DOCSLIB.ORG

Intel® Celeron® Processor 400 Series

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Intel® Celeron® Processor 400 Series Intel® Celeron® Processor 400 Series Datasheet — Supporting the Intel® Celeron® processor 420 , 430 , 440 , and 450 August 2008 Document Number: 316963-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/ processor_number for details. Intel® 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64. Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http://www.intel.com/technology/intel64/index.htm for more information including details on which processors support Intel 64, or consult with your system vendor for more information. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Celeron® processor 400 series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Celeron, Pentium, Intel Core, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2007–2008 Intel Corporation. 2 Datasheet Contents 1 Introduction ..............................................................................................................9 1.1 Terminology .......................................................................................................9 1.1.1 Processor Packaging Terminology ............................................................. 10 1.2 References ....................................................................................................... 11 2 Electrical Specifications ........................................................................................... 13 2.1 Power and Ground Lands.................................................................................... 13 2.2 Decoupling Guidelines........................................................................................ 13 2.2.1 Vcc Decoupling ...................................................................................... 13 2.2.2 Vtt Decoupling ....................................................................................... 13 2.2.3 FSB Decoupling...................................................................................... 14 2.3 Voltage Identification......................................................................................... 14 2.4 Market Segment Identification (MSID) ................................................................. 16 2.5 Reserved, Unused and TESTHI Signals ................................................................. 16 2.6 Voltage and Current Specification ........................................................................ 17 2.6.1 Absolute Maximum and Minimum Ratings .................................................. 17 2.6.2 DC Voltage and Current Specification ........................................................ 19 2.6.3 Vcc Overshoot ....................................................................................... 21 2.6.4 Die Voltage Validation ............................................................................. 22 2.7 Signaling Specifications...................................................................................... 22 2.7.1 FSB Signal Groups.................................................................................. 23 2.7.2 CMOS and Open Drain Signals ................................................................. 25 2.7.3 Processor DC Specifications ..................................................................... 25 2.7.3.1 GTL+ Front Side Bus Specifications ............................................. 27 2.8 Clock Specifications ........................................................................................... 28 2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 28 2.8.2 FSB Frequency Select Signals (BSEL[2:0])................................................. 29 2.8.3 Phase Lock Loop (PLL) and Filter .............................................................. 29 2.8.4 BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 30 2.8.5 BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 32 2.9 PECI DC Specifications ....................................................................................... 34 3 Package Mechanical Specifications .......................................................................... 35 3.1 Package Mechanical Drawing............................................................................... 35 3.2 Processor Component Keep-Out Zones................................................................. 39 3.3 Package Loading Specifications ........................................................................... 39 3.4 Package Handling Guidelines............................................................................... 39 3.5 Package Insertion Specifications.......................................................................... 40 3.6 Processor Mass Specification ............................................................................... 40 3.7 Processor Materials............................................................................................ 40 3.8 Processor Markings............................................................................................ 40 3.9 Processor Land Coordinates ................................................................................ 41 4 Land Listing and Signal Descriptions ....................................................................... 43 4.1 Processor Land Assignments ............................................................................... 43 4.2 Alphabetical Signals Reference ............................................................................ 66 5 Thermal Specifications and Design Considerations .................................................. 75 5.1 Processor Thermal Specifications ......................................................................... 75 5.1.1 Thermal Specifications ............................................................................ 75 5.1.2 Thermal Metrology ................................................................................. 78 5.2 Processor Thermal Features ................................................................................ 78 5.2.1 Thermal Monitor..................................................................................... 78 Datasheet 3 5.2.2 Thermal Monitor 2 ..................................................................................79 5.2.3 On-Demand Mode...................................................................................80 5.2.4 PROCHOT# Signal ..................................................................................81 5.2.5 THERMTRIP# Signal ................................................................................81 5.3 Thermal Diode...................................................................................................82 5.4 Platform Environment Control Interface (PECI) ......................................................84 5.4.1 Introduction...........................................................................................84
Load more

Recommended publications
  • Dual-Core Intel® Xeon® Processor 3100 Series Specification Update
    Dual-Core Intel® Xeon® Processor 3100 Series Specification Update — on 45 nm Process in the 775-land LGA Package December 2010 Notice: Dual-Core Intel® Xeon® Processor 3100 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this Specification Update. Document Number: 319006-009 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system.
    [Show full text]
  • Microcode Revision Guidance August 31, 2019 MCU Recommendations
    microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment.
