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Miniature Loop Heat Pipe with Flat Evaporator for Cooling Computer CPU Randeep Singh, Aliakbar Akbarzadeh, Chris Dixon, Mastaka Mochizuki, and Roger R

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Miniature Loop Heat Pipe with Flat Evaporator for Cooling Computer CPU Randeep Singh, Aliakbar Akbarzadeh, Chris Dixon, Mastaka Mochizuki, and Roger R View metadata, citation and similar papers at core.ac.uk brought to you by CORE provided by RMIT Research Repository 42 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 30, NO. 1, MARCH 2007 Miniature Loop Heat Pipe With Flat Evaporator for Cooling Computer CPU Randeep Singh, Aliakbar Akbarzadeh, Chris Dixon, Mastaka Mochizuki, and Roger R. Riehl Abstract—This paper presents an experimental investigation Subscripts on a copper miniature loop heat pipe (mLHP) with a flat disk Ambient. shaped evaporator, 30 mm in diameter and 10-mm thick, designed for thermal control of computer microprocessors. Tests were Compensation chamber. conducted with water as the heat transfer fluid. The device was Condenser. capable of transferring a heat load of 70 W through a distance up to 150 mm using 2-mm diameter transport lines. For a range of Evaporator. power applied to the evaporator, the system demonstrated very Junction. reliable startup and was able to achieve steady state without any symptoms of wick dry-out. Unlike cylindrical evaporators, flat Heat pipe. evaporators are easy to attach to the heat source without need of Total. any cylinder-to-plane reducer material at the interface and thus offer very low thermal resistance to the heat acquisition process. Vapor. In the horizontal configuration, under air cooling, the minimum Liquid. value for the mLHP thermal resistance is 0.17 C/W with the corresponding evaporator thermal resistance of 0.06 C/W. It is concluded from the outcomes of the current study that a mLHP I. INTRODUCTION with flat evaporator geometry can be effectively used for the thermal control of electronic equipment including notebooks with limited space and high heat flux chipsets. The results also confirm HE development of high-end and compact computers has the superior heat transfer characteristics of the copper-water Tresulted in a considerable rise in the power dissipation configuration in mLHPs. tendency of their microprocessors. At present, the waste heat Index Terms—CPU cooling, flat evaporator, miniature loop heat released by the central processing Unit (CPU) of a desktop and pipe (mLHP), thermal control. server computer is 80 to 130 W and of notebook computer is 25 to 50 W [1]. In the latter case, the heating area of the chipset has become as small as 1–4 cm . This problem is further complicated NOMENCLATURE by both the limited available space and the restriction to maintain the chip surface temperature below 100 C. It is expected that A Area, m . conventional two-phase technologies [2] like heat pipes and R Thermal resistance, C/W. vapor chambers will not be able to meet the futuristic thermal T Temperature, C, K needs of the next generation notebooks. Other technologies like Heat load, W. liquid cooling and thermoelectric coolers have good potential but still create major integration, reliability and cost issues. With the h Heat transfer coefficient, W/m C. development in the two-phase heat transfer systems and porous M Merit number, W/m . media technology, loop heat pipes (LHPs) have come up as a L Latent heat of vaporization, J/Kg. potential candidate to meet these challenging needs [3]. Greek Symbols Originally known as an antigravitational heat pipe (AGHP), Surface tension N/m. the LHP is a highly efficient two-phase heat transfer device that operates passively on the basis of a capillary driven loop Density, Kg/m . scheme. It utilizes capillary pressure developed by the fine pore Viscosity, Pa.s. wick to circulate the working fluid, and the latent heat of va- porization and condensation of the working fluid to acquire and transport heat loads. LHPs possess all the advantages of the conventional heat pipe and additionally provide reliable oper- Manuscript received November 4, 2005; revised April 4, 2006. This work was recommended for publication by Associate Editor C. Patel upon evaluation of ation over long distance at any orientation in the gravity field. the reviewers’ comments. At present, LHPs with different architectures and performance R. Singh, A. Akbarzadeh, and C. Dixon are with the Energy CARE Group, capabilities are widely used in space applications [4]. School of Aerospace, Mechanical and Manufacturing Engineering, Royal Mel- bourne Institute of Technology (RMIT) University, Victoria 3083, Australia Various aspects of the theory and principle of LHPs have been (e-mail: [email protected]). examined in detail [5] in the past. Most of this research is con- M. Mochizuki is with Fujikura, Ltd., Tokyo 135, Japan. centrated on the LHPs with large size cylindrical evaporators, R. R. Riehl is with the Space Mechanics and Control Division, National In- stitute for Space Research—INPE, São José dos Campos 12227-010, Brazil. 