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Wind River Vxworks Platforms 3.8
Wind River VxWorks Platforms 3.8 The market for secure, intelligent, Table of Contents Build System ................................ 24 connected devices is constantly expand- Command-Line Project Platforms Available in ing. Embedded devices are becoming and Build System .......................... 24 VxWorks Edition .................................2 more complex to meet market demands. Workbench Debugger .................. 24 New in VxWorks Platforms 3.8 ............2 Internet connectivity allows new levels of VxWorks Simulator ....................... 24 remote management but also calls for VxWorks Platforms Features ...............3 Workbench VxWorks Source increased levels of security. VxWorks Real-Time Operating Build Configuration ...................... 25 System ...........................................3 More powerful processors are being VxWorks 6.x Kernel Compatibility .............................3 considered to drive intelligence and Configurator ................................. 25 higher functionality into devices. Because State-of-the-Art Memory Host Shell ..................................... 25 Protection ..................................3 real-time and performance requirements Kernel Shell .................................. 25 are nonnegotiable, manufacturers are VxBus Framework ......................4 Run-Time Analysis Tools ............... 26 cautious about incorporating new Core Dump File Generation technologies into proven systems. To and Analysis ...............................4 System Viewer ........................ -
OSB Representative Participant List by Industry
OSB Representative Participant List by Industry Aerospace • KAWASAKI • VOLVO • CATERPILLAR • ADVANCED COATING • KEDDEG COMPANY • XI'AN AIRCRAFT INDUSTRY • CHINA FAW GROUP TECHNOLOGIES GROUP • KOREAN AIRLINES • CHINA INTERNATIONAL Agriculture • AIRBUS MARINE CONTAINERS • L3 COMMUNICATIONS • AIRCELLE • AGRICOLA FORNACE • CHRYSLER • LOCKHEED MARTIN • ALLIANT TECHSYSTEMS • CARGILL • COMMERCIAL VEHICLE • M7 AEROSPACE GROUP • AVICHINA • E. RITTER & COMPANY • • MESSIER-BUGATTI- CONTINENTAL AIRLINES • BAE SYSTEMS • EXOPLAST DOWTY • CONTINENTAL • BE AEROSPACE • MITSUBISHI HEAVY • JOHN DEERE AUTOMOTIVE INDUSTRIES • • BELL HELICOPTER • MAUI PINEAPPLE CONTINENTAL • NASA COMPANY AUTOMOTIVE SYSTEMS • BOMBARDIER • • NGC INTEGRATED • USDA COOPER-STANDARD • CAE SYSTEMS AUTOMOTIVE Automotive • • CORNING • CESSNA AIRCRAFT NORTHROP GRUMMAN • AGCO • COMPANY • PRECISION CASTPARTS COSMA INDUSTRIAL DO • COBHAM CORP. • ALLIED SPECIALTY BRASIL • VEHICLES • CRP INDUSTRIES • COMAC RAYTHEON • AMSTED INDUSTRIES • • CUMMINS • DANAHER RAYTHEON E-SYSTEMS • ANHUI JIANGHUAI • • DAF TRUCKS • DASSAULT AVIATION RAYTHEON MISSLE AUTOMOBILE SYSTEMS COMPANY • • ARVINMERITOR DAIHATSU MOTOR • EATON • RAYTHEON NCS • • ASHOK LEYLAND DAIMLER • EMBRAER • RAYTHEON RMS • • ATC LOGISTICS & DALPHI METAL ESPANA • EUROPEAN AERONAUTIC • ROLLS-ROYCE DEFENCE AND SPACE ELECTRONICS • DANA HOLDING COMPANY • ROTORCRAFT • AUDI CORPORATION • FINMECCANICA ENTERPRISES • • AUTOZONE DANA INDÚSTRIAS • SAAB • FLIR SYSTEMS • • BAE SYSTEMS DELPHI • SMITH'S DETECTION • FUJI • • BECK/ARNLEY DENSO CORPORATION -
Bootstomp: on the Security of Bootloaders in Mobile Devices
BootStomp: On the Security of Bootloaders in Mobile Devices Nilo Redini, Aravind Machiry, Dipanjan Das, Yanick Fratantonio, Antonio Bianchi, Eric Gustafson, Yan Shoshitaishvili, Christopher Kruegel, and Giovanni Vigna, UC Santa Barbara https://www.usenix.org/conference/usenixsecurity17/technical-sessions/presentation/redini This paper is included in the Proceedings of the 26th USENIX Security Symposium August 16–18, 2017 • Vancouver, BC, Canada ISBN 978-1-931971-40-9 Open access to the Proceedings of the 26th USENIX Security Symposium is sponsored by USENIX BootStomp: On the Security of Bootloaders in Mobile Devices Nilo Redini, Aravind Machiry, Dipanjan Das, Yanick Fratantonio, Antonio Bianchi, Eric Gustafson, Yan Shoshitaishvili, Christopher Kruegel, and Giovanni Vigna