Intel® Celeron® Processor Specification Update

Total Page:16

File Type:pdf, Size:1020Kb

Intel® Celeron® Processor Specification Update ® ® Intel Celeron Processor Specification Update Release Date: August 2007 Document Number: 243748-051 The Intel® Celeron® processor may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are documented in this Specification Update. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Mobile Intel® Celeron® Processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Pentium, Celeron, Intel Xeon and the Intel logo are trademarks or registered trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries*Other names and brands may be claimed as the property of others. Copyright © 2007, Intel Corporation. All rights reserved. CONTENTS REVISION HISTORY....................................................................................................................................... ii PREFACE ....................................................................................................................................................... vi ® ® Specification Update for the Intel Celeron Processor................................................................................... 1 GENERAL INFORMATION.............................................................................................................................. 1 Intel® Celeron® Processor and Boxed Intel® Celeron® Processor Markings (S.E.P. Package).................... 1 Intel® Celeron® Processor and Boxed Intel® Celeron® Processor Markings (PPGA Package).................... 2 Intel® Celeron® Processor and Boxed Intel® Celeron® Processor Markings (FC-PGA/FC-PGA2 Package) 3 IDENTIFICATION INFORMATION .................................................................................................................. 4 SUMMARY OF CHANGES............................................................................................................................ 11 Summary of Errata ..................................................................................................................................... 12 Summary of Documentation Changes ....................................................................................................... 21 Summary of Specification Clarifications..................................................................................................... 23 Summary of Specification Changes ........................................................................................................... 24 ERRATA ........................................................................................................................................................ 25 DOCUMENTATION CHANGES .................................................................................................................... 79 SPECIFICATION CHANGES......................................................................................................................... 99 i INTEL® CELERON® PROCESSOR SPECIFICATION UPDATE REVISION HISTORY Date of Revision Version Description April 1998 -001 This document is the first Specification Update for the Intel® Celeronc processor. May 1998 -002 Added Errata 24 through 28. June 1998 -003 Updated S-spec Table. Updated Summary Table of Changes. Updated Erratum 2 and 26. Added Errata 29 and 30. Added Documentation Changes 7 through 12. Added Specification Clarification 6 and 7. July 1998 -004 Updated S-spec Table. Added Documentation Changes 13 through 16. Added Specification Clarifications 7 through 12. Added Specification Change 1. August 1998 -005 Updated Summary Table of Changes. Changed numbering in order to maintain consistency with other product Specification Updates. Updated Errata 6 and 38. Added Errata 56 through 59. Updated Specification Clarification 5. September 1998 -006 Updated S-spec table. Updated Erratum 56. Added Errata 60 through 62. October 1998 -007 Implemented new numbering nomenclature. Updated Errata C1 and C27. Added Errata C37 through C39. Added Specification Clarification C15. Added Specification Change C2. November 1998 -008 Updated Erratum C23. Added Erratum C40. Updated Documentation Change C10. Added Documentation Changes C17 and C18. Added Specification Change C3. December 1998 -009 Added the Celeron processor (PPGA) markings. Added the Mb0 stepping to the Processor Identification Information table and the Table of Changes. Added Errata C41 and C42. December 1998 -010 Updated Identification Information table January 1999 -011 Added Erratum C3AP. Added Documentation Changes C19 and C20. Updated Processor Identification Information table. February 1999 -012 Updated Processor Identification Information table. March 1999 -013 Updated Processor Markings, Summary Table of Changes, Documentation Changes, Specification Clarifications, and Specification Changes sections. Added Specification Change C1. May 1999 -014 Updated the Processor Identification Information table. Added Erratum C43. June 1999 -015 Added Erratum C44. Added Documentation Change C1. Added Specification Clarifications C2 and C3. Added Specification