芯原微电子(上海)股份有限公司 Verisilicon Microelectronics (Shanghai) Co., Ltd

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芯原微电子(上海)股份有限公司 Verisilicon Microelectronics (Shanghai) Co., Ltd 本次股票发行后拟在科创板市场上市,该市场具有较高的投资风险。科创板 公司具有研发投入大、经营风险高、业绩不稳定、退市风险高等特点,投资 者面临较大的市场风险。投资者应充分了解科创板市场的投资风险及本公司 所披露的风险因素,审慎作出投资决定。 芯原微电子(上海)股份有限公司 VeriSilicon Microelectronics (Shanghai) Co., Ltd. 中国(上海)自由贸易试验区春晓路 289 号张江大厦 20A 首次公开发行股票并在科创板上市 招股说明书 (申报稿) 公司的发行申请尚需经上海证券交易所和中国证监会履行相应程序。本招股 说明书不具有据以发行股票的法律效力,仅供预先披露之用。投资者应当以 正式公告的招股说明书作为投资决定的依据。 保荐人(主承销商) (深圳市福田区福田街道福华一路 111 号) 联席主承销商 (上海市黄浦区广东路 689 号) 财务顾问 芯原微电子(上海)股份有限公司首次公开发行股票并在科创板上市申请文件 招股说明书(申报稿) 声明及承诺 中国证监会、交易所对本次发行所作的任何决定或意见,均不表明其对注册 申请文件及所披露信息的真实性、准确性、完整性作出保证,也不表明其对发行 人的盈利能力、投资价值或者对投资者的收益作出实质性判断或保证。任何与之 相反的声明均属虚假不实陈述。 根据《证券法》的规定,股票依法发行后,发行人经营与收益的变化,由发 行人自行负责;投资者自主判断发行人的投资价值,自主作出投资决策,自行承 担股票依法发行后因发行人经营与收益变化或者股票价格变动引致的投资风险。 发行人及全体董事、监事、高级管理人员承诺招股说明书及其他信息披露资 料不存在虚假记载、误导性陈述或重大遗漏,并对其真实性、准确性、完整性承 担个别和连带的法律责任。 发行人第一大股东承诺本招股说明书不存在虚假记载、误导性陈述或重大遗 漏,并对其真实性、准确性、完整性承担个别和连带的法律责任。 公司负责人和主管会计工作的负责人、会计机构负责人保证招股说明书中财 务会计资料真实、完整。 发行人及全体董事、监事、高级管理人员、发行人的第一大股东以及保荐人、 承销的证券公司承诺因发行人招股说明书及其他信息披露资料有虚假记载、误导 性陈述或者重大遗漏,致使投资者在证券发行和交易中遭受损失的,将依法赔偿 投资者损失。 保荐人及证券服务机构承诺因其为发行人本次公开发行制作、出具的文件有 虚假记载、误导性陈述或者重大遗漏,给投资者造成损失的,将依法赔偿投资者 损失。 1-1-1 芯原微电子(上海)股份有限公司首次公开发行股票并在科创板上市申请文件 招股说明书(申报稿) 本次发行概况 发行股票类型 人民币普通股(A 股) 本次公开发行股票采用公开发行新股方式,公开发行不低于 发行股数 48,319,289 股,不低于发行后总股本的 10.00%。本次发行中, 公司股东不进行公开发售股份。 公司高级管理人员及核心员工拟通过专项资管计划参与本次发 行战略配售,配售数量不超过本次发行数量的 10.00%,具体按 发行人高管、员工参与战 照上交所相关规定执行。公司及相关人员后续将按要求进一步 略配售情况 明确参与本次发行战略配售的具体方案,并按规定向上交所提 交相关文件。 保荐机构将安排子公司招商证券投资有限公司参与本次发行战 保荐人相关子公司参与战 略配售,具体按照上交所相关规定执行。保荐机构及其相关子 略配售 公司后续将按要求进一步明确参与本次发行战略配售的具体方 案,并按规定向上交所提交相关文件。 每股面值 1.00 元 每股发行价格 【】元/股 预计发行日期 【】年【】月【】日 拟上市的证券交易所和板 上海证券交易所科创板 块 发行后总股本 483,192,883 股 保荐人(主承销商) 招商证券股份有限公司 联席主承销商 海通证券股份有限公司 招股说明书签署日期 2019 年 9 月 10 日 1-1-2 芯原微电子(上海)股份有限公司首次公开发行股票并在科创板上市申请文件 招股说明书(申报稿) 重大事项提示 公司特别提请投资者注意,在作出投资决策之前,务必仔细阅读本招股说明 书“风险因素”章节及本招股说明书正文的全部内容,并特别关注以下公司风险。 一、提醒投资者给予特别关注的“风险因素” (一)研发方向与行业未来发展方向不一致的风险 集成电路设计企业需要根据行业发展趋势进行前瞻性的研发设计,研发方向 与行业未来发展方向是否一致较为重要,若公司未来不能紧跟行业主流技术和前 沿需求,将有可能使公司技术研发方向与行业发展方向及需求存在偏差,无法满 足下游客户的需求,从而对公司的经营产生不利影响。 (二)集成电路设计研发风险 公司的集成电路设计研发风险主要由于公司设计服务技术含量较高、持续时 间较长,可能面临研究设计未能达到预期效果、流片失败、客户研究方向或市场 需求改变等不确定因素而导致公司签署的服务合同存在较预期提前终止或延期 支付的风险,可能会对公司未来的收入和盈利能力产生一定程度的影响。 (三)技术升级迭代风险 集成电路设计行业下游需求不断变化,产品及技术升级迭代速度较快,芯片 制程不断向 28nm、14nm、7nm 等先进制程演变。该行业仍在不断革新之中,且 研发创新存在不确定性,公司在新技术的开发和应用上可能无法持续取得先进地 位,或者某项新技术的应用导致公司现有技术被替代,将导致公司行业地位和市 场竞争力下降,从而对公司的经营产生不利影响。 (四)研发人员流失风险 集成电路设计行业属于技术密集型产业,对技术人员的依赖度较高。高素质 技术人员是公司核心竞争力的重要组成部分,也是公司赖以生存和发展的基础和 关键。稳定的研发队伍和技术人员,是公司持续进行技术创新和保持市场竞争优 势的重要因素,截至报告期末,公司拥有研发人员 677 人,占员工总人数的 83.37%。 未来,如果公司薪酬水平与同行业竞争对手相比丧失竞争优势、核心技术人员的 1-1-3 芯原微电子(上海)股份有限公司首次公开发行股票并在科创板上市申请文件 招股说明书(申报稿) 激励机制不能落实、或人力资源管控及内部晋升制度得不到有效执行等,将 难以 引进更多的高端技术人才,甚至导致现有骨干技术人员流失,将对公司生产经营 产生不利影响。 (五)尚未盈利的风险 报告期内,公司归属于母公司所有者的净利润分别为-14,551.55 万元、 -12,814.87 万元、-6,779.92 万元、474.19 万元。报告期内公司尚未在一个完整会 计年度内盈利,如果公司持续亏损且无法通过外部途径进行融资,将会造成公司 现金流紧张,进而对公司业务拓展、人才引进、团队稳定、研发投入、市场拓展 等方面造成负面影响。 (六)存在累计未弥补亏损的风险 截至 2019 年 6 月 30 日,公司未分配利润(累计未弥补亏损)为-153,461.89 万元。预计首次公开发行后,公司短期内将无法现金分红,对投资者的投资收益 造成一定影响。 (七)海外经营风险 公司在美国、欧洲、日本、中国香港、中国台湾等地区设有分支机构并积极 拓展海外业务。报告期内,公司来源于境外的收入金额分别为 68,445.33 万元、 73,060.09 万元、77,995.48 万元、36,611.91 万元,占当期营业收入总额的 82.14%、 67.65%、73.75%、60.21%,公司境外收入占比较高。