DOCSLIB.ORG

Participant Guidelines and Directory

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Participant Guidelines and Directory NEMI Participant Guidelines and Directory September 2004 Connect with and Strengthen your Supply Chain TABLE OF CONTENTS Introduction .......................................................................................................................... 2 Projects ................................................................................................................................. 4 Legal Documents ................................................................................................................... 5 Some Anti-Trust Do’s and Don’ts ........................................................................................... 6 Export Compliance Protocol for NEMI Projects........................................................................ 7 NEMI Secretariat Services.................................................................................................... 8 • Meetings...................................................................................................................... 8 • Communications/Software ........................................................................................... 9 • Publicity...................................................................................................................... 9 Member Companies/Organizations....................................................................................... 10 NEMI Leadership................................................................................................................ 11 NEMI Member Directory – September 2004 ........................................................................... 19 1 NEMI Participant Guidelines & Directory INTRODUCTION PURPOSE OF GUIDELINES The purpose of the NEMI Member Guidelines is to provide a general overview of NEMI structure and basic information that will assist you. NEMI MISSION The National Electronics Manufacturing Initiative is a North American based consortium whose mission is dedicated to providing leadership for the global electronics manufacturing supply chain for the benefit of its member companies and the industry. NEMI members use existing resources to develop and deploy new manufacturing technologies and efficient business practices necessary to maintain a responsive supply chain infrastructure. Since many of NEMI’s members are global companies, coordination is encouraged with other regions to achieve global solutions. NEMI STRUCTURE/ORGANIZATION NEMI is a consortium (organized as a 501(c)(6) corporation) made up of Electronic Equipment Manufacturers, their suppliers, other consortia/ associations, government agencies, and universities. As seen in the organization chart below, the group is headed by a board of directors that is elected by the NEMI Council of member representatives. The Technical Committee, driving both roadmapping and implementation efforts, is led by industry/staff co-chairs appointed by the board. The board also sponsors the Business Leadership Team to address selected business/supply chain topics. Technology Working NEMI Board NEMI Board Optoelectronics Group of Directors NEMI Staff of Directors NEMI Staff Technology Technology Elected by NEMI Council Elected by NEMI Council SecretarySecretary to to BoD BoD Integration Working Representatives Representatives CommunicationsCommunications Group EMS Directors Group EMS Directors MembershipMembership Development Development OEM Directors OEM Directors TechnicalTechnical Facilitation Facilitation Supplier Directors Substrates Supplier Directors Technology Strategic Objectives Strategic Objectives Working OperationalOperational Responsibility Responsibility Technology Group Integration Group • • Technology Board Assembly Technical Committee • Roadmapping Technical Committee Implementation Technology EMS, OEM, Supplier & Integration Technology 19 Industry EMS, OEM, Supplier & 5 NEMI Working TWGs Academia/GovernmentAcademia/Government Group Representatives TIGs Group Representatives Product Life Cycle Information Product Need Management Roadmapping Business Business Technology Research Committee Leadership Integration ResearchResearch CommitteeCommittee Leadership 7 Industry TeamTeam Group PEGs EMS,EMS, OEM, OEM, Supplier Supplier & & Academia/GovernmentAcademia/Government EMSEMS & & OEM OEM Environmentally RepresentativesRepresentatives RepresentativesRepresentatives Conscious Product Product Electronics Emulator Emulator Technology Group Group Integration Group Technology Working Groups (TWGs) and Product Emulator Groups (PEGs) are involved with the roadmapping activities while the Technology Integration Groups (TIGs) drive the implementation projects. A small permanent staff, the executive Secretariat, provides the administrative framework for the group activities. Contact information for all of the people filling these roles can be found in this Directory. 