Change C1. July 1999 -016 Added Erratum C45. ii INTEL® CELERON® PROCESSOR SPECIFICATION UPDATE REVISION HISTORY Date of Revision Version Description August 1999 -017 Added Documentation Change C2. Updated Preface paragraph. Updated Codes Used in Summary Table. Updated column heading in Errata, Documentation Changes, Specification Clarifications and Specification Changes tables. October 1999 -018 Added ‘Brand Id’ to Identification Information table. Updated Processor Identification Information Table. Added Errata C46. November 1999 -019 Added Errata C47 and C48. Added Documentation Change C3. December 1999 -020 Added Errata C49. Added Documentation Change C4. Added Specification Clarification C4. January 2000 -021 Added Errata C50 and C51. Added Documentation Change C5. February 2000 -022 Added Documentation Change C6. Updated Summary of Changes product letter codes. March 2000 -023 Updated Erratum C47. Updated the CPUID/Stepping information in the Summary of Changes section. May 2000 -024 Updated the Intel® Celeron® Processor Identification Information table. Added Errata C52 – C69. Updated the Summary of Errata, Summary of Documentation Changes, Summary of Specification Clarifications and Summary of Changes tables. Added Specification Change C2. June 2000 -025 Added Specification Change C3. July 2000 -026 Added Errata C70 and C71. August 2000 -027 Updated Processor Identification Information table. Added Erratum C72. September 2000 -028 Updated the Intel® Celeron® Processor Identification Information table. Added Erratum C73. Updated Errata C33 ,C47 and C51. Added Documentation changes C7 and C8. October 2000 -029 Added Erratum C74. Added Documentation Changes C9 and C10 November 2000 -030 Updated the Intel® Celeron® Processor Identification Information table Added Errata C75 and C76. December 2000 -031 Updated Specification Update product key to include the Intel® Pentium® 4 processor, Updated Erratum C2. Added Documentation changes C11, C12, C13, C14, C15 and C16. January 2001 -032 Updated the Intel® Celeron® Processor Identification Information table, Updated Erratum C2. Added Documentation changes C17 and C18. February 2001 -033 Updated Documentation change C17. Added Documentation change C19. March 2001 -034 Updated Summary of Errata, Summary of Documentation Changes, Summary of Specification Clarifications and Summary of Specification Changes tables. Added Errata C77 and C78. iii INTEL® CELERON® PROCESSOR SPECIFICATION UPDATE REVISION HISTORY Date of Revision Version Description July 2001 -035 Updated the Intel® Celeron® Processor Identification Information table. Updated the Summary of Errata table. August 2001 -036 Added Errata C79 and C80. Updated the Summary of changes section. August 2001 -037 Out of cycle release. Updated the Intel® Celeron® Processor Identification Information table October 2001 -038 Updated the identification information section with 0.13 micron Celeron processor details. Updated Processor Identification Information Table. Updated Summary of Errata Table. Updated Summary of Documentation Changes Table. Updated Summary of Specification Clarifications
Recommended publications
  • Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance
    White Paper Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance Ofri Wechsler Intel Fellow, Mobility Group Director, Mobility Microprocessor Architecture Intel Corporation White Paper Inside Intel®Core™ Microarchitecture Introduction Introduction 2 The Intel® Core™ microarchitecture is a new foundation for Intel®Core™ Microarchitecture Design Goals 3 Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art multi-core optimized Delivering Energy-Efficient Performance 4 and power-efficient microarchitecture is designed to deliver Intel®Core™ Microarchitecture Innovations 5 increased performance and performance-per-watt—thus increasing Intel® Wide Dynamic Execution 6 overall energy efficiency. This new microarchitecture extends the energy efficient philosophy first delivered in Intel's mobile Intel® Intelligent Power Capability 8 microarchitecture found in the Intel® Pentium® M processor, and Intel® Advanced Smart Cache 8 greatly enhances it with many new and leading edge microar- Intel® Smart Memory Access 9 chitectural innovations as well as existing Intel NetBurst® microarchitecture features. What’s more, it incorporates many Intel® Advanced Digital Media Boost 10 new and significant innovations designed to optimize the Intel®Core™ Microarchitecture and Software 11 power, performance, and scalability of multi-core processors. Summary 12 The Intel Core microarchitecture shows Intel’s continued Learn More 12 innovation by delivering both greater energy efficiency Author Biographies 12 and compute capability required for the new workloads and usage models now making their way across computing. With its higher performance and low power, the new Intel Core microarchitecture will be the basis for many new solutions and form factors. In the home, these include higher performing, ultra-quiet, sleek and low-power computer designs, and new advances in more sophisticated, user-friendly entertainment systems.
