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Fusion-Io Virtualization Reference Architecture
A Principled Technologies reference architecture commissioned by Fusion-io, Inc. (Revised) TABLE OF CONTENTS Table of contents ..................................................................................... 2 Executive summary .................................................................................. 3 Solution considerations ............................................................................ 4 Summary of main findings ........................................................................ 5 Solution components ............................................................................... 5 Cisco UCS ............................................................................................5 VMware vSphere 5.1 ..........................................................................6 VMware Horizon View ........................................................................6 Fusion ioControl Hybrid Storage Appliance ........................................7 Cisco UCS Fusion ioDrive2 785GB adapter and Fusion ioTurbine software ..............................................................................................9 Workloads ............................................................................................. 11 Login VSI workload .......................................................................... 11 OLTP (DVD Store) workload description .......................................... 12 Exchange (Microsoft LoadGen) ........................................................ 13 Solution architecture -
Technology of Enterprise Solid State Drive
White Paper | April 2014 Technology of Enterprise Solid State Drive Recently, large capacity and high-performance storages are highly required in the cloud computing and data center due to rapidly increasing amount of information and number of access. When many people heavily access to internet services such as social network service (SNS) or web search engine, they will always expect an instant response from the service. In the corporate on-premise network system and financial trading system, micro seconds range of the response time makes big difference to the business outcome. As an evolution of the enterprise server and storage system, more focus is placed on speed, response time and latency to support large number of SNS user accesses and time-critical business transactions. Then Solid State Drive (SSD) plays an important role for server system to make the transactions faster. Enterprise class SSD is a storage device with NAND flash memories and required the design to store and retrieve data at very high speed under high duty operation conditions with reliable endurance performance. It will be very beneficial for system managers to deploy SSD for boosting up computing process and storage access speed. By positioning between host processor and hard disk drive (HDD) storage pools as a large cache memory, SSD increases the system transaction speed. SSD has also good points, in addition to higher performance, such as smaller footprint and lower power consumption. Toshiba has matured leading edge technologies in the SSD as the first company developing NAND flash memory. Interfaces Host Controller Interface) is popular for client application. -
2020 ANNUAL MEMBERS MEETING October 22, 2020 8AM Pacific / 11AM Eastern – Teleconference (See Next Page for Dial-In and Zoom Instructions)
