NEMI

Participant Guidelines and Directory

September 2004

Connect with and Strengthen your Supply Chain TABLE OF CONTENTS

Introduction ...... 2

Projects ...... 4

Legal Documents ...... 5

Some Anti-Trust Do’s and Don’ts ...... 6

Export Compliance Protocol for NEMI Projects...... 7

NEMI Secretariat Services...... 8 • Meetings...... 8 • Communications/Software ...... 9 • Publicity...... 9

Member Companies/Organizations...... 10

NEMI Leadership...... 11

NEMI Member Directory – September 2004 ...... 19

1 NEMI Participant Guidelines & Directory INTRODUCTION

PURPOSE OF GUIDELINES The purpose of the NEMI Member Guidelines is to provide a general overview of NEMI structure and basic information that will assist you.

NEMI MISSION The National Electronics Manufacturing Initiative is a North American based consortium whose mission is dedicated to providing leadership for the global electronics manufacturing supply chain for the benefit of its member companies and the industry. NEMI members use existing resources to develop and deploy new manufacturing technologies and efficient business practices necessary to maintain a responsive supply chain infrastructure. Since many of NEMI’s members are global companies, coordination is encouraged with other regions to achieve global solutions.

NEMI STRUCTURE/ORGANIZATION NEMI is a consortium (organized as a 501(c)(6) corporation) made up of Electronic Equipment Manufacturers, their suppliers, other consortia/ associations, government agencies, and universities. As seen in the organization chart below, the group is headed by a board of directors that is elected by the NEMI Council of member representatives. The Technical Committee, driving both roadmapping and implementation efforts, is led by industry/staff co-chairs appointed by the board. The board also sponsors the Business Leadership Team to address selected business/supply chain topics.

Technology Working NEMINEMI Board Board Group Optoelectronics ofof DirectorsDirectors NEMINEMI Staff Staff Technology Technology Elected by NEMI Council Elected by NEMI Council SecretarySecretary to to BoD BoD Integration Working Representatives Representatives CommunicationsCommunications Group EMS Directors Group EMS Directors MembershipMembership Development Development OEM Directors OEM Directors TechnicalTechnical Facilitation Facilitation Supplier Directors Substrates Technology Supplier Directors StrategicStrategic Objectives Objectives Working OperationalOperational Responsibility Responsibility Technology Group Integration • Group • Technology Board Assembly Technical Committee • Roadmapping Technical Committee Implementation Technology Technology 19 Industry EMS,EMS, OEM, OEM, Supplier Supplier & & Integration Academia/Government 5 NEMI Working TWGs Academia/Government TIGs Group Group RepresentativesRepresentatives Product Life Cycle Information Product Need Business Management Roadmapping Business Technology Leadership ResearchResearch Committee Committee LeadershipLeadership Integration 7 Industry TeamTeam Group PEGs EMS,EMS, OEM, OEM, Supplier Supplier & & Academia/GovernmentAcademia/Government EMSEMS & & OEM OEM Environmentally RepresentativesRepresentatives RepresentativesRepresentatives Conscious Product Product Electronics Emulator Emulator Technology Group Group Integration Group

Technology Working Groups (TWGs) and Product Emulator Groups (PEGs) are involved with the roadmapping activities while the Technology Integration Groups (TIGs) drive the implementation projects. A small permanent staff, the executive Secretariat, provides the administrative framework for the group activities. Contact information for all of the people filling these roles can be found in this Directory.

2 NEMI Participant Guidelines & Directory CURRENT NEMI FUNCTIONS NEMI employs an innovative strategy to achieve its goals. First, NEMI forecasts major trends in the evolution of technology across 19 different disciplines. Second, NEMI defines future virtual products from seven market segments and then identifies the technologies and processes (both business and technical) that will be necessary to design and produce those products in our increasingly distributed manufacturing environment. Then, comparison of the virtual products’ requirements with projected technology/ infrastructure trends enables NEMI members to identify and address gaps in the industry supply chain for high volume electronics. The methodology followed by NEMI is shown below.

NEMI TECHNICAL METHODOLOGY

Technology Product Evolution Needs Roadmap Project Global Completion Participation

Disruptive Available Technology to Market Government Place Competitive GAP Research Solutions Analysis No Work Academia Required NEMI Users & Suppliers Regional Collaboration Industry Solution Projects Needed

For those efforts requiring fundamental R&D, NEMI works with government agencies, universities, and other consortia to ensure that the work is properly funded and undertaken. In those cases where the technology exists but is lacking in infrastructure, interested NEMI member companies will form projects to address the needs identified. From both the roadmapping and the project activities, standards initiatives can be identified. Through the project process, NEMI will work to ensure that the standards are created by collaborating with the appropriate standards groups. For emerging topics to industry, NEMI organizes and conducts forums to educate, communicate, and identify new areas of industry collaboration.

NEMI FUNDING AND PARTICIPATION NEMI projects will be funded primarily through the use of in-kind resources by industry participants.

ROLES AND RESPONSIBILITIES The following roles and responsibilities are provided for the various NEMI functions.

• NEMI Council Represents all organizations participating in NEMI. The Council also elects the Board of Directors (staggered 3-year terms). • NEMI Board of Directors Has operational responsibility for the organization. This group approves the strategy, plans, and budget of NEMI. • Technical Committee Facilitates and coordinates all NEMI technical activities. This group also develops and integrates the NEMI technical strategy and plans. • Business Leadership Team Facilitates and coordinates all NEMI business gap activities. The group also supports the TC, TIGs, and TWGs relative to business topics. • Research Committee Responsible for stimulating research in areas identified as gaps during the NEMI roadmapping process. 3 NEMI Participant Guidelines & Directory • Technology Working Groups (TWGs) Responsible for developing technology roadmaps. Participation in roadmapping activities does not require membership in NEMI. • Product Emulator Groups (PEGs) Responsible for developing product emulator roadmaps. Participation in roadmapping activities does not require membership in NEMI. • Technology Integration Groups (TIGs) Responsible for identifying technology needs and facilitating the formation and management of projects. • Project Teams Responsible for implementing NEMI projects to approved Project Statements (see NEMI Project Participation Agreement). • NEMI Secretariat Responsible for corporate office functions and providing staff support to all other NEMI activities.

PROJECTS BACKGROUND During the Roadmap process the Technology Working Groups (TWGs) analyze the future technology requirements defined by the product emulators against the predicted technology advancements as forecasted. The differences between product needs and technology trends are identified as gaps – both business and technical – that need to be filled if the global supply chain is to maintain world class manufacturing capabilities. The Technology Integration Groups (TIGs) identify projects that need to be undertaken by member companies in order to fill these gaps.

PROJECT PROCESS Once the Technology Integration Group (TIG) has determined a technical or business area where projects are needed, one or more project champions are located to initiate the project process. Representatives from member companies meet to define the project. This generally starts with a Definition of Requirements from companies (generally OEMs and/or EMS providers) who will be the end users of the project deliverables. The member company representatives then define a Statement of Work (SOW) that will be undertaken to develop the necessary capabilities to satisfy user needs. The SOW is submitted to the NEMI Technical Committee for review and approval, after which it is forwarded to the key technical contact in each member company, and company participation is solicited. The project can proceed if at least two member companies commit to the program, although we prefer a larger participation to help ensure broad industry support. The actual work on the project is carried out by the member companies. The responsibilities of each member are defined at the beginning of each project. Each company commits the necessary resources to carry out its assigned responsibilities. Provisions are made for each member company to protect their intellectual property, which is also clearly delineated at the beginning of the project. Upon completion of the project, all team members share in the results. Project results also may or may not be shared with all NEMI members and/or the industry in general. This is defined by the members of the project team at the beginning of the project. It may be necessary to develop new Standards as a result of the NEMI project work. In this case, NEMI will work with existing Standards bodies to accept, release, and maintain the new standard. Where appropriate, NEMI will help such a Standards body to develop and get approval for such standards. The overall Project Process, the Release Process, and the NEMI Standards Policy are available on the NEMI members’ website (http://www.nemi.org/x1Private/index.html).

LEGAL DOCUMENTS* NEMI BY-LAWS This document defines the purpose of the organization, membership requirements, classes of membership, privileges of membership, election of the Board of Directors, powers of Council and Board, Officers of the corporation, and meeting protocols.

NEMI PROJECT PARTICIPATION AGREEMENT This document describes the process for project formation, management, reporting, and closure. Customization of a particular project is allowed as part of the described documents (Statement of Work, Project Statement, IP Declarations).

NEMI INTELLECTUAL PROPERTY POLICY This document provides the umbrella policy to outline how Intellectual Property is handled during a NEMI Project. As with the Project Agreement, alternatives are allowed for in the handling of background technology and project inventions.

* Copies of these legal documents are available from the Secretariat. They are also posted on the NEMI members’ website (http://www.nemi.org/ x1Private/index.html) under the “Guidelines & Policies” tab. 4 NEMI Participant Guidelines & Directory NEMI MEMBERSHIP AGREEMENT This is a one-page document that must be signed by all members to indicate that they will abide by the By- laws, Project Participation Agreement, and the Intellectual Property Policy.

NEMI ANTI-TRUST POLICY AND GUIDELINES The essential principle that should guide the policies and activities of the Initiative is that all agreements reached or carried out through the corporation must conform to United States Anti-Trust laws. NEMI must also avoid any conduct that could be interpreted by a disinterested third party as a violation of the anti-trust laws. Staff, officers, directors, and members of NEMI should be particularly on guard as to conduct or agreements affecting areas of particular anti-trust concern — such as pricing, conflict of interest, and standardization. Counsel should be consulted concerning the Initiative’s policies and programs and should attend all Council and Board of Directors meetings.

SOME ANTI-TRUST DO’S AND DON’TS Members can participate fully in NEMI activities and projects with minimal possibility of anti-trust problems by following a few simple do's and don'ts: 1. DO schedule and attend meetings only when there are proper items of substance to be discussed that justify your attendance. 2. DO review the meeting notice or agenda in advance of every meeting. It should be specific, without broad topics, such as "marketing practices," that might look suspicious from an anti-trust standpoint. 3. DO adhere strictly to the stated agenda. In general, subjects not included on the agenda should not be considered at the meeting. 4. DO ensure that no matter of doubtful legality is brought up for discussion. This, of course, is counsel's responsibility; but in his or her absence, the Initiative staff representative or any member present who becomes aware of legal implications of a discussion should attempt to halt the discussion. 5. DO make sure that minutes of all meetings are kept and that they accurately report what actions were taken. 6. DO use NEMI as a vehicle for promoting research and the industry as a whole. 7. DO send copies of all NEMI-related correspondence to the NEMI Secretariat and advise the Secretariat of any inaccuracies in proposed statements to be made by NEMI. 8. DO ensure that NEMI counsel is in attendance at all meetings of the Initiative where legally sensitive subjects might be discussed. 9. DO check with NEMI staff, who will likely contact counsel, if there is doubt about the legality of any NEMI policy or program. 10. DO cooperate with NEMI counsel in all matters, particularly when counsel has ruled adversely about a particular activity. 11. DON'T allow or participate in secret or "rump" meetings. At best, these meetings raise questions as to the propriety of what is discussed. They could seriously jeopardize legitimate NEMI activities and create a risk that those activities will be investigated. 12. DON'T allow or participate in any discussions that discourage research or research projects by persons outside of NEMI. 13. DON'T, without specific authorization, make public or private communications about policies or positions of the Initiative.

