k

INDEX

aboveground advanced materials creation Sun Oil and Houdry process, 92–94 cultural-strategic risks, 390, 394–419 advanced heat-resistant sealants, 147 k entrepreneurship and innovation, 331 advanced materials innovation k flowchart, gauntlet of perceived risk, 337 aboveground (see aboveground advanced gauntlet of perceived risks, 331–332 materials creation) intellectual risks, 331, 347–363 acquisition assessment, 443 market interaction risks, 371, 380–389 advanced material processes and chief minimal risk conditions, 332 products, 14 project terminations and completions, 332–336 biotechnology and health care, 10–11 prototyping risks, 364, 370–379 blue-sky innovation, 439 relevancy risks, 337–347 “buying of time,” 440 resource minimization risks, 363–369 champion targeting, 441–442 risk-averse management, 330 construction, infrastructural, and manufacturing scaling risks, 389–394 industries, 12–13 uncertainties, 331 core competency linking, 442 active addressing scheme see thin-film transistors corporate management, 440 (TFTs) corporate strategy, 439 active-matrix LCDs, 277 cultural monitoring, 442 advanced casting technology see thin slab and thin different products, 13 strip casting COPYRIGHTEDenergy, MATERIAL 9–10 advanced fuels forward-looking management, 439 gasoline, 91 global perspective, 444–446 high-octane fuel, 92 implications for government, 443–444 Jersey Standard and fluidization process, 94–99 information and computer technology, 8–9 oil feedstock, 91 inventors and champions, 422–423

Advanced Materials Innovation: Managing Global Technology in the 21st century, First Edition. Sanford L. Moskowitz. © 2016 John Wiley & Sons, Inc. Published 2016 by John Wiley & Sons, Inc.

k k

450 INDEX

advanced materials innovation (Continued) bipolar transistor, 184 different types, 433–438 bisphenol A, 81 gauntlet of risks, 423–433 Brattain, Walter, 150, 152–154, 157 major task milestones, 318–320 British Telecom, 220 management skills, 440 Brody, T. Peter., 273 on-the-ground logistical expertise, 440 buckminsterfullerene, 297–298 organizational structuring, 442–443 buckyball “factory,” Germany, 299–300 “perceived” and “relative” risk, 14 bulk polymerization, 73 R&D activity, 443 Busicom, 189–190, 193 resource-rich firms, 438 revolution, 3–7 Carbon Nanotechnologies Inc. (CNI), 303 risk planning, 441 carbon nanotubes, 289, 290, 305 sectors of US economy, 6, 8 Carothers, Wallace, 51–53 structural context, 419–422 CASTRIP process, 29 technology–market assessment, 442 cellulose, 45 transition management, 441 Center for Nanoscale Science and Technology transportation, 11–12 (CNST), 301 underground, General Electric and Union Carbide, 327–330 chemical vapor deposition (CVD), 229 underground vs. aboveground (see Claude process, 46 “underground” vs. “aboveground” colloidal materials, 52 advanced materials innovation) CommQuest, 238 American Telephone and Telegraph (AT&T), 146, CoMoCAT system, 305 206, 214–221 complementary metal-oxide semiconductor amorphous silicon, 276 (CMOS), 262, 263 AP2 experimental machine, 293–295 computer displays (Joint US–Japanese k aramids, 77–80 Cooperation), 281–284 k Atalla, John, 166–168 conduction bands, 205 construction, infrastructural, and manufacturing industries, 12–13 Bakelite, 72 Consumer Electronics Division, 274 band-gap engineering, 205 cultural-strategic risks Bardeen, John, 150, 152–154 aboveground projects, 394 Bayer materials science “blue-sky” research, 395 Bayer’s first commercial polycarbonate CASTRIP process, 396 plant, 309 commercialization phase, 396–418 “Baytube”-technology, 309 cultural conflict, 395 CHEMPARK, 309 cultural forcing, 419 conductive plastics, 310 cultural issues, 390 graphene, 311 Fairchild and MOS technology, 419 HiPco process, 310 individualism vs. collectivism, 395 polyurethane polymers, 309 “internally static” culture, 419 “Baytube”-technology, 309 Jersey Standard, 395 Bell Labs, 179 “long-term” oriented firms, 395 history, 148–150 “short-term” oriented companies, 395 MOS research, 165–168 cutting-edge minimill technology, 26 point-contact transistor, 152–156 cutting-edge polymer development, 110 and semiconductor laser, 206–221 semiconductor research, 150–152 transistor, 148–149 dacron Big Blue, 238 development, 66–67 Big Steel, 20–21 polyester fiber, 60 biotechnology and health care, 10–11 research phase, 65–66 bipolar complementary MOS (BiCMOS) scale-up and commercialization, 67–68 transistor, 235–236 Darlington minimill, 26

