Optris Product Brochure

Total Page:16

File Type:pdf, Size:1020Kb

Optris Product Brochure Infrared thermometers Infrared video thermometers Ratio pyrometer Infrared cameras Accessories / software / apps PRODUCT OVERVIEW Non-contact temperature measurement Made in Germany when temperature matters For further information on non-contact The adequate measurement device temperature measurement see our brochure: i IR Basic Principles www.optris.global/downloads Which process velocity? Object size and measurement distance Spot measurement or thermal image? To achieve accurate temperature measurement it is IR thermometers use the radiation signal emitted by the First of all, it is important to define the measurement task and important to know how fast measuring objects are entire measurement spot. The size of the measurement to decide on one of these two measures: moving in front of the sensor or how fast they change spot (S) largely depends on the device, the optics temperature. selected and the distance between the sensor and measurement object plane (D): Which measure? Which object surface? Our fastest infrared thermometer captures changes within 1 ms. A point measuring infrared ther- The condition of the object surface ■ 8 – 14 μm mometer should be used if you defines the measurement device for non-metal surfaces know where the critical point or the and wavelength to be used for the (Type of device: LT) area to be measured is positioned application. The emissivity Ɛ ■ 0.5; 1.0; 1.6; 2.3 μm within your application. The size of occupies a central position. The mainly for liquid metals and metal the measuring object is important choice of the right device is of great surfaces (Type of device: to define which lens is necessary. It importance especially for metals, 05M; 08M; 1M; 2M; 3M; 4M) is therefore possible to monitor the where the emissivity depends on ■ 3.43 µm accurate temperature and optimize the temperature and wave length. for thin plastic films like PE, PP and PS Measurement spot diameter (S) depending on the measurement distance (D) with an IR thermometer processes – if necessary – before (Type of device: P3) We are able to offer appropriate quality problems arise. ■ 3.9 ; 4.24; 4.64 μm measurement devices for most for special applications For a precise temperature measurement, the measure- applications throughout a wide (Type of device: MT; F2; F6) Display of fast temperature changes over a period of time. ment spot needs to be smaller than, or the same size as product range. the object to be measured. 5.0 μm The following explanation helps ■ for glass surfaces (Type of device: G5) If the measurement spot is larger than the object, to find the rightwavelength a temperature is calculated from the averaged heat 7.9 μm for your application: ■ radiation signal from the object and its environment. In for plastic foils and glass surfaces a colder environment, it means that correspondingly, the (Type of device: P7 / G7) Integration of sensors? temperature measurement value determined is too low. 8 LT Short wavelengths reduce P7 Our temperature sensors can be installed as part of the i Pyrometer configurator: 7 measurement errors on P3 process with or . G5 mounting brackets flanges 6 surfaces with low, unknown www.optris.global/pyrometer-configurator F2 F6 5 or changing emissivity. This MT Depending on the device, we offer different analog and 3M occurs mostly with metals. 4 digital interfaces for data evaluation such as triggering, 2M The diagram above shows Error [%] 1M 3 alerting or saving of data. 08M the measurement errors 05M 2 across different wavelengths Analog Interfaces: 1 if the emissivity is wrongly adjusted by only 10 percent. 