5 NEMI Participant Guidelines & Directory EXPORT COMPLIANCE PROTOCOL FOR NEMI PROJECTS Before starting a Project, the Project Team should: • Consult with a company export compliance officer about the project. • Determine whether any item or technology to be used could be on the United States Munitions List (USML). A license will be required for the transfer of any item on the USML or of related data to a non-U.S. person, wherever located. • Determine whether any item or technology to be used could be on the Commerce Control List (CCL). • Ascertain the purpose for any item or technology that appears on the CCL. • Ascertain the nationality of any non-U.S. citizen or permanent resident located in the United States who is likely to be involved in the project. • Ascertain the nationality and affiliation of any non-U.S. citizen or permanent resident not located in the United States who is likely to be involved in the project. • Seek the input of a company export compliance officer with respect to any items or technology that appear on the CCL, the purpose to which the item is to be put, and the nationality and affiliation of any non-U.S. citizen or permanent resident likely to be involved in the project. • Receive clearance from an export compliance officer before starting the project. During the Project, the Project Team should: • Conduct periodic reviews (3-6 month periods) of items and technology being used in the project to determine if any could appear on the CCL or USML. • Follow procedures above for all items or technology that appear on the CCL or USML. • Maintain a current list of the "approved" non-U.S. citizens and permanent residents working on the project, and obtain the approval of a company export compliance officer before adding someone or involving anyone on that list in a new phase of the project. Compliance with U.S. export control laws is the responsibility of each NEMI project team member. The individual team members and their companies are the parties responsible for ensuring compliance with U.S. export control laws.

6 NEMI Participant Guidelines & Directory NEMI SECRETARIAT SERVICES

The NEMI Secretariat is available to provide support services to the membership as defined below:

FUNCTIONS OF THE NEMI SECRETARIAT

NEMI Council

Public Relations NEMI Board of Directors

Secretariat Member Recruitment Technical Committee

Business Leadership Team External Organization and Industry Group Roadmapping Activities TIGs

Externally Managed Projects Technical Programs Internal Liaison External Liaison

Operations Management • Vision, Purpose, Strategy • Legal, Operation & Business Dissemination Affairs • Technical Plan Description & • Business & Technical Calendars Promotion • Operations Assessment • Benefits & Value Assessment & • Financials and HR Description • BoD and TC Meetings Secretary • External Linkage Development - Industry Associations Information Services - Consortia • Communication Channels - Government • Recordkeeping & Databases • Roadmapping • Document Generation • Public Announcements • Action Register • New Membership Development

Technical Oversight & Facilitation • Member of TC and Business Leadership Team (Strategies) • TIG Mentoring • Project Facilitation

MEETING RESPONSIBILITIES The NEMI Secretariat is always available to answer questions and assist in planning NEMI related meetings, telephone conferences, and web services. In addition, the Secretariat maintains a meeting schedule on the NEMI website. We need your input to keep the schedule current. Please provide meeting schedules and venues to the Secretariat so that we can keep the master schedule up to date and support queries from the membership. The Secretariat is responsible for all Board of Directors Meetings, Technical Committee Meetings, Council Meetings, Gap Analysis Meetings, and General Roadmap meetings (i.e., not TWG specific). All other meetings and telephone conferences will be organized and conducted by the Project Chairs, TIG Chairs, and TWG Chairs. Upon request, the Secretariat may be able to help with other meetings, particularly if they are held in the Herndon, VA facility.

7 NEMI Participant Guidelines & Directory MEETING/FUNCTION ATTENDANCE Participation in TIG meetings, TC meetings, Gap Analysis meetings, Project meetings, and Council meetings requires NEMI membership. In some cases, however, companies wish to participate in some of these meetings as part of their “due diligence” process in order to determine if they should make the commitment to join NEMI. Please refer any such requests to the Executive Director who will contact the prospective member to ensure that they have the full membership information package, are eligible, and are in fact considering membership in NEMI.

COMMUNICATIONS/SOFTWARE Members are expected to exploit computer and communications technologies in the conduct of their business. The use of common tools can provide for ease of communication and information dissemination among the organizations participating in NEMI. Some tools that are recommended for use by NEMI members are:

• Microsoft Office 2000 o Word Processor: Microsoft Word o Graphics: Microsoft PowerPoint o Spreadsheet: Microsoft Excel o Email: Microsoft Outlook • Teleconferencing: Premiere Conferencing

Presentation and other templates are available on the NEMI members-only website. Where possible, NEMI will use electronic mail for dissemination of reports and information. NEMI will also maintain a World Wide Web home page (http://www.nemi.org) for public consumption, as well as a members-only area. The NEMI Secretariat provides a confidential File Transfer Protocol (FTP) site for members-only information exchange. Members can access the private members’ website by browsing http:// www.nemi.org/x1Private/, user name “nemi”. This area contains the Secretariat Calendar, the NEMI Newsletter, as well as project updates and guidelines. The member’s-only FTP site is located at ftp.nemi.org. Both sites require a password to access. Passwords can be obtained by contacting the Secretariat. Please contact the NEMI Secretariat at 703-834-0330 or [email protected] with any questions or requests.

PUBLICITY A primary goal of NEMI is to affect fundamental changes in the electronics manufacturing infrastructure for the global supply chain. Toward this end, we seek as much visibility as possible through conferences, seminars, contributed articles and press releases. Member companies are encouraged to seek opportunities for publicity, but they should make sure that the NEMI staff is actively involved in the preparation and approval of materials. Any project-specific information that is included in a press release, contributed article or conference paper/presentation must fall within the project’s information sharing guidelines, as defined by the project Statement of Work and Participation Agreement, and NEMI’s IP policy. Consistent with these requirements, project teams — along with a member of the NEMI Secretariat — will review/approve all press releases and contributed articles and/or papers prior to release. For conference presentations, the portions of a presentation dealing with project materials must be reviewed. If you have an idea — or a specific opportunity — for a press release, contributed article or presentation, please contact NEMI’s Director of Communications (Cynthia Williams) for whatever assistance may be needed for preparation and approval of materials. An archive of NEMI press releases is maintained on the NEMI website (www.nemi.org — in the Newsroom).

8 NEMI Participant Guidelines & Directory MEMBER COMPANIES/ ORGANIZATIONS

3M Advanced Micro Devices, Inc. Integrated Electronics (AMD) Engineering Center (IEEC), AeA (formerly American Electronics SUNY-Binghamton Association) Intel Corporation Agile Software Corporation IPC–Association Connecting Agilent Technologies, Inc. Electronics Industries Alcatel Canada Inc. Jabil Circuit, Inc. AMR Research, Inc. Kester Asymtek Kulicke and Soffa Industries, Inc. Aurora Instruments, Inc. LACE Technologies BTU International, Inc. Lucent Technologies Celestica, Inc. Massachusetts Institute of Centor Software Corporation Technology (M.I.T.) Centre for Microelectronics MatrixOne, Inc. Assembly and Packaging META Group, Inc. (CMAP) Microsoft Cisco Systems, Inc. Ministère du Développement Cookson Electronics économique et régional et de la • Alpha Metals, Inc. recherche (Province of Quebec) Cray Inc. Motorola, Inc. Dell, Inc. Nanodynamics, Inc. Delphi Electronics & Safety National Center for Dover Technologies Manufacturing Sciences (NCMS) • Everett Charles Technologies National Institute of Standards • Universal Instruments and Technology (NIST) Corporation Nihon Superior Co., Ltd. Nortel Networks • Vectron International Plexus Corp. • Vitronics Soltec Rohm and Haas Electronic Materials E2open Sanmina-SCI Corporation Electronic Industries Alliance Senju Comtek Corp. (EIA) Solectron Corporation Endicott Interconnect Technologies, Speedline Technologies, Inc. Inc. (EIT) StorageTek® FCI Sumitomo Electric Lightwave Foxconn Corporation Georgia Institute of Technology Sun Microsystems, Inc. Henkel Teradyne, Inc. Heraeus, Inc. Texas Instruments Incorporated Hewlett Packard Company Total Parts Plus IBM Corporation Tyco Electronics Corporation Indium Corporation of America Virginia’s Center for Innovative Technology (CIT) Vytran Corporation

9 NEMI Participant Guidelines & Directory NEMI LEADERSHIP

BOARD OF DIRECTORS

Nasser Grayeli (Intel Corporation), Chairman of the Board Assistant: Jan Martinez ([email protected]; 480-552-2795) Marc Benowitz (Lucent Technologies) Assistant: Kanta Gurnani ([email protected]; 908-582-6432) Mike Coady (Delphi Electronics & Safety) Assistant: Cindy K. Roe ([email protected]; 765-451-0795) Blair Davies (Celestica, Inc.) Katherine Frase (IBM) Sundar Kamath (Sanmina-SCI) Eugene McCabe (Sun Microsystems, Inc.) Assistant: Gorete Cunha ([email protected]; 510-315-5646) Minoru Okamoto (Tyco Electronics Corporation) Assistant: Karol Dostalik ([email protected]; 717-986-5470) Assistant (Japan): Tomoko Shirasaka ([email protected]; (81)44-844-8000) John E. Pomeroy (Dover Technologies) Assistant: Jan Houseknecht ([email protected]; 607-779-6761) Mike Toben (Rohm and Haas Electronic Materials) Assistant: Judy Sweeney ([email protected]; 516-868-8800 x259) Iwona Turlik (Motorola) Assistant: Blanca Trevino ([email protected]; 847-538-7694) Mauro J. Walker (Motorola, retired) (Chairman Emeritus)

EX-OFFICIO BOARD MEMBERS Bill Anderson (NIST) Assistant: Sheilda Bryner ([email protected]; 301-975-2220) Frederick F. Kuhlman (Delphi Electronics & Safety) Jim McElroy (NEMI Secretariat) Robert C. Pfahl, Jr. (NEMI Secretariat)

COUNSEL

Christopher Hanback (Holland & Knight LLP) ([email protected]; 202-457-7157)

TECHNICAL COMMITTEE MEMBERS

Frederick F. Kuhlman (Delphi Electronics & Safety), Co-Chair Robert C. Pfahl, Jr. (NEMI Secretariat), Co-Chair; NERCC Chair Jim Arnold (Motorola), Director of Roadmapping Bill Bader (Intel Corporation) Bill Ballard (3M) Bill Barthel (Plexus Corp.) Koen Gieskes (Universal Instruments Corporation) Leslie Guth (Lucent Technologies), Co-Director of Planning Carol Handwerker (NIST), Co-Chair, Research Committee Eamon O’Keeffe (Sanmina-SCI) Alan Rae (Nanodynamics, Inc.), Chair, Research Committee; Director of Research Srinivas Rao (Solectron Corporation), Co-Director of Planning Rao Tummala (Georgia Institute of Technology)

EX-OFFICIO TECHNICAL COMMITTEE MEMBERS Alan Allan (Intel Corporation), ITRS Representative David Godlewski (NEMI Secretariat), Staff Manager of Planning Chuck Richardson (NEMI Secretariat), Staff Manager of Roadmapping

RESEARCH COMMITTEE Alan Rae (Nanodynamics, Inc.), Chair Carol Handwerker (NIST), Co-Chair Robert C. Pfahl, Jr. (NEMI Secretariat), Secretary Srinivas Rao (Solectron Corporation) D.H.R. Sarma (Delphi Electronics & Safety) Rao Tummala (Georgia Institute of Technology)