k k

INDEX 451

DeLoach, Barry, 212–220 planar junction transistor, 162–163 Delrin plastic, 117–118 silicon transistor, 160–162 Deming, W. Edwards, 196 spin-off Intel, 180 diamonds, 297 “super dip,” 184 Digital Technology Incorporated (DTI), 283–284 fiber optics industry, 210 digital watch, 265–268 field-effect approach, 184 dimethylformamide (DMF), 61 field-effect transistors (FETs), 156, 165, 179 DuPont firm and project characteristics, 325–327 and Delrin plastic, 117–118 first-generation high-pressure chemicals, 47–48 disparate products, 50 fixed-bed, high-pressure catalysis, 122 and polychemicals department, 116–117 Fixed Nitrogen Research Lab (FNRL), 46 and polyethylene, 118–122 flat-panel (hang-on-the-wall) TVs, 278–281 and specialty fibers flat-screen TV, 279–280 high-performance fibers, 74 fluidization I high-value specialized fibers, 74 General Electric and polysilicones, 100–112 Kevlar and aramids, 77–80 Jersey Standard, 94–99 Lycra spandex and block copolymers, 75–77 Sun Oil and Houdry process, 92–94 synthetic fiber revolution fluidization II advanced fibers, 44–48 DuPont and Delrin plastic, 117–118 dacron, 65–68 DuPont and polychemicals department, 3-D printing revolution, 41 116–117 high-pressure catalytic technology, 42 DuPont and polyethylene, 118–122 miracle fibers, 41 Union Carbide and polyolefins, 122–136 nature of high-pressure synthesis, 42–44 Unipol revolution and metallocene polymers, nylon revolution, 48–60 137–139 orlon, 61–65 Frohman, Dov, 187, 188 k dynamic random access memory (DRAM), fullerene factory, 301 k 185–187, 195, 198 fullerenes, 297 dynamic scattering (DS) effect, 250 functional materials, 10 dynamite, 44 gallium arsenide, 210 elastomer fibers, 76 gauntlet of risks electric arc furnaces (EAFs), 21 cultural-strategic risks, 390, 394–419 Electron Tube Division, 274, 275 entrepreneurship and innovation, 331 emulsion polymerization, 73 flowchart, 337 energy technology, 9–10 intellectual risks, 331, 347–363 market interaction risks, 371, 380–389 epitaxial process, 204–206 minimal risk conditions, 332 erasable programmable read-only memory perceived risks, 331–332 (EPROM), 187–189, 195, 198 project terminations and completions, 332–336 ethyl phenyl silicone (EPS), 100 prototyping risks, 364, 370–379 Europe and liquid crystal display, 259 relevancy risks, 337–347 excited atoms, 207 resource minimization risks, 363–369 Exxon Enterprises, 258 risk-averse management, 330 Exxpol, 138 scaling risks, 389–394 uncertainties, 331 Faggin, Federico, 189–195, 198 General Electric Fairchild semiconductor company, 179, 192, 195, and polycarbonates 199 commercialization phase, 85–88 bipolar transistor, 184 development and scale-up, 82–85 integrated circuit, 163–165 research phase, 80–82 “Materials and Processes” group, 182 polymer projects, 327 MOS project, 182 and polysilicones MOS research, 168–175 commercialization phase, 107–112