fnredini, machiry, dipanjan, yanick, antoniob, edg, yans, chris, [email protected] University of California, Santa Barbara Abstract by proposing simple mitigation steps that can be im- plemented by manufacturers to safeguard the bootloader Modern mobile bootloaders play an important role in and OS from all of the discovered attacks, using already- both the function and the security of the device. They deployed hardware features. help ensure the Chain of Trust (CoT), where each stage of the boot process verifies the integrity and origin of 1 Introduction the following stage before executing it. This process, in theory, should be immune even to attackers gaining With the critical importance of the integrity of today’s full control over the operating system, and should pre- mobile and embedded devices, vendors have imple- vent persistent compromise of a device’s CoT. However, mented a string of inter-dependent mechanisms aimed at not only do these bootloaders necessarily need to take removing the possibility of persistent compromise from untrusted input from an attacker in control of the OS in the device. -
Enel Green Power, Sharp and Stmicroelectronics Sign Agreement for the Largest Photovoltaic-Panel Manufacturing Plant in Italy
Enel Green Power, Sharp and STMicroelectronics Sign Agreement for the Largest Photovoltaic-Panel Manufacturing Plant in Italy January 4, 2010 3:04 AM ET Enel Green Power, Sharp and STMicroelectronics join forces to produce innovative thin-film photovoltaic panels. The plant, located in Catania, Italy, is expected to have initial production capacity of 160 MW per year and is targeted to grow to 480 MW over the next years. In addition, Enel Green Power and Sharp will jointly develop solar farms focusing on the Mediterranean area, with a total installed capacity at a level of 500 MW, by the end of 2016. Geneva, January 4, 2010 – Today, Enel Green Power, Sharp and STMicroelectronics signed an agreement for the manufacture of triple-junction thin-film photovoltaic panels in Italy. At the same time, Enel Green Power and Sharp signed a further agreement to jointly develop solar farms. Today's agreement regarding the photovoltaic panel factory follows the Memorandum of Understanding signed in May 2008 by Enel Green Power and Sharp. STMicroelectronics has joined this strategic partnership. This agreement marks the first time that three global technology and industrial powerhouses have joined together in an equal partnership to contribute their unique value-add to the solar industry. It brings together Enel Green Power, with its international market development and project management know-how; Sharp, and its exclusive triple-junction thin-film technology, which will be operational in the mother plant in Sakai, Japan as of spring 2010; and STMicroelectronics, with its manufacturing capacity, skills and resources in highly advanced, hi-tech sectors such as microelectronics. -
The Evolving Role of Semiconductor Consortia in the United States and Japan
Portland State University PDXScholar Business Faculty Publications and Presentations The School of Business Fall 1998 The Evolving Role of Semiconductor Consortia in the United States and Japan Rose Marie Ham University of California - Berkeley Greg Linden University of California - Berkeley Melissa M. Appleyard Portland State University, [email protected] Follow this and additional works at: https://pdxscholar.library.pdx.edu/busadmin_fac Part of the Business Administration, Management, and Operations Commons Let us know how access to this document benefits ou.y Citation Details Ham, R., Linden, G., & Appleyard, M. M. (1998). The Evolving Role of Semiconductor Consortia in the United States and Japan. California Management Review, 41(1), 137-163. This Article is brought to you for free and open access. It has been accepted for inclusion in Business Faculty Publications and Presentations by an authorized administrator of PDXScholar. Please contact us if we can make this document more accessible: [email protected]. The Evolving Role of Semiconductor Consortia in the United States and Japan Rose Marie Ham Greg Linden Melissa M. Appleyard ince the late 1970s, governments throughout the industrialized economics have proclaimed the benefits of research consortia. In the United States, tor example, ihe 1984 National Cooperative Research SAct (NCRA) relaxed U.S. antitrust laws to encourage the formation of research consortia hy firms in the same industry; by the end of 1995, over 575 consortia had heen registered under the NCRA in a variety of -