0 – 20 mA, 4 – 20 mA, 0 – 5 V, 0 – 10 V, 0 0 250 500 750 1000 1250 1500 1750 2000 2250 2500 Thermocouple (type J, type K) Temperature [°C] Digital Interfaces: Which temperature range? USB, RS232, RS485, Relay, Profibus DP, Modbus RTU, Ethernet Infrared cameras should be used in The temperature is another factor to decide on. The range should cover all rele- cases where more than one critical vant temperatures of the application. The measurement range of the devices is IR image of an electronics circuit board – adaptation of the measurement spot to the object size area exists or the area cannot be between –50 °C and 3000 °C. clearly defined. Critical areas can be When transferred to the two-dimensional measurement localized by the camera through the µm mA mV TC with IR cameras, the pixel size there needs to suit the demonstration of thermal images. 50 °C ... 400 °C P3 object size for the selected measurement distance. Here, The areas can then be permanently 0 °C ... 710 °C P7 the object should fill at least 3x3 pixels. monitored by one or multiple fixed –50 °C ... 1030 °C LT infrared thermometers. 200 °C ... 1500 °C G7 RS232 RS485 Relay In the example above, the correct temperature of a chip 100 °C ... 1650 °C G5 of 46 °C is determined with the suitable measurement 200 °C ... 1650 °C MT, F2, F6 spot size (a). A measurement spot (A) which is three 50 °C ... 3000 °C 05M, 08M, 1M, 2M, 3M, 4M times larger already leads to a measurement error of Profibus Modbus IR-camera-configurator: 0 500 1000 1500 2000 2500 3000 Ethernet 5 °C or 10%. If you select a larger component on the i DP RTU Temperature (°C) same circuit board (on the right in the picture), then in www.optris.global/ir-camera-configurator this case, both measurement spots (b and B) provide the Display of temperature over wavelength for the devices of the compact and the high performance series correct temperature measurement value of 58 °C. 2 3 CS/ CSmicro/ CT series i Optris calculator App with spot size calculator · p. 27 Infrared thermometers Infrared thermometers CS/ CSmicro series Small, compact infrared thermometers, ideal for use in cramped and hot surroundings Basic model CS CSmicro CSmicro CSmicro CSmicro Type LT LT02 / LT15 (H) / LT 22 H LT15 HS 2M 3M Classification / Single-piece sensor with smart Single-piece sensor with electro- Single-piece two-wire sensor with Single-piece sensor for temp. Single-piece sensor for temp. special features LED display (self diagnostics, nics in cable; smart LED display electronics in cable; high thermal measurements on metal; measurements on metal; aiming support, alarm, sensitivity; smart LED display electronics in cable; electronics in cable; temperature code) smart LED display smart LED display Detector Thermopile Thermopile Thermopile InGaAs Ext. InGaAs Sensing head exchangeable – – – – – Head cable shortening ■ ■ (behind electronics) ■ (behind electronics) ■ (behind electronics) ■ (behind electronics) CS series Thread (sensing head) M12x1 M12x1 M18x1 M12x1 M12x1 Single-piece pyrometer - Spectral range 8 – 14 μm 8 – 14 μm 8 – 14 μm 1.6 μm 2.3 μm Electronic within sensing head Temperature ranges –50 ... 1030 °C –50 ... 1030 °C –20 ... 150 °C 2ML: 250 ... 800 °C 3ML: 50 ... 350 °C In this device design, the optics are 2MH: 385 ... 1600 °C 3MH: 100 ... 600 °C installed together with the electronics Temperature resolution 0.1 K 0.1 K 0.025 K [>20 °C] 0.1 K 0.1 K in a compact housing. Optical resolution 15:1 LT02: 2:1 / LT15 (H): 15:1 / 15:1 2ML: 40:1 3ML: 22:1 LT22 H: 22:1 2MH: 75:1 3MH: 33:1 Option: CF lens ■ ■ ■ ■ ■ CSmicro series Smallest spot (CF optics / add. CF lens) 0.8 mm @ 10 mm LT02: 2.5 mm @ 23 mm 0.8 mm @ 10 mm 2ML: 2.7 mm @ 110 mm 3ML: 1.5 mm @ 30 mm Single-piece pyrometer - LT15 (H): 0.8 mm @ 10 mm 2MH: 1.5 mm @ 110 mm 3MH: 1 mm @ 30 mm Electronic within cable LT 22 H: 0.6 mm @ 10 mm To increase the robustness of the Smallest spot (SF optics) 7 mm 7 mm 7 mm 7 mm 7 mm sensor head, Optris developed two-wire Sighting LED aiming LED aiming LED aiming LED aiming LED aiming devices whose electronics