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2009 JINST 4 P03012 c , c a , a SISSA 17, 2009 : T. Lauf, January 28, 2009 : e December 15, 2008 , : a F. Schopper, d , a UBLISHING FOR UBLISHED CCEPTED P ECEIVED A P. Holl, R c , troscopy are foreseen as key respectively, making energy a IOP P 10.1088/1748-0221/4/03/P03012 doi: st mission to use formation-flying ular resolution. The instrument will ented focal length of around 20 m. xploring the x-ray sky. Located on , the eROSITA (extended Roentgen form an imaging all-sky survey up to R.H. Richter, c ng its own pnCCD camera in the focus. , a d low energy detectors, a monolithic 128 nck-Straße 2, UBLISHED BY P S. Herrmann, e , a M. Porro, c , a R. Hartmann, ORKSHOP c , W c a , a N. Meidinger, e , a 2008 , IL, U.S.A. G. Lutz, NTERNATIONAL ATAVIA e , and L. Str¨uder R. Andritschke, a e 1 , : Pixelated semiconductor detectors for X-ray imaging spec , , B a b [email protected] , EPTEMBER a 2008 I Corresponding author. ¨ ¨ ohringer Ring 6, D-80805 Munich, omerstraße 28, D-80803 Munich, Germany 128 DEPFET macropixel array and a pixellated CdZTe detector 1 2009 IOP Publishing Ltd and SISSA BSTRACT E-mail: MPI Semiconductor Laboratory, Otto-Hahn-Ring 6, D-81739 Munich, Germany Max--Institute for Solar Systems Research, Max-Pla D-37191 Katlenburg-Lindau, Germany Max-Planck-Institute for Extraterrestrial Physics, Giessenbachstraße, D-85748 Garching, Germany Max-Planck-Institute for Physics, F PNSensor GmbH, R IXEL ERMILAB c e a b d c A P F 23–26 S × components of the payload ofthe various platform future of space the missions new e Survey Spectrum-Roentgen-Gamma with an satellite Imaging Telescope Array) instrumentan X-ray will energy per of 10 keV withconsist unprecedented of spectral seven and parallel ang oriented mirrorThe modules satellite each havi born X-ray observatorytechniques SIMBOL-X to will implement be an the X-ray fir The telescope detector with instrumentation consists an of unpreced separate high- an H. Soltau P. Lechner, J. Treis,

Pixel detectors for x-ray imaging spectroscopyspace in 2009 JINST 4 P03012 rescence (XRF) systems oposed for the next generation X- ay Spectrometer) instrument on the DEPFET macropixel arrays together planetary XRF analysis of ’s ementation strategies are shown. ts are briefly discussed, and the resulting 1 : X-ray detectors and telescopes; Spectrometers; X-ray fluo EYWORDS K requirements on the detector devices together with the impl ray observatory IXO. Finally, the MIXSEuropean (Mercury Mercury Imaging exploration X-r mission BepiColombo will use with a small X-ray telescope tocrust. perform Here, a the mission spatially concepts resolved and their scientific targe band between 0.5 to 80 keV accessible. A similar concept is pr 2009 JINST 4 P03012 1 2 3 4 5 9 14 17 ] offers a con- 1 1 mm, so adapting the < e ewards depletion [ on, a variety of innovative device n the low energy X-ray band, and ctor material. Typical application is ting between pixels, which reduces ood an energy resolution as possible, focal plane instrumentation featuring size of a focal plane array to the re- ation as focal plane instrumentation esign with respect to the requirements the sensor performance by decoupling 20 keV X-ray semiconductor detectors pacitance is coupled to the pixel area. rder of several hundreds of microns are s carrying an X-ray optical system, e.g. art of the readout electronics within the , as well as unnecessary, power-costly ge targets the simultaneous detection of nimum extend possible, in combination con based devices at relatively moderate ∼ – 1 – 100 eV and ∼ When using silicon as a detector device, the principle of sid Especially in the energy range between Common X-ray optical systems provide PSF sizes in in the rang 1.3 Macropixel devices 1.1 X-ray pnCCDs 1.2 DEPMOSFET devices pixel size to thethe optics overall PSF spectral is resolution requiredoversampling due to of to the avoid PSF. Thus, recombination charge optimized noise pixel split sizesdesirable. at the This o is difficult to combineas with for the common demand pad of as detectors, g for instance, the equivalent ca energy and interaction point ofthe an field X-ray of photon X-ray astronomy, with where the space-bornWolter observatorie dete Type X-ray telescopes, are combined withvarying a kinds dedicated of X-ray detectors. 1 Introduction Imaging spectroscopy of ionizing radiation in the X-ray ran 4 The MIXS focal Plane assembly on5 BepiColombo Outlook: The International X-ray Observatory IXO 2 The eROSITA instrument 3 The Low Energy Detector for SIMBOL-X Contents 1 Introduction venient and effective way toquirements simultaneously of the adapt imaging the system pixel and avoid deterioration of based on silicon planarfor technology X-ray increasingly astronomy. find applic Siliconnear Fano-limited shows X-ray an spectroscopy is efficient possibleoperating absorbtion with conditions. sili i This can be achieveddetector by device, integrating reducing p the readout capacitancewith to the high mi performance, lowconcepts noise can be readout used systems. to convenientlyof optimize In the the detector instrument, additi d e.g. by tailoring the pixel size. 2009 JINST 4 P03012 m, µ 200 ted bulk, ∼ arallel readout using an column- through the transfer channel, which ector built using the principle of MPI semiconductor laboratory in h and low energy range. iple of sidewards depletion are cur- e window with a fill factor of 100% performance of the respective X-ray ition, sidewards depleted devices are respective missions together with the rties, e.g. extend and internal mecha- ce. For X-ray detectors, noise perfor- concepts, e.g. DEPFET based MPDs. highly optimized low noise integrated th pixel sizes smaller than d photon pileup. In the following, the ent noise charge (ENC), rather than by With sidewards depleted devices, noise adout node, which can be minimized by ector will be given. ss, and, if illuminated from the backside, wards depletion, located deep underneath the the data. In this way, wafer scale devices like the -pulses for the transfer of the charge are applied using φ – 2 – ], they are equally suitable in terms of performance for 3 , 2 ]. By asymmetric biasing of the surfaces of a sidewards deple 1 implantations required for sidewards depletion. Column-p + . Cutaway of a pnCCD device (left). The charge is transferred Pixelated, silicon based X-ray detectors based on the princ Figure 1 readout electronics which allows highdevice speed concepts readout are to briefly avoi introduced, anddesign an drivers for outline the of selection the of the respective X-ray det 1.1 X-ray pnCCDs The X-ray pnCCD was thesidewards first depletion integrating [ large area X-ray det the task of X-ray imaging spectroscopy. All devices require larger requested pixel sizes requireAlthough the these use devices of strongly new differ detector nism in of concept charge and sharing prope between pixels [ the same p EPIC pnCCD on XMM Newton (right) have been built. the sensitive area of the pixel from the capacitance of the re individual integrated JFET provides for fast processing of design. This yields extremely goodmance readout is noise usually performan quantified in terms ofa electrons fixed rms signal equival to noise ratio, asfigures the of X-ray of energy 2-4 is electrons variable. ENCfully are depleted, regularly achieved. i.e. In sensitive add overcan the be entire provided bulk with thickne an extremelyto thin, meet homogeneous the entranc requirement of good quantum efficiency in both hig rently being developed forMunich. a The variety selected device of concept space stronglyoptics. depends missions While on at the pnCCD detectors the are suitable for detectors wi falls together with thesurface potential of minimum the generated detector device. by The side potentials of the 2009 JINST 4 P03012 , 2 m µ FETs . The device py have 150 × -implantations + p internal gate ]. Using the princi- shows a cutaway of -doped region close 7 + , 2 iation tolerance of the 6 -amplifier structure consists ]; features like double sided, 5 . Figure ower circuit, where the change king the voltages in the correct transistor channel, and all bulk- 40 eV FWHM @ 5.9 keV. In the ilicon bulk [ n-individual readout anode is pos- the channel conductivity a function arge variety of versatile innovative silicon bulk. The so referred to as oved [ applying appropriate bias potentials, ues even in the low energy range can ge pulse to an n e used as radiation entrance window, source voltage levels before and after with a pixel size of 150 r. The device still delivers an effective x devices, a pixel array is placed on a ]. In addition to its use as X-ray detec- adout electronics of the CAMEX type, en developed for the next generation of 2 dulates the charge carrier density in the 8 cleargate he DEPFET source. The signal is evalu- is kind so far is the EPIC pnCCD device l pixel in a row is processed in parallel, ration to reduce power consumption. The dless from the presence of a transistor cur- , the pixels are interconnected for row-wise, 6 cm 3 × ]. It is operating continuously since 1999 without – 3 – 4 here consists of an additional N-MOSFET composed clear region -contact. The charge handling capacity of conventional DEP 2 electrons ENC can be achieved. The pnCCD concept is a proven clear . The type of DEPMOSFET structures used for X-ray spectrosco ∼ − e 5 ]. 9 ). This ’buried’ transfer channel greatly increases the rad 1 Currently, DEPFET readout is mostly done using a source foll on ESA’s XMM Newton X-ray observatory [ technology for space applications. The largest sensor of th located here are segmentedsequence and a connected three in phase a transfersible way of (see that the figure by charge cloc towards a colum rent, so the transistor can be turnedcharge off can during be signal removed integ regularly by applying a positive volta internal gate persists and keeps integrating charges regar the potential minimum is shifted under the top surface of the a circular DEPMOSFET structure. in channel conductivity is converted into a voltage step at t tor, the DEPFET concept isdetector the concepts basic [ working principle for a l ated by correlated double sampling (CDS), i.e. sampling the device. As the backside isand with completely a unstructured, thin it backside implantation, canbe extremely b good achieved. QE Together val with thereadout tailored noise figures column-parallel of re column parallel readout or frame storepnCCD architecture devices. have be 1.2 DEPMOSFET devices A DEPMOSFET (DEpleted P-channel MOSFET)of a combined p-channel detector MOSFET integrated on theple surface of of sideways an depletion, n-type the s bulka can potential be fully minimum depleted. for By generated electrons electrons can are collected be there. generatedchannel Their below in presence the the mo same way as chargeof on the the external charge gate, in making the potential minimum, which is therefore al the clear and calculating thecommon difference. bulk and In back large contact. FPA matri column-parallel As readout, shown in i.e. figure the signaland the information whole of matrix al is read out in a rolling shutter mode [ any problem. The device has an overall area of 6 to the internal gate, the occupying nearly the entire usable areareadout of an noise 4” of silicon 6 wafe electronslast ENC years, and the pnCCD an technology energy has resolution been of continuously 1 impr is in the range of 10 circular transistor geometry. The of the clear contact and a surrounding MOS structure, the 2009 JINST 4 P03012 ll with an SDD-like driftring lent circuit schematics: A MOS- row-wise readout. Row-wise con- readout electronics is used. The of a silicon drift detector (SDD) with by simply changing number, size and encer is used for device readout. Ex- becomes more and more dependent on r ICs. In addition, an integrated ampli- ift field become larger. Arbitrarily large fold CDS filtering stage, internal sample egister contacts, and the required potential ter can be contacted via the n-type Clear-. ow addressing, and column-wise connection of – 4 – , the realization of a CCD based sensor becomes in- 2 m µ

n+clear s per row is possible with these circuits.

