Comparing Parylene to Liquid Conformal Coatings

By: Sean Horn

Diamond-MT, Inc.

213 Chestnut Street

Johnstown, Pa 15906

+1 (814) 535 3505 phone

+1 (814) 535 2080 fax www.paryleneconformalcoating.com [email protected]

Conformal Coatings: A Quick Primer

Consisting of various polymeric materials, conformal coatings preserve the operational integrity of electrical and mechanical assemblies, insulating the substrate, improving performance and extending product lifecycle. Conformal coatings provide printed circuit boards

(PCBs) and similar electric devices with a protective, non-conductive dielectric layer, safeguarding these assemblies from:

1. Abrasion resulting from contact with acids, chemicals, solvents or, bodily fluids, in the

case of medical equipment.

2. Conductor electro-migration, corrosion, dendritic growth, and electronic short-circuits.

3. Exposure to extreme changes in temperatures and humidity, working conditions requiring

prolonged operation, or harsh physical environments.

They also provide superior insulation and stress-relief to assure ongoing functionality.

Major conformal coating types are composed of acrylic, epoxy, parylene, silicone and urethane. The type of coating material used depends upon such circumstances as:

 the precise character of the assembly/product being coated,

 the operational environment of the item's intended use,

 the coating substance's ability to provide appropriate protection, and

 the coating's process-requirements and cost relative to other coating materials.

Four of the five types of conformal coating — acrylic, epoxy, polyurethane, and silicone

— are applied by liquid methods, by either brushing, spraying, or dipping the coating on the substrate, then letting it dry on the surface of the designated assembly. Parylene is the major exception, employing a unique chemical vapor deposition (CVD) polymerization process, which generates superior performance for most uses, compared to liquid coatings.

Whatever coating type is used, PCB manufacturers need devices that withstand heat, cold, rain, snow, vibration, fungus, oxidation, and corrosion through decades of operation, something normal circuit boards cannot do without protection. Compared to liquid coatings, parylene’s CVD application process penetrates into the substrate surfaces, generating the highest levels of protection available for many products. Comparisons of available conformal coating types usefully demonstrates the value of each type, and parylene’s comparative functional advantage in most cases.

Comparing Parylene to Liquid Conformal Coatings Parylene

Each conformal coating has its own unique properties which dictate its particular range of product uses and the required coating-thickness necessary to assure reliable performance.

These conditions vary according to product and purpose. In comparison to liquid coatings, parylene surfaces are the most consistently pinhole-free, shielding substrates from potential environmental damage, at thickness-levels finer than other materials. In addition, Parylene generates chemical, dielectric, moisture, and thermal protection exceeding that of liquid conformal coatings.

Additional beneficial qualities associated with parylene use are:

 Adaptability to creviced-surfaces, those with exposed internal surfaces, points or sharp

edges, or other unusual coating conditions.

 Electrical insulation with low dielectric constancy and high tension strain.

 Non-conductive qualities that eliminate electrostatic, magnetic or radio frequency

interference during operation.

 Reliable resistance to acids, bases and solvents.

 Thermal stability between -195 °C to +350°C.

Parylene coating films are exceptionally thin and resilient, especially adaptable to the coating requirements of PCBs, microchips, their sensors and other electrical assemblies. Parylene coatings can be effective at considerably finer levels than liquid coating substances; that is, thinner layers of parylene provide equal or superior protection, compared to liquid coatings (measured in millimeters (inches)):

 Parylene -- 0.013 – 0.051 (0.0005 to 0.002).

 Silicone -- 0.051 – 0.203 (0.002 to 0.008).

 Acrylic, urethane, epoxy -- 0.025 – 0.127 (0.001 to 0.005)

Liquid coatings measure between 25-75 micrometers (µm/microns) thick for most uses. Parylene coatings are effective at significantly thinner levels, between 0.1-70 µm, improving their functionality for microelectricalmechanical/nano-technology (MEMS/NT) purposes, characterized by smaller moving parts requiring more freedom to function appropriately. Its specialized CVD process ensures parylene penetrates far more completely into the substrate surface, generating superior protection of product mechanisms and operation.

Liquid Conformal Coatings

In comparison to parylene, properties of liquid conformal coatings include:

 Acrylic: Rapid-drying acrylic coatings do not contract during cure and display good

fungus and humidity resistance. However, they have limited abrasive and stress-relieving

capabilities, causing them to break-down more readily at higher temperatures. In

addition, the recent decline in their cost advantage compared to other coatings reduces a

major advantage of their use.