are integrated into the cable. This makes the IR sensor, Response time (90 %) 25 ms LT: 14 ms / LTH:150 ms 150 ms 8 ms (mA version: 20 ms) 8 ms (mA version: 20 ms) for example, significantly less sensitive to Accuracy ±1.5 °C or ±1.5 % ±1 °C or ±1 % ±1°C or ±1 % ±(0.3 % TMeas +1 °C) ±(0.3 % TMeas +1 °C) heat. In addition, the heat generated by Outputs analog: 0 – 20 mA / – / – / ■ / ■ / ■ – / – / ■ / ■ / – or – / – / ■ / ■ / – or – / – / ■ / ■ / – or – / – / ■ / ■ / – or the two-wire electronics has no influence 4 – 20 mA / 0 – 5 V / 0 – 10 V / t/c (K/J) – / ■ / – / – / – – / ■ / – / – / – – / ■ / – / – / – – / ■ / – / – / – on the thermal stability of the sensor Second analog output – – – – – head. Interfaces: USB / RS232 / RS485 / ■ / – / – / – / – / – / – ■ / – / – / – / – / – / – ■ / – / – / – / – / – / – ■ / – / – / – / – / – / – / – ■ / – / – / – / – / – / – Profibus / Ethernet / Modbus RTU / Relay Signal processing: ■ / ■ / ■ / ■ ■ / ■ / ■ / ■ ■ / ■ / ■ / ■ ■ / ■ / ■ / ■ ■ / ■ / ■ / ■ Peak / Valley / AVG / Advanced hold CT series TAmb Head min. –20 °C –20 °C –20 °C –20 °C –20 °C Two-piece pyrometer - Sensing head with separate electronic box TAmb Head max. 80 °C LT02 / LT15: 120 °C 75 °C 125 °C 85 °C LT15 H / LT22 H: 180 °C As a third variant, a two-part device TAmb Electronics max. 80 °C 80 °C / 75 °C (mA version) 80 °C / 75 °C (mA version) 80 °C / 75 °C (mA version) 80 °C / 75 °C (mA version) consisting of measuring head and separate electronics box is available. Functional inputs / number ■ / 1 ■ / 1 ■ / 1 ■ / 1 ■ / 1 In addition to the simple device External emissivity adjustment ■ (via Vcc adjust) ■ (mV version) ■ (mV version) ■ (mV version) ■ (mV version) configuration and a temperature display, External background temperature control ■ ■ (mV version) ■ (mV version) ■ (mV version) ■ (mV version) the electronics box offers the possibility to choose between different interfaces, Trigger input for reset of hold functions ■ ■ ■ ■ ■ such as USB, RS232, RS485, Modbus Digital I/O pins / number – – – – – RTU, Profibus DP and Ethernet.
Recommended publications
  • List of Projects Using Raspberry Pi with Advance View: 1
    List of Projects using Raspberry Pi with advance view: 1. Home/Hotel Monitoring System with Automated controls A cloud connected prototype to monitor and control any hotel or can be home, The system is connected to an android application. Story Everyday we see a changing trend in technology and no matter wh has changed the way we live today and…... Listed under: Metering - Instrument Projects, Sensor - Transducer - Detector Projects 2. JQR Quadruped Autonomous Robot With a lot of inspiration from Boston Dynamics projects, I'm trying to make something great w million dollars. Story JQR Quadruped Robot is a DIY project with the main objective to build an autonomous, legged robot that wi people in many activities. The project…... Listed under: Robotics - Automation Projects 3. Raspberry Pi Web-Controlled Robot with Video Simple Raspberry Pi web-controlled robot with video live streaming. Story gatoBo gato is the spanish translation for cat. A web controlled Raspberry Pi Zero W Robot with live video streaming. This is something I b order to bother my cats. About Raspberry Pi Wikipedia: The Raspberry Pi is a…... Listed under: Robotics - Automation Projects 4. Alexa Messenger for Whatsapp Text anyone at anytime without even holding your phone or type a single letter with Alexa Messen Story Alexa Messenger for Whatsapp Did you ever want to text your friend but you are always busy or just not comfortable wit phone small screen…... Listed under: Other Projects 5. Archimedes: The AI Robot Owl A wearable robotic owl familiar. Archimedes judges your emotions, via Google AIY. Story As feature in Make: Magazine! This is a robotic owl that looks around for cool people, and can tell whether you're happy or upset.