2 NEMI Participant Guidelines & Directory CURRENT NEMI FUNCTIONS NEMI employs an innovative strategy to achieve its goals. First, NEMI forecasts major trends in the evolution of technology across 19 different disciplines. Second, NEMI defines future virtual products from seven market segments and then identifies the technologies and processes (both business and technical) that will be necessary to design and produce those products in our increasingly distributed manufacturing environment. Then, comparison of the virtual products’ requirements with projected technology/ infrastructure trends enables NEMI members to identify and address gaps in the industry supply chain for high volume electronics. The methodology followed by NEMI is shown below. NEMI TECHNICAL METHODOLOGY Technology Product Evolution Needs Roadmap Project Global Completion Participation Disruptive Available Technology to Market Government Place Competitive GAP Research Solutions Analysis No Work Academia Required NEMI Users & Suppliers Regional Collaboration Industry Solution Projects Needed For those efforts requiring fundamental R&D, NEMI works with government agencies, universities, and other consortia to ensure that the work is properly funded and undertaken. In those cases where the technology exists but is lacking in infrastructure, interested NEMI member companies will form projects to address the needs identified. From both the roadmapping and the project activities, standards initiatives can be identified. Through the project process, NEMI will work to ensure that the standards are created by collaborating with the appropriate standards groups. For emerging topics to industry, NEMI organizes and conducts forums to educate, communicate, and identify new areas of industry collaboration. NEMI FUNDING AND PARTICIPATION NEMI projects will be funded primarily through the use of in-kind resources by industry participants. ROLES AND RESPONSIBILITIES The following roles and responsibilities are provided for the various NEMI functions. • NEMI Council Represents all organizations participating in NEMI. The Council also elects the Board of Directors (staggered 3-year terms). • NEMI Board of Directors Has operational responsibility for the organization. This group approves the strategy, plans, and budget of NEMI. • Technical Committee Facilitates and coordinates all NEMI technical activities. This group also develops and integrates the NEMI technical strategy and plans. • Business Leadership Team Facilitates and coordinates all NEMI business gap activities. The group also supports the TC, TIGs, and TWGs relative to business topics. • Research Committee Responsible for stimulating research in areas identified as gaps during the NEMI roadmapping process. 3 NEMI Participant Guidelines & Directory • Technology Working Groups (TWGs) Responsible for developing technology roadmaps. Participation in roadmapping activities does not require membership in NEMI. • Product Emulator Groups (PEGs) Responsible for developing product emulator roadmaps. Participation in roadmapping activities does not require membership in NEMI. • Technology Integration Groups (TIGs) Responsible for identifying technology needs and facilitating the formation and management of projects. • Project Teams Responsible for implementing NEMI projects to approved Project Statements (see NEMI Project Participation Agreement). • NEMI Secretariat Responsible for corporate office functions and providing staff support to all other NEMI activities. PROJECTS BACKGROUND During the Roadmap process the Technology Working Groups (TWGs) analyze the future technology requirements defined by the product emulators against the predicted technology advancements as forecasted. The differences between product needs and technology trends are identified as gaps – both business and technical – that need to be filled if the global supply chain is to maintain world class manufacturing capabilities. The Technology Integration Groups (TIGs) identify projects that need to be undertaken by member companies in order to fill these gaps. PROJECT PROCESS Once the Technology Integration Group (TIG) has determined a technical or business area where projects are needed, one or more project champions are located to initiate the project process. Representatives from member companies meet to define the project. This generally starts with a Definition of Requirements from companies (generally OEMs and/or EMS providers) who will be the end users of the project deliverables. The member company representatives then define a Statement of Work (SOW) that will be undertaken to develop the necessary capabilities to satisfy user needs. The
Load more

Recommended publications
  • 2020 Annual Report
    Section Header Here 2020 ANNUAL REPORT 2020 2020 Annual Report 2018 PROXY STATEMENT Section Header Here Dear Shareholders For Benchmark, our customers, employees, and suppliers, the past year of 2020 was unlike any other in our history. The company rallied and executed well in an unprecedented operating environment and rapidly adjusted to meet the fluid demand needs of our customers. This required tremendous effort across all functions of our business, especially our front-line design engineers and manufacturing personnel. Through our global COVID -19 Task Force, we made quick decisions and put new protective measures in place, including enhanced cleaning and social distancing protocols, contact tracing, and quarantines as needed. We also implemented thermal imaging temperature checks, mandatory use of masks, and at times performed rapid COVID-19 testing. We also introduced programs to help impacted employees, including those at higher risk and those caring for family members. I want to extend my personal gratitude for the enormous effort and dedication of the entire Benchmark team. Against the background of the global pandemic, we made significant progress throughout the year on our 2020 strategic initiatives: (a) enhancing customer focus, (b) growing our business, (c) driving enterprise efficiencies, and (d) engaging talent. We exited the year with customer satisfaction at an all-time high from our customer-focused initiatives. We also made progress on making it “easier to do business” with Benchmark, along with improvements in deepening our strategic relationships and growing our position with existing accounts. We have improved customer and program retention significantly in the last eighteen months. While we have room to improve customer satisfaction further, I am pleased with the positive trends and the impact this is having on increasing business across our new and FOR BENCHMARK, OUR existing customer base.