2020 ANNUAL MEMBERS MEETING October 22, 2020 8AM Pacific / 11AM Eastern – Teleconference (See Next Page for Dial-in and Zoom Instructions) 1 | ©2020 Storage Networking Industry Association. All Rights Reserved. Conference Call Dial-in and Zoom Info https://www.snia.org/annualmeeting Link will start Zoom meeting – afterwards, redirects to copy of the presentation materials Teleconference/Zoom coordinates: Zoom Meeting ID: 988 4674 5668 Passcode: 102220 https://zoom.us/j/98846745668?pwd=SW5BUzAxdUJZVDFhTmhPS2VNd0FKZz09 One tap mobile +16699009128,,98846745668#,,,,,,0#,,102220# US (San Jose) +13462487799,,98846745668#,,,,,,0#,,102220# US (Houston) +16465588656,,98846745668#,,,,,,0#,,102220# US (New York) Find your local number: https://zoom.us/u/aekOw6XZjj 2 | ©2020 Storage Networking Industry Association. All Rights Reserved. Zoom Format – Attendee Guidance . Enter Name (Company) on your Zoom Login/Attendee Info . Everyone will be on Mute, except the Moderator/Speaker . You can unmute yourself if you would like to say something . Voting Member Company Primary/Alternate representatives, please identify yourself when joining . Remain on Mute when not speaking . Use the Chat Icon to text message the group or a particular person . Use Raised Hand function under “participants” icon 3 | ©2020 Storage Networking Industry Association. All Rights Reserved. 2020 Annual Members Meeting Agenda . Greetings and Roll Call – Michael Oros, Executive Director . FY2019: Annual Report published . Motion to Approve 2019 Meeting Minutes – Jim Pappas, SNIA Secretary . Fiscal Report (2019 Annual Report) – Sue Amarin, SNIA Treasurer . FY2020: SNIA update and achievements to date – Michael Oros, Executive Director . FY2021: What’s ahead for SNIA – J Metz, Ph.D, SNIA Chairman . Special Guest Speakers: EPA: Ryan Fogle; DMTF: Jeff Hilland; NVM Express: Amber Huffman . -
ISSM2020 –International Symposium on Semiconductor Manufacturing SPONSORSHIP December 15-16, 2020, Tokyo, Japan
ISSM2020 –International Symposium on Semiconductor Manufacturing SPONSORSHIP December 15-16, 2020, Tokyo, Japan Shozo Saito Chairman, ISSM2020 Organizing Committee Device & System Platform Development Center Co., Ltd. Shuichi Inoue, ATONARP INC. It is our great pleasure to announce that The 28th annual International Symposium on Semiconductor Manufacturing (ISSM) 2020 will be held on December 15-16, 2020 at KFC Hall, Ryogoku, Tokyo in cooperation with e-Manufacturing & Design Collaboration Symposium (eMDC) which is sponsored by TSIA with support from SEMI and GSA. The program will feature keynote speeches by world leading speakers, timely and highlighted topics and networking sessions focusing on equipment/materials/software/services with suppliers' exhibits. ISSM continues to contribute to the growth of the semiconductor industry through its infrastructure for networking, discussion, and information sharing among the world's professionals. We would like you to cooperate with us by supporting the ISSM 2020. Please see the benefit of ISSM2020 sponsorship. Conference Overview Date: December 15-16, 2020 Location: KFC (Kokusai Fashion Center) Hall 1-6-1 Yokoami Sumidaku, Tokyo 130-0015 Japan +81-3-5610-5810 Co-Sponsored by: IEEE Electron Devices Society Minimal Fab Semiconductor Equipment Association of Japan (SEAJ) Semiconductor Equipment and Materials International (SEMI) Taiwan Semiconductor Industry Association (TSIA) Endorsement by: The Japan Society of Applied Physics Area of Interest: Fab Management Factory Design & Automated Material -
Intel® Solid State Drive 730 Series Product Brief
PRODUCT BRIEF Intel® Solid State Drive 730 Series Data Center DNA Performance Unleashed Factory overclocked 3rd generation Intel controller infused with DNA stolen from the Intel SSD Data Center Family. Optimized for Performance 730 Series + Intel® Rapid Maximize your computing experience Storage Technology = Amazing with the Intel® Solid State Drive (Intel® Performance SSD) 730 Series, built with a specially Digital Content Creation experts and qualified 3rd generation Intel con- PC Enthusiasts know the highest troller, 20nm NAND and optimized storage performance is achieved firmware. with RAID-0 configurations as SSDs Intel has taken storage a step fur- saturate the SATA interface. Comparing ther by factory overclocking these two Intel SSD 730 Series drives in a components to push the limits of RAID-0 array to a single alternative performance with a 50% increase in SSD, results in the same capacity controller speed and 20% increase in and nearly double the performance. NAND bus speed. Intel SSD 730 Series As shown below, two