 Epoxy: Like acrylics, film-shrinkage during polymerization is common for epoxy resins.

In addition, their stress resistance diminishes substantially when subjected to temperature extremes. These conditions somewhat nullify their extreme surface durability, and good

abrasive/chemical resistance.

 Silicone: Easily repairable, with low toxicity, silicone conformal coatings have a low

dissipation factor and good PCB-adhesion, with superior resistance to heat, humidity,

moisture and ultraviolet light. Silicone has an operating temperature range of -55°C

- +200°C, thus withstanding extreme temperature variations. Very versatile, silicone can

be adapted precisely to a product's coating requirements.

 Urethane: Possessing excellent dielectric properties, good chemical resistance, low

moisture-permeability, and reliable low-temperature flexibility, urethane coatings have

limited overall bond-strength. They commonly flake and peel when applied to larger

surface areas and have poor high-temperature resistance; repairing urethane surfaces is

difficult.

In all, liquid coatings lack parylene's reliable combination of adhesion, electrical conductivity, durability, and flexibility. Parylene consistently performs under conditions of duress that engender diminished performance or product failure when liquid conformal coatings are applied.

Parylene Excellence

Parylene displays better coating-thickness and temperature advantages, providing the thinnest effective coating application compared to liquid coating materials. Its CVD process penetrates deep into the substrate surface, generating exceptionally resilient pinhole-free surfaces, capable of withstanding extreme physical stress, while generating such high-value substrate-treatment properties as:  chemical/dielectric/moisture barrier protection,

 dry-film lubricity,

 exceptional functional durability,

 reliable application and

 thermal stability.

Each of the major types of conformal coatings offers particular advantages for a range of uses. Liquid coatings are less costly and easier to apply than parylene, but none displays parylene's functional versatility. Its exceptional dielectric properties make parylene the coating film-of-choice for a considerable range of electrical assemblies. While reliance on CVD application-processes can increase manufacturing costs, compared to liquid conformal coatings, parylene withstands specialized and often harsh environments with optimal functionality to the most reliable degree, making it more cost-effective long-term.

Despite parylene’s functional superiority for many conformal coating purposes, liquid coating types have their uses. Realizing their capabilities is recommended to assure selection of the coating type most appropriate to your product objectives

Comparing Acrylic and Polyurethane Conformal Coatings

Acrylic (AR) and polyurethane (UR) conformal coatings are among the best known and most commonly used conformal coating materials. As liquid coatings, both can be applied to substrates through a variety of methods:

 Brushing the substance onto the substrate surface.

 Dipping properly masked components into vats of coating material.

 Atomized/non-atomized spraying procedures, using either human or robotic labor.

However, sharing basic application techniques and some product end uses does not mean they can be applied interchangeably. Significant differences need to be addressed prior to determining how appropriate either conformal coating is for use with any particular project.

Basic Properties of AR and UR

Understanding the fundamental differences between AR and UR is essential to their effective use.

 Acrylic: Protecting electronics from corrosion, dirt, dust, fungus, moisture, and thermal

shocks, AR conformal films also possess dielectric properties capable of withstanding

most static/voltage discharge. With a dielectric strength of V 300/Mil., a dielectric

constant of 2.5, and a dissipation factor of 0.01, ARs’ effective operating temperatures

range from -65'C through +125'C. Following application – usually via liquid brush or

spray methods – they dry quickly to a clear, salt-resistant conformal finish. Fluorescent levels are consistently high. While their abrasive/chemical resistance is commensurately

low, AR coatings are rather easily applied, cleaned and removed; they are also useful for

many component miniaturization and repair processes. Solvent-resistance is poor, but is

good for acids and bases. These factors combine with moderate production costs to

enhance acrylics’ popularity for many simpler conformal coating processes. Some grades

of AR (e.g., Humiseal 1B31) are suitable for such specialized applications as Mil-I-

46058C IPC-CC-830B. Typically, acrylic films vary from 0.002 to 0.005 inches thick

after application. Curing time seldom exceeds 30 minutes, making acrylics the most

viable option when a short turnaround time is required. AR is commonly used as

moisture protection, conformally-coating printed circuit boards (PCBs).