    [Show full text]
  • Filed by Celestica Inc. Filed Pursuant to Rule 425 Under the Securities Act
    Filed by Celestica Inc. Filed pursuant to Rule 425 under the Securities Act of 1933, as amended, and deemed filed pursuant to Rule 14a-12 under the Securities Exchange Act of 1934, as amended. Subject Company: Manufacturers’ Services Limited Commission File No.: 001-15883 The following is a Q & A and slide presentation to be given to employees of Manufacturers' Services Limited regarding the proposed merger with Celestica Inc. which was announced on October 15, 2003: 1. Why are we merging with CLS? This transaction will provide the combined company with an enhanced portfolio of capabilities, expanded supply chain leverage and the advantage of an increased global footprint. In addition, CLS’s proven track record, strong balance sheet and reputation as a global leader in the EMS industry makes this attractive for our customers, shareholders and employee’s. 2. Who are they? (See fact sheet) • -Number of employee’s- 38,000 worldwide • -Number of sites- 38 worldwide locations, 17 countries • -Key customers-Dell, Cisco, Alactel, Lucent, EMC, IBM, HP, Avaya, NEC • -Annual ‘02 revenue-8.3 billion in ‘02 • -Headquartered in Toronto Canada 3. Do we have any common customers with them now? Although the majority of Celestica’s customers are not a part of MSL’s customer portfolio, there are some common customers, including HP and IBM. 4. How do our customers feel about this? We are contacting our customers and expect that they will be pleased with the announcement as it expands the depth and breath of our service, capability and geographical offerings. 5. What impact will this announcement have on our suppliers when the deal closes? We expect that the closing of the transaction will enhance our overall buying power and provide more opportunities for our suppliers as we grow.
    [Show full text]
  • The Politics of Global Production: Apple, Foxconn and Chinas New
    New Technology, Work and Employment 28:2 ISSN 0268-1072 The politics of global production: Apple, Foxconn and China’s new working class Jenny Chan, Ngai Pun and Mark Selden Apple’s commercial triumph rests in part on the outsourcing of its consumer electronics production to Asia. Drawing on exten- sive fieldwork at China’s leading exporter—the Taiwanese- owned Foxconn—the power dynamics of the buyer-driven supply chain are analysed in the context of the national ter- rains that mediate or even accentuate global pressures. Power asymmetries assure the dominance of Apple in price setting and the timing of product delivery, resulting in intense pressures and illegal overtime for workers. Responding to the high- pressure production regime, the young generation of Chinese rural migrant workers engages in a crescendo of individual and collective struggles to define their rights and defend their dignity in the face of combined corporate and state power. Keywords: Foxconn, Apple, global supply chains, labour, China, outsourcing, consumer electronics manufacturing, collective actions. Introduction The magnitude of Apple’s commercial success is paralleled by, and based upon, the scale of production in its supply chain factories, the most important of them located in Asia (Apple, 2012a: 7). As the principal manufacturer of products and components for Apple, Taiwanese company Foxconn1 currently employs 1.4 million workers in China alone. Arguably, then, just as Apple has achieved a globally dominant position, described as ‘the world’s most valuable brand’ (Brand Finance Global 500, 2013), so too have the fortunes of Foxconn been entwined with Apple’s success, facilitating Foxconn’s rise to become the world’s largest electronics contractor (Dinges, 2010).