10 NEMI Participant Guidelines & Directory BUSINESS LEADERSHIP TEAM

Richard Kubin (E2open), Chair Jim McElroy (NEMI Secretariat), Co-Chair Vinay Asgekar (AMR Research) Marc Benowitz (Lucent Technologies) Craig Brown (Intel) Blair Davies (Celestica) James Dickerson (IBM) Steve di Loreto (Plexus Corp.) Phil Metz (Solectron) Rod Walker (Altus Consulting)

TECHNOLOGY WORKING GROUP (TWG) CHAIRS

Roadmap Jim Arnold (Motorola), Director of Roadmapping Chuck Richardson (NEMI), Staff Manager of Roadmapping Board Assembly Kirk Van Dreel (Plexus), Chair Dennis Krizman (Celestica), Co-Chair Connectors John MacWilliams (Consultant), Chair Displays M. Robert Pinnel (USDC), Chair J. Norman Bardsley (USDC), Co-Chair Energy Storage Systems Daniel Doughty (Sandia National Laboratories), Chair Ralph Brodd (Broddarp of Nevada), Co-Chair Environmentally Conscious Mark Newton (Dell), Chair Electronics Joe Johnson (Microsoft), Co-Chair Final Assembly Mike Reagin (Delphi), Chair Reijo Tuokko (Tampere University), Co-Chair Interconnect Substrates – Ceramic Howard Imhof (Metalor Technologies USA), Chair Ton Schless (MIDAS Vision Systems), Co-Chair Interconnect Substrates – Organic Jack Fisher (Consultant), Chair Dieter Bergman (IPC), Co-Chair Mass Data Storage Tom Coughlin (Coughlin Associates), Chair Roger Hoyt (Hitachi Global Storage Technology), Co-Chair

Modeling, Simulation & Sanjeev Sathe (ASE (US) Inc.), Chair Design Tools SB Park (State University of New York at Binghamton), Co-Chair Optoelectronics John Stafford (JWS Consulting), Chair Laura Turbini (CMAP), Co-Chair Packaging Joseph Adam (Skyworks Solutions), Chair Bill Bottoms (3MT Solutions), Co-Chair Passive Components Philip Lessner (KEMET Electronics), Chair Joseph P. Dougherty (Penn State), Co-Chair Product Lifecycle Information Eric Simmon (NIST), Chair Management (PLIM) RF Components and Vijay Nair (Intel), Chair Subsystems John Barr (Agilent Technologies), Co-Chair Steve Kenney (Georgia Institute of Technology), Co-Chair Semiconductor Technology Paolo Gargini (Intel), Chair Alan Allan (Intel), Co-Chair

11 NEMI Participant Guidelines & Directory TECHNOLOGY WORKING GROUP (TWG) CHAIRS (CONTINUED)

Test, Inspection & Measurement Michael J. Smith (Teradyne), Chair Stig Oresjo (Agilent Technologies), Co-Chair Sensors Mike Azarian (CALCE – University of Maryland), Chair Michael Pecht (CALCE – University of Maryland), Chair Gans Ganesan (CALCE – University of Maryland, Co-Chair) Thermal Management Cam Murray (3M), Chair Tom Roth (3M), Chair Alex Vukovic (University of Ottowa), Co-Chair/NETCOM Lead

PRODUCT EMULATOR GROUP (PEG) CHAIRS

Aerospace/Defense Bill Murphy (Lockheed Martin), Chair

Automotive Jim Spall (Delphi), Chair

Consumer/Portable Products Gerry Bird (3M), Chair

Medical Products Terry Dishongh (Intel), Chair

Network, Datacom, Telecom Michael Schabel (Bell Laboratories, Lucent Technologies), Chair (Netcom)

Office/Large Business Systems George Katopis (IBM), Co-Chair Erich Klink (IBM), Co-Chair Tom Pearson (Intel), Co-Chair

System in Package (SIP) Joseph Adam (Skyworks Solutions), Chair

TECHNOLOGY INTEGRATION GROUP (TIG) CHAIRS, PROJECT CHAIRS, AND GROUP CHAIRS

Board Assembly TIG Tom Pearson (Intel), Chair DPMO (Defective Parts Tim Kruse (Plexus), Chair per Million Opportunities) David Mendez (Solectron), Co-Chair Project

Materials & Processes for Chair TBD High-Frequency Products Initiative (in conjunction with Substrates TIG)

Substrate Surface Finishes Keith Newman (Sun Microsystems), Chair for Lead-Free Assembly Charan Gurumurthy (Intel), Co-Chair Project (in conjunction with Substrates TIG)

Environmentally Conscious Chair TBD Electronics TIG Lead-Free Assembly and Rework Gerald Gleason (Hewlett Packard Company), Co-Chair Charles Reynolds (IBM), Co-Chair Assembly Process Matt Kelly (Celestica), Chair Development Components and Materials Ken Lyjak (IBM), Chair

12 NEMI Participant Guidelines & Directory TECHNOLOGY INTEGRATION GROUP (TIG) CHAIRS, PROJECT CHAIRS, AND GROUP CHAIRS (CONTINUED)

Reliability Patrick Roubaud (Hewlett Packard Company), Chair Rework Process Development Jasbir Bath (Solectron), Chair Lead-Free Wave Soldering Denis Barbini (Vitronics Soltec), Chair Assembly Process Project Paul Wang (Sun Microsystems), Co-Chair Bill of Material (BOM) Kitty Pearsall (IBM), Chair Working Group Process Development Quyen Chu (Jabil), Chair Working Group Test Vehicle Design Kevin Heimerman (Plexus), Acting Chair Working Group RoHS Transition Task Group Dave McCarron (Dell), Chair Project Assembly Process Specifications Frank Grano (Sanmina-SCI), Chair Project Component and Board Marking Vivek Gupta (Intel), Chair Project Alan Ater (Sanmina- SCI), Co-Chair Component Supply Chain Ty Bolenbaugh (Intel), Chair Readiness Project Alan Ater (Sanmina-SCI), Co-Chair Materials Declarations Project Nancy Bolinger (IBM), Chair Diane Fisher (Hewlett Packard Company), Co-Chair Tin Whisker Accelerated Valeska Schroeder (Hewlett Packard Company), Chair Test Project Mark Kwoka (Intersil Corp), Co-Chair Jack McCullen (Intel), Co-Chair Tin Whisker Modeling George Galyon (IBM), Chair Project Maureen Williams (NIST), Co-Chair Tin Whisker User Group Joseph Smetana (Alcatel), Chair Richard Coyle (Lucent), Co-Chair

Optoelectronics TIG Peter Arrowsmith (Celestica), Chair Fiber Connector End-Face Tatiana Berdinskikh (Celestica), Chair Inspection Specifications Heather Tkalec (Alcatel Canada), Co-Chair Project Fiber Optic Signal Tatiana Berdinskikh (Celestica), Chair Performance Project Heather Tkalec (Alcatel Canada), Co-Chair Fiber Optic Splice Improvement Peter Arrowsmith (Celestica), Chair Project Fiber Optic Splice Loss Peter Arrowsmith (Celestica), Chair Measurement Specification Matt Brown (US Conec Ltd.), Co-Chair Initiative

Product Lifecycle Information John Cartwright (Intel), Co-Chair Management (PLIM) TIG Barbara Goldstein (NIST), Co-Chair Data Exchange Industry Chair TBD Adoption Initiative PDX Extensions & Updates Barbara Goldstein (NIST), Chair (PDX 2.0) Initiative Materials Composition Data Richard Kubin (E2open), Chair Exchange Initiative Marissa Yao (Intel), Co-Chair

13 NEMI Participant Guidelines & Directory Substrates TIG Hamid R. Azimi (Intel), Chair High Frequency Material Hamid Azimi (Intel), Chair Effects on HDI Formation Jack Fisher (Consultant), Co-Chair Project (joint Project with IPC) Materials & Processes for Chair TBD High-Frequency Products Initiative (in conjunction with Board Assembly TIG)

Optoelectronics for Substrates Jack Fisher (Consultant), Chair Initiative

Substrate Surface Finishes Keith Newman (Sun Microsystems), Chair for Lead-Free Assembly Charan Gurumurthy (Intel), Co-Chair Project (in conjunction with Board Assembly TIG)

NEMI SECRETARIAT

CEO/Executive Director Jim McElroy Vice President of Operations/ Robert C. Pfahl, Jr. Treasurer Staff Manager of Planning David Godlewski Office Manager Linda Anderson-Jessup NEMI General Counsel Christopher Hanback (Holland & Knight LLP) Consultants Georg Anderson, Net/Systems Administrator Ron Gedney, Deployment Chuck Richardson, Staff Manager, Roadmapping Dee-Dee Taylor, Office Assistant George Till, Roadmapping Rod Walker (Altus Consulting), Business Leadership Team Cynthia Williams, Director of Communications

14 NEMI Participant Guidelines & Directory NEMI DIRECTORY – SEPTEMBER 2004

This section contains names of key contacts for NEMI companies (e.g., company representatives, Board of Directors, Technical Committee members, Research Committee members, and Business Leadership Team members), TWG/roadmapping leaders, and TIG/project chairs, based on our database records. While we strive to keep this information current, our rapidly changing industry creates a great deal of churn. Please provide change input to the Secretariat for inclusion in the next biannual release.

Mr. Joseph Adam Dr. William Anderson Chair, Packaging TWG; Chair, System in Board of Directors - Ex-officio Package (SIP) Product Emulator Group Director, Electronics and Electrical (PEG) Engineering Laboratory Vice President, Strategic Marketing National Institute of Standards and Skyworks Solutions Technology (NIST) 5221 California Ave., 41-1 Room B358 Irvine, CA 92612 100 Bureau Drive, Stop 8100 Phone: 949-231-4848 Gaithersburg, MD 20899-8100 Fax: 949-483-3911 Phone: 301-975-2220 Email: [email protected] Fax: 301-975-4091 Email: [email protected] Mr. Steven J. Adamson Market Manager Ms. Linda Anderson-Jessup Asymtek Office Manager 2762 Loker Avenue West NEMI Secretariat Carlsbad, CA 92008 2214 Rock Hill Road Phone: 760-930-7274 Suite 110 Fax: 760-930-7439 Herndon, VA 20170-4214 Email: [email protected] Phone: 703-834-2086 Fax: 703-834-2735 Mr. Alan Allan Cell: 571-241-5331 Co-Chair, Semiconductor Technology TWG; Email: [email protected] Ex-officio Technical Committee Member, ITRS Representative Mr. William Archey Staff Engineer, Technology Manufacturing President & CEO Group; External Programs, SRG AeA (formerly American Electronics Intel Corporation Association) M/S CH6-312 601 Pennsylvania Avenue, NW 5000 W. Chandler Blvd. Northwest Building, Suite 600 Chandler, AZ 85226-3699 Washington, DC 20004 Phone: 480-554-8624 Phone: 202-682-9110 Fax: Call office for best fax # Fax: 202-682-9111 Email: [email protected] Mr. David J. Arendash Mr. Georg Anderson Staff Process Development Engineer Net/Systems Administrator FCI Electronics, Inc. NEMI Consultant Lenape Drive, RR1, Box 212 5655 Beverlies Mill Road Mount Union, PA 17066 Broad Run, VA 20137 Phone: 814-542-5965 Phone: 540-349-8881 Fax: 814-542-5885 Fax: 703-834-2735 Email: [email protected] Email: [email protected]