 Urethane: Exceptionally resistant to abrasion and other forms of mechanical wear and

corrosion, UR’s durable surfaces also offer diminished reversion potential. UR’s

dielectric properties promote miniaturization because they insulate signal traces from

circuits situated close together. With good moisture and chemical resistant qualities, UR

is effective in operating environments where exposure to harsh chemicals is the rule.

However, high levels of heat and/or vibration can distress UR conformal films and should

be avoided. UR coatings are particularly valuable for their ability to combat ‘tin

whiskers,’ the occurrence of crystalline, electrically-conductive tin-structures that can

develop on assemblies whose final surface finish is composed of tin. Although whiskers

seldom exceed several millimeters, the condition is especially problematic for

electroplated tin finishes; they can cause electrical short-circuits for components

following conformal coating. UR films are very effective at preventing their

development, because they generate a coating sufficiently thick and strong to protect the assembly’s tin surface, while preventing additional structures from becoming a threat that

could short-circuit the item.

Summary

Both AR and UR conformal coatings are applied to substrates by liquid processes, and frequently used for a variety of purposes. In many ways, similarities between them stop there.

For purposes of comparison, it should be noted the AR is quick-drying, emits minimal heat during cure (protecting the integrity of temperature-sensitive components), and achieves maximal physical properties in minutes. AR conformal films also:

 withstand humidity during component operation, resisting moisture-development within

the assembly,

 do not shrink during operation,

 display low glass-transition temperatures,

 can be readily removed for repair by solvent-application to the region requiring attention,

 provide considerable post-application flexibility,

 fluoresce under UV light for simplified inspection, and

 are easily repaired, with the capacity to be soldered through if necessary.

Despite these advantages, AR can be easily removed with solvents, making it unsuitable for many coating purposes. Even weak solvents like isopropyl alcohol or xylene are sufficiently robust to remove AR from substrate surfaces. Moreover, assemblies subjected to operating temperatures greater than 125ºC are ill-served by AR coatings, which become quickly unserviceable. Also, their standard coating thicknesses -- between .002 and .005 inches – are unsuitable for the microelectricalmechanical systems (MEMS) and nanotechnology (NT) uses becoming increasingly prevalent today.

Unlike AR, UR is much more impervious to solvents; its coating is exceptionally durable.

Also, whereas AR can be completely cured in as few as 30 minutes, a full UR-cure usually requires at least several hours; some UR-types need 30 days at room temperatures to cure appropriately. Most varieties of UR provide conformal coatings supporting reliable inspection, with neither fluorescent nor free isocyanate content. UR films fight tin whisker growth very well, while delivering excellent humidity and chemical resistance, displaying dependable dielectric properties over extended durations.

However, its high solvent resistance makes UR difficult to remove or rework. While it can be removed with chemicals, this resistance can also mandate introduction of mechanical reworking techniques.to complete the task, increasing production downtime. UR also doesn’t perform effectively in high-vibration or high-heat environments. Most urethanes lose coating effectiveness at temperatures in excess of 125°C, limiting coating applications.

Neither AR nor UR display the versatility of parylene conformal coatings, but are useful for specified product purposes. Similar coating decisions need to be made among parylene types, as well.

Parylene C v Parylene F Uses of Parylene

Depending on the specific use, parylene conformal coatings can be effective in the range of 0.1 - 76 microns' thickness, far finer than liquid coating materials. Whatever form is used –

N, C, D, AF-4, or F -- parylene films generate pinhole-free, conformal substrate coverage, shielding protected surfaces with a reliable barrier against caustic solutions, acids and water vapor. Parylene films are very adaptable to complex coating problems, including surfaces with crevices, points, sharp edges, or exposed internal surfaces, and offer exceptional electrical insulation with low dielectric constancy and high tension strain.

Comparing Parylene C with Parylene F

Parylene C is the most widely used parylene type for conformal coatings. It is classified as a poly-monochoro para-xylene, produced from dimer material, with one chlorine group per repeat unit on its main-chain phenyl ring. As a conformal coating, Type C can be deposited at room temperature via CVD. The resulting film exhibits low chemical, moisture, and vapor permeability, making it particularly useful where protection is needed from corrosive gases. C’s alliance of electrical and physical properties distinguish it uses from those Parylene F, a consequence of their different chemical composition; F has a fluorine atom on its benzene ring, in contrast to C’s chlorine atom.

