Issue 2017 | 01 BLUETOOTH SILICON AND SOFTWARE FOR WIRELESS COMMUNICATION SINGLE CHIP SOLUTIONS FOR THE UTMOST FLEXIBILITY BLUETOOTH ICs FOR COMPACT AND ULTRA-LOW POWER DESIGNS Toshiba offers an all-in-one solution for high quality Bluetooth® ICs with stable, reliable Bluetooth profiles. Benefitting from over 15 years’ experience, Toshiba’s Bluetooth ICs offer low power solutions with both Bluetooth Classic and Low Energy line-ups of firmware. Toshiba’s devices realize an easy way to integrate Bluetooth for various industrial, medical, smart home, wearable and automotive applications. All Toshiba Bluetooth devices and embedded software are Bluetooth Qualification Expert (BQE) qualified. The next generation of devices will also support the new Bluetooth 4.2 standard. • Embedded Bluetooth stack and selected profiles • Proven interoperability • Suitable for a variety of application scenarios • High-quality, cost-effective Bluetooth-compliant designs • Low power consumption TC35678 TC35679 TC35670 / TC35675 The TC35678 supports the Bluetooth TC35679 supports the Bluetooth Low The TC35670 and TC35675 Bluetooth NFC Low Energy (BLE) 4.2 standard. The Energy (BLE) 4.2 standard and comes Combo devices support the BT Low Energy TC35678 is suitable for ultra-low power with embedded BLE stack and GATT (LE) 4.1 standard and include an NFC portable products and comes with profile. The TC35679 achieves extremely Forum compliant Tag Class 3. embedded BLE stack and GATT profile. low current consumption, it delivers long Easy Bluetooth pairing through NFC and TC35678 is available in both QFN40 and operating times for applications powered connection setup enables ease of use at QFN60 packages. The QFN60 package by small coin batteries making it perfectly very low power. An active NFC device may extends the number of general purpose suited for wearable technology, medical switch on the Bluetooth LSIs with zero IO from 17 to 32 making it suitable for equipment, smartphone accessories and battery power use. The devices are suitable use in equipment such as keyboards remote controls. for ultra low power portable products and and remote controls that require a large come with embedded BLE stack and GATT number of control pins. profile. An over-the-air (OTA) software update service can be realized. Both devices can be used with a host or in a standalone configuration. The TC35675 also includes embedded Flash Memory to remove the need for external EEPROM memory in standalone mode. TC35667/ TC35676 TC35661 The TC35667 and TC35676 are highly The TC35661 is dual mode, it supports integrated RFCMOS Bluetooth devices both the Bluetooth Classic (3.0 + EDR) that support the BT Low Energy (LE) 4.1 and the new BT Low Energy (LE) 4.2 standard. Both devices are suitable for ultra standard. TC35661SBG supports the low power portable products. The devices standard Bluetooth HCI interface and come with an embedded BLE stack offers integration of stack and selected BT and GATT profile. An over-the-air (OTA) profiles on-chip as well. The device offers software update service can be realized. simple Bluetooth integration for various Both devices can be used with a host or industrial, medical, smart home, wearable in a standalone configuration. TC35676 and automotive applications. The device is also includes embedded Flash Memory also automotive qualified (AECQ100). to remove the need for external EEPROM memory in standalone mode. TC35670 / TC35675 SINGLE CHIP CONTROLLER FOR BLUETOOTH LE (4.1) + NFC TAG The NFC Tag built into the TC35670 and TC35675 can wake up the BLE devices from sleep mode through the NFC antenna and initiate easy Bluetooth pairing after confirmation of the BT device address. This connection setup enables ease of use and a very long battery life. TC35670 and TC35675 are suitable for ultra low power portable products and come with embedded BLE stack and GATT profiles. KEY BENEFITS FEATURES • Allows the extension of battery lifetimes by supporting wake up • Bluetooth Low Energy (BLE) 4.1 compliant with 0 standby current. The integration of an NFC Tag and • Supports BLE GAP central and peripheral mode Bluetooth LSI allows the Bluetooth circuit to be off until woken up • by an active NFC controller signal from another device. Internal RAM for application code, data patches • TC35675: Embedded 192KB Flash Memory • Easy pairing initialization or safe out-of-band pairing, and transfer of small amounts of data with NFC Forum compliant Tag • Wake up signal from NFC tag for Bluetooth host device • Exchange of data with NFC Tag EEPROM without waking up the • Tag communication: NFC Type 3 Tag (ISO/IEC18092) Bluetooth circuit • Tag communication speed: 212kbps / 424kbps automatic • Flexible system architectures through: switchover • Embedded Bluetooth profile model (API over host UART) • On-chip 2KB EEPROM accessible from Bluetooth controller • Stand alone