    [Show full text]
  • SOM IB3710 Quad Core SOM (System-On-Module) Rev 1.3
    Intel Braswell SOM IB3710 Quad Core SOM (System-On-Module) Rev 1.3 SolidRun Ltd. 7 Hamada st., Yokne’am Illit, 2495900, Israel Simple. Robust. Computing Solutions www.solid-run.com 1 | Page Document revision 1.0 28082017 SolidRun Ltd. 2017 Overview Embedded system developers, device makers and OEMs: Shorten your development cycle and accelerate time-to-market with our Micro-System on a Module – SolidRun’s SOM family. We’ve harnessed Intel’s powerful new Braswell line of 14 nm SoCs, producing a powerful, small form- factor module that is ideally suited for a wide range of Windows- and Linux-based IoT applications. SOM IB3710 Highlighted Features Based on Intel’s Braswell SoC Up to 8GB Memory Size Small size 53mmx40mm Long longevity of 7 years 4K support Optimized onboard power management Dramatically reduces complexity 2 | Page Document revision 1.0 28082017 SolidRun Ltd. 2017 System Specifications Pentium N3710 Processor cores 4 Memory (RAM) Up to 8GB (4GB default size) CPU HFM Clock (GHz) 1.60, Burst 2.56 Graphic GPU Intel Gen8 LP – 16EU GPU HFM Clock (MHz) 400, Turbo Clock 700 Max Resolution (DP 1.1a, HDMI 1.4b) 3840×2160 @30 Hz, 2560×1600 @60; 24 bpp eDP 1.4 Max 2560×1600 @60; 24bpp Junction temp. range 0C-90C Dimensions 52.8mm x 40mm Max. height from carrier 6.1mm to 8.6mm (depending on DF40 1.5-4.0 mm mating height on carrier board) Mechanical fastening 3 x M1.8 mechanical holes DDR-3L Onboard one channel (1GByte version) and dual channel (all other) DDR3L 1600Mbps , up to 8GByte total Network Onboard 10/100/1000 Mbps (RTL8111G)
    [Show full text]
  • Press Release 26.2.2019
    Press Release 26.2.2019 Media Contacts: Jake Jones [email protected] SolidRun Announces Its First 16 Core Networking COM Express type 7 Platform Harnessing NXP’s Robust QorIQ® Layerscape® LX2160A processor CEx7 LX2160A COM Express module developed in partnership with NXP will be offered as a COM, an SBC and evaluation board – boasting unparalleled performance for high-end network computing applications. Nuremberg, February 26, 2019 – SolidRun, a leading developer of high-performance and energy- efficient embedded edge computing solutions is today announcing the new CEx7 LX2160A. The new module, built in partnership with NXP, harnesses the outstanding network computing power of NXP’s LX2160A 16 core Arm® Cortex®-v8 A72 processor developed on a modular COM Express type 7 standard form factor. CEx7 LX2160A was designed for high-end network and edge computing applications, including switch management, software defined network, and software based dataplane, server offload, network security solutions, white box switching, eNodeB L2/L3 compute node and network storage solutions. Based on the advanced 16 core NXP LX2160A Arm® v8 Cortex®-A72 processor, the new COM Express Type 7 module from SolidRun supports up to 2.2GHz CPU clock with high-end networking accelerators and connectivity features. Implemented in low-power 16 FinFET Compact, this powerful 64-bit Arm based platform offers support for 100 Gigabit with up to 16 Ethernet ports, supporting on board 64-bit DDR4 (up to 64GB),with ECC, and DPDK. The module also features 18 lane PCIe gen 4.0 (6 controllers), two SATA ports, two USB 3.0 ports with a total of 24 muxed SERDESs.