    [Show full text]
  • Dual-Core Intel® Xeon® Processor 3100 Series Specification Update
    Dual-Core Intel® Xeon® Processor 3100 Series Specification Update — on 45 nm Process in the 775-land LGA Package December 2010 Notice: Dual-Core Intel® Xeon® Processor 3100 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this Specification Update. Document Number: 319006-009 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system.
    [Show full text]
  • Microcode Revision Guidance August 31, 2019 MCU Recommendations
    microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment.
    [Show full text]
  • Single Board Computer
    Single Board Computer SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) SBC-C66 and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs High-performing, flexible solution for intelligence at the edge HIGHLIGHTS CONNECTIVITY CPU 2x USB 3.1; 4x USB 2.0; NVMe SSD Slot; PCI-e x8 Intel® 8th gen. Core™ / Xeon® and 9th gen. Core™ / port (PCI-e x16 mechanical slot); VPU High Speed Xeon® / Pentium® / Celeron® CPUs Connector with 4xUSB3.1 + 2x PCI-ex4 GRAPHICS MEMORY Intel® UHD Graphics 630/P630 architecture, up to 128GB DDR4 memory on 4x SO-DIMM Slots supports up to 3 independent displays (ECC supported) Available in Industrial Temperature Range MAIN FIELDS OF APPLICATION Biomedical/ Gaming Industrial Industrial Surveillance Medical devices Automation and Internet of Control Things FEATURES ® ™ ® Intel 8th generation Core /Xeon (formerly Coffee Lake H) CPUs: Max Cores 6 • Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Max Thread 12 HyperThreading • Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Intel® QM370, HM370 or CM246 Platform Controller Hub Chipset Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), (PCH) with HyperThreading • Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB 2x DDR4-2666 or 4x DDR4-2444 ECC SODIMM Slots, up to 128GB total (only with 4 SODIMM modules). Cache, 45W TDP (35W cTDP) Memory ® ™ ® ® ECC DDR4 memory modules supported only with Xeon Core Information subject to change. Please visit www.seco.com to find the latest version of this datasheet Information subject to change.
    [Show full text]
  • "PCOM-B216VG-ECC.Pdf" (581 Kib)
    Intel® Arrandale processor based Type II COM Express module support ECC DDR3 SDRAM PCOM-B216VG-ECC with Gigabit Ethernet 204pin ECC DDR3 SODIMM socket ® Intel QM57 ® Intel Arrandale processor FEATURES GENERAL CPU & Package: Intel® 45nm Arrandale Core i7/i5/i3 or Celeron P4505 ® Processor The Intel Arrandale and QM57 platform processor up to 2.66 GHz with 4MB Cache in FC-BGA package with turbo boost technology to maximize DMI x4 Link: 4.8GT/s (Full-Duplex) CPU & Graphic performance Chipset/Core Logic Intel® QM57 ® Intel Arrandale platform support variously System Memory Up to 8GB ECC DDR3 800/1066 SDRAM on two SODIMM sockets powerful processor from ultra low power AMI BIOS to mainstream performance type BIOS Storage Devices SATA: Support four SATA 300 and one IDE Supports Intel® intelligent power sharing Expansion Interface VGA and LVDS technology to reduce TDP (Thermal Six PCI Express x1 Design Power) LPC & SPI Interface High definition audio interface ® ® Enhance Intel vPro efficiency by Intel PCI 82577LM GbE PHY and AMT6.0 Hardware Monitoring CPU Voltage and Temperature technology Power Requirement TBA Support two ECC DDR3 800/1066 SDRAM on Dimension Dimension: 125(L) x 95(W) mm two SODIMM sockets, up to 8GB memory size Environment Operation Temperature: 0~60 °C Storage Temperature: -20~80 °C Operation Humidity: 5~90% I/O ORDERING GUIDE MIO N/A IrDA N/A PCOM-B216VG-ECC ® Standard Ethernet One Intel 82577LM Gigabit Ethernet PHY Intel® Arrandale processor based Type II COM Express module with ECC DDR3 SDRAM and Audio N/A Gigabit Ethernet USB Eight USB ports Keyboard & Mouse N/A CPU Intel® Core i7-610E SV (4M Cache, 2.53 GHz) Support List Intel® Core i7-620LE LV (4M Cache, 2.00 GHz) Intel® Core i7-620UE ULV (4M Cache, 1.06 GHz) Intel® Core i5-520E SV (3M Cache, 2.40 GHz) Intel® Celeron P4505 SV (2M Cache, 1.86 GHz) DISPLAY Graphic Controller Intel® Arrandale integrated Graphics Media Accelerator (Gen 5.75 with 12 execution units) * Specifications are subject to change without notice.