Intel SSD 730 are optimized for the most demanding Series drives in a RAID-0 configuration tasks including digital content creation, can provide throughput numbers video capture/editing, extreme gaming exceeding 1000MB/s when coupled and other client usages where stor- with Intel platforms supporting Intel age performance improves the user’s Rapid Storage Technology (Intel® RST). experience and efficiency. Applications Similarly four Intel SSD 730 Series will benefit from the 50µs read latency, drives in a RAID-0 array with an Intel® up to 550MB/s sequential reads and chipset based platform can provide 89,000 IOPs random reads. -
Ulltradimm™ SSD Overview
ULLtraDIMM™ SSD Overview Rob Callaghan June 9th, 2014 c 1 A Global Leader in Flash Storage Solutions Rankings Trailing 4 Qtr Financials* Global Operations Leading Retail Brand° $6.2B Revenue #1 Global Retail $3.6B Net Cash* Revenue $0.7B R&D Investment 5,500 Employees† Share SanDisk Client All Leading & Retail SSDs Smartphone Approved & Tablet Supplier to Qualified at Manufacturers All Leading PC 6 of the Top 7 use SanDisk Manufacturers Server & Storage OEMs Enterprise SSDs and Storage Software *Financials as of Q4, ‘13. Net Cash = [Cash + cash equivalents + short-term & long-term marketable securities] less [debt at maturity value] as of the end of Q4, ‘13. †Headcount as of Jan., ‘14. NPD Estimate, Nov., ‘13. Estimates of the memory card & USB markets from NPD (Nov. ‘13) and GfK Retail and Technology, Sep., ‘13. 2 Enabling Flash Storage from Wafer to Software NAND TECH NAND DIE SCALE ASSY, TEST & CONTROLLER FLASH MGMT SSD SOFTWARE PACKAGING Close to Half of Industry Bit Output World-Leading Innovator + Together with manufacturing 4,900 Patents partner Toshiba Fabs: World class NAND capacity 1991 2013 Patents as of Oct., ‘13; NPD Estimate, Nov., ‘13. Gartner: NAND Flash Supply & Demand, WW 1Q ‘12-4Q ‘14, 3Q ’13. Update Dec., ‘13. 3 The Path to Ultra Low Latency & Scalable Performance DDR 1’s 10’s PCIe 100’s Latency (µsec) speed memory bus speed memory 1000’s on high the Flash Storage SAS/SATA/FC 1,000,000 100 100,000 IOPS 4 Creating a New Storage Interface This is a This is DRAM with SATA DIMM battery backup Flash Flash Flash Flash Flash -
Federal Register/Vol. 85, No. 97/Tuesday, May 19, 2020/Notices
Federal Register / Vol. 85, No. 97 / Tuesday, May 19, 2020 / Notices 29975 DEPARTMENT OF JUSTICE Register pursuant to Section 6(b) of the No other changes have been made in Act on April 12, 2019 (84 FR 14973). either the membership or planned Antitrust Division activity of the group research project. Suzanne Morris, Membership in this group research Notice Pursuant to the National Chief, Premerger and Division Statistics, project remains open, and Pistoia Cooperative Research and Production Antitrust Division. Alliance, Inc. intends to file additional Act of 1993—Silicon Integration [FR Doc. 2020–10730 Filed 5–18–20; 8:45 am] written notifications disclosing all Initiative, Inc. BILLING CODE P changes in membership. On May 28, 2009, Pistoia Alliance, Notice is hereby given that, on April Inc. filed its original notification DEPARTMENT OF JUSTICE 23, 2020, pursuant to Section 6(a) of the pursuant to Section 6(a) of the Act. The Department of Justice published a notice National Cooperative Research and Antitrust Division Production Act of 1993, 15 U.S.C. 4301 in the Federal Register pursuant to et seq. (‘‘the Act’’), Silicon Integration Notice Pursuant to the National Section 6(b) of the Act on July 15, 2009 Initiative, Inc. (‘‘Si2’’) has filed written Cooperative Research and Production (74 FR 34364). notifications simultaneously with the Act of 1993—Pistoia Alliance, Inc. The last notification was filed with the Department on February 6, 2020. A Attorney General and the Federal Trade notice was published in the Federal Commission disclosing changes in its Notice is hereby given that, on April 24, 2020, pursuant to Section 6(a) of the Register pursuant to Section 6(b) of the membership. -
The Benefits of Serial Attached SCSI (SAS) for External Subsystems
