k INDEX aboveground advanced materials creation Sun Oil and Houdry process, 92–94 cultural-strategic risks, 390, 394–419 advanced heat-resistant sealants, 147 k entrepreneurship and innovation, 331 advanced materials innovation k flowchart, gauntlet of perceived risk, 337 aboveground (see aboveground advanced gauntlet of perceived risks, 331–332 materials creation) intellectual risks, 331, 347–363 acquisition assessment, 443 market interaction risks, 371, 380–389 advanced material processes and chief minimal risk conditions, 332 products, 14 project terminations and completions, 332–336 biotechnology and health care, 10–11 prototyping risks, 364, 370–379 blue-sky innovation, 439 relevancy risks, 337–347 “buying of time,” 440 resource minimization risks, 363–369 champion targeting, 441–442 risk-averse management, 330 construction, infrastructural, and manufacturing scaling risks, 389–394 industries, 12–13 uncertainties, 331 core competency linking, 442 active addressing scheme see thin-film transistors corporate management, 440 (TFTs) corporate strategy, 439 active-matrix LCDs, 277 cultural monitoring, 442 advanced casting technology see thin slab and thin different products, 13 strip casting COPYRIGHTEDenergy, MATERIAL 9–10 advanced fuels forward-looking management, 439 gasoline, 91 global perspective, 444–446 high-octane fuel, 92 implications for government, 443–444 Jersey Standard and fluidization process, 94–99 information and computer technology, 8–9 oil feedstock, 91 inventors and champions, 422–423 Advanced Materials Innovation: Managing Global Technology in the 21st century, First Edition. Sanford L. Moskowitz. © 2016 John Wiley & Sons, Inc. Published 2016 by John Wiley & Sons, Inc. k k 450 INDEX advanced materials innovation (Continued) bipolar transistor, 184 different types, 433–438 bisphenol A, 81 gauntlet of risks, 423–433 Brattain, Walter, 150, 152–154, 157 major task milestones, 318–320 British Telecom, 220 management skills, 440 Brody, T. Peter., 273 on-the-ground logistical expertise, 440 buckminsterfullerene, 297–298 organizational structuring, 442–443 buckyball “factory,” Germany, 299–300 “perceived” and “relative” risk, 14 bulk polymerization, 73 R&D activity, 443 Busicom, 189–190, 193 resource-rich firms, 438 revolution, 3–7 Carbon Nanotechnologies Inc. (CNI), 303 risk planning, 441 carbon nanotubes, 289, 290, 305 sectors of US economy, 6, 8 Carothers, Wallace, 51–53 structural context, 419–422 CASTRIP process, 29 technology–market assessment, 442 cellulose, 45 transition management, 441 Center for Nanoscale Science and Technology transportation, 11–12 (CNST), 301 underground, General Electric and Union Carbide, 327–330 chemical vapor deposition (CVD), 229 underground vs. aboveground (see Claude process, 46 “underground” vs. “aboveground” colloidal materials, 52 advanced materials innovation) CommQuest, 238 American Telephone and Telegraph (AT&T), 146, CoMoCAT system, 305 206, 214–221 complementary metal-oxide semiconductor amorphous silicon, 276 (CMOS), 262, 263 AP2 experimental machine, 293–295 computer displays (Joint US–Japanese k aramids, 77–80 Cooperation), 281–284 k Atalla, John, 166–168 conduction bands, 205 construction, infrastructural, and manufacturing industries, 12–13 Bakelite, 72 Consumer Electronics Division, 274 band-gap engineering, 205 cultural-strategic risks Bardeen, John, 150, 152–154 aboveground projects, 394 Bayer materials science “blue-sky” research, 395 Bayer’s first commercial polycarbonate CASTRIP process, 396 plant, 309 commercialization phase, 396–418 “Baytube”-technology, 309 cultural conflict, 395 CHEMPARK, 309 cultural forcing, 419 conductive plastics, 310 cultural issues, 390 graphene, 311 Fairchild and MOS technology, 419 HiPco process, 310 individualism vs. collectivism, 395 polyurethane polymers, 309 “internally static” culture, 419 “Baytube”-technology, 309 Jersey Standard, 395 Bell Labs, 179 “long-term” oriented firms, 395 history, 148–150 “short-term” oriented companies, 395 MOS research, 165–168 cutting-edge minimill technology, 26 point-contact transistor, 152–156 cutting-edge polymer development, 110 and semiconductor laser, 206–221 semiconductor research, 150–152 transistor, 148–149 dacron Big Blue, 238 development, 66–67 Big Steel, 20–21 polyester fiber, 60 biotechnology and health care, 10–11 research phase, 65–66 bipolar complementary MOS (BiCMOS) scale-up and commercialization, 67–68 transistor, 235–236 Darlington minimill, 26 k k INDEX 451 DeLoach, Barry, 212–220 planar junction transistor, 162–163 Delrin plastic, 117–118 silicon transistor, 160–162 Deming, W. Edwards, 196 spin-off Intel, 180 diamonds, 297 “super dip,” 184 Digital Technology Incorporated (DTI), 283–284 fiber optics industry, 210 digital watch, 265–268 field-effect approach, 184 