    [Show full text]
  • Microsom I2 Dual Core Som (System-On-Module)
    NXP-Freescale i.MX6 MicroSoM i2 Dual Core SoM (System-On-Module) SolidRun Ltd. 3 Dolev st., 3rd floor, P.O. Box 75 Migdal Tefen 2495900, Israel. Simple. Robust. Computing Solutions www.solid-run.com MicroSoM i2 Data Sheet Overview Expands the capabilities of the single core SOM-i1 with a dual lite CPU and 1GByte of DRAM. MicroSoM i2 Highlighted Features: • Based on NXP’s iMX6 Dual-lite Core SoC • 1GB DDR3 • Small size 47mm×30mm • Variety of temperature grades: - Commercial 0°C...60°C - Extended-20°C...70°C - Industrial -40°C...85°C - Automotive -40°C...105°C • Long longevity of 10 years • Low power consumption © SolidRun Ltd. 2016 3 Dolev St., 3rd floor, P.O. Box 75, Migdal Tefen 2495900, Israel / 2 MicroSoM i2 Data Sheet System Specifications i.MX6 Dual-lite Processor core Dual core ARM A9 Processor speed 1GHz (up to 1.2GHz) Floating Point VFPv3 SIMD NEON Graphics Processing Unit Vivante GC880 3D GPU Support OpenGL ES 1.1/2.0 HW Video Dec/Enc Multi Format Memory 64 bit, 1GB DDR3 @ 800Mbps Wired Network 10/100/1000 Mbps* Wireless Network Optional Bluetooth Optional Display Max resolution HDMI: 1080p, LCD: WUXGA (1920×1200) Display Interfaces LVDS, HDMI 1.4, DSI, Parallel Dual display support Supported External Storage NOR-Flash, eMMC, SD/microSD, PCIe SSD SD/MMC 3 USB 2.0 host 1 USB OTG 1 Serial ports 3 Digital audio serial interface 1 Camera interface port 2 Lane CSI CAN bus ** S-ATA – PCI-Express 2.0 ×1 Second Ethernet Via PCIe or USB NIC I2C 3 SPI 3 PWM 4 © SolidRun Ltd.
    [Show full text]
  • Debian GNU/Linux Installation Guide
    Debian GNU/Linux Installation Guide July 31, 2021 Debian GNU/Linux Installation Guide Copyright © 2004 – 2021 the Debian Installer team This manual is free software; you may redistribute it and/or modify it under the terms of the GNU General Public License. Please refer to the license in Appendix F. Build version of this manual: 20210730. i Contents 1 Welcome to Debian 1 1.1 What is Debian? . 1 1.2 What is GNU/Linux? . 1 1.3 What is Debian GNU/Linux? . 2 1.4 What is the Debian Installer? . 3 1.5 Getting Debian . 3 1.6 Getting the Newest Version of This Document . 3 1.7 Organization of This Document . 3 1.8 About Copyrights and Software Licenses . 4 2 System Requirements 5 2.1 Supported Hardware . 5 2.1.1 Supported Architectures . 5 2.1.2 Three different ARM ports . 6 2.1.3 Variations in ARM CPU designs and support complexity . 6 2.1.4 Platforms supported by Debian/armhf . 6 2.1.5 Platforms no longer supported by Debian/armhf . 8 2.1.6 Multiple Processors . 8 2.1.7 Graphics Hardware Support . 8 2.1.8 Network Connectivity Hardware . 8 2.1.9 Peripherals and Other Hardware . 8 2.2 Devices Requiring Firmware . 8 2.3 Purchasing Hardware Specifically for GNU/Linux . 9 2.3.1 Avoid Proprietary or Closed Hardware . 9 2.4 Installation Media . 9 2.4.1 CD-ROM/DVD-ROM/BD-ROM . 9 2.4.2 Network . 10 2.4.3 Hard Disk . 10 2.4.4 Un*x or GNU system .
