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ECD.Dec.2012.Pdf AT THE POINT OF INCEPTION …one SOURCE ACCELERATES DESIGN. Brought to you by www.EmbeddedSoftwareStore.com -community Beat Keeping the embedded conversation going By Jennifer Hesse www.embedded-computing.com BLOGS | MARKET STATS | SURVEYS | VIDEOS | SOCIAL NETWORKING -community Beat Keeping the embedded conversation going By Jennifer Hesse www.embedded-computing.com ON THE COVER High-speed interconnect technology has become a necessary component to optimize the performance www.embedded-computing.com of high-bandwidth embedded systems. Read updates on some of the leading interconnect standards in our Silicon section, and don’t miss December 2012 | Volume 10 • Number 8 | | | | BLOGSour special MA RadvertisingKET S TsectionATS exploring SU RtheV EYS VIDEOS SOCIAL NETWORKING question of “What’s Hot in 2013 in Embedded?” 7 Tracking Trends in Embedded Technology 42 -community Beat Bandwidth demands redefine interconnect technology Keeping the embedded conversation going By Warren Webb By Jennifer Hesse Silicon Software Strategies High-speed interconnects Android Multicore 10 16 29 PCI Express over M-PHY: 8 Developing Android-driven ▲ Heterogeneous 20 Proven technologies scale applications for automotive system architecture: I/O performance to meet infotainment Multicore image processing mobile needs By Andrew Patterson, Mentor Graphics using a mix of CPU and Q&A with Rick Wietfeldt, MIPI Alliance, GPU elements and Al Yanes, PCI-SIG By Frank Altschuler and Jonathan Gallmeier, AMD RapidIO: 10 A modern software platform Optimized for low-latency for the era of multicore and 26 processor connectivity cloud computing By Sam Fuller, RapidIO Trade Association Q&A with Mark Brewer, Typesafe Embedded DisplayPort: 13 Next-generation multicore 29 Increased flexibility and power SoC architectures for tomorrow’s savings render greater display communications networks efficiency By David Sonnier, LSI Corporation By Craig Wiley, VESA 2012 OpenSystems Media ® E-CASTS © 2012 Embedded Computing Design All registered brands and trademarks within Embedded Computing Design Building Intelligent Therapeutic Devices magazine are the property of their respective owners. iPad is a trademark of Apple Inc., registered in the U.S. and other countries. December 11, 12 p.m. EST App Store is a service mark of Apple Inc. Presented by: Wind River ISSN: Print 1542-6408, Online: 1542-6459 Improving Healthcare through Standards and Interoperability December 12, 11 a.m. EST Presented by: IBM, Freescale Semiconductor, Wind River 4 | December 2012 Embedded Computing Design www.embedded-computing.com and PERFORMANCE OR SWaP You Can Do More with Less. XPand6000 Series Small Form Factor (SFF) Systems from X-ES support the highest- performance Freescale™ QorIQ™ and 3rd generation Intel® Core™ i7 processors in the smallest SFF Systems available, at less than 72 in3 and 3.5 lbs. With COM Express processor modules, PMC/XMC I/O, and SSD storage, application-ready SFF Systems enable you to focus on your area of expertise. Call us today to learn more. Extreme Engineering Solutions 608.833.1155 www.xes-inc.com Tight on space and high in performance. That’s Extreme. Advertiser Information Page Advertiser/Ad title 2 Annapolis Micro Systems, Inc. – High performance signal and data ECD Editorial/Production Staff processing 12 EMAC, Inc. – Atom D525 touch PC Warren Webb, Editorial Director Brandon Lewis, Associate Editor 44 AMD – Innovate now! [email protected] [email protected] 28 ATP Electronics – ATP industrial grade Jennifer Hesse, Managing Editor Steph Sweet, Creative Director DRAM and flash products [email protected] [email protected] 3 Avnet – At the point of inception 19 Elma Electronic Inc. – Conveniently Sales Group designed with a small footprint 38 Elma Electronic Inc. – Smart, reliable Tom Varcie International Sales platforms for embedded computing Senior Account Manager Elvi Lee, Account Manager – Asia 39 Embedded Software Store – A marketplace [email protected] [email protected] for software developers Rebecca Barker Gerry Rhoades-Brown 41 embedded world – It’s a smarter world Strategic Account Manager Account Manager – Europe 34 Flexera – The solution company [email protected] [email protected] business model Eric Henry, Strategic Account Manager Regional Sales Managers 27 Interface Concept – Switches and IP routers Barbara Quinlan, Southwest [email protected] 35 Lilee Systems – Seamless M2M [email protected] connectivity Ann Jesse. Strategic Account Manager Denis Seger, Southern California 33 Micron Technology – Semiconductor [email protected] memories for the automotive electronics [email