Mac Labs. More Creativity
Mac labs. More creativity. More engagement. More learning. Every Mac comes ready for 21st-century learning. Mac OS X Server creates the ultimate lab environment. Creativity and innovation are critical skills in the modern Mac OS X Server includes simplified tools for creating wikis and workplace, which makes them critical skills to teach today’s blogs, so students and staff can set up and manage them with students. Apple offers comprehensive lab solutions for your little or no help from IT. The Spotlight Server feature makes it school or university that will creatively engage students and easy for students collaborating on projects to find and view motivate them to take an interest in their own learning. The content stored anywhere on the network. Of course, access iLife ’09 suite of applications comes standard on every Mac, controls are built in, so they only get the search results they’re so students can immediately begin creating podcasts, editing authorised to see. Mac OS X Server also allows for real-time videos, composing music, producing photo essays and more. streaming of audio and video content, which lets everyone get right to work instead of waiting for downloads – saving major Mac or PC? Have both. storage across your network. Now one lab really can solve all your computing needs. Every Mac is powered by an Intel processor and features Launch careers from your Mac lab. Mac OS X – the world’s most advanced operating system. As an Apple Authorised Training Centre for Education, your Mac OS X comes with an amazing dual-boot feature called school can build a bridge between students and real-world Boot Camp that lets students run Windows XP or Vista natively careers. -
Intel Corporation
US RESEARCH | PUBLISHED BY RAYMOND JAMES & ASSOCIATES INTEL CORPORATION (INTC-NASDAQ) JULY 26, 2021 | 8:27 PM EDT Semiconductors COMPANY BRIEF Chris Caso | (212) 856-4893 | [email protected] Melissa Fairbanks | (727) 567-1081 | [email protected] Underperform 4 New Names, Same Problems Suitability M/ACC Intel hosted its "Intel Accelerated" manufacturing roadmap update Monday evening, detailing their process roadmap through 2025. The presentation laid a path through which Intel hopes to MARKET DATA Current Price (Jul-26-21) $54.31 have achieved parity with TSMC (and by extension, AMD) by 2024, and a goal of process leadership Market Cap (mln) $221,802 by 2025. This is no different from the goals laid out by Intel’s new CEO when he came on board Current Net Debt (mln) $10,552 a quarter ago, but the company did provide more details about how they intend to achieve that Enterprise Value (mln) $232,354 Shares Outstanding (mln) 4,084.0 goal. Attaining leadership by 2025 requires Intel to introduce a full process node improvement 30-Day Avg. Daily Value (mln) $1,362.7 each year for the next 4 years – an aggressive assumption given the production missteps from Dividend $1.39 the past several years. What Intel didn’t disclose were the costs of this roadmap, which we Dividend Yield 2.6% 52-Week Range $43.61 - $68.49 expect them to discuss during the November analyst day. And while there is great uncertainty BVPS $14.76 about Intel’s ability to achieve these targets, what’s less uncertain is a requirement for higher Long-Term Debt (mln) $24,632 capital intensity. -
Learning the Superior Techniques of the Barbarians China’S Pursuit of Semiconductor Independence