    [Show full text]
  • Single Board Computer
    Single Board Computer SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) SBC-C66 and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs High-performing, flexible solution for intelligence at the edge HIGHLIGHTS CONNECTIVITY CPU 2x USB 3.1; 4x USB 2.0; NVMe SSD Slot; PCI-e x8 Intel® 8th gen. Core™ / Xeon® and 9th gen. Core™ / port (PCI-e x16 mechanical slot); VPU High Speed Xeon® / Pentium® / Celeron® CPUs Connector with 4xUSB3.1 + 2x PCI-ex4 GRAPHICS MEMORY Intel® UHD Graphics 630/P630 architecture, up to 128GB DDR4 memory on 4x SO-DIMM Slots supports up to 3 independent displays (ECC supported) Available in Industrial Temperature Range MAIN FIELDS OF APPLICATION Biomedical/ Gaming Industrial Industrial Surveillance Medical devices Automation and Internet of Control Things FEATURES ® ™ ® Intel 8th generation Core /Xeon (formerly Coffee Lake H) CPUs: Max Cores 6 • Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Max Thread 12 HyperThreading • Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Intel® QM370, HM370 or CM246 Platform Controller Hub Chipset Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), (PCH) with HyperThreading • Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB 2x DDR4-2666 or 4x DDR4-2444 ECC SODIMM Slots, up to 128GB total (only with 4 SODIMM modules). Cache, 45W TDP (35W cTDP) Memory ® ™ ® ® ECC DDR4 memory modules supported only with Xeon Core Information subject to change. Please visit www.seco.com to find the latest version of this datasheet Information subject to change.
    [Show full text]
  • "PCOM-B216VG-ECC.Pdf" (581 Kib)
    Intel® Arrandale processor based Type II COM Express module support ECC DDR3 SDRAM PCOM-B216VG-ECC with Gigabit Ethernet 204pin ECC DDR3 SODIMM socket ® Intel QM57 ® Intel Arrandale processor FEATURES GENERAL CPU & Package: Intel® 45nm Arrandale Core i7/i5/i3 or Celeron P4505 ® Processor The Intel Arrandale and QM57 platform processor up to 2.66 GHz with 4MB Cache in FC-BGA package with turbo boost technology to maximize DMI x4 Link: 4.8GT/s (Full-Duplex) CPU & Graphic performance Chipset/Core Logic Intel® QM57 ® Intel Arrandale platform support variously System Memory Up to 8GB ECC DDR3 800/1066 SDRAM on two SODIMM sockets powerful processor from ultra low power AMI BIOS to mainstream performance type BIOS Storage Devices SATA: Support four SATA 300 and one IDE Supports Intel® intelligent power sharing Expansion Interface VGA and LVDS technology to reduce TDP (Thermal Six PCI Express x1 Design Power) LPC & SPI Interface High definition audio interface ® ® Enhance Intel vPro efficiency by Intel PCI 82577LM GbE PHY and AMT6.0 Hardware Monitoring CPU Voltage and Temperature technology Power Requirement TBA Support two ECC DDR3 800/1066 SDRAM on Dimension Dimension: 125(L) x 95(W) mm two SODIMM sockets, up to 8GB memory size Environment Operation Temperature: 0~60 °C Storage Temperature: -20~80 °C Operation Humidity: 5~90% I/O ORDERING GUIDE MIO N/A IrDA N/A PCOM-B216VG-ECC ® Standard Ethernet One Intel 82577LM Gigabit Ethernet PHY Intel® Arrandale processor based Type II COM Express module with ECC DDR3 SDRAM and Audio N/A Gigabit Ethernet USB Eight USB ports Keyboard & Mouse N/A CPU Intel® Core i7-610E SV (4M Cache, 2.53 GHz) Support List Intel® Core i7-620LE LV (4M Cache, 2.00 GHz) Intel® Core i7-620UE ULV (4M Cache, 1.06 GHz) Intel® Core i5-520E SV (3M Cache, 2.40 GHz) Intel® Celeron P4505 SV (2M Cache, 1.86 GHz) DISPLAY Graphic Controller Intel® Arrandale integrated Graphics Media Accelerator (Gen 5.75 with 12 execution units) * Specifications are subject to change without notice.