dimethylformamide (DMF), 61 field-effect transistors (FETs), 156, 165, 179 DuPont firm and project characteristics, 325–327 and Delrin plastic, 117–118 first-generation high-pressure chemicals, 47–48 disparate products, 50 fixed-bed, high-pressure catalysis, 122 and polychemicals department, 116–117 Fixed Nitrogen Research Lab (FNRL), 46 and polyethylene, 118–122 flat-panel (hang-on-the-wall) TVs, 278–281 and specialty fibers flat-screen TV, 279–280 high-performance fibers, 74 fluidization I high-value specialized fibers, 74 General Electric and polysilicones, 100–112 Kevlar and aramids, 77–80 Jersey Standard, 94–99 Lycra spandex and block copolymers, 75–77 Sun Oil and Houdry process, 92–94 synthetic fiber revolution fluidization II advanced fibers, 44–48 DuPont and Delrin plastic, 117–118 dacron, 65–68 DuPont and polychemicals department, 3-D printing revolution, 41 116–117 high-pressure catalytic technology, 42 DuPont and polyethylene, 118–122 miracle fibers, 41 Union Carbide and polyolefins, 122–136 nature of high-pressure synthesis, 42–44 Unipol revolution and metallocene polymers, nylon revolution, 48–60 137–139 orlon, 61–65 Frohman, Dov, 187, 188 k dynamic random access memory (DRAM), fullerene factory, 301 k 185–187, 195, 198 fullerenes, 297 dynamic scattering (DS) effect, 250 functional materials, 10 dynamite, 44 gallium arsenide, 210 elastomer fibers, 76 gauntlet of risks electric arc furnaces (EAFs), 21 cultural-strategic risks, 390, 394–419 Electron Tube Division, 274, 275 entrepreneurship and innovation, 331 emulsion polymerization, 73 flowchart, 337 energy technology, 9–10 intellectual risks, 331, 347–363 market interaction risks, 371, 380–389 epitaxial process, 204–206 minimal risk conditions, 332 erasable programmable read-only memory perceived risks, 331–332 (EPROM), 187–189, 195, 198 project terminations and completions, 332–336 ethyl phenyl silicone (EPS), 100 prototyping risks, 364, 370–379 Europe and liquid crystal display, 259 relevancy risks, 337–347 excited atoms, 207 resource minimization risks, 363–369 Exxon Enterprises, 258 risk-averse management, 330 Exxpol, 138 scaling risks, 389–394 uncertainties, 331 Faggin, Federico, 189–195, 198 General Electric Fairchild semiconductor company, 179, 192, 195, and polycarbonates 199 commercialization phase, 85–88 bipolar transistor, 184 development and scale-up, 82–85 integrated circuit, 163–165 research phase, 80–82 “Materials and Processes” group, 182 polymer projects, 327 MOS project, 182 and polysilicones MOS research, 168–175 commercialization phase, 107–112 k k 452 INDEX General Electric (Continued) EPROM, 187–189 development phase, 103–107 “internalized short-term dynamic” culture, initiation phase, 100–101 197–200 research phase, 101–103 microprocessor, 191–194 and Union Carbide organized, resources allocated, and people “bottom-up” innovation, 327–328 hired, 181 “bottom-up” model, 329 silicon gate process, 180–182 enamels, 327 superb MOS-GATE technology, 226 fluid reaction technology, 329 test chips, 185 high-pressure polyethylene process, 327 and US semiconductor industry, 196 interfacial polymerization, 329 intellectual risks polycarbonates, 328 early research phase, 348–361 silicone project, 330 informational networks, 362 German coal tar-based synthetics, 3 innate creative energy, 347 giant electronics devices, fundamental Nucor steel, 348 technologies of, 280–281 revolutionary technology, 347 graded index fiber, 218 risk-embracing personalities, 363 graphite, 297 strategic discoveries, 348 Gray, George, 247 underground projects, 362 Grove, Andrew, 181, 182, 184, 186 interfacial polymerization see low-temperature guaiacol carbonate, 81 polymerization guest–host (GH) effect, 250 “internalized short-term dynamic” culture (Intel), 197–200 International Business Machines (IBM) HDPE problem, 121 for personal computers Hecht, Jeff, 210 commercialization, 283–284 k Heilmeier, George, 249–251, 253–255 development, 282–283 k heterostructured composites, 203 research phase, 282 hexamethylene diamine (HDA), 57 scale-up, 283 high-density polyethylene (HDPE), 115 production process, silicon-germanium chip highly stable 60-atom cluster peak, 295–298 integration, 235–236 high-performance polymers, 13 research at, 224–226 high-pressure carbon monoxide (HiPco) silicon–germanium chip, 223–224, 226–239 process, 303 International Liquid Crystal Company (ILIXCO), high-pressure process 256–257 DuPont’s diversification strategy, 44–45 inventors and champions, advanced materials DuPont’s struggles, 45–46 innovation, 422–423 first-generation high-pressure chemicals, 47–48 different types, 433–438 nature, 42–44 gauntlet of risks, 423–433 high-quality gun powder, 44 Iverson, Ken, 24–25 Hoerni’s planar process, 163 Hoff, Ted, 189–190, 192, 194 Japanese companies,