    [Show full text]
  • SOM I.MX8M Datasheet
    SOM i.MX8M Datasheet NXP i.MX8M based System on Module | Rev. 2.0 SolidRun Ltd. Embedded Edge Computing 7 Hamada st., Yokne’am Illit, 2495900, Israel www.solid-run.com Overview SolidRun’s i.MX8M based System on Module (SOM) harnesses NXP’s powerful i.MX8M in a flexible & compact SOM including a memory subsystem, power management subsystem, networking and system interconnectivity. The i.MX8 SOM will allow developers and OEMs to simplify the production cycle and reduce time-to-market drastically. SOM i.MX8M Highlighted Features Based on NXP’s i.MX8M dual/quad-core Arm Cortex A53 processor, Cortex M4 general purpose processor 4K UltraHD, full HDR, 20 audio channels & Dolby Vision Up to 4GB LPDDR4 3200 Tiny footprint (47mm x 30mm) 2 | Page Document revision 1.1 25072019 SolidRun Ltd. 2019 System Specifications SOM i.MX8M Dual SOM i.MX8M Quad Lite SOM i.MX8M Quad Processor NXP i.MX8M dual Arm Cortex NXP i.MX8M Quad Arm Cortex NXP i.MX8M Quad Arm Cortex A53 A53 A53 General Purpose Processor Arm Cortex M4 Arm Cortex M4 Arm Cortex M4 Processor Speed 1.5GHz Commercial 1.5GHz Commercial 1.5GHz Commercial 1.3GHz Industrial 1.3GHz Industrial 1.3GHz Industrial Floating Point VFPv4 VFPv4 VFPv4 SIMD NEON NEON NEON Graphic Processing Unit Vivante GC7000 Lite Vivante GC7000 Lite Vivante GC7000 Lite 3D GPU Support OpenGL ES1.1/2.0/3.0/3.1, OpenGL ES1.1/2.0/3.0/3.1, OpenGL ES1.1/2.0/3.0/3.1, OpenCL 1.2 & Vulkan OpenCL 1.2 & Vulkan OpenCL 1.2 & Vulkan HW Video Dec/Enc Multi Format Multi Format Multi Format Memory 32bit up to 3GB LPDDR4 32bit up to 3GB LPDDR4
    [Show full text]
  • SOM I.MX 8M User Manual NXP I.MX 8M™ Based SOM | Rev
    SOM i.MX 8M User Manual NXP i.MX 8M™ based SOM | Rev. 1.0 EMBEDDED EDGE COMPUTING SolidRun Ltd. 7 Hamada st. | Yokne'am Illit 2069201 | Israel www.solid-run.com Revisions and Notes Date Owner Revision Notes Feb. 25th 2018 Noam Wiedenfeld 1.0 Initial release Disclaimer No warranty of accuracy is given concerning the contents of the information contained in this publication. To the extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by SolidRun Ltd., its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or inaccuracies in this document. SolidRun Ltd. reserves the right to change details in this publication without prior notice. Product and company names herein may be the trademarks of their respective owners. © 2018 SolidRun Ltd. All Rights Reserved. Please verify that you have the most current version of this document from: www.solid- run.com 2 Table of Content Introduction ........................................................................................................................................................ 4 Overview ............................................................................................................................................................. 4 Highlighted Features .......................................................................................................................................... 4 Supporting Products ..........................................................................................................................................
    [Show full text]
  • Microsom I2ex Dual Core Som (System-On-Module) Rev 1.3
    NXP-Freescale i.MX6 MicroSoM i2eX Dual Core SoM (System-On-Module) Rev 1.3 SolidRun Ltd. 3 Dolev st., 3rd floor, P.O. Box 75 Migdal Tefen 2495900, Israel. Simple. Robust. Computing Solutions www.solid-run.com 1 | Page Document revision 1.0 25082016 SolidRun Ltd. 2016 Overview Introduces better capabilities such as a higher end processing power and a dual CPU. MicroSoM i2eX Highlighted Features Based on NXP’s iMX6 Dual Core SoC 1GB DDR3 Small size 47mm×30mm Variety of temperature grades: - Commercial 0°C...60°C - Industrial -40°C...85°C - Automotive -40°C...105°C Long longevity of 10 years Low power consumption Broad SW support (Linux, Android) 2 | Page Document revision 1.0 25082016 SolidRun Ltd. 2016 System Specifications i.MX6 Dual System On Chip i.MX6 Dual Processor core Dual core ARM A9 Processor speed 1GHz (up to 1.2GHz) Floating Point VFPv3 SIMD NEON Graphics Processing Unit Vivante GC2000 3D GPU Support OpenGL|ES 1.1/2.0,OpenCL 1.1E HW Video Dec/Enc Multi Format Memory 64 bit, 1GB DDR3 @ 1066Mbps Wired Network 10/100/1000 Mbps* Mbps Wireless Network Optional (BCM4330) Bluetooth Optional (BCM4330) Display Max resolution HDMI: 1080p, LCD: WUXGA(1920 x 1200) Display Interfaces LVDS, HDMI 1.4, DSI, Parallel Dual display support Supported External Storage NOR-Flash, eMMC, SD/microSD, PCIe SSD SD/MMC 3 USB 2.0 host 1 USB OTG 1 Serial ports 3 Digital audio serial interface 1 Camera interface port 4 Lane CSI CAN bus ** S-ATA Gen II, 3Gbps PCI-Express 2.0 x1 Second Ethernet Via PCIe or USB NIC I2C 3 SPI 3 PWM 4 GPIO 75 JTAG Test Point Header S/PDIF Input S/PDIF Output 1-Wire 1-Wire Transceiver on carrier board RTC On Carrier Linux Support Android Support 3 | Page Document revision 1.0 25082016 SolidRun Ltd.