    [Show full text]
  • 2009 Annual Report Cover Final.Indd
    ANNUAL REPORT 2009 Advancing manufacturing technology Message from the Chairman & CEO The magnitude of the world economic challenges became much clearer in 2009 in all major geographies and in all segments of the electronics industry. While volume and revenue levels became even more compressed, the industry’s pain level rose. Despite this troubling business backdrop, iNEMI not only managed to stabilize, but to actually grow our membership; and many of our members began to see slowly improving business conditions starting in the third quarter. The impact and contributions from Asia grew with seven new members, a maturing Asia Steering Committee and several projects initiated from within that region. At the end of the year, we sponsored a Packaging Substrates Workshop in Japan, which generated proposals for six high-impact projects in packaging and miniaturization. We are working to drive these projects to the formation and implementation stages quickly as the new year begins. In Europe we have done a great deal to grow recognition of INEMI as a key contributor on environmental issues in the electronics Nasser Grayeli manufacturing industry, with further value in Europe expected in 2010. The 2009 Roadmap was the focus of many of our activities this year. We not only pushed it out to industry, but also mined its contents to create the iNEMI Technical Plan and Research Priorities, both valuable documents for guiding iNEMI‘s activities and identifying R&D needs. The Technical Plan has been broadened, with 26 projects either active or in development. The environmental challenges facing mankind continue to demand proactive and aggressive responses.
    [Show full text]
  • HP Ecosystem (650) 857-1501
    HP Inc. 1501 Page Mill Road Palo Alto, California HP Ecosystem (650) 857-1501 www.hp.com Outside Relationships Outside Relationships HP Inc. (a Delaware Corporation) Regulators Capital Suppliers Customers Securities Regulation and Customers Suppliers Capital Regulators Debt Structure Equity Structure Stock Exchange Rules Public Debt Bond Financing Subjects of Debt ( $6.18B Outstanding @ March 5, 2021) | Credit Ratings on Senior Unsecured Debt: Moody’s: Baa2; S&P: BBB, Fitch: BBB+ Equity Securities Holders Dividends and Common Regulators Substantive Share Repurchase Program Preferred Stock Common Stock Significant Working Capital Financing Commercial Paper Programs Commercial Loans Notes Stock Repurchases Regulation Commercial Authorized: $15.0B Authorized: 300 Authorized: 9.6B Shareholders Two Commercial Paper Programs for Senior Unsecured Notes Issued Senior Unsecured Notes Issued US Securities Banks $1.0B 364-Day Revolving Credit $4.0B Revolving Credit $725M Uncommitted U.S. Foreign Currency and $6.0B and €6.0B (Aggregate Amount 2010-11: $2.70B at 3.57-6.00% 2020: $2.99B at 2.20-3.40% Expiration: None Issued: None Issued/Outstanding: 1.304B Equity Capital and Exchange Facility (Matures 2021) Facility (Matures 2023) Lines of Credit Dodge & Cox Environmental Interest Rate Derivatives Outstanding May Not Exceed $6.0B) Due 2021-2041 Due 2025-30 Remaining: $12.7B Recordholders: None Recordholders: 56,084 Commission Hedge (11.99%) Protection (Business Counterparties Disclosure and Agency General Business Finance and Vanguard Financial Reporting Human Resources Commercial Legal Corporate Matters Professional Regulation and Regulation Governance Accounting Group, Inc. Requirements; Anti- Board of Directors Customer Support Legal Operations Services Firms Permitting Workforce Business Decision Marketing Supply Chain (10.71%) Bribery Record- Regarding Air & Selected Development and keeping Enrique Lores (Chair) Charles V.