protected] Christine Long industry Sydele Starr, Northern California Vice President, Online Business 36 Microsemi Corporation – FPGA technology [email protected] to deliver new capabilities for systems [email protected] requiring security, low power, reliability, Ron Taylor and integration Reprints and PDFs East Coast/Mid Atlantic 28 PC/104 Embedded Consortium [email protected] – Maintaining and distributing [email protected] PC/104 specifications 37 SafeNet – Monetizing embedded software OpenSystems Media Editorial/Production Staff 25 Supermicro – Embedded building blocks 17 Technologic Systems – Industrial controllers 31 VIA Technologies, Inc. – VIA system on module solution Warren Webb, Editorial Director Sharon Hess, Managing Editor 40 VIA Technologies, Inc. – VIA Technologies embraces both x86 and ARM Embedded Computing Design VITA Technologies 43 Wind River Systems, Inc. – Innovation is [email protected] [email protected] 100 percent reliability 65 million miles from Jennifer Hesse, Managing Editor Monique DeVoe home. Again. Embedded Computing Design Assistant Managing Editor 22-23 WinSystems, Inc. – A 1.66 GHz Intel Atom [email protected] PC/104 and Small Form Factors industrial SBC of EPIC proportions DSP-FPGA.com 5 X-ES – Performance and SWaP Jim Turley, Embedded Moderator Embedded Computing Design [email protected] [email protected] Brandon Lewis, Associate Editor Reader Resources Mike Demler, Editorial Director CompactPCI, AdvancedTCA, & MicroTCA Systems Subscribe to magazines and E-letters: DSP-FPGA.com and EDA Digest [email protected] www.opensystemsmedia.com/subscriptions [email protected] Curt Schwaderer E-casts: ecast.opensystemsmedia.com John McHale, Editorial Director Technology Editor TechChannels: tech.opensystemsmedia.com Military Embedded Systems Steph Sweet [email protected] Creative Director White Papers: whitepapers.opensystemsmedia.com Joe Pavlat, Editorial Director David Diomede CompactPCI, AdvancedTCA, Art Director Videos: video.opensystemsmedia.com & MicroTCA Systems Joann Toth Get news via RSS: [email protected] Senior Designer www.embedded-computing.com/news/rss.xml Jerry Gipper, Editorial Director Konrad Witte, Senior Web Developer VME and Critical Systems [email protected] Matt Jones, Web Developer Editorial/Business Office Patrick Hopper, Publisher Rosemary Kristoff, President Tel: 586-415-6500 [email protected] [email protected] Wayne Kristoff, CTO Subscriptions Updates 16626 E. Avenue of the Fountains, Ste. 201 Karen Layman, Business Manager Fountain Hills, AZ 85268 www.opensystemsmedia.com/subscriptions Tel: 480-967-5581 n Fax: 480-837-6466 Tel: 586-415-6500 n Fax: 586-415-4882 30233 Jefferson, St. Clair Shores, MI 48082 6 | December 2012 Embedded Computing Design www.embedded-computing.com Tracking Trends in Embedded Technology By Warren Webb @warrenwebb [email protected] Bandwidth demands redefine interconnect technology As high-performance embedded devices stretch the limits Subsystem interconnection of technology, subsystem interconnection strategies must strategies must be constantly be constantly updated to match the growing data transfer requirements. Medical instrumentation, military systems, com- updated to match the growing munications installations, and industrial automation are just data transfer requirements. a few areas where soaring bandwidth, increased processing requirements, and escalating application complexity continue cloud data services, telematics, and video/audio streaming. to expand the interconnection technology envelope. Andrew Patterson, business development director for Mentor Graphics Embedded Software Division, presents the advan- Embedded designers are using the latest high-speed inter- tages of developing these evolving vehicle-based applications connects to not only boost data rates, but also dynamically using the Android OS. optimize performance, bypass failed subsystems, and coexist with legacy components. Although several different architec- Along with interconnect and software selections, embedded tures still vie for universal acceptance, there is little doubt that designers must also choose a processor architecture that high-speed interconnect technology has become a necessary maximizes performance while reducing power and cost. In the element of most high-bandwidth embedded systems. Strategies section, technology experts examine the benefits of the growing trend toward multiple processing elements. In the Silicon section of this issue of Embedded Computing In that vein, AMD’s Frank Altschuler, senior product manager, Design, industry experts bring you up-to-date on several high- and Jonathan Gallmeier,
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