k k

452 INDEX

General Electric (Continued) EPROM, 187–189 development phase, 103–107 “internalized short-term dynamic” culture, initiation phase, 100–101 197–200 research phase, 101–103 microprocessor, 191–194 and Union Carbide organized, resources allocated, and people “bottom-up” innovation, 327–328 hired, 181 “bottom-up” model, 329 silicon gate process, 180–182 enamels, 327 superb MOS-GATE technology, 226 fluid reaction technology, 329 test chips, 185 high-pressure polyethylene process, 327 and US semiconductor industry, 196 interfacial polymerization, 329 intellectual risks polycarbonates, 328 early research phase, 348–361 silicone project, 330 informational networks, 362 German coal tar-based synthetics, 3 innate creative energy, 347 giant electronics devices, fundamental Nucor steel, 348 technologies of, 280–281 revolutionary technology, 347 graded index fiber, 218 risk-embracing personalities, 363 graphite, 297 strategic discoveries, 348 Gray, George, 247 underground projects, 362 Grove, Andrew, 181, 182, 184, 186 interfacial polymerization see low-temperature guaiacol carbonate, 81 polymerization guest–host (GH) effect, 250 “internalized short-term dynamic” culture (Intel), 197–200 International Business Machines (IBM) HDPE problem, 121 for personal computers Hecht, Jeff, 210 commercialization, 283–284 k Heilmeier, George, 249–251, 253–255 development, 282–283 k heterostructured composites, 203 research phase, 282 hexamethylene diamine (HDA), 57 scale-up, 283 high-density polyethylene (HDPE), 115 production process, silicon-germanium chip highly stable 60-atom cluster peak, 295–298 integration, 235–236 high-performance polymers, 13 research at, 224–226 high-pressure carbon monoxide (HiPco) silicon–germanium chip, 223–224, 226–239 process, 303 International Liquid Crystal Company (ILIXCO), high-pressure process 256–257 DuPont’s diversification strategy, 44–45 inventors and champions, advanced materials DuPont’s struggles, 45–46 innovation, 422–423 first-generation high-pressure chemicals, 47–48 different types, 433–438 nature, 42–44 gauntlet of risks, 423–433 high-quality gun powder, 44 Iverson, Ken, 24–25 Hoerni’s planar process, 163 Hoff, Ted, 189–190, 192, 194 Japanese companies, in semiconductors, 196–197 humble nanoclays, 289 Japan, LCD development, scale-up, and hunt-and-peck method, 260, 268 commercialization in, 260–268 Jersey Standard and fluidization process IBM see International Business Machines (IBM) “downflow” design, 98 Imperial Chemical Industries (ICI), 119 fixed-bed technology, 94 improved solid-state amplifier, 157 fluid bed technique, 97 Industrial Equipment Business Division fluid catalytic cracking plant, 98 (IEBD), 262 heat control problem, 96 information and computer technology (ICT), 8–9 hydrogenation, 95 integrated circuit, 163–165 research and development, 94 Intel, 257 rotating screw concept, 95 DRAM, 185–187 scaling-up process, 97

k k

INDEX 453

specially designed glass equipment, 96 biomedical technology, 72 superior catalytic refining process, 95 Dupont and specialty fibers, 74–80 turbulent catalyst beds, 98 General Electric and polycarbonates, 80–88 junction (bipolar) transistor neoprene, 73 advantages, 158–159 polystyrene, 73 dopants, 158 polyvinyl chloride, 73 doping process, 158 specialized polymers, 72 purification of semiconductor, 158 synthetic polymer, 72 Shockley’s design, 157 Lucite plastic, 48 zone refining, 158 Lycra spandex and block copolymers, 75–77