    [Show full text]
  • Management Information Circular
    NOTICE OF MEETING AND MANAGEMENT INFORMATION CIRCULAR FOR THE ANNUAL MEETING OF SHAREHOLDERS TO BE HELD ON APRIL 29, 2021 INVITATION TO SHAREHOLDERS On behalf of the Board of Directors, management and employees of Celestica Inc. (the “Corporation”), it is our pleasure to invite you to join us at the Corporation’s Annual Meeting of Shareholders (the “Meeting”) to be held on Thursday, April 29, 2021 at 9:30 a.m. EDT in a virtual format due to the ongoing public health concerns related to coronavirus disease 2019 and related mutations (“COVID-19”). Shareholders will not be able to attend the Meeting in person. We believe that hosting a virtual Meeting will facilitate shareholder attendance and participation by enabling shareholders to participate remotely from any location around the world. We have designed the format of the virtual Meeting so that shareholders have opportunities to vote and participate, substantially similar to those they would have at a physical meeting. Shareholders will be able to submit questions before and during the Meeting using online tools, providing an opportunity for meaningful engagement with the Corporation. Your participation at the Meeting is important. We encourage you to exercise your right to vote. For instructions on attending the Meeting virtually and voting your shares, please see Questions and Answers on Voting and Proxies in the accompanying Management Information Circular (“Circular”). The Meeting will begin at approximately 9:30 a.m., EDT, with login beginning at 9:00 a.m., EDT, via a live audio-only webcast on the internet. The items of business to be considered and voted upon by shareholders at the Meeting are described in the Notice of Annual Meeting and the Circular.
    [Show full text]
  • The Electronic Manufacturing Service (EMS) Industry in 2014
    The Electronic Manufacturing Service Ericsson, routers for Cisco, and printers for HP. Cal- 1 (EMS) Industry in 2014 Comp Electronics (based in Thailand) produces components for HP printers and other products. Celestica (based in Canada, where it was spun off by IBM in 1994), meanwhile, produces sub-assemblies for Cisco’s internet and intranet devices, as well as products for customers such as HP, IBM, and NEC (until 2012, Celestica also was one of the producers of the Blackberry smartphone, for which Foxconn is now taking the lead in design and assembly). Each of these EMS providers has plants around the world, well beyond their home countries. EMS are similar to ODMs (Original Design Manufacturers), with a key difference that EMS providers traditionally did not take ownership of intellectual property, while ODM firms (many of EMS services at Celestica solar panel lab (Canada) which – such as Pegatron, Compal, Wistron, and Photo: Adrian Wyld/Canadian Press Quanta – originated in Taiwan) often retain at least partial IP ownership of the products they design for an OEM. Hence, ODMs historically were stronger at product design capabilities than most EMS providers. However, the line between the two types of service organizations is rapidly blurring and the same companies can act as both ODM and EMS providers. Pegatron, for instance, is one of the EMS producers of the iPhone, while Foxconn has taken on ODM- type responsibility for Blackberry. The boundaries of the EMS market are dynamic, so that measuring market size is ambiguous. However, an estimate by the “Research and Markets” industry analysts is that total electronics assembly exceeded $1 trillion in 2013 and will grow to about $1.5 trillion iPhone assembly at a Foxxcon facility in China in 2017.