    [Show full text]
  • IBM Posts SPEC CPU2006 Scores for Quad-Core X3200 M2 X3200 M2 Achieves Leadership Specint2006 Score for a Single-Socket Server Using Intel Xeon X3370 Processor
    IBM posts SPEC CPU2006 scores for quad-core x3200 M2 x3200 M2 achieves leadership SPECint2006 score for a single-socket server using Intel Xeon X3370 processor August 12, 2008 ... IBM® System xTM 3200 M2 server is an affordable, single-socket tower server that has been optimized to provide outstanding availability, manageability, and performance features for small to medium-sized businesses, retail stores, or distributed enterprises. The x3200 M2 systems include features not typically seen in this class of system, such as standard, hardware-based RAID 0/1, 2.5-inch (SFF) hot-swap SAS drives, and redundant power supplies (on select models). The x3200 M2 includes quad- and dual-core Intel® Xeon® processors for applications that require performance and stability; the x3200 M2 also supports Intel Pentium® dual-core and Core 2 Duo processors for applications that require lower cost. In measurements with the SPEC CPU2006 benchmark suite, the x3200 M2 achieved a leadership SPECint2006 score for a system using the Intel Xeon X3370 processor and competitive scores on the other members of the benchmark suite. The x3200 M2 was configured with the Quad-Core Intel Xeon Processor X3370 (3.00GHz, 12MB L2 cache, and 1333 MHz front-side bus—1 processor/4 cores/4 threads) and 8GB of DDR2 PC2- 6400 memory, and ran SUSE Linux® Enterprise Server 10 SP1 x64. (1) The scores in the following tables are the first SPEC CPU2006 results published for this processor model. SPEC CPU2006 x3200 M2 – Quad-Core Intel Xeon Processor X3370 Benchmark (3.00GHz, 12MB L2 Cache, 1333 MHz FSB) SPECint2006 26.3 SPECint_rate2006 76.2 SPECint_rate_base2006 66.2 SPECfp2006 24.2 SPECfp_rate2006 51.8 SPECfp_rate_base2006 47.8 Results are current as of August 12, 2008.
    [Show full text]
  • The New Intel® Xeon® Processor Scalable Family
    Akhilesh Kumar Intel Corporation, 2017 Authors: Don Soltis, Irma Esmer, Adi Yoaz, Sailesh Kottapalli Notices and Disclaimers This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest forecast, schedule, specifications and roadmaps. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit http://www.intel.com/performance. Optimization Notice: Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.