JANUARY 2019 Learning the Superior Techniques of the Barbarians China’s Pursuit of Semiconductor Independence AUTHOR James A. Lewis A joint project of the CSIS TECHNOLOGY POLICY PROGRAM and the CSIS FREEMAN CHAIR IN CHINA STUDIES China Innovation Policy Series JANUARY 2019 Learning the Superior Techniques of the Barbarians China’s Pursuit of Semiconductor Independence AUTHOR James A. Lewis A joint project of the CSIS Technology Policy Program and the CSIS Freeman Chair in China Studies About CSIS Established in Washington, D.C., over 50 years ago, the Center for Strategic and International Studies (CSIS) is a bipartisan, nonprofit policy research organization dedicated to providing strategic insights and policy solutions to help decisionmakers chart a course toward a better world. In late 2015, Thomas J. Pritzker was named chairman of the CSIS Board of Trustees. Mr. Pritzker succeeded former U.S. senator Sam Nunn (D-GA), who chaired the CSIS Board of Trustees from 1999 to 2015. CSIS is led by John J. Hamre, who has served as president and chief executive officer since 2000. Founded in 1962 by David M. Abshire and Admiral Arleigh Burke, CSIS is one of the world’s preeminent international policy in¬stitutions focused on defense and security; regional study; and transnational challenges ranging from energy and trade to global development and economic integration. For the past seven years consecutively, CSIS has been named the world’s number one think tank for international security by the University of Pennsylvania’s “Go To Think Tank Index.” The Center’s over 220 full-time staff and large network of affiliated scholars conduct research and analysis and develop policy initiatives that look to the future and anticipate change. -
Intesa Sanpaolo Group Conflicts of Interest
Conflicts of interest 24/07/2020 Intesa Sanpaolo Group conflicts of interest Please read carefully the important disclosures at the end of this publication COMPANIES CONFLICTS OF INTEREST 2I RETE GAS SPA We provide the following information on Intesa Sanpaolo Group's conflicts of interest: - One or more of the companies of the Intesa Sanpaolo Banking Group have an equity stake of 5% or more in 2I RETE GAS SPA or in the Company that has a controlling interest in 2I RETE GAS SPA or are a major shareholder of 2I RETE GAS SPA - One or more of the companies of the Intesa Sanpaolo Banking Group have elected one or more members of the Board of Directors or the Board of Statutory Auditors or another controlling body of 2I RETE GAS SPA or of the parent company 2I RETE GAS SPA or the majority shareholder of 2I RETE GAS SPA - One or more of the companies of the Intesa Sanpaolo Banking Group have granted significant financing to 2I RETE GAS SPA and its parent and group companies A2A SPA We provide the following information on Intesa Sanpaolo Group's conflicts of interest: - One or more of the companies of the Intesa Sanpaolo Banking Group have granted significant financing to A2A SPA and its parent and group companies ABITARE IN SPA We provide the following information on Intesa Sanpaolo Group's conflicts of interest: - One or more of the companies of the Intesa Sanpaolo Banking Group are one of the main financial lenders to ABITARE IN SPA and its parent and group companies - Intesa Sanpaolo acts as Corporate Broker relative to securities issued -
Vxworks Architecture Supplement, 6.2
VxWorks Architecture Supplement VxWorks® ARCHITECTURE SUPPLEMENT 6.2 Copyright © 2005 Wind River Systems, Inc. All rights reserved. No part of this publication may be reproduced or transmitted in any form or by any means without the prior written permission of Wind River Systems, Inc. Wind River, the Wind River logo, Tornado, and VxWorks are registered trademarks of Wind River Systems, Inc. Any third-party trademarks referenced are the property of their respective owners. For further information regarding Wind River trademarks, please see: http://www.windriver.com/company/terms/trademark.html This product may include software licensed to Wind River by third parties. Relevant notices (if any) are provided in your product installation at the following location: installDir/product_name/3rd_party_licensor_notice.pdf. Wind River may refer to third-party documentation by listing publications or providing links to