Keywords for Surface & Coatings Technology Authors Should Select A

Keywords for Surface & Coatings Technology

Authors should select a maximum of six keywords from Erosion the approved list for Surface & Coatings Technology.If % Grit blast test desired, authors may propose one keyword not currently listed, however the total number of keywords must not exceed six. The author proposed keyword will be printed Hardness in the journal and will be considered for inclusion in the % Nano-indentation approved list in the future. % Vickers hardness test % Brinell hardness test Authors are requested to include the keywords in their % Knoop hardness test manuscript, placing them below the abstract. Each key- % Creep and relaxation test word should be preceded by the capital letter denoting the category from which the keyword has been selected. Any additional keyword proposed by the author must Impact be preceded by the letter X. % Impact Test

If selecting keywords from the list appearing in the Porosity journal or provided by an Editor or the publisher, please % Mercury intrusion porosity tick the appropriate boxes. (MIP)

Rolling contact fatigue [A] Theoretical Methods, Models and Techniques % Twin disc machine

Models Structure % Growth models % Amorphous % Plasma simulation and modelling % Cluster % Reliability models % Creep % Thickness uniformity models % Crystalline % Defects Techniques % Diffusion % Dislocations % Dynamic Monte Carlo methods % Elastic properties % Grain boundary % Grain growth % Impurities [B] Properties and Characterisation % Interfaces % Lattice parameters TESTING/EVALUATION % Nucleation % Phase transitions Abrasion % Structural Zones 1,2,T % Abrasive wheel test % Vacancies % Others (specify) Surface finish Adhesion % Profilometry % Scratch test % Roughness % Others (specify) Thermal degradation % Conductivity % Burner rig test % Resistivity Thickness Corrosion % Ball crater % Immersion test % Interferometry % Impedance spectroscopy % Profilometry % Salt spray % X-ray fluorescence 192 Keywords / Surface and Coatings Technology 105 (1998) 191–194

Wear Cleaning % Block on ring % Abrasive % Pin on disc % Acid % Alkaline CHARACTERISATION % Electrolytic % Emulsion Microscopy % Etching % Atomic force microscopy (AFM) % Grit blasting % Ballistic electron microscopy (BEEM) % Pickling % Field emission microscopy (FEM) % Salt bath % Field ion microscopy % Solvent % Low-energy electron microscopy (LEEM) % Ultrasonic % Reﬂection electron microscopy (REM) % Scanning electron microscopy (SEM) % Scanning transmission electron microscopy (STEM) GASEOUS % Scanning tunneling microscopy (STM) % Transmission electron microscopy (TEM) Physical vapour deposition (PVD)

Diffraction % Electron beam evaporation % Auger electron diffraction % Gas evaporation % Low energy electron diffraction (LEED) % Ion beam evaporation % Photoelectron diffraction % % Reflection high-energy electron diffraction (RHEED) Pulsed laser deposition (PLD) % % Transmission high energy electron diffraction Vacuum evaporation % X-ray diffraction Chemical vapour deposition (CVD) Spectroscopy % Auger electron spectroscopy (AES) % Fast atom beam source (FAB) % Electron energy loss spectroscopy % Hot filament % Ellipsometry % Laser % Field emission spectroscopy % Molecular beam epitaxy (MBE) % Fourier transform infrared spectroscopy % Organometallic CVD % Glow discharge mass spectroscopy (GDMS) % Pack difflusion coatings % Glow discharge optical spectroscopy (GDOS) % Photolaser CVD % Infrared spectroscopy % Inverse photoemission spectroscopy Plasma % Ion scattering spectroscopy % Activated reactive evaporation (ARE) % Mossbauer spectroscopy % Arc evaporation % Photoelectron spectroscopy % Carburising % Photon absorption spectroscopy % % Positron spectroscopy Direct current (DC) % % Raman scattering spectroscopy Electron cyclotron resonance (ECR) plasmas % % Reflection spectroscopy Filtered arc % Rutherford backscattering spectroscopy % Glow discharge sputtering % Scanning tunneling spectroscopy % Ion beam deposition % Secondary ion mass spectroscopy (SIMS) % Ion bombardment % Secondary neutral mass spectroscopy (SNMS) % Ion implantation % Surface photovoltage spectroscopy % Ion plating % Thermal desorption spectroscopy % Magnetron % Microwave [C] Preparation and Processing % Nitriding % Nitrocarburising PREPARATION % PACVD % PAPVD Finishing % Plasma source ion implantation (PSII) % Grinding % Plasma immersion ion implantation (PIII) % Polishing % Pulsed % Shot peening % Radio frequency (RE) Keywords / Surface and Coatings Technology 105 (1998) 191–194 193