    [Show full text]
  • HP 250 Notebook PC
    HP 250 Notebook PC Our value-priced notebook PC with powerful essentials ideal for everyday computing on the go. HP recommends Windows. Built for mobile use Designed for productivity For professionals on the move, the HP 250 features a Connect with colleagues online and email from the durable chassis that helps protect against the rigors of office or from your favorite hotspots with Wi-Fi the day. CERTIFIED™ WLAN.5 Carry the HP 250 from meeting to meeting. Enjoy great From trainings to sales presentations, view high-quality views on the 15.6-inch diagonal HD2 display, without multimedia and audio right from your notebook with sacrificing portability. preinstalled software and the built-in Altec Lansing speaker. Powered for business Tackle projects with the power of the Intel® third Make an impact with presentations when you connect 2 6 7 generation Core™ i3 or i5 dual-core processors.3 to larger HD displays through the HDMI port. Develop stunning visuals without slowing down your notebook, thanks to Intel’s integrated graphics. 4 HP, a world leader in PCs brings you Windows 8 Pro designed to fit the needs of business. HP 250 Notebook PC HP recommends Windows. SPECIFICATIONS Operating system Preinstalled: Windows 8 644 Windows 8 Pro 644 Ubuntu Linux FreeDOS Processor 3rd Generation Intel® Core™ i5 & i33; 2nd Generation Intel® Core™ i33; Intel® Pentium® 3; Intel® Celeron® 3 Chipset Mobile Intel® HM70 Express (Intel® Pentium® and Celeron® processors) Mobile Intel® HM75 Express (Intel® Core™ i3 and i5 processor) Memory DDR3 SDRAM (1600 MHz)
    [Show full text]
  • Discover, Develop, Deliver with the New Intel® Celeron® Processor
    Product Brief The New Intel® Celeron® Processor THE NEW INTEL® CELERON® PROCESSOR DISCOVER DEVELOP DELIVER The new Intel® Celeron® processor built around Intel’s latest microarchitecture and manufactured on Intel’s state-of-the-art 14nm process technology delivers Intel level performance that lets you enjoy entertainment and get your work done. Get performance and value you can count on with an Intel Celeron processor. When paired with the latest Intel® H110 Chipset, Intel Celeron processor-based PCs are an ideal choice for editing photos one minute and watching movies the next, and going from spreadsheets to gaming in a flash. That’s serious processing. Only with Intel Inside®. Product Brief The New Intel® Pentium® MAKES VIDEO CREATION AND TECHNOLOGY The new 14nm Intel Celeron processor brings support for the latest CONVERSION technologies such as DDR4 RAM memory that enables PCs to have a high memory data transfer speed at a lower power as compared to FAST AND EASY DDR3. Intel HD graphics 510 delivers some great graphics with support up to 4K resolution and 3 independent displays. Intel Quick Sync Video technology delivers amazing hardware acceleration that makes video conversion and creation fast and easy. 2 INTEL ® CELERON® PROCESSOR FEATT URES A A GLANCE INTEL ® CELERON® G39XX FEATURES BENEFITS Socket LGA 1151 Dual-Core Runs two independent processor cores in Manufacturing 14nm Processing one physical package at the same frequency. Process Intel® Smart The shared cache is dynamically allocated Processor Base Up to 2.9 GHz Cache to each processor core, based on workload. Frequency on G39XX Efficient last-level cache data usage and instant communication between the core Intel® Smart Cache 2 MB L3 shared and memory.
    [Show full text]
  • The Intel X86 Microarchitectures Map Version 2.0
    The Intel x86 Microarchitectures Map Version 2.0 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • Variant: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128
    [Show full text]
  • Demystifying Intel® Ivy Bridge Microarchitecture
    Presented at the Research Congress 2013 De La Salle University Manila March 7-9, 2013 DEMYSTIFYING INTEL® IVY BRIDGE MICROARCHITECTURE Roger Luis Uy College of Computer Studies, De La Salle University Abstract: Tick-Tock is a model introduced by Intel ® Corporation in 2006 to show the improvement of its chip development. Every “tick” is the die-shrink of the current microarchitecture, while every “tock” is the new microarchitecture. During the 2nd quarter of 2012, Ivy Bridge Microarchitecture was introduced as the 22-nm die shrink (the “tick”) of the Sandy Bridge microarchitecture (the “tock”). Ivy Bridge-based microprocessors are multi- core processor which place emphasis on minimizing thermal dissipation of processor and providing architecture innovation rather than raw processor speed. Ivy Based-processor comes in three variations – for desktop, for mobile and for server usage. Difference among them lies in the number of core in a processor, the clock frequency, the Thermal Design Power (TDP), the cache memory size and architectural innovations. This research paper will survey the Ivy Based-processor and classify them accordingly. Survey will be based from the Intel’s official website (ark.intel.com). At the same time, independent website (www.cpu-world.com) will be used to counter- check the specifications and to obtain additional information. A freeware software, called CPU-Z (www.cpuid.com) is used to gather information of the processor and provide information such as the name and number of the processor, internal and external clock rate, clock multiplier, supported instructions and cache information. Once the survey and classification is done, we can gain information on which type of applications can be used on which type of microprocessor.