third-party Web sites for informational purposes. Wind River accepts no responsibility for the information provided in such third-party documentation. Corporate Headquarters Wind River Systems, Inc. 500 Wind River Way Alameda, CA 94501-1153 U.S.A. toll free (U.S.): (800) 545-WIND telephone: (510) 748-4100 facsimile: (510) 749-2010 For additional contact information, please visit the Wind River URL: http://www.windriver.com For information on how to contact Customer Support, please visit the following URL: http://www.windriver.com/support VxWorks Architecture Supplement, 6.2 11 Oct 05 Part #: DOC-15660-ND-00 Contents 1 Introduction -
Mediatek Linkit™ Development Platform for RTOS Get Started Guide
MediaTek LinkIt™ Development Platform for RTOS Get Started Guide Version: 3.0 Release date: 30 June 2016 © 2015 - 2016 MediaTek Inc. This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s). MediaTek cannot grant you permission for any material that is owned by third parties. You may only use or reproduce this document if you have agreed to and been bound by the applicable license agreement with MediaTek (“License Agreement”) and been granted explicit permission within the License Agreement (“Permitted User”). If you are not a Permitted User, please cease any access or use of this document immediately. Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited. THIS DOCUMENT IS PROVIDED ON AN “AS-IS” BASIS ONLY. MEDIATEK EXPRESSLY DISCLAIMS ANY AND ALL WARRANTIES OF ANY KIND AND SHALL IN NO EVENT BE LIABLE FOR ANY CLAIMS RELATING TO OR ARISING OUT OF THIS DOCUMENT OR ANY USE OR INABILITY TO USE THEREOF. Specifications contained herein are subject to change without notice. MediaTek LinkIt™ Development Platform for RTOS Get Started Guide Document Revision History Revision Date Description 1.0 24 March 2016 Initial version. 2.0 17 May 2016 Move the contents relative to flash, HDK, and build comments to corresponding documents. Add the support of Keil 3.0 30 June 2016 Add the support of IAR. Refine the architecture and provide more information on the SDK usage. © 2015 - 2016 MediaTek Inc. Page i of v This document contains information that is proprietary to MediaTek Inc. -
Qualcomm-Snapdragon-Integrated
QUALCOMM® SNAPDRAGON™ INTEGRATED FABLESS MANUFACTURING 2 Executive Summary Assembly and Test Services (OSATS) companies as well. The new mobile age has brought with it a new approach to solve the performance and power effi- Although QTI is fabless, it is still invested in ciency problems of modern processors. As a leader advancing manufacturing technology. QTI helps in the mobile industry, Qualcomm Technologies, drive and influence semiconductor innovations Inc. (QTI) implemented the Integrated Fabless through alliances and cooperation with industry Manufacturing (IFM) model to address the changes organizations. In 2013, QTI became a core member in the evolving mobile ecosystem to deliver the of the CMOS Program at the global semiconduc- best user experiences. IFM allows Qualcomm tor research program, IMEC, to extend the group’s Technologies to work closely with selected found- collaboration into advance CMOS process tech- ries, test and assembly vendors to provide nologies. Prior to QTI’s core membership, the two cutting edge solutions that can be manufactured organizations collaborated for several years on 3D in high volume while also meeting the perfor- stacking technologies. Also in 2010, QTI became mance, power, size, and cost requirements of the the first integrated, fabless chip manufactures to mobile industry. join SEMATECH, also with the intent to advance CMOS scaling and collaborate on new technologies. Technical Engagement Flexible Foundries The QTI IFM builds tight technical interfaces among all parties in the semiconductor develop- IFM uniquely positions QTI to adjust demand ment cycle. As a technology leader in the mobile across foundries and select the most cost effective ecosystem, QTI collaborates closely with the process nodes for the various components of a foundries and other services, on virtually every mobile system chipset.