In comparison to Type F, Parylene C demonstrates a lesser throw-capability, generating a commensurately lower reduction in crevice penetration-activity. At the same time, Type C has a faster rate of deposits on substrates. Unlike C, which depends upon standard CVD processes, Type F is deposited using the Gorham method, with the cyclic dimer octofluoro-

[2.2|paracyclophane]. A problem interfering with wider scale adaptation of Parylene F is difficulty synthesizing dimer. Low availability of F dimer inhibits it commercial viability, although researchers actively seek alternatives to dimer synthesis.

Polarizability is the tendency of an atom's electron cloud to be distorted from its normal shape by an external electric field. Because it is influential in establishing the degree to which a given surface interacts with a designated compound’s chemistry, polarizability is well-correlated with its molecular weight, except in the case of the fluorinated chemistries. In contract to C,

Parylene F is fluorinated, characterized by fluorine atoms on its aromatic ring; its use can significantly lower coating capacitation, reducing a coated surface’s electrical charge during operation.

In comparison to Parylene C, Parylene F has a lower dielectric constant and better thermal stability, enhancing its functionality for inner layer dielectric (ILD) applications. This capacity makes F potentially very useful for ultra large scale integration (ULSI), wherein one million or more circuit elements are situated on a single chip; these properties would support F’s expanded MEMS and NT applications, if its synthesis were more readily achieved.

F’s superior thermal stability is attributed to its aliphatic C-F bond, compared to Type C’s

C-C bond. Possessing aliphatic -CH2- chemistry, F therefore has poor oxidative and UV stability. At the same time, F exhibits a higher coating density and significantly more penetrating power than C, although its refractive index is slightly lower. A further comparison of essential properties of parylene Types F and C is provided in

Table 1

Table 1: Properties of Parylene F and C Compared

Properties Under Analysis Parylene F Parylene C

General Density g/cm2 1.652 1.289 Refractive index nD23 1.58 1.639 Penetration power 30x 5x

Electrical Dielectrical strength/limited duration 7,000 6,800 (Volts/mil @ 1 mil) Dielectrical constant: 60 Hz 2.20 3.12 1,000 Hz 2.25 3.10 1,000,000 Hz 2.42 2.95 Dissipation factor: 60 Hz 0.0002 0.020 1,000 Hz 0.0013 0.019 1,000,000 Hz 0.0080 0.013 Volume resistivity at 23°C 50%RH 1.1(10)17 2.2(10)15 Surface resistivity at 23°C 50%RH 4.7(10)17 6.9(10)16

Mechanical/Physical Properties Tensile modulus 3.0 3.2 Tensile strength, psi 7,800 10,000 Tensile strength, MPa 55 69 Yield strength, psi 7,600 8,000 Yield strength, MPa 52 55 Yield elongation 2.4 2.9 Elongation to break % 5 – 10% 10 -39% Rockwell hardness R80 R85 Coefficient of friction - static 0.39 0.29 Coefficient of friction - dynamic 0.35 0.29 Water absorption 0.01%/24 0.06%/24 hours hours Water vapor temperature at 38°C, 0.32 0.10 g.mm/(m2 . j)

Gas permeability Nitrogen 5.8 0.95 Oxygen 34.7 7.1 Carbon dioxide --- 7.7 Sulfur dioxide --- 11 Chlorine --- 0.35

Thermal Properties Melting temperature 435°C 290°C Glass transition temperature 60 - 66°C 13 – 80 °C Continuous service temperature during 200°C 80°C 100,000 hours Continuous service temperature during 350°C 115°C 1,000 hours

Linear coefficient of expansion @ 25°C, K1 4.5(10)-5 3.5(10)-5 Thermal conductivity, calories/sec 3.2 cal/sec 2.0 cal/sec Thermal conductivity, W(m.K) 0.1 0.084

Both Parylene F and C are largely impervious to the effects of corrosive chemicals and exhibit low levels of trace metal contamination. Parylene C’s faster deposition rate and lower processing cost render it readily applicable for a more extensive range of uses than other parylene types, including F, explaining C’s popularity. However, as the evidence suggests, both

F and C have their own recommended applications. Because of their unique chemical formulation, silicone coatings need to be considered within the context of all parylene types.