SERVER STORAGE SOLUTIONS WHITE PAPER The Benefits of Serial Attached SCSI (SAS) for External Subsystems Serial Attached SCSI (SAS), the follow-on to parallel The first SAS prototypes were announced in 2003 and SCSI, is designed for high-performance enterprise were a major step to achieving mass market requirements and offers both the benefits of backward availability. Those prototypes allowed development of compatibility with SCSI and interoperability with the first generation of technologies and products that Serial ATA (SATA), bringing enterprises a flexibility bring the benefits of SAS into the enterprise. These and cost savings previously not possible. SAS provides products have been developed and tested, and enable a significant benefits to external storage subsystems and wide variety of integrated solutions. offers users “one-stop-shopping” to satisfy their Interoperability testing was a key component of SAS, requirements for the following three main data types; because it increases the architecture’s flexibility by Throughput Data Transaction Data Reference Data supporting both SAS and SATA disk drives and components. Interoperability allows one vendor’s SAS • High MB/s and large • Maximum IOPs for OLTP, • Fixed content, archival data data-intensive files calculation intensive files for secondary/nearline products to be compatible with another’s, and it also • Large block, random • Small block, random storage ensures products developed today will work with all read/writes read/writes • Large block, sequential existing and next-generation -
SD Supported Media 08-03-2020 Hs
TASCAM HS-2 Tested media List SDHC/SDXC Card 2021/8/25 Manufacturer Model Parts# Capacity Remarks EXCERIA PLUS SDHC/SDXC UHS-I KSDH-A032G 32GB ○ Memory Card KIOXIA EXCERIA SDHC/SDXC UHS-I KSDU-A032G 32GB ○ Memory Card SDHC/SDXC Card 2020/8/3 Manufacturer Model Parts# Capacity Remarks SDXC/SDHC UHS-II IMemory Card SONY SF-G32T 32GB ○ SF-G Series SDHC/SDXCIMemory Card TOSHIBA SDBR48N32G 32GB ○ (SDBR48N Series) SDHC/SDXC Card 2019/4/8 Manufacturer Model Parts# Capacity Remarks SDXC/SDHC UHS-IMemory Card SF-32UY3 32GB ○*1 SONY SF-UY3Series SF-16UY3 16GB ○*1 *1: The performace of the media may be degraded significantly if it will be used repeatedly. ERASE FORMAT by HS-2 is recommended before use. *1: 繰り返し使用により書き込み性能が著しく低下する場合があります。 HS-2IでのERASE FORMAT後の使用を推奨します。 SDHC/SDXC Card 2018/9/19 Manufacturer Model Parts# Capacity Remarks SanDisk Extreme Pro SD UHS-II card SDSDXPK-032G-JNJIP 32GB ○ SDHC/SDXC Card 2018/5/30 Manufacturer Model Parts# Capacity Remarks TASCAM TSQD-32A 32GB ○ Japan Only SD/SDHC Card 2018/2/2 Manufacturer Model Parts# Capacity Remarks Extreme SDHC/SDXC™ UHS-I SanDisk SDSDXNE-016G-JNJIP 16GB ○ card (U3, Class10) SD/SDHC Card 2016/7/22 Maker Series Model Capacity Result SanDisk Ultra Plus SDHC/ SDXC UHS-I SDSDUM-016G-J01 16GB OK SONY SDXC/SDHC UHS-I SF-8UY2 8GB OK SD/SDHC Card 2016/1/22 Maker Series Model Capacity Result SanDisk Extreme Pro® SDSDXPA-032G-JU3 32GB OK SDHC UHS-I Card (CLASS 10) SDSDXPA-016G-JU3 16GB OK SanDisk Extreme® SDSDXL-032G-JU3 32GB OK SanDisk SDHC UHS-I Card (CLASS 10) SDSDXL-016G-JU3 16GB OK SanDisk Standard -
Synnex Corporate 2021 Line Card
SYNNEX CORPORATE 2021 LINE CARD Corporate Headquarters Fremont, California* Sales Headquarters Greenville, South Carolina Warehouse Locations 1 Tracy, California 3 5 2 Chantilly, Virginia 6 10 3 Romeoville, Illinois 1 4 Richardson, Texas 2 5 Monroe, New Jersey 8 6 Grove City, Ohio 9 7 Miami, Florida 4 8 Southaven, Mississippi* 9 Chino, California 10 Columbus, Ohio 7 *ISO-9001:2015 Manufacturing Facilities ADVANCING IT INNOVATIONS SERVICES Map your destination to increased productivity, Sounds simple, but at • GSA Schedule cost savings and overall business success. Our SYNNEX we understand that • ECExpress Online Ordering true business growth requires • Software Licensing distribution centers are strategically located across access to meaningful, tangible the United States to provide you with product business infrastructure, tools, • Reseller Marketing Services