15 NEMI Participant Guidelines & Directory Dr. James N. Arnold CALCE - University of Maryland Technical Committee; Director of CALCE Electronic Products and Systems Roadmapping; Coach, Environmentally Center Conscious Electronics TIG Room 2106A, Martin Hall Director R&D, Strategy & Technology College Park, MD 20742 Physical Realization Research Center of Phone: 301-405-8126 Excellence Fax: 301-314-9269 Motorola, Inc. Email: [email protected] M/S IL02 1014 1301 E. Algonquin Rd. Dr. Hamid R. Azimi Schaumburg, IL 60196 Chair, Substrates TIG; Project Chair, High Phone: 847-576-2753 Frequency Material Effects on HDI Fax: 847-576-2111 Formation Email: [email protected] Manager, Substrate, Subcon and Passive Technology Development Dr. Peter Arrowsmith Intel Corporation Chair, Optoelectronics TIG; Project Chair, Assembly Technology Development Dept. Fiber Optic Splice Improvement; Project CH5-159 Chair, Fiber Optic Splice Loss 5000 W. Chandler Blvd. Measurement Specification Chandler, AZ 85226-3699 Global Engineering Consultant, Corporate Phone: 480-554-1335 Process Technology Fax: 480-554-1521 Celestica, Inc. Email: [email protected] 844 Don Mills Road, M/S 33/349 North York, Ontario M3C 1V7 Mr. Bill Bader Canada Technical Committee; Coach, Board Phone: 416-448-4906 Assembly TIG Fax: 416-448-4736 General Manager, Systems Manufacturing Email: [email protected] Technology Development Intel Corporation Mr. Vinay Asgekar 5200 N.E. Elam Young Parkway, M/S HF1- Business Leadership Team 08 Director, Semiconductor and High Tech Hillsboro, OR 97124-6497 Research Phone: 503-696-7303 AMR Research, Inc. Fax: 503-696-5150 1920 Main Street, Suite 301 Email: [email protected] Irvine, CA 92614 Phone: 949-471-5301 Mike Baker Fax: 949-477-5350 Director, High Technology Business Email: [email protected] Practices Alan Ater MatrixOne, Inc. Project Co-Chair, Component and Board 210 Littleton Road Marking; Project Co-Chair, Component Westford, MA 01886 Supply Chain Readiness Phone: 978-589-4059 Supply Chain Manager Fax: 801-340-2911 Sanmina-SCI Inc. Email: [email protected] Supply Chain Management P.O. Box 1000 William V. Ballard Huntsville, AL 35807 Technical Committee Phone: 256-882-4211 Business Unit Manager for the Multilayer Fax: 256-882-4087 Interconnect Products Organization Email: [email protected] 3M 3M-Eau Claire Dr. Michael H. Azarian 2020 Prairie Lane Chair, Sensors TWG Eau Claire, WI 54702-2300 Assistant Research Scientist Phone: 715-830-3048 16 NEMI Participant Guidelines & Directory Fax: 715-830-3030 Email: [email protected] Email: [email protected] Mr. Brian D. Bauer Business Manager, Surface Mount Materials Dr. Denis Barbini Heraeus, Inc. Project Chair, Lead-Free Wave Soldering Circuit Materials Division Assembly Process 24 Union Hill Road Advanced Technologies Manager W. Conshohocken, Vitronics Soltec PA 19428-2736 2 Marin Way Phone: 610-825-6050 ext 247 Stratham, NH 03885 Fax: 610-825-7061 Phone: 603-772-7778 ext 207 Email: [email protected] Fax: 603-772-7776 Email: [email protected] Mr. Brian Bell Component Engineer Dr. J. Norman Bardsley Total Parts Plus Co-Chair, Displays TWG 709 Anchors Street Director of Roadmaps and Technology Fort Walton Beach, FL 32547 Planning Phone: 850-244-7293 ext 238 U.S. Display Consortium (USDC) Fax: 850-664-5349 60 South Market Street, Suite 480 Email: [email protected] San Jose, CA 95113 Phone: 408-277-2380 Mr. Joe Belmonte Fax: 408-277-2490 Project Manager Email: [email protected] Speedline Technologies 16 Forge Park John Barr Franklin, MA 02038 Co-Chair, RF Components and Subsystems Phone: 508-541-4772 TWG Fax: 508-520-2288 EDA RFIC Business Specialist Email: [email protected] Agilent Technologies, Inc. EEsof - 2US-P Dr. Marc Benowitz 1400 Fountaingrove Parkway Board of Directors; Business Leadership Santa Rosa, CA 95404 Team Phone: 707-577-2350 Director, Reliability & Engineering Fax: 928-833-6470 Infrastructure Email: [email protected] Lucent Technologies, Inc. 600 Mountain Avenue, Mr. Bill Barthel Rm. 2B-523 Technical Committee Murray Hill, NJ 07974-0636 Manager, Manufacturing Technology Phone: 908-582-5851 Development Fax: 908-582-4008 Plexus Electronic Assembly Email: [email protected] N800 County Road CB P.O. Box 7780 Dr. Tatiana Berdinskikh Appleton, WI 54912-7081 Project Chair, Fiber Optic Signal Phone: 920-996-8681 Performance; Project Chair, Fiber Connector Fax: 920-996-8652 End-Face Inspection Specifications Email: [email protected] Celestica Regional Supplier Engineering, Fiber Optics Components Mr. Jasbir Bath Celestica International, Inc. Project Chair, Rework Process Development 1150 Eglington East Advisory Process Engineer Toronto, Ontario M3C 1H7 Solectron Corporation Canada 637 Gibraltar Court, Bldg. 1 Phone: 416-448-5579 Milpitas, CA 95035 Fax: 416-448-3029 Phone: 408-957-2935 Email: [email protected] Fax: 408-956-6083 17 NEMI Participant Guidelines & Directory Mr. Richard L. Berger Email: [email protected] President Nanodynamics Inc. Ty Bolenbaugh 901 Fuhrmann Blvd. Project Chair, Component Supply Chain Buffalo, NY 14203 Readiness Phone: 716-853-4900 ext 303 TMG, Program Manager Fax: 716-853-8996 Intel Corporation Email: [email protected] CH5-155 5000 W. Chandler Blvd. Mr. David Bergman Chandler, AZ 85226 Vice President, Standards, Technology & Phone: 480-554-7345 International Relations Fax: 480-554-7214 IPC Email: [email protected] 3000 Lakeside Drive, Suite 309 S Bannockburn, IL 60015 Dr. Nancy J. Bolinger Phone: 847-615-7100 Project Chair, Materials Declarations Fax: 847-615-7105 Mgr of RoHS Compliance, Senior Engineer Email: [email protected] IBM Corporation IBM Integrated Supply Chain/Global Mr. Dieter Bergman Procurement Engineering Co-Chair, Interconnect Substrates (Organic) Phone: 919-543-4209 TWG Email: nb@us.ibm.com Director, Technology Transfer IPC Dr. W. R. (Bill) Bottoms 3000 Lakeside Drive, Suite 309 S Co-Chair, Packaging TWG Bannockburn, IL 60015 Chairman Phone: 847-615-7100 3MT Solutions Fax: 847-615-7105 1942 Zankar Road Email: [email protected] San Jose, CA 95112 Mr. Ross B. Berntson Phone: 408-392-9310 Director, Fabricated Products Business Unit Fax: 408-392-9312 Indium Corporation of America Email: [email protected] 1676 Lincoln Avenue Utica, NY 13502 Mr. Mark Brillhart Phone: 315-853-4900 ext 7569 Director, Hardware Reliability Group Fax: 315-853-1000 Cisco Systems, Inc. Email: [email protected] 80 West Tasman Drive San Jose, CA 95134 Peter Biocca Phone: 408-525-7466 Market Development Engineer Fax: 408-527-8535 Kester Email: [email protected] 203 Fairfax Drive Allen, TX 75013 Ralph Brodd Phone: 972-390-1197 Co-Chair, Energy Storage Systems TWG Fax: 972-390-1654 President/Consultant Email: [email protected] Broddarp of Nevada, Inc. 2161 Fountain Springs Drive Mr. Gerry Bird Henderson, NV 89074 Chair, Consumer/Portable Products Product Phone: 702-897-3027 Emulator Group (PEG) Fax: 702-897-5812 Marketing Manager, Handheld Markets Email: [email protected] 3M Electronics Markets Materials Division 3M Center, Building 25-03-N-11 Mr. Craig C. Brown St Paul, MN 55144-1000 Business Leadership Team Phone: 651-736-2295 General Manager / Assembly / Test Fax: 651-575-0853 Materials Operation 18 NEMI Participant Guidelines & Directory Intel Corporation Fax: 949-639-3511 5000 W. Chandler Blvd., Email: [email protected] CH5-232 Chandler, AZ 85226 Mr. Anthony Carra Phone: 480-554-2820 Applications Engineer Fax: 602-554-5241 Vytran Corporation Email: [email protected] 1400 Campus Drive West Morganville, NJ 07751 Matt Brown Phone: 732-972-2880 Project Co-Chair, Fiber Optic Splice Loss Fax: 732-972-4528 Measurement Specification Email: [email protected] Applications Engineer US Conec Ltd. Mr. John M. Cartwright P.O. Box 2306 Co-Chair, Product Lifecycle Information 1555 4th Ave SE Management (PLIM) TIG Hickory, NC 28603 Programs Manager, Phone: 828-267-6327 Buy-Side B2Bi Fax: 828-322-7120 Intel Corporation Email: [email protected] Mail Stop: AG5-532 52500 N.E. Elam Young Parkway Mr. Paul Brown Hillsboro, OR 97124 Advanced Technology Engineering Phone: 503-456-2648 Alcatel Fax: 503-264-2442 600 March Road Email: [email protected] P.O. Box 13600 Mr. Alex Chan Kanata, Ontario K2K 2E6 Team Leader Canada Alcatel North America - Advanced Phone: 613-784-4573 Technology Email: [email protected] Alcatel Canada, Inc. 600 March Road Ms. Nellie L. Cabato P.O. Box 13600 Vice President Kanata, Ontario K2K 2E6 Aurora Instruments, Inc. Canada 124 South Maple Street Phone: 613-784-4504 Ambler, PA 19422 Email: [email protected] Phone: 215-646-4636 Fax: 215-646-4721 Ms. Vicki Chin Email: [email protected] Manufacturing Engineer Cisco Systems, Inc. Dr. Gary S. Calabrese 170 West Tasman Drive Vice President, Chief Technology Officer San Jose, CA 95134-1706 Rohm and Haas Company Phone: 408-527-1090 455 Forest Street Fax: 408-527-1090 Marlboro, MA 01752 Email: [email protected] Phone: 508-229-7272 Fax: 508-480-0853 Mr. Quyen Chu Email: [email protected] Project Chair, Process Development Advanced Manufacturing Engineer Mr. Dan Camarda Jabil Circuit, Inc. Vice President, Marketing & Business Phone: 727-803-3094 Development Email: [email protected] Centor Software Corp. 20 Fairbanks Bob Chylak Suite 198 VP Packaging and Process Integration Irvine, CA 92618 Kulicke and Soffa Industries (K&S) Phone: 949-639-3505 2101 Blair Mill Road 19 NEMI Participant Guidelines & Directory Willow Grove, PA 19090 Email: [email protected] Phone: 215-784-6446 Fax: 215-784-6258 Mr. Thomas M. Coughlin Email: [email protected] Chair, Mass Data Storage TWG Mr. Tom Cipielewski President Advanced Manufacturing Technology Coughlin Associates Director 1665 Willowmont Ave. Jabil Circuit, Inc. San Jose, CA 95124 10800 Roosevelt Blvd. Phone: 408-978-8184 St. Petersburg, FL 33716 Fax: 408-978-8184 Phone: 727-803-3099 Email: [email protected] Fax: 727-803-3395 Website: www.tomcoughlin.com Email: [email protected] Dr. Richard J. Coyle Dr. Joel P. Clark Project Co-Chair, Tin Whisker User Group Professor of Materials Engineering Member of Technical Staff Massachusetts Institute of Technology Lucent Technologies, Bell Labs (M.I.T.) Reliability Engineering Department Room 8-413 Room 2C-324 77 Massachusetts Avenue 101 Crawfords Corner Road Cambridge, MA 02139 Holmdel, NJ 07733 Phone: 617-253-6885 Phone: 732-332-6745 Fax: 617-258-8836 Email: [email protected] Email: [email protected] Derek Daily Mr. Rick Cleveland Deputy General Manager Director, US Sales Senju Comtek Corp. Total Parts Plus Silicon Valley Office 709 Anchors Street 20300 Stevens Creek Blvd., Fort Walton Beach, FL 32545 Suite 300 Phone: 850-244-7293 ext 204 Cupertino, CA 95014 Fax: 850-664-5349 Phone: 408-446-7866 Email: [email protected] Fax: 408-253-2140 Email: [email protected] Mr. Mike Coady Board of Directors Mr. Blair Davies Manager, Manufacturing Planning and Board of Directors; Business Leadership Contract Services Team Delphi Electronics & Safety Director, Global Design P.O. Box 9005 Celestica, Inc. Mail Stop: CT10B 1150 Eglinton Avenue East Kokomo, IN 46904-9005 Toronto, Ontario M3C 1H7 Phone: 765-451-6828 Canada Fax: 765-451-0740 Phone: 416-448-2953 Email: [email protected] Fax: 416-448-5895 Email: [email protected] Marie S. Cole Senior Technical Staff Member, Lead Free Mr. Steve di Loreto Program Manager, Worldwide Packaging & Business Leadership Team Test Executive Vice President, Plexus Electronic IBM Microelectronics Assembly MS 87P Plexus Corp. 2070 Route 52 55 Jewelers Park Drive Hopewell Junction, NY 12533 P.O. Box 156 Phone: 845-894-8069 Neenah, WI 54957 Fax: 845-892-6628 Phone: 920-751-3561 20 NEMI Participant Guidelines & Directory Fax: 920-969-6002 Associate Professor Emeritus of Materials Email: [email protected] and Electrical Engineering Penn State Materials Research Institute Mr. James E. Dickerson 167 Materials Research Lab Business Leadership Team State College, PA 16802-4801 Director, IPD Solutions Phone: 814-865-1638 IBM Fax: 814-865-2326 Bldg. 003-1, Office D02 Email: [email protected] Zip P535 Poughkeepsie, NY 12601 Dr. Daniel H. Doughty Phone: 845-433-4500 Chair, Energy Storage Systems TWG Fax: 845-432-9608 Manager, Battery R&D Department Email: [email protected] Sandia National Laboratories P.O. Box 5800 Fred Dimock MS 0613 Senior Process Engineer Albuquerque, NM 87185-0613 BTU International Phone: 505-845-8105 23 Esquire Road Fax: 505-844-6972 North Billerica, MA 01862 Email: [email protected] Phone: 978-667-4111 ext 207 Fax: 978-667-9068 Mr. Andrew D. Dugenske Email: [email protected] Manager of Research Services Georgia Institute of Technology Mr. Michael DiPietro Manufacturing Research Center Technology Transfer & Business 813 Ferst Drive, N.W. Development Specialist Atlanta, GA 30332-0560 IEEC, SUNY - Binghamton University Phone: 404-894-9161 T. J. Watson School of Engr & App. Science Email: [email protected] PO Box 6000 Binghamton, NY 13902-6000 Mr. Pierre FaFard Phone: 607-777-4345 Agent de développement industriel Fax: 607-777-4683 Microélectronique Email: [email protected] Ministère du Développement économique et régional et de la recherche (Gouvernement Dr. Terry Dishongh du Quebec) Chair, Medical Products Product Emulator 380 Rue St-Antoine Ouest, Group (PEG) 4d Etage Senior Staff Research – Montreal, Quebec H2Y 3X7 Pro-health Group Canada Intel Corporation Phone: 514-499-2199 ext 5903 2111 NE 25th, M/S JF3-377 Fax: 514-864-3755 Hillsboro, OR 97124-6497 Email: [email protected] Phone: 503-712-5034 Fax: 503-696-1521 James (Jim) Ficaro Email: [email protected] Marketing Manager for ATD's Commercial Test Products Douglass Dixon Teradyne, Inc. Marketing Manager Assembly Test Division Henkel 600 Riverpark Drive, 15051 East Don Julian Road MS-NR6002-17 Industry, CA 91746 North Reading, MA 01864 Phone: 626-968-6511 ext 275 Phone: 978-370-6204 Fax: 626-336-0160 Fax: 978-370-6230 Email: [email protected] Email: [email protected]