Parylene and Silicone Conformal Coatings: A Comparison

One liquid coating type that rivals the use of parylene is silicone conformal coating (Type

SR), which cures rapidly, is reliably dielectric and displays exceptional stability across a wide temperature range. These properties make it parylene’s chief performance competitor, for many purposes. Further comparison delineates their benefits and disadvantages relative to each other.

Composition

While parylene and silicone are both technically polymers, their dimer materials are very different. Parylene dimer is composed of a hydrocarbon molecule (hydrogen + carbon), allying it chemically to virtually all other available plastics. In contrast, silicone’s dimer is comprised of an oxygen/silicone composite, creating the most unique chemical union among conformal coatings.

Deposition

As a liquid conformal coating, silicone relies on brush, dip or spray techniques for substrate application. It typically requires a relatively thick film application, ranging from 003"-

.008”, to be effective by IPC standards. Although the resultant surface is reliably durable for selected functions, sustaining components’ function in operating environments characterized by large-scale, rapid shifts in temperature, it is less useful for any purposes requiring thin film covering to assure product operation, limiting its adaptation for MEMS/NT purposes. In contract, parylene’s vapor-based CVD application process can deposit the substance in thinner layers than all competing coating types, generally between .0005” to .002”, making it exceptionally suitable for all PCBs and most specialized MEMS/NT functions. Moreover, CVD allows parylene to seep deep within substrates, conforming to all surface types, regardless of shape.

Thermal Properties

Parylene’s operational temperature range is substantial. Parylene films:

 withstand cold to levels as low as -165°C without sustaining physical damage, and

 conversely heat as high as 200°C in a vacuum.

Perhaps more important, parylene conformal coatings offer considerable functional stability in the long-term, performing as expected at a constant temperature of 80°C for 10 years.

In comparison, silicone is cured, and functions better under exceptionally heat-intensive conditions. While most silicone types function at a baseline operating temperature range of -

55°C -- 200°C, some remain functional at levels as high as 600°C, far exceeding parylene’s performance range for higher temperatures.

Table 2 compares the thermal properties of parylenes C, D, and N with silicone.

Table 2: Thermal Properties of Selected Parylenes, in Comparison with Silicone Conformal Coating

Properties Parylene Parylene Parylene Silicone C D N Melting point, ° C 290 380 420 Cured T5 point (where modulus = 125 125 160 125 Taken from secant modulus temperature curve) T4 point (where modulus = 240 240 300 - 80 Taken from secant modulus temperature curve) Thermal conductivity, 25° C 2.0 -- 3.0 3.5 - 7.5 Specific heat, 25° C 0.17 --- 0.20 ---

Physical Properties Compared

Silicone

As a conformal coating, silicone cures rapidly; its generally thicker film application also generates superior vibration dampening and thermal protection. When applied in a thick enough coat, it can actually serve as a shock absorber for the coated item, helping to protect it against heavy impact.

These factors assure good adhesion to those PCB materials that do not require thinner film covering to ensure operation; UV and corrosion resistance are superior to most competing conformal coatings. Featuring high dielectric strength, silicone surfaces are easily reworked if repair is necessary. Repair is not uncommon. Silicone is very hydrophobic, with high moisture permeability; it may not prevent excess moisture-retention within PCBs, conditions that can stimulate the component’s corrosion and metallization. Silicone’s other functional drawbacks include:

 often considerable attention to the coating process to achieve optimal thickness,

 exceptionally poor solvent resistance, and

 inferior durability during operational conditions where abrasive or other factors

stimulating surface deterioration are common.

Parylene

Parylene successfully adheres to the widest selection of substrate substances and surface geometries of all conformal coatings. Chemically and biologically inert, it provides excellent dielectric and moisture barrier properties, generating bubble- and pinhole-free conformal coatings at thicknesses as thin as .0005”. Paylene’s other benefits include:

 high optical clarity,

 mitigated tin whisker growth, and

 flexible conformability for adaptation to all surfaces,

 enabling film-penetration of extremely small spaces and crevices, making it very

functional for MEMS/NT applications.

On the negative side, parylene’s CVD processing technologies are slow, generating only limited throughput. Parylene removal requires abrasion-based methods. These factors combine to increase parylene’s application costs; higher prices for raw materials, labor, and lot-volume have limited wider adaptation of parylene, compared to silicone or other liquid-based films. Table 3 presents mechanical of selected parylene types with silicone.