    [Show full text]
  • Ideacentre AIO 520 (22") Intel F0D500C9PB
    ideacentre AIO 520 (22") Intel F0D500C9PB Region Microphone www.lenovo.com EET Dual Array This publication was developed for products and Country HDMI services offered in the United States and E.M.E.A Poland HDMI-in countries. Lenovo may not offer the products, services or features discussed in this document in Machine Type WLAN + Bluetooth other countries. Lenovo may withdraw an offering at F0D5 11ac, 1x1 + BT4.0 any time. Information is subject to change without notice. Consult your local representative for information on offerings available in your area. Processor Keyboard / Mouse Lenovo reserves the right to change specifcations or Core i5-8250U (4C, 1.6 / 3.4GHz, 6MB) 2.4G Silver / 2.4G Silver other product information without notice. Lenovo is not responsible for photographic or typographical Graphics Power Supply errors. Lenovo provides this publication “as is” Integrated Intel UHD Graphics 620 90W Adapter without warranty of any kind, either express or implied, including the implied warranties of Chipset Operating System merchantability or ftness for a particular purpose. Intel SoC Platform Windows 10 Home 64 Memory Warranty 8GBx1 2-year, Depot http://psref.lenovo.com Visit psref website for the latest version of Storage Ann Date (mm/yy) Product Specifcations Reference. 1TB 7200rpm 02/18 © Lenovo, 2018. All rights reserved. Optical DVD±RW Media Reader 3-in-1 Note: Country Code "US" is for United States, "++" is for EMEA Display countries (e.g. AD - Saudi, Arabia, AT - Austria, BM - Bulgaria, 21.5" FHD (1920x1080) IPS etc.), "xx" is for EAST countries (e.g. BM - Bulgaria, CX - Hungary, CY - Cyprus, etc.), and "**" is for MEA countries (e.g.
    [Show full text]
  • The Intel X86 Microarchitectures Map Version 2.2
    The Intel x86 Microarchitectures Map Version 2.2 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • New instructions: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128
    [Show full text]
  • T H I N K P a D X 1 T H E S T R E S S T E S
    THINKPAD X1 THE STRESS TESTS Bring on the storm. The military-spec tested ThinkPad X1 Yoga with dust-resistant technology. Different endures better. X1 YOGA Available at lenovo.com/think Intel® Core™ i7 vPro™ processor Dramatization. Parameters used for actual test: Computer and fan operating, common household dust; not sand or other heavy particulates. Abuse like this is not covered under warranty. Ultrabook, Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, Xeon Phi, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries. Dear gravity, our condolences. The military-spec tested ThinkPad X1 Tablet with Gorilla Glass. Different survives better. X1 TABLET Available at lenovo.com/think Intel® Core™ i7 vPro™ processor Dramatization. Parameters used for actual test: Drop height 12 inches, corner impact, onto cement stair. Abuse like this is not covered under warranty. Ultrabook, Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, Xeon Phi, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries. ‘Oops’ resistant. The military-spec tested ThinkPad X1 Carbon with spill-resistant keyboard. Different protects better. X1 CARBON Available at lenovo.com/think Intel® Core™ i7 vPro™ processor Dramatization. Parameters used for actual test: 1 Liter of fresh cold water poured directly onto keyboard. Abuse like this is not covered under warranty.
    [Show full text]
  • Intel® Celeron® Processor in the 478-Pin Package up to 1.80 Ghz Datasheet
    Intel® Celeron® Processor in the 478-Pin Package up to 1.80 GHz Datasheet I Available at 1.70 and 1.80 GHz I Level 1 Execution Trace Cache stores 12K I Binary compatible with applications micro-ops and removes decoder latency running on previous members of the Intel from main execution loops microprocessor line I 128 KB Advanced Transfer Cache (on-die, I System bus frequency at 400 MHz. full speed Level 2 (L2) cache) with Error Correction Code (ECC) I Rapid Execution Engine: Arithmetic Logic Units (ALUs) run at twice the processor I 144 Streaming SIMD Extensions 2 (SSE2) core frequency. Instructions I Hyper Pipelined Technology. I Power Management capabilities I Advanced Dynamic Execution —System Management mode —Very deep out-of-order execution —Multiple low-power states —Enhanced branch prediction I Optimized for 32-bit applications running on advanced 32-bit operating systems I 8 KB Level 1 data cache The Intel® Celeron® processor in the 478-pin package up to 1.80 GHz expands Intel’s processor family into the value-priced PC market segment. Intel Celeron processors provide the value customer the capability to affordably get onto the Internet, and utilize educational programs, home-office software and productivity applications. All of Intel’s Celeron processors include an integrated L2 cache, and are built on Intel's advanced CMOS process technology. The Intel Celeron processor is backed by over 30 years of Intel experience in manufacturing high-quality, reliable microprocessors. June 2002 Document Number: 290748-002 Information in this document is provided solely to enable use of Intel products.
    [Show full text]