12 to 30 mm in diameter, for space applications. In order to em- Digital Object Identifier 10.1109/TCAPT.2007.892066 ploy LHPs for cooling of compact electronic equipments like 1521-3331/$25.00 © 2007 IEEE Authorized licensed use limited to: RMIT University. Downloaded on November 23, 2008 at 21:47 from IEEE Xplore. Restrictions apply. SINGH et al.: MINIATURE LHP 43 notebooks, their potential in the direction of miniaturization has used in conventional heat pipes for this purpose. Kim et al. to be evaluated. By now different prototypes of the miniature [12] developed a high performance remote heat exchanger loop heat pipe (mLHP) have been created and tested for cooling (RHE) from a copper-water heat pipe that was able to transfer of power saturated electronics [6]. Usually, the design configu- 75-W heat load dissipated by a desktop CPU of 35 35 mm ration of these mLHPs consisted of cylindrical evaporator with area. Moon et al. [13] built and performed test on a copper ammonia as working fluid. Pastukhov et al. [7] developed dif- based miniature heat pipe, 2-mm thick, with woven wire wick ferent designs of cylindrical evaporator mLHP with a nominal and water as the working fluid. The miniature heat pipe de- capacity of 25–30 W and a heat transfer distance up to 250 mm vice was able to effectively manage the heat load of 11.5 W for cooling the CPU of a mobile PC. Under air cooling the total from a 35 35 mm laptop CPU. Water due to its excellent thermal resistance (interface to ambient) of such a system lies heat transfer characteristics like high latent heat, high surface in the range between 1.7 and 4.0 C/W with the mLHP own tension and easy of availability in pure state is a widely used thermal resistance of 0.3 to 1.2 C/W. An ammonia charged heat pipe working fluid in the computer cooling applications. mLHP was also tested [8] for low power management and tem- Various copper-water based thermal designs using heat pipe or perature control for electronic components especially for space- vapor chamber has made it possible to extend and maximize the craft applications. cooling capability of the heat sinks for electronic applications Apart from the cylindrical design, the flat shape is another [14]. However, it is expected that the convectional heat pipe design option for the LHP evaporator. Flat evaporators can be design will not be able to provide reliable thermal control considered as the optimum design from the point of view that for the next generation high-end computers with extensive they do not need any special thermal interface (saddle), i.e., processing capabilities. This has instigated the need to focus cylinder-plane reducer to provide a thermal contact with the heat on the alternative and efficient thermal designs using mLHPs. load source. In case of cylindrical evaporators, such a saddle Miniature LHPs with copper-water arrangement can serve as creates an additional thermal resistance and increase the LHP potential replacements of conventional heat pipes in electronic total mass [6]. Also, flat evaporators can be easily integrated cooling applications. into the compact space inside the object to be cooled (e.g., note- Although the copper-water combination is not yet fully ex- book). By now, various investigative prototype of mLHP with plored in mLHPs, some of the investigative prototypes which flat evaporators and ammonia-stainless steel configuration have have been developed with this combination have shown supe- also been developed for space as well as ground based appli- rior performance and high heat manageable potential. In their cations. Boo and Chung [9] demonstrated a successful working work on mLHPs, Maydanik et al. [15] developed and tested dif- of a mLHP with a flat evaporator, 40 50 mm active area and ferent prototypes of ammonia-stainless steel and copper-water 30-mm thickness, using a polypropylene wick. With ammonia mLHPs with cylindrical evaporators, 5 and 6 mm in diameter, as the working fluid the designed mLHP showed a maximum and heat transfer distances up to 300 mm. Tests have shown that heat load of 87 W and thermal resistance of 0.65 C/W in the a nominal heat load of 70 W for ammonia mLHP and 130 W for horizontal position. Another prototype of ammonia mLHP [10] water mLHP can be obtained. The work clearly pinpoints the was developed with flat rectangular evaporator of 5.5-mm thick- potential of the copper-water mLHP for electronic cooling ap- ness and heat transfer length of 75 mm. The maximum heat plications. Kiseev et al. [16] presented his results on the mLHP load with air blowing was 30 W and the total thermal resis- with flat evaporator, 31.8 mm diameter and 15-mm thick, using et al. tance “evaporator-air” was 2 C/W. Delil [11] report de- different configuration of capillary structure (i.e., nickel and ti- velopment of a mLHP having a flat disk shaped evaporator with tanium) and working fluids (i.e., acetone and water).
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