    [Show full text]
  • Instruction Rate with Ivy Bridge Vs Haswell for Some Common Jobs
    Instruction rate with Ivy Bridge vs Haswell for some common jobs David Smith on behalf of IT-DI-LCG, UP team. 20 Oct 2016, ATLAS computing workflow performance meeting 20.10.16 Sandy Bridge / Haswell 1 Introduction • Get some insight about how the job’s code is interacting with the CPU while running by looking at Instructions per Cycle (IPC) • This is not our usual performance measure, but I hope this may let one more easily see how the cpu pipeline is handling the code, and to some extent compare microarchitectures 10/20/2016 Sandy Bridge / Haswell 2 IPC for some jobs • Ratio of retired instructions / unhalted clock cycles (most over whole job). Physical machine. • Atlas simu with single process athena, HT on, affinity fixed to 1 core. No other significant load. • Haswell was Xeon E5-2683 v3 (~3GHz); Ivy Bridge i7-3770k (~3.8GHz) • checked Ivy Bridge also on Xeon E5-2695 v2 (~3.1GHz) running ATLAS Sim (19.2) => 0.91 IPC • checked Atlas simu (19.2) with athenaMP (8) affinity to 4 cores on one socket => 1.58/0.97 IPC • ATLAS sim was job 2972328065 (19.2.4.9, slc6-gcc47-opt or 20.7.8.5, slc6-gcc49-opt; mc15_13TeV.362059.Sherpa_CT10_Znunu_Pt140_280_CFilterBVecto_fac4) • Looked up previous HS06 results; usually ~10% higher for Haswell (per job slot/per GHz) 10/20/2016 Sandy Bridge / Haswell 3 Which microarchitectures are used? • The above are usually classed as the intel microarchitectures: e.g. Ivy Bridge is the die shrink version of SB, and is classed as SB microarch. • This is the last 90 days of ATLAS jobs, raw data from elastic search (thanks Andrea) • Used wall clock time per cpu type, with classification based on type string, weighted by quoted cpu freq, and a rough weighting of x1.5 for Intel Core, as that microarch.
    [Show full text]
  • HP 250 Notebook PC
    HP 250 Notebook PC Our value-priced notebook PC with powerful essentials ideal for everyday computing on the go. HP recommends Windows. Built for mobile use Designed for productivity For professionals on the move, the HP 250 features a Connect with colleagues online and email from the durable chassis that helps protect against the rigors of office or from your favorite hotspots with Wi-Fi the day. CERTIFIED™ WLAN.5 Carry the HP 250 from meeting to meeting. Enjoy great From trainings to sales presentations, view high-quality views on the 15.6-inch diagonal HD2 display, without multimedia and audio right from your notebook with sacrificing portability. preinstalled software and the built-in Altec Lansing speaker. Powered for business Tackle projects with the power of the Intel® third Make an impact with presentations when you connect 2 6 7 generation Core™ i3 or i5 dual-core processors.3 to larger HD displays through the HDMI port. Develop stunning visuals without slowing down your notebook, thanks to Intel’s integrated graphics. 4 HP, a world leader in PCs brings you Windows 8 Pro designed to fit the needs of business. HP 250 Notebook PC HP recommends Windows. SPECIFICATIONS Operating system Preinstalled: Windows 8 644 Windows 8 Pro 644 Ubuntu Linux FreeDOS Processor 3rd Generation Intel® Core™ i5 & i33; 2nd Generation Intel® Core™ i33; Intel® Pentium® 3; Intel® Celeron® 3 Chipset Mobile Intel® HM70 Express (Intel® Pentium® and Celeron® processors) Mobile Intel® HM75 Express (Intel® Core™ i3 and i5 processor) Memory DDR3 SDRAM (1600 MHz)
    [Show full text]
  • Discover, Develop, Deliver with the New Intel® Celeron® Processor
    Product Brief The New Intel® Celeron® Processor THE NEW INTEL® CELERON® PROCESSOR DISCOVER DEVELOP DELIVER The new Intel® Celeron® processor built around Intel’s latest microarchitecture and manufactured on Intel’s state-of-the-art 14nm process technology delivers Intel level performance that lets you enjoy entertainment and get your work done. Get performance and value you can count on with an Intel Celeron processor. When paired with the latest Intel® H110 Chipset, Intel Celeron processor-based PCs are an ideal choice for editing photos one minute and watching movies the next, and going from spreadsheets to gaming in a flash. That’s serious processing. Only with Intel Inside®. Product Brief The New Intel® Pentium® MAKES VIDEO CREATION AND TECHNOLOGY The new 14nm Intel Celeron processor brings support for the latest CONVERSION technologies such as DDR4 RAM memory that enables PCs to have a high memory data transfer speed at a lower power as compared to FAST AND EASY DDR3. Intel HD graphics 510 delivers some great graphics with support up to 4K resolution and 3 independent displays. Intel Quick Sync Video technology delivers amazing hardware acceleration that makes video conversion and creation fast and easy. 2 INTEL ® CELERON® PROCESSOR FEATT URES A A GLANCE INTEL ® CELERON® G39XX FEATURES BENEFITS Socket LGA 1151 Dual-Core Runs two independent processor cores in Manufacturing 14nm Processing one physical package at the same frequency. Process Intel® Smart The shared cache is dynamically allocated Processor Base Up to 2.9 GHz Cache to each processor core, based on workload. Frequency on G39XX Efficient last-level cache data usage and instant communication between the core Intel® Smart Cache 2 MB L3 shared and memory.