    [Show full text]
  • SOM I.MX 8M Plus Datasheet
    SOM i.MX 8M Plus Datasheet NXP i.MX 8M Plus based System-on-Module SolidRun Ltd. Embedded Edge Computing 7 Hamada st., Yokne’am Illit, 2495900, Israel Overview Based on Arm Cortex A53 technology and manufacturing process utilizing 14LPC FinFET process, the NXP i.MX 8M Plus SoC provides high performance and processing speed, while keeping the power consumption to a minimum. The built-in NPU (up to 2.3TOPs) provides customers the option to perform machine learning inference directly on the edge, reducing cloud dependency, latency and is able to perform highly complex neural network functions like face and emotion detection, object detection and surveillance, which are key to applications such as smart and safe cities, retail, smart home and much more. Featuring additional high-speed interfaces such as 2 x Gigabit Ethernet, TSN, PCIe Gen 3, USB 3.0, and CAN-FD capabilities, offering industrial temperature grade and NXP’s longevity program, the i.MX8M Plus SOM is perfect for industrial IoT and HMI applications. SOM i.MX 8M Plus Highlighted Features Quad/Dual core Cortex A53 + Cortex M7 for real time applications Integrated NPU up to 2.3TOPs Built in Dual ISP with onboard MIPI-CSI Up to 8GB LPDDR4 system memory 2 | Page Document revision 1.2 01022020 SolidRun Ltd. System Specifications i.MX 8M Plus CPU Details NXP i.MX 8M Plus Dual/Quad 2/4 x Cortex A53 1 x Cortex M7 1 x NPU up to 2.3 TOPS CPU Speed 1.8GHz Commercial 1.6Ghz Industrial Floating Point VFPv4 SIMD NEON RAM Up to 8GB LPDDR4 Internal Storage 8GB eMMC External Storage Support NOR-Flash
    [Show full text]
  • Cubox-I Pro Carrier Board for Imx6 Som (System-On-Module)
    NXP-Freescale i.MX6 CuBox-i Pro Carrier Board for iMX6 SoM (System-On-Module) SolidRun Ltd. 3 Dolev st., 3rd floor, P.O. Box 75 Migdal Tefen 2495900, Israel. Simple. Robust. Computing Solutions www.solid-run.com CuBox-i Pro Data Sheet Overview At only 2”×2”×2” the CuBox-i is the tiniest computer in the world. Its elegant enclosure makes it ideal for mini-computing solutions, while its size is perfect for integrated solutions. Take advantage of the wide variety of features, interfaces and processor options, including onboard real-time clock, in selecting the solution that’s just right for you. CuBox-i Carrier Pro Highlighted Features: • Based on NXP’s iMX6 Single to Quad Core • Up to 4GB DDR3 • Small size 2”×2”×2” • Fanless, Robust and Industrial Design © SolidRun Ltd. 2016 3 Dolev St., 3rd floor, P.O. Box 75, Migdal Tefen 2495900, Israel / 2 CuBox-i Pro Data Sheet System Specifications System on Chip CuBox-i Pro HDMI 1080p with CEC USB 2.0 2 PWM LED Ethernet 5V DC Jack eSATA II Depends on MicroSOM model MicroUSB for development Micro SD interface RTC with backup battery Optical SPDIF audio out Infra-Red Remote Control Receiver Infra-Red Transmit (Remote Control) Tiny GPIO Button Passive Thermal Management High Polish Plastic Enclosure WiFi and BlueTooth Antenna Depends on MicroSOM model Power Management © SolidRun Ltd. 2016 3 Dolev St., 3rd floor, P.O. Box 75, Migdal Tefen 2495900, Israel / 3 CuBox-i Pro Data Sheet Interfaces Back View © SolidRun Ltd. 2016 3 Dolev St., 3rd floor, P.O.