Dr. Joseph P. Dougherty Ms. Diane Fisher Co-Chair, Passive Components TWG Project Co-Chair, Materials Declarations

21 NEMI Participant Guidelines & Directory Product Content Manager Senior Technical Staff Member - IBM Hewlett Packard Company Systems Group 1501 Page Mill Road Materials Team Lead - Poughkeepsie Lab M/S1222 IBM Corporation Palo Alto, CA 94304 2455 South Road, P932 Phone: 650-857-2164 Poughkeepsie, NY 12602-5400 Fax: 650-857-4646 Phone: 845-433-5115 Email: [email protected] Fax: 845-432-9807 Email: [email protected] Mr. John T. "Jack" Fisher Chair, Interconnect Substrates (Organic) Dr. Sanka (Gans) Ganesan TWG; Project Chair, Optoelectronics for Co-Chair, Sensors TWG Substrates Initiative; Project Co-Chair, Associate Research Scientist High Frequency Material Effects on HDI CALCE Electronic Products and Systems Formation Center Interconnect Technology Consultant University of Maryland Interconnect Technology Analysis, Inc. 2106B Martin Hall 4309 Casa Blanca Drive College Park, MD 20742 Georgetown, TX 78628 Phone: 301-405-0765 Phone: 512-930-5666 Fax: 301-314-9269 Fax: 512-930-5666 Email: [email protected] Email: [email protected] Dr. Paolo Gargini Dr. Katherine Frase Chair, Semiconductor Technology TWG Board of Directors Director of Technology Strategy and Intel Vice President, Worldwide Packaging and Fellow Test Intel Corporation IBM Microelectronics Division 2200 Mission College Blvd., Phone: 845-892-5089 RN 3-70 Fax: 845-892-6080 Santa Clara, CA 95052-8119 Email: [email protected] Phone: 408-765-9646 Fax: 408-653-7039; 408-765-0158 Mr. Foo-Ming Fu Email: [email protected] Vice President Foxconn (Hon Hai) Mr. Ronald W. Gedney 8807 Fallbrook Drive NEMI Deployment Consultant Houston, TX 77064 2214 Rock Hill Road Phone: 281-668-1551 Suite 110 Fax: 281-671-1960 Herndon, VA 20170-4214 Email: [email protected] Phone: 386-478-1204 Fax: 703-834-2735 Mr. Jean-Yves Gagne Email: [email protected] Advanced Technologies, Process Leader Nortel Networks Mr. Koen A. Gieskes 2351 Alfred-Nobel Technical Committee Mail Stop: 85D/Q3/T6 Vice President, Research & Development St. Laurent, Quebec H4S 1K5 Universal Instruments Corporation Canada P.O. Box 825 Phone: 514-818-5162 Binghamton, NY 13902-0825 Fax: 514-818-3008 Phone: 607-779-5894 Email: [email protected] Fax: 607-779-4418 Email: [email protected] Dr. George T. Galyon Project Chair, Tin Whisker Modeling Mr. Jerry Gleason Project Co-Chair, Lead-Free Assembly and Rework 22 NEMI Participant Guidelines & Directory R&D Engineer/Scientist, Strategic Process Dr. Nasser Grayeli Development NEMI Chairman of the Board Hewlett Packard Company Vice President of Technology and 1501 Page Mill Road, MS 1222 Manufacturing Palo Alto, CA 94304-1126 Director, Assembly Technology Phone: 650-857-2046 Development Fax: 650-857-4646 Intel Corporation Email: [email protected] 5000 W. Chandler Blvd. Mail Stop CH5-160 Mr. David Godlewski Chandler, AZ 85226 Staff Manager of Planning; Phone: 480-554-5317 Ex-officio Technical Committee Member Fax: 480-554-0375 NEMI Secretariat Email: [email protected] 3213 Linden Parkway Harrisburg, PA 17110 Mr. Donald Gross Phone: 717-651-0522 Manager, Applications Engineering Cell: 703-786-9202 Sumitomo Electric Lightwave Corporation Fax: 717-651-0522 78 Alexander Drive Email: [email protected] Research Triangle Park, NC 27709 Mr. James (Jim) Goeppinger Phone: 919-541-8260 StorageTek Fax: 919-541-8265 One StorageTek Drive Email: [email protected] Louisville, CO 80029 Phone: 303-926-0033 Mr. Vivek Gupta [email protected]; Project Chair, Component and Board [email protected] Marking Program Manager, Lead-Halogen Free Ms. Barbara L.M. Goldstein Development Co-Chair, Product Lifecycle Information Intel Corporation Management (PLIM) TIG; Project Chair, M/S CH5-299 PDX Extensions & Updates (PDX 2.0) 5000 W. Chandler Blvd. Initiative Chandler, AZ 85226 Strategic Advisor to the Director Phone: 480-554-2195 Electronics and Electrical Engineering Lab Fax: 480-554-7262 National Institute of Standards and Email: [email protected] Technology (NIST) Mail Stop 8100 Charan Gurumurthy 100 Bureau Drive Project Co-Chair, Substrate Surface Gaithersburg, MD 20899-8100 Finishes for Lead-Free Assembly Phone: 301-975-2304 Manager, Substrate Core Competency Fax: 301-975-4091 Intel Email: [email protected] 5000 W. Chandler Blvd., ATD, CH5-159 Chandler, AZ 85226-3699 Mr. Frank Grano Phone: 480-552-2702 Project Chair, Assembly Process Fax: 480-554-1521 Specifications Email: [email protected] Principal Process Engineer Sanmina-SCI Dr. Leslie A. Guth 13000 South Memorial Parkway, P.O. Box Technical Committee, Co-Director of 1000 Planning Huntsville, AL 35807 Director, Advanced Technology & Phone: 256-882-4903 Platforms Fax: 256-882-4871 Supply Chain Networks Email: [email protected] Lucent Technologies, Inc. Rm 2J-327 23 NEMI Participant Guidelines & Directory 101 Crawford's Corner Road Email: [email protected] Holmdel, NJ 07733-3030 Phone: 732-949-8816 Mr. Ray Hein Fax: 732-949-6459 V.P., Product Strategy Email: [email protected] Agile Software Corporation 6373 San Ignacio Avenue Mr. Charles Han San Jose, CA 95119 President Phone: 408-284-3866 LACE Technologies Fax: 408-975-3901 3483 Swenson Avenue Email: [email protected] St. Charles, IL 60174 Phone: 630-762-3865 ext 18 Bert Honour Fax: 630-762-3856 Vice President Email: [email protected] Centor Software Corporation Suite 600 Mr. Christopher B. Hanback 39555 Orchard Hill Place General Counsel, NEMI Novi, MI 48375 Holland & Knight LLP Phone: 248-347-0121 2099 Pennsylvania Avenue, NW Fax: 248-347-2359 Suite 100 Email: [email protected] Washington, DC 20006 Phone: 202-457-7157 Dr. Roger F. Hoyt Fax: 202-955-5564 Co-Chair, Mass Data Storage TWG Email: [email protected] Server BU Cost Management Hitachi Global Storage Technology Dr. Carol Handwerker 2D046/0122 Technical Committee; Co-Chair, Research 5600 Cottle Road Committee San Jose, CA 95193-0001 Chief, Metallurgy Division Phone: 408-717-5076 National Institute of Standards and Fax: 408-717-9267 Technology (NIST) Email: [email protected] M/S 8550 Mr. Kim D. Hyland 100 Bureau Drive Director of Process Integration Gaithersburg, MD 20899-8550 Solectron Corporation Phone: 301-975-6158 637 Gibralter Drive, Bldg. #1 Fax: 301-975-4553 Milpitas, CA 95035 Email: [email protected] Phone: 408-956-6337 Fax: 408-956-6050 Mr. James Hayward Email: [email protected] Senior Member of Technical Staff Advanced Micro Devices, Inc. (AMD) Mr. Howard Imhof 1 AMD Place Chair, Interconnect Substrates (Ceramic) P.O. Box 3453, MS 103 TWG Sunnyvale, CA 94088-3453 Director of Sales and Marketing Phone: 408-982-6427 Advanced Materials Division Fax: 408-982-6164 Metalor Technologies USA Email: [email protected] 52 Gardner Street Attleboro, MA 02703 Kevin Heimerman Phone: 508-226-4470 ext 142 Acting Project Chair, Test Vehicle Design Fax: 508-695-4180 Design Engineer Email: [email protected] Plexus Corp. 55 Jewelers Park Drive Mr. Sarvesh P. Jagannivas