    [Show full text]
  • Intel's Core Microarchitecture Sets New Records in Performance and Energy Efficiency 23 May 2006
    Intel's Core Microarchitecture Sets New Records in Performance and Energy Efficiency 23 May 2006 Virtualization Technology (Intel VT), Intel Active Server Manager and Intel I/O Acceleration Technology. (Intel I/OAT)” Fully-buffered dual in-line memory (FB-DIMM) technology allows for better memory capacity, throughput and overall reliability. This is critical for creating balanced platforms using multiple cores and the latest technologies, such as virtualization, to meet the expanding demand for compute headroom. Shipping in Intel Xeon MP processors since last year, Intel Virtualization Technology (Intel VT) Dual-Core Intel Xeon processor 5000 series, previously provides silicon-level software support that codenamed "Dempsey." improves dependability and interoperability and is enabling faster industry innovation. Intel Active Server Manager integrates hardware, software and firmware to manage today’s complex datacenters Intel today disclosed record breaking results on 20 and enterprise environments. Intel I/O Acceleration key dual-processor (DP) server and workstation Technology (Intel I/OAT) improves application benchmarks. The first processor due to launch response time, server I/O performance and based on the new Intel Core microarchitecture — reliability. the Dual-Core Intel Xeon processor 5100 series, previously codenamed “Woodcrest” — delivers up Intel’s new server and workstation platforms, to 125 percent performance improvement over codenamed “Bensley” and “Glidewell” previous generation dual-core Intel Xeon respectively, are architected for today’s dual-core processors and up to 60 percent performance processors. They will also support dual- and quad- improvement over competing x86-based core processors built using Intel’s 65-nanometer architectures, whilst also delivering performance (nm) and future process technologies.
    [Show full text]
  • Product Brief: Intel® Xeon® Scalable Platform
    PRODUCT BRIEF Intel® Xeon® Scalable Platform The Future-Forward Platform Foundation for Agile Digital Services Empowering Transformation in a Digital World Across an evolving digital world, disruptive and emerging technology trends in business, industry, science, and entertainment increasingly impact the world’s economies. By 2020, the success of half of the world’s Global 2000 companies will depend on their abilities to create digitally enhanced products, services, and experiences,1 and large organizations expect to see an 80 percent increase in their digital revenues,2 all driven by advancements in technology and usage models they enable. This global transformation is rapidly scaling the demands for flexible compute, networking, and storage. Future workloads will necessitate infrastructures that can seamlessly scale to support immediate responsiveness and widely diverse performance requirements. The exponential growth of data generation and consumption, the rapid expansion of cloud-scale computing, emerging 5G networks, and the extension of high-performance computing (HPC) and artificial intelligence (AI) into new usages require that today’s data centers and networks urgently evolve—or be left behind in a highly competitive environment. These demands are driving the architecture of modernized, future-ready data centers and networks that can quickly flex and scale. The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability.3 Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform.
    [Show full text]