% Reactive sputtering % Hafnium % Sputtering % Indium % Iridium SOLUTION STATE % Iron % Lanthanides Chemical solution deposition % Lead % Chemical conversion % Manganese % Chemical etching % Mercury % Chemical reduction % Molybdenum % Cyaniding % Nickel % Electroless deposition % Niobium % Electroplating % Osmium % Trowel coating % Palladium % Platinum Electrochemical deposition % Rhenium % Anodising % Rhodium % Plating % Ruthenium % Scandium Sol gel/slurry coatings % Silver % Sol gel/slurry % Tantalum % Technetium MOLTEN OR SEMI-MOLTEN STATE % Thallium % Thorium % Alloying % Tin % Cementation % Titanium % Cladding % Tungsten % Flame spraying % Uranium % Hardfacing % Vanadium % High velocity oxyfuel (HVOF) % Ytterbium % Hot dip % Yttrium % Hot isostatic pressing (HIP) % Zinc % Laser machining (LBM) % Zirconium % Laser melting % Plasma spraying Non-metals % Sintering % Boron % Thermal spraying % Bromine % Welding % Carbon % Diamond [D] Materials % Graphite % Iodine ELEMENTAL % Phosphorus % Silicon Metals % Alkali metals Gases % Alkaline earth metals % Argon % Aluminium % Chlorine % Antimony % Helium % Arsenic % Hydrogen % Bismuth % Neon % Cadmium % Nitrogen % Cerium % Oxygen % Chromium % Cobalt COMPOUNDS % Copper % Gallium Metal alloys % Germanium % Aluminium alloy % Gold % Chromium alloy 194 Keywords / Surface and Coatings Technology 105 (1998) 191–194

% Copper alloy % Nitrous oxide % Iron alloy % Silane % Nickel alloy % Sulphur dioxide % Titanium alloy % Tungsten alloy Intermetallics % Zinc alloy % Antimonides % Zirconium alloy % Arsenides % Cadmium selenide % Cadmium sulphide Ceramics % Cadmium telluride % Aluminium nitride % Gallium antimonide % Aluminium oxide % Gallium arsenide % Boron carbides % Gallium phosphide % Boron nitride % Gallium selenide % Carbides % Indium antimonide % Chromium carbide % Indium arsenide % Chromium nitride % Indium phosphides % Chromium oxide % Lead telluride % Cubic Boron nitride % Mercury telluride % Cuprous oxide % Nickel sulphide % Indium oxide % Phosphides % Iron oxide % Selenides % Lead oxide % Sulphides % Molybdenum nitride % Tellurides % Molybdenum oxide % Tin telluride % Nickel carbides % Nickel oxide Liquids % Niobium oxide % Hydrogen cyanide % Nitrides % Methanol % Oxides % Silicon carbide Polymers % Silicon nitride % Polyester % Silicon oxide % Polyethylene % Tantalum nitride % Polypropylene % Tin oxide % Titanium carbide Paints % Titanium nitride % Additives % Titanium oxide % Pigments % Tungsten carbide % Resins % Tungsten oxide % Solvents % Uranium oxide % Vanadium oxide Semiconductors % Yttrium oxide % Compound % Zinc oxide % Germanium % Zirconium nitride % Silicon % Zirconium oxide % Cermets and composites Structures % Metal-oxide semiconductor structure (MOS) Gases % Monolayer % Acetylene % Multilayer % Ammonia % Nanostructure % Hydrogen sulphide % Methane [ X ] Optional author selected keyword % Nitrogen dioxide (please specify and tick one of the following categories % Nitric oxide [A] [B] [C] [D])