Neenah, WI 54957 Director, Marketing - Electronics and High Phone: 920-969-6095 Tech Fax: 920-720-6707 Agile Software Corporation 24 NEMI Participant Guidelines & Directory 6373 San Ignacio Avenue Mr. J. Stevenson Kenney San Jose, CA 95119 Co-Chair, RF Components and Subsystems Phone: 408-284-3879 TWG Fax: 408-284-4002 Associate Professor Email: [email protected] School of Electrical and Computer Engineering Joe Johnson Georgia Institute of Technology Co-Chair, Environmentally Conscious 813 Ferst Drive, NW Electronics TWG Atlanta, GA 30332-0250 Environmental Regulatory Manager Phone: 404-894-5170 Microsoft Fax: 404-894-4641 One Microsoft Way Email: [email protected] RedWest B/1188 Redmond, WA 98052-6399 Dr. Randolph Kirchain Phone: 425-707-4364 Assistant Professor of Materials Systems Fax: 425-936-7329 Massachusetts Institute of Technology Email: [email protected] (M.I.T.) Room E40-421 Dr. Sundar Kamath 77 Massachusetts Avenue Board of Directors Cambridge, MA 02139 Senior Vice President, Advanced Phone: 617-253-4258 Technology (EMS), Global Technology Fax: 617-258-7471 Solutions Email: [email protected] Sanmina-SCI 2000 Ringwood Avenue Mr. Dave Kleinke San Jose, CA 95131 Engineering Information Manager Phone: 408-904-2176 Agilent Technologies, Inc. Fax: 408-904-2069 Building 54L Email: [email protected] 5301 Stevens Creek Blvd. Santa Clara, CA 95051-7295 George Katopis Phone: 408-553-7645 Co-Chair, Office/Large Business Systems Fax: 408-553-7857 Product Emulator Group (PEG) Email: [email protected] Distinguished Engineer IBM Erich Klink 2455 South Road (P310) Co-Chair, Office/Large Business Systems Poughkeepsie, NY 12601 Product Emulator Group (PEG) Phone: 845-435-6719 Senior Technical Staff Member, System Fax: 845-435-1593 Technology Group Email: [email protected] IBM Lab Boeblingen Schoenaicher Str. 220 Mr. Matt Kelly, P.Eng D-71032 Boeblingen, Postfach 1380 Project Chair, Assembly Process IBM Lab Boeblingen Development 71032-05-015, D/3190 Process & Test Engineering Specialist, Germany Corporate Technology Phone: 49 - (0)-7031-16-3436 Celestica, Inc. Fax: 49 - (0)-7031-16-2042 844 Don Mills Road Email: [email protected] Toronto, Ontario M3C 1V7 Ms. Leah Knight Canada Director, Market Research Phone: 416-443-7138 E2open Fax: 416-448-4810 1600 Seaport Blvd., 5th Floor Email: [email protected] Redwood City, CA 94063 Phone: 650-381-3775 Fax: 650-381-3999 Email: [email protected] 25 NEMI Participant Guidelines & Directory Mr. David R. Knudtson Phone: 765-451-0159 Engineering Manager Fax: 765-451-0287 StorageTek Email: [email protected] M/S 5245 One StorageTek Drive Mr. Mark Kwoka Louisville, CO 80028 Project Co-Chair, Tin Whisker Accelerated Phone: 303-673-2168 Test Fax: 303-661-4911 Senior Principal Engineer, Technology Email: [email protected] Operations Intersil Corporation Dennis Krizman P.O. Box 883 Co-Chair, Board Assembly TWG MS 58-100 Senior Engineering Associate, Corporate Melbourne, FL 32902-0883 Process Development Phone: 321-729-5790 Celestica International Inc. Fax: 321-729-4744 844 Don Mills Road, 33/178 Email: [email protected] Toronto, Ontario M3C 1V7 Canada Dr. Sudarshan Lal Phone: 416-443-7578 Sr. Global Process Development Engineer Fax: 416-448-4736 FCI Electronics, Inc. Email: [email protected] 825 Old Trail Road Etters, PA 17319-9351 Mr. Tim Kruse Phone: 717-938-7394 Project Chair, DPMO (Defective Parts per Fax: 717-938-7681 Million Opportunities) Email: [email protected] Test Project Engineer Plexus Corp. Dr. John H. Lau N800 County Road CB Lead-Free Program Manager, Enterprise P.O. Box 7780 Supply Chain Services Appleton, WI 54912 Agilent Technologies, Inc. Phone: 920-996-8676 5301 Stevens Creek Blvd. Fax: 920-996-8652 P.O. Box 58059, MS 54L-AB Email: [email protected] Santa Clara, CA 95052 Phone: 408-553-2358 Mr. Richard Kubin Fax: 408-553-7659 Chair, Business Leadership Team; Project Email: [email protected] Chair, Materials Composition Data Exchange Dr. Ning-Cheng Lee Vice President, Product Lifecycle Vice President of Technology Management Indium Corporation of America E2open 34 Robinson Road 1600 Seaport Blvd., 5th Floor Clinton, NY 13323 Redwood City, CA 94063 Phone: 315-853-4900 ext 7613 Phone: 650-381-3977 Fax: 315-853-4320 Fax: 650-381-3999 Email: [email protected] Email: [email protected] Dr. Philip Lessner Mr. Frederick F. Kuhlman Chair, Passive Components TWG Co-Chair, Technical Committee; Board of Director, Technical Marketing Directors - Ex-officio KEMET Electronics Manufacturing Engineering 2835 Kemet Way Manager of Innovation & Continuous Simpsonville, SC 29681 Improvement Methodologies Phone: 864-228-4234 Delphi Electronics & Safety Fax: 864-967-6876 P.O. Box 9005, MS CT30C Email: [email protected] Kokomo, IN 46904

26 NEMI Participant Guidelines & Directory Ms. Becky Linder Mr. Voya R. Markovich Director, International Trade Policy Chief Technology Officer AeA - Advancing the Business of Endicott Interconnect Technologies, Inc. Technology (EIT) 601 Pennsylvania Avenue, NW 1701 North Street, North Building, Suite 600 Endicott, NY 13761 Washington, DC 20004 Phone: 607-755-1978 Phone: 202-682-4445 Fax: 607-755-6151 Fax: 202-682-9111 Email: [email protected] Email: [email protected] Mr. Raj Master Mr. Kenneth S. Lyjak Senior AMD Fellow Project Chair, Components and Materials Advanced Micro Devices, Inc. (AMD) ECAT T&Q. DEPT YUSA P.O. Box 3453-MS-58 Interconnect T&Q GLOBAL Procurement Sunnyvale, CA 94088-3453 IBM Corporation Phone: 408-982-7023 Building 061 Office R115 Fax: 408-982-6164 RTP N.C. Email: [email protected] Research Triangle Park, NC 27709 Mr. Eugene G. McCabe Phone: 919-543-7296 Board of Directors Fax: 919-543-3642 Senior Vice President, Operations Email: [email protected] Sun Microsystems, Inc. 7777 Gateway Blvd. Mr. John MacWilliams Building 10 Chair, Connectors TWG Newark, CA 94560 Sr Consultant and Analyst to Bishop & Phone: 510-315-5900 Associates Fax: 510-574-5448 UScompetitors LLC Email: [email protected] 565 Upper Pike Creek Rd. Newark, DE 19711 Mr. Dave McCarron Phone: 302-235-2726 Project Chair, RoHS Transition Task Group Fax: 810-277-1991 Director, Program Management Email: [email protected] Dell, Inc. One Dell Way Roy Magnuson Round Rock, TX 78682 Sr. Engineer Phone: 512-725-0445 Endicott Interconnect Technologies, Inc. Fax: 512-725-2112 (EIT) Email: [email protected] 1701 North Street Endicott, NY 13761 Mr. Jack T. McCullen Phone: 607-755-1927 Project Co-Chair, Tin Whisker Accelerated Fax: 607-755-6151 Test Email: [email protected] Sr. Packaging Reliability Engineer Chairman of the JEDEC JC-14.1 Mr. Larry Marcanti Subcommittee: Reliability Test Methods Senior Manager, Advanced Design for Packaged Devices Technology Intel Corporation Nortel Networks Mail Stop CH 5-263 M/S 991/07/B10 5000 W. Chandler Blvd 2221 Lakeside Blvd. Chandler, AZ 85226 Richardson, TX 75082-4399 Phone: 480-554-5354 Phone: 972-684-4135 Fax: 480-554-7171 Fax: 972-685-3455 Email: [email protected] Email: [email protected]