海外市场受政策法规变动、 政治经济局势变化、知识产权保护等多种因素影响,随着公司业务规模的不断扩 大,公司涉及的法律环境将会更加复杂,若公司不能及时应对海外市场环境的变 化,会对海外经营的业务带来一定的风险。 (八)国际贸易摩擦风险 近年来,伴随着全球产业格局的深度调整,国际贸易摩擦不断,逆全球化思 潮出现。部分国家通过贸易保护的手段,对中国相关产业的发展造成了客观不利 影响,中国企业将面对不断增加的国际贸易摩擦和贸易争端。报告期内,公司来 源于境外的收入占比较高,若未来与中国相关的国际贸易摩擦持续发生,可能会 对公司的经营产生不利影响。 1-1-4 芯原微电子(上海)股份有限公司首次公开发行股票并在科创板上市申请文件 招股说明书(申报稿) (九)知识产权风险 公司的核心技术为芯片定制技术和半导体 IP 技术,公司通过申请专利、集 成电路布图设计专有权、软件著作权等方式对自主知识产权进行保护,该等知识 产权对公司未来发展具有重要意义,但无法排除关键技术被竞争对手通过模仿或 窃取等方式侵犯的风险。同时,公司一贯重视自主知识产权的研发,并在需要时 取得第三方知识产权授权,避免侵犯他人知识产权,但无法排除竞争对手或其他 利益相关方采取恶意诉讼的策略,阻碍公司正常业务发展的风险。 (十)商誉减值风险 截至 2019 年 6 月 30 日,公司因 2004 年 9 月收购上海众华电子有限公司 100% 股权和 2016 年 1 月收购图芯美国 100%股权,合计形成商誉 17,387.52 万元。公 司至少每年对收购形成的商誉执行减值测试,如果被收购公司未来经营状况未达 预期,则发行人存在商誉减值的风险,可能对公司的当期盈利水平产生不利影响。 (十一)发行失败风险 公司计划在上交所科创板上市。科创板的发行规则和上市条件与 A 股主板、 中小板、创业板存在区别,其中发行价格按询价情况确定,上市条件与预计市值 挂钩,而预计市值为股票公开发行后按照总股本乘以发行价格计算出来的公司股 票名义总价值,因此公司是否符合上交所科创板上市条件需待发行阶段确定发行 价格后方可最终确定。如果届时出现发行认购不足、或者发行定价后公司无法满 足科创板上市条件的,则可能发行中止甚至发行失败。 公司特别提请投资者注意,在作出投资决策前,请务必仔细阅读本招股说明 书“第四节风险因素”的全部内容。 二、相关承诺事项 关于:1、本次发行前股东所持股份的限售安排、自愿锁定股份、延长锁定 期限以及股东持股及减持意向等承诺;2、稳定股价的措施和承诺;3、股份回购 和股份购回的措施和承诺;4、对欺诈发行上市的股份购回承诺;5、填补被摊薄 即期回报的措施及承诺;6、利润分配政策的承诺;7、依法承担赔偿或赔偿责任 的承诺;8、其他承诺事项等,详见本招股说明书之“第十节、六、相关承诺事 项”相关内容。 1-1-5 芯原微电子(上海)股份有限公司首次公开发行股票并在科创板上市申请文件 招股说明书(申报稿) 目录 声明及承诺 .................................................................................................................. 1 本次发行概况 .............................................................................................................. 2 重大事项提示 .............................................................................................................. 3 一、提醒投资者给予特别关注的“风险因素” ............................................... 3 二、相关承诺事项 ............................................................................................... 5 目录............................................................................................................................... 6 第一节释义 ................................................................................................................ 10 一、一般释义 ..................................................................................................... 10 二、专业术语释义 ............................................................................................. 15 第二节概览 ................................................................................................................ 21 一、发行人及本次发行的中介机构基本情况 ................................................. 21 二、本次发行概况 ............................................................................................. 21 三、主要财务数据和财务指标 ......................................................................... 23 四、发行人的主营业务经营情况 ..................................................................... 24 五、发行人技术先进性、研发技术产业化情况以及未来发展战略 ............. 27 六、发行人选择的具体上市标准 ..................................................................... 29 七、公司治理特殊安排 ..................................................................................... 29 八、募集资金用途 ............................................................................................. 29 第三节本次发行概况 ................................................................................................ 31 一、本次发行的基本情况 ................................................................................. 31 二、本次发行的有关机构 ................................................................................. 