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Excimer Laser Ablation – a Novel Patterning Solution for Advanced Packaging

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Excimer Laser Ablation – a Novel Patterning Solution for Advanced Packaging EXCIMER LASER ABLATION – A NOVEL PATTERNING SOLUTION FOR ADVANCED PACKAGING Ralph Zoberbier SUSS MicroTec Lithography GmbH | Germany Habib Hichri SUSS MicroTec Photonic Systems Inc | USA Published in the SUSS report V1 06/2015 E-mail: [email protected] www.SUSS.com EXCIMER LASER ABLATION – A NOVEL PATTERNING SOLUTION FOR ADVANCED PACKAGING Ralph Zoberbier SUSS MicroTec Lithography GmbH, Schleissheimer Str. 90, 85748 Garching, Germany Habib Hichri SUSS MicroTec Photonic Systems Inc. 220 Klug Circle, Corona, CA 92880-5409, USA INTRODUCTION EXCIMER LASER ABLATION Photolithography has long been the key TECHNOLOGY patterning technology for structuring organic Excimer laser ablation is a dry patterning pro- materials used in advanced packaging appli- cess, breaking a material’s molecular structure cations like fl ip-chip wafer bumping, electro- and directly etching the desired circuit pattern to plated gold, solder bumps, copper pillar tech- clearly defi ned depths on the substrate, with mi- nologies and redistribution layers. Nowadays, nimal heat affected zone (HAZ). This patterning proximity exposure technologies (mask aligner) technology uses the advantage of the excimer or projection lithography (step and repeat or laser source to emit high energy pulses at projection scanning) are the typical choices short wavelengths. The short wavelength out- to create the features. The continuous trend put on the one hand enables the imaging of of the miniaturization, increasing performance small features but also supports absorption and mobility of electronic devices drive the in many different materials. Depending on the requirements of the chip itself but also its material each laser pulse removes a certain package type. More and more, the photolitho- amount of material. The ablation rates are in graphy process is becoming the limiting factor the 100nm range for polymers and dielectrics to develop cost effective and innovative packa- that are typically used as passivation layers in ge designs that meet the market requirements. the semiconductor backend applications. The technology allows for the fi ne tuning of sidewall In response to this industry challenge excimer angles of the created features by adjustments laser ablation has been adapted to the semi- of the laser fl uence. conductor packaging industry and is now avai- lable as a disruptive patterning technology. To address the latest requirements of the advan- This complementary technology offers the ced packaging industry, such as the creation promise of further reductions in manufacturing of feature sizes in the range of 2-5μm com- costs as well as enhancements in chip or bined with an overlay accuracy of less than package performance. This paper provides a 1-2μm, requires a careful selection of the comprehensive overview of the excimer laser right equipment platform. Thus, excimer laser ablation technology, and its level of maturity. It ablation is available on a step and repeat discusses the recent technology developments platform which is a very common platform for and corresponding debris cleaning solutions high-end lithography applications. from a technical perspective. 2 Figure 1 Overview of ablation rates in BCB (Cyclotene 3000) based on different fl uence level [1] The combination of the excimer laser source and reduction projection optics enables the capability of high resolution imaging with suf- Figure 2 Schematic illustrations of excimer laser ablation of thin fi lms from a polymer substrate fi cient fl uence output to pattern a large area at in a dry one-step etch process once to achieve the highest possible through- put. A reticle defi nes the pattern to be ablated, providing a high degree of pattern fi delity and for a photoresist nor the post-develop and etch placement accuracy. In addition the demagni- processes that accompany a photolithography fi cation of the optical systems generates a high process. excimer laser ablation is suitable for energy level on the substrate side while the ablating a wide variety of polymeric materials, illumination of the reticle itself is still in an ac- thin metals (<600nm), epoxies, EMC’s, nitrides ceptable range to avoid mask damage. Typical and other materials. reticles on an excimer ablation stepper are based on chrome or aluminum on quartz or Excimer laser ablation technology enables the dielectric masks. industry to use new materials that offer better mechanical properties required by the advan- The illumination setup of the optics is typically ced semiconductor packaging industry (low customized based on the application require- CTE and residual stress, and thermally stable). ments to ensure a match of fl uence require- ments