27 NEMI Participant Guidelines & Directory Mr. Jim McElroy 1400 Campus Drive West CEO/Executive Director; Co-Chair, Morganville, NJ 07751 Business Leadership Team; Board of Phone: 732-972-2880 ext 108 Directors!- Ex-officio Fax: 732-972-4690 NEMI Secretariat Email: [email protected] 2214 Rock Hill Road Suite 110 Mr. Edward F. Mikoski Herndon, VA 20170 VP, Technology Strategy & Standards South Phone: 703-834-2082 Electronic Industries Alliance (EIA) South Fax: 703-834-2735 2500 Wilson Blvd. North Phone: 603-539-7722 Arlington, VA 22201-3834 North Fax: 603-539-8383 Phone: 703-907-8023 Cell: 703-786-9201 Fax: 703-875-8908 Email: [email protected] Email: [email protected] Mr. Bruce Moloznik Mr. Dennis P. McGuirk Director, Product Management President Cookson Electronics Assembly Materials IPC 600 Route 440 3000 Lakeside Drive, Suite 309 S Jersey City, NJ 07304 Bannockburn, IL 60015 Phone: 201-324-3616 Phone: 847-615-7000 Fax: 201-434-6548 Fax: 847-615-7105 Email: [email protected] Email: [email protected] Mr. Frank Murch Mr. Gerhard D. Meese Director Executive Vice President Asymtek Dover Technologies International, Inc. 2762 Loker Avenue West 20 Hawley Street, 6th Floor, East Tower Carlsbad, CA 97078 Binghamton, NY 13901-3280 Phone: 760-930-7424 Phone: 607-779-6760 Fax: 760-930-7439 Fax: 607-779-6770 Email: [email protected] Email: [email protected] Mr. William E. (Bill) Murphy Mr. David M. Mendez Chair, Aerospace/Defense Product Project Co-Chair, DPMO (Defective Parts Emulator Group (PEG) per Million Opportunities) Sr. Technical Staff Member, Manufacturing Chief Technologist Engineering Solectron Corporation Lockheed Martin Systems Integration 12455 Research Blvd., MS 2110 1801 State Route 17C, M/S 0220 Austin, TX 78759 Owego, NY 13827-3900 Phone: 512-425-7608 Phone: 607-751-5879 Fax: 512-425-7693 Fax: 607-751-2800 Email: [email protected] Email: [email protected] Phil Metz Business Leadership Team Dr. Cameron T. Murray VP Market Planning & Sales Support Chair, Thermal Management TWG Solectron Senior Product Development Specialist, Building 7 Electronic Materials 1007 Gibraltar Drive 3M Milpitas, CA 95035 Industrial Adhesives and Tapes Division Phone: 408-956-6994 Building 0209-01-C-30 Email: [email protected] St. Paul, MN 55144 Phone: 651-736-9294 Mr. Eric Mies Fax: 651-733-0846 President Email: [email protected] Vytran Corporation 28 NEMI Participant Guidelines & Directory Vijay Nair Vice President, Global Communications, Chair, RF Components and Subsystems Computer & Consumer Electronics TWG Tyco Electronics Corporation Principal Engineer, Corporate Technology 3-5-8 Hisamoto, Takatsu-ku, Group Kawasaki, Kanagawa 213-8535 Intel Corporation Japan 2111 25th Avenue, M/S JF2-86 Phone: +81-44-844-8000 Hillsboro, OR 97124 Fax: +81-44-812-3210 Phone: 503-712-6122 Email: [email protected] Email: [email protected] Tetsuya Okuno Mr. Keith Newman General Manager & Plant Manager Project Chair, Substrate Surface Finishes Senju Comtek Corp. for Lead-Free Assembly 1171-B North 4th Street Senior Staff Engineer San Jose, CA 95112 Sun Microsystems Phone: 408-792-3832 1028 Havre Court Fax: 408-884-2444 Sunnyvale, CA 94087 Email: [email protected] Phone: 408-404-6886 Fax: 408-404-6886 Stig Oresjo Email: [email protected] Co-Chair, Test, Inspection & Measurement TWG Dr. Mark Newton Sr. Test Strategy Consultant, Manufacturing Chair, Environmentally Conscious Test Business Unit Electronics TWG Agilent Technologies, Inc. Worldwide Environmental Affairs MS BU221 Manager 815 14th Street, SW Dell, Inc. Loveland, CO 80537 One Dell Way, MS 6630 Phone: 970-679-3215 Round Rock, TX 78682 Fax: 970-679-5399 Phone: 512-724-2236 Email: [email protected] Fax: 512-283-9261 Email: [email protected] Dr. SB Park Mr. Tetsuro Nishimura Co-Chair, Modeling, Simulation & Design President Tools TWG Nihon Superior Co., Ltd. Assistant Professor, Mechanical Eng. Dept. NS Building State University of New York at 16-15, Esaka-Cho, 1-Chome Binghamton Suita city, Osaka Binghamton, NY 13902-6000 Japan 564-0063 Phone: 607-777-3415 Phone: +81-(0)6-6380-1121 Fax: 607-777-4620 Fax: +81-(0)6-6380-1262 Email: [email protected] Email: [email protected] Bob Parker Mr. Eamon O'Keeffe Vice President Technical Committee AMR Research, Inc. Sr Mgr, EMS Technology 125 Summer Street Sanmina-SCI Corporation Boston, MA 02110 2000 Ringwood Avenue Phone: 617-574-5117 San Jose, CA 95131 Fax: 617-542-5670 Phone: 408-964-3500 Email: [email protected] Email: [email protected] Mr. Lee Patch Mr. Minoru Okamoto Program Manager Board of Directors National Center for Manufacturing Sciences (NCMS) 29 NEMI Participant Guidelines & Directory 3025 Boardwalk Dr. M. Robert Pinnel Ann Arbor, MI 48108 Chair, Displays TWG Phone: 734-995-4972 Chief Technical Officer Fax: 734-995-4004 U.S. Display Consortium (USDC) Email: [email protected] 60 S. Market Street, Suite 480 San Jose, CA 95113 Kitty Pearsall Phone: 408-277-2493 Project Chair, Bill of Material (BOM) Fax: 408-277-2490 IBM Email: [email protected] Phone: 512-838-7215 Email: [email protected] Mr. John E. Pomeroy Board of Directors Tom Pearson President and CEO Chair, Board Assembly TIG; Co-Chair, Dover Technologies International, Inc. Office/Large Business Systems Product 20 Hawley Street, 6th Floor, Emulator Group (PEG) East Tower Technology Enabling Program Manager Binghamton, NY 13901-3280 Intel Corp Phone: 607-779-6760 5200 NE Elam Young Parkway Fax: 607-779-6770 Hillsboro, OR 97124 Email: [email protected] Phone: 503-696-7024 Email: [email protected] Dr. Alan Rae Technical Committee; Director of Research; Dr. Michael Pecht Chair, Research Committee; Coach, Chair, Sensors TWG Optoelectronics TIG Director and Professor VP, Market and Business Development CALCE Electronic Products and Systems Nanodynamics Inc. Center 901 Fuhrmann Blvd. University of Maryland Buffalo, NY 14203 College Park, MD 20742 Phone: 716-853-4900 ext 346 Phone: 301-405-5323 Fax: 716-853-4996 Fax: 301-314-9269 Email: [email protected] Email: [email protected] Dr. Srinivas Rao Technical Committee, Co-Director of Dr. Robert C. Pfahl Planning; Research Committee Vice President of Operations/Treasurer; Vice President Technology Co-Chair, Technical Committee; NERCC Solectron Corporation Chair; Secretary, Research Committee; 637 Gibralter Drive, Bldg. #1 Board of Directors - Ex-officio Milpitas, CA 95035 NEMI Secretariat Phone: 408-956-6478 2214 Rock Hill Road Fax: 408-956-6050 Suite 110 Email: [email protected] Herndon, VA 20170 Phone: 703-834-2083 Mr. Mike Reagin Fax: 703-834-2735 Chair, Final Assembly TWG Email: [email protected] Manufacturing Engineering Manager - Test Competency Dr. Gerald Pham-Van-Diep Delphi Electronics Systems Director, Advanced Development One Corporate Center Speedline Technologies M/S CT 10C 16 Forge Park P.O. Box 9005 Franklin, MA 02038 Kokomo, IN 46904-9005 Phone: 508-541-4950 Phone: 765-451-0497 Email: [email protected] Fax: 765-451-0542 Email: [email protected]

30 NEMI Participant Guidelines & Directory Mr. Charles Reynolds 5, avenue Raymond Chanas Project Co-Chair, Lead-Free Assembly and Eybens Rework 38053 Grenoble Cedex 9 Engineer, IBM Microelectronics Division France IBM Corporation - East Fishkill Phone: 33(0)4 76 14 63 22 Hudson Valley Research Park Fax: 33(0)4 76 14 12 41 2070 State Route 52 Email: [email protected] B/330D 2nd Floor 2BB35-101 Internal Zip 87P Dr. Thomas J. Russell Hopewell Junction, NY 12533 Special Assistant to Director, Office of Law Phone: 845-894-0727 Enforcement Standards Fax: 845-892-6280/6214 National Institute of Standards and Email: [email protected] Technology (NIST) Electronics and Electrical Engineering Lab Mr. Charles E. Richardson Bldg. 225, Room A353 Staff Manager, Roadmapping; Ex-officio Gaithersburg, MD 20899-0001 Technical Committee Member Phone: 301-975-2665 NEMI Consultant Fax: 301-975-4091 2012 Burlington Dr. S.E. Email: [email protected] Huntsville, AL 35803-3632 Phone: 256-880-0922 Dr. Bahgat Sammakia Fax: 256-880-4902 Director Email: [email protected] IEEC SUNY-Binghamton P.O. Box 6000 Mr. Kevin Rock Binghamton, NY 13902-6000 Vice President, Americas Communications, Phone: 607-777-6880 Computer & Consumer Electronics Fax: 607-777-4683 Tyco Electronics Corporation Email: [email protected] M.S. 128-023 3101 Fulling Mill Road Dr. D.H.R. Sarma Middletown, PA 17057 Research Committee Phone: 717-592-2096 Technical Fellow and Engineering Group Fax: 717-986-7262 Manager Email: [email protected] Delphi Electronics and Safety Kim Ross P.O. Box 9005-M/S 8145 Regulatory Compliance Manager Kokomo, IN 46904-9005 Microsoft Corp. Phone: 765-451-7786 1065 La Avenida Fax: 765-451-3115 SVC-2 Email: [email protected] Mountain View, CA 94043 Phone: 650-693-6437 Dr. Sanjeev Sathe Fax: 425-936-7329 Chair, Modeling, Simulation & Design Email: [email protected] Tools TWG Director, Assembly Business Development Mr. Thomas A. Roth ASE (US) Inc. Chair, Thermal Management TWG 3590 Peterson Way Computer & Peripheral Segment Manager Santa Clara, CA 95054 3M Phone: 408-986-6527 Electronics Markets Materials Division Fax: 408-565-0289 Building 0224-03-N-11 Email: [email protected] St. Paul, MN 55144 Phone: 651-737-0620 Dr. Michael J. Schabel Email: [email protected] Chair, Netcom Product Emulator Group (PEG) Dr. Patrick Roubaud Member of the Technical Staff Project Chair, Reliability Bell Laboratories, Lucent Technologies Hewlett Packard Company 31 NEMI Participant Guidelines & Directory Room 1D-349 Ms. Chrys Shea 600 Mountain Avenue Manager, Applications Engineering Murray Hill, NJ 07974 Cookson Electronics Assembly Materials Phone: 908-582-2769 Group Fax: 908-582-6228 600 Route 440 Email: [email protected] Jersey City, NJ 07304 Phone: 201-934-6778 Mr. Dave Scheiner Fax: 609-239-7789 Senior Technical Services Engineer Email: [email protected] 515 E. Touhy Avenue Des Plaines, IL 60018-2675 Eric Simmon Phone: 847-699-5543 Chair, Product Lifecycle Information Fax: 847-699-4960 Management (PLIM) TWG Email: [email protected] National Institute of Standards and Technology (NIST) Mr. Mark Schenecker Phone: 301-975-3956 Vice President, Product Management Email: [email protected] E2open 1600 Seaport Blvd., 5th Floor Joseph Smetana Redwood City, CA 94063 Project Chair, Tin Whisker User Group Phone: 650-381-3964 Principal Engineer, Advanced Technology; Fax: 650-381-3999 Distinguished Member, Alcatel Technical Email: [email protected] Academy Alcatel Ton Schless MS SAGE2 Co-Chair, Interconnect Substrates 3400 West Plano Parkway (Ceramic) TWG Plano, TX 75075 President and CEO Phone: 972-519-6135 MIDAS Vision Systems, Inc. Fax: 972-519-4412 77 Green Street Email: [email protected] Foxboro, MA 02035 Phone: 508-549-9933 ext 105 Mr. Michael J. Smith Fax: 508-549-0995 Chair, Test, Inspection & Measurement Email: [email protected] TWG Director of Strategic Technology Mr. Jeroen L. Schmits Teradyne, Inc. President Assembly Test Division (ATD) Vitronics Soltec 600 Riverpark Drive Innovatiepark 12 MS-NR 6002-16 4906 AA Oosterhout North Reading, MA 01864 The Netherlands Phone: 978-370-6218 Phone: +31 162 483 000 Fax: 978-370-6220 Fax: +31 162 456 738 Email: [email protected] Email: [email protected] Mr. John L. Snyder Dr. Valeska Schroeder Business Unit Manager, SMT Materials, Project Chair, Tin Whisker Accelerated Americas Test Heraeus CMD R&D Engineer 24 Union Hill Road Hewlett Packard W. Conshohocken, PA 19428 MS 1222 Phone: 610-825-6050 1501 Page Mill Road Fax: 610-825-7061 Palo Alto, CA 94304 Email: [email protected] Phone: 650-857-4795 Email: [email protected]