Kellogg Brown & Root (KBR), 304 Magnascreen, 278 Kelly, Mervin J., 150, 151, 155, 156, 159 Maiman, Ted, 208–210 Kevlar, 77–80 Makrolon, 81 Klein, Thomas, 182 market interaction risks Kratschmer–Huffman apparatus, 300 computer-aided design technology, 381 elasticity spectrum, 381 elastic vs. inelastic processes, 381 “lab on a chip” concept, 11 innovation phase, 382–388 laser oven stopgap, 302 market stability, 382 LCD. see liquid crystal display (LCD) Nespresso coffee system, 380 Le Comber, Peter, 276 process flexibility, 380, 389 Lehmann, Otto, 246 product-oriented technologies, 382 light-emitting diodes (LEDs), 9, 265 semicommercial prototype, 371 linear low-density polyethylene (LLDPE), 115, synthetic fiber, 380 132 technology–market interactions, 382 k liquid crystal display (LCD), 246 “Materials and Processes” group, Fairchild, 182 k business unit search, 253–255 materials and related devices, advanced, 6–7 development at RCA, 252–255 Materials Genome Initiative, 444 development, scale-up, and commercialization Mauguin, Charles, 247 in Japan, 260–268 McGowan, Bill, 220–221 development, scale-up, and commercialization melt polymerization technique, 84 in USA, 255–259 metallocene polymers, Unipol revolution and Europe and, 259 advanced materials, 138–139 experimental displays, 252 science and technology, 137–138 14-inch LCD, 279 metal-on-silicon (MOS) research 40-inch LCD, 279–280 Bell Labs, 165–168 Japanese companies, 278–284 Fairchild Project liquid crystal action modes, 249–251 cultural and strategic risks, 174–175 liquid crystal “domains,” 248–249 human resource risk, 170–171 for personal computers initiation, research, and early development, commercialization, 283–284 168–169 development, 282–283 structural risk, 171–174 research phase, 282 technology–market interaction risk, scale-up, 283 172–173 pocket calculator, 261–265 MOS-based memory chips, 185 room-temperature liquid crystals, 251–252 MOS devices, 182, 183 United States, 277–278 MOS field-effect transistor, 233 weakening influence of Sarnoff Labs, 252–253 MOS-GATE, 192 liquid crystals, 245–246 MOS integrated chips, 181 research, RCA and, 248–255 MOS-silicon gate memory, 183 liquid phase epitaxial (LPE) process, 206, 212, metal-organic chemical vapor deposition 213, 217, 219 (MOCVD), 219 low-temperature polymerization methylchlorosilane (MCS), 103

k k

454 INDEX

methyl phenol silicone (MPS), 101 laser oven stopgap, 302 Meyerson, Bernard, 227–239 multiwalled nanotube, 290 microalloys, 22–23 nanocomputers, 289 microchips, nonsilicon-based, 204–206 single-walled nanotube, 290 Micro Display Systems, 256, 257 small buckyball “factory” in Germany, 299–300 microprocessor, 180, 189 technology transfer, 303–308 championing at Intel, 192–194 National Cash Register (NCR), 224 competitive advantage of, 191 near-net-shape casting, 21 Faggin, Federico, 190–191 Nelson, Herbert, 212 Hoff, Ted, 189–190 nematic materials, 246 microwave amplification by the stimulated neoprene, 73 emission of radiation (maser), 208 Niagara’s cheap electrical power, 4 Microwave Communications Inc. (MCI), Nippon Electric Company (NEC), 291 215–216, 220–221 nitrocellulose, 45 militaristic educational system (Japan), 196 nixie tubes, 262 Million-Hour Laser, 217 Nomex, 78 mini-and micromill revolution, 21–22 nonsilicon-based microchips, 204–206 Ministry of International Trade and Industry Noyce, Robert, 151, 160, 161, 163–165, 170, 171, (MITI), 263–264 174, 175 miracle fibers, 41 Nucor steel see also thin slab and thin strip casting MIT Lincoln Labs, 219 flexible structure, 24 molecular beam epitaxy (MBE), 206, Iverson, Ken, 24–25 227–229 steel minimill, 25–26 Moore’s law, 186, 189, 195, 197–200 nylon revolution MOS-SG process, 204 Carothers, Wallace, 51–53 competition and resource allocation, central research department, 49–51 k 196–197 development, scale-up, and commercialization, k concentration of, 183 56–60 development phase, 182–185 research phase, 53–56 DRAM, 185–187 EPROM, 187–189 “internalized short-term dynamic” culture, “One Polyethylene” strategy, 120–121 197–200 organic light-emitting diode (OLED), 9 microprocessor, 189–194 organizational champion, 432 Moore’s law, 197–200 orlon product development, 185–194 acrylic fiber, 60 research and early development, 182 development phase, 63–64 scale-up and commercialization, 194–200 research phase, 61–62 Mostek, 199 scale-up and commercialization, 64–65 multiwalled nanotube (MWNT), 290, 305, 306, 309, 310, 382 Panelvision, 277–278 Mylar elastomers, 122 PAN fibers, 62 parallel mirror approach, 208 nanoconcrete, 12 p-azoxyanisole, 249 nanomaterials, 245, 288–289 Pentium chip, 199–200 “Nano Super Hard Inexpensive Laser Deposited Petritz, Richard, 199 (NSHILD)” coatings, 13 photolithographic technique, 164 nanotubes, 245 photoresist, 184 commercialization, 308–311 planar junction transistor, 162–163 early research, 291–298 p–n junction, 152 entrepreneurial vision, 300–302 point-contact transistor, 154–156 extraordinary electronic properties, 289 polyacrylonitrile (PAN), 61 graphene, 290 polycarbonates “HiPco” solution, 303 commercialization phase, 85–88