model (with embedded Bluetooth stack and or NFC antenna profile, no host needed) • Tag Security: Mutual recognition by Triple DES MAC (MAC: Message Authentication Code) • Bluetooth qualified embedded BLE stack and GATT profile for easy Bluetooth product qualification • On-chip balun, antenna switch, LNA, DC-DC converter • Ultra-low bill of materials due to very few external components: • Operational Voltage: 1.8V to 3.6V • With TC35675 no external EEPROM memory is needed • BLE peak power consumption: 6.3mA (depends on selected due to on-chip Flash clocking scheme and data mode) • System integration is simplified by various on-chip • Deep sleep mode: 0.05µA; sleep mode 15µA peripherals • Peak current in operation mode: 6.3mA • Only a small RF circuit is necessary due to built-in • Tag Operational Mode: 600µA discrete components • Transmitter Output Power: 0dBm to -20dBm (4dB steps) • An over-the-air (OTA) software update service can be realized • RX Sensitivity: -92dBm (typ.) • The device can operate at voltages between 1.8V and 3.6V • Operating Temperature Range: TC35670 is -30 to 85C; making it TC35675 is -40 to 85 suitable for use with various battery types such as coin cell, • AAA or AA TC35670 Package: 40pin QFN 6mm x 6mm x 0.5mm pitch, 0.9mm height • Various sleep modes and clock options to optimize power • consumption TC35675 Package: 52pin FBGA 4.5mm x 4.5mm, 0.5mm pitch, 1.2mm height • QFN40/FBGA52 package allows small form factor designs • Profiles: GATT (Generic Attribute Profile), including server and client functions • Interfaces: UART (2), SPI & I2C interface, PWM output BLOCK DIAGRAM (3channels), ADC (4 channels), 7 programmable IO RF Block ARM® CPU UART GPIO5 GPIO4 GPIO3 DCDCEN VDDIO TMODE1 RESETX GPIO2 GPIO1 GPIO0 30 29 28 27 26 25 24 23 22 21 I2C / SPI GPIO6 31 20 GPIO15 LE MaskROM TMODE2 32 19 GPIO14 MODEM 18 ADC GPIO9 33 SLPXOIN SRAM GPIO10 34 17 SLPXOOUT 16 CLK Gen. GPIO GPIO11 35 VDD12D 15 VDD Flash GPIO12 36 14 DCDOOUT DCDC Memory* PWM GPIO13 37 13 GPIO7 38 VDD15IN 12 XOIN GPIO8 39 11 XOOUT NFC Tag VPGM 40 NFC Tag SRAM Logic Analog 1 2 3 4 5 6 7 8 9 10 Block I2C EEPROM VSSX VSSA1 VSSA2 RFIO_P RFIO_N VDD12X TRTEST1 TRTEST2 VDD12A1 VDD12A2 *TC35675 Only TC35670 Example TC35661 SINGLE CHIP CONTROLLER FOR BLUETOOTH CLASSIC (3.0 + EDR) AND BLUETOOTH LE (4.2) The device delivers an easy way to integrate Bluetooth for various industrial, medical, wearable and automotive applications. KEY BENEFITS • Dual Mode core for classic and new Bluetooth 4.2 standard • BQE qualified hardware and software for easy Bluetooth EPL System System Product ID (*) Configuration • Flexible system architectures through: • HCI model BT 4.2 HCI standard HCI TC35661-009 • Embedded stack and profile model • Standalone model (with embedded stack and profile) SPP (with EDR) TC35661-203 BT 4.2 Embedded Profile • Embedded on-chip Bluetooth stack and selected profiles for SPP+BLE GATT TC35661SBG-503 easy Bluetooth system design BT 4.2 with LE secure connections SPP+BLE GATT TC35661SBG-551 • Stand alone operation with embedded SPP or HID profile for small applications is feasible without a host MCU • Ultra low bill of materials due to very few external components • Multiple programmable IO and peripheral options • On-chip voltage controller and low power modes • Consumer and automotive qualification (AEC-Q100) (*) Subject to firmware updates. Subject to change without notice FEATURES TC35661SBG (FBGA64) • Bluetooth Core Spec 3.0 and 4.2, EDR and LE support • TC35661–00X: HCI type RF BLOCK • TC35661–XXX: embedded profile type UART Class 2 • BT Class 2 support ARM® CPU • RX Sensitivity –91dBm (typ.) 13–52 MHZ • EDR / LE Baseband with ARM® CPU - 13 to 52 MHz USB 2.0 • On–chip ROM, RAM, including Patch–RAM Modem • On–chip balun, antenna switch, LNA, LDO • Interfaces: UART, SPI, USB2.0(FS), I2C, I2S/PCM, GPIO I2C, I2S • ROM Data transfer up to 2 Mbps (DH5 packets) net SPI • Package: 64ball BGA (ROM version), 0.5/0.8mm pitch, 1.2/1.4mm height • Operational voltage: 1.8V or 3.3V (typ.) GPIO SRAM • Low power sleep mode 30uA (max) • Operation current well below 30mA (depends on packet type and selected operational mode) • AEC-Q100 automotive qualification (0.8mm pitch) HCI SYSTEM CONCEPT TC35661-00X The Bluetooth HCI (host controller interface) model: 26 MHz HOST OSC the low layer stack (RF, LC, LM) runs on the TC35661 RF Analog PROCESSOR device for both Bluetooth Classic and BLE (4.0). SLEEP CLK for v4.0, EDR & LE Through a UART or USB it is connected to an 1.2V LDO external host processor, which executes the upper UART (HCI) Bluetooth stack (L2CAP, RFCOMM) and profiles. BT STACK / UART PROFILE Beyond the upper stack the host processor runs the USB (HCI) EDR + LE USB 2.0 application software. This application processor may Modem Middleware also run additional tasks such as middleware and EEPROM 2 ® (optional) I C ARM CPU multimedia functions.