based on the material to be ablated, A major concern for the adoption of excimer coupled with required ablation fi eld size that is laser ablation is effective and cost effi cient defi ned by die or package sizes. debris cleaning. The laser ablation process itself creates some debris that needs to be As mentioned above, the technology is similar removed. Latest developments show the to traditional UV steppers, however, instead of availability of effi cient post ablation cleaning exposing a photo sensitive material, the mate- solutions. rial is etched directly without the need neither 3 ADVANCED PACKAGING APPLICATIONS AND TECHNOLOGY TRENDS Today a wide variety of advanced packaging thus, are ever more sensitive to any thermo- technologies exists to meet the requirements mechanical stress. Different non-photo sensi- of the semiconductor industry. The leading tive materials with a better match are available advanced packages, including chip-on-chip, for quite some time but could not be patterned wafer-level packages, chip-on-chip stacking, at the required resolution, required profi le and embedded IC, all have a need to structure at an acceptable cost level. thin substrates, redistribution layers and other package components like high resolution vias. Finally cost pressure of the total package is The consumers constant push for higher func- typically addressed in the semiconductor tionality on smaller and thinner end devices, industry by a transfer of technologies to a like smart phones or tablets drives the need for larger, next generation substrate format. While next generation packages with fi ner features at the wafer based packages are limited to the increasing reliability of the package. In addition, largest wafer scale of 300mm, fan out wafer cost considerations become more and more level package technologies offer the scalability important to survive in the competitive land- to larger substrate sizes in a panel format. scape for all parties within the supply chain, To sum it up, a very attractive technology from chip manufacturer, assembly and test to alternative to photolithography would be a the consumer end device manufacturer. There- technique that can directly structure non-photo fore, the industry desperately strives for innova- PIs, PBOs and epoxies at high resolution tive approaches to lower manufacturing costs combined with panel compatibility. coupled with enabling technologies that meet the challenging technical requirements. Excimer laser ablation technology now provi- des that alternative while also delivering several Specifi c needs in the patterning area are to other advantages. overcome current resolution limitations that are caused by the today‘s available photopoly- mers. They are limited in the supported resolu- EXCIMER LASER ABLATION IN ADVANCED tion and via wall angle, even though the today‘s PACKAGING APPLICATIONS imaging photolithography technologies would The most promising advanced packaging theoretically support even higher performance. application that could benefi t from the inherent In addition some polymers or dielectrics such technology difference using laser ablation is via as polyimides (PIs), PBOs and epoxies that drilling in polymers to create openings on top of are used as passivation layers remain in the metal pads for electrical interconnection. While package and will fi nally also impact the package the polymer is patterned by the laser energy, reliability. There is a signifi cant coeffi cient of the relatively thick metal pad actually acts as thermal expansion (CTE) mismatch between a natural ablation stop layer. Additional key these materials and the chips. Furthermore, advantages are the ability to pattern a large higher density packages have bigger thermal area fi lled with thousands of vias enabled by loads, exacerbating this problem. As a result, the mask based patterning technology and the this CTE mismatch can cause issues such as provided high laser energy level. 5μm vias or stress damage to low- dielectrics and wiring smaller can be created in both traditional layers, which are also getting thinner and, photopolymers and new materials. 4 Figure 3 SEM image of a 5μm via in BCB at 650mJ/cm2, 30 pulses [1] A complete wafer level package based on Figure 5 Cross section of two layer PBO patterning by SUSS [2] excimer laser ablation was completed and ELP300 with plated copper RDL and solder bump tested by a cooperation of SUSS MicroTec and FlipChip International. One major advantage of POST-ABLATION CLEANING the excimer laser is the capability of building The ablation process of these photo and non- stacked redistributed layers of 2 and more at photo sensitive materials using the excimer lower cost than photolithography tools. laser usually generates debris that will need to be removed during and/or after ablation. Excimer laser tools are always equipped with a debris cell that
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