32 NEMI Participant Guidelines & Directory Jim Spall Herndon, VA 20170 Chair, Automotive Product Emulator Group Phone: 703-834-2087 (PEG) Fax: 703-834-2735 Staff Development Engineer Email: [email protected] Delphi Electronics & Safety P.O. Box 9005 M. Denis Thériault MS CT40A Director Kokomo, IN 46904-9005 Gouvernement du Quebec, Ministère du Phone: 765-451-5400 développement économique et régional et de Fax: 765-451-0470 la recherche Email: [email protected] 710 Place d'Youville, 8e étage Québec G1R 4Y4 Canada Mr. John W. Stafford Phone: 418-691-5957 Chair, Optoelectronics TWG Fax: 418-643-6947 Director Email: [email protected] JWS Consulting P.L.C. Mr. George Till 15035 South 19th Way NEMI Roadmap Consultant Phoenix, AZ 85048 101 Apremont Court Phone: 602-228-1005 DeLand, FL 32724 Fax: 480-460-2177 Phone: 386-738-3449 Email: [email protected] Email: [email protected]

Mr. Keith Sweatman Jonathon Till Adviser Engineering Director, Network Storage Nihon Superior Co., Ltd. Operations NS Building Sun Microsystems, Inc. 16-15, Esaka-Cho, 1-Chome 7777 Gateway Blvd., Bldg. 16 Suita, 564-0063 Newark, CA 94560 Japan Phone: 510-936-2497 Phone: +61-(0)7-54467543 Fax: 510-936-2528 Fax: +61-(0)7-54467832 Email: [email protected] Email: [email protected] Ms. Heather Tkalec Rohit Tangri Project Co-Chair, Fiber Optic Signal Director, Product Management Performance; Project Co-Chair, Fiber MatrixOne, Inc. Connector End-Face Inspection 5440 Corporate Drive, Suite 200 Specifications Troy, MI 48098 Test Engineer Phone: 248-312-3050 Alcatel Canada Fax: 248-312-3094 600 March Road Email: [email protected] Ottawa, Ontario K2K 2E6 Canada Karim Tatah Phone: 613-784-4832 Lead Optical Engineer Fax: 613-531-1960 Cray Inc. Email: [email protected] 1050 Lowater Road P.O. Box 6000 Mr. Michael Toben Chippewa Falls, WI 54729 Board of Directors Phone: 715-726-4678 Global Technology Director, Packaging and Fax: 715-726-4880 Finishing Technologies Email: [email protected] Rohm and Haas Electronic Materials 272 Buffalo Avenue Ms. Dee-Dee Taylor Freeport, NY 11520 NEMI Consultant Phone: 516-868-8800 2214 Rock Hill Road Fax: 516-868-4781 Suite 110 Email: [email protected] 33 NEMI Participant Guidelines & Directory Dr. Brian J. Toleno 1301 E. Algonquin Road, IL02-1014 Senior Applications Chemist Schaumburg, IL 60196 Henkel Technologies Phone: 847-576-8916 15051 East Don Julian Road Fax: 847-576-8917 Industry, CA 91746 Email: [email protected] Phone: 626-968-6511 ext 304 Fax: 626-336-0526 Mr. Kirk Van Dreel Email: [email protected] Chair, Board Assembly TWG Sr. Staff Process Engineer Dr. Rao R. Tummala Plexus Corporation Technical Committee; Research Committee P.O. Box 7780 Chair Professor and Director, Packaging Appleton, WI 54912-7081 Research Center Phone: 920-996-8685 Georgia Institute of Technology Fax: 920-996-8651 Manufacturing Research Center Email: [email protected] 813 Ferst Drive, NW Room 380 Mr. David R. Van Loan Atlanta, GA 30332-0560 President and CEO Phone: 404-894-9097 Everett Charles Technologies Fax: 404-894-3842 700 E. Harrison Ave. Email: [email protected] Pomona, CA 91767 Phone: 909-625-9367 Professor Reijo Tuokko Fax: 909-621-5731 Co-Chair, Final Assembly TWG Email: [email protected] Professor, Automation Technology, Head of Assembly Automation Lab. Ms. Nancy A. Vorona Tampere University of Technology VP Research Investment Institute of Production Engineering Virginia's Center for Innovative Korkeakoulunkatu 6 Technology (CIT) P.O. Box 589 CIT Tower, Suite 600 33101 Tampere 2214 Rock Hill Road Finland Herndon, VA 20170-4200 Phone: 358 3 3115 2313 Phone: 703-689-3043 Mobile Phone: 358 40 849 0270 Fax: 703-464-1720 Fax: 358 3 3115 2753 Email: [email protected] Email: [email protected] Dr. Alex Vukovic Dr. Laura J. Turbini Co-Chair/NETCOM Lead, Thermal Co-Chair, Optoelectronics TWG Management TWG Executive Director Research Scientist & Adjunct Professor at Centre for Microelectronics Assembly and University of Ottawa Packaging (CMAP) Communications Research Centre (CRC) University of Toronto Canada 184 College Street Rm 150B 3701 Carling Av. Toronto, Ontario M5S 3E4 Ottawa, Ontario Canada Canada K2H 8S2 Phone: 416-946-7329 Phone: 613-998-2452 Fax: 416-946-3628 Fax: 613-990-8382 Email: [email protected]; Email: [email protected] [email protected] John Wagner Dr. Iwona Turlik Hardware Technical Project Leader Board of Directors Cray Inc. Corporate Vice President and Director 1050 Lowater Road Physical Realization Research Center P.O. Box 6000 Motorola Labs Chippewa Falls, WI 54729 34 NEMI Participant Guidelines & Directory Phone: 715-726-4916 Phone: 207-871-1260 Fax: 715-726-4960 Fax: 419-844-0117 Email: [email protected] Email: [email protected]; [email protected] Mr. Mauro J. Walker NEMI Chairman Emeritus Ms. Maureen E. Williams Motorola – Retired Project Co-Chair, Tin Whisker Modeling 108 Dolphin Drive Mechanical Engineer Ocean Ridge, FL 33435 National Institute for Standards and Phone: 561-375-9317 Technology (NIST) Fax: 561-736-4339 100 Bureau Drive Email: [email protected] Mail Stop 8555 Bldg. 223, Rm. A153 Mr. Rod Walker Gaithersburg, MD 20899-8555 Consultant; Business Leadership Team Phone: 301-975-6170 President Fax: 301-975-4553 Altus Consulting, Inc. Email: [email protected] PO Box 2829 Mr. Robert Willis Evergreen, CO 80437 President Phone: 303-670-8852 Electronic Components, Assemblies & Fax: 303-670-3175 Materials Association (ECA) Email: [email protected] The Electronic Components Sector of EIA 2500 Wilson Blvd. Paul Wang Arlington, VA 22201-3834 Project Co-Chair, Lead-Free Wave Phone: 703-907-8024 Soldering Assembly Process Fax: 703-875-8908 Sr. Process and Reliability Engineer Email: [email protected] Sun Microsystems 7777 Gateway Blvd, MSNWK10-260 Ms. Marissa A. Yao Newark, CA 94560 Project Co-Chair, Materials Composition Phone: 510-315-6161 Intel Corporation Fax: 510-315-6161 3600 Juliette Lane Email: [email protected] Mailstop: SC12-324 Santa Clara, CA 95052 Mr. Tsutomu Watanabe Phone: 408-765-1227 Manager, Product Development Fax: 408-765-3362 Sumitomo Electric Lightwave Corporation Email: [email protected] 78 Alexander Drive Research Triangle Park, NC 27709 Mr. John Yealland Phone: 919-541-8346 Vice President, Corporate Technology Fax: 919-541-8265 Celestica, Inc. Email: [email protected] 1150 Eglington Ave E Toronto, Ontario M3C 1H7 Mr. Laurence N. Wesson Canada President Phone: 416-448-5065 Aurora Instruments, Inc. Fax: 416-448-5454 124 South Maple Street Email: [email protected] Ambler, PA 19422 Phone: 215-646-4636 Mr. David Yockelson Fax: 215-646-4721 Senior Vice President and Director Email: [email protected] META Group 208 Harbor Drive Ms. Cynthia Williams Stamford, CT 06912 NEMI Director of Communications Phone: 203-973-6744 NEMI Consultant Fax: 203-359-8066 P.O. Box 898 Email: [email protected] Portland, ME 04104-0898

35 NEMI Participant Guidelines & Directory Mr. Mike Yuen Phone: 727-803-3342 Advanced Mfg Technology Manager Fax: 727-231-3342 Foxconn (Hon Hai) Email: [email protected] 8807 Fallbrook Drive Houston, TX 77064 Mr. Edgar Zuniga Phone: 281-668-1654 Packaging Manager, High Volume Analog Fax: 281-671-1960 & Logic Email: [email protected] Texas Instruments Incorporated 6412 Highway 75 South, Mr. Jim Zboralski M/S 802 Sr. Director, Advanced Manufacturing Sherman, TX 75092 Technology Phone: 903-868-5820 Jabil Circuit, Inc. Fax: 903-868-5616 10800 Roosevelt Blvd. Email: [email protected] St. Petersburg, FL 33716 Data Exchange

36 NEMI Participant Guidelines & Directory