where you need it when you need it. Each of our and resources. That’s why • Leasing distribution centers provides our customers with over the last year we’ve • Integration Services invested heavily in providing • Trade Up warehouse ratings of nearly 100% in accuracy and our partners with high-impact • A Menu of Financial Services business services, designed PPS (pick, pack and ship) performance. Couple that • SYNNEX Service Network with unsurpassed service from our infrastructure from the ground up to provide real value, and delivering on • ASCii Program support, giving you one more reason why you our commitment to provide • PRINTSolv should be doing business with SYNNEX. That’s -
RZ/V Series, Visionai ASSP RZ/V2M Datasheet
DATASHEET RZ/V Series, VisionAI_ASSP RZ/V2M R01DS0372EJ0100 Rev.1.00 Apr 28, 2021 Section 1 Overview 1.1 Features This LSI chip includes the AI dedicated accelerator (DRP-AI) and 4K-compatible image signal processor (ISP). This processor is vision-AI ASSP for real-time human and object recognition. The AI dedicated hardware IP, DRP-AI, configured with the dynamic reconfigurable processor (DRP) and AI-MAC, combines both a high-speed AI inference and low power consumption and realizes 1TOPS/W class power performance. In addition, the image signal processor (ISP) is highly robust, producing a stable image independent of the environment, allowing for a high AI recognition accuracy. With these features, this LSI realizes low power consumption, which is a critical factor for embedded devices, making heat dissipation measures easier. The result is that it is ideal for vision AI applications in a wide range of embedded markets, including surveillance security, retail, office automation (OA), industrial automation, and robotics. In addition, this LSI also features abundant high-speed communication interfaces such as USB 3.1, PCI Express®, Gigabit Ethernet, and many CPU peripheral functions, so it can also be used in a variety of applications. CPU and DDR Memory Interfaces High Speed Interfaces ● Cortex®-A53 Dual (996 MHz maximum) ● 1× Gigabit Ethernet ● 32-bit LPDDR4-3200 ● 1× USB3.1 Gen1 Host/Peripheral ® ● 1× PCIe Gen 2 (2 lanes) ● 2× SDIO 3.0 Vision and AI ● 1× NAND Flash Interface ONFI1.0 ● AI accelerator: DRP-AI (1.0 TOPS/W class) ● 1× -
Toshiba Memory Corporation to Deliver Value SAS Ssds Targeting SATA Applications
Toshiba Memory Corporation to Deliver Value SAS SSDs Targeting SATA Applications New RM5 value SAS Series Brings Improved Performance, Reliability and Capacity at a Price Point that Enables SATA Replacement in Servers Düsseldorf, Germany, 20 June 2018 - Toshiba Memory Europe (TME), European subsidiary of Toshiba Memory Corporation, unveiled today a new, game-changing category of SAS SSDs expected to replace SATA SSDs in server applications. The RM5 12Gbit/s value SAS (vSAS) series features capacity, performance, reliability, and manageability and data security advantages – at a price that obsoletes SATA SSDs. A homogeneous SAS environment has long been the gold standard for enterprise server and storage systems. With vertical integration expertise in flash technology, firmware and controller design, Toshiba Memory Corporation leveraged its leading position as the world’s leading[1] SAS SSD line optimising RM5 to close the cost gap with SATA – and usher in a new class of SSDs. SATA simply cannot compete with SAS, falling well short in terms of performance, robustness, and encryption options. “Designed with affordability and server applications in mind, the Toshiba RM5 vSAS series seeks to provide a cost effective and much higher performing solution to overcome the bottlenecks that are inherent with SATA today,” Comments Paul Rowan, General Manager for the SSD unit at Toshiba Memory Europe. Where SATA drives often use SAS expanders to scale out, the RM5 enables the use of native SAS from end-to-end, eliminating the need for protocol translation to SATA. Customers can now take full advantage of SAS’s richer feature set and realise performance throughput superiority over SATA.