32 三、发行人与本次发行有关当事人之间的关系 ............................................. 34 四、预计发行上市的重要日期 ......................................................................... 34 五、战略配售 ..................................................................................................... 34 第四节风险因素 ........................................................................................................ 35 一、技术风险 ..................................................................................................... 35 二、经营风险 ..................................................................................................... 35 三、尚未盈利的风险 ......................................................................................... 37 1-1-6 芯原微电子(上海)股份有限公司首次公开发行股票并在科创板上市申请文件 招股说明书(申报稿) 四、存在累计未弥补亏损的风险 ..................................................................... 37 五、法律风险 ..................................................................................................... 37 六、财务风险 ..................................................................................................... 38 七、内控风险 ..................................................................................................... 40 八、发行失败风险 ............................................................................................. 40 九、触发退市风险 ............................................................................................. 41 第五节发行人基本情况 ............................................................................................ 42 一、发行人基本资料 ......................................................................................... 42 二、发行人设立及报告期内股本和股东变化情况、报告期内重大资产重组情 况 ......................................................................................................................... 43 三、发行人股权结构 ......................................................................................... 56 四、发行人的控股、合营、参股公司情况 ..................................................... 58 五、持有发行人 5%以上股份或表决权的主要股东及实际控制人的基本情况 ............................................................................................................................. 63 六、发行人股本情况 ......................................................................................... 71 七、董事、监事、高级管理人员与核心技术人员 ......................................... 78 八、发行人员工股权激励及相关安排 ............................................................. 96 九、员工及社会保障情况 ............................................................................... 101 第六节业务与技术 .................................................................................................. 104 一、发行人主营业务及主要服务情况 ........................................................... 104 二、发行人所处行业基本情况及其竞争状况 ............................................... 141 三、发行人销售情况和主要客户 ................................................................... 173 四、发行人原材料采购和主要供应商情况 ................................................... 177 五、对主要业务有重大影响的主要固定资产、无形资产等资源要素情况180 六、发行人核心技术情况 ............................................................................... 181 七、发行人境外经营情况 ............................................................................... 193 第七节公司治理与独立性 .....................................................................................
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