    [Show full text]
  • LOGO 2017 Prvoduct Guide PICTURE
    LOGO 2017 Prvoduct Guide PICTURE SolidRun Product Catalog 2017 Overview AweSOMe Embedded Solutions SolidRun is a leading developer and manufacturer of powerful, energy- efficient Systems-on-Module (SOM), Single Board Computers (SBC), and Industrial PCs for the growing Internet-of-Things (IoT) sector. SolidRun’s offering of innovative solutions includes a wide range of hardware and software design, development, and support services for its global customer base. Product Range Systems-on-Module Single Board Computers OEM/ODM Services Software (SOMs) (SBCs) Reduce development time and Utilize SBCs for deployment, Design and manufacturing Linux tier 1 support and costs using a MicroSOM integration, and evaluation services – from the software partner ecosystem conceptualization to the finished product Technology Partners Simple. Robust. Computing Solutions. www.solid-run.com 3 Business Segments SolidRun’s IoT solutions combine hardware, software, services, and an ecosystem of partnerships to simplify IoT applications development while overcoming deployment challenges in a variety of sectors. Automotive Transport Industrial Automation / Medical Technology Aviation / Drones Multimedia Home Automation Smart City Point of Sale / Vending Industry 4.0 Machines The automotive industry, Industrial automation is a The medical technology Drones offer a variety of As high-definition video IoT technologies are the Smart city applications Opportunities in the POS/ together with the latest rapidly growing market for industry provides the ultimate applications ranging from 3D systems become the norm, driving force behind a wave harness a constant flow of kiosk marketplace are self-driving innovations, has IoT-based innovation. With its challenge – the demand for mapping to traffic monitoring multimedia processing of innovation in the field of data from a growing network expanding rapidly as they challenged the electronic emphasis on constant safe, reliable systems that and security, and require requirements have become a home automation.
    [Show full text]
  • Solidrun Solidsense Iot Connectivity
    SolidRun SolidSense IoT Connectivity Powerful Industrial & Internet of Things Application-Ready Gateway & Connectivity Solution -Confidential- Overview About Major Milestones • SolidRun is a developer and producer of a range 2010: Founded of embedded computers and servers for the edge computing market. 2012: CuBox world’s smallest • HQ Office located in Yokne’am Illit, Israel. PC Additional engineering support in Europe. 2014: IoT embedded • Private, Self-funded. Kossay Omary (co-founder), modules 2015: partner with Arrow as Rabeeh Khoury (co-founder), Dr. Atai Ziv (CEO). Global distributer (EMEA, US) • Diversified global B2B customer base 2016: Networking embedded • HC - 30 (48% R&D) modules • Fast growing: 98% CAGR in 2018 ($9.1M, 2017: Win Tier 1 customers (e.g. Profitable) Nokia, Axis, Ericsson) • Investing in breakthrough innovation within high 2018: Foothold in Japanese growth segments Market -Confidential- Edge Computing The Cloud The Edge Remote data center Data processing closer to services allows real-time analytics & optimization AI Video IoT <100 KM Internet of things (IoT), Artificial intelligence (AI) and video streaming deployments will drive Edge Computing market growth, projected to exceed $9.2B by 2023 - CAGR of %27.3 SolidRun is leading the edge computing revolution by providing modular low-power dense computers and servers -Confidential- Selected Customers SolidRun has over 75 active customers from more than 23 countries around the world. Industrial & IoT (Gateway) Network (Node) Inspectron Tools Servotronix Ericsson Inspection tools & systems Control & automation solutions HPE Telecommunications. USA Israel IT enterprise solutions. USA Sweden Nokia Axis Communication Voleatech PicoCELA Communication solutions. Security systems. Network solutions. Multi-hop connectivity solutions. Finland Sweden Germany Japan AeroVironment Vivi Gigaclear RAD Tactical areal systems.
    [Show full text]