Table 3: Mechanical/Physical Properties of Selected Parylenes, in Comparison with Silicone Conformal Coating

Mechanical/Physical Parylene C Parylene D Parylene N Silicone Properties Tensile modulus 3.2 3.0 2.8 .007 Tensile strength, psi 10,000 11,000 6,000 – 11,000 800 – 1,000 Yield strength, psi 8,000 9,000 6,100 --- Yield elongation 2.9 3.0 2.5 --- Elongation to break 10 -39% 10% 20 – 25% 10% % Rockwell hardness R85 R80 R85 40 – 45 (Shore A) Coefficient of friction 0.29 0.33 0.25 --- - static Coefficient of friction 0.29 0.31 0.25 --- - dynamic Water absorption 0.06%/24 < 0.01%/24 < 0.01%/24 0.12%/7 days hours hours hours Density g/cm2 1.289 1.418 1.10 – 1.12 1.05 – 1.23 Refractive index 1.639 1.669 1.661 1.43 nD23

Summary

Both materials protect substrates, but do so differently. Therefore, coating properties and the method of film application are critical factors when determining the use of either as a conformal coating. Parylene forms a resilient, but ultra-thin coating that sometimes lacks strong abrasion resistance. Silicone, on the other hand, is roughly equivalent to a very soft rubber, but may be absent sufficient utility for high-profile, consistently active electronic components. Silicone offers a viable alternative to parylene in many cases, but simply does not have parylene’s overall material and performance versatility.

Conclusion

Of the conformal coatings, parylene generally provides optimum protection against the effects of solvents, while generating excellent moisture and gas protection, very high dielectric strength, and reliable bio-compatibility. These benefits strongly suggest parylene’s advantages over liquid coating types. It is true that parylene’s CVD application process can be slower, costlier and provides limited adhesion for most noble metals. However, these disadvantages pale in light of parylene’s extreme utility for most purposes, especially in comparison to liquid conformal coatings.

About Diamond MT

Diamond MT was founded in 2001 as a firm specializing in contract applications of conformal coatings for Department of Defense and Commercial Electronic Systems. Since our beginning, Diamond MT has established a reputation for providing the highest quality services in the industry. Our commitment to quality, integrity, and customer satisfaction combined with an unmatched expertise in applications and processes has provided every one of our customers with superior results.

Diamond MT operates out of a freestanding 12,000 square foot building in Johnstown, Pennsylvania, which is located 60 miles southeast of Pittsburgh. Diamond MT is located near three major interstates and is supported by the Cambria County Airport, which serves as a primary freight terminal for south central Pennsylvania. Diamond MT maintains a strict program per NSI ANSI Standard 20.20 for ESD protection. All work areas are safeguarded with the latest in protection devices including wrist straps, garments, and workstations.

Quality Assurance: Diamond MT’s quality manual ensures every employee is focused on continuous improvement and service excellence. Our ESD safe facilities stretch over 12,000 square feet dedicated to your conformal coating requirements. We are continually researching and updating our equipment to make sure we are providing the best ESD protection available.

All employees have been trained in proper ESD procedures. We operate at a class 3 level to ensure the job is done right the first time and to the highest quality standards set forth in accordance with the MIL-STDs, IPC, J-STDs as well as having our biomedical and ITAR certification. Furthermore, all assemblies are tracked through every step of the process with documentation/serialization spreadsheets as well as each assembly going through a 100% visual inspection.

Diamond MT has a strong organization consisting of highly motivated personnel, modern facilities, and diverse capabilities. Diamond MT represents one of the most modern, well-equipped facilities in the region. Diamond MT offers a highly skilled workforce, rapid turnaround manufacturing and high reliability through an established quality program, along with experience of commercial manufacturing requirements, competitive pricing and on-time delivery.

Rapid Turnaround: Diamond MT understands that oftentimes conformal coating is overlooked because it’s the last step in the process. We are committed to serving the industry with rapid turn times for parylene, (normally 10 business days) with expedited service in as little as 2-5 business days depending upon the complexity and quantity.

For liquid coatings, our normal turnaround time is five business days; again with expedited service in as little as 2-3 business day turns. We understand that there are times you’ll need a project completed FASTER. We will accommodate your needs in a budget friendly manner. This service is offered on a FIFO basis.

To learn more about Diamond MT, please contact us today!

Diamond MT 213 Chestnut Street Johnstown, PA 15906 Phone: (814) 535-3505 Fax: (814) 535-2080