k k

INDEX 455

customer issue, 87–88 thin slab casting, 27–28 development and scale-up, 82–85 thin strip casting, 28–30 patent issue, 86–87 transition management, 441 research phase, 80–82 resource minimization risks, 363–369 polycrystalline silicon, 276 Rice Quantum Institute (RQI), 301 polyethylene room-temperature liquid crystals, 251–252 European developments, 118–120 Rowe, Tom, 183, 184 fluidization, 122 high-density polyethylene problem, 121 Sarnoff, David, 248, 253 “One Polyethylene” strategy, 120–121 Sarnoff Labs, 248, 251 polyethylene terephthalate (PET), 65 scaling risks polymers, 4 deeply rooted process technology, 390 polymethylene, 119 economies of scope, 390 polyolefin technology, 5 polycarbonates, 389 “polysiliconed” products, 106 scale-up phase, 390–394 polysilicones, 83 underground projects, 389 commercialization phase, 107–112 Unipol system, 389 development phase, 103–107 Seiko Corporation, 265–268 initiation phase, 100–101 semiconductor firm, purpose of, 145 research phase, 101–103 semiconductor laser, 203, 206–207 polystyrene, 73 advances to higher wavelengths, 218–220 polyvinyl chloride (PVC), 73 competition, 220–221 population inversion, 207 development at AT&T/Bell Labs, 215–216 product-oriented technology, 246 development of, 212–217 product/technology champion, 432 early research in United States, 210–211 project terminations and completions, 332–336 first lasers, 207–209 k prototyping risks, 364, 370–379 initiation and research, 211–212 k Pyrovac, 147 Million-Hour Laser, 217 resource problems and creative bootstrapping, quantum theory of solids, 210 214–215 scale-up and commercialization, 218–221 working toward prototype, 213–214 RCA, 247 semiconductors, 210 initiation and research at, 248–252 Sharp Corporation, 261–265, 279 and liquid crystal research, 248–255 shift registers, 186 ready-to-mold plastic resins, 305 Shockley’s bipolar junction, 179 Reed’s fluid bed reactor, 110 Shockley semiconductor, 192, 195 Reinitzer, Friedrich, 246 creation and fall, 159–160 relevancy risks junction (bipolar) transistor, 156–159 “big steel” companies, 338 Shockley, William, 150–152 breakthrough innovation, 337 silicon, 203, 210 electrical products, 347 polymer project, 109 initiation, 338–346 transistor, 160–162 management-approved projects, 338 silicone-based polymer, 101 thin slab casting technology, 338 silicones research and development (R&D) commercialization phase, 107–112 acquisition assessment, 443 development phase, 103–107 activity, 443 initiation phase, 100–101 champion targeting, 441–442 research phase, 101–103 core competency linking, 442 “1101” silicon gate memory chip, 184 cultural monitoring, 442 silicon gate process, 179–180 see also MOS-SG organizational structuring, 442–443 process risk planning, 441 Intel creation, 180–182 technology–market assessment, 442 silicon–germanium bipolar devices, 235