deepp-well µ

cleargate 150 ]. In the volume of an SDD device controlled by the driftring

’internalgate’ deepn-doping × 10

FETgate

p+backcontact 150

p+drain ∼

depleted n-Sibulk

amplifier

p+source . Schematic interconnection of DEPMOSFET matrix pixels for . Cutaway of a circular DEPMOSFET pixel device and the equiva For operating a matrix, a set of VLSI integrated control- and control-ICs used are multichannel highfier/shaper voltage circuit multiplexe equipped with either aand trapezoidal hold, or serial 8- analog readouttremely and high speed integrated readout shaping of sequ up to 2 nection of Gate, Clear andthe Cleargate readout voltages nodes provides provides for for r column-parallel readout. pixel sizes can be achieved, however, bya merging the DEPFET concept type readout amplifier.structure, the By pixel surrounding size the cangeometry DEPFET be of ce adapted the to drift the electrodes requirements [ differences between the registers to create a reasonable dr creasingly difficult, as the charge transferdiffusion due slows to down large as equipotential areas it underneath the r Figure 3 Figure 2 1.3 Macropixel devices For pixel sizes larger than FET with two gates: External and Internal Gate, while the lat 2009 JINST 4 P03012 el, ], the 13 ]. Hereby, 12 ). Each telescope consists rbitrarily scalable changing 5 Gamma)-Satellite [ -by-row on-demand due to the ission is designed to meet two nology has already been proven ngular resolution [ d only in case it is actually read adout anode of a conventional SDD very fast at low noise, and as no ded by the eROSITA instrument, gure ty is combined with the scalability rge number of clusters of galaxies, fill factor of 100%. Due to the low atrix devices (MPDs) suitable for a any sideways depleted detector, the Replacing the readout anode of the D array. In this way, large integrating ion X-ray observatories, particularly te of Dark Energy and of “baryonic from an earlier prototyping run have y survey is to be extended to higher of an array of square SDD devices on spite of the large pixel area. ically more radiation hard than compa- axy clusters. , the pixels can be made arbitrarily large, se bias to create a drift field, which drives – 5 – ). The resulting device, henceforth referred to as macropix 4 . Cross-cut through a Macropixel device. By replacing the re The required detection efficiency for this task will be provi Figure 4 SDD with a DEPFET cell, the DEPFET’sof charge the storage capabili SDD arrangement (see figure while the capacitance of the readout node remains constant. with a DEPFET, chargeimaging storage detectors capability can can be built be from added an array to of an Macropixels. SD structure, a potential cascade is superimposed onthe the electrons rever towards the central readout anode. In this way has the combined benefitsnumber, of geometry DEPFET and and size of SDD. thea The drift common pixel rings. bulk size By yields integration is a largeDEPFET’s a area charge FPA, storage which capability. can be Asout, read the a out DEPFET macropixel row is matrix powere isbackside very radiation power entrance efficient, window is and homogeneous likeinput and for capacitance has of a the DEPFETs,charge the transfer is devices required, can the be DEPFETrable read devices CCD out are devices. intrins Theexperimentally. radiation These hardness properties of make DEPFET the macropixel DEPFETlarge m number tech of experiments. Singlesuccessfully macropixel tested and prototypes showed outstanding performance in 2 The eROSITA instrument Being part ofeROSITA (extended the Roentgen payload Survey with ofprimary a scientific Telescope the goals: Array) new m Firstly,X-ray the SRG energies ROSAT imaging up (Spectrum-R¨ontgen- all-sk toeROSITA 10 is a keV pathfinder with mission unprecedented forSIMBOL-X the spectral and large, IXO. and next Secondly, genenerat a by detectionprecise of a measurements sufficiently will la be feasibleacoustic oscillations” of in the the equation power density of spectrum sta of gal which consists of an array of seven imaging telescopes (see fi 2009 JINST 4 P03012 cording in diameter, ◦ m was matched to the µ d for XMM-Newton and ) readout IC is switched in 75 m. The energy of the X-ray module (right). The eROSITA µ ion. A schematic view of the × osure time the image is rapidly V. e to the high scan rate during the 75 e. the time to process the image m l signal processing in the pnCCD µ r resolution of the X-ray optics. If × mage area top left through the cut-out 50 ms minimizes the probability of itude of 580 km, a frame rate of 20 loid mirror shells and a frame store focal plane. ow by row, while the photons of the ctrons ENC. ides a field of view of 1 m µ ray telescope consisting of 54 nested mirror an 10 ms for the complete image. During oled, the camera casing, which surrounds the cal plane detector. The overall field of view is ing system for all seven cameras. 15 arcsec. The right part of the figure shows a cross ∼ s. As the frame store area is shielded against X- µ – 6 – large image area. The pnCCD allows spectroscopy of X-rays 2 384 pixels with a size of 75 3 cm × , together with a photo of an assembled laboratory module. Ac × 6 . Setup of the eROSITA instrument (left) and the pnCCD camera The fast, low-noise readout is done by fully column-paralle A relatively high time resolution is required for eROSITA du The pnCCD detector for eROSITA is based on the pnCCD develope , the projected half energy width of the modules is ◦ which is composed of 384 Figure 5 standby mode to minimize the average heat dissipation to the and the analog readout ASIC CAMEX. The pixel size of 75 the remaining time the CAMEX (CMOS Amplifier and MultiplEXer to the scientific requirements of eROSITA, the detector prov rays, the stored image cannext be image read accumulate out in withoutinformation interference the integrated r image during the area. exposure time, is The less readout th time, i. photons is precisely measured with a readout noise of 2-3 ele all-sky survey. In the plannedimages/s low for the orbit camera (LEO) isvery with necessary bright alt to sources avoid are a observed,photon loss the pile-up of short in angula exposure a time pixeltransferred of of to a the frame frame as store well. area within After the 200 50 ms exp instrument consists of a telescopeshells. array Each of telescope 7 has Wolter its Type1 individual 1 pnCCD X- module as fo with a quantum efficiency of at least 90% up to an energy of 11 ke upon the frame store pnCCDCCD designed is for shown the in proposed figure DUO miss section of an eROSITA camerain module. the proton X-rays shield. enter WhileCCD the the detector, pnCCD is copper connected i proton via shield a is heat not pipe co to the central cool of a highly nested mirrorpnCCD system camera with with 54 a paraboloid-hyperbo 3 2009 JINST 4 P03012 384 pixels of × . A readout noise 7 consists of 384 e on prototypes like the one e region, consisting of an equally cts. The imaging capabilities of tical and UV light is necessary m of thickness, and the backside eV, where a quantum efficiency µ re image area, as the fill factor of 0% for all X-ray energies down to e large bulk thickness extends the nergy width (HEW) on-axis. The o 60% and at 300 eV to 38% for the uation by means of an external filter. be