allow for debugging over SWD (Serial Wire Debug) using embedded J-Link debuggers. The board comes with 2 USB interfaces – one each for USB power/control as well as debugging using J-Link. These evaluation boards come in multiple options for daughterboard along with a common base board: 1. A daughterboard with 121-pin TC35678/9 BGA chipsets (for development only) with external flash ROM for developing firmware for external, serial EEPROM/flash for TC35679 chipset family. This option uses a rubber ducky antenna 2. A Toshiba reference module board with TC35678 chip in QFN40 or QFN60 packaging mounted on the PCB. These modules utilize Toshiba recommended PCB layout antenna 3. A Toshiba reference module board with TC35679FSG chip and Skyworks’s SKY66111-11 FEM for enhanced transmit power levels. These modules use PCB antenna.

Evaluation System Contents: Daughtercard Options:

• BASEBOARD-BLEV2 • STR-MODULE-TC35678FSG-002 (17 GPIO) • One of Daughtercard options • STR-MODULE-TC35678FXG-002 (32 GPIO) • USB Cable • STR-MODULE-TC35679FSG_FEM • MDK/IAR project sample (with external PA module) • EVAL-BOARD-TC35679XBG-002 (with external flash)

BLUETOOTH SMART REFERENCE DESIGN KITS The REFMODEL-ND-TC356XX are a series of compact hardware and software reference designs with multiple peripheral device support. There are versions of these evaluation kits that come with JTAG/SWD interface for enabling debugging capabilities. These kits may significantly reduce the design time required anytime a developer intends to integrate one or more of following peripherals in the product design. • Light emitting diodes (LEDs) • Liquid crystal display (LCD) • Buzzer • 6-axis, 9-axis accelerometer/gyroscope/magnetometer • Pulse-width-modulation (PWM) controlled devices • External EEPROM for program storage • NFC Tags (on chip tags such as those in TC35670 or external tags)

Contents: Kit Options:

• BT Refmodel kit • REFMODEL-ND-TC35667 • UART cable • REFMODEL-ND-TC35670 • UART to USB conversion board • REFMODEL-ND-TC35676 • HCI tester program • REFMODEL-ND-TC35678 • Micro USB cable BLUETOOTH SOFTWARE SUPPORT

Toshiba offers a Bluetooth SDK with Bluetooth Classic and LE driver software source code (C/C++). The SDK is free of charge for use with Toshiba Bluetooth LSIs. The software can be ported onto any external host processor (linked to the Bluetooth LSI via UART) or used for stand-alone (no host) designs, if the chip firmware supports it. DUAL / SINGLE MODE SDK The software simplifies Bluetooth software development via an abstracted high level API. It allows for fast turn-around times for system integration. It is available for dual mode (SPP & BLE) and SPP BLE single mode (BLE single) devices. It includes various PTS tested BLE profiles as references as well as a Toshiba SPPoverBLE SPP Demo Application BLE Demo Application profile. The SDK shows how a software engineer may create BLE Profile their own BLE profiles using reference examples and related SPP API instructions. Toshiba will also launch a plug-in for the Blutooth BLE API

SIG developer Studio. It can be ported to system host controllers StoreKey TCU Classic Drivers TCU BLE Drivers or used for a standalone solution. The SDK can be used with or without RTOS. It is hardware platform independant (LSI, Module, Porting Layer

Starterkit, Development Kits, Beacons etc.). Android client SoftwareHost reference apps are available, too.

To support the embedded NFC function, the SDK also includes the software interface to control and exchange data with the Bluetooth LSI Firmware HW embedded NFC tag in different modes.

To inquire about SDK availability, please e-mail us at [email protected] SYSTEM SOLUTIONS

Toshiba offers complete form factor solutions including hardware, software and bil of materials details for easy re-use, modification or direct implementation into customer designs. BLUETOOTH LE SCATTERNET CONCEPT

SCATTERNET LIGHTING SYSTEM BLUETOOTH LE SCATTERNET CONCEPT WITH TC35670

• Scatternet Bluetooth LE solution for lighting systems NODE S • Multiple master (scanning) and multiple slave (advertising) configuration S • Access by multiple controllers possible M • Node set up via embedded NFC interface M M S • Embedded into standalone Bluetooth LE devices NODE NODE S M M M S S

NODE NODE

Set-up nodes via NFC Bluetooth Smart® Slave (S) advertising NODE NFC Master (M) scanning

BLUETOOTH LE & NFC TAG REFERENCE BEACON REFERENCE MODEL MODEL WITH TC35670 WITH TC35670

• Standalone solution • Standalone solution • Built-in EEPROM for Application Code (512kbit) • Built-in EEPROM for Application Code (512Kbit) • Built-in multi sensors • Built-in 6-axis sensor • BLE chip antenna & NFC antenna • Antenna for Bluetooth and NFC Tag • Coin battery (CR2032/2025) • Coin battery (CR2032) power supply • Case size: Ø 30mm • Case size: 75mm x 35mm x 12mm • PCB size: Ø 25mm, 4 layers • Various standalone application codes available • Standalone application codes available • Android client application available • Coin battery (CR2032) power supply • Case size: 75mm x 35mm x 12mm • Various standalone application codes available For further information on Toshiba semiconducter products and solutions and local sales information, please visit: www.toshiba.semicon-storage.com

The Bluetooth® word mark, Bluetooth Smart, and logos are registered trademarks of Bluetooth SIG, Inc.

NFC Forum and the NFC Forum logo are trademarks of the Near Field Communication Forum.

ARM® is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. Windows is a registered trademark of Microsoft Corporation in the United States and other countries. Android is a trademark of Google Inc. Copyright 2017 Toshiba America Electronic Components, Inc. Product specifications are all subject to change without notice. Product design specifications and colours are subject to change without notice and may vary from those shown. Errors and omissions excepted. 01/01/2017