k k

456 INDEX

silicon–germanium (SiGe) chip, 223–224 superb MOS-GATE technology, 226 development phase, 231–235 “super dip,” 184 dynamic market, 235 superlattices composites, 203 finding markets, 236–237 supertwisted nematic (STN) effect, 261 germanium solution, 230–231 initiation and research phases, 226–231 Tabulating Machine Company, 224 integration into IBM’s production task milestones, advanced materials innovation, process, 235–236 318–320 internal competition, 231–233 technology transfer ion implantation, 227 CNI and pilot plant, 304–305 microchip, 203 intellectual property, 303 molecular beams vs. chemical vapor deposition, SWNTs and problems, 305–308 229 terylene, 66 scale-up and commercialization, 235–239 test chips, 185 shifting context and shrinking thick slab casting, 20–21 resources, 233–235 thin-film transistors (TFTs), 253 strategies creation, 237–239 history, 272 temperatures, 228–229 polycrystalline and amorphous silicon, 276 transistor program, 233 research and early development silicon polymer project, 109 Europe, 276 silicon transistor, 160–162 United States, 273–275 Silicon Valley, 196 thin slab and thin strip casting, 5 single-molecule theory, 52 challenges of scaling, 30–31 Single-Wall Carbon Nanotube Production and dynamic expansionist culture, 36–38 Application Technologies, 303 experiential risks, 34 single-walled nanotube (SWNT), 290, 291, “internalized static” culture and technology k 302–308, 310, 382 k selection, 35–36 Smalley, Richard, 293–295, 300–302 research and development, 27–30 “smart” drug delivery systems, 11 resource risks, 32–33 Solid State Division (SSD), 254–255 structural risks, 31–32 space dust, 291–293 Thomas J. Watson Research Center, 225–226 Spear, Walter, 276 3D architectured nanostructural metamaterials, 12 specialty fibers three-dimensional printing, 10 high-performance fibers, 74 transistor, 148–149 see also junction (bipolar) high-value specialized fibers, 74 transistor; planar junction transistor; Kevlar and aramids, 77–80 point-contact transistor; silicon transistor Lycra spandex and block copolymers, 75–77 transportation sector, 11–12 spun-bound aramid polymers, 78 “triboluminescent” materials, 11 static random access memory (SRAM) Tubes@Rice, 302 chip, 185 “TWIP” plastic steels, 12 steel minimill, 25–26 twisted nematic liquid crystal display (TN-LCD), stimulated emission, 207 247, 256–257 Stine, Charles, 49–51 type A point-contact transistor, 154 strategic context, and major task milestones, Type 41 Orlon, 64 advanced materials innovation, 321–325 Type 42 Orlon, 64 Sun Oil and Houdry process “burn-off” cycle, 93 catalytic cracking technology, 93 ultrahigh molecular weight polyethylene higher-octane fuel, 94 (UHMWPE), 115 high-octane gasoline, 92 ultrahigh vacuum chemical vapor deposition quality fuel market, 92 (UHV-CVD), 230–232, 234, 239 refining technology, 93 ultra large-scale integrated (ULSI) chips, 200 superior refining process, 92 ultrathin cast strip (UCS), 22 thermal cracking facilities, 93 ultrathin steel, 22–23

k k

INDEX 457

“underground” vs. “aboveground” advanced university research–technology transfer materials innovation office–high-tech start-up network, 5 characteristics, 320–321 urea-based fertilizer, 48 costs and benefits, 321–322 firm and project characteristics, 325–327 vacuum tube strategic context, and major task milestones, components, 146 321–325 development rate and direction, 147 Union Carbide, 73 limitations, 147 General Electric very low-density polyethylene (VLDPE), 115 “bottom-up” innovation, 327–328 “Vespel” resins, 122 “bottom-up” model, 329 viscous polymer, 102 enamels, 327 fluid reaction technology, 329 high-pressure polyethylene process, 327 Watson, Thomas, Jr., 225 interfacial polymerization, 329 Watson, Thomas, Sr., 224 polycarbonates, 328 Western Electric, 149, 154–156 silicone project, 330 Westinghouse business units and polyolefins Magnascreen, 278 background, 123–125 Panelvision, 277–278 synthetic organic chemicals, 123 and TFTs, 273–275 Unipol process, 128–136 Williams, Richard, 248–249 Unipol process Williams, Roger, 47–48 “blue-sky” research, 128 “wool-like” polyester, 66 commercialization phase, 133–136 development and scale-up phases, 129–133 Yamazaki, Yoshio, 265–267 fluid cracking, 129 k game-changing technology, 128 k Ziegler–Natta catalysts, 120 initiation phase, 125–127 zone refining, 158 Phillips Process, 128 Unipol revolution and metallocene polymers advanced materials, 138–139 science and technology, 137–138

k