determined with a higher level of as deposited directly on the photon n on the backside serving as photon w 1 keV. Whereas at 0.9 keV energy t, a photo of a prototype ceramic hybrid g conditions. The device was operated C. The intensity image measured with n-parallel way by three 128 channel VLSI ◦ ase the QE is still better than the QE of a bution between the pixels. As the CCD is tire 450 ). This region is shielded against X-rays. Readout 2 m µ – 7 – 51 m thick filter layer stack, composed of silicon oxide, × µ . Some results from the first measurements are shown in figure 6 size. The charge can be rapidly transferred to the frame stor 2 m . Schematic view of an eROSITA pnCCD (left). The imaging area µ 75 Fe source shows an insignificantly small number of pixel defe To evaluate the properties of the CCD devices, tests were don 55 × dimensioned array with different pixel size (75 Figure 6 an provides for a homogeneous,quantum ultra-thin efficiency entrance to window. the higherof Th energy 90% is x-ray expected. region upentrance The to window ultra-thin, provides 11 homogeneous for k pn-junctio a0.3 quantum efficiency keV. Moreover, close the to response 10 the is backside homogeneous is over the 100%. enti in As space a for certain high-resolutionentrance degree spectroscopy, window of a of suppression filter the of system CCD. op This w 0.17 silicon nitride and aluminum reduces the QE at energies belo a QE of 90% is stilldetector obtained, including it filter. decreases But for even 400 with eV this photons expected t decre shown in figure of 2.4 electrons was obtained for thewith later a eROSITA operatin frame rate of 20 images/s and a temperature of -80 of the image stored in the frame store region is done in a colum system providing a comparable degree of optical and UV atten 75 low-noise shaper/amplifier ICs ofequipped the with CAMEX CCD type. sensor and To readout the ASICS is righ shown. projected resolution of theincidence mirror positions system of the of X-ray 15spatial photons accuracy arcsec on by the half analyzing detector the e patterns can of charge distri sidewards depleted device, its bulk is sensitive over its en 2009 JINST 4 P03012 ice. The observed inhomogeneity . Upper left: The flat field illumina- he image quality is impressive, espe- tween 0.4 keV and 1 keV. The expected -K photons (1.5 keV) of an X-ray tube y generated in the Al-housing of the source. scale for number of counts and an inset with tterned silicon baffle yields the image shown o-backgroundratio of 7700:1 was determined n as detector material. The additional peak at rence, which is a benefit of the frame store en source and detector. Only one point defect, corner of the device. The resulting energy spec- – 8 – lines at 5.9 keV and 6.5 keV are observed,with a FWHM of 133eV @ β and Mn-K α Fe source shows the excellent spatial homogeneity of the dev 55 . Results from first prototype tests of eROSITA pnCCD devices Figure 7 tion with an 5.9 keV for single events and 143eV for all events. The peak-t referring to the Mn-Ksilicon peak escape and peak the at average 4.2 number keV1.5 appears keV of results due counts from to be Al the fluorescence useIlluminating X-rays, of the which silico sensor were with mainl 1.5 keV X-rays (Al-K) using a pa through a patterned silicon baffle placecially in the front strong of suppression the of CCD. ’out-of-time’ T event occur the device are demonstrated illuminating the device with Al in the top right corner. is due to the large detector size and the short distance betwe a non-transferring pixel, can be observedtrum in is the shown upper in the right lowerlinear part scale. of The the Mn-K figure with a logarithmic 2009 JINST 4 P03012 . 3 > line at 5.9 keV α ack holes and the mech- nt with high photon statistics umentation cannot be housed from 500 eV to 80 keV with a large on-axis effective area ( Wolter type-I geometry with 100 he telescope’s usable FoV in the s corresponds to a circle with 7 to oded mask apertures (e.g. INTE- ologies. SIMBOL-X will be the ity level will be reached which is ). Both spacecrafts are aligned by ck by a Soyuz-Fregat carrier from AL and equivalent to XMM New- gnal charge collected in one pixel) ission to adopt the formation flight cal plane detectors, LED and HED, 8 focal length of 20 m. The field of -energy protons which would reach s 20 arcsec HEW. For temperature f incomplete charge collection. mission with a projected launch date cience time plus the provision for an ems for the soft (low energy detector inimum occurrence of partial events 00 km and an apogee of 180.000 km. ding this performance, the SIMBOL- a relative position accuracy of 1 cm of the mirror shells is equipped with re ll above 10 keV where up to now only ron-hole pairs within the non-depleted ction) also proves the excellent quality s require a high sensitivity over a broad at 75 keV) is obtained by high-reflectivity covered with thermal blankets defining the 300 keV. 2 < Fe data sets yields for the Mn-K 100 cm 55 – 9 – > each. The angular resolution of the telescope is 20 arcsec 2 8 cm E of 40 - 50 in the energy range from 6 - 10 keV and around 50 at at 30 keV, and × ∆ 2 300 cm > ]. The mission’s core targets are the census and physics of bl 15 at 2 keV, 2 The focal plane instrumentation has to cover the energy band As a telescope with 20 m focal length and its focal plane instr The two SIMBOL-X spacecrafts will beKourou launched to as a a high single eccentric sta 4-daysThe orbit with mission a duration perigee is of planned 20.0 toextension be of two two years calendar of years. effective s required spectral resolution E/ 60 keV. As there is no single detector system capable of provi X focal plane is equipped with(LED)) two imaging and spectroscopy the syst hard (highLED energy energy detector range HED) is 12 energy to band. 158.8 arcmin. T cm At in a the focal focal length plane. ofwill 20 To m display have thi the a complete sensitive FOV, both area fo of 8 architecture. Spectroscopic analysis of the first in a single spacecraft structure,of SIMBOL-X two will independent be mirror the and first detector m spacecrafts (see figu anisms of cosmic particle acceleration.energy The band scientific which task is obtainedfirst mission by using the a focusing application telescopeimaging of at systems X-ray new energies using techn we collimators (e.g.GRAL BeppoSAX IBIS/ISGRI) PDS) have and been c available.improved by In three this orders way of a magnitudeton with sensitiv in respect the soft to X INTEGR ray band.nested The Ni SIMBOL-X telescope mirror is shells based on with a 1000 diameters cm from 26 cm to 65 cm. The an active control system to provide the formation flight with an energy resolution of 133 eVand FWHM 143 for eV single FWHM events on (i.e. averagerevealed si for an all excellent event peak-to-valley patterns. ratio(i.e. A of events measureme 7700:1. resulting from The incomplete m signal charge colle part of the entrance window implantation is the main source o 3 The Low Energy Detector for SIMBOL-X SIMBOL-X is a joint French-Italian-German scientificmid X-ray 2014 [ of the radiation entrance window, as recombination of elect multi-layer coating of the mirror surfaces and by an extreme view (FoV) is 12 arcminstabilization, and the telescope’s the entrance targeted and exit