    [Show full text]
  • UNITED STATES SECURITIES and EXCHANGE COMMISSION Form
    Use these links to rapidly review the document TABLE OF CONTENTS UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 ____________________________________________________________________________ Form 10-K (Mark One) ý ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended March 31, 2016 Or o TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 Commission file number 000-23354 FLEXTRONICS INTERNATIONAL LTD. (Exact name of registrant as specified in its charter) Singapore (State or other jurisdiction of Not Applicable incorporation or organization) (I.R.S. Employer Identification No.) 2 Changi South Lane, Singapore 486123 (Address of registrant's principal executive offices) (Zip Code) Registrant's telephone number, including area code (65) 6876-9899 Securities registered pursuant to Section 12(b) of the Act: Title of Each Class Name of Each Exchange on Which Registered Ordinary Shares, No Par Value The NASDAQ Stock Market LLC (NASDAQ Global Select Market) Securities registered pursuant to Section 12(g) of the Act— NONE Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. Yes ý No o Indicate by check mark if the registrant is not required to file reports pursuant to Section 13 or Section 15(d) of the Exchange Act. Yes o No ý Indicate by check mark whether the registrant: (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days.
    [Show full text]
  • Performance Assessment for Electronic Manufacturing Service Providers Using Two-Stage Super-Efficiency SBM Model
    Applied Economics ISSN: 0003-6846 (Print) 1466-4283 (Online) Journal homepage: http://www.tandfonline.com/loi/raec20 Performance assessment for electronic manufacturing service providers using two-stage super-efficiency SBM model Chia-Nan Wang, Hsien-Pin Hsu, Yen-Hui Wang & Thi-Thu-Huyen Pham To cite this article: Chia-Nan Wang, Hsien-Pin Hsu, Yen-Hui Wang & Thi-Thu-Huyen Pham (2016): Performance assessment for electronic manufacturing service providers using two- stage super-efficiency SBM model, Applied Economics, DOI: 10.1080/00036846.2016.1229446 To link to this article: http://dx.doi.org/10.1080/00036846.2016.1229446 Published online: 13 Sep 2016. Submit your article to this journal Article views: 23 View related articles View Crossmark data Full Terms & Conditions of access and use can be found at http://www.tandfonline.com/action/journalInformation?journalCode=raec20 Download by: [UCL Library Services] Date: 28 January 2017, At: 23:05 APPLIED ECONOMICS, 2016 http://dx.doi.org/10.1080/00036846.2016.1229446 Performance assessment for electronic manufacturing service providers using two-stage super-efficiency SBM model Chia-Nan Wanga,b, Hsien-Pin Hsuc, Yen-Hui Wangd and Thi-Thu-Huyen Phame aNational Kaohsiung University of Applied Science, Kaohsiung, Taiwan; bTon Duc Thang University, Ho Chi Minh City, Vietnam; cNational Kaohsiung Marine University, Kaohsiung, Taiwan; dChihlee University of Technology, New Taipei City, Taiwan; eFoxconn Electronics Inc., Honi, Vietnam ABSTRACT KEYWORDS Manufacturing Service providers (EMSs) offer services to Original Equipment Manufacturers Data envelopment analysis; (OEMs). However, increasing challenges require an EMS to be more capable, adaptable and EMS industry; forecast; grey responsive. For survival, an EMS manager has to understand its relative efficiency in the industry.
    [Show full text]
  • Case No COMP/M.1841 - CELESTICA / IBM (EMS)
    EN Case No COMP/M.1841 - CELESTICA / IBM (EMS) Only the English text is available and authentic. REGULATION (EEC) No 4064/89 MERGER PROCEDURE Article 6(1)(b) NON-OPPOSITION Date: 25/02/2000 Also available in the CELEX database Document No 300M1841 Office for Official Publications of the European Communities L-2985 Luxembourg COMMISSION OF THE EUROPEAN COMMUNITIES Brussels, 25.02.2000 SG (2000) D/101806 In the published version of this decision, some information has been omitted PUBLIC VERSION pursuant to Article 17(2) of Council Regulation (EEC) No 4064/89 concerning MERGER PROCEDURE non-disclosure of business secrets and other ARTICLE 6(1)(b) DECISION confidential information. The omissions are shown thus […]. Where possible the information omitted has been replaced by ranges of figures or a general description. To the notifying party Dear Sirs, Subject: Case No COMP/M.1841-Celestica/IBM (EMS) Notification of 26 January 2000 pursuant to Article 4 of Council Regulation No 4064/89 1. On 26 January 2000, the Commission received a notification of a proposed concentration pursuant to Article 4 of Council Regulation (EEC) Nº 4064/891 by which the undertaking Celestica Inc. (“Celestica”) will acquire sole control within the meaning of Article 3(1)(b) of the Council Regulation of some parts of the undertaking International Business Machines Corporation (“IBM”) 2. After examining the notification, the Commission has concluded that the notified concentration falls within the scope of Council Regulation (EEC) Nº 4064/89 and does not raise serious doubts as to its compatibility with the common market and with the functioning of the EEA Agreement I.
    [Show full text]
  • 2019 Public Supplier List
    2019 Public Supplier List The list of suppliers includes original design manufacturers (ODMs), final assembly, and direct material suppliers. The volume and nature of business conducted with suppliers shifts as business needs change. This list represents a snapshot covering at least 95% of Dell’s spend during fiscal year 2020. Corporate Profile Address Dell Products / Supplier Type Sustainability Site GRI Procurement Category Compal 58 First Avenue, Alienware Notebook Final Assembly and/ Compal YES Comprehensive Free Trade Latitude Notebook or Original Design Zone, Kunshan, Jiangsu, Latitude Tablet Manufacturers People’s Republic Of China Mobile Precision Notebook XPS Notebook Poweredge Server Compal 8 Nandong Road, Pingzhen IoT Desktop Final Assembly and/ Compal YES District, Taoyuan, Taiwan IoT Embedded PC or Original Design Latitude Notebook Manufacturers Latitude Tablet Mobile Precision Notebook Compal 88, Sec. 1, Zongbao Inspiron Notebook Final Assembly and/ Compal YES Avenue, Chengdu Hi-tech Vostro Notebook or Original Design Comprehensive Bonded Zone, Manufacturers Shuangliu County, Chengdu, Sichuan, People’s Republic of China Public Supplier List 2019 | Published November 2020 | 01 of 40 Corporate Profile Address Dell Products / Supplier Type Sustainability Site GRI Procurement Category Dell 2366-2388 Jinshang Road, Alienware Desktop Final Assembly and/ Dell YES Information Guangdian, Inspiron Desktop or Original Design Xiamen, Fujian, People’s Optiplex All in One Manufacturers Republic of China Optiplex Desktop Precision Desktop
    [Show full text]
  • HP Supplier List
    HP Supplier List Below is an alphabetized listing of HP production suppliers and information about their sustainability practices. These suppliers represent more than 95% of HP’s procurement expenditures for materials, manufacturing, and assembly at the time of publication. This list includes final assembly suppliers, which may include contract manufacturers, electronic manufacturing service providers, and original design manufacturers, as well as commodity and component suppliers. HP is sharing this list with the intent of promoting transparency and progress in raising social and environmental standards in the electronics industry supply chain. Final assembly parent supplier name Sustainability link Company publishes Product type City, Country Site address Number of workers on HP lines sustainability report using the Global Reporting (GRI) Initiative framework AU Optronics Corporation Sustainability Yes Display Suzhou, China No. 398, Suhong Zhong Road, Suzhou 890 Industrial Park, 215021 BOE Technology Group Co. Corporate Social Responsibility Yes Display Beijing, China No.118 Jinghaiyilu, BDA, Beijing, 100176 50 Display Chongqing, China No. 7, Yunhan Road, Shuitu Hi Tech 950 Industrial Park, Beibei District, 400700 Display Hefei, China No.2177, Great East Road, Xin Zhan 150 Development Zone, Hefei, An Hui Province Cheng Uei Precision Industry Co. Corporate Responsibility Yes Scanner Dongguan, China FIT Industry Park, Yinhe Industrial Area, 1013 Qingxi, Dongguan Guangdong Province Compal Electronics Sustainable Development Yes PC Kunshan,
    [Show full text]