angularlow-energy sides resolution cut-off are at i 500 eV. To reduce thethe background focal by plane low throughpermanent the magnets telescope deflecting the protons with support energies structure 2009 JINST 4 P03012 150 eV FWHM at ≤ sec. This is achieved µ sensor region containing the nd scientific instrumentation are limit of the LED sensitivity is X project there was no known eep the dead-time caused by the for radiation related degradation d function of 1.9 mm in the focal 500 eV) requiring a thin entrance at would cause a shadow on the ont of the HED it must be fully estigate matter under the extreme ring energy-shifted characteristic acecraft the LED must operate at a tion of variable objects with quasi- atory. uction. The LED must be sensitive ≥ n one side, and to maintain a position ng ’transparent’ for energies beyond gy resolution of olution of 50 nt for hard X rays. Consequently, the ixel size of both focal plane detectors, LED, HED, AC) low the LED must be ts ( efore, the development of the DEPFET . That way the HEW is roughly an area of 2 n autonomously working active position control m µ 625 – 10 – C. That is only feasible with a detector process yielding × ◦ . 3 1 cm ≤ . Artist’s view of the SIMBOL-X spacecrafts. Mirror system a 3 pixels, which is sufficient for reliable position reconstr × for energies transmitted by the telescope’s thermal blanke 5.9 keV, corresponding to ananticoincidence ENC connection of of 10.5 the electrons threeread r.m.s. detector out systems extremely To ( fast k with aperiodic frame rate oscillations of in 8 kHz. the The msec-range observa requires a time res 3 window with high quantum efficiencygiven for by soft the X absorption rays.20 properties keV. The Among of upper other silicon science which targets,conditions SIMBOL-X is of intends getti to accretion inv onemission compact lines. massive The objects analysis by of the measu spectra requires an ener an extremely low leakageduring current level the with mission enough lifetime.detector headroom fulfilling At all the requirements beginningbased simultaneously. MPDs of has Ther been the initiated SIMBOL- at the MPI semiconductor labor HEW. At a focal length of 20 m this corresponds to a point sprea plane. To avoid undesired oversampling by tooresolution small well pixels below o the limitationLED of and the HED, telescope, has the been p chosen to be 625 Figure 8 located on two individual spacecrafts beingsystem positioned to an by accuracy a of by a window mode whichobject does with not higher read repetition thesensitive full rate. over frame the but entire As only area theLED the and LED must homogeneously is transpare be placed aHED in monolithic in fr the device FOV. Due without to support therelatively limited warm structure temperature resources of th of nominal the 45 detector sp 2009 JINST 4 P03012 st and a 2 the imaging 8 cm quadrants with × m width. For the will be the largest µ s, corresponding to 2 µ 128 with a pixel size × -areas of the pixel array 8 cm system readout, two pixel aced behind the LED and igh Energy Detector (HED) row by row. The operations × rame time is given by the time t and control electronics. This 8 pixels providing an excellent sumably 4 g the full frame time by a factor 1 cm to avoid imaging errors. A es a complex on-chip wiring and ling the usable area of a 6 inch y shield surrounding the telescope × on to all pixels of a quadrant. The id called CALISTE and containing m length and 47 C. As SIMBOL-X is aiming at the ≤ ndard design for X-ray spectroscopy o the small atomic number of silicon ◦ an active anticoincidence shield. The lastic scintillators (BC 400) covering µ shield plates covering the scintillators, ound is also reduced by graded shield 5 ith a sensitive area of 8 nd must be at an extremely low level of iven by the requirement to integrate the ng of six concentric rings with rounded cles or photons except the telescope FoV. e regions on the sensor. The largest part of . 10 keV. In an energy band from 5 keV to 80 keV 9 – 11 – > m. The sensor format is 128 µ 16 pixels. The CdTe crystal with a thickness of 1 - 2 mm ]. Each pixel has its own electronics chain. The full focal × 14 8 array of CALISTE modules. The readiness of this technology × . The HED architecture follows a modular concept. The smalle 2 m keV). To achieve this performance it is necessary to enclose · µ sec 625 crystal with 16 · . For redundancy reasons the pixel array is divided into four 2 2 2 × m µ cts/(cm 625 4 ]. The wafer thickness is 450 − × 10 10 a frame rate of 4 kHzrows for per a quadrant device with will 64 be pixel readof rows. simultaneously, two To thus but speed reducin also up doubling the number of readoutWindow channels. Mode: The MPD conceptdown to allows single to pixels. address arbitrary However, this sub full flexibility requir for all pixels within one rowrequired are to process performed the in signal parallel. of one The pixel, f which will be pre Full Frame Mode: The four quadrants are read simultaneously 64 pixels, each having individual power supplies and readou The MPD for the SIMBOL-X LED with its sensitive area of 8 Seen from the telescope, the High Energy Detector (HED) is pl × • • × of 625 division is purely electrical and notthe related pixel to area insensitiv is filledcorners by to the avoid drift high-field diode regions. structureDEPFET amplifier The consisti in outmost the ring pixel center is isapplications comm implemented with in the circular sta outline and the gate dimensions monolithic sensor for Xwafer [ ray imaging spectroscopy, almost fil 64 SIMBOL-X LED there are two baseline readout modes: detects only hard X rays transmitted throughthe the LED LED, efficiency as drops due t steeply at energies plane detector is built of an 8 readout ASICs of the IDeF-X type [ is bump bonded on the 3D integrated readout electronics cubo has been demonstrated by a smaller prototype module with 8 the respective efficiencies of LED andis HED a sum pixelated up Schottky-type to cadmium-telluride 100 detector %. w The H subunit has a 1 cm energy resolution of 0.78 keV FWHM at 59.5 keV and 37 pixel size of 625 sketch of the payload design is shown in figure discovery and study of faint sources,2 the - detector 3 backgrou detectors by the combination of aactive graded anticoincidence absorber detector shield and (AC) is aall compact possible ’box’ directions of for p In incident addition high-energetic to parti the activeabsorbers. anticoincidence The passive shield shield the has three backgr a components: 2 graded m long collimator on topon of the the mirror focal spacecraft. plane assembly The andLED focal a plane and sk architecture HED is detection dr planes within a vertical distance of 2009 JINST 4 P03012 A at 17 150 eV m thick − µ < s) the en- 10 µ but also re- photons per 6 × 5 10 100 > ≫ c window mode for the located directly behind the ector entrance window and of indow mode only a part of the the mission. This performance of the sensor area. The number D quantum efficiency at the low on the window has the full width f the two spacecrafts the presence ne proton has been measured in a tical burden of towards north and south directions. ration conditions, an energy resolu- IMBOL-X specifications ( aluminum layer of 100 nm thickness of 10 MeV equivalent protons during f leakage current of 2.4 tical load by a factor 10 nt. The typical value obtained by the uments are mounted on an AL baseplate, 2 rrent caused by radiation damage in the / cm s of an anticoincidence detector using a plastic . The detector stack is surrounded by active and 8 10 × – 12 – ) and the long integration time ( 2 m µ at room temperature and full depletion of a 450 625 2 × 1 nA/cm < . Sketch of the SIMBOL-X instrumentation payload. The LED is control logic. Therefore,observation for of the bright point SIMBOL-X sources LEDpixel has array only been is conceived. one read starting In basi from w theThe equatorial vertical center window line position is centeredof on rows the in equator the line window isof selectable. the In sensor the area. east/west directi Due to the large pixel size (625 aperture, while the HEDwhich is is located connected to behind the the spacecraft LED. radiators Both by heatpipes instr scintillators being read out with photomultipliers. passive graded absorber shields. The active shield consist a mission time of fivededicated years irradiation has campaign been to estimated. be The an effect additional of amount o o FWHM at 5.9 keV) throughout theenergy full end mission of life the time. SIMBOL-Xabsorbing The energy layers LE band in is front a of function the detector. of the As the det LED has an op Figure 9 device. Scaling this extremely low value totion the of SIMBOL-X 130 ope eV (FWHM atprovides 5.9 a keV) large is enough buffer expected for at theorbit. the additional beginning leakage By of cu simulation an integrated fluence of 3 ergy resolution will be clearlyDEPFET limited technology by is the leakage curre room temperature allowing for the LED operation within the S pixel and frame imposed by theof autonomous an alignment optical system filter o isdirectly mandatory. on It the is sensor’s foreseen entrance to window deposit attenuating an the op 2009 JINST 4 P03012 . 2 2 ard C) and 3.2 cm le events ◦ × the results s are integrated onto 700 Hz. The spectra ≈ e the pnCCD camera of e sensor has been tested in representative prototype of a m. From 20 keV on the LED uadrant prototype has the same . With its sensitive area of more µ een measured to be 100 pA/cm 2 SIMBOL-X LED MPD. The device t lower temperature (-90 ncy will still be above 80 % in the m LED quantum efficiency is limited ompliance with the requirements is 450 µ absorbed by the hard energy detector. 500 C at a framerate of ◦ nd ratio of 3000:1. The readout noise was 3.1 × e device are visible at the lower right (CAMEX Fe source. Due to limitations in the readout each. The overall sensitive area is 3.2 ffle (top right) demonstrates the homogeneity and 2 55 m µ – 13 – 500 × Fe source display an energyresolution of 127eV FWHM for sing 55 m thick device. The prototype has been mounted on a ceramic bo µ 700 Hz) compared to the SIMBOL-X conditions. Nevertheless, Switcher IC) edges of the sensor respectively. Sensor and IC ∼ × 64 pixels but a smaller pixel size of 500 64 pixels with an area of 500 it is the largest monolithic X ray imaging spectrometer sinc × × 2 . Photo (top left) and results from tests of a prototype of the To demonstrate the readiness of the DEPFET-MPD technology a IC) and lower left (2 The control- and readout electronics required to operate th than 10 cm Figure 10 a ceramic thick-film hybrid. The device was operated at -90 will be almost transparent and all more energtic photons are SIMBOL-X LED quadrant has been processedformat and of qualified. 64 The q and wire bonded to thevacuum CAMEX conditions and in SWITCHER spectroscopy front-end mode chips. using Th an system and in the thermal setup the sensor has been operated a XMM Newton. The room temperatureat leakage full current level depletion has of b the 450 are scalable with temperature and readout time so that full c obtained by illumination with an ducing the low energy response of the LED. The quantum efficie and 135eV for all events,electrons and ENC. Illumination an through excellent a peak-to-backgrou patternedimaging silicon capability ba of the device. energy interval from 0.7 toby 13 the keV. Towards poor high absorption energies the of silicon and the device thickness of consists of 64 at lower frame rate ( 2009 JINST 4 P03012 ]. 16 880eV ∼ absence of a shielding . ace, Space ENvironment, ) will be sent to its 6 years’ 10 ions, with different instrument meter) instrument, which will et, its form, interior, structure ge part of its instrumentation is d 135 eV for all events including ogeneous. The overall electronic e origin and evolution of a planet panese Space Agency JAXA [ e of a patterned silicon mask. An e Italian engineer and mathemati- entific objectives. MIXS will mea- r (MPO), will be deployed in two ission lifetime is one year, with a pendent probes, the Mercury Mag- recedented spectral and spatial res- figure ithin the system Mercury-, the rcury, especially the concentration of sity X-ray Spectrometer (SIXS). For ace. One of the instruments on board ate the planet’s surface and generate on. While the MMO will study Mer- board MESSENGER, use collimated imited energy resolution of on mission to Mercury to be operated ate the traces of Mercury’s vestigial nar X-rays, MIXS depends on the ref- the compositions of the major terrains, m and Iron within the crust are of inter- ely together with all other MPO instru- results strongly relies on the availability d ratio of 3.000 : 1. The imaging capa- ures and detect iron globally and locally. Fe flat field illumination shows an energy 55 ve measurement of which can be used to de- – 14 – ]. The technique of planetary XRF makes use of the fact that in 17 Planetary XRF instruments have been used on a variety of miss In 2013, the BepiColombo Mercury Composite Spacecraft (MCS Each spacecraft carries an individual set of instrumentati achieved. The sensor has been found to be defect-free and hom noise is 3.1 electrons ENC. The energy spectrum of an reconstructed multiple pixel hits andbility a of peak-to-backgroun the system hasimage been of demonstrated a by prototype the module shadow and selected imag results are shown in resolution of 127 eV FWHM at 5.9 keV for single pixel events an atmosphere the coronar X-rays fromcharacteristic the X-ray fluorescence sun radiation, directly a illumin quantitati termine the elemental abundance on the surface.the In important case tracer of elements Me Magnesium, Silicon, Aluminu est. As the quantitative interpretation ofof the reliable measurement data about the spectrumerence and data intensity about of the the coro inputthe interpretation flux of provided the by gathered Solar data, Inten ments. MIXS will The work data clos will be combinedsure to the achieve MIXS’ average composition primary sci of Mercury’s crust,determine determine the composition inside craters and crater struct concepts. Most instruments, e.g.gas the proportional X-ray counters spectrometer as on X-ray detectors. Due to their l Being a successor toGEochemistry and NASA’s simpler Ranging) probe, MESSENGER BepiColomboin (MErcury will close study Surf th proximity toand geology, the its parent surface star,atmosphere and composition study its and . Mercury craters, as investig a plan journey to Mercury. Upon arrival atnetospheric Mercury Orbiter in 2019, (MMO) two and inde theindependent Mercury polar Planetary orbits Orbite aroundpossible the extension planet. for another year. The envisaged m 4 The MIXS focal Plane assemblyESA’s on 5th BepiColombo cornerstone mission BepiColombocian is Guiseppe named “Bepi” after Colombo. th Itby is the is European a Space planetary Agency explorati ESA in collaboration with the Ja cury’s magnetosphere and ,MPO and will the mainly focus interactions on w made observing to do the multi-wavelength crust scans of of thethe Mercury. entire MPO A Mercury surf is lar theperform so-called a MIXS planetary (Mercury XRF analysis Imagingolution of X-ray [ Mercury’s Spectro crust with unp 2009 JINST 4 P03012 es will be iridium MEB (electronics) , one equipped with a high FPAs @ 10 keV. The overall field of is foreseen, which is optimized planetary remote sensing, as it s sufficiently high, for instance 2 2 ffering spatial resolutions better 9 keV) and Si (1.74 keV) can not surement of major rock forming ]. For the first channel, MIXS-C, a asurements will be on the scale of al elements provided by low mass t electronics. MIXS-C, the collimator rgy range. The sensitivity to Iron is ns on Mercury. The second channel, 18 -ray attenuation of three independent with high solar activity, and the Iron-L access to individual landforms such as 64 mm tion. The excellent spatial resolution is e will have an aperture of 21 cm, a focal B). ng the fluorescence radiation of the surface, × , with the same focal plane array, are located he two instrument channels are controlled by a ]. ootprint in case of low solar X-ray intensity. MIXS- 19 @ 1 keV, and 15 cm – 15 – Heatpipescoming frombelow 2 FOV at an aperture of 64 ◦ MIXS-C MIXS-T for an angular resolution of 1.7 arcmin HEW. Both optic modul ◦ . Sketch of the MIXS instrument on BepiColombo. Two channels MIXS differs radically from previous X-ray instruments for Optics aperture coated to increase their effective area. resolution X-ray telescope andon one a with common a optical collimatorinstrument, bench optics serves for and large controlled scale observations with ofT, a a large which f common requires readou higher solar X-ray fluxes, is used for imagi capable of resolving features incommon the electronics, sub-kilometer located in range. the MIXS T electronics Box (ME FWHM at 5.9 keV, shell emission linesbe of separated Mg with (1.25 keV), such Al an (1.4 instrument instrument, channels and equipped the with differential filters X limited, as is the used Iron-K line in can be thatlines observed ene around only during 700 eV times can not be directly observed [ to provide a high throughputelements of can be X-rays achieved and for ensure70 all that to solar 270 the conditions. km, mea MIXS-C sufficientMIXS-T, for me uses the separation an of imaging the X-raythan major telescope 10 terrai km of during the periods Wolterduring when type, solar the o flare X-ray events. flux from Highcraters and the spatial their surface resolution internal i provides structures. The MIXS-T telescop length of 1 m and an effective area of 120 cm Figure 11 achieved by two complementary channels equipped with optic will provide for unprecedented spatial and spectral resolu and high efficiency Microchannel Plate (MCP)slumped X-ray collimator optics with [ a 10 view will be 1 2009 JINST 4 P03012 3 × ∼ ease DetectorDetector CoolingCooling Block(Mb)Block(Mb) is again 2 m µ . The setup of ThermalStrapThermalStrap 12 300 1 ms are mainly the × ≤ 0 MPDs as sensitive elements sensor is divided into two inde- e overall proton dose of sides. This additional degree of energy limit of 0.5 keV permits t on the electronic noise are, with ue to radiation damage during the s will measure X-rays in the energy been divided into two independent d to cover both the iron-K line (6.4 ftrings per pixel, the outermost ring est and provides access to lines not e L-line, which greatly increases the han 1 kHz, as the fast readout helps MountingFrameMountingFrame namics of the incident X-ray intensity. ssion lines. The sensitive area of 1.9 de vacuum gap between sensor and hybrid, wo, as shown in figure DetectorDetector Adapter Adapter time resolution of d readout electronics (left). The connection to d have no direct thermal contact. The thermal HybridHybrid all. Thermal simulations predict a temperature of the sensor, to which the cold finger is attached C), provides for good thermal decoupling. The ◦ +30 ∼ – 16 – CeramicHybrid . EastSwitchers 11 ]. For the sake of simplicity, both of MIXS channels are ENC respectively, very moderate. This performance allows 20 Southern hemisphere − NorthCAMEX has a big impact on the operating scenario. The expected incr Norhern hemisphere SouthCAMEX 2 WestSwitchers C. . Hybrid schematic and mounting concept for the MIXS FPA. The ◦ is made to match the mirror system FOV, and the pixel size of 30 10 MeV Protons / cm 2 10 The spectral resolving power is achieved by the use of DEPFET The biggest challenge for MIXS is the radiation hardness. Th Readout Flexlead 10 the electronics is done via a flex circuit. Sensor ICvia and an Hybri aluminum nitride sensor adapter (right). The 0.5 mm wi pendent hemispheres, each of which having its own control an connection to the cold finger is done directly to the backside the latter being at spacecraft ambient temperature ( below -43 heat intake via the bond wires is not negligible, but still sm in the focal plane assembly (FPA) [ Figure 12 equipped with identical FPAs with one MPDband each. of The detector 0.5 - 7.5200 eV keV. The FWHM energy @ resolution 1 limitthe keV and separation and the of 10 limi e X-ray lineaccessible to emission previous from instruments, elements including of the1.9 Fe-L cm inter emi the MIXS instrument is shown in figure × driven by the size ofagain the being PSF. This common pixel to design allkeV) pixels. requires and 3 The the dri energy iron-L range line isthe (0.71 selecte detection keV). of As iron mentioned even above, insensitivity a on case iron. low of a The quiet scientific sun drivers for state the using required th spacecraft movement over ground and partially also dueNevertheless, to the dy system foresees ato much suppress higher the framerate influence t mission of lifetime. the increase This of ishemispheres also leakage similar the to current the reason, d SIMBOL-X why LEDparallelization and the is increases sensor read the has out readout to speed two by a factor of t 2009 JINST 4 P03012 ovide imaging C are required on ◦ size located on a six 2 l length which will be m µ nstellation-X mission. High ly been studies as a merged n tested yet. But as the design 100 nic TES, and an X-ray grating ill cover the entire usable region y additional filters in the optics cooling power is made available × resolution, can only be partially test system for the predictions of detectors as well, and as the pixel l area, the tests of the SIMBOL-X rformance and yield figures. served yield and their performance of sensor and front end electronics, on board of MPO are quite limited, ied. In addition, various annealing es an instrument very similar to the ptical and infrared photons passing solution instrument to study variable gate element and planet formation as ometer (WFI) combined with an high imulations show, that this temperature eable focal plane. The current payload e large X-ray mirror and an extensible r narrow FOV instruments respectively. ersive X-ray spectrometer with smaller e-characterization of interesting sources he starting configuration for IXO, which xy evolution and study the influ- tional X-Ray Observatory IXO, is going nce objectives. IXO will study growth and elements with modest resource demands is n together with a mirror system with large pixels of 100 6 10 – 17 – × 1 ∼ ). Operating temperatures of around -45 , the sensor will be surrounded by the control- and readout 12 13 ] capable of covering this entire field of view. The WFI will pr 21 By the time of writing, no MIXS flight grade detectors have bee The FOV of IXO will cover 18 to 20 arcmin, depending on the foca inch wafer with a common homogeneousof backside. the This wafer. device w As shown in figure of leakage current due to NIEL, which also affects the energy compensated via the readout speed.the As design the of cooling the resources FPA hasfor to cooling be the made detector in (see a figure way, that all available capabilities with near Fano-limited performance and do ato pr be studied further with the highIt resolution will non-imaging consist o of a DEPFET MPD with the sensor to keep the requiredcan energy only resolution. be Thermal achieved s inrequiring case an an extensive advanced thermal mechanical decoupling scenarios mounting are concept, being is considered. appl through Furthermore, the impact optics from aperture o baffle has and to an aluminization be on kept the sensor low, entrance which window. is doneis b equivalent to the SIMBOL-Xprototypes prototypes can except be for regarded the toarea pixe be of the representative prototypes for is the morehas MIXS been than found two to times be larger very and good, the it ob is justified to expect good5 pe Outlook: The International X-ray ObservatoryThe IXO large, next-generation X-ray observatory, theto Interna be a jointsuccessor enterprise project of of ESA, the JAXA ESA/JAXAsensitivity and XEUS instrumentation NASA mission with which and high is NASA’s spectral Co effective current resolutio area are essential for achieving itsevolution primary of scie supermassive black holes,general and relativity. will It will use study themence galaxy as of formation dark a and matter gala and darkwell energy. as It particle will acceleration mechanisms be in used the to universe. investi T is currently under study, foresees a single platform with on optical bench with a 20-25m focal length,instrumentation with foresees an interchang an X-ray wideenergy field detector imaging (HED), spectr a high spectralFOV resolution (Narrow-Field non-disp Imager NFI),spectrometer. which In is addition, allocation likely for to further payload be a cryoge being studied, such as an X-ray polarimeter and a high time re X-ray sources with great timing accuracy. finally implemented. The current proposalformer XEUS for WFI the [ WFI forese

2009 JINST 4 P03012 lex fl ge transport

, gateSWITCHER ROI pixel DEPFET MPD integrated 6 fanout s random pixel access capability. 10 nstrumentation stack, is currently ceramicsubstrate × ead them with increased repetition n ROI based observation, depending ltiple bright objects distributed over 1 s, which yields a framerate of 1 kHz, produced at the MPI semiconductor ow to allocate and address arbitrarily res, which are, for improved readout y with respect to high speed readout µ ∼ re usable area. The WFI will be surrounded by ill be read out independently. Random access to ects will have to be observed simultaneously, will . . – 18 – readoutASICs readoutASICs (1984) 608 (2006) 1595 3 ]. A225 22 s in case a 16 row wide ROI is selected. The accomodation of the µ

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(116mm) (105mm) lex fl 64x64pixel Nucl. Instrum. Meth. 100x100µm² 20arcmin@L=20m 18arcmin@L=20m , . Sketch of the proposed IXO WFI. It will consist of a IEEE Nucl. Sci. Symp. Conf. Rec. scheme [2] P. Lechner et al. [1] E. Gatti and P. Rehak, Figure 13 but the time resolution can be much betteron than the 1 size ms in of case the of ROI, a e.g. 32 Hard X-ray detector behind the WFI, forming a SIMBOL-X like i References being investigated. Prototype sensorslaboratory for in the Munich WFI are recently aboutand the to windowing undergo capabilities testing [ especiall monolithically on a six inch wafer and nearly filling its enti its control- and readout electronics. Its two hemispheres w on-the-fly selectable ROIs, e.g. in casebe multiple one bright of obj the instruments key features. electronics. Again, the sensorspeed, is read divided out into in parallel. two Aslarge hemisphe a regions new of feature, interest the WFI (ROIs)rate will on and all the unchanged sensor spectral on performance,the the e.g. FOV. This fly, to readout and mode observe r makes mu excessiveThe use of envisaged row the processing DEPFET’ time for the WFI is around 2 2009 JINST 4 P03012 , , . , , . . D camera Planetary and , . ield Imager r X-ray astronomy Colombo ution to our ray active pixel sensor , ntal Results (1987) 365 , (2008) 702110 , st observation of , (2007) 66860H A 253 , 7021 (2006) 62660F . 6686 , 6266 . Proc. SPIE , , Article in press. (1993) 404 Proc. SPIE , Nucl. Instrum. Meth. Proc. SPIE A 324 , , (2007) 668617 – 19 – X-Ray Evolving Universe Spectroscopy-The XEUS . 6686 ...... BepiColombo, ESA’s Mercury Cornerstone Mission . (2006) 207 (2004) 10 Planetary and Space Science Nucl. Instrum. Meth. Proc. SPIE (2008) 778 (2005) 1083 , , , New Detector Concepts (2001) L18 55 52 5165 A 568 The X-ray Spectrometer on the MESSENGER Spacecraft Fast large-area spectroscopic and imaging CCD detectors fo (2007) 303 Spectrum-RG/eROSITA/Lobster astrophysical mission 365 The Mercury Imaging X-ray Spectrometer’s (MIXS’s) contrib SIMBOL-X: Mission overview Analysis of the charge collection process in pnCCDs (2001) 1409. The European Photon Imaging Camera on XMM-Newton: the pn-CC (2006) 627610 (2008) 70210Z (2006) 62660O (2008) 70210Y (2006) 62760D XEUS wide field imager: first experimental results with the x- Caliste 64, an Innovative CdTe Hard X-ray Micro-Camera eROSITA The Low Energy Detector of SIMBOL-X Development of DEPFET Macropixel Detectors X-ray focusing using square-pore microchannel plates: Fir 131 49 New DEPFET structures: Concepts, Simulations and Experime DEPMOSFET Active Pixel Sensor Prototypes for the XEUS Wide F DEPFET based X-ray Detectors for the MIXS Focal Plane on Bepi Advancements in DEPMOSFET device developments for XEUS , ESA SP-1273 (2003). 6276 7021 6266 7021 6276 Proc. SPIE , with eROSITA and for exploration of the nanocosmos understanding of Mercury Instruments Proc. SPIE Proc. SPIE Space Sci. Rev. Proc. SPIE IEEE Trans. Nucl. Sci. Proc. SPIE Nucl. Instrum. Meth. IEEE Trans. Nucl. Sci. Proc. SPIE Astron. Astrophys. Space Science cruciform image structure DEPFET [3] N. Kimmel et al., [6] J. Kemmer and G. Lutz, [7] L. et Str¨uder al., [8] J. Treis et al., [9] G. Lutz et al., [4] L. et. Str¨uder al., [5] N. Meidinger et al., [22] J. Treis et al. [19] C.E. Schlemm et al., [20] J. Treis et al., [21] The XEUS Instrument Working Group, [12] P. Predehl et al., [13] M. Pavlinski et al., [14] A. Meuris et al., [15] P. Ferrando et al., [16] A. Anselmi and G.E.N. Scoon, [10] C. Zhang et al., [11] P. Lechner et